Semiconductor plastic packaging machine

Abstract

The invention discloses a semiconductor plastic packaging machine, and relates to the technical field of semiconductor plastic packaging, and the semiconductor plastic packaging machine is characterized in that the bottom end of a plastic packaging machine main body is fixedly connected with a storage box, the bottom end of the storage box is fixedly connected with an injector, the bottom end of the injector is fixedly connected with injection pipes at equal intervals in the length direction, and a mold is arranged in the plastic packaging machine main body; the bottom end of the mold abuts against and is connected with a bearing plate, the two ends of the mold are fixedly connected with sliding bases respectively, the sliding bases are connected with guide rails in a sleeved mode, the pressing device is fixedly connected to the end, away from the storage box, of the plastic packaging machine body, and a pressing plate used for abutting against the mold is arranged at the bottom end of the pressing device. The storage box can store the plastic package material, and the temperature of the plastic package material can be reduced in the process that the semiconductor is fed by the bearing plate, so that the plastic package material reaches a proper temperature, and the phenomenon that the plastic package material generates bubbles when the semiconductor is subjected to plastic package is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor plastic packaging, and in particular to a semiconductor plastic packaging machine. Background Art

[0002] A semiconductor is a material whose electrical conductivity is between that of a conductor and an insulator. In solid-state physics, semiconductors are materials whose electrical conductivity can be adjusted by doping or changing the temperature. The most common example of a semiconductor material is silicon, but it also includes germanium, gallium arsenide, etc.

[0003] In the prior art, semiconductors are often encapsulated using a encapsulation machine, which is mainly composed of a mold, an injection device and a loading device. Semiconductors are placed in rows in the mold, and then the injection device injects heated encapsulation material into the mold to encapsulate the semiconductors. The mold then presses the encapsulation material to complete the effect of encapsulating the semiconductor.

[0004] However, since the plastic film is relatively thin, when the temperature of the plastic sealing machine is set high, when the injection device injects the plastic sealing material into the mold, bubbles will be generated during the pressing of the plastic sealing material, resulting in poor semiconductor plastic sealing effect. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor molding machine to solve the technical problem in the prior art that due to the thin molding film, when the temperature of the molding machine is set high, when the injection device injects the molding material into the mold, bubbles will be generated during the molding material pressing, resulting in poor semiconductor molding effect.

[0006] The technical problem to be solved by the present invention can be achieved by the following technical solutions:

[0007] A semiconductor plastic packaging machine, comprising:

[0008] A laminator body, wherein a storage box is fixedly connected to the bottom end of the laminator body, a syringe is fixedly connected to the bottom end of the storage box, and an injection tube is fixedly connected to the bottom end of the syringe at equal distances along the length direction;

[0009] The mold is arranged inside the main body of the plastic packaging machine, the bottom end of the mold is abutted and connected with a bearing plate, the two ends of the mold are respectively fixedly connected with a slide seat, and the slide seat sleeve is connected with a guide rail;

[0010] The presser is fixedly connected to one end of the plastic packaging machine body away from the storage box, and a pressing plate for supporting the mold is arranged at the bottom of the presser.

[0011] As a further solution of the present invention: both ends of the laminator body are fixedly connected with conveying boxes, the inner wall of the laminator body is slidably connected with a moving platform, the side end of the laminator body is fixedly connected with a controller, and the top of the moving platform is fixedly connected with a lifting platform.

[0012] As a further solution of the present invention: a telescopic door for sealing the conveying box is fixedly connected to the inner wall of the conveying box.

[0013] As a further solution of the present invention: the controller is arranged at one end of the plastic packaging machine body away from the moving platform, and an air hole is opened at the side end of the plastic packaging machine body, and the air hole is communicated with the controller.

[0014] As a further solution of the present invention: the side end of the guide rail is fixedly connected to the inner wall of the laminator body, and a driver for driving the slide to slide on the outer wall of the guide rail is provided between the guide rail and the laminator body, and the two ends of the driver are respectively fixedly connected to the guide rail and the laminator body.

[0015] As a further solution of the present invention: a telescopic rod is fixedly connected to the top of the pressing plate, the press is provided with a slide groove, and the inner wall of the slide groove is slidably connected to the telescopic rod.

[0016] As a further solution of the present invention: limiting grooves are respectively provided at both ends of the suppressor, the cross-section of the limiting grooves is rectangular, the inner wall of the limiting grooves is slidably connected to a limiting tube, and the limiting tube is fixedly connected to the top of the pressing plate.

[0017] As a further solution of the present invention: the interior of the storage box is interconnected with the syringe, a heating plate is fixedly connected to the inner wall of the storage box, and a plurality of sensors are fixedly connected to the inner side end of the storage box along the width direction.

[0018] As a further solution of the present invention: locking components are fixedly connected to both ends of the mold, and the locking components are respectively abutted and connected to both ends of the bearing plate.

[0019] As a further solution of the present invention: the locking assembly includes: a clamping plate, a locking rod and a locking device, the two ends of the supporting plate are respectively fixedly connected with positioning columns, the locking device is fixedly connected to the side end of the mold, the two ends of the locking rod are respectively fixedly connected to the clamping plate and the locking device, the clamping plate is sleeved and connected to the outer wall of the positioning column, and the clamping plate is abutted and connected to the side end of the supporting plate.

[0020] Beneficial effects of the present invention:

[0021] 1. The carrier plate carries the semiconductor and moves it to the bottom of the mold. The semiconductor then enters the injection groove opened in the mold. Then the mold moves toward the direction of the press with the carrier plate. During the movement of the mold, the plastic sealing material stored in the storage box is sprayed through the syringe. The syringe sprays the plastic sealing material into the injection groove opened in the mold through the injection tube. The syringe can realize quantitative spraying of the plastic sealing material. The storage box has the effect of keeping the plastic sealing material warm. When the main body of the plastic sealing machine melts the plastic sealing material and then passes it into the storage box, the storage box will store the plastic sealing material. The temperature of the plastic sealing material will be cooled down during the process of loading the semiconductor on the carrier plate, so that the plastic sealing material reaches a suitable temperature, thereby avoiding the phenomenon of bubbles in the plastic sealing material when the semiconductor is plastic sealed.

[0022] 2. When the mold continues to move with the semiconductor, the mold can slide along the guide rail through a fixed slide. The mold moves with the semiconductor, and the syringe injects the plastic sealing material into the injection groove opened in the mold, thereby improving the work efficiency of injecting the plastic sealing material into the semiconductor. When the mold moves to the bottom of the press, the press drives the pressing plate to move downward, and the pressing plate supports the top of the mold, so that the pressing plate achieves the effect of pressing the plastic sealing material. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the internal structure of the main body of the plastic sealing machine of the present invention;

[0026] Figure 3 It is a front view of the internal structure of the plastic packaging machine body of the present invention;

[0027] Figure 4 It is a cross-sectional view of the internal structure of the main body of the plastic sealing machine of the present invention;

[0028] Figure 5 For the present invention Figure 4 A schematic diagram of the structure at A;

[0029] Figure 6 It is a schematic diagram of the mold structure of the present invention;

[0030] Figure 7 It is a schematic diagram of the pressed plate structure of the present invention.

[0031] In the figure: 1. Laminator body; 2. Conveying box; 3. Telescopic door; 4. Presser; 5. Pressing plate; 6. Driver; 7. Controller; 8. Air hole; 9. Guide rail; 10. Slide; 11. Loading plate; 12. Mold; 13. Moving table; 14. Lifting table; 15. Storage box; 16. Syringe; 17. Injection tube; 18. Heating plate; 19. Limiting tube; 20. Limiting groove; 21. Slide; 22. Telescopic rod; 23. Sensor; 24. Positioning column; 25. Clamping plate; 26. Locking rod; 27. Locker. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] like Figure 1-Figure 7 As shown, a semiconductor packaging machine includes: a packaging machine body 1, a mold 12 and a pressing device 4,

[0034] The bottom end of the main body 1 of the laminator is fixedly connected to a storage box 15, the bottom end of the storage box 15 is fixedly connected to a syringe 16, the bottom end of the syringe 16 is fixedly connected to an injection tube 17 equidistantly along the length direction, the mold 12 is arranged inside the main body 1 of the laminator, the bottom end of the mold 12 is abutted against a carrier plate 11, both ends of the mold 12 are respectively fixedly connected to a slide 10, the slide 10 is sleeved and connected with a guide rail 9, the press 4 is fixedly connected to the end of the main body 1 of the laminator away from the storage box 15, the bottom end of the press 4 is provided with a pressing plate 5 for abutting the mold 12, the carrier plate 11 carries the semiconductor to the bottom of the mold 12, and then the semiconductor enters the injection groove provided in the mold 12, and then the mold 12 carries the carrier plate 11 to move to the bottom of the mold 12. The plate 11 moves toward the direction of the suppressor 4. During the movement of the mold 12, the plastic encapsulation material stored in the storage box 15 is sprayed through the injector 16. The injector 16 sprays the plastic encapsulation material into the injection groove opened in the mold 12 through the injection tube 17. The injector 16 can realize quantitative spraying of the plastic encapsulation material. The storage box 15 has the effect of keeping the plastic encapsulation material warm. When the plastic encapsulation machine body 1 melts the plastic encapsulation material and then passes it into the storage box 15, the storage box 15 will store the plastic encapsulation material. The temperature of the plastic encapsulation material will be cooled down during the process of the semiconductor being loaded on the carrier plate 11, so that the plastic encapsulation material reaches a suitable temperature, thereby avoiding the phenomenon of bubbles in the plastic encapsulation material when the semiconductor is being plastic encapsulated;

[0035] When the mold 12 continues to move with the semiconductor, the mold 12 can slide along the guide rail 9 through the fixed slide 10. The mold 12 moves while carrying the semiconductor, and the injector 16 injects the plastic encapsulation material into the injection groove opened by the mold 12, thereby improving the working efficiency of injecting the plastic encapsulation material into the semiconductor. When the mold 12 moves to the bottom of the press 4, the press 4 drives the pressing plate 5 to move downward, and the pressing plate 5 supports the top of the mold 12, so that the pressing plate 5 achieves the effect of pressing the plastic encapsulation material.

[0036] In some specific embodiments, the two ends of the plastic packaging machine body 1 are respectively fixedly connected to the conveying box 2, the inner wall of the plastic packaging machine body 1 is slidably connected to the moving platform 13, the side end of the plastic packaging machine body 1 is fixedly connected to the controller 7, the top of the moving platform 13 is fixedly connected to the lifting platform 14, the moving platform 13 can carry the carrying plate 11 through the lifting platform 14, the semiconductors are neatly placed on the carrying plate 11, and then the moving platform 13 carries the carrying plate 11 for loading and unloading through the lifting platform 14, the moving platform 13 can move along the conveying box 2 and enter the interior of the plastic packaging machine body 1, and then the moving platform 13 drives the lifting platform 14 to move upward, the lifting platform 14 carries the carrying plate 11 and the bottom end of the mold 12 is abutted, the semiconductor on the carrying plate 11 enters the injection groove opened by the mold 12, when the semiconductor is plastic-sealed, the mold 12 moves to the top of the lifting platform 14 with the carrying plate 11, and then the lifting platform 14 carries the carrying plate 11, and then the lifting platform 14 moves downward, and finally, the moving platform 13 moves the plastic-sealed semiconductor out of the plastic packaging machine body 1.

[0037] In some specific embodiments, the inner wall of the conveying box 2 is fixedly connected with a telescopic door 3 for sealing the conveying box 2. When the moving platform 13 moves the semiconductor into the laminating machine body 1, the telescopic door 3 starts to seal the conveying box 2, thereby ensuring that the laminating machine body 1 is in a sealed state.

[0038] In some specific embodiments, the controller 7 is arranged at one end of the laminating machine body 1 away from the moving platform 13, and an air hole 8 is opened at the side end of the laminating machine body 1, and the air hole 8 is interconnected with the controller 7. In order to further avoid the phenomenon of bubbles in the plastic packaging material, the controller 7 is running, and the controller 7 extracts the air in the laminating machine body 1 through the air hole 8, thereby ensuring that the laminating machine body 1 is in a vacuum environment. When the moving platform 13 moves the plastic-sealed semiconductor out of the laminating machine body 1, the controller 7 is running, and the controller 7 keeps the air pressure in the laminating machine body 1 consistent with the external air pressure. The vacuum environment can further avoid the phenomenon of bubbles in the plastic packaging material when the semiconductor is plastic-sealed.

[0039] In some specific embodiments, the side end of the guide rail 9 is fixedly connected to the inner wall of the laminating machine body 1, and a driver 6 for driving the slide 10 to slide on the outer wall of the guide rail 9 is provided between the guide rail 9 and the laminating machine body 1. The two ends of the driver 6 are respectively fixedly connected to the guide rail 9 and the laminating machine body 1. When the mold 12 needs to move, the driver 6 runs, and the driver 6 controls the slide 10 to slide on the guide rail 9, so that the slide 10 moves with the mold 12, thereby achieving the effect of moving the mold 12 along the trajectory of the guide rail 9.

[0040] In some specific embodiments, a telescopic rod 22 is fixedly connected to the top of the pressing plate 5, and the presser 4 is provided with a slide groove 21. The inner wall of the slide groove 21 is slidably connected to the telescopic rod 22. When the presser 4 drives the pressing plate 5 to press the plastic packaging material, the presser 4 drives the telescopic rod 22 to move downward, and the telescopic rod 22 slides along the inner wall of the slide groove 21, so that the telescopic rod 22 moves downward with the pressing plate 5. When the pressing plate 5 presses the plastic packaging material, the telescopic rod 22 stops moving.

[0041] In some specific embodiments, limiting grooves 20 are respectively provided at both ends of the press 4, and the cross-section of the limiting groove 20 is rectangular. The inner wall of the limiting groove 20 is slidably connected to the limiting tube 19, and the limiting tube 19 is fixedly connected to the top of the pressing plate 5. When the pressing plate 5 moves downward, the pressing plate 5 moves downward with the limiting tube 19, and the limiting tube 19 slides along the inner wall of the limiting groove 20. The shape of the inner wall of the limiting groove 20 can provide limiting support for the pressing plate 5 by abutting against the limiting tube 19, thereby avoiding the pressing plate 5 from deflecting or overturning when pressing the plastic encapsulation material, thereby ensuring the accuracy of the pressing plate 5 in pressing the plastic encapsulation material.

[0042] In some specific embodiments, the interior of the storage box 15 is interconnected with the syringe 16, a heating plate 18 is fixedly connected to the inner wall of the storage box 15, and a plurality of sensors 23 are fixedly connected to the inner side ends of the storage box 15 along the width direction. When the temperature of the plastic sealing material stored in the storage box 15 is lower than a suitable value, the sensor 23 will promptly detect the temperature of the plastic sealing material. At this time, the heating plate 18 will operate and heat the plastic sealing material stored in the storage box 15, thereby ensuring that the plastic sealing material stored in the storage box 15 is always at a suitable temperature.

[0043] In some specific embodiments, locking assemblies are fixedly connected at both ends of the mold 12, and the locking assemblies are respectively abutted against the two ends of the carrier plate 11. When the carrier plate 11 and the bottom end of the mold 12 are abutted against each other, the locking assemblies are operated, and the locking assemblies clamp the two ends of the carrier plate 11, so that the mold 12 achieves the effect of clamping and fixing the carrier plate 11.

[0044] In some specific embodiments, the locking assembly includes: a clamping plate 25, a locking rod 26 and a locking device 27, the two ends of the carrier plate 11 are respectively fixedly connected with the positioning column 24, the locking device 27 is fixedly connected to the side end of the mold 12, the two ends of the locking rod 26 are respectively fixedly connected to the clamping plate 25 and the locking device 27, the clamping plate 25 is sleeved and connected to the outer wall of the positioning column 24, the clamping plate 25 is abutted against the side end of the carrier plate 11, when the locking assembly fixes the carrier plate 11, the carrier plate 11 and the bottom end of the mold 12 are abutted, the locking device 27 is operated, and the locking device 27 controls the locking rod 26 to move in the direction of the positioning column 24 Move, and then the locking rod 26 moves with the clamping plate 25 to the positioning column 24. A circular hole is opened on the clamping plate 25, and the circular hole opened in the clamping plate 25 is sleeved on the positioning column 24. When the clamping plate 25 abuts against the side end of the load-bearing plate 11, the inner wall of the circular hole opened in the clamping plate 25 abuts against the positioning column 24. When the moving platform 13 controls the lifting platform 14 to move downward, the locking component abuts against the positioning column 24 through the inner wall of the circular hole, thereby achieving the effect of fixing the load-bearing plate 11. When the mold 12 moves, the mold 12 clamps and fixes the load-bearing plate 11 through the locking component, thereby achieving the effect of carrying and moving the load-bearing plate 11.

[0045] Several embodiments of the present invention are described in detail above, but the embodiments of the present invention are not limited thereto and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A semiconductor plastic packaging machine, characterized in that: include: A plastic sealing machine body (1), wherein the bottom end of the plastic sealing machine body (1) is fixedly connected to a storage box (15), the bottom end of the storage box (15) is fixedly connected to a syringe (16), and the bottom end of the syringe (16) is fixedly connected to an injection tube (17) at equal distances along the length direction; A mold (12), wherein the mold (12) is arranged inside the main body (1) of the plastic packaging machine, the bottom end of the mold (12) is abutted against and connected to a carrier plate (11), and both ends of the mold (12) are respectively fixedly connected to a slide seat (10), and the slide seat (10) is sleeved and connected to a guide rail (9); The press (4) is fixedly connected to one end of the plastic packaging machine body (1) away from the storage box (15), and a pressing plate (5) for supporting the mold (12) is provided at the bottom end of the press (4).

2. A semiconductor packaging machine according to claim 1, characterized in that: The two ends of the plastic sealing machine body (1) are respectively fixedly connected to a conveying box (2), the inner wall of the plastic sealing machine body (1) is slidably connected to a moving platform (13), the side end of the plastic sealing machine body (1) is fixedly connected to a controller (7), and the top of the moving platform (13) is fixedly connected to a lifting platform (14).

3. A semiconductor packaging machine according to claim 2, characterized in that: A telescopic door (3) for sealing the conveying box (2) is fixedly connected to the inner wall of the conveying box (2).

4. A semiconductor packaging machine according to claim 2, characterized in that: The controller (7) is arranged at one end of the plastic sealing machine body (1) away from the moving platform (13), and an air hole (8) is opened at the side end of the plastic sealing machine body (1), and the air hole (8) is communicated with the controller (7).

5. A semiconductor packaging machine according to claim 1, characterized in that: The side end of the guide rail (9) is fixedly connected to the inner wall of the plastic packaging machine body (1), and a driver (6) is provided between the guide rail (9) and the plastic packaging machine body (1) for driving the slide seat (10) to slide on the outer wall of the guide rail (9), and the two ends of the driver (6) are respectively fixedly connected to the guide rail (9) and the plastic packaging machine body (1).

6. A semiconductor packaging machine according to claim 1, characterized in that: The top end of the pressing plate (5) is fixedly connected with a telescopic rod (22), the pressing device (4) is provided with a sliding groove (21), and the inner wall of the sliding groove (21) is slidably connected with the telescopic rod (22).

7. A semiconductor packaging machine according to claim 6, characterized in that: The two ends of the press (4) are respectively provided with limiting grooves (20), the cross section of the limiting groove (20) is rectangular, the inner wall of the limiting groove (20) is slidably connected to the limiting tube (19), and the limiting tube (19) is fixedly connected to the top end of the pressing plate (5).

8. A semiconductor packaging machine according to claim 1, characterized in that: The interior of the storage box (15) is in communication with the syringe (16); a heating plate (18) is fixedly connected to the inner wall of the storage box (15); and a plurality of sensors (23) are fixedly connected to the inner side end of the storage box (15) along the width direction.

9. A semiconductor packaging machine according to claim 1, characterized in that: The two ends of the mold (12) are respectively fixedly connected with locking components, and the locking components are respectively butted and connected with the two ends of the carrying plate (11).

10. A semiconductor packaging machine according to claim 9, characterized in that: The locking assembly comprises: a clamping plate (25), a locking rod (26) and a locking device (27); the two ends of the carrier plate (11) are respectively fixedly connected with positioning columns (24); the locking device (27) is fixedly connected to the side end of the mold (12); the two ends of the locking rod (26) are respectively fixedly connected to the clamping plate (25) and the locking device (27); the clamping plate (25) is sleeved and connected to the outer wall of the positioning column (24); and the clamping plate (25) is butt-connected to the side end of the carrier plate (11).

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