Grabbing mechanism for chip processing

Abstract

The invention discloses a grabbing mechanism for chip machining, and belongs to the technical field of chip machining, the grabbing mechanism for chip machining comprises a mechanical arm, a support assembly is arranged at the outer end of the mechanical arm, the support assembly comprises a mounting cylinder connected with the outer end of the mechanical arm, an adsorption assembly is arranged in the mounting cylinder, and supporting rings are arranged at the two ends of the mounting cylinder correspondingly; side rings are arranged outside the mounting cylinders, a plurality of rotating rods are arranged between the mounting cylinders, sliding grooves are formed in the rotating rods, adjusting cylinders are arranged on the rotating rods in a sliding mode, transverse rods are arranged in the adjusting cylinders, transverse plates are arranged outside the adjusting cylinders, clamping columns are connected outside the transverse plates, first gear rings are arranged on the rotating rods, rotating rings are arranged between the mounting cylinders and the side rings in a sliding mode, second gear rings are arranged on the rotating rings, and sliding rods are arranged on the side rings; the sliding rods are connected with lifting rings, arc grooves are distributed outside the lifting rings, limiting rings are in sliding fit with the interiors of the arc grooves, inclined grooves are distributed in the outer sides of the rotating rings, and sliding columns are arranged on the sliding rods. The double-grabbing device has the advantages of double grabbing, disengagement prevention, damage prevention, stability, reliability, flexibility and practicability.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and in particular to a grasping mechanism for chip processing. Background Art

[0002] Chip packaging refers to the process of assembling integrated circuits into final chip products. It mainly involves placing the bare integrated circuit chips produced by the foundry on a substrate that serves as a carrier, leading out the pins, and then packaging them into a whole. This process involves actions such as placement, fixing, sealing and lead-in, as well as connecting the circuit pins on the silicon chip to the external connector through wires. Packaging not only protects the chip, but also enhances its electrical and thermal performance and realizes the connection between the internal chip and the external circuit.

[0003] At present, in the chip packaging process, a plurality of integrated circuit bare chips arranged from bottom to top in a box body are usually picked up in sequence by a suction cup grabbing device, and then the picked up circuit bare chips are packaged one by one on the corresponding external circuit substrate.

[0004] Since the size of integrated circuit bare chips is generally small, the specifications and dimensions of the vacuum suction cups used in the traditional grasping devices for grasping integrated circuit bare chips are also small. When using the traditional suction cup grasping device to quickly grasp the integrated circuit bare chips, the grasped integrated circuit bare chips are very likely to fall off due to insufficient suction of the grasping device, causing damage to the integrated circuit bare chips. This not only reduces the normal production progress of the chip, but also causes a waste of resources and increases the production costs of the enterprise.

[0005] Therefore, it is necessary to provide a chip processing grasping mechanism to solve the above problems. Summary of the invention

[0006] In view of the shortcomings of the prior art, an object of the embodiments of the present invention is to provide a grasping mechanism for chip processing to solve the problems in the above-mentioned background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions: A grasping mechanism for chip processing comprises a mechanical arm, wherein a bracket assembly is provided at the outer end of the mechanical arm, wherein the bracket assembly comprises a mounting tube connected to the outer end of the mechanical arm, wherein an adsorption assembly is provided inside the mounting tube, wherein support rings are provided at both ends of the outer side of the mounting tube, wherein a side ring located between the two support rings is provided on the outer side of the mounting tube, wherein a plurality of rotating rods penetrating the side rings are circumferentially distributed and rotatably provided between the mounting tubes, wherein a slide groove is provided on the rotating rod, wherein an adjustment tube is slidably sleeved on the rotating rod, wherein a cross bar slidably matched with the slide groove is provided inside the adjustment tube, wherein a cross plate is provided on the outer side of the adjustment tube, wherein a clamping column is connected to the outer end of the cross plate The rotating rod is provided with a gear ring 1, a rotating ring is slidably provided between the mounting cylinder and the side ring, the rotating ring is provided with a gear ring 2 meshing with the gear ring 1, the side ring is rotatably provided with a worm meshing with the gear ring 2, the worm is connected to the adjusting motor, a sliding rod is circumferentially distributed on and passes through the side ring, one end of the sliding rod is connected with a lifting ring movably sleeved on the outside of the mounting cylinder, a plurality of arc grooves are circumferentially distributed on the outside of the lifting ring, a limiting ring arranged on the outside of the adjusting cylinder is slidably matched in the arc groove, a plurality of inclined grooves are circumferentially distributed on the outside of the rotating ring, and a sliding column slidably matched with the inclined groove is provided on the sliding rod.

[0008] As a further solution of the present invention, the adsorption assembly includes a bracket arranged inside the mounting cylinder and a plurality of lifting cylinders passing through the mounting cylinder and the bracket, an adsorption plate is provided at the outer end of the lifting cylinder, a plurality of through holes are provided on the adsorption plate, an elastic module is provided between the outside of the lifting cylinder and the bracket, an air suction module is provided between the inner wall of the lifting cylinder and the inside of the mounting cylinder, and an adjustment module connected to the air suction module is provided inside the mounting cylinder.

[0009] As a further solution of the present invention, the elastic module includes a retaining ring 1 arranged on the lifting cylinder and located between the adsorption plate and the bracket. The lifting cylinder is provided with a retaining ring 2 located on the side of the bracket away from the adsorption plate. A spring is connected between the retaining ring 1 and the bracket.

[0010] As a further solution of the present invention, the air suction module includes a lifting plate slidably arranged in the lifting cylinder, a sealing ring is provided between the lifting plate and the lifting cylinder, a plurality of through holes 2 are provided on the lifting plate, a plurality of movable cover plates corresponding to the through holes 2 are hingedly connected on the side of the lifting plate away from the adsorption plate, a connecting plate is movably provided in the mounting cylinder, a vertical rod connected to the lifting plate on one side of the connecting plate, and a guide rod slidably matched with the bracket is connected to the connecting plate.

[0011] As a further solution of the present invention, the adjustment module includes a transmission gear rotatably arranged on the top of the inner side of the mounting tube, the connecting plate and the transmission gear are movably connected by a plurality of hinged rods, a rotating gear meshing with the transmission gear is rotatably arranged inside the mounting tube, and the rotating gear is connected to a rotating motor.

[0012] As a further solution of the present invention, the length of the slide groove is greater than the length of the inclined groove in the vertical direction.

[0013] As a further solution of the present invention, the clamping column is made of rubber.

[0014] As a further solution of the present invention, the hinged rod is respectively hinged to the connecting plate and the transmission gear ball.

[0015] As a further solution of the present invention, the adsorption plate is made of rubber, the contact end surface of the adsorption plate close to the chip is set as a circular ring, the through hole 1 is located inside the circular ring, and a spacing is provided between the through hole 1 and the circular ring.

[0016] As a further embodiment of the present invention, as described.

[0017] In summary, compared with the prior art, the embodiments of the present invention have the following beneficial effects: The present invention moves the bracket assembly to the top of the chip through a mechanical arm, and the chip can be adsorbed and grasped through the adsorption assembly. At the same time, the adjusting motor drives the worm to rotate, and the worm drives the rotating ring to rotate counterclockwise by meshing with the second gear ring. The second gear ring drives the rotating rod to rotate by meshing with the first gear ring. The rotating rod drives the adjusting cylinder to rotate synchronously through the sliding cooperation between the sliding groove and the cross bar. The adjusting cylinder drives the clamping column to rotate through the cross plate, and the plurality of clamping columns clamp the outer edge of the chip by approaching the installation cylinder to avoid damage to the integrated circuit on the chip. At the same time, the rotating ring drives the sliding rod to move downward through the sliding cooperation between the inclined groove and the sliding column, and the sliding rod drives the lifting ring to move downward synchronously. The lifting ring drives the adjusting cylinder to move downward along the rotating rod by the sliding cooperation between the arc groove and the limit ring. The adjusting cylinder drives the clamping column to move downward synchronously through the cross plate, so that chips of different thicknesses can be stably clamped, and the chip has the effects of double grasping, anti-separation, damage avoidance, stability, reliability, flexibility and practicality.

[0018] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional diagram of a grasping mechanism for chip processing in an embodiment of the invention.

[0020] Figure 2 for Figure 1 A is an enlarged view of the middle image.

[0021] Figure 3 It is a schematic diagram of the structure of the bracket assembly in an embodiment of the invention.

[0022] Figure 4 It is a cross-sectional view of a bracket assembly in an embodiment of the invention.

[0023] Figure 5 It is a bottom cross-sectional view of the bracket assembly in the embodiment of the invention.

[0024] Figure 6 It is a schematic diagram of the structure of the swivel in the embodiment of the invention.

[0025] Figure 7 It is a schematic diagram of the structure of the adjusting cylinder in the embodiment of the invention.

[0026] Figure numerals: 1-mechanical arm, 2-bracket assembly, 201-support ring, 202-installation cylinder, 203-side ring, 204-sliding rod, 205-lifting ring, 206-arc groove, 207-limiting ring, 208-adjusting cylinder, 209-cross plate, 210-clamping column, 211-rotating rod, 212-tooth ring 1, 213-rotating ring, 214-tooth ring 2, 215-worm, 216-adjusting motor, 217-slant groove, 218- Sliding column, 219-cross bar, 220-slideway, 3-adsorption assembly, 301-bracket, 302-lifting cylinder, 303-adsorption plate, 304-through hole one, 305-blocking ring one, 306-spring, 307-blocking ring two, 308-guide rod, 309-connecting plate, 310-hinge rod, 311-transmission gear, 312-rotating gear, 313-vertical pole, 314-lifting plate, 315-through hole two, 316-movable cover plate. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0028] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0029] In one embodiment of the present invention, see Figure 1 , Figure 2 , Figure 3 , Figure 6 and Figure 7The chip processing grasping mechanism comprises a robot arm 1, wherein the outer end of the robot arm 1 is provided with a bracket assembly 2, wherein the bracket assembly 2 comprises a mounting cylinder 202 connected to the outer end of the robot arm 1, wherein the mounting cylinder 202 is provided with an adsorption assembly 3, wherein the two ends of the outer side of the mounting cylinder 202 are provided with support rings 201, wherein the outer side of the mounting cylinder 202 is provided with a side ring 203 located between the two support rings 201, wherein the mounting cylinder 202 is provided with a plurality of rotating rods 211 which penetrate the side rings 203 and are rotatably provided with a plurality of rotating rods 211 which are circumferentially distributed and rotatably provided between the mounting cylinders 202, wherein the rotating rod 211 is provided with a slide groove 220, wherein the rotating rod 211 is provided with an adjustment cylinder 208 which is slidably sleeved, wherein the adjustment cylinder 208 is provided with a cross bar 219 which is slidably matched with the slide groove 220, wherein the outer side of the adjustment cylinder 208 is provided with a cross plate 209, wherein the outer end of the cross plate 209 is connected with a clamping column 210, wherein the rotating rod 2 A gear ring 1 212 is provided on 11, a rotating ring 213 is slidably provided between the mounting cylinder 202 and the side ring 203, a gear ring 214 meshing with the gear ring 1 212 is provided on the rotating ring 213, a worm 215 meshing with the gear ring 214 is rotatably provided on the side ring 203, the worm 215 is connected to the adjusting motor 216, a sliding rod 204 is circumferentially distributed on and penetrates the side ring 203, one end of the sliding rod 204 is connected to a lifting ring 205 movably sleeved on the outside of the mounting cylinder 202, a plurality of arc grooves 206 are circumferentially distributed on the outside of the lifting ring 205, a limit ring 207 arranged on the outside of the adjusting cylinder 208 is slidably matched in the arc groove 206, a plurality of inclined grooves 217 are circumferentially distributed on the outside of the rotating ring 213, and a sliding column 218 slidably matched with the inclined groove 217 is provided on the sliding rod 204.

[0030] In this embodiment, in the initial state, the clamping column 210 is away from the installation cylinder 202, and the sliding column 218 is located at the highest point of the inclined groove 217. When the chip needs to be grabbed, the robot arm 1 moves the bracket assembly 2 to the top of the chip, and the chip can be adsorbed and grabbed through the adsorption assembly 3. At the same time, the adjustment motor 216 drives the worm 215 to rotate, and the worm 215 drives the rotating ring 213 to rotate counterclockwise by engaging with the gear ring 214. The gear ring 214 drives the rotating rod 211 to rotate by engaging with the gear ring 1 212. The rotating rod 211 drives the adjustment cylinder 208 to rotate synchronously through the sliding cooperation between the slide groove 220 and the cross bar 219. The adjustment cylinder 208 drives the clamping column 210 to rotate through the cross plate 209. Several clamping columns 210 clamp the outer edge of the chip by approaching the installation cylinder 202 to avoid damage to the integrated circuit on the chip. The rotating ring 213 drives the slide bar 204 downward by sliding cooperation between the inclined groove 217 and the slide column 218, and the slide bar 204 drives the lifting ring 205 to move downward synchronously. The lifting ring 205 drives the adjusting cylinder 208 to move downward along the rotating rod 211 by sliding cooperation between the arc groove 206 and the limit ring 207. The adjusting cylinder 208 drives the clamping column 210 to move downward synchronously through the cross plate 209, which can stably clamp chips of different thicknesses, and has double grasping, anti-detachment, damage avoidance, stability, reliability, flexibility and practicality. Among them, the rotating rod 211 is provided with at least 4, the length of the slide groove 220 is greater than the length of the inclined groove 217 in the vertical direction, the side ring 203 is provided with a ring groove at one end close to the rotating ring 213, and the rotating ring 213 is provided with a slip ring that slides with the ring groove at one end. The clamping column 210 can be made of rubber, which can avoid damage to the outer edge of the chip caused by clamping.

[0031] In one embodiment of the present invention, see Figure 1 , Figure 2 , Figure 4 and Figure 5The adsorption assembly 3 includes a bracket 301 arranged inside the mounting cylinder 202 and a plurality of lifting cylinders 302 penetrating the mounting cylinder 202 and the bracket 301. The outer end of the lifting cylinder 302 is provided with an adsorption disk 303, and the adsorption disk 303 is provided with a plurality of through holes 1 304. The lifting cylinder 302 is provided with a retaining ring 1 305 located between the adsorption disk 303 and the bracket 301. The lifting cylinder 302 is provided with a retaining ring 2 307 located on the side of the bracket 301 away from the adsorption disk 303. A spring 306 is connected between the retaining ring 1 305 and the bracket 301. A lifting disk 314 is slidably provided in the lifting cylinder 302. A sealing ring is provided between the lifting disk 314 and the lifting cylinder 302. A plurality of through holes 315 are provided, and a plurality of movable cover plates 316 corresponding to the through holes 315 are hinged on the side of the lifting plate 314 away from the adsorption plate 303. A connecting plate 309 is movably provided in the installation tube 202, and a vertical rod 313 connected to the lifting plate 314 is connected to one side of the connecting plate 309. A guide rod 308 slidingly matched with the bracket 301 is connected to the connecting plate 309. A transmission gear 311 is rotatably provided at the top of the inner side of the installation tube 202. The connecting plate 309 and the transmission gear 311 are movably connected by a plurality of hinged rods 310. A rotating gear 312 meshing with the transmission gear 311 is rotatably provided inside the installation tube 202, and the rotating gear 312 is connected to a rotating motor.

[0032] In the present embodiment, in the initial state, the lifting plate 314 is at the lowest point, the movable cover plate 316 is in contact with the second through hole 315, the spring 306 is at its original length, and the hinge rod 310 is in a vertical state. When the bottom of the adsorption plate 303 is in contact with the chip surface, the rotating motor drives the transmission gear 311 to rotate by driving the rotating gear 312 to rotate. The transmission gear 311 drives the connecting plate 309 to move upward by means of the hinge rod 310 and the sliding cooperation between the guide rod 308 and the bracket 301. The connecting plate 309 is moved upward by means of the vertical connection. The rod 313 drives the lifting plate 314 to move upward, and the air pressure in the internal space of the lifting cylinder 302 from the top of the adsorption plate 303 to the bottom of the lifting plate 314 decreases. Under the driving effect of the atmospheric pressure, the chip is adsorbed on the bottom of the adsorption plate 303, thereby realizing the chip grabbing operation. When the chip needs to be released, the rotating motor drives the rotating gear 312 to rotate in the reverse direction to drive the transmission gear 311 to rotate in the reverse direction. The transmission gear 311 is driven by the hinge rod 310 and the connecting plate 309. The guide rod 308 and the bracket 301 are slidably matched. The movable connecting plate 309 moves downward, and the connecting plate 309 drives the lifting plate 314 to move downward through the vertical rod 313. The air pressure in the internal space of the lifting cylinder 302 from the top of the adsorption plate 303 to the bottom of the lifting plate 314 increases, so that the internal and external air pressures are restored to balance, which is convenient for the release of the chip. Among them, when the adsorption plate 303 contacts the uneven surface of the chip, the adsorption plate 303 is stressed and pushes the lifting cylinder 302 to move upward, and the lifting cylinder 302 drives the retaining ring 305 to move upward synchronously, and the spring 306 is stressed and contracts, so that several adsorption plates 303 can be The adsorption area is expanded and the grasping stability is improved by the effect of adsorption with the chip surface, wherein the hinge rod 310 is respectively ball-hinged with the connecting plate 309 and the transmission gear 311, and the lifting cylinder 302 is at least set to 3, and the cooperation of the through hole 2 315 and the movable cover plate 316 facilitates the circulation of gas on both sides of the lifting plate 314. The adsorption plate 303 is made of rubber, and the contact end face of the adsorption plate 303 close to the chip is set as a circular ring, and the through hole 1 304 is located on the inner side of the circular ring, and a spacing is provided between the through hole 1 304 and the circular ring.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip processing grasping mechanism, comprising a robotic arm, characterized in that: The outer end of the mechanical arm is provided with a bracket assembly, and the bracket assembly includes a mounting tube connected to the outer end of the mechanical arm, an adsorption assembly is provided inside the mounting tube, support rings are respectively provided at both ends of the outer side of the mounting tube, a side ring located between the two support rings is provided on the outer side of the mounting tube, a plurality of rotating rods penetrating the side rings are circumferentially distributed and rotatably provided between the mounting tubes, a sliding groove is provided on the rotating rod, an adjusting tube is slidably sleeved on the rotating rod, a cross bar slidably matched with the sliding groove is provided in the adjusting tube, a cross plate is provided on the outer side of the adjusting tube, a clamping column is connected to the outer end of the cross plate, a gear ring 1 is provided on the rotating rod, a swivel is slidably provided between the mounting tube and the side ring, a gear ring 2 meshing with the gear ring 1 is provided on the swivel, a worm meshing with the gear ring 2 is rotatably provided on the side ring, and the worm The cam is connected to the adjusting motor, and a sliding rod is circumferentially distributed on the side ring and passes through the sliding rod. One end of the sliding rod is connected to a lifting ring movably sleeved on the outside of the mounting tube. A plurality of arc grooves are circumferentially distributed on the outside of the lifting ring. A limit ring arranged on the outside of the adjusting tube is slidably matched in the arc groove. A plurality of oblique grooves are circumferentially distributed on the outside of the rotating ring. A sliding column slidably matched with the oblique groove is provided on the sliding rod. The adjusting motor drives the worm to rotate, and the worm drives the rotating ring to rotate counterclockwise by meshing with the second gear ring. The second gear ring drives the rotating rod to rotate by meshing with the first gear ring. The rotating rod drives the adjusting tube to rotate synchronously by sliding cooperation between the sliding groove and the cross bar. The adjusting tube drives the clamping column to approach the mounting tube through the cross plate, and a plurality of clamping columns double clamp the chip by cooperating with the adsorption component.

2. The chip processing grasping mechanism according to claim 1, characterized in that: The adsorption assembly includes a bracket arranged inside the mounting cylinder and a plurality of lifting cylinders passing through the mounting cylinder and the bracket, an adsorption plate is provided at the outer end of the lifting cylinder, a plurality of through holes are provided on the adsorption plate, an elastic module is provided between the outer side of the lifting cylinder and the bracket, an air suction module is provided between the inner wall of the lifting cylinder and the inside of the mounting cylinder, and an adjustment module connected to the air suction module is provided inside the mounting cylinder.

3. The chip processing grasping mechanism according to claim 2, characterized in that: The elastic module includes a retaining ring 1 arranged on the lifting cylinder and located between the adsorption plate and the bracket. The lifting cylinder is provided with a retaining ring 2 located on the side of the bracket away from the adsorption plate. A spring is connected between the retaining ring 1 and the bracket.

4. The chip processing grasping mechanism according to claim 3, characterized in that: The suction module includes a lifting plate slidably arranged in the lifting cylinder, a sealing ring is arranged between the lifting plate and the lifting cylinder, a plurality of through holes 2 are arranged on the lifting plate, a plurality of movable cover plates corresponding to the through holes 2 are hingedly connected on the side of the lifting plate away from the adsorption plate, a connecting plate is movably arranged in the installation cylinder, a vertical rod connected to the lifting plate is connected to one side of the connecting plate, and a guide rod slidably matched with the bracket is connected to the connecting plate.

5. The chip processing grasping mechanism according to claim 4, characterized in that: The adjustment module includes a transmission gear rotatably arranged on the top of the inner side of the installation cylinder. The connecting plate and the transmission gear are movably connected through a plurality of hinged rods. A rotating gear meshing with the transmission gear is rotatably arranged inside the installation cylinder, and the rotating gear is connected to a rotating motor.

6. The chip processing grasping mechanism according to claim 1, characterized in that: The length of the slide groove is greater than the length of the inclined groove in the vertical direction.

7. The chip processing grasping mechanism according to claim 1, characterized in that: The clamping column is made of rubber.

8. The chip processing grasping mechanism according to claim 5, characterized in that: The hinged rod is respectively hinged to the connecting plate and the transmission gear ball.

9. The chip processing grasping mechanism according to claim 2, characterized in that: The adsorption plate is made of rubber, the contact end surface of the adsorption plate close to the chip is set as a circular ring, the through hole 1 is located inside the circular ring, and a spacing is set between the through hole 1 and the circular ring.

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