Ring taking system

Abstract

The embodiment of the invention provides a ring taking system, and the system comprises a carrying platform which is suitable for carrying a wafer, the wafer comprises a wafer main body and a Taiguo ring, and one side of the wafer is provided with a film; the ring taking clamp comprises a ring taking piece, when the first end of the ring taking piece reaches the outer edge of the wafer main body, a first distance is formed between the first end face of the ring taking piece and a thin film on one side of the wafer main body at the first end, and the first distance is larger than the thickness of the outer edge of the wafer main body; the first adjusting assembly is used for driving the ring taking piece to move in the first direction, and the first direction is the radial direction of the carrying table; one end of the second adjusting assembly is connected with the first adjusting assembly, the other end of the second adjusting assembly is connected with the ring taking piece, the ring taking piece is suitable for moving in the second direction through the second adjusting assembly, and the second direction is the axial direction of the carrying table; and the main body part is connected with the first adjusting assembly and used for driving the ring taking piece to rotate. By the adoption of the technical scheme, the tapioca ring can be taken down.

Description

Technical Field

[0001] The disclosed embodiments relate to the field of semiconductor device technology, and in particular, to a ring removal system. Background Art

[0002] When preparing larger wafers, in order to improve the mechanical strength and stability during the wafer preparation process, a Taiko ring will be formed on the edge of the wafer. Therefore, before packaging the wafer, the following steps are performed: applying a thin film on the surface of the wafer; cutting off the Taiko ring on the outer edge of the wafer; and removing the Taiko ring from the film.

[0003] Therefore, how to remove the Taikoo Ring is a question worth discussing. Summary of the invention

[0004] In view of this, an embodiment of the present disclosure provides a ring removal system that can remove the Taikoo ring.

[0005] In order to solve the above technical problems, the present disclosure provides a ring removal system, wherein the ring removal system includes:

[0006] A carrier, the carrier being suitable for placing a wafer, wherein the wafer comprises: a wafer body and a Taiko ring, and one side of the wafer has a film;

[0007] The ring removal fixture comprises:

[0008] A ring removing member, when the first end of the ring removing member reaches the outer edge of the wafer body, the first end surface has a first distance at the first end from the film on one side of the wafer body, wherein the first distance is greater than the thickness of the outer edge of the wafer body;

[0009] A first adjusting component, the first adjusting component is used to drive the ring removing member to move along a first direction, wherein the first direction is a radial direction of the carrier;

[0010] a second adjusting component, one end of which is connected to the first adjusting component, and the other end of which is connected to the ring-removing member, wherein the ring-removing member is adapted to move along a second direction through the second adjusting component, wherein the second direction is the axial direction of the carrier;

[0011] A main body part, wherein the main body part is connected to the first adjusting assembly and is used to drive the ring removing member to rotate.

[0012] Optionally, the first adjustment component includes:

[0013] A first bracket, the first bracket is fixed to the main body and extends along the radial direction of the carrier;

[0014] A driving member, one end of which is connected to the first bracket, and the other end of which is connected to the second adjusting assembly, for driving the second adjusting assembly to move along the first direction.

[0015] Optionally, the first bracket has:

[0016] A guide groove extending along the first direction, and the second adjustment assembly slidingly cooperates with the guide groove.

[0017] The second adjustment component comprises:

[0018] A sliding member, wherein the sliding member is slidably matched with the guide groove of the first adjustment assembly;

[0019] A guide rod, wherein a first end of the guide rod is disposed in the sliding member and is adapted to move relative to the sliding member along the second direction, and a second end of the guide rod is connected to the ring removing member;

[0020] An elastic member is sleeved on the guide rod and clamped between the sliding member and the ring-removing member in a compressed state.

[0021] Optionally, the guide rod has:

[0022] A limiting portion, the limiting portion being located at the first end of the guide rod;

[0023] The sliding member has:

[0024] An accommodating cavity, wherein the accommodating cavity is suitable for accommodating the limiting portion;

[0025] A guide hole is communicated with the accommodating cavity, the guide hole is located on a side of the sliding member away from the first adjusting component, and the guide hole extends along the second direction.

[0026] Optionally, the sliding member has:

[0027] A sliding portion is located in the guide groove and slidingly cooperates with the guide groove along the first direction.

[0028] Optionally, the thickness of the ring removing member gradually increases from the first end to the second end of the ring removing member.

[0029] Optionally, when the first end of the ring removing member is located between the Taiko ring and the film, a first angle is formed between the first end surface of the ring removing member and the film, and the first angle may be in the range of 1 degree to 30 degrees.

[0030] Optionally, there are multiple first adjustment components, and the multiple first adjustment components are arranged in a circumferential array around the main body.

[0031] Optionally, the ring removal system further comprises:

[0032] A controller is electrically connected to the driving member and is suitable for controlling the first adjusting component to drive the ring removing member along the first direction.

[0033] Compared with the prior art, the technical solution of the embodiment of the present disclosure has the following advantages:

[0034] The ring removal system includes a carrier and a ring removal fixture, wherein the carrier is suitable for placing a wafer, the wafer includes: a wafer body and a Taiko ring, one side of the wafer has a film, the ring removal fixture includes: a ring removal member, a first adjustment component, a second adjustment component and a main body, the first adjustment component is used to drive the ring removal member to move along a first direction, the ring removal member is suitable for moving along a second direction through the second adjustment component, the main body is used to drive the ring removal member to rotate, when the first end of the ring removal member reaches the outer edge of the wafer body, the first end face has a first spacing at the first end and the film on one side of the wafer body, wherein the first spacing is greater than the thickness of the outer edge of the wafer body. By adopting the above technical solution, on the one hand, the Taiko ring can be removed from the film by the ring removal fixture, and on the other hand, the probability of the wafer body being broken due to the ring removal member contacting the wafer body during the ring removal process can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments of the present disclosure or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 A schematic diagram of an application scenario of a ring removal system in an embodiment of the present disclosure is shown;

[0037] Figure 2 A top view of a ring removal clamp in an embodiment of the present disclosure is shown;

[0038] Figure 3 Shows Figure 2 A schematic cross-sectional view of a partial structure of the ring removal fixture in the A1-A2 direction;

[0039] Figure 4 Shows Figure 2 Schematic diagram of the cross-section of part of the structure of the ring removal fixture in the B1-B2 direction.

[0040] Reference numerals:

[0041] Carrier 100;

[0042] Ring removing clamp 200, main body 210, first bracket 221, ring removing member 230, sliding member 241, sliding portion 242, guide rod 243, limiting portion 244, elastic member 245;

[0043] Taikoo Ring 300;

[0044] film 400;

[0045] Guide groove a, accommodating cavity b, guide hole c. DETAILED DESCRIPTION

[0046] According to the background technology, when preparing a larger wafer, in order to improve the mechanical strength and stability of the wafer during preparation, a Taiko ring will be formed on the edge of the wafer. Therefore, before packaging the wafer with the Taiko ring, the following steps can be performed: attaching a film to the surface of the wafer; cutting off the Taiko ring on the outer edge of the wafer; removing the Taiko ring from the film.

[0047] In some embodiments, the step of cutting off the Taiko ring on the outer edge of the wafer may include the following steps: first, placing the wafer on a carrier and setting it coaxially with the carrier; then using a cutting piece to separate the wafer body and the Taiko ring.

[0048] It should be pointed out that in order to reduce the damage to the wafer during the cutting process, the cutting depth cannot be too deep, so the Taiko ring and the film on one side of the wafer body are still integrated. Therefore, how to remove the Taiko ring from the film is a problem worth discussing.

[0049] In order to solve the above technical problems, in an embodiment of the present disclosure, a carrier and a ring removal fixture are included, wherein the carrier is suitable for placing a wafer, the wafer includes: a wafer body and a Taiko ring, one side of the wafer has a thin film, the ring removal fixture includes: a ring removal piece, a first adjustment component, a second adjustment component and a main body, the first adjustment component is used to drive the ring removal piece to move in a first direction, the ring removal piece is suitable for moving in a second direction through the second adjustment component, the main body is used to drive the ring removal piece to rotate, when the first end of the ring removal piece reaches the outer edge of the wafer body, the first end face has a first distance between the first end and the thin film on one side of the wafer body, wherein the first distance is greater than the thickness of the outer edge of the wafer body.

[0050] By adopting the above technical solution, on the one hand, the Taiko ring can be removed from the film by the ring removal fixture, and on the other hand, the probability of the wafer body being broken due to the ring removal component contacting the wafer body during the ring removal process can be reduced.

[0051] In order to make the above-mentioned objects, features and beneficial effects of the present disclosure more obvious and easy to understand, the specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0052] Reference Figures 1 to 4 ,in, Figure 1 A schematic diagram of the structure of a ring removal system in an embodiment of the present disclosure is shown. Figure 2 A top view of a ring removal fixture in an embodiment of the present disclosure is shown. Figure 3 Shows Figure 2 A schematic cross-sectional view of the partial structure of the ring removal fixture in the A1-A2 direction. Figure 4 Shows Figure 2 Schematic diagram of the cross-section of part of the structure of the ring removal fixture in the B1-B2 direction.

[0053] Continue to combine references Figures 1 to 4 The ring removal system may include: a carrier 100 and a ring removal fixture 200.

[0054] Specifically, the wafer is coaxially placed on the carrier 100, and the ring removal fixture 200 is used to perform a ring removal operation on the wafer.

[0055] In some embodiments, the wafer (not shown) may include: a wafer body (not shown) and a Swire ring 300 .

[0056] Specifically, the Taiko ring 300 is formed on the outer edge of the wafer body, and the thickness of the Taiko ring 300 is greater than the thickness of the wafer body, which can improve the mechanical strength of the wafer and reduce the risk of breakage during subsequent processing and transportation.

[0057] In some embodiments, one side of the wafer has a thin film 400 .

[0058] Specifically, the main body and the Taikoo ring 300 are both attached to the film 400, and the film 400 can provide protection for the wafer and reduce the chance of contamination, scratches or other physical damage during subsequent processing.

[0059] In some embodiments, the wafer body may have a plurality of semiconductor devices (not shown) thereon.

[0060] In some embodiments, the ring removal fixture 200 may include: a main body 210 .

[0061] Specifically, the main body 210 is connected to a driving device (not shown) and is suitable for rotating under the driving of the driving device.

[0062] In some embodiments, the ring removal fixture 200 may further include: a first adjustment component and a ring removal member 230 .

[0063] In actual use, the main body 210 is coaxially arranged with the carrier 100, one end of the first adjustment component is connected to the main body 210, and the other end is connected to the ring removing component 230, which is suitable for driving the ring removing component 230 to move along a first direction, for example, driving the ring removing component 230 to move radially along the Taiko ring 300 or the carrier 100, and the ring removing component 230 is located in the gap between the Taiko ring 300 and the film 400, and the main body 210 is rotated to make the ring removing component 230 separate the Taiko ring 300 and the film 400 along the circumferential direction of the Taiko ring 300, wherein the first direction can be the radial direction of the Taiko ring 300 or the radial direction of the carrier 100.

[0064] In some embodiments, the number of the first adjustment components is multiple, for example, three.

[0065] In some embodiments, a plurality of first adjustment components are arranged in a circumferential array around the main body 210. For example, a plurality of first adjustment components can be evenly arranged around the circumference of the main body 210. In this way, when the plurality of first adjustment components separate the Taikoo ring 300 and the film 400, the force on the Taikoo ring 300 can be more uniform, thereby reducing the probability of the Taikoo ring 300 breaking. For example, a plurality of first adjustment components can be non-uniformly arranged around the circumference of the main body 210 to reduce the position setting requirements of the first adjustment components.

[0066] Accordingly, the number of the ring removing members 230 may be multiple, for example, three.

[0067] Specifically, a ring removing member 230 is provided corresponding to a first adjusting component.

[0068] It should be pointed out that, in the following description, the number of the first adjustment components and the number of the ring removing components 230 may be multiple as an example for illustration, but it does not constitute a limitation on the specific number of the first adjustment components and the ring removing components 230. For example, the number of the first adjustment components and the ring removing components 230 may be one.

[0069] In some embodiments, the first adjustment component may include: a first bracket 221 .

[0070] Specifically, the first bracket 221 is fixed to the main body 210 and extends along the first direction, wherein the fixing method may include a detachable connection method and other fixed connection methods.

[0071] In some embodiments, the first bracket 221 may be detachably connected to the main body 210. For example, the first end of the first bracket 221 is screwed or clamped to the main body 210. This facilitates replacement of accessories and reduces costs.

[0072] In some embodiments, the first bracket 221 is fixedly connected to the main body 210. For example, the first end of the first bracket 221 is welded or integrally formed with the main body 210. This can improve the connection strength and stability between the first bracket 221 and the main body 210.

[0073] In some embodiments, the first adjustment assembly may further include: a driving member (not shown).

[0074] Specifically, the driving member is fixed on the first bracket 221 .

[0075] In some embodiments, the first end of the driving member may be detachably connected to the first bracket 221. For example, the first bracket 221 may have an embedding groove, and the first end of the driving member is embedded and fixed in the embedding groove. For example, the first end of the first bracket 221 is connected to the first bracket 221 by a screw.

[0076] In some embodiments, the first end of the ring removing member 230 is in contact with the gap between the Taiko ring 300 and the film 400 , and the second end of the ring removing member 230 is connected to the second end of the driving member.

[0077] During the ring removal process, the second end of the driving member is controlled to move radially along the Taikoo ring 300, and the first end of the ring removal member 230 can move radially along the Taikoo ring 300 under the drive of the second end of the driving member, thereby entering the gap between the Taikoo ring 300 and the film 400 to achieve separation between the Taikoo ring 300 and the film 400.

[0078] In some embodiments, the driving member can be a hydraulic mechanism or a pneumatic mechanism. For example, the driving member is a hydraulic mechanism, and the hydraulic mechanism has a housing and a hydraulic rod, the housing is the first end of the driving member, and the driving end of the hydraulic rod is the second end of the driving member.

[0079] In some embodiments, the thickness of the ring removing member 230 gradually increases from the first end to the second end of the ring removing member 230. For example, the ring removing member 230 may be a wedge-shaped member, and the first end of the ring removing member 230 is a wedge-shaped tip of the wedge-shaped member.

[0080] In some embodiments, the ring removing member 230 may have a first end surface and a second end surface.

[0081] Specifically, when the first end of the ring removing member 230 is located between the film 400 and the Swire ring 300 , the first end face of the ring removing member 230 is opposite to the top face of the film 400 , and the second end face of the ring removing member 230 is opposite to the bottom face of the Swire ring 300 .

[0082] It should be noted that, due to the limitation of the alignment process, although the wafer is coaxially placed on the carrier 100 and the main body 210 is coaxially arranged with the carrier 100, it is not necessarily the case that the main body 210 and the wafer body are coaxial, which means that there is likely to be a certain deviation between the central axis of the main body 210 and the central axis of the wafer body. Therefore, in the process of the ring removing member 230 rotating to separate the Taiko ring 300 and the film 400, the first end of the ring removing member 230 is at a different distance from the circumferential outer edge of the wafer body, which may easily lead to the inability to completely separate the Taiko ring 300 and the film 400 near the wafer body, or, although the Taiko ring 300 and the film 400 are completely separated, the wafer body may be damaged due to the first end of the ring removing member 230 colliding with the outer edge of the wafer body.

[0083] In some embodiments, when the first end of the ring removing member 230 is located between the Taiko ring 300 and the film 400, a first angle is provided between the first end face of the ring removing member 230 and the top surface of the film 400, and when the first end of the ring removing member 230 reaches the outer edge of the wafer body, a first distance is provided between the first end face at the first end and the film 400 on one side of the wafer body, and the first distance is greater than the thickness of the outer edge of the wafer body.

[0084] Specifically, the first spacing is greater than the thickness of the outer edge of the wafer body, which can prevent the first end from touching the wafer body, thereby reducing the probability of the wafer body being broken due to the first end of the ring removal member 230 contacting the wafer body during the ring removal process.

[0085] In some embodiments, the first angle may range from 0 to 30 degrees. For example, the first angle may range from 1 to 30 degrees. For example, the first angle may be 15 degrees.

[0086] It should be noted that the smaller the first angle is, the easier it is for the first end of the ring removing member 230 to enter the gap between the Taiko ring 300 and the film 400, thereby achieving the separation between the Taiko ring 300 and the film 400; the larger the first angle is, when the first end of the ring removing member 230 reaches the outer edge of the wafer body, the greater the distance between the first end face at the first end and the film 400 on one side of the wafer body.

[0087] It should be noted that, during the ring removal process, the first end face of the ring removal member 230 conflicts with the carrier 100 or the film 400. When the first angle is not zero, in the process of the first end of the ring removal member 230 approaching the wafer body along the first direction, under the joint action of the carrier 100 or the film 400, the relative positions of the ring removal member 230 and the film 400 in the axial direction of the film 400 change, wherein the axial direction of the film 400 is consistent with the axial direction of the carrier 100.

[0088] In some embodiments, the ring removal assembly may further include: a second adjustment assembly.

[0089] Specifically, one end of the second adjusting component may be connected to the second end of the driving member, and the other end thereof may be connected to the ring removing member 230 .

[0090] Specifically, when the ring removing member 230 moves along the first direction under the action of the first adjusting component, the second adjusting component is suitable for providing a space for the ring removing member 230 to move along the second direction relative to the first adjusting component, the carrier 100 and the film 400, thereby realizing that the relative positions of the ring removing member 230 and the film 400 in the axial direction of the film 400 change, wherein the axial direction of the Taiko ring 300 is consistent with the axial direction of the carrier 100.

[0091] In some embodiments, there are multiple second adjustment components, and one second adjustment component corresponds to one ring removing member 230 .

[0092] In some embodiments, there is a second angle between the first direction and the second direction, and the second angle may range from 30 degrees to 150 degrees. For example, the second angle is 90 degrees.

[0093] In some embodiments, the second adjustment component may include: a sliding member 241 .

[0094] Specifically, the sliding member 241 is connected to the second end of the driving member, and is suitable for moving under the drive of the second end of the driving member.

[0095] In some embodiments, the structural strength of the first bracket 221 is higher than the second end of the driving member.

[0096] Specifically, in this way, the deformation of the first bracket 221 generated when a force in a direction perpendicular to the first bracket 221 is lower than the deformation of the second end of the driving member generated when a force in a direction perpendicular to the second end of the driving member is applied.

[0097] In some embodiments, the first bracket 221 may have a guide groove a.

[0098] Specifically, the guide groove a can extend along the first direction, and the sliding member 241 is located in the guide groove a and slidably cooperates with the guide groove a to ensure that the sliding member 241 moves along the first direction under the drive of the second end of the driving member.

[0099] In some embodiments, the cross-sectional shape of the guide groove a may be T-shaped.

[0100] In some embodiments, the second end of the driving member may be located in the guide groove a.

[0101] In some embodiments, the sliding member 241 may have a sliding portion 242, and the outer dimensions of the sliding portion 242 are adapted to the inner wall dimensions of the guide groove a. In this way, the sliding member 241 can only move along the extension direction of the guide groove a.

[0102] It should be noted that the matching of the external dimensions of the sliding portion 242 with the internal dimensions of the guide groove a means that the sliding portion 242 and the guide groove a interfere with each other so that the sliding member 241 can only move along the extension direction of the guide groove a and cannot move relative to each other on the cross section of the guide groove a. However, this does not mean that the external shape of the sliding portion 242 is consistent with the shape of the inner wall of the guide groove a. For example, the outer surface of the sliding portion 242 may have a groove, which can reduce the contact area between the sliding portion 242 and the inner wall of the guide groove a, reduce the friction between the two, and thus reduce the friction loss between the two.

[0103] In some embodiments, the second adjustment assembly may further include: a guide rod 243 .

[0104] Specifically, one end of the guide rod 243 is disposed on the sliding member 241 , and the guide rod 243 can move relative to the sliding member 241 along the second direction.

[0105] In some embodiments, the sliding member 241 may have a receiving cavity b and a guide hole c.

[0106] Specifically, the accommodating cavity b is communicated with the guide hole c, the guide hole c is located on a side of the sliding member 241 away from the first bracket 221 , and the guide hole c extends along the second direction.

[0107] In some embodiments, the first end of the guide rod 243 may have a limiting portion 244 .

[0108] Specifically, the limiting portion 244 may be located in the accommodating cavity b, and the size of the limiting portion 244 is larger than the size of the guide hole c, so as to prevent the first end of the guide rod 243 from leaving the accommodating cavity b through the guide hole c.

[0109] In some embodiments, the second end of the guide rod 243 may be connected to the guide member. For example, the second end of the guide rod 243 is connected to the second end surface of the guide member, for example, the second end of the guide rod 243 is connected to the side of the second end of the guide member.

[0110] In some embodiments, the cross-sectional shape of the guide hole c may be one of a circle, an ellipse or a polygon, and the cross-sectional shape of the guide rod 243 is adapted to the cross-sectional shape of the guide hole c. For example, the cross-sectional shapes of the guide hole c and the guide rod 243 may both be rectangular, so that the guide rod 243 and the guide hole c can be prevented from rotating relative to each other during use.

[0111] In some embodiments, the second adjustment component may further include: an elastic member 245 .

[0112] Specifically, the elastic member 245 is sleeved on the guide rod 243 and clamped between the sliding member 241 and the ring removing member 230, wherein the elastic member 245 is always in a compressed state, the first end of the elastic member 245 is in contact with the sliding member 241, and the second end of the elastic member 245 is in contact with the ring removing member 230.

[0113] In actual use, as the first end of the ring removing member 230 approaches the wafer body along the first direction, the distance between the first end of the ring removing member 230 and the film 400 gradually increases, and the ring removing member 230 further compresses the elastic member 245, so that the ring removing member 230 is connected to the sliding member 241 while also being able to adaptively move along the second direction according to the interaction force between the ring removing member 230 and the film 400.

[0114] In some embodiments, the elastic member 245 may be a spring.

[0115] It should be noted that the larger the elastic modulus of the elastic member 245 is, the greater the force required to compress or stretch the elastic member 245 is, the less likely the elastic member 245 is to be deformed, and the smaller the probability of the ring removing member 230 shaking during rotation is.

[0116] In some embodiments, the elastic modulus of the spring is in the range of 4000 N / m to 40000 N / m.

[0117] In some embodiments, when the first end of the ring removing member 230 is located between the Taiko ring 300 and the film 400, a third angle is formed between the second end surface of the ring removing member 230 and the top surface of the Taiko ring 300, and the third angle may range from 0 to 30 degrees. For example, the third angle may be 0 degrees.

[0118] In some embodiments, the ring removal system may further include: a controller (not shown).

[0119] Specifically, the controller is electrically connected to the driving member, and is suitable for controlling the first adjusting component to drive the ring removing member 230 along the first direction.

[0120] In some embodiments, the controller may include at least one of an integrated circuit with processing functions, a processor, etc. For example, the processor may be a central processing unit (CPU), a microprocessor, or a field programmable gate array (FPGA), etc.

[0121] It should be understood that, in the description of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0122] It is understood that the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0123] It is understood that in this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0124] It is to be understood that, in the present application, unless otherwise expressly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0125] It is understood that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0126] It is understandable that the term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article indicates that the associated objects before and after are in an "or" relationship.

[0127] It is understandable that the above describes multiple embodiments provided by the embodiments of the present disclosure, and the various optional methods introduced in the embodiments can be combined and cross-referenced with each other without conflict, thereby extending a variety of possible embodiments, which can all be considered as embodiments disclosed and disclosed by the present disclosure. Although the embodiments of the present disclosure are disclosed as above, the present disclosure is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure, so the scope of protection of the present disclosure should be based on the scope defined by the claims.

Claims

1. A ring removal system, characterized in that: include: A carrier, the carrier being suitable for placing a wafer, wherein the wafer comprises: a wafer body and a Taiko ring, and one side of the wafer has a film; The ring removal fixture comprises: A ring removing member, when the first end of the ring removing member reaches the outer edge of the wafer body, a first distance is formed between the first end surface of the ring removing member and the film on one side of the wafer body at the first end of the ring removing member, wherein the first distance is greater than the thickness of the outer edge of the wafer body; A first adjusting component, the first adjusting component is used to drive the ring removing member to move along a first direction, wherein the first direction is a radial direction of the carrier; a second adjusting component, one end of which is connected to the first adjusting component, and the other end of which is connected to the ring-removing member, wherein the ring-removing member is adapted to move along a second direction through the second adjusting component, wherein the second direction is the axial direction of the carrier; A main body part, wherein the main body part is connected to the first adjusting assembly and is used to drive the ring removing member to rotate.

2. The ring removal system according to claim 1, characterized in that: The first adjustment component comprises: A first bracket, the first bracket is fixed to the main body and extends along the radial direction of the carrier; A driving member, one end of which is connected to the first bracket, and the other end of which is connected to the second adjusting assembly, for driving the second adjusting assembly to move along the first direction.

3. The ring removal system according to claim 2, characterized in that: The first bracket has: A guide groove extending along the first direction, and the second adjustment assembly slidingly cooperates with the guide groove.

4. The ring removal system according to claim 1, characterized in that: The second adjustment component comprises: A sliding member, wherein the sliding member is slidably matched with the guide groove of the first adjustment assembly; A guide rod, wherein a first end of the guide rod is disposed in the sliding member and is adapted to move relative to the sliding member along the second direction, and a second end of the guide rod is connected to the ring removing member; An elastic member is sleeved on the guide rod and clamped between the sliding member and the ring-removing member in a compressed state.

5. The ring removal system according to claim 4, characterized in that: The guide rod has: A limiting portion, the limiting portion being located at the first end of the guide rod; The sliding member has: An accommodating cavity, wherein the accommodating cavity is suitable for accommodating the limiting portion; A guide hole is communicated with the accommodating cavity, the guide hole is located on a side of the sliding member away from the first adjusting component, and the guide hole extends along the second direction.

6. The ring removal system according to claim 4, characterized in that: The sliding member has: A sliding portion is located in the guide groove and slidingly cooperates with the guide groove along the first direction.

7. The ring removal system according to claim 1, characterized in that: The thickness of the ring removing member gradually increases from the first end to the second end of the ring removing member.

8. The ring removal system according to claim 1, characterized in that: When the first end of the ring removing member is located between the Taiko ring and the film, a first angle is formed between the first end surface of the ring removing member and the film, and the first angle ranges from 1 degree to 30 degrees.

9. The ring removal system according to claim 1, characterized in that: There are multiple first adjustment components, and the multiple first adjustment components are arranged in a circumferential array around the main body.

10. The ring removal system according to claim 1, characterized in that: Also includes: A controller is electrically connected to the driving member and is suitable for controlling the first adjusting component to drive the ring removing member along the first direction.

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