Separating device and method for cleaning and drying multi-size wafers

Abstract

The invention relates to a separating device and method for cleaning and drying multi-size wafers. The device comprises a carrier moving assembly, a cutter moving assembly, a linear driving assembly and a cam connecting rod assembly. The carrier moving assembly comprises a connecting platform and a bearing platform arranged below the connecting platform and used for bearing carriers of different sizes, and a first pushing mechanism is arranged between the connecting platform and the bearing platform. The cutter moving assembly comprises a first separation platform arranged above the connecting platform and a second separation platform arranged above the first separation platform, the first separation platform is provided with a first cutter used for separating large-size wafers, and the second separation platform is provided with a second cutter used for separating small-size wafers; and a second pushing mechanism is arranged between the first separation platform and the second separation platform. The linear driving assembly is connected with the second separation platform. The cam connecting rod assembly is arranged on the linear driving assembly and used for being matched with the linear driving assembly to drive the carrier moving assembly and the cutter moving assembly to reciprocate in the vertical direction.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning and drying, and in particular to a separation device and method for cleaning and drying wafers of multiple sizes. Background Art

[0002] In the production process of semiconductor devices, wafer cleaning and drying is a key process. Trace contaminants may cause device failure. The main purpose of cleaning is to remove contaminants on the surface of the wafer, including organic, inorganic and particulate matter. These contaminants may exist in the form of atoms, ions, films or particles, which can cause various defects. After the wafer is cleaned, a high-precision robotic arm or a wafer separation device in the non-process area is required to separate the wafer from the carrier for further drying.

[0003] However, existing wafer separation devices are usually only suitable for wafers of a single size and have poor compatibility with wafers of different sizes. This limitation limits the scope of application of the equipment and makes it difficult to meet the current semiconductor production requirements for compatibility and efficient processing of wafers of multiple specifications. Summary of the invention

[0004] The object of the present invention is to provide a separation device and method for cleaning and drying multi-size wafers, which can separate wafers and carriers of different sizes.

[0005] To achieve the above object, according to a first aspect of the present invention, a separation device for cleaning and drying multi-size wafers is provided, comprising:

[0006] A carrier moving assembly, comprising a connecting platform and a bearing platform arranged below the connecting platform, the bearing platform being used to bear detachable carriers of different sizes, and a first pushing mechanism being arranged between the connecting platform and the bearing platform;

[0007] A tool moving assembly, comprising a first separation platform arranged above the connection platform and a second separation platform arranged above the first separation platform, wherein a first tool for separating large-sized wafers is arranged on the first separation platform, a second tool for separating small-sized wafers is arranged on the second separation platform, and a second pushing mechanism is arranged between the first separation platform and the second separation platform;

[0008] A linear drive assembly connected to the second separation platform;

[0009] The cam-connecting rod assembly is arranged on the linear drive assembly and is used to cooperate with the linear drive assembly to drive the carrier moving assembly and the tool moving assembly to move back and forth vertically.

[0010] Optionally, a first tool bracket is arranged between the first separation platform and the first tool, and a second tool bracket is arranged between the second separation platform and the second tool.

[0011] Optionally, the tops of the first tool and the second tool are located on the same vertical plane as the bottom of the wafer.

[0012] Optionally, a carrier bracket is provided on the carrying platform, and two groups of relatively arranged limit blocks are provided on the carrier bracket, and the carrier is arranged between the two groups of limit blocks.

[0013] Optionally, the first tool bracket, the second tool bracket and the carrier bracket are staggered in the horizontal direction.

[0014] Optionally, the linear drive assembly includes a support frame, a vertical screw arranged on the support frame, and a vertical guide rail, the vertical screw is connected to the second separation platform, and the supporting platform, the connecting platform, the first separation platform and the second separation platform are slidably arranged on the vertical guide rail in sequence from bottom to top.

[0015] Optionally, the cam-link assembly comprises:

[0016] A cam plate, arranged on the support frame, wherein the side edge of the cam plate is divided into a synchronization section of a vertical structure and a separation section of an arc structure;

[0017] a first connecting rod, one end of which is rotatably connected to the second separation platform;

[0018] a second connecting rod, one end of which is rotatably connected to the connecting platform, and the other end of which is rotatably connected to the other end of the first connecting rod;

[0019] An idler wheel, arranged at the connection between the first connecting rod and the second connecting rod, and rotatably arranged at the side edge of the cam plate;

[0020] The cam-connecting rod assembly is configured to cooperate with the linear drive assembly to drive the carrier moving assembly and the tool moving assembly to move upward synchronously when the idler wheel is located in the synchronization section;

[0021] When the idler wheel is located in the separation section, the linear drive assembly cooperates with the linear drive assembly to drive the tool moving assembly to move upward to separate the wafer and the carrier.

[0022] According to a second aspect of the present invention, there is provided a separation method for cleaning and drying multi-sized wafers, comprising the following steps:

[0023] When separating the large-size wafer and the carrier, controlling the first pushing mechanism to open and extend, pushing the carrying platform downward so that the first cutter and the second cutter contact the bottom of the large-size wafer;

[0024] Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to move and drive the tool moving assembly and the carrier moving assembly to move upward synchronously so that the large-size wafer and the carrier are in an initial separation position;

[0025] Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to continue to move and drive the tool moving assembly to move upward to eject the large-size wafer from the carrier and separate it into a drying box located above the carrier;

[0026] The linear drive assembly is controlled to cooperate with the cam connecting rod assembly to move in the opposite direction so that the separation device returns to a state where the large-size wafer and the carrier are in an initial separation position.

[0027] Optionally, the separation method for cleaning and drying multi-size wafers further comprises the following steps:

[0028] When separating the small-sized wafer and the carrier, controlling the first pushing mechanism to close and retract, driving the carrying platform to move upward so that the small-sized wafer and the carrier are in an initial separation position;

[0029] Controlling the second pushing mechanism to open and extend, pushing the first separation platform to move downward so that the first tool avoids the small-sized carrier;

[0030] Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to move and drive the tool moving assembly to move upward to eject the small-sized wafer from the carrier and separate it into a drying box located above the carrier;

[0031] The linear drive assembly is controlled to cooperate with the cam-link assembly to move in the opposite direction, and the second pushing mechanism is controlled to close and retract, so that the separation device returns to a state where the small-size wafer and the carrier are in an initial separation position.

[0032] The beneficial effects of the present invention are as follows: by setting a connecting platform, a carrying platform and a first pushing mechanism, the positions of carriers of different sizes can be adjusted without interfering with the state of the cam-connecting rod assembly, so that wafers of different sizes and the top of the carrier are on the same target reference plane, the initial separation position is unified, and by setting a first tool and a second tool, in cooperation with a linear drive assembly and a cam-connecting rod assembly, wafers of different sizes can be ejected and separated from the carrier; at the same time, by setting a first separation platform, a second separation platform and a second pushing mechanism, the first separation platform can be pushed downward to allow the first tool to avoid small-sized carriers.

[0033] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 This is a schematic structural diagram of a separation device for cleaning and drying wafers of multiple sizes shown in one embodiment of the present invention;

[0035] Figure 2 A schematic structural stereogram of a separation device for cleaning and drying wafers of multiple sizes shown in one embodiment of the present invention;

[0036] Figure 3 It is a schematic structural diagram of a tool moving assembly of a separation device for cleaning and drying multi-size wafers shown in one embodiment of the present invention;

[0037] Figure 4 A schematic flow chart of a separation method for cleaning and drying wafers of multiple sizes shown in one embodiment of the present invention;

[0038] In the figure: 1. carrier moving assembly; 11. connecting platform; 12. bearing platform; 13. carrier; 14. first pushing mechanism; 15. carrier bracket; 151. limit block; 2. tool moving assembly; 21. first separation platform; 22. second separation platform; 23. first tool; 24. second tool; 25. second pushing mechanism; 26. first tool bracket; 27. second tool bracket; 3. linear drive assembly; 31. support frame; 32. vertical screw; 33. vertical guide rail; 4. cam connecting rod assembly; 41. cam plate; 411. synchronization section; 412. separation section; 42. first connecting rod; 43. second connecting rod; 44. idler wheel. DETAILED DESCRIPTION

[0039] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0042] See also Figures 1 to 3 A separation device for cleaning and drying multi-sized wafers shown in a preferred embodiment of the present application includes a carrier 13 moving component 1, a tool moving component 2, a linear drive component 3 and a cam connecting rod component 4. The carrier 13 moving component 1 includes a connecting platform 11 and a carrying platform 12 arranged below the connecting platform 11, the carrying platform 12 is used to carry detachable carriers 13 of different sizes, and a first pushing mechanism 14 is arranged between the connecting platform 11 and the carrying platform 12. The tool moving component 2 includes a first separation platform 21 arranged above the connecting platform 11 and a second separation platform 22 arranged above the first separation platform 21, a first tool 23 for separating large-sized wafers is arranged on the first separation platform 21, a second tool 24 for separating small-sized wafers is arranged on the second separation platform 22, and a second pushing mechanism 25 is arranged between the first separation platform 21 and the second separation platform 22. The linear drive component 3 is connected to the second separation platform 22. The cam-connecting rod assembly 4 is disposed on the linear drive assembly 3 and is used to cooperate with the linear drive assembly 3 to drive the carrier 13 moving assembly 1 and the tool moving assembly 2 to move back and forth vertically.

[0043] According to the solution of the embodiment of the present invention, by setting the connecting platform 11, the carrying platform 12 and the first pushing mechanism 14, the positions of the carriers 13 of different sizes can be adjusted without interfering with the state of the cam-link assembly 4, so that the wafers of different sizes and the top of the carrier 13 are on the same target reference plane, and the initial separation position is unified. By setting the first tool 23 and the second tool 24, in cooperation with the linear drive assembly 3 and the cam-link assembly 4, the wafers of different sizes can be ejected and separated from the carrier 13; at the same time, by setting the first separation platform 21, the second separation platform 22 and the second pushing mechanism 25, the first separation platform 21 can be pushed downward to allow the first tool 23 to avoid the small-sized carrier 13.

[0044] The following is a detailed description with specific embodiments:

[0045] See also Figure 2 The linear drive assembly 3 includes a support frame 31, a vertical lead screw 32 disposed on the support frame 31, and a vertical guide rail 33. The vertical lead screw 32 is connected to the second separation platform 22. The carrying platform 12, the connecting platform 11, the first separation platform 21, and the second separation platform 22 are slidably disposed on the vertical guide rail 33 in sequence from bottom to top. Figure 1 and Figure 2 The cam link assembly 4 includes a cam plate 41, a first link 42, a second link 43 and an idler wheel 44. The cam plate 41 is arranged on the support frame 31, and the side edge of the cam plate 41 is divided into a synchronization section 411 of a vertical structure and a separation section 412 of an arc structure. One end of the first link 42 is rotatably connected to the second separation platform 22, one end of the second link 43 is rotatably connected to the connection platform 11, and the other end of the second link 43 is rotatably connected to the other end of the first link 42. The idler wheel 44 is arranged at the connection between the first link 42 and the second link 43, and is rollably arranged at the side edge of the cam plate 41. The cam link assembly 4 is arranged to cooperate with the linear drive assembly 3 to drive the carrier 13 moving assembly 1 and the tool moving assembly 2 to move upward synchronously when the idler wheel 44 is located in the synchronization section 411. When the idler wheel 44 is located in the separation section 412, the linear drive assembly 3 drives the tool moving assembly 2 to move upward to separate the wafer and the carrier 13.

[0046] It can be seen that when the linear drive assembly 3 drives the second separation platform 22 to move upward, the cam-link assembly 4 is divided into two movement stages. In the first movement stage, the idler wheel 44 is located in the synchronization section 411. Since the synchronization section 411 is a vertical structure, the angle between the first connecting rod 42 and the second connecting rod 43 remains unchanged. Therefore, the cam-link assembly 4 drives the carrier 13 moving assembly 1 and the tool moving assembly 2 to move upward synchronously, so that the wafer and the carrier 13 reach the initial separation position. In the second movement stage, the idler wheel 44 is located in the separation section 412. Since the separation section 412 is an arc structure, the angle between the first connecting rod 42 and the second connecting rod 43 gradually increases and opens. Therefore, the cam-link assembly 4 drives the tool moving assembly 2 to move upward alone, and the carrier 13 moving assembly 1 and the carrier 13 remain stationary at the final initial separation position in the first movement stage, so that the tool moving assembly 2 ejects the wafer from the carrier 13 and separates it and enters the drying box located above the carrier 13. Regardless of the size of the wafer, its separation process follows the above two movement stages.

[0047] Specifically, the wafer and the carrier 13 reach the initial separation position based on the top of the wafer and the carrier 13 being at the target reference plane (in this embodiment, the target reference plane is the dehydration liquid level in the reaction tank). From the perspective of the entire separation process, since the first movement stage and the second movement stage are continuous processes, when only the same cam connecting rod assembly 4 and the linear drive assembly 3 are used, no matter what size of wafer is separated, when the wafer and the carrier 13 reach the initial separation position, the idler wheel 44 in the cam connecting rod assembly 4 is at the inflection point of the cam synchronization section 411 and the separation section 412, and the position of the carrier platform 12 at this time is the highest point and will not move upward, and only the tool moving assembly 2 will continue to move upward. If the separation of small-sized wafers is used as a reference, and large-sized wafers are used for separation, the wafer and the carrier 13 will escape from the liquid surface at the initial separation position and even collide with the drying tank above, causing motion interference. If the separation of large-sized wafers is used as a reference, and small-sized wafers are used for separation, the wafers and carrier 13 will be some distance away from the liquid surface at the initial separation position, which will increase the subsequent movement stroke of the tool. If the size is too small, the movement range of the cam connecting rod assembly 4 may not be satisfied. At the same time, different wafer sizes have different thicknesses, resulting in different lengths of wafer groups of different sizes. Therefore, when only a shorter length tool is used to separate a large-sized wafer group, some large-sized wafers may not be ejected and separated from the carrier 13.

[0048] Based on the above problems, the embodiment of the present invention takes the separation of large-sized wafers as the benchmark, designs the cam-link assembly 4 and the linear drive assembly 3, and sets the connecting platform 11, the carrying platform 12 and the first pushing mechanism 14. Without interfering with the state of the cam-link assembly 4, the position of the small-sized carrier 13 can be moved up, so that the small-sized wafer and the top of the carrier 13 can also be at the same target reference plane (i.e., the dehydration liquid level) at the initial separation position, unifying the initial separation position. At the same time, the first tool 23 and the second tool 24 are designed to match the length of the large-sized and small-sized wafer groups, so as to ensure that all wafers can be completely separated.

[0049] See also Figure 2 Specifically, in this embodiment, a first tool 23 bracket is provided between the first separation platform 21 and the first tool 23, and a second tool 24 bracket is provided between the second separation platform 22 and the second tool 24. A carrier 13 bracket is provided on the carrying platform 12, and two sets of oppositely arranged limit blocks 151 are provided on the carrier 13 bracket, and the carrier 13 is provided between the two sets of limit blocks 151.

[0050] For further information, see Figure 3 In this embodiment, the top of the first cutter 23 and the second cutter 24 are located on the same vertical plane as the bottom of the wafer. By setting it in this way, the center of gravity of the wafer on the top of the two cutters can be ensured, so that the separation process is more stable.

[0051] For further information, see Figure 3 The first tool 23 bracket, the second tool 24 bracket and the carrier 13 bracket are arranged in a staggered manner in the horizontal direction. By so arranging, the first tool 23 bracket, the second tool 24 bracket and the carrier 13 bracket collide when they move up and down, resulting in motion interference.

[0052] See also Figure 4 The present invention also provides a separation method for cleaning and drying multi-size wafers, comprising the following steps:

[0053] S10: When separating the large-sized wafer and the carrier 13, the first pushing mechanism 14 is controlled to open and extend, and the carrying platform 12 is pushed downward to make the first cutter 23 and the second cutter 24 contact the bottom of the large-sized wafer;

[0054] S20: Control the linear drive assembly 3 to cooperate with the cam connecting rod assembly 4 to move and drive the tool moving assembly 2 and the carrier 13 moving assembly 1 to move upward synchronously so that the large-size wafer and the top of the carrier 13 are at the target reference plane and reach the initial separation position;

[0055] S30: Control the linear drive assembly 3 to cooperate with the cam connecting rod assembly 4 to continue to move and drive the tool moving assembly 2 to move upward so that the first tool 23 and the second tool 24 can eject the large-sized wafer from the carrier 13 and separate it and put it into the drying box located above the carrier 13;

[0056] S40: Control the linear drive assembly 3 to cooperate with the cam link assembly 4 to move in the reverse direction so that the separation device returns to the state where the large-size wafer and the carrier 13 are at the initial separation position.

[0057] S50: When separating the small-sized wafer and the carrier 13, the first pushing mechanism 14 is controlled to be closed and retracted, and the carrying platform 12 is driven to move upward so that the small-sized wafer and the carrier 13 are at the target reference plane and reach the initial separation position;

[0058] S60: Control the second pushing mechanism 25 to open and extend, and push the first separation platform 21 to move downward so that the first tool 23 can avoid the small-sized carrier 13;

[0059] S70: Control the linear drive assembly 3 to cooperate with the cam connecting rod assembly 4 to move and drive the tool moving assembly 2 to move upward so that the second tool 24 can eject the small-sized wafer from the carrier 13 and separate it into the drying box located above the carrier 13;

[0060] S80: Control the linear drive assembly 3 to cooperate with the cam link assembly 4 to move in the reverse direction, and control the second push mechanism 25 to close and retract, so that the separation device returns to the state where the small-sized wafer and the carrier 13 are in the initial separation position.

[0061] In step S10 , after the first pushing mechanism 14 is opened and extended, the first cutter 23 , the second cutter 24 and the carrier 13 are in a substantially flush state.

[0062] In step S40 , the first pushing mechanism 14 is in an open and extended state, so that the first pushing mechanism 14 can be closed and retracted when the small-sized wafer and the carrier 13 are subsequently separated.

[0063] In step S50, since the first cutter 23, the second cutter 24 and the horizontal part of the carrier 13 are basically flush at this time, the first pushing mechanism 14 is closed and retracted, which can drive the carrying platform 12 to move up to compensate for the height difference between the small-sized wafer and the large-sized wafer, so that the small-sized wafer and the carrier 13 can also reach the target reference surface and reach the initial separation position. In this process, the first cutter 23 and the second cutter 24 move downward relative to the horizontal part of the carrier 13, so they will not contact the wafer to cause interference.

[0064] In step S60, since the length of the first cutter 23 corresponds to the length of the large-sized wafer group and the carrier 13, if the first cutter 23 and the second cutter 24 are moved up synchronously when separating the small-sized wafer and the carrier 13, the first cutter 23 cannot be inserted into the small-sized carrier 13 due to its long length and will overturn the carrier 13. Therefore, through this step, the first cutter 23 is moved down relative to the second cutter 24 and is set to avoid the small-sized carrier 13. In step S70, although the first cutter 23 and the second cutter 24 are moved up synchronously under the drive of the linear drive assembly 3 and the cam connecting rod assembly 4, due to the avoidance setting in the previous step, only the second cutter 24 enters the carrier 13 to push out and separate the small-sized wafer.

[0065] Regardless of the size of the wafer and the carrier 13 to be separated, after separation and the drying process, the wafer and the carrier 13 will be restored to the initial separation position for subsequent separation.

[0066] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A separation device for cleaning and drying multi-size wafers, characterized in that: include: A carrier moving assembly, comprising a connecting platform and a bearing platform arranged below the connecting platform, the bearing platform being used to bear detachable carriers of different sizes, and a first pushing mechanism being arranged between the connecting platform and the bearing platform; A tool moving assembly, comprising a first separation platform arranged above the connection platform and a second separation platform arranged above the first separation platform, wherein a first tool for separating large-sized wafers is arranged on the first separation platform, a second tool for separating small-sized wafers is arranged on the second separation platform, and a second pushing mechanism is arranged between the first separation platform and the second separation platform; A linear drive assembly connected to the second separation platform; The cam-connecting rod assembly is arranged on the linear drive assembly and is used to cooperate with the linear drive assembly to drive the carrier moving assembly and the tool moving assembly to move back and forth vertically.

2. The separation device for cleaning and drying multi-size wafers according to claim 1, characterized in that: A first tool bracket is arranged between the first separation platform and the first tool, and a second tool bracket is arranged between the second separation platform and the second tool.

3. The separation device for cleaning and drying multi-size wafers according to claim 2, characterized in that: The tops of the first tool and the second tool are located on the same vertical plane as the bottom of the wafer.

4. The separation device for cleaning and drying multi-sized wafers according to claim 3, characterized in that: The carrying platform is provided with a carrier bracket, the carrier bracket is provided with two sets of relatively arranged limit blocks, and the carrier is arranged between the two sets of limit blocks.

5. The separation device for cleaning and drying multi-size wafers according to claim 4, characterized in that: The first tool bracket, the second tool bracket and the carrier bracket are staggered in a horizontal direction.

6. The separation device for cleaning and drying multi-size wafers according to claim 1, characterized in that: The linear drive assembly includes a support frame, a vertical screw arranged on the support frame and a vertical guide rail, the vertical screw is connected to the second separation platform, and the bearing platform, the connecting platform, the first separation platform and the second separation platform are slidably arranged on the vertical guide rail from bottom to top.

7. The separation device for cleaning and drying multi-sized wafers according to claim 6, characterized in that: The cam-link assembly comprises: A cam plate, arranged on the support frame, wherein the side edge of the cam plate is divided into a synchronization section of a vertical structure and a separation section of an arc structure; a first connecting rod, one end of which is rotatably connected to the second separation platform; a second connecting rod, one end of which is rotatably connected to the connecting platform, and the other end of which is rotatably connected to the other end of the first connecting rod; An idler wheel, arranged at the connection between the first connecting rod and the second connecting rod, and rotatably arranged at the side edge of the cam plate; The cam-connecting rod assembly is configured to cooperate with the linear drive assembly to drive the carrier moving assembly and the tool moving assembly to move upward synchronously when the idler wheel is located in the synchronization section; When the idler wheel is located in the separation section, the linear drive assembly cooperates with the linear drive assembly to drive the tool moving assembly to move upward to separate the wafer and the carrier.

8. A separation method for cleaning and drying multi-sized wafers according to any one of claims 1 to 7, characterized in that: The steps include: When separating the large-size wafer and the carrier, controlling the first pushing mechanism to open and extend, pushing the carrying platform downward so that the first cutter and the second cutter contact the bottom of the large-size wafer; Control the linear drive assembly to cooperate with the cam connecting rod assembly to move and drive the tool moving assembly and the carrier moving assembly to move upward synchronously so that the large-size wafer and the top of the carrier are at the target reference plane and reach the initial separation position; Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to continue to move and drive the tool moving assembly to move upward so that the first tool and the second tool can eject the large-size wafer from the carrier and separate it and enter the drying box located above the carrier; The linear drive assembly is controlled to cooperate with the cam connecting rod assembly to move in the opposite direction so that the separation device returns to a state where the large-size wafer and the carrier are in an initial separation position.

9. The separation method for cleaning and drying multi-sized wafers according to claim 8, characterized in that: The following steps are also included: When separating the small-sized wafer and the carrier, controlling the first pushing mechanism to close and retract, driving the carrying platform to move upward so that the small-sized wafer and the carrier are at the target reference plane and reach the initial separation position; Controlling the second pushing mechanism to open and extend, pushing the first separation platform to move downward so that the first tool avoids the small-sized carrier; Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to drive the tool moving assembly to move upward so that the second tool can eject the small-sized wafer from the carrier and separate it into a drying box located above the carrier; The linear drive assembly is controlled to cooperate with the cam-link assembly to move in the opposite direction, and the second pushing mechanism is controlled to close and retract, so that the separation device returns to a state where the small-size wafer and the carrier are in an initial separation position.

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