A semiconductor device feeding apparatus

Abstract

The application relates to the technical field of semiconductor device processing, and particularly discloses a semiconductor device feeding device, which can pre-feed a plurality of semiconductor devices into a vibrating disc, and after the vibrating motor of the vibrating disc is started, the semiconductor devices are conveyed to a conveying channel along a spiral material channel, high-pressure gas is introduced into the inclined air holes, the semiconductor devices can move along the conveying channel through the inclined blowing of the high-pressure gas, the top plate is arranged in a structure capable of moving up and down, the semiconductor devices can be pressed and dropped through the driving of the up-and-down movement of the top plate, the top edge of the semiconductor devices is prevented from being clamped to the bottom surface of the top plate, the material clamping phenomenon is avoided, and the semiconductor devices can be smoothly conveyed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device processing technology, and in particular to a semiconductor device feeding device. Background Technology

[0002] In the production process of semiconductor devices, a vibratory feeder is usually used for feeding. The discharge end of the vibratory feeder is then connected to a feeding track, which transports the semiconductor devices to the next work station.

[0003] Existing feed tracks, such as Figure 1 As shown, the feeding track uses oblique blowing air holes, and the semiconductor device 30 is moved by the oblique high-pressure airflow. However, since the internal height of the feeding track is uniform, when the semiconductor device 30 with a lower height passes through, it is easy for the semiconductor device 30 to tilt up under the action of the high-pressure airflow. The top edge of the semiconductor device 30 gets stuck on the bottom surface of the top plate of the feeding track, resulting in a jam and preventing smooth conveying.

[0004] Therefore, existing technologies still need to be improved and developed. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a semiconductor device feeding device to solve the problem that semiconductor devices are prone to tilting during the advancement process in the track.

[0006] A semiconductor device feeding device includes a vibratory feeder with a spiral feed channel. The discharge end of the spiral feed channel is connected to a track conveying assembly. The track conveying assembly includes a straight track, a partition, and a top plate. The straight track has a straight groove. The partition is disposed in the straight groove and divides the straight groove into a lower air channel and an upper conveying channel. The conveying channel is connected to the discharge end of the spiral feed channel. The partition has a plurality of inclined air holes that connect the air channel and the conveying channel. The top plate can move up and down above the conveying channel.

[0007] Specifically, the track conveying assembly further includes a height holding mechanism, which includes several springs connected between the top plate and the straight track, and a pressure block disposed above the top plate and used to press down the top plate. The height of the pressure block is adjustable.

[0008] Specifically, the track conveying assembly also includes a vibratory unloading mechanism, which includes a side plate detachably fixed to one side of the straight track and a lifting drive device fixed to the side plate. The pressure block is connected to the output end of the lifting drive device.

[0009] Specifically, the lifting drive device is a cylinder, and both the lifting drive device and the pressure block have two.

[0010] Specifically, the track conveying assembly further includes a quick-release mechanism, which includes a pin connected to the bottom of the side plate, a socket provided on the side of the straight track and engaged with the pin, a mounting base fixed to one side of the straight track, a stop bar whose lower end is rotatably connected to the mounting base, and a locking member for locking the stop bar and the mounting base. The upper end of the stop bar can swing to one side of the side plate to limit and fix the side plate.

[0011] Specifically, the locking component is a quick-release screw.

[0012] Specifically, an air inlet connector connected to the air passage is provided on the outer side of the straight track.

[0013] Specifically, the inner bottom of the vibratory feeder is provided with a hollow groove, and an upwardly arched guide seat is detachably connected to the hollow groove. A spirally rising base plate is provided around the guide seat. A filtering area is provided on the base plate. The filtering area is provided with several filtering holes. A dust collection box is provided below the filtering holes. The dust collection box is located in the hollow groove.

[0014] The beneficial effects of this invention are:

[0015] The semiconductor device feeding device of the present invention can pre-pour several semiconductor devices into a vibratory feeder. After the vibratory motor of the vibratory feeder is started, the semiconductor devices are conveyed to the conveying channel along the spiral material channel. High-pressure gas is then introduced into the inclined air hole. Through the oblique blowing action of the high-pressure gas, the semiconductor devices can move along the conveying channel. Moreover, the top plate is set to a structure that can move up and down. By driving the top plate to move up and down, the semiconductor devices can be pressed down to prevent the top edge of the semiconductor devices from getting stuck on the bottom surface of the top plate, thereby avoiding the jamming phenomenon and ensuring that the semiconductor devices can be conveyed smoothly. Attached Figure Description

[0016] Figure 1 A schematic diagram of a feed track for conveying semiconductor devices using existing technology;

[0017] Figure 2 This is a perspective view of the semiconductor device feeding apparatus of this application;

[0018] Figure 3 This is a perspective view of the track conveying assembly of this application;

[0019] Figure 4 This is a three-dimensional sectional view of the track conveying assembly of this application;

[0020] Figure 5 This is a front view of the track conveying assembly of this application;

[0021] Figure 6 This is a right view of the track conveying assembly of this application;

[0022] Figure 7 This is a top view of the vibratory feeder of this application;

[0023] Figure 8 for Figure 7 Sectional view along line BB;

[0024] Figure 9 for Figure 8 Enlarged view of section C.

[0025] The attached figures are labeled as follows: vibratory feeder 10, spiral feed channel 11, track conveying assembly 20, straight track 21, partition 22, top plate 23, air channel 201, conveying channel 202, air hole 203, height holding mechanism 24, spring 241, pressure block 242, vibratory feeding mechanism 25, side plate 251, lifting drive device 252, quick release mechanism 26, pin 261, insertion hole 262, mounting base 263, stop bar 264, locking part 265, air inlet connector 27, hollow groove 12, guide seat 13, bottom plate 14, filter hole 15, dust collection box 16, semiconductor device 30. Detailed Implementation

[0026] This invention provides a semiconductor device feeding device. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention.

[0027] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0028] like Figures 1 to 9This embodiment discloses a semiconductor device feeding device, including a vibratory feeder 10. The vibratory feeder 10 is provided with a spiral feed channel 11. The discharge end of the spiral feed channel 11 is connected to a track conveying assembly 20. The track conveying assembly 20 includes a straight track 21, a partition 22 and a top plate 23. The straight track 21 is provided with a straight groove. The partition 22 is provided in the straight groove and divides the straight groove into an air channel 201 located below and a conveying channel 202 located above. The conveying channel 202 is connected to the discharge end of the spiral feed channel 11. The partition 22 is provided with a plurality of inclined air holes 203 that connect the air channel 201 and the conveying channel 202. The top plate 23 can move up and down above the conveying channel 202.

[0029] In this embodiment, the semiconductor device feeding device can pre-pour several semiconductor devices 30 into the vibratory feeder 10. After the vibration motor of the vibratory feeder 10 is started, the semiconductor devices 30 are conveyed along the spiral feed channel 11 to the conveying channel 202. High-pressure gas is then introduced into the inclined air hole 203. Through the oblique blowing action of the high-pressure gas, the semiconductor devices 30 can move along the conveying channel 202. Moreover, the top plate 23 is set to be a structure that can move up and down. By driving the top plate 23 to move up and down, the semiconductor devices 30 can also be pressed down to prevent the top edge of the semiconductor devices 30 from getting stuck on the bottom surface of the top plate 23, thereby avoiding the jamming phenomenon and ensuring that the semiconductor devices 30 can be conveyed smoothly.

[0030] For further details, please refer to... Figure 2 , Figure 5 and Figure 6 The track conveying assembly 20 in this embodiment also includes a height holding mechanism 24. The height holding mechanism 24 includes several springs 241 connected between the top plate 23 and the straight track 21, and a pressure block 242 disposed above the top plate 23 and used to press down the top plate 23. The height of the pressure block 242 is adjustable. The height of the pressure block 242 can be adjusted according to the height of the semiconductor device 30, thereby adjusting the height of the conveying channel 202. The height of the conveying channel 202 can be set to be slightly greater than the height of the semiconductor device 30 to avoid the bottom surface of the top plate 23 from contacting the semiconductor device 30 and reduce the conveying resistance. Several springs 241 are also provided between the top plate 23 and the straight track 21. Moreover, the top plate 23 has a certain downward buffer space. When one end of the semiconductor device 30 is blown up by the inclined airflow, the top plate 23 can be driven to move up and down, thereby pressing down the semiconductor device 30, correcting the conveying posture of the semiconductor device 30, and ensuring that the semiconductor device 30 can be conveyed smoothly.

[0031] For further details, please refer to... Figure 6The track conveying assembly 20 in this embodiment also includes a vibration unloading mechanism 25. The vibration unloading mechanism 25 includes a side plate 251 that is detachably fixed to one side of the straight track 21, a lifting drive device 252 fixed to the side plate 251, and a pressure block 242 connected to the output end of the lifting drive device 252. The lifting drive device 252 drives the pressure block 242 to move up and down, thereby pressing or shaking the semiconductor device 30 on the bottom surface of the top plate 23 to avoid jamming.

[0032] Furthermore, in this embodiment, the lifting drive device 252 is a cylinder. The cylinder generates force by compressing air or gas. The cylinder moves very fast and can drive the pressure block 242 at a high frequency, so that the semiconductor device 30 on the bottom surface of the top plate 23 can be quickly pressed down or shaken off.

[0033] For further details, please refer to... Figure 5 There are two lifting drive devices 252 and two pressure blocks 242. By setting two lifting drive devices 252 and two pressure blocks 242, the stability of the top plate 23 moving up and down is improved.

[0034] In addition, the track conveying assembly 20 needs to be disassembled for inspection and maintenance regularly. Based on this, this embodiment also adds a quick-release mechanism 26. The quick-release mechanism 26 includes a pin 261 connected to the bottom of the side plate 251, a socket 262 located on the side of the straight track 21 and engaged with the pin 261, a mounting base 263 fixed to one side of the straight track 21, a stop bar 264 whose lower end is rotatably connected to the mounting base 263, and a locking member 265 for locking the stop bar 264 and the mounting base 263. The upper end of the stop bar 264 can swing to one side of the side plate 251 to limit and fix the side plate 251. When it is necessary to disassemble for inspection and maintenance, the locking member 265 can be loosened, the upper end of the stop bar 264 can be swung downward, and then the vibrating feeding mechanism 25 can be removed. After the vibrating feeding mechanism 25 is removed, the top plate 23 can be directly disassembled to achieve quick disassembly and assembly.

[0035] Furthermore, in this embodiment, the locking component 265 is a quick-release screw, which can be easily installed and removed, greatly reducing the time and cost of equipment maintenance and replacement.

[0036] Please refer to Figure 2 In this embodiment, the outer side of the straight track 21 is provided with an air inlet connector 27 connected to the air channel 201. The air inlet connector 27 is connected to the air supply equipment through a pipe. The air supply equipment provides high-pressure gas to the air inlet connector 27. The high-pressure gas is then introduced into the air channel 201 and blown into the conveying channel 202 through the inclined air hole 203, thereby pushing the semiconductor device 30 in the conveying channel 202.

[0037] When the vibratory plate 10 vibrates, it is prone to generating particles or debris. Therefore, please refer to... Figures 7 to 9In this embodiment, the inner bottom of the vibratory plate 10 is provided with a hollow groove 12. A guide seat 13 that arches upward is detachably connected to the hollow groove 12. A spirally rising base plate 14 is provided around the guide seat 13. A filter area is provided on the base plate 14. The filter area is provided with a plurality of filter holes 15. A dust collection box 16 is provided below the filter holes 15. The dust collection box 16 is located in the hollow groove 12. During vibration, particles or debris can fall into the dust collection box 16 through the filter holes 15 and be collected.

[0038] In addition, in this embodiment, the guide seat 13 is designed as a detachable structure. When it is necessary to clean the particles or debris in the dust collection box 16, the guide seat 13 can be removed and the dust collection box 16 can be taken out from the hollow groove 12 for cleaning.

[0039] The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are all included within the scope defined by the claims of the present invention.

Claims

1. A semiconductor device feeding device, comprising a vibratory feeder (10), the vibratory feeder (10) having a spiral feeding channel (11), the discharge end of the spiral feeding channel (11) being connected to a track conveying assembly (20), characterized in that, The track conveying assembly (20) includes a straight track (21), a partition (22) and a top plate (23). The straight track (21) is provided with a straight groove. The partition (22) is located in the straight groove and divides the straight groove into an air channel (201) located below and a conveying channel (202) located above. The conveying channel (202) is connected to the discharge end of the spiral material channel (11). The partition (22) is provided with a plurality of inclined air holes (203) that connect the air channel (201) and the conveying channel (202). The top plate (23) can move up and down above the conveying channel (202). The track conveying assembly (20) further includes a height holding mechanism (24), which includes a plurality of springs (241) connected between the top plate (23) and the straight track (21), and a pressure block (242) disposed above the top plate (23) and used to press down the top plate (23). The height of the pressure block (242) is adjustable. The track conveying assembly (20) also includes a vibrating unloading mechanism (25), which includes a side plate (251) detachably fixed to one side of the straight track (21) and a lifting drive device (252) fixed to the side plate (251). The pressure block (242) is connected to the output end of the lifting drive device (252). An air inlet connector (27) is provided on the outside of the straight track (21) and connected to the air passage (201).

2. The semiconductor device feeding device according to claim 1, characterized in that, The lifting drive device (252) is a cylinder, and both the lifting drive device (252) and the pressure block (242) have two.

3. The semiconductor device feeding device according to claim 1, characterized in that, The track conveying assembly (20) also includes a quick-release mechanism (26), which includes a pin (261) connected to the bottom of the side plate (251), a socket (262) provided on the side of the straight track (21) and engaged with the pin (261), a mounting base (263) fixed to one side of the straight track (21), a stop bar (264) whose lower end is rotatably connected to the mounting base (263), and a locking member (265) for locking the stop bar (264) and the mounting base (263). The upper end of the stop bar (264) can swing to one side of the side plate (251) to limit and fix the side plate (251).

4. A semiconductor device feeding device according to claim 3, characterized in that, The locking element (265) is a quick-release screw.

5. A semiconductor device feeding device according to claim 1, characterized in that, The inner bottom of the vibratory plate (10) is provided with a hollow groove (12). A guide seat (13) that arches upward is detachably connected to the hollow groove (12). A spirally rising base plate (14) is provided around the guide seat (13). A filter area is provided on the base plate (14). The filter area is provided with a number of filter holes (15). A dust collection box (16) is provided below the filter holes (15). The dust collection box (16) is located in the hollow groove (12).

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