Semiconductor cleaning equipment

Abstract

According to the semiconductor cleaning equipment, a supporting base is installed in a cleaning cavity and used for supporting a to-be-cleaned part, one end of an input pipeline communicates with a cleaning liquid source, and a spraying head is installed at the other end of the input pipeline and installed in the cleaning cavity; the liquid discharging assembly comprises a liquid discharging cylinder and a liquid discharging piston, the liquid discharging piston is movably arranged in the liquid discharging cylinder, a containing cavity is defined by the liquid discharging piston and the liquid discharging cylinder, the containing cavity communicates with the cleaning cavity through a first liquid discharging pipeline, the containing cavity further communicates with a waste liquid discharging pipeline through a second liquid discharging pipeline, and the first liquid discharging pipeline is provided with a first liquid discharging valve; the second liquid discharge pipeline is provided with a second liquid discharge valve; and before the first liquid discharge valve is opened to discharge the liquid in the cleaning cavity to the accommodating cavity, the accommodating cavity is in a negative pressure state. The semiconductor cleaning equipment can solve the problems that an existing semiconductor cleaning equipment is low in liquid discharging efficiency, and the working efficiency of the cleaning technology is not improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor processing technology, and specifically relates to a semiconductor cleaning device. Background Art

[0002] The cleaning process is an important step in the semiconductor processing process to remove impurities and chemicals attached to the surface of the workpiece. In current semiconductor cleaning equipment, a cleaning chamber is usually provided, and cleaning liquid and the like can be sprayed onto the surface of the workpiece through pipelines and spray heads to achieve the purpose of cleaning the workpiece. Accordingly, as the cleaning process continues, the cleaning liquid and impurities can be temporarily retained in the cleaning chamber.

[0003] In addition, current semiconductor cleaning equipment is equipped with a waste liquid chamber, which is connected to the waste liquid chamber through a discharge valve, and the waste liquid chamber is connected to the factory wastewater discharge pipeline. When the liquid in the cleaning chamber needs to be discharged, the discharge valve is opened to discharge the liquid in the cleaning chamber into the waste liquid chamber. However, due to the limitation of the pipe diameter of the discharge valve and other factors, the discharge efficiency is relatively low, which is not conducive to improving the working efficiency of the cleaning process. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a semiconductor cleaning device to solve the problem that the liquid discharge efficiency of the current semiconductor cleaning device is low, which is not conducive to improving the working efficiency of the cleaning process.

[0005] The embodiment of the present application discloses a semiconductor cleaning device, which includes a cleaning chamber, a support seat, an input pipeline, a spray head and a liquid discharge assembly, wherein the support seat is installed in the cleaning chamber and is used to support a workpiece to be cleaned, one end of the input pipeline is connected to a cleaning liquid source, the spray head is installed at the other end of the input pipeline, and the spray head is installed in the cleaning chamber;

[0006] The liquid discharge assembly includes a liquid discharge cylinder and a liquid discharge piston, wherein the liquid discharge piston is movably disposed in the liquid discharge cylinder, and the liquid discharge piston and the liquid discharge cylinder form a receiving chamber, wherein the receiving chamber is connected to the cleaning chamber via a first liquid discharge pipeline, and the receiving chamber is also connected to a waste liquid discharge pipeline via a second liquid discharge pipeline, wherein the first liquid discharge pipeline is provided with a first liquid discharge valve, and the second liquid discharge pipeline is provided with a second liquid discharge valve;

[0007] Before the first liquid discharge valve is opened to discharge the liquid in the cleaning chamber into the accommodating chamber, the accommodating chamber is in a negative pressure state.

[0008] An embodiment of the present application discloses a semiconductor cleaning device, which includes a cleaning chamber and a support seat arranged in the cleaning chamber, the support seat is used to support the workpiece to be cleaned, and the semiconductor cleaning device is provided with an input pipeline connected to a cleaning liquid source, and a spray head for cleaning the workpiece to be cleaned is also installed at the other end of the input pipeline.

[0009] At the same time, in the discharge assembly of the semiconductor cleaning equipment, the discharge piston is movably arranged in the discharge cylinder, and the two form a receiving chamber, and the receiving chamber is connected to the cleaning chamber and the waste liquid discharge pipeline through the first discharge pipeline and the second discharge pipeline, respectively, and the first discharge valve and the second discharge valve are respectively arranged on the first discharge pipeline and the second discharge pipeline, so as to control the flow of the liquid. In addition, during the operation of the semiconductor cleaning equipment, when the first discharge valve is opened to discharge the liquid in the cleaning chamber to the receiving chamber, the receiving chamber can be controlled to be in a negative pressure state by changing the position of the discharge piston, so that after the first discharge valve is opened, the liquid in the cleaning chamber is "sucked" into the receiving chamber by the negative pressure, which can greatly improve the discharge speed of the liquid in the cleaning chamber, thereby improving the working efficiency of the cleaning process.

[0010] In addition, in the semiconductor cleaning equipment disclosed in the embodiment of the present application, after the liquid in the cleaning chamber is discharged into the accommodating chamber, when the first drain valve is closed and the second drain valve is opened, the liquid can be discharged from the accommodating chamber to the waste liquid discharge pipeline by controlling the relative movement of the drain piston to reduce the accommodating chamber. In this process, the liquid discharge rate can be controlled by controlling parameters such as the movement speed of the drain piston, thereby preventing the impact on the factory service pipeline caused by the excessively fast rate of liquid discharge into the waste liquid discharge pipeline, and even the possibility that the waste liquid may flow back into other pipelines or equipment along the factory service pipeline, causing interference with the normal operation of other equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0012] Figure 1 A schematic diagram of the structure of a semiconductor cleaning device disclosed in an embodiment of the present application;

[0013] Figure 2 A schematic diagram of the structure of a liquid discharge assembly in a semiconductor cleaning device disclosed in an embodiment of the present application;

[0014] Figure 3 This is a schematic diagram of the structure of a liquid leveling component in a semiconductor cleaning device disclosed in an embodiment of the present application.

[0015] Reference numerals:

[0016] 2001-frame, 2002-pipeline installation area, 2003-exhaust flange, 2004-drainage assembly, 2005-first drainage pipeline, 2006-blocking valve, 2007-liquid homogenizing part, 2008-cavity installation area, 2009-first spray head, 2010-support seat, 2011-cleaning chamber, 2012-second spray head, 2013-parts to be cleaned, 2014-overflow pipeline, 2015-medicine solution Mixing valve, 2016-air purification fan, 2017-first liquid medicine pipeline, 2018-second liquid medicine pipeline, 2019-third liquid medicine pipeline, 2020-fourth liquid medicine pipeline, 2021-pure water pipeline, 2022-first collection pipeline, 2023-second collection pipeline, 2024-acid solution discharge pipeline, 2025-recycled water discharge pipeline, 2026-reflux pipeline, 2027-waste liquid discharge pipeline,

[0017] 3001-first liquid discharge valve, 3002-second liquid discharge valve, 3003-first end cover, 3004-cylinder body, 3005-partition plate, 3006-connecting rod, 3007-driving piston, 3008-second end cover, 3009-first air inlet, 3010-second air inlet, 3011-sealing ring, 3012-exhaust port, 3016-mounting groove, 3017-liquid discharge piston,

[0018] 4001-drainage hole, 4002-through hole. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0021] like Figure 1-Figure 3As shown, the embodiment of the present application discloses a semiconductor cleaning device, which includes a cleaning chamber 2011, a support seat 2010, an input pipeline, a spray head and a drainage component 2004. Of course, the semiconductor cleaning device also includes other devices and mechanisms. For example, the semiconductor cleaning device is provided with a skeleton 2001, which is used to provide a basic installation function for other devices and mechanisms, wherein the skeleton 2001 is provided with a pipeline installation area 2002, and devices such as pipelines and valves can be arranged in the installation area. In addition, the skeleton 2001 can also be provided with a cavity installation area 2008 for installing devices such as the cleaning chamber 2011. Optionally, the skeleton 2001 can also be provided with an area for installing other devices, which will not be described in detail herein. An exhaust flange 2003 can be installed on the skeleton 2001, and the exhaust flange 2003 is connected to the installation area of ​​the semiconductor cleaning device. By installing an exhaust device at the exhaust flange 2003, the gas generated during the cleaning process can be discharged outside the semiconductor cleaning device to improve the cleaning effect. In addition, an air purification fan 2016 may be provided on the top of the cleaning chamber 2011 to purify the gas exhausted from the cleaning chamber 2011 by the air purification fan 2016 to prevent the gas generated in the cleaning chamber 2011 from polluting the processing workshop.

[0022] As described above, the cleaning chamber 2011 can be installed in the chamber installation area 2008 of the frame 2001. Based on this, the support seat 2010 for supporting the object to be cleaned 2013 is installed in the cleaning chamber 2011, so that the object to be cleaned 2013 can be fixed in the cleaning chamber 2011 for the cleaning process. The support seat 2010 can specifically include two parts, which are respectively fixed on opposite sides of the inner wall of the cleaning chamber 2011, so that the object to be cleaned 2013 can be sandwiched between the two support seats 2010.

[0023] The input pipeline is a pipeline used to transport cleaning liquid in semiconductor cleaning equipment. One end of the input pipeline is connected to the cleaning liquid source, and the spray head is installed at the other end of the input pipeline, so that the cleaning liquid in the cleaning liquid source can be transported to the spray head through the input pipeline. By installing the spray head in the cleaning chamber 2011, it is ensured that the spray head can clean the part to be cleaned 2013 by spraying.

[0024] Specifically, the number of the spray heads can be one, and in order to improve the cleaning effect and cleaning efficiency, the number of the spray heads can be multiple. In the process of arranging the spray heads, the spray heads can be installed in a relatively lower area in the cleaning chamber 2011. More specifically, the spray heads include a first spray head 2009, and the number of the first spray heads 2009 can be multiple, and the multiple first spray heads 2009 can be installed at a position below the to-be-cleaned part 2013 supported by the support seat 2010.

[0025] In addition, the input pipeline can specifically include a pipeline, and its two ends are respectively connected to the cleaning liquid source and the spray head. When the type of cleaning liquid needs to be switched, the type of cleaning liquid source connected to the input pipeline can be changed, so that the corresponding cleaning liquid can be used when the residues on the part 2013 to be cleaned are different.

[0026] In another embodiment of the present application, the input pipeline can include multiple branches, and the multiple branches of the input pipeline are respectively connected to the first liquid medicine pipeline 2017, the second liquid medicine pipeline 2018, the third liquid medicine pipeline 2019 and the fourth liquid medicine pipeline 2020 for conveying different liquid medicines. Accordingly, valves can be provided on the first liquid medicine pipeline 2017, the second liquid medicine pipeline 2018, the third liquid medicine pipeline 2019 and the fourth liquid medicine pipeline 2020 to control the on-off relationship of each pipeline. When the technical solution disclosed in this embodiment is adopted, the operation complexity of the cleaning process can be reduced.

[0027] In addition, a liquid medicine mixing valve 2015 can be set at the position where the input pipeline is connected to the first liquid medicine pipeline 2017, the second liquid medicine pipeline 2018, the third liquid medicine pipeline 2019 and the fourth liquid medicine pipeline 2020. This allows the liquid medicine transported in the first liquid medicine pipeline 2017, the second liquid medicine pipeline 2018, the third liquid medicine pipeline 2019 and the fourth liquid medicine pipeline 2020 to have the ability to be pre-mixed, so that the degree of mixing of the cleaning liquid is relatively better, thereby further improving the cleaning effect. Among them, the specific types of liquid medicine transported in the first liquid medicine pipeline 2017, the second liquid medicine pipeline 2018, the third liquid medicine pipeline 2019 and the fourth liquid medicine pipeline 2020 can be flexibly selected according to actual needs. Optionally, the liquid medicine transported in the first liquid medicine pipeline 2017, the second liquid medicine pipeline 2018, the third liquid medicine pipeline 2019 and the fourth liquid medicine pipeline 2020 can be HCL, HF, H2O2 and NH4OH respectively. In addition, the number of liquid medicine pipelines can be further increased, that is, the input pipeline can also be connected to the fifth liquid medicine pipeline, the sixth liquid medicine pipeline, etc., which is not limited in this article.

[0028] In the embodiment of the present application, when the part to be cleaned 2013 needs to be cleaned, the cleaning liquid can be delivered to the spray head through the input pipeline, and the part to be cleaned 2013 is cleaned by spraying using the spray head. Accordingly, the cleaning liquid delivered to the cleaning chamber 2011 and the residue on the part to be cleaned 2013 will also be temporarily retained in the cleaning chamber 2011, and the discharge work will be performed after the cleaning work is completed or when the liquid in the cleaning chamber 2011 needs to be discharged.

[0029] As described above, the semiconductor cleaning equipment disclosed in the embodiment of the present application includes a liquid discharge component 2004, which includes a liquid discharge cylinder and a liquid discharge piston 3017. The liquid discharge cylinder specifically includes a cylinder body 3004, and the liquid discharge piston 3017 is movably disposed in the cylinder body 3004 of the liquid discharge cylinder, and the liquid discharge piston 3017 and the liquid discharge cylinder form a receiving cavity. That is, the liquid discharge piston 3017 can move in the liquid discharge cylinder along the axial direction of the liquid discharge cylinder. Of course, the liquid discharge piston 3017 is also connected to a driving source, so as to use the driving source to provide power to drive the liquid discharge piston 3017 to move in the liquid discharge cylinder, thereby changing the volume of the receiving cavity surrounded by the liquid discharge piston 3017 and the liquid discharge cylinder.

[0030] At the same time, the receiving chamber is connected to the cleaning chamber 2011 through the first drainage pipeline 2005, and the receiving chamber is also connected to the waste liquid discharge pipeline 2027 through the second drainage pipeline, so that the liquid in the cleaning chamber 2011 can be discharged into the receiving chamber through the first drainage pipeline 2005, and the liquid discharged into the receiving chamber can also be discharged into the waste liquid discharge pipeline 2027 through the second drainage pipeline. In order to control the reliable discharge process, a first drainage valve 3001 is provided on the first drainage pipeline 2005, and a second drainage valve 3002 is provided on the second drainage pipeline. When the liquid in the cleaning chamber 2011 needs to be discharged into the receiving chamber, the first drainage valve 3001 can be controlled to be opened, and the second drainage valve 3002 can be controlled to be closed. When the liquid in the receiving chamber needs to be discharged, the second drainage valve 3002 can be controlled to be opened, and the first drainage valve 3001 can be controlled to be closed. In order to improve the utilization efficiency of the cleaning liquid, the first liquid discharge valve 3001 can be set in the first liquid discharge pipeline 2005 near the liquid discharge cylinder, and a blocking valve 2006 can be added in the first liquid discharge pipeline 2005 near the cleaning chamber 2011, and the blocking valve 2006 can be operated synchronously with the first liquid discharge valve 3001.

[0031] Based on the semiconductor cleaning equipment including the above structure disclosed in the embodiment of the present application, in order to improve the discharge efficiency of the liquid in the cleaning chamber 2011, during the operation of the semiconductor cleaning equipment, before the first drain valve 3001 needs to be opened to discharge the liquid in the cleaning chamber 2011 into the receiving chamber, the receiving chamber can be placed in a negative pressure state. Specifically, when there is no more liquid in the receiving chamber and the first drain valve 3001 and the second drain valve 3002 are both closed, the volume of the receiving chamber is increased by moving the drain piston 3017 relative to the cylinder body 3004 of the drain cylinder. At this time, since there is no liquid in the receiving chamber and the first drain valve 3001 and the second drain valve 3002 are both in a closed state, the gas cannot enter the increased volume of the receiving chamber, thereby forming a negative pressure state in the receiving chamber. The specific parameters of the negative pressure state of the receiving chamber can be flexibly selected according to actual conditions and are not limited here.

[0032] As for the timing of forming a negative pressure state in the accommodating chamber, optionally, after the liquid in the accommodating chamber is discharged through the second discharge pipeline, the discharge piston 3017 is used to put the accommodating chamber in a negative pressure state, or, before a preset time before the liquid in the cleaning chamber 2011 is discharged into the accommodating chamber, the discharge piston 3017 is used to put the accommodating chamber in a negative pressure state. This can ensure that the liquid in the cleaning chamber 2011 needs to be discharged next time, and after the first discharge valve 3001 is opened, the negative pressure in the accommodating chamber can enable the liquid in the cleaning chamber 2011 to be transported to the accommodating chamber more quickly, thereby increasing the discharge speed of the liquid in the cleaning chamber 2011, and further improving the efficiency of the cleaning process.

[0033] Specifically, the actual parameters of the negative pressure state in the receiving chamber can be flexibly controlled according to specific circumstances. For example, the volume of the receiving chamber in the negative pressure state can be made greater than or equal to the volume of the liquid in the cleaning chamber 2011 when the liquid needs to be discharged from the cleaning chamber 2011, thereby ensuring that the liquid in the cleaning chamber 2011 can be basically "sucked away" before the pressure in the receiving chamber returns to the atmospheric pressure. Of course, after the first liquid discharge valve 3001 is opened, the liquid discharge piston 3017 can be controlled to continue to move, so that the receiving chamber continues to maintain a negative pressure state during the process of liquid flowing into the receiving chamber until the liquid in the cleaning chamber 2011 is completely discharged into the receiving chamber.

[0034] The waste liquid discharge pipeline 2027 can be specifically connected to the factory service pipeline. As mentioned above, the input pipeline can be connected to multiple liquid pipelines respectively to improve the cleaning effect while reducing the complexity of the operation of the semiconductor cleaning equipment. In this case, for the waste liquid discharge pipeline 2027, it can also be connected to different discharge pipelines through multiple branches. Specifically, the multiple branches can include a collection pipeline and a discharge pipeline, wherein, when the input pipeline is connected to the HF and NH4OH liquid pipelines, the collection pipeline can include a first collection pipeline 2022 and a second collection pipeline 2023, which are respectively used to collect HF and NH4OH liquid medicines, so that the liquid medicines can be reused, and prevent the direct discharge of the liquid medicines from causing the subsequent treatment process of the waste liquid to increase too much. For relatively weakly acidic or harmless liquid medicines, an acid solution discharge pipeline 2024 can be provided, and the acid solution discharge pipeline 2024 can also be connected to the waste liquid discharge pipeline 2027. At the same time, by setting valves on the first collection pipeline 2022, the second collection pipeline 2023 and the acid solution discharge pipeline 2024, the discharge path of the waste liquid can be controlled.

[0035] The embodiment of the present application discloses a semiconductor cleaning device, which includes a cleaning chamber 2011 and a support base 2010 arranged in the cleaning chamber 2011, the support base 2010 is used to support the workpiece 2013 to be cleaned, and the semiconductor cleaning device is provided with an input pipeline connected to a cleaning liquid source, and a spray head for cleaning the workpiece 2013 to be cleaned is also installed at the other end of the input pipeline.

[0036] At the same time, in the discharge assembly 2004 of the semiconductor cleaning equipment, the discharge piston 3017 is movably arranged in the discharge cylinder, and the two enclose a receiving chamber, and the receiving chamber is connected to the cleaning chamber 2011 and the waste liquid discharge pipeline 2027 through the first discharge pipeline 2005 and the second discharge pipeline, and the first discharge valve 3001 and the second discharge valve 3002 are respectively arranged on the first discharge pipeline 2005 and the second discharge pipeline, so as to control the flow of the liquid. In addition, during the operation of the semiconductor cleaning equipment, when the first discharge valve 3001 is opened to discharge the liquid in the cleaning chamber 2011 to the receiving chamber, the position of the discharge piston 3017 can be changed to control the receiving chamber to be in a negative pressure state, so that after the first discharge valve is opened, the liquid in the cleaning chamber 2011 is "sucked" into the receiving chamber by the negative pressure, which can greatly improve the discharge speed of the liquid in the cleaning chamber 2011, thereby improving the working efficiency of the cleaning process.

[0037] In addition, in the semiconductor cleaning equipment disclosed in the embodiment of the present application, after the liquid in the cleaning chamber 2011 is discharged into the accommodating chamber, when the first liquid discharge valve 3001 is closed and the second liquid discharge valve 3002 is opened, the liquid discharge piston 3017 can be controlled to move relative to the liquid discharge cylinder to reduce the accommodating chamber, thereby controlling the liquid to be discharged from the accommodating chamber to the waste liquid discharge pipeline 2027. In this process, the liquid discharge rate can be controlled by controlling the parameters such as the moving speed of the liquid discharge piston 3017, thereby preventing the liquid from being discharged into the waste liquid discharge pipeline 2027 at an excessively fast rate and causing an impact on the plant service pipeline, and even preventing the waste liquid from flowing back into other pipelines or equipment along the plant service pipeline, thereby interfering with the normal operation of other equipment.

[0038] As described above, the liquid discharging piston 3017 can be driven by a driving source to put the accommodating chamber in a negative pressure state, and when the accommodating chamber contains liquid, the liquid in the accommodating chamber can also be discharged by driving the liquid discharging piston 3017. Optionally, the liquid discharging piston 3017 can be driven to move relative to the liquid discharging cylinder by means of electricity or hydraulic pressure. In another embodiment of the present application, compressed air can be used as a driving source to move the liquid discharging piston 3017 relative to the liquid discharging cylinder.

[0039] In detail, the liquid discharge assembly 2004 disclosed in the embodiment of the present application further includes a partition 3005, a driving piston 3007, a first air inlet 3009 and a second air inlet 3010, wherein the partition 3005 is installed in the liquid discharge cylinder and is sealed and connected to the inner wall of the liquid discharge cylinder, and the liquid discharge piston 3017 and the driving piston 3007 are respectively arranged on opposite sides of the partition 3005. That is, the partition 3005 can separate the inner cavity of the liquid discharge cylinder into two parts, one part of which is used to cooperate with the liquid discharge piston 3017 and form a receiving cavity, and the other part is used to cooperate with the driving piston 3007 to form a driving cavity. The first air inlet 3009 and the second air inlet 3010 are both used to drive the driving piston 3007 to move, and the two make the driving piston 3007 move in opposite directions.

[0040] Furthermore, by connecting the driving piston 3007 with the discharge piston 3017, when the driving piston 3007 moves relative to the discharge cylinder on one side of the partition 3005, the discharge piston 3017 can be driven to move relative to the discharge cylinder on the other side of the partition 3005 to change the volume of the accommodating chamber.

[0041] As mentioned above, the driving source of the liquid discharging piston 3017 disclosed in the embodiment of the present application can be compressed air, and for this purpose, the first air inlet 3009 and the second air inlet 3010 can be both arranged on the side of the partition 3005 facing the driving piston 3007, and the first air inlet 3009 and the second air inlet 3010 can be respectively arranged on the opposite sides of the driving piston 3007. In this case, when gas is transported into the liquid discharging cylinder through the first air inlet 3009, the driving piston 3007 can be moved in a direction close to the second air inlet 3010, and vice versa, the driving piston 3007 can be moved in a direction close to the first air inlet 3009, so as to achieve the purpose of driving the liquid discharging piston 3017 to move through the driving piston 3007 to change the volume of the accommodating chamber.

[0042] Of course, in order to ensure that the driving action can be performed more reliably, a more reliable sealing relationship needs to be formed between the partition 3005, the discharge piston 3017 and the drive piston 3007 and the cylinder body 3004. Optionally, the outer peripheries of the partition 3005, the discharge piston 3017 and the drive piston 3007 can be provided with a sealing ring 3011, so as to achieve the purpose of sealing connection between the corresponding device and the discharge cylinder through the sealing ring 3011.

[0043] As mentioned above, the discharge piston 3017 and the driving piston 3007 are respectively arranged on opposite sides of the partition 3005, and a fixed connection relationship is formed between the two. Specifically, the discharge assembly 2004 includes a connecting rod 3006, and the discharge piston 3017 and the driving piston 3007 can form a fixed connection relationship through the connecting rod 3006. Accordingly, the connecting rod 3006 needs to be arranged through the partition 3005. In order to ensure that a reliable sealing relationship can be formed between the partition 3005 and the connecting rod 3006, a perforation is provided on the partition 3005, and the inner wall of the perforation is provided with at least one sealing ring 3011. The connecting rod 3006 is penetrated in the perforation, and a reliable sealing relationship is formed with the inner wall of the perforation through the sealing ring 3011.

[0044] In addition, the liquid discharge cylinder may specifically include a cylinder body 3004, a first end cover 3003 and a second end cover 3008. The cylinder body 3004 is a cylindrical structure as a whole, and the first end cover 3003 and the second end cover 3008 are respectively sealed and connected to the opposite ends of the cylinder body 3004. The partition 3005 is installed in the middle of the cylinder body 3004. Specifically, the partition 3005 can form a fixed connection relationship with the inner wall of the cylinder body 3004 by means of threaded connection, and a mounting groove 3016 is provided on the surface of the partition 3005 to facilitate screwing the partition 3005. Among them, the first end cover 3003 can be provided on the side of the liquid discharge piston 3017 away from the driving piston 3007, and the first liquid discharge valve 3001 and the second liquid discharge valve 3002 are both connected to the first end cover 3003. Furthermore, in order to ensure that the discharge piston 3017 can move normally relative to the cylinder body 3004 to form a negative pressure accommodating chamber, an exhaust port 3012 can be provided in the portion of the cylinder body 3004 on the side where the partition 3005 is located toward the discharge piston 3017, adjacent to the partition 3005, so that when the discharge piston 3017 moves toward the partition 3005, the gas between the discharge piston 3017 and the partition 3005 can be discharged to the outside of the discharge cylinder through the exhaust port 3012. Accordingly, when the discharge piston 3017 moves away from the partition 3005, the gas outside the discharge cylinder can also be sucked into the discharge cylinder through the exhaust port 3012, so that the air pressure in the space between the partition 3005 and the discharge piston 3017 is the same as the atmospheric pressure.

[0045] During the operation of the semiconductor cleaning device disclosed in the above embodiment, the amount and speed of the gas input to the first air inlet 3009 and the second air inlet 3010 can be controlled by controlling the output of the gas source and other parameters. In order to further reduce the difficulty of operating the semiconductor cleaning device, the first air inlet 3009 and the second air inlet 3010 can both include a speed regulating valve, so that the amount and speed of the gas delivered to the liquid discharge cylinder through the first air inlet 3009 and the second air inlet 3010 can be controlled by the speed regulating valve. In addition, in order to reduce the difficulty of assembling the semiconductor cleaning device, the first air inlet 3009 and the second air inlet 3010 can both be connected to the air source through a three-position five-way valve. In detail, the first air inlet 3009 and the second air inlet 3010 can be connected to two exhaust ports in the three-position five-way valve, and the air source can be connected to one of the three ports in the three-dimensional five-way valve, and the remaining two ports are respectively connected to the space on the opposite sides of the driving piston 3007 to achieve exhaust of the corresponding space.

[0046] As described above, a spray head is provided in the cleaning chamber 2011, specifically, the spray head includes a first spray head 2009, and the first spray head 2009 is connected to the input pipeline, so that the cleaning liquid in the input pipeline can be sprayed onto the part to be cleaned 2013 through the first spray head 2009, so as to provide a cleaning effect for the part to be cleaned 2013. At the same time, in the embodiment of the present application, the part to be cleaned 2013 can be located above the first spray head 2009. In this case, the part to be cleaned 2013 can be sprayed and cleaned from the bottom of the part to be cleaned 2013, thereby improving the comprehensiveness of the cleaning process, and further improving the cleaning efficiency and cleaning effect. Of course, the number of the first spray head 2009 can be one. In order to further improve the cleaning effect, the number of the first spray heads 2009 can be multiple, so that the multiple first spray heads 2009 can be used to clean the part to be cleaned 2013 from different sides below the part to be cleaned 2013.

[0047] As described above, the liquid in the cleaning chamber 2011 can be discharged into the receiving chamber, and then the receiving chamber has the ability to temporarily retain the liquid in the cleaning chamber 2011 that completes the cleaning work. In order to improve the utilization efficiency of the cleaning liquid, the semiconductor cleaning equipment disclosed in the embodiment of the present application also includes a return line 2026, and one end of the return line 2026 is connected to the receiving chamber, and the other end of the return line 2026 is connected to the spray head, and a third liquid discharge valve is provided on the return line 2026. Then, when the first liquid discharge valve 3001 and the second liquid discharge valve 3002 are both closed, and the third liquid discharge valve is opened, by driving the liquid discharge piston 3017 to move relative to the liquid discharge cylinder, the liquid in the receiving chamber can be re-delivered to the cleaning chamber 2011 through the return line 2026, and sprayed out from the spray head, so as to achieve the purpose of reusing the cleaning liquid.

[0048] At the same time, in order to prevent the secondary cleaning liquid from contaminating the input pipeline, the spray head optionally includes a second spray head 2012, and the return pipeline 2026 is connected to the second spray head 2012, so that the secondary cleaning liquid can be transported to the cleaning chamber 2011 through the return pipeline 2026 via the second spray head 2012, thereby achieving the purpose of cleaning the to-be-cleaned object 2013. Accordingly, the number of second spray heads 2012 can be multiple to improve the cleaning effect.

[0049] Optionally, the second spray head 2012 is disposed below the part to be cleaned 2013. In another embodiment of the present application, the part to be cleaned 2013 can be located below the second spray head 2012, so that the part to be cleaned 2013 is cleaned from above the part to be cleaned 2013. In this case, the semiconductor cleaning equipment can also include a pure water pipeline 2021, one end of the pure water pipeline 2021 is connected to a pure water source, and the other end of the pure water pipeline 2021 is connected to a return pipeline 2026, so that pure water at the pure water source can be transported to the second spray head 2012 through the pure water pipeline 2021 and the return pipeline 2026, and the pure water can be sprayed onto the part to be cleaned 2013, and then at the end of the cleaning process, the cleaning liquid adhering to the part to be cleaned 2013 is removed by using pure water, so as to further improve the cleaning effect of the part to be cleaned 2013.

[0050] At the same time, by setting a valve on the pure water pipeline 2021, the on-off condition of the pure water pipeline 2021 can be controlled. In addition, when the pure water pipeline 2021 and the return pipeline 2026 are connected to each other, pure water can also be transported into the receiving cavity through the pure water pipeline 2021 via the return pipeline 2026, so as to clean the receiving cavity with pure water, and ensure that the particles contained in the liquid transported to the cleaning cavity 2011 by the return pipeline 2026 of the receiving cavity mirror meet the standards. In addition, when the pure water pipeline 2021 is provided, a recycled water discharge pipeline 2025 can also be provided, and the recycled water discharge pipeline 2025 is connected to the waste liquid discharge pipeline 2027 to collect the pure water (i.e., recycled water) that has completed the cleaning work.

[0051] When the semiconductor cleaning equipment is provided with a pure water pipeline 2021, the pure water pipeline 2021 can further be connected to the input pipeline, so that the pure water in the pure water pipeline 2021 can also be transported to the input pipeline, and when the input pipeline is connected to multiple chemical liquid pipelines, multiple chemical liquids can be mixed with pure water at the chemical liquid mixing valve 2015 to dilute the chemical liquid, thereby reducing the difficulty of mixing the chemical liquid.

[0052] Of course, in order to prevent the liquid in the accommodating chamber from contaminating the input pipeline during the process of being transported to the cleaning chamber 2011 through the return pipeline 2026, the connection between the return pipeline 2026 and the pure water pipeline 2021 can be located upstream of the connection between the input pipeline and the pure water pipeline 2021, and by providing a valve between the pure water pipeline 2021 and the input pipeline, the liquid in the return pipeline 2026 can be prevented from flowing into the input pipeline and contaminating the cleaning liquid in the input pipeline.

[0053] As described above, after the cleaning work is completed, or when it is necessary to discharge the retained liquid in the cleaning chamber 2011, the liquid in the cleaning chamber 2011 can be discharged to the receiving chamber by opening the first liquid discharge valve 3001. In order to prevent the liquid in the cleaning chamber 2011 from overflowing from the cavity opening of the cleaning chamber 2011 due to factors such as accidents or failures when the first liquid discharge valve 3001 is not opened when it is necessary to discharge the liquid in the cleaning chamber 2011, the semiconductor cleaning device disclosed in the embodiment of the present application can optionally further include an overflow pipeline 2014, and one end of the overflow pipeline 2014 is connected to the cleaning chamber 2011, and the other end of the overflow pipeline 2014 is connected to the second liquid discharge pipeline. Furthermore, in the process of laying out the overflow pipeline 2014, the connection position of the overflow pipeline 2014 on the cleaning chamber 2011 is located above the connection position of the first liquid discharge pipeline 2005 on the cleaning chamber 2011. As for the specific connection position of the overflow pipeline 2014 on the cleaning chamber 2011, it can be flexibly selected according to actual conditions. For example, the overflow pipeline 2014 can be connected to the upper third of the middle of the part 2013 to be cleaned in the cleaning chamber 2011, etc., which is not limited in this article. Of course, the overflow pipeline 2014 is in a normally open state, ensuring that when the liquid in the cleaning chamber 2011 reaches the connection point of the overflow pipeline 2014 on the cleaning chamber 2011, it can be discharged to the outside of the cleaning chamber 2011 through the overflow pipeline 2014 and the second liquid discharge pipeline.

[0054] As described above, the second liquid discharge pipeline can be specifically connected to the plant service pipeline. In order to prevent the liquid in the plant service pipeline from flowing back into the cleaning chamber 2011 through the overflow pipeline 2014 due to the relatively large instantaneous flow of the plant service pipeline, a one-way valve is optionally provided on the overflow pipeline 2014.

[0055] As described above, before opening the first drain valve 3001 to drain the liquid in the cleaning chamber 2011 to the receiving chamber, the drain efficiency of the liquid in the cleaning chamber 2011 can be improved by placing the receiving chamber in a negative pressure state. However, due to the negative pressure, after the first drain valve 3001 is opened, the liquid in the cleaning chamber 2011 will be "sucked away" relatively quickly due to the negative pressure. In this process, in order to prevent the liquid from flowing quickly in the cleaning chamber 2011 and possibly impacting the part to be cleaned 2013, causing the part to be cleaned 2013 to be unable to be stably supported on the support seat 2010 and fall, be damaged or contaminated, the semiconductor cleaning equipment disclosed in the embodiment of the present application may also include a liquid leveling member 2007, which is provided with a plurality of evenly distributed drain holes 4001, The liquid part 2007 is installed in the cleaning chamber 2011, and the connecting position between the first liquid discharge pipeline 2005 and the cleaning chamber 2011 is located below the liquid uniformizing part 2007, so that the liquid will first pass through the liquid uniformizing part 2007 during the process of being discharged from the first liquid discharge pipeline 2005 to the outside of the cleaning chamber 2011. Under the action of multiple evenly distributed liquid discharge holes 4001 of the liquid uniformizing part 2007, the flow of the liquid can be smoother and more uniform, and no large flow field changes will occur, thereby ensuring that the part to be cleaned 2013 can be stably supported on the support seat 2010.

[0056] The shape of the liquid uniformizing member 2007 can be the same as the cross-section of the cleaning chamber 2011, and by making the sizes of the two correspond, the edge of the liquid uniformizing member 2007 can extend to the inner wall of the cleaning chamber 2011. The liquid uniformizing member 2007 can be formed of a material that is not easily corroded, such as plastic, and the edge of the liquid uniformizing member 2007 can be provided with a through hole 4002. Then, the liquid uniformizing member 2007 can be fixedly installed in the cleaning chamber 2011 by connecting parts such as screws.

[0057] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0058] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A semiconductor cleaning device, characterized in that: It includes a cleaning chamber, a support seat, an input pipeline, a spray head and a liquid discharge assembly, wherein the support seat is installed in the cleaning chamber and is used to support the object to be cleaned, one end of the input pipeline is connected to a cleaning liquid source, the spray head is installed at the other end of the input pipeline, and the spray head is installed in the cleaning chamber; The liquid discharge assembly includes a liquid discharge cylinder and a liquid discharge piston, wherein the liquid discharge piston is movably disposed in the liquid discharge cylinder, and the liquid discharge piston and the liquid discharge cylinder form a receiving chamber, wherein the receiving chamber is connected to the cleaning chamber via a first liquid discharge pipeline, and the receiving chamber is also connected to a waste liquid discharge pipeline via a second liquid discharge pipeline, wherein the first liquid discharge pipeline is provided with a first liquid discharge valve, and the second liquid discharge pipeline is provided with a second liquid discharge valve; Before the first liquid discharge valve is opened to discharge the liquid in the cleaning chamber into the accommodating chamber, the accommodating chamber is in a negative pressure state.

2. The semiconductor cleaning equipment according to claim 1, characterized in that: The liquid discharge assembly further comprises a partition, a driving piston, a first air inlet member and a second air inlet member, wherein the partition is installed in the liquid discharge cylinder and is sealedly connected to the inner wall of the liquid discharge cylinder, the liquid discharge piston and the driving piston are respectively arranged on opposite sides of the partition, and the liquid discharge piston is fixedly connected to the driving piston; The first air inlet member and the second air inlet member are both connected to the side of the partition in the liquid discharge cylinder facing the driving piston, and the first air inlet member and the second air inlet member are respectively located on opposite sides of the driving piston, and the first air inlet member and the second air inlet member are respectively used to drive the driving piston to move in opposite directions relative to the partition.

3. The semiconductor cleaning equipment according to claim 2, characterized in that: The first air intake member and the second air intake member both include a speed regulating valve.

4. The semiconductor cleaning equipment according to claim 1, characterized in that: The spray head comprises a first spray head, the first spray head is communicated with the input pipeline, and the part to be cleaned is located above the first spray head.

5. The semiconductor cleaning equipment according to claim 1, characterized in that: The shower head also includes a second shower head, and the semiconductor cleaning equipment also includes a reflux pipeline, one end of which is connected to the accommodating cavity, and the other end of which is connected to the second shower head. A third drain valve is provided on the reflux pipeline.

6. The semiconductor cleaning equipment according to claim 5, characterized in that: The part to be cleaned is located below the second shower head. The semiconductor cleaning equipment also includes a pure water pipeline, one end of which is connected to a pure water source, the other end of which is connected to the reflux pipeline, and a valve is provided on the pure water pipeline.

7. The semiconductor cleaning equipment according to claim 6, characterized in that: The pure water pipeline is communicated with the input pipeline.

8. The semiconductor cleaning equipment according to claim 1, characterized in that: The semiconductor cleaning equipment further includes an overflow pipeline, one end of which is connected to the cleaning chamber, and the other end of which is connected to the second liquid discharge pipeline.

9. The semiconductor cleaning equipment according to claim 8, characterized in that: The overflow pipeline is provided with a one-way valve.

10. The semiconductor cleaning equipment according to claim 1, characterized in that: The semiconductor cleaning equipment also includes a liquid leveling member, which is provided with a plurality of evenly distributed liquid discharge holes. The liquid leveling member is installed in the cleaning chamber, and the connecting position between the first liquid discharge pipeline and the cleaning chamber is located below the liquid leveling member.

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