Resistor substrate sputtering revolution and rotation device

Abstract

The invention belongs to the technical field of resistor substrates, and discloses a resistor substrate sputtering revolution and rotation device which comprises a sputtering box body, a sealing cover is arranged on the front face of the sputtering box body, a first motor is arranged at the top of the sputtering box body, an output shaft of the first motor is in transmission connection with an auxiliary frame body, and a reinforcing sleeve is arranged at the bottom of the auxiliary frame body. One end of the reinforcing sleeve is sleeved with a wrapping sleeve, a guide mechanism is arranged on one side of the sputtering box body, a collecting box is arranged on the other side of the sputtering box body, through cooperation of the wrapping sleeve, the rolling ball, the compression-resistant base, the circular groove, the reinforcing groove and the reinforcing column, argon is introduced into the sputtering box body through the guide mechanism, and when argon ions impact a target material, the target material is prevented from being damaged. And the rolling ball arranged at the bottom of the wrapping sleeve can assist rotation, reduce friction force, reduce energy loss during rotation, improve rotation stability, effectively reduce starting and running resistance of the device and improve revolution efficiency of the device.

Description

Technical Field

[0001] The invention belongs to the technical field of resistor substrates, and in particular relates to a resistor substrate sputtering orbital rotation device. Background Art

[0002] Sputtering is a type of physical vapor deposition. During the sputtering process, the gas is accelerated and impacts the target surface, causing the target atoms to be ejected from the target surface. These splashed atoms and molecules are then deposited onto the substrate surface to form a thin film. In order to ensure uniform deposition of the thin film, the substrate usually needs to be rotated during the sputtering process. The rotation device controls the rotational motion of the substrate to ensure that the sputtering source evenly covers the entire substrate surface, avoiding uneven film deposition and areas of uneven thickness.

[0003] However, the existing resistor substrate sputtering rotation device is not perfect and still has certain defects: Traditional devices are installed in an integrated manner with the substrate. During the sputtering process, the substrate may be damaged, contaminated, and its performance may degrade due to long-term use and improper operation. Scratches and contamination on the surface of the substrate require replacement of the entire equipment, increasing maintenance costs and downtime. Contaminated substrates will lead to a decline in sputtering quality. Summary of the invention

[0004] The object of the present invention is to provide a resistor substrate sputtering rotation device to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a resistor substrate sputtering rotation device, comprising a sputtering box, a sealed cover is provided on the front of the sputtering box, a first motor is provided on the top of the sputtering box, the output shaft of the first motor is transmission-connected with an auxiliary frame, a reinforcement sleeve is provided at the bottom of the auxiliary frame, a wrapping sleeve is provided at one end of the reinforcement sleeve, a guide mechanism is provided on one side of the sputtering box, a collecting box is provided on the other side of the sputtering box, a vacuum pump is provided on one side of the collecting box, a plurality of second motors are provided on the top of the auxiliary frame, the output shafts of the plurality of second motors are transmission-connected with auxiliary cylinders, the outer walls of the plurality of auxiliary cylinders are provided with a plurality of bonding plates, a substrate is provided on one side of the plurality of bonding plates, and a pressure-resistant seat is provided inside the sputtering box.

[0006] Preferably, a suction pipe is provided on the top of the collection box, one end of which is interlaced and connected with the other side of the sputtering box body, a reinforcement groove is opened in the middle of the top of the pressure-resistant seat, and a reinforcement column is provided at the bottom of the reinforcement sleeve.

[0007] Preferably, the bottom of the reinforcement column rotates inside the reinforcement groove, the wrapping sleeve is fixedly sleeved with one end of the reinforcement sleeve, and a plurality of vertical rods are arranged at the bottom of the wrapping sleeve.

[0008] Preferably, a circular groove is provided at the top of the anti-compression seat, and a rolling ball is fixedly mounted on one end of each of the plurality of vertical rods, and each of the plurality of rolling balls rotates inside the circular groove.

[0009] Preferably, a protective plate is disposed on one side of the plurality of laminating plates, two arc-shaped blocks are disposed on one side of the plurality of protective plates, and two first limiting holes are opened on one side of the plurality of base plates.

[0010] Preferably, a first limiting bolt is provided on one side of each of the arc blocks, two second limiting holes are opened on one side of each of the bonding plates, and one end of each of the first limiting bolts is respectively connected to the internal threads of each of the first limiting holes.

[0011] Preferably, a fixed plate is fixedly installed on the other side of the multiple arc blocks, a movable plate is movably hinged on one side of the multiple fixed plates, a second limiting bolt is arranged on one side of the multiple movable plates, and one end of the multiple second limiting bolts is respectively connected to the internal threads of the multiple second limiting holes.

[0012] Preferably, a wear-resistant seat is provided at the bottom of the sputtering box, and the plurality of substrates are movable on one side of the plurality of bonding plates respectively.

[0013] The beneficial effects of the present invention are as follows: 1. The present invention cooperates with the wrapping sleeve, vertical rod, rolling ball, anti-pressure seat, circular groove, reinforcement groove and reinforcement column, and argon gas is introduced into the interior of the sputtering box through the guide mechanism. When the argon ions hit the target material, the atoms on the surface of the target material are excited and fly out to form sputtering particles, which can be guided to the surface of the substrate, gradually deposited and form a thin film. When the first motor is started, the auxiliary frame and the reinforcement sleeve are driven to rotate synchronously, and multiple substrates can be driven to rotate in a circle. Multiple rolling balls can make circular motion inside the circular groove, and the reinforcement column rotates inside the reinforcement groove. The rolling balls arranged at the bottom of the wrapping sleeve can assist the rotation, reduce friction, reduce energy loss during rotation, improve rotation stability, and effectively reduce the starting and running resistance of the device, thereby improving the revolution efficiency of the device.

[0014] 2. The present invention cooperates with the arc block, the first limiting bolt, the first limiting hole, the movable plate, the second limiting bolt, the second limiting hole and the protective plate. When the first motor is started, the bonding plate and the substrate are driven to revolve. When the second motor is started, the bonding plate is driven to rotate. The two first limiting bolts are rotated in reverse in turn to be pulled out from the inside of the first limiting hole. Then, the two second limiting bolts are rotated in reverse to pull one end of the second limiting bolt out from the inside of the second limiting hole. The bonding plate and the substrate can be separated, and the damaged substrate can be replaced later. The replacement of the substrate is to adjust the deposition process of the thin film and test different materials.

[0015] 3. The present invention cooperates with the collection box, vacuum pump, suction pipe, wear-resistant seat, second motor, auxiliary cylinder and first motor. After the second motor is started, it drives the auxiliary cylinder connected to its output shaft to rotate, and the bonding plate connected to it can rotate in a circle, thereby realizing the orbital rotation of the substrate. After starting the vacuum pump, the suction pipe can pump the internal gas of the sputtering box to the inside of the collection box, and reduce the air pressure in the sputtering chamber to a vacuum level. Through the set gas control system, argon gas is introduced into the sputtering chamber by a guiding mechanism, and is ionized and accelerated through an ion source to form argon ions. The argon ions are guided to collide with the surface of the target material, which will cause the atoms on the surface of the target material to be excited and fly out to form sputtering particles. These sputtered particles are guided to the substrate, gradually deposited and form a thin film, and rotate to prevent the problem of uneven film thickness caused by the asymmetric geometric position between the target material and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front view structural schematic diagram of the present invention; Figure 2 It is a side view structural schematic diagram of the present invention; Figure 3 It is a partial front view structural schematic diagram of the present invention; Figure 4 For the present invention Figure 3 The enlarged view of point A in the middle; Figure 5 It is a partial side view structural schematic diagram of the present invention; Figure 6 It is a partial exploded view of the present invention.

[0017] In the figure: 1. sputtering box; 2. airtight cover; 3. guide mechanism; 4. collecting box; 5. vacuum pump; 6. suction pipe; 7. auxiliary frame; 8. first motor; 9. second motor; 10. auxiliary cylinder; 11. bonding plate; 12. protective plate; 13. arc block; 14. first limiting bolt; 15. base plate; 16. first limiting hole; 17. fixed plate; 18. movable plate; 19. second limiting bolt; 20. second limiting hole; 21. reinforcement sleeve; 22. wrapping sleeve; 23. vertical rod; 24. rolling ball; 25. reinforcement column; 26. pressure-resistant seat; 27. circular groove; 28. reinforcement groove; 29. ​​wear-resistant seat. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] like Figures 1 to 6 As shown, the embodiment of the present invention provides a technical solution for a resistor substrate sputtering rotation device: Embodiment 1

[0020] like Figure 1-2 As shown, a resistor substrate sputtering rotation device comprises a sputtering box 1, a sealed cover 2 is arranged on the front of the sputtering box 1, a first motor 8 is arranged on the top of the sputtering box 1, the output shaft of the first motor 8 is drivingly connected to an auxiliary frame 7, a reinforcement sleeve 21 is arranged at the bottom of the auxiliary frame 7, a wrapping sleeve 22 is sleeved on one end of the reinforcement sleeve 21, a guide mechanism 3 is arranged on one side of the sputtering box 1, a collecting box 4 is arranged on the other side of the sputtering box 1, a vacuum pump 5 is arranged on one side of the collecting box 4, a plurality of second motors 9 are arranged on the top of the auxiliary frame 7, the output shafts of the plurality of second motors 9 are all drivingly connected to an auxiliary cylinder 10, and the outer walls of the plurality of auxiliary cylinders 10 are all provided with a plurality of bonding plates 11, A substrate 15 is provided on one side of the multiple bonding plates 11, and a pressure-resistant seat 26 is provided inside the sputtering box 1. The bottom of the reinforcement column 25 rotates inside the reinforcement groove 28. The wrapping sleeve 22 is fixedly mounted on one end of the reinforcement sleeve 21, and a plurality of vertical rods 23 are provided at the bottom of the wrapping sleeve 22. When the first motor 8 is started, it drives the auxiliary frame 7 and the reinforcement sleeve 21 to rotate synchronously, and can also drive the multiple substrates 15 to rotate in a circle. The multiple balls 24 can make circular motion inside the circular groove 27, and the reinforcement column 25 rotates inside the reinforcement groove 28. The balls 24 arranged at the bottom of the wrapping sleeve 22 can assist the rotation, reduce friction, reduce energy loss during rotation, and improve rotation stability. Embodiment 2

[0021] Based on the first embodiment, Figure 2-4 As shown, a circular groove 27 is provided at the top of the pressure-resistant seat 26, and a plurality of vertical rods 23 are fixedly installed with a ball 24 at one end, and the plurality of balls 24 rotate inside the circular groove 27. A protective plate 12 is provided on one side of the plurality of bonding plates 11, and two arc blocks 13 are provided on one side of the plurality of protective plates 12. Two first limiting holes 16 are provided on one side of the plurality of base plates 15. When the first motor 8 is started, the bonding plate 11 and the base plate 15 are driven to revolve. When the second motor 9 is started, the bonding plate 11 is driven to rotate, and the two first limiting bolts 14 are rotated in reverse in turn to be pulled out from the inside of the first limiting hole 16, and then the two second limiting bolts 19 are rotated in reverse to pull one end of the second limiting bolt 19 out from the inside of the second limiting hole 20. Embodiment 3

[0022] On the basis of the first and second embodiments, Figure 1 , Figure 5 and Figure 6 As shown, one side of the multiple arc blocks 13 is provided with a first limiting bolt 14, one side of the multiple bonding plates 11 is provided with two second limiting holes 20, one end of the multiple first limiting bolts 14 is respectively connected with the internal threads of the multiple first limiting holes 16, and the other side of the multiple arc blocks 13 is fixedly installed with a fixed plate 17, one side of the multiple fixed plates 17 is movably hinged with a movable plate 18, one side of the multiple movable plates 18 is provided with a second limiting bolt 19, one end of the multiple second limiting bolts 19 is respectively connected with the internal threads of the multiple second limiting holes 20, after starting the vacuum pump 5, the suction pipe 6 can pump the internal gas of the sputtering box 1 into the interior of the collecting box 4, and reduce the gas pressure in the sputtering chamber to the vacuum level. Through the set gas control system, argon gas is introduced into the sputtering chamber by the guide mechanism 3, and the argon gas is ionized and accelerated through the ion source to form argon ions. The argon ions are guided to collide with the surface of the target material, which will cause the atoms on the surface of the target material to be excited and fly out to form sputtering particles.

[0023] Working principle and use process of the present invention: Sputtering is a kind of physical vapor deposition. During the sputtering process, the gas is accelerated and hits the surface of the target material, causing the target material atoms to be ejected from the target material surface. These sputtered atoms and molecules are then deposited on the substrate surface to form a thin film. In order to ensure uniform deposition of the thin film, it is usually necessary to rotate the substrate during the sputtering process. The rotation device controls the rotational motion of the substrate to ensure that the sputtering source evenly covers the entire substrate surface, avoiding uneven film deposition and areas of uneven thickness. The traditional device and the substrate are installed in an integrated manner. During the sputtering process, the substrate will be damaged, contaminated, and its performance will degrade due to long-term use and improper operation. Scratches and contamination appear on the surface of the substrate and the entire substrate needs to be replaced. The equipment increases maintenance costs and downtime. Contaminated substrates will lead to a decrease in sputtering quality. Argon gas is introduced into the interior of the sputtering box 1 through the guide mechanism 3. When argon ions hit the target material, the atoms on the surface of the target material are excited and fly out to form sputtering particles, which can be guided to the surface of the substrate 15, gradually deposited and form a thin film. When the first motor 8 is started, the auxiliary frame 7 and the reinforcement sleeve 21 are driven to rotate synchronously, which can also drive multiple substrates 15 to rotate in a circle. Multiple balls 24 can make circular motions inside the circular groove 27, and the reinforcement column 25 rotates inside the reinforcement groove 28. The balls 24 arranged at the bottom of the wrapping sleeve 22 can assist the rotation, reduce friction, reduce energy loss during rotation, and improve rotation stability. And effectively reduce the starting and running resistance of the device, improve the revolution efficiency of the device, the start of the first motor 8 drives the bonding plate 11 and the substrate 15 to revolve, and when the second motor 9 is started, it will drive the bonding plate 11 to rotate, and the two first limiting bolts 14 are rotated in reverse order to pull them out from the inside of the first limiting hole 16, and then the two second limiting bolts 19 are rotated in reverse to pull one end of the second limiting bolt 19 out from the inside of the second limiting hole 20, so that the bonding plate 11 and the substrate 15 can be separated, and then the damaged substrate 15 can be replaced later. The replacement of the substrate 15 is to adjust the deposition process of the thin film and test different materials. After the second motor 9 is started, it drives the auxiliary The auxiliary cylinder 10 rotates, and the bonding plate 11 connected thereto can rotate in a circle, thereby realizing the orbital and self-rotation of the substrate 15. After starting the vacuum pump 5, the suction pipe 6 can pump the internal gas of the sputtering box 1 into the interior of the collecting box 4, and reduce the gas pressure in the sputtering chamber to a vacuum level. Through the set gas control system, the argon gas is introduced into the sputtering chamber by the guiding mechanism 3. Through the ion source, the argon gas is ionized and accelerated to form argon ions. The argon ions are guided to collide with the surface of the target material, which will cause the atoms on the surface of the target material to be excited and fly out to form sputtering particles. These sputtered particles are guided onto the substrate 15, gradually deposited and form a thin film, and the rotation prevents the problem of uneven film thickness caused by the asymmetric geometric position between the target material and the substrate 15.

[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A resistor substrate sputtering rotation device, comprising a sputtering box (1), characterized in that: The front of the sputtering box (1) is provided with a sealed cover (2), the top of the sputtering box (1) is provided with a first motor (8), the output shaft of the first motor (8) is connected to the auxiliary frame (7), the bottom of the auxiliary frame (7) is provided with a reinforcement sleeve (21), one end of the reinforcement sleeve (21) is provided with a wrapping sleeve (22), one side of the sputtering box (1) is provided with a guide mechanism (3), the other side of the sputtering box (1) is provided with a collection box (4), one side of the collection box (4) is provided with a vacuum pump (5), the top of the auxiliary frame (7) is provided with a plurality of second motors (9), the output shafts of the plurality of second motors (9) are connected to the auxiliary cylinder (10), the outer walls of the plurality of auxiliary cylinders (10) are provided with a plurality of bonding plates (11), one side of the plurality of bonding plates (11) is provided with a base plate (15), and the interior of the sputtering box (1) is provided with a pressure-resistant seat (26).

2. The resistor substrate sputtering rotation device according to claim 1, characterized in that: A suction pipe (6) is provided at the top of the collection box (4), one end of the suction pipe (6) is connected to the other side of the sputtering box (1) through insertion, a reinforcement groove (28) is provided in the middle of the top of the pressure-resistant seat (26), and a reinforcement column (25) is provided at the bottom of the reinforcement sleeve (21).

3. The resistor substrate sputtering rotation device according to claim 2, characterized in that: The bottom of the reinforcement column (25) rotates inside the reinforcement groove (28), the wrapping sleeve (22) is fixedly sleeved with one end of the reinforcement sleeve (21), and a plurality of vertical rods (23) are arranged at the bottom of the wrapping sleeve (22).

4. The resistor substrate sputtering rotation device according to claim 3, characterized in that: A circular groove (27) is formed at the top of the compression-resistant seat (26), and a rolling ball (24) is fixedly mounted on one end of each of the plurality of vertical rods (23), and each of the plurality of rolling balls (24) rotates inside the circular groove (27).

5. The resistor substrate sputtering rotation device according to claim 1, characterized in that: A protective plate (12) is provided on one side of the plurality of laminating plates (11), two arc-shaped blocks (13) are provided on one side of the plurality of protective plates (12), and two first limiting holes (16) are provided on one side of the plurality of base plates (15).

6. The resistor substrate sputtering rotation device according to claim 5, characterized in that: A first limiting bolt (14) is provided on one side of each of the plurality of arc-shaped blocks (13), two second limiting holes (20) are provided on one side of each of the plurality of bonding plates (11), and one end of each of the plurality of first limiting bolts (14) is respectively connected to the internal threads of the plurality of first limiting holes (16).

7. The resistor substrate sputtering rotation device according to claim 6, characterized in that: A fixed plate (17) is fixedly mounted on the other side of the plurality of arc-shaped blocks (13), a movable plate (18) is movably hinged on one side of the plurality of fixed plates (17), a second limiting bolt (19) is arranged on one side of the plurality of movable plates (18), and one end of the plurality of second limiting bolts (19) is respectively connected to the internal threads of the plurality of second limiting holes (20).

8. The resistor substrate sputtering rotation device according to claim 1, characterized in that: A wear-resistant seat (29) is provided at the bottom of the sputtering box (1), and the plurality of substrates (15) are movable on one side of the plurality of laminating plates (11) respectively.

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