Wafer test box

Abstract

The invention discloses a wafer test box. The wafer test box comprises a first shell, a second shell and a magnetic force blocking assembly. The first shell is provided with a first magnetic piece. The second shell is provided with a second magnetic piece, and the second magnetic piece corresponds to the first magnetic piece. When the first shell and the second shell are in corresponding contact, an accommodating space is formed between the first shell and the second shell. The magnetic force blocking assembly is configured to be connected with the first shell or the second shell and used for reducing or relieving magnetic attraction force generated between the first magnetic piece and the second magnetic piece. Before the first shell is in contact with the second shell, the magnetic force blocking assembly is used for reducing or removing the magnetic attraction force. And when the first shell and the second shell are in corresponding contact, the influence of the magnetic force blocking assembly is relieved, so that the first shell and the second shell are tightly combined through magnetic attraction force. The first shell and the second shell are tightly combined through magnetic attraction force. The magnetic attraction force is reduced through the magnetic force blocking assembly, so that the first shell and the second shell can be separated.

Description

Technical Field

[0001] The invention relates to a wafer testing box, in particular to a wafer testing box with a magnetic fixing structure. Background Art

[0002] When the wafer completes the design of the integrated circuit, the wafer needs to undergo a burn-in test and an electrical test. Traditionally, the wafer burn-in and reliability test is performed by testing each wafer separately through a test machine and a probe card. Each wafer is placed on a carrier and electrically contacted with the probe of the probe card to complete the test. Therefore, when the number of wafers is large, more test machines and probe cards are required, and the test process generates greater time and equipment costs.

[0003] In the prior art, in order to improve the efficiency of the burn-in test, a composite test unit system has been developed, which can perform burn-in tests on multiple wafers at the same time. The aforementioned system has multiple test unit arrays in one test device, each wafer is respectively configured in each test unit array, and each test unit has at least one chuck to fix the wafer, and the wafer is connected to the tester for burn-in test or electrical test.

[0004] On the other hand, a wafer test box has been developed recently, which pre-positions the probe card and wafer and places them in the wafer test box. The wafer test box is directly and electrically connected to the test machine, and the wafer test box is placed in the test unit for pre-burn-in test or electrical test. The upper and lower shells of the existing wafer test box are combined in a snap-on or vacuum manner. The snap-on type has limited effect on the combination and fixation of the upper and lower shells, and there are problems of uneven force and deformation. The vacuum type is prone to vacuum failure when the wafer test box is subjected to external force, and may also encounter aging of the seals and reduce the vacuum effect.

[0005] Therefore, how to improve the use effect of the wafer test box through the improvement of the structural design to overcome the above-mentioned defects has become one of the important issues that the industry wants to solve. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a wafer testing box in view of the shortcomings of the prior art, characterized in that it includes: a first shell having at least one first magnetic component; a second shell having at least one second magnetic component, the second magnetic component being arranged corresponding to the first magnetic component, wherein when the first shell is in corresponding contact with the second shell, an accommodating space is formed between the first shell and the second shell; and a magnetic barrier component, which is configured to be connected to the first shell or the second shell, and is used to reduce or release the magnetic attraction generated between the first magnetic component and the second magnetic component; wherein before the first shell is in contact with the second shell, the magnetic barrier component is used to reduce or release the magnetic attraction; wherein when the first shell is in corresponding contact with the second shell, the influence of the magnetic barrier component is released so that the first shell and the second shell are tightly combined by the magnetic attraction; wherein the first shell and the second shell, which are tightly combined by the magnetic attraction, use the magnetic barrier component to reduce the magnetic attraction so that the first shell and the second shell can be separated.

[0007] Preferably, the first magnetic component is a permanent magnet, the second magnetic component is a permanent magnet or a non-magnetic magnetic conductive object, the magnetic barrier component is movably disposed in the first shell or the second shell and is located between the first magnetic component and the second magnetic component, and when the magnetic barrier component moves to a position shielding the first magnetic component or the second magnetic component, the magnetic attraction force generated between the first magnetic component and the second magnetic component is reduced.

[0008] Preferably, the first magnetic component is a non-permanent magnet (electromagnet), the second magnetic component is a paramagnetic object, the magnetic barrier component controls whether the magnetic force of the first magnetic component is generated or not, the magnetic barrier component is connected to the first magnetic component, and the magnetic barrier component is a switch or a microprocessor.

[0009] Preferably, the first shell includes at least one first positioning structure, the second shell includes at least one second positioning structure, and the first positioning structure and the second positioning structure are correspondingly arranged to make the first shell contact with the second shell correspondingly.

[0010] Preferably, the wafer testing box further comprises a probe card and a wafer, and the probe card and the wafer are arranged in the accommodating space.

[0011] One of the beneficial effects of the present invention is that the wafer testing box provided by the present invention can strengthen the structure of the wafer testing box, strengthen the ability of the first shell and the second shell to be combined and fixed, and strengthen the alignment accuracy during combination through technical solutions such as "the wafer testing box includes a first shell and a second shell", "the first shell has a first magnetic component", "the second shell has a second magnetic component", "when the first magnetic component of the first shell and the second magnetic component of the second shell are relatively close, a magnetic attraction force is generated between the first magnetic component and the second magnetic component to combine and fix the first shell and the second shell" and "the magnetic barrier is used to reduce or cut off the magnetic attraction force generated between the first magnetic component and the second magnetic component, so that the first shell and the second shell can be separated".

[0012] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 FIG. 1 is a first schematic diagram of a wafer testing box according to a first embodiment of the present invention.

[0014] Figure 2 FIG. 2 is a second schematic diagram of the wafer testing box according to the first embodiment of the present invention.

[0015] Figure 3 FIG. 4 is a three-dimensional diagram of a wafer testing box according to a first embodiment of the present invention.

[0016] Figure 4 It is a schematic diagram of the appearance of the first shell and the second shell of the first embodiment of the present invention.

[0017] Figure 5 FIG. 4 is a schematic diagram of a wafer testing box according to a second embodiment of the present invention.

[0018] Figure 6 FIG. 4 is a schematic diagram of a wafer testing box according to a third embodiment of the present invention.

[0019] Fig. 7A FIG. 4 is a first schematic diagram of a wafer testing box according to a fourth embodiment of the present invention.

[0020] Figure 7B FIG. 4 is a second schematic diagram of a wafer testing box according to a fourth embodiment of the present invention.

[0021] Figure 7C FIG. 4 is a third schematic diagram of a wafer testing box according to a fourth embodiment of the present invention.

[0022] Fig. 8A FIG. 1 is a first schematic diagram of a wafer testing box according to a fifth embodiment of the present invention.

[0023] Figure 8B FIG. 4 is a second schematic diagram of a wafer testing box according to a fifth embodiment of the present invention.

[0024] Figure 8C FIG. 4 is a third schematic diagram of a wafer testing box according to a fifth embodiment of the present invention.

[0025] Fig. 9 FIG. 4 is a schematic diagram of a wafer testing box according to a sixth embodiment of the present invention. DETAILED DESCRIPTION

[0026] The following is an explanation of the implementation of the "wafer test box" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted in actual size. It is stated in advance. The following embodiments will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0027] See also Figure 1 , Figure 2 , Figure 3 as well as Figure 4 , Figure 1 FIG. 1 is a first schematic diagram of a wafer testing box according to a first embodiment of the present invention. Figure 2 1 is a second schematic diagram of the wafer test box according to the first embodiment of the present invention. Figure 3 It is a perspective view of the first embodiment of the present invention. Figure 4 It is a schematic diagram of the appearance of the first shell and the second shell of the first embodiment of the present invention.

[0028] The wafer testing box 1A includes a first housing 11 and a second housing 12. The first housing 11 has a first magnetic member 111, and the second housing 12 has a second magnetic member 121. Figure 1 as well as Figure 2 , the wafer test box 1A of this embodiment is shown from a side view.

[0029] In the present embodiment, the shape of the wafer testing box 1A may be square, circular or other shapes, which may be adjusted according to actual needs and is not limited in the present invention.

[0030] like Figure 1 as well as Figure 2As shown, the wafer test box 1A includes at least one set of corresponding first magnetic components 111 and second magnetic components 121, the first magnetic components 111 are arranged around the first shell 11, and the second magnetic components 121 are also arranged around the second shell 12. Each set of corresponding first magnetic components 111 and second magnetic components 121 are arranged correspondingly. That is, the position where the first magnetic component 111 is arranged on the first shell 11 corresponds to the position where the second magnetic component 121 is arranged on the second shell 12.

[0031] When the first shell 11 and the second shell 12 of the wafer test box 1A are combined, a servo motor or a stepper motor can be used as a driving device for the first shell 11 and the second shell 12. The servo motor or the stepper motor can provide a more precise driving force, and provide a smooth combination process when the first shell 11 and the second shell 12 approach each other.

[0032] When the first shell 11 and the second shell 12 are arranged close to each other, the first magnetic component 111 and the second magnetic component 121 will attract each other to generate magnetic attraction. However, too strong a magnetic attraction may cause the contact force between the upper and lower shells to be too large, thereby causing damage to the probe or the wafer. Therefore, the wafer test box of the present invention also includes a magnetic barrier component for reducing or releasing the magnetic attraction between the first magnetic component 111 and the second magnetic component 121. The magnetic barrier component is configured to be connected to the first shell 11 or the second shell 12, and is used to reduce the magnetic attraction between the first magnetic component 111 and the second magnetic component 121 before the upper and second shells 12 contact, or to eliminate the magnetic attraction between the first magnetic component 111 and the second magnetic component 121.

[0033] In this embodiment, the first magnetic component 111 and the second magnetic component 121 are paramagnetic objects, such as permanent magnets, non-permanent magnets, or non-magnetic magnetic conductive objects.

[0034] When the first magnetic component 111 and the second magnetic component 121 are both permanent magnets, or when one of the first magnetic component 111 and the second magnetic component 121 is a permanent magnet and the other is a non-permanent magnet, in order to make the first magnetic component 111 and the second magnetic component 121 generate magnetic attraction, the two ends of the first magnetic component 111 and the second magnetic component 121 facing each other have different polarities.

[0035] According to some embodiments, one of the first magnetic member 111 and the second magnetic member 121 is a non-permanent magnet, such as an electromagnet, and the other is a paramagnetic object, such as a magnetic conductive object such as iron, cobalt or nickel. According to some embodiments, the paramagnetic object is a permanent magnet or an electromagnet.

[0036] exist Figure 1 as well as Figure 2In the embodiment, the first magnetic member 111 and the second magnetic member 121 are respectively arranged in the first shell 11 and the second shell 12. According to some embodiments, the first shell 11 includes at least one first positioning structure, and the second shell 12 includes at least one second positioning structure, for example, the first positioning structure can be a first convex structure 11F extending downwardly around the first shell 11. Similarly, the second positioning structure can be a second convex structure 12F extending upwardly around the second shell 12. In this embodiment, the first magnetic member 111 is arranged in the first convex structure 11F. The second magnetic member 121 is arranged in the second convex structure 12F. However, the present application is not limited to this. The first convex structure 11F and the second convex structure 12F are arranged correspondingly. When the first shell 11 and the second shell 12 are tightly combined through the first magnetic member 111 and the second magnetic member 121, the first convex structure 11F will be tightly combined with the second convex structure 12F. According to some embodiments, the first magnetic member 111 and the second magnetic member 121 can be one or more, and are arranged correspondingly to each other. In other words, the first magnetic member 111 and the second magnetic member 121 can be disposed at any position of the first shell 11 and the second shell respectively, and the positions of the two correspond to each other. Figure 3 In the embodiment shown, there are multiple first magnetic members 111 and multiple second magnetic members 121. Figure 1 and Figure 2 As shown, the first shell 11 and the second shell 12 of the wafer test box 1A can be combined and fixed by the magnetic attraction generated by the first magnetic component 111 and the second magnetic component 121. In this embodiment, when the first magnetic component 111 and the second magnetic component 121 are set, a magnetic force of mutual attraction is generated (such as the faces of the first magnetic component 111 and the second magnetic component 121 facing each other, and their polarities are opposite). In other words, the present application does not limit the first magnetic component 111 and the second magnetic component 121 to face each other. If the two can generate magnetic attraction to combine and fix the first shell 11 and the second shell 12, they are all within the scope of protection of the present application. In addition, when the first shell 11 and the second shell 12 are in corresponding contact, an accommodating space S is formed between the first shell 11 and the second shell 12.

[0037] in accordance with Figure 1 and Figure 2 In the embodiment shown, the first magnetic member 111 and the second magnetic member 121 are located around the first shell 11 and the second shell 12 (i.e., on both sides of the accommodating space S). However, according to some embodiments, other groups of the first magnetic member 111 and the second magnetic member 121 may be disposed at other positions of the wafer test box 1A (e.g., located above or below the accommodating space S). The user may adjust the size of the magnetic attraction between the first magnetic member 111 and the second magnetic member 121, or the distribution position, according to the requirements (e.g., the sealing between the first shell 11 and the second shell 12), and the present application is not limited thereto.

[0038] According to some embodiments, in order to align the first shell 11 with the second shell 12, a snap-fit ​​structure (such as a male / female snap-fit ​​structure) is provided between the first shell 11 and the second shell 12. Figure 1 and Figure 2 As shown, in this embodiment, the first convex structure 11F of the first shell 11 has a snap-fit ​​structure 11FP, and the second convex structure 12F of the second shell 12 has another corresponding snap-fit ​​structure 12FP. The snap-fit ​​structure 11FP may be arranged corresponding to the first magnetic component 111, or may not be arranged corresponding to the first magnetic component 111. Similarly, the snap-fit ​​structure 12FP may be arranged corresponding to the second magnetic component 121, or may not be arranged corresponding to the second magnetic component 121. However, the present application does not limit the snap-fit ​​structure to be arranged on the first convex structure 11F of the first shell 11 and the second convex structure 12F of the second shell 12. According to some embodiments, the snap-fit ​​structure 11FP and the snap-fit ​​structure 12FP are respectively located on the lower surface of the first shell 11 and the upper surface of the second shell 12, such as Figure 4 In other words, according to Figure 4 In the illustrated embodiment, the first engaging structure 11FP and the second engaging structure 12FP are disposed in the accommodating space S.

[0039] According to some embodiments, the first shell 11 and the second shell 12 have a snap-fit ​​structure (for example, the aforementioned snap-fit ​​structure 11FP and the corresponding snap-fit ​​structure 12FP). When the first shell 11 and the second shell 12 are aligned and positioned, the first shell 11 and the second shell 12 are combined and fixed through the magnetic attraction between the first magnetic component 111 and the second magnetic component 121, thereby achieving the effect of locking the first shell 11 and the second shell 12 with each other.

[0040] like Figures 1 to 4 As shown, the magnetic barrier component in the application of the permanent magnet is a magnetic shielding member 15A, which shields the second magnetic member 121 by lateral movement to block the magnetic attraction between the first magnetic member 111 and the second magnetic member 121. However, according to some embodiments, the magnetic barrier component in the application of the electromagnet can be a switch or a microprocessor. In other embodiments, the magnetic barrier component can also be a magnetic force generating component (such as an electromagnet). Figure 1In the illustrated embodiment, a probe card 112 is further disposed in the first shell 11. The probe card 112 includes one or more probes 1121. When the first shell 11 and the second shell 12 are combined, one or more probes 1121 will protrude toward the second shell 12. Further, in this embodiment, a wafer 13 is also disposed in the wafer test box 1A, and the second shell 12 carries the wafer 13. When the first shell 11 and the second shell 12 are combined, one or more probes 1121 will protrude toward the second shell to abut against the wafer 13, so that the probes 1121 are in electrical contact with the pads (test contact points) of the wafer 13. In other words, the probe card 112 and the wafer 13 are both disposed in the accommodating space S. According to some embodiments, the wafer 13 is electrically connected to the second shell 12.

[0041] In this embodiment, the first housing 11 includes some mechanical parts to fix the probe card 112, such as a first fixing member 112F. The first fixing member 112F is disposed on one side of the first housing, facing the probe card 112, and is used to clamp and fix the probe card 112. In this embodiment, the first fixing member 112F is disposed on the outside of the probe card 112. The first fixing member 112F can also be designed in the joint area between the probe card 112 and the first housing 11 to tightly fit with the probe card 112.

[0042] The second housing 12 also includes some mechanical components to fix the wafer 13, such as a second fixing member 13F. In this embodiment, the second fixing member 13F is used to fix the outer edge of the wafer 13. The first fixing member 112F and the second fixing member 13F of this embodiment can be achieved by using other fixing structures, which is not limited in the present invention.

[0043] That is, before the upper second housing 12 is assembled, the probe card 112 and the wafer 13 have been aligned, so that at least one probe 1121 of the probe card 112 can abut against pads of the wafer 13 during the assembly.

[0044] See also Figure 5 , Figure 5 The wafer test box 1B includes a seal 16, which is located between the first shell 11 and the second shell 12. In one embodiment, the seal 16 is an O-ring. The seal 16 is used to strengthen the airtightness after the first shell 11 and the second shell 12 are combined. According to some embodiments, the seal 16 can be set on the first convex structure 11F or the second convex structure 12F, and the user can adjust it according to actual needs. The present application does not limit the setting position of the seal 16. If the seal 16 is set between the first convex structure 11F and the second convex structure 12F, when the first shell 11 and the second shell 12 are combined by the magnetic attraction of the first magnetic part 111 and the second magnetic part 121, the first shell 11 and the second shell 12 are in a tightly combined state.

[0045] See also Figure 6 , the two sides of the second shell 12 include two second magnetic parts 121, and the two sides of the first shell 11 include two first magnetic parts 111, which are aligned with the corresponding magnetic parts. Furthermore, the polarity settings and magnetic attraction between the two first magnetic parts 111 and the second magnetic parts 121 can be different. In this embodiment, the magnetic attraction between the first magnetic part 111 and the second magnetic part 121 near the inner edge of the wafer test box is stronger than the magnetic attraction between the first magnetic part 111 and the second magnetic part 121 near the outer edge of the wafer test box. Moreover, the first magnetic part 111 near the inner edge of the wafer test box is N-pole upward and S-pole downward, and the corresponding second magnetic part 121 is also the same setting: N-pole upward and S-pole downward. Furthermore, the first magnetic part 111 near the outer edge of the wafer test box can be N-pole downward and S-pole upward, and the corresponding second magnetic part 121 is oppositely set: S-pole downward and N-pole upward. At this time, in the absence of interference from the magnetic barrier component 15A, the first shell and the second shell will be tightly combined due to the magnetic attraction between the first magnetic component 111 and the second magnetic component 121 near the inner edge of the wafer test box. When the magnetic attraction between the first magnetic component 111 and the second magnetic component 121 near the inner edge of the wafer test box is shielded by the magnetic barrier component 15A, the magnetic mutual repulsion between the first magnetic component 111 and the second magnetic component 121 near the outer edge of the wafer test box is similar to the magnetic attraction between the first magnetic component 111 and the second magnetic component 121 near the outer edge of the wafer test box, then the magnetic attraction near the inner edge of the wafer test box and the mutual repulsion near the outer edge of the wafer test box will be offset, so as to separate the upper second shell 12.

[0046] See also FIG. 7A to FIG. 7C , Fig. 7A FIG. 4 is a first schematic diagram of a wafer testing box according to a fourth embodiment of the present invention. Figure 7B FIG. 4 is a second schematic diagram of a wafer testing box according to a fourth embodiment of the present invention. Figure 7C Schematic diagram of the wafer test box according to the fourth embodiment of the present invention

[0047] In this embodiment, the structure and function of the wafer test box 1D are similar to those of the wafer test box 1A of the first embodiment. The first magnetic component 111C of the wafer test box 1D of this embodiment is a permanent magnet, and the second magnetic component 121C is a paramagnetic object, such as the aforementioned magnetic conductive objects such as iron, cobalt or nickel; the paramagnetic object can also be a permanent magnet.

[0048] First, when the first shell 11 and the second shell 12 of the wafer test box 1D gradually approach each other, their respective driving devices, such as but not limited to servo motors or stepper motors, can make the first shell 11 and the second shell 12 finally contact and be tightly combined by magnetic force.

[0049] When the wafer 13 has completed the test procedure or the burn-in procedure of the probe card 112 , the first shell 11 and the second shell 12 can be separated from each other by gradually increasing power through respective driving devices, such as but not limited to a servo motor or a stepper motor.

[0050] Further explanation, such as Fig. 7A As shown, the magnetic barrier component of the wafer test box 1D is a magnetic shielding member 15A, which can be set on one side of the first magnetic member 111C or the second magnetic member 121C. In this embodiment, the magnetic shielding member 15A is located on one side of the second magnetic member 121C. The magnetic shielding member 15A can shield the second magnetic member 121C in a movable manner, so that the magnetic attraction between the first magnetic member 111C and the second magnetic member 121C can be reduced or cut off. When the first shell 11 and the second shell 12 are close to each other, the magnetic shielding member 15A shields the second magnetic member 121C, so that the first shell 11 and the second shell 12 can be close to each other in a labor-saving manner and then contact (join), thereby avoiding the aforementioned excessive magnetic attraction from causing damage to the wafer or probe card in the wafer test box 1D.

[0051] like Figure 7B As shown, when the first shell 11 contacts the second shell 12, the magnetic shielding member 15A moves away from the second magnetic member 121C (moves along the direction D1), and the magnetic attraction force generated between the first magnetic member 111C and the second magnetic member 121C makes the first shell 11 and the second shell 12 tightly combined.

[0052] like Figure 7C As shown, when the wafer test box 1D completes the test, the magnetic shielding member 15A shields the second magnetic member 121C by moving, eliminating or reducing the aforementioned magnetic attraction. At this time, the bonding ability between the first shell 11 and the second shell 12 is weaker, so that the first shell 11 and the second shell 12 can be separated in a more labor-saving manner.

[0053] See also Fig. 8A , Figure 8B as well as Figure 8C , Fig. 8A FIG. 1 is a first schematic diagram of a wafer testing box according to a fifth embodiment of the present invention. Figure 8B FIG. 4 is a second schematic diagram of a wafer testing box according to a fifth embodiment of the present invention. Figure 8C FIG. 5 is a fifth schematic diagram of a wafer testing box according to the third embodiment of the present invention.

[0054] In this embodiment, the structure and function of the wafer test box 1E are similar to those of the wafer test boxes 1A to 1C of the first embodiment. The first magnetic component 111E of the wafer test box 1E of this embodiment is a permanent magnet, the second magnetic component 121E is a non-permanent magnet (electromagnet), and the magnetic blocking component is a current switch 15B connected to a power source P.

[0055] like Fig. 8A As shown, the current switch 15B is in the on mode, and no magnetic attraction is generated between the first magnetic member 111E and the second magnetic member 121E. At this time, the first shell 11 and the second shell 12 are close to and in contact with each other. Figure 8B As shown, when the first shell 11 and the second shell 12 are in contact (engaged) with each other, the current switch 15B is in the closed mode, and a magnetic attraction is generated between the first magnetic member 111E and the second magnetic member 121E, so that the first shell 11 and the second shell 12 are tightly combined, and the first shell 11 and the second shell 12 are locked to each other. Figure 8C As shown, after the wafer 13 completes the test procedure, the current switch 15 is turned on again to eliminate the magnetic attraction between the first magnetic component 111E and the second magnetic component 121E. In this way, the first shell 11 and the second shell 12 can be separated from each other in a relatively labor-saving manner.

[0056] According to some embodiments, the first magnetic member 111E is a non-permanent magnet (electromagnet), and the second magnetic member 121E is a non-permanent magnet (electromagnet). The first magnetic member 111E and the second magnetic member 121E are respectively connected to a magnetic barrier component, and the magnetic barrier component is a current switch 15B. In other words, there are multiple current switches 15B, which are respectively electrically connected to the first magnetic member 111E and the second magnetic member 121E. Please refer to FIG. 8A to FIG. 8C In the embodiment, similarly, the user turns on and off the current switch 15B, causing the first magnetic member 111E and the second magnetic member 121E to generate magnetic attraction or cut off (eliminate) the magnetic attraction, so that the first shell 11 and the second shell 12 can be closer to each other, contact and align with each other with less effort. After the first shell 11 and the second shell 12 are aligned, they are further tightly combined by generating magnetic attraction. After the wafer 13 test procedure is completed, the magnetic attraction is cut off (eliminated) again so that the first shell 11 and the second shell 12 can be easily separated.

[0057] According to some embodiments, the magnetic barrier component is a processor connected to a power source P. The processor changes the strength of the magnetic field by increasing or decreasing the current intensity, thereby eliminating or weakening the aforementioned magnetic attraction (when the first shell 11 and the second shell 12 are relatively close and in contact), and generating or enhancing the aforementioned magnetic attraction (when the first shell 11 and the second shell 12 are to be tightly combined). After the wafer 13 completes the test procedure, the processor reduces or eliminates the magnetic attraction by reducing the current intensity, so that the first shell 11 and the second shell 12 can be separated. In this embodiment, the power source P can be a battery or a DC power generation circuit to provide electrical energy to the first magnetic component 111E or the second magnetic component 121E. When the power source P is a battery, the power source P can be a lithium-ion battery, a lithium-manganese battery, a lithium polymer battery, or a nickel-metal hydride battery.

[0058] See also Fig. 9 In the present embodiment, the magnetic barrier component is a magnetic force generating component 15C (such as an electromagnet), which is disposed between the first magnetic component 111E and the second magnetic component 121E. The magnetic force generating component 15C is used to shield or regulate the magnetic attraction between the first magnetic component 111E or the second magnetic component 121E. At this time, the first magnetic component 111E and the second magnetic component 121E can be permanent magnets or non-magnetic magnetic conductive objects. In the present embodiment, the magnetic force generating component 15C is disposed in the second shell 12. The magnetic force generating component 15C is connected to the control circuit CRT and the external power supply P2.

[0059] in accordance with Fig. 9 In the embodiment shown, the polarity of the surface of the magnetic force generating component 15C facing the first magnetic component 111E is the same as the polarity of the first magnetic component 111E (for example, both are N poles), and the polarity of the surface of the magnetic force generating component 15C facing the second magnetic component 121E is the same as the polarity of the second magnetic component 121E (for example, both are S poles).

[0060] When the first shell 11 and the second shell 12 are about to approach and contact each other, the control circuit CRT controls the current of the magnetic force generating component 15C so that the mutual repulsion between the magnetic force generating component 15C and the first magnetic part 111E and the second magnetic part 121E is less than or slightly less than the magnetic attraction between the first magnetic part 111E and the second magnetic part 121E. After the first shell 11 and the second shell 12 are aligned and contacted, the control circuit CRT gradually reduces the current of the magnetic force generating component 15C, which will reduce or eliminate the mutual repulsion between the magnetic force generating component 15C and the first magnetic part 111E and the second magnetic part 121E, so that the first shell 11 and the second shell 12 are tightly combined. After the wafer 13 completes the test procedure, the control circuit CRT increases the current of the magnetic force generating component 15C, thereby enhancing or generating the mutual repulsion force between the magnetic force generating component 15C and the first magnetic component 111E and the second magnetic component 121E, respectively, so that the mutual repulsion force is greater than the magnetic attraction force between the first magnetic component 111E and the second magnetic component 121E. In this way, the first shell 11 and the second shell 12 are in a state that can be easily separated.

[0061] [Beneficial Effects of Embodiments]

[0062] One of the beneficial effects of the present invention is that the wafer testing box provided by the present invention can strengthen the structure of the wafer testing box, strengthen the ability of the first shell and the second shell to be combined and fixed, and strengthen the alignment accuracy during combination through technical solutions such as "the wafer testing box includes a first shell and a second shell", "the first shell has a first magnetic component", "the second shell has a second magnetic component", "when the first magnetic component of the first shell and the second magnetic component of the second shell are relatively close, a magnetic attraction force is generated between the first magnetic component and the second magnetic component to combine and fix the first shell and the second shell" and "the magnetic barrier is used to reduce or cut off the magnetic attraction force generated between the first magnetic component and the second magnetic component, so that the first shell and the second shell can be separated".

[0063] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the scope of the present invention.

Claims

1. A wafer testing box, characterized in that: include: A first housing having at least one first magnetic element; A second shell having at least one second magnetic component, wherein the second magnetic component is disposed correspondingly to the first magnetic component, wherein when the first shell is in corresponding contact with the second shell, an accommodating space is formed between the first shell and the second shell; and A magnetic blocking component, configured to be connected to the first shell or the second shell, and used to reduce or release the magnetic attraction generated between the first magnetic component and the second magnetic component; Wherein, before the first shell contacts the second shell, the magnetic blocking component is used to reduce or release the magnetic attraction; Wherein, when the first shell and the second shell are in corresponding contact, the influence of the magnetic barrier component is released, so that the first shell and the second shell are tightly combined by the magnetic attraction force; and The first shell and the second shell are tightly combined by the magnetic attraction force, and the magnetic barrier component is used to reduce the magnetic attraction force so that the first shell and the second shell can be separated.

2. The wafer testing box according to claim 1, characterized in that: The first magnetic component is a permanent magnet, the second magnetic component is a permanent magnet or a non-magnetic magnetic conductive object, the magnetic barrier component is movably disposed in the first shell or the second shell and is located between the first magnetic component and the second magnetic component, and when the magnetic barrier component moves to a position that shields the first magnetic component or the second magnetic component, the magnetic attraction force generated between the first magnetic component and the second magnetic component is reduced.

3. The wafer testing box according to claim 2, characterized in that: The magnetic force blocking component is a magnetic shielding component or a magnetic force generating component.

4. The wafer testing box as claimed in claim 3, characterized in that: The magnetic barrier component is the magnetic force generating component, and the magnetic force generating component is used to adjust the magnetic attraction between the first magnetic component and the second magnetic component so as to make the first shell and the second shell tightly combined or separated.

5. The wafer testing box according to claim 1, characterized in that: The first magnetic component is a non-permanent magnet (electromagnet), the second magnetic component is a paramagnetic object, the magnetic barrier component controls whether the magnetic force of the first magnetic component is generated or not, the magnetic barrier component is connected to the first magnetic component, and the magnetic barrier component is a switch or a microprocessor.

6. The wafer testing box according to claim 1, characterized in that: There are a plurality of the first magnetic members, and there are a plurality of the second magnetic members, and the number of the plurality of the first magnetic members is the same as the number of the plurality of the second magnetic members.

7. The wafer testing box according to claim 1, wherein: The wafer testing box further includes a sealing member disposed around the accommodating space, and the first shell, the second shell and the sealing member define the accommodating space.

8. The wafer testing box as claimed in claim 1, characterized in that: The first shell includes at least one first positioning structure, the second shell includes at least one second positioning structure, and the first positioning structure and the second positioning structure are correspondingly arranged to make the first shell contact with the second shell correspondingly.

9. The wafer testing box according to claim 8, characterized in that: One side of the first shell includes the first positioning structure, and one side of the second shell includes the second positioning structure. The first positioning structure is a first convex structure, and the second positioning structure is a second convex structure. The first convex structure and the second convex structure are arranged correspondingly. When the first shell and the second shell are tightly combined, the first convex structure is tightly combined with the second convex structure.

10. The wafer testing box according to claim 1, wherein: One side of the first shell includes a first convex structure, and one side of the second shell includes a second convex structure. The first convex structure and the second convex structure are arranged correspondingly. When the first shell and the second shell are tightly combined, the first convex structure is tightly combined with the second convex structure.

11. The wafer testing box according to claim 10, characterized in that: The first shell, the first convex structure, the second shell and the second convex structure define the accommodating space.

12. The wafer testing box according to claim 1, wherein: The wafer testing box further includes a probe card and a wafer, and the probe card and the wafer are arranged in the accommodating space.

13. The wafer testing box according to claim 12, wherein: The first housing carries the probe card, the probe card includes at least one probe, and when the first housing and the second housing are combined, the probe protrudes toward the second housing; Wherein, the wafer testing box further comprises a wafer having at least one pad, and the second shell supports the wafer; wherein, when the first shell and the second shell are combined, the at least one probe is in electrical contact with the at least one pad of the wafer.

Images