Automated material handling system and method of transporting carrier using automated material handling system

Abstract

A method of transporting a first carrier is provided. The method includes, in response to a processing station being scheduled for receiving a semiconductor wafer carried by a first carrier, moving a first transport carrier from a first track to a second track via a first junction while the first carrier is supported by a first carrier support assembly of the first transport carrier. The method includes transferring the first carrier from the first carrier support assembly to the cushioning support assembly when the first transport carrier is engaged with the second track. The method includes transferring the first carrier from the buffer support assembly to a second carrier support assembly of a second transport carrier in response to the processing station being operable to receive the semiconductor wafer. The method includes transferring a first carrier from a second carrier support assembly to a processing station.

Description

Technical Field

[0001] The present disclosure relates to a system and method, and more particularly to an automated material handling system and a method for transporting a carrier using the automated material handling system. Background Art

[0002] Semiconductor devices are formed on, in, and / or from semiconductor wafers and are used in a variety of electronic devices (e.g., mobile phones, laptops, desktops, tablets, watches, gaming systems, and various other industrial, commercial, and consumer electronics). One or more semiconductor fabrication processes are performed to form semiconductor devices on, in, and / or from semiconductor wafers. The semiconductor wafer is transferred to a station for performing the one or more semiconductor fabrication processes. Summary of the invention

[0003] The automated material handling system of the present invention comprises a first transport carrier, a transport track system, a buffer support assembly and a second transport carrier. The first transport carrier comprises a first carrier support assembly configured to support a first carrier carrying a semiconductor wafer. The transport track system is configured to facilitate the movement of the first transport carrier, wherein the transport track system comprises a first track and a second track. The second track is connected to the first track via a first joint. The buffer support assembly is configured to support the first carrier. The second transport carrier comprises a second carrier support assembly. In response to the processing station being scheduled to receive the semiconductor wafer, the first transport carrier is configured to: travel from the first track to the second track via the first joint when the first carrier is supported by the first carrier support assembly; and transfer the first carrier from the first carrier support assembly to the buffer support assembly when the first transport carrier is engaged with the second track. In response to the processing station being used to receive the semiconductor wafer, the second transport carrier is configured to: receive the first carrier from the buffer support assembly using the second carrier support assembly; and transfer the first carrier from the second carrier support assembly to the processing station.

[0004] In the method of using an automated material handling system to transport a first carrier of the present invention, the automated material handling system includes a first transport carrier, a second transport carrier, a buffer support component and a transport track system, the transport track system includes a first track and a second track connected to the first track via a first joint, the method includes: in response to a processing station being scheduled for receiving semiconductor wafers carried by the first carrier, when the first carrier is supported by the first carrier support component of the first transport carrier, the first transport carrier is moved from the first track to the second track via the first joint; when the first transport carrier is engaged with the second track, the first carrier is transferred from the first carrier support component to the buffer support component; in response to the processing station being used to receive the semiconductor wafers, the first carrier is transferred from the buffer support component to the second carrier support component of the second transport carrier; and the first carrier is transferred from the second carrier support component to the processing station.

[0005] In the method of using an automated material handling system to transport a first carrier of the present invention, the automated material handling system includes a first transport carrier, a buffer support component and a transport track system, the transport track system includes a first track and a second track connected to the first track via a first joint, the method includes: in response to a processing station being scheduled for receiving semiconductor wafers carried by the first carrier, when the first carrier is supported by the first carrier support component of the first transport carrier, the first transport carrier is moved from the first track to the second track via the first joint; when the first transport carrier is engaged with the second track, the first carrier is transferred from the first carrier support component to the buffer support component; in response to the processing station being used to receive the semiconductor wafers, the first carrier is transferred from the buffer support component to the first carrier support component; and the first carrier is transferred from the first carrier support component to the processing station. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The aspects of the present disclosure will be best understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of various features may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1A A top view of an automated material handling system is illustrated, according to some embodiments.

[0008] Figure 1B A top view of an automated material handling system is illustrated, according to some embodiments.

[0009] Figure 1CA top view of an automated material handling system is illustrated, according to some embodiments.

[0010] Figure 1D A top view of an automated material handling system is illustrated, according to some embodiments.

[0011] Figure 1E A top view of an automated material handling system is illustrated, according to some embodiments.

[0012] Figure 1F A top view of an automated material handling system is illustrated, according to some embodiments.

[0013] Figure 1G A top view of an automated material handling system is illustrated, according to some embodiments.

[0014] Figure 1H A top view of an automated material handling system is illustrated, according to some embodiments.

[0015] Fig. 1I A top view of an automated material handling system is illustrated, according to some embodiments.

[0016] Figure 1J A top view of an automated material handling system is illustrated, according to some embodiments.

[0017] Figure 1K A top view of an automated material handling system is illustrated, according to some embodiments.

[0018] Figure 1L A component block diagram illustrating communications between one or more components of an automated material handling system is illustrated in accordance with some embodiments.

[0019] Figure 1M A top view of an automated material handling system is illustrated, according to some embodiments.

[0020] Figure 2 A side view of an automated material handling system with a first transport vehicle engaged with a first track is illustrated in accordance with some embodiments.

[0021] Figure 3 Illustrated is a perspective view of a second transport vehicle and a third transport vehicle engaged with a second track, according to some embodiments.

[0022] Figure 4 A top view of an automated material handling system is illustrated, according to some embodiments.

[0023] Figure 5 A top view of an automated material handling system is illustrated, according to some embodiments.

[0024] Figure 6 A block diagram illustrating components of an automated material handling system according to some embodiments.

[0025] Figure 7 is a flow chart illustrating a method according to some embodiments.

[0026] Figure 8 Example computer-readable media are illustrated in accordance with some embodiments, in which processor-executable instructions configured to implement one or more of the specifications described herein may be included. DETAILED DESCRIPTION

[0027] The following disclosure provides several different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, the following description of forming a first feature on or on a second feature may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may reuse reference numbers or letters in various examples. This repetition is for the purpose of brevity and clarity, rather than itself representing the relationship between the various embodiments or configurations discussed.

[0028] Furthermore, for ease of description, spatially relative terms such as "beneath," "below," "lower," "above," "upper," and the like may be used herein to describe the relationship of one element or feature illustrated in the figures to another (other) element or feature. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation illustrated in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should be interpreted accordingly.

[0029] According to some embodiments, an automated material handling system uses a transport track system to facilitate movement of a transport carrier. In some embodiments, a transport carrier of the automated material handling system is used to transport a carrier to a processing station in a semiconductor manufacturing environment. In some embodiments, the transport track system includes a first track and a second track. In some embodiments, the automated system includes one or more buffer support components proximate to the second track. In some embodiments, the one or more buffer support components are used to temporarily store one or more carriers carrying semiconductor wafers, which are waiting to be received by the processing station to undergo a process (e.g., a semiconductor manufacturing process) scheduled for the semiconductor wafer. In some embodiments, a carrier of the one or more carriers is transferred from the transport carrier to a buffer support component of the one or more buffer support components when the transport carrier is engaged with the second track, thereby enabling the carrier to be transferred to the buffer support component without obstructing the first track. In some embodiments, once the processing station is available to receive the carrier, the carrier is transferred from the buffer support component to the processing station. Therefore, according to some embodiments, the present disclosure provides at least one of the following advantages: (i) the speed at which a carrier is transferred to a processing station is increased in response to the processing station becoming available for processing semiconductor wafers carried by the carrier; (ii) as a result of the increased speed at which a carrier is transferred to a processing station, the production efficiency of the processing station is also improved; or (iii) as a result of reduced congestion along the first track, the traffic volume of the entire track system is also reduced.

[0030] Figures 1A to 1M to Figure 6 Various aspects associated with the automated material handling system 100 are illustrated in accordance with some embodiments. Figures 1A to 1M The use of the automated material handling system 100 to transport a first carrier 154 according to some embodiments is illustrated. In some embodiments, the automated material handling system 100 includes a transport carrier configured to transport a carrier carrying a semiconductor wafer. In some embodiments, the automated material handling system 100 includes a first transport track system 150 configured to facilitate movement of the transport carrier to transport the semiconductor wafer to one or more locations within a semiconductor manufacturing environment. In some embodiments, the automated material handling system 100 includes a controller 115 configured to manage movement of the transport carrier along one or more tracks of the first transport track system 150.

[0031] Figure 1AA top view of an automated material handling system 100 is illustrated in accordance with some embodiments. In some embodiments, a semiconductor manufacturing environment includes a first processing station 102. In some embodiments, the first processing station 102 includes a semiconductor fabrication station. In some embodiments, the first processing station 102 is configured to perform processes such as semiconductor fabrication steps on semiconductor wafers. In some embodiments, although one processing station 102 is illustrated, any number of processing stations is contemplated. In some embodiments, the first processing station 102 includes at least one of the following equipment: (i) cleaning equipment, such as a cleaning tool including a cleaning tank, in which at least one of cleaning, cleaning, etc., is performed on the semiconductor wafer; (ii) physical vapor deposition (PVD) equipment; (iii) plating equipment; (iv) etching equipment, such as at least one of plasma etching equipment, wet etching equipment, dry etching equipment, reactive-ion etching (RIE) equipment, atomic layer etching (ALE) equipment, buffered oxide etching equipment, or ion beam milling equipment; (v) lithography equipment; (vi) chemical mechanical planarization (CMP) equipment; (vii) chemical vapor deposition (CVD) equipment; (viii) a furnace, such as a semiconductor furnace tool; or (ix) another equipment.

[0032] In some embodiments, the first transport carrier 152 of the automated material handling system 100 is configured to support the first carrier 154. In some embodiments, the first carrier 154 is configured to carry the first semiconductor wafer 204 (in Figure 2 ). In some embodiments, the first transport vehicle 152 includes at least one of an overhead transport vehicle, a guided transport vehicle traveling on a predetermined route or track, a forklift, or another suitable vehicle.

[0033] In some embodiments, the first transport track system 150 includes a plurality of tracks. In some embodiments, one, some, or all of the plurality of tracks each include one or more rails, races, sidewalls, etc. and are configured to accommodate the first transport vehicle 152. In some embodiments, one, some, or all of the plurality of tracks each include at least one of metal, phenolic, nylon, or another suitable material. In some embodiments, at least one of the plurality of tracks is suspended from a ceiling. In some embodiments, at least one of the plurality of tracks is erected relative to at least one of a floor or a wall. In some embodiments, at least one of the plurality of tracks is erected using a grating support structure.

[0034] In some embodiments, the plurality of tracks include at least one of the first track 112, the second track 104, the third track 114, the fourth track 116, the fifth track 126, the sixth track 128, the seventh track 130, the eighth track 142, the ninth track 144, the tenth track 146, or one or more other suitable tracks. In some embodiments, the first transport track system 150 includes a plurality of track system segments. In some embodiments, the plurality of track system segments include at least one of the first track system segment 140, the second track system segment 148, or one or more other suitable track system segments. In some embodiments, the first track system segment 140 includes an intra-bay segment for transporting a carrier from one location within a bay to another location within the (same) bay. In some embodiments, a bay includes one or more processing stations, such as the first processing station 102. In some embodiments, first track system segment 140 includes at least one of first track 112, second track 104, third track 114, fourth track 116, fifth track 126, sixth track 128, or one or more other suitable tracks. In some embodiments, second track system segment 148 includes an inter-bay segment for transporting carriers from a first bay to a second bay different from the first bay. In some embodiments, second track system segment 148 includes at least one of eighth track 142, ninth track 144, tenth track 146, or one or more other suitable tracks.

[0035] In some embodiments, the first transport carrier 152 travels along the first track 112 with the first semiconductor wafer 204 in the first carrier 154. According to some embodiments, the first transport carrier 152 is maintained on the first track 112 using guide rails, guard rails, etc. The first track 112 forms a pathway for the first transport carrier 152 to travel from one location to another location within the semiconductor manufacturing environment. In some embodiments, the first track 112 is configured to facilitate movement of the transport carrier in a first direction 162. In some embodiments, the first transport carrier 152 travels in the first direction 162 along the first track 112. In some embodiments, the third track 114 is configured to facilitate movement of the transport carrier in a second direction 164 that is different from the first direction 162. In some embodiments, the second direction 164 is opposite to the first direction 162.

[0036] In some embodiments, the second track 104 is connected to the first track 112 via at least one of the first junction 108 or the second junction 110. In some embodiments, the second track 104 includes a track loop. In some embodiments, the second track 104 includes a side track. In some embodiments, the second track 104 includes a first portion 104a and a second portion 104b. In some embodiments, the first portion 104a of the second track 104 is substantially parallel to the second portion 104b of the second track 104. In some embodiments, the first portion 104a of the second track 104 is configured to facilitate movement of the transport vehicle in a third direction 158. In some embodiments, the second portion 104b of the second track 104 is configured to facilitate movement of the transport vehicle in a fourth direction 156 that is different from the third direction 158. In some embodiments, the fourth direction 156 is opposite to the third direction 158. In some embodiments, at least one of the third direction 158 or the fourth direction 156 is substantially perpendicular to at least one of the first direction 162 or the second direction 164. In some embodiments, the first joint 108 includes a first transfer component (not shown) that facilitates converting the transport vehicle from traveling along the first track 112 to traveling along the second track 104, such as at least one of a switch, a turnout, etc. In some embodiments, the second joint 110 includes a second transfer component (not shown) that facilitates converting the transport vehicle from traveling along the second track 104 to traveling along the first track 112, such as at least one of a switch, a turnout, etc.

[0037] In some embodiments, the fourth track 116 is connected to the first track 112 via at least one of the third joint 118 or the fourth joint 120. In some embodiments, the fourth track 116 is connected to the third track 114 via at least one of the fifth joint 122 or the sixth joint 124. In some embodiments, the fourth track 116 includes a track loop, such as an inner track loop of the first track system segment 140. In some embodiments, the fourth track 116 includes a first portion 116a and a second portion 116b. In some embodiments, the first portion 116a of the fourth track 116 is substantially parallel to the second portion 116b of the fourth track 116. In some embodiments, the first portion 116a of the fourth track 116 is configured to facilitate movement of the transport vehicle in a fifth direction 166. In some embodiments, the second portion 116b of the fourth track 116 is configured to facilitate movement of the transport vehicle in a sixth direction 168 that is different from the fifth direction 166. In some embodiments, the sixth direction 168 is opposite to the fifth direction 166. In some embodiments, at least one of the fifth direction 166 or the sixth direction 168 is substantially parallel to at least one of the first direction 162 or the second direction 164. In some embodiments, the third joint 118 includes a third conversion component (not shown) that facilitates converting the transport vehicle from traveling along the fourth track 116 to traveling along the first track 112, such as at least one of a shunt, a switch, etc. In some embodiments, the fourth joint 120 includes a fourth conversion component (not shown) that facilitates converting the transport vehicle from traveling along the first track 112 to traveling along the fourth track 116, such as at least one of a shunt, a switch, etc. In some embodiments, the fifth joint 122 includes a fifth conversion component (not shown) that facilitates converting the transport vehicle from traveling along the third track 114 to traveling along the fourth track 116, such as at least one of a shunt, a switch, etc. In some embodiments, the sixth joint 124 includes a sixth conversion component (not shown) that facilitates converting the transport vehicle from traveling along the fourth track 116 to traveling along the third track 114, such as at least one of a shunt, a switch, etc.

[0038] In some embodiments, the automated material handling system 100 includes one or more first buffer support assemblies, including at least one of a first buffer support assembly 106a, a second buffer support assembly 106b, a third buffer support assembly 106c, or a fourth buffer support assembly 106d. In some embodiments, although four buffer support assemblies are illustrated, any number of buffer support assemblies is contemplated. In some embodiments, the one or more first buffer support assemblies are used to temporarily store one or more carriers carrying one or more semiconductor wafers, which are waiting to be received and / or processed using the first processing station 102. In some embodiments, a buffer support assembly of the one or more first buffer support assemblies is used to store carriers scheduled for undergoing a process performed using the first processing station 102. In some embodiments, the buffer support assembly is used to store the carriers during a time period before the time when the first processing station 102 is scheduled for receiving and / or processing the carriers. In some embodiments, the buffer support assembly is used to store the carriers when the first processing station 102 is in at least one of an occupied state or a state of not receiving semiconductor wafers carried by the carriers. In some embodiments, the buffer support assembly is used to store the carrier during down time between a previous process performed on a semiconductor wafer carried by the carrier and a subsequent process scheduled to be performed on the semiconductor wafer using the first processing station 102. In some embodiments, the carrier is transferred from the buffer support assembly to the first processing station 102 in response to the first processing station 102 becoming available to receive the semiconductor wafer.

[0039] Figure 2 An automated material handling system 100 is illustrated having a first transport vehicle 152 engaged with a first track 112 according to some embodiments. In some embodiments, the first transport vehicle 152 is suspended from the first track 112 by one or more wheels 206 of the first transport vehicle 152. In some embodiments, the first transport vehicle 152 is self-propelled, such as a motorized vehicle. In some embodiments, the first track 112 includes a conveying mechanism, such as a chain, belt, motor, compressed air, etc., that moves the first transport vehicle 152 along the first track 112. In some embodiments, at least some of the relative motion between the first transport vehicle 152 and the first track 112 is attributable to the conveying mechanism. Other embodiments are contemplated, and the present disclosure is not limited to the embodiments just described.

[0040] In some embodiments, the first transport vehicle 152 includes a first carrier support assembly 208 configured to support the first carrier 154. In some embodiments, the first carrier support assembly 208 includes at least one of a belt and pulley system, a robotic arm, a base, or another suitable assembly. In some embodiments, the first carrier support assembly 208 selectively engages the first carrier 154 configured to carry the first semiconductor wafer 204, so that the first transport vehicle 152 moves the first carrier 154 and / or the first semiconductor wafer 204 to one or more locations within a semiconductor manufacturing environment.

[0041] In some embodiments, the first carrier 154 includes a wafer storage device. In some embodiments, the wafer storage device includes at least one of a front opening unified pod (FOUP), a cassette pod, a reticle pod, or another type of wafer storage device. In some embodiments, the wafer storage device is used to store one or more semiconductor wafers including the first semiconductor wafer 204. In some embodiments, the one or more semiconductor wafers include a batch of wafers. In some embodiments, the one or more semiconductor wafers include at least one of one or more substrates, one or more photomasks, one or more semiconductor devices, one or more dies, etc. In some embodiments, the one or more semiconductor wafers are stacked in a wafer storage device in a vertical direction. In some embodiments, the one or more semiconductor wafers are supported by a support frame of a wafer storage device, and the support frame has at least one of a wafer shelf or a wafer slot. In some embodiments, the semiconductor wafers stored in the wafer storage device include one or more layers, such as at least one of a semiconductor layer, a conductor layer, or an insulator layer.

[0042] In some embodiments, at least some of the transport vehicles of the automated material handling system 100 have one or more of the features, structures, relationships to other elements, etc. provided herein for the first transport vehicle 152 .

[0043] Figure 1BA first movement operation of the first transport carrier 152 is illustrated according to some embodiments. In some embodiments, the first movement operation includes movement of the first transport carrier 152 along the first travel path 170. In some embodiments, in the first movement operation, the first transport carrier 152 travels from a first position of the first track 112 to a second position of the second track 104. In some embodiments, the first transport carrier 152 travels from the first position of the first track 112 to the second position of the second track 104 in response to the first processing station 102 being scheduled to receive the first semiconductor wafer 204. In some embodiments, the first processing station 102 is configured to perform a first process on the first semiconductor wafer 204. In some embodiments, the controller 115 instructs the first transport carrier 152 to travel to the second position of the second track 104 in response to the first processing station 102 being scheduled to receive the first semiconductor wafer 204. In some embodiments, the first transport carrier 152 travels from the first track 112 to the second track 104 via the first joint 108. In some embodiments, the controller 115 controls the first conversion component of the first coupling portion 108 to facilitate the first transport vehicle 152 to convert from traveling along the first track 112 to traveling along the second track 104 .

[0044] Figure 1C 1. The first carrier 154 is shown in FIG. 1 and FIG. 2 according to some embodiments. Figure 2172 to the first buffer support assembly 106a. In some embodiments, the first carrier 154 is transferred 172 from the first carrier support assembly 208 to the first buffer support assembly 106a in response to the first transport carrier 152 reaching the second position of the second track 104. In some embodiments, the second position of the second track 104 is proximate to the first buffer support assembly 106a. In some embodiments, the first carrier 154 is transferred 172 from the first carrier support assembly 208 to the first buffer support assembly 106a when the first transport carrier 152 is engaged with the second track 104 (e.g., when the one or more guide wheels 206 of the first transport carrier 152 have at least one of the following features: connected to the second track 104, directly in contact with the second track 104, or indirectly in contact with the second track 104). In some embodiments, the first carrier 154 is transferred 172 from the first carrier support assembly 208 to the first buffer support assembly 106a using at least one of the first carrier support assembly 208, a first mechanical device (not shown), or another suitable component. In some embodiments, the first transport carrier 152 includes a first mechanical device. In some embodiments, the first transport carrier 152 does not include a first mechanical device. In some embodiments, the first buffer support assembly 106a includes a first mechanical device. In some embodiments, the controller 115 controls the operation of the first mechanical device. In some embodiments, the first carrier support assembly 208 is disengaged from the first carrier 154 to release the first carrier 154. In some embodiments, the first buffer support assembly 106a includes a first shelf unit configured to support the first carrier 154. In some embodiments, the first carrier 154 is disposed on the first shelf unit using at least one of the first carrier support assembly 208 or the first mechanical device.

[0045] In some embodiments, after transferring 172 the first carrier 154 from the first carrier support assembly 208 of the first transport vehicle 152 to the first buffer support assembly 106a, the first transport vehicle 152 may be used to perform a first transport operation for transporting a second carrier (not shown) that is different from the first carrier 154. In some embodiments, in response to transferring 172 the first carrier 154 from the first carrier support assembly 208 to the first buffer support assembly 106a, the first transport vehicle 152 travels from the second position of the second track 104 to a different position. In some embodiments, in response to transferring 172 the first carrier 154 from the first carrier support assembly 208 to the first buffer support assembly 106a, the controller 115 instructs the first transport vehicle 152 to perform the first transport operation for transporting the second carrier. In some embodiments, in response to transferring 172 the first carrier 154 from the first carrier support assembly 208 to the first buffer support assembly 106a, the controller 115 changes the state of the first transport vehicle 152 from an occupied state to an available state. In some embodiments, when the first transport vehicle 152 is in an available state, the controller 115 includes the first transport vehicle 152 in the list of available transport vehicles. In some embodiments, in response to identifying a first transport operation associated with transporting the second carrier, the controller 115 selects the first transport vehicle 152 from the list of available transport vehicles to perform the first transport operation. In some embodiments, in response to selecting the first transport vehicle 152, the controller 115 instructs the first transport vehicle 152 to perform the first transport operation. In some embodiments, the first transport vehicle 152 leaves the second track 104 via the second coupling portion 110.

[0046] In some embodiments, after the first carrier 154 is transferred 172 from the first carrier support assembly 208 of the first transport carrier 152 to the first buffer support assembly 106a, the first transport carrier 152 leaves the second track 104. In some embodiments, the first transport carrier 152 leaves the second track 104 via the second joint 110. In some embodiments, the first transport carrier 152 leaves the second track 104 to perform the first transport operation. Figure 1DThe automated material handling system 100 is illustrated after the first transport carrier 152 leaves the second track 104 according to some embodiments. In some embodiments, the second transport carrier 178 of the automated material handling system 100 is located at a third position of the second track 104. In some embodiments, the third position is proximate to the third buffer support assembly 106c. In some embodiments, the third transport carrier 180 of the automated material handling system 100 is located at a fourth position of the second track 104. In some embodiments, the fourth position is proximate to the fourth buffer support assembly 106d. In some embodiments, at least one of the second transport carrier 178 or the third transport carrier 180 is a backup carrier configured to deliver the buffer carrier to the first processing station 102 in response to the first processing station 102 being available to receive the buffer carrier stored by a buffer support assembly of the one or more first buffer support assemblies.

[0047] Figure 1E A second movement operation of the second transport carrier 178 is illustrated according to some embodiments. In some embodiments, the second movement operation includes movement of the second transport carrier 178 along the second travel path 184. In some embodiments, in the second movement operation, the second transport carrier 178 travels from the third position of the second track 104 to the fifth position of the second track 104. In some embodiments, the fifth position of the second track 104 is substantially the same as the second position of the second track 104. In some embodiments, the second transport carrier 178 travels to the fifth position of the second track 104 in response to the first processing station 102 being available to receive the first semiconductor wafer 204. In some embodiments, the controller 115 instructs the second transport carrier 178 to travel to the fifth position of the second track 104 in response to the first processing station 102 being available to receive the first semiconductor wafer 204. Embodiments are contemplated in which the second transport carrier 178 travels to the fifth position of the second track 104 from a position different from the third position.

[0048] Figure 1FThe example of transferring 186 the first carrier 154 from the first buffer support assembly 106a to the second transport vehicle 178 according to some embodiments is illustrated. In some embodiments, the first carrier 154 is transferred 186 from the first buffer support assembly 106a to the second transport vehicle 178 in response to the second transport vehicle 178 reaching the fifth position of the second track 104. In some embodiments, the fifth position of the second track 104 is proximate to the first buffer support assembly 106a. In some embodiments, the first carrier 154 is transferred 186 from the first buffer support assembly 106a to the second transport vehicle 178 when the second transport vehicle 178 is engaged with the second track 104 (e.g., when one or more guide wheels of the second transport vehicle 178 have at least one of the following characteristics: connected to the second track 104, directly in contact with the second track 104, or indirectly in contact with the second track 104). In some embodiments, the second transport vehicle 178 includes a second carrier support assembly (not shown). In some embodiments, the second carrier support assembly includes at least one of a belt and pulley system, a robot arm, a base, or another suitable assembly. In some embodiments, the second carrier support assembly selectively engages the first carrier 154. In some embodiments, the first carrier 154 is transferred 186 from the first buffer support assembly 106a to the second transport vehicle 178 using the second carrier support assembly.

[0049] Figure 1G A third movement operation of the second transport carrier 178 is illustrated according to some embodiments. In some embodiments, the third movement operation includes movement of the second transport carrier 178 along a third travel path 188. In some embodiments, in the third movement operation, the second transport carrier 178 travels from the fifth position of the second track 104 to the sixth position of the first track 112. In some embodiments, the second transport carrier 178 travels from the fifth position of the second track 104 to the sixth position of the first track 112 in response to at least one of the following situations: the first carrier 154 is transferred 186 from the first buffer support assembly 106a to the second transport carrier 178 or the first processing station 102 is available to receive the first semiconductor wafer 204. In some embodiments, the controller 115 instructs the second transport carrier 178 to travel to the sixth position of the first track 112 in response to at least one of the following situations: the first carrier 154 is transferred 186 from the first buffer support assembly 106a to the second transport carrier 178 or the first processing station 102 is available to receive the first semiconductor wafer 204. In some embodiments, the second transport vehicle 178 travels from the second track 104 to the first track 112 via the second joint 110. In some embodiments, the controller 115 controls the second conversion component of the second joint 110 to facilitate the second transport vehicle 178 to convert from traveling along the second track 104 to traveling along the first track 112.

[0050] Figure 1H Transferring 190 of a first carrier 154 from a second transport carrier 178 to a first processing station 102 is illustrated in accordance with some embodiments. In some embodiments, the first carrier 154 is transferred 190 from the second carrier support assembly of the second transport carrier 178 to the first processing station 102 in response to the second transport carrier 178 reaching the sixth position of the first track 112. In some embodiments, the sixth position of the first track 112 is proximate to the first processing station 102. In some embodiments, the first carrier 154 is transferred 190 from the second carrier support assembly of the second transport carrier 178 to the first processing station 102 when the second transport carrier 178 is engaged with the first track 112 (e.g., when one or more guide wheels of the second transport carrier 178 have at least one of the following characteristics: connected to the first track 112, in direct contact with the first track 112, or in indirect contact with the first track 112). In some embodiments, the first carrier 154 is transferred 190 from the second carrier support assembly of the second transport carrier 178 to the first processing station 102 using at least one of a second carrier support assembly of the second transport carrier 178, a second mechanical device (not shown), or another suitable assembly. In some embodiments, the second transport carrier 178 includes a second mechanical device. In some embodiments, the second transport carrier 178 does not include a second mechanical device. In some embodiments, the first processing station 102 includes a second mechanical device. In some embodiments, the controller 115 controls the operation of the second mechanical device. In some embodiments, the second carrier support assembly of the second transport carrier 178 disengages from the first carrier 154 to release the first carrier 154. In some embodiments, the first processing station 102 includes a first loading port (not shown). In some embodiments, the first carrier 154 is placed on the first loading port using at least one of the second carrier support assembly of the second transport carrier 178 or the second mechanical device.

[0051] In some embodiments, the first semiconductor wafer 204 is transferred from the first carrier 154 to the first processing station 102 via the first loading port of the first processing station 102. In some embodiments, the first semiconductor wafer 204 is transferred from the first carrier 154 to the first processing station 102 in response to transferring 190 the first carrier 154 from the second transport carrier 178 to the first processing station 102. In some embodiments, when the first carrier 154 is docked onto the first loading port, the first semiconductor wafer 204 is unloaded from the first carrier 154 and inserted into the first processing station 102. In some embodiments, after the first semiconductor wafer 204 is inserted into the first processing station 102, a first process is performed on the first semiconductor wafer 204 using the first processing station 102 to produce a first processed semiconductor wafer. In some embodiments, the first process includes a cleaning process, and the first processed semiconductor wafer includes a cleaned semiconductor wafer produced by performing the cleaning process on the first semiconductor wafer 204. Other types of processes for the first process are also within the scope of the present disclosure. In some embodiments, the first process includes at least one of a PVD process, a plating process, an etching process, a lithography process, a CMP process, a CVD process, a thermal process, or another process. In some embodiments, in response to producing a first processed semiconductor wafer by performing the first process on the first semiconductor wafer 204, the first processed semiconductor wafer is removed from the first processing station 102 and loaded into a first carrier 154 (e.g., a wafer storage device). In some embodiments, a plurality of semiconductor wafers are processed at one time using the first processing station 102. In some embodiments, a single semiconductor wafer is processed at one time using the first processing station 102. In some embodiments, the first processing station 102 is used to perform the first process on each semiconductor wafer of one, some, or all semiconductor wafers stored in the first carrier 154 to produce a group of one or more processed semiconductor wafers, and the group of one or more processed semiconductor wafers is loaded into the first carrier 154. In some embodiments, the group of one or more processed semiconductor wafers includes the first processed semiconductor wafer.

[0052] In some embodiments, after the first carrier 154 is transferred 190 from the second transport carrier 178 to the first processing station 102, the second transport carrier 178 may be used to perform a second transport operation for transporting a second carrier (not shown) different from the first carrier 154. In some embodiments, in response to the transfer 190 of the first carrier 154 from the second transport carrier 178 to the first processing station 102, the second transport carrier 178 travels from the sixth position of the first track 112 to a different position. In some embodiments, in response to the transfer 190 of the first carrier 154 from the second transport carrier 178 to the first processing station 102, the controller 115 instructs the second transport carrier 178 to perform the second transport operation for transporting the second carrier. In some embodiments, in response to the transfer 190 of the first carrier 154 from the second transport carrier 178 to the first processing station 102, the controller 115 changes the state of the second transport carrier 178 from an occupied state to an available state. In some embodiments, when the second transport carrier 178 is in an available state, the controller 115 includes the second transport carrier 178 in the list of available transport carriers. In some embodiments, in response to identifying a second transport operation associated with transporting the second carrier, the controller 115 selects the second transport carrier 178 from the list of available transport carriers to perform the second transport operation. In some embodiments, in response to selecting the second transport carrier 178, the controller 115 instructs the second transport carrier 178 to perform the second transport operation. In some embodiments, after the first carrier 154 is transferred 190 from the second transport carrier 178 to the first processing station 102, the second transport carrier 178 leaves the first track 112. In some embodiments, the second transport carrier 178 leaves the first track 112 to perform the second transport operation.

[0053] Fig. 1IA fourth movement operation of the third transport carrier 180 according to some embodiments is illustrated. In some embodiments, the fourth movement operation includes movement of the third transport carrier 180 along the fourth travel path 192. In some embodiments, in the fourth movement operation, the third transport carrier 180 travels from the fourth position of the second track 104 to the seventh position of the first track 112. In some embodiments, the seventh position of the first track 112 is substantially the same as the sixth position of the first track 112. In some embodiments, the third transport carrier 180 travels to the seventh position of the first track 112 in response to at least one of the following situations: the first processing station 102 uses the first semiconductor wafer 204 to produce a first processed semiconductor wafer or the first processed semiconductor wafer is loaded into the first carrier 154. In some embodiments, the third transport carrier 180 travels to the seventh position of the first track 112 in response to an indication that the first process performed by the first processing station 102 is completed. In some embodiments, the controller 115 instructs the third transport carrier 180 to travel to the seventh position of the first track 112. Embodiments are contemplated in which the third transport vehicle 180 travels from a position different from the fourth position of the second track 104 to the seventh position of the first track 112. In some embodiments, the third transport vehicle 180 travels from the second track 104 to the first track 112 via the second joint 110. In some embodiments, the controller 115 controls the second conversion assembly of the second joint 110 to facilitate conversion of the third transport vehicle 180 from traveling along the second track 104 to traveling along the first track 112.

[0054] Figure 1JThe first carrier 154 is transferred 194 from the first processing station 102 to the third transport carrier 180 according to some embodiments. In some embodiments, the first carrier 154 is transferred 194 from the first processing station 102 to the third transport carrier 180 in response to at least one of the following: the third transport carrier 180 reaches the seventh position of the first track 112, the first processing station 102 uses the first semiconductor wafer 204 to produce a first processed semiconductor wafer, or the first processed semiconductor wafer is loaded into the first carrier 154. In some embodiments, the seventh position of the first track 112 is close to the first processing station 102. In some embodiments, the first carrier 154 is transferred 194 from the first processing station 102 to the third transport carrier 180 when the first carrier 154 carries the first processed semiconductor wafer or at least one of the group of one or more processed semiconductor wafers including the first processed semiconductor wafer. In some embodiments, the first carrier 154 is transferred 194 from the first processing station 102 to the third transport carrier 180 when the third transport carrier 180 is engaged with the first track 112 (e.g., when one or more guide wheels of the third transport carrier 180 have at least one of the following characteristics: connected to the first track 112, directly in contact with the first track 112, or indirectly in contact with the first track 112). In some embodiments, the third transport carrier 180 includes a third carrier support assembly (not shown). In some embodiments, the third carrier support assembly includes at least one of a belt and pulley system, a robot, a base, or another suitable assembly. In some embodiments, the third carrier support assembly selectively engages with the first carrier 154. In some embodiments, the first carrier 154 is transferred 194 from the first processing station 102 to the third transport carrier 180 using the third carrier support assembly. In some embodiments, the first carrier 154 is transferred 194 from the first processing station 102 to the third transport carrier 180 by a first transfer operation. In some embodiments, the third transport carrier 180 receives the first carrier 154 by a first transfer operation. In some embodiments, during the first transfer operation, the third carrier support assembly of the third transport vehicle 180 engages with the first carrier 154 .

[0055] Figure 1KA fifth movement operation of the third transport carrier 180 is illustrated according to some embodiments. In some embodiments, the fifth movement operation includes movement of the third transport carrier 180 along the fifth travel path 103. In some embodiments, in the fifth movement operation, the third transport carrier 180 travels from the seventh position of the first track 112 to the eighth position of the eighth track 142. In some embodiments, in response to transferring 194 the first carrier 154 from the first processing station 102 to the third transport carrier 180, the third transport carrier 180 travels from the seventh position of the first track 112 to the eighth position of the eighth track 142. In some embodiments, the third transport carrier 180 travels from the seventh position of the first track 112 to the eighth position of the eighth track 142 in response to the completion of the first transfer operation. In some embodiments, in response to transferring 194 the first carrier 154 from the first processing station 102 to the third transport carrier 180, the controller 115 instructs the third transport carrier 180 to travel to the eighth position of the eighth track 142. In some embodiments, the third transport vehicle 180 travels from the first track 112 to the eighth track 142 via the seventh joint 117 connecting the first track 112 to the eighth track 142. In some embodiments, the seventh joint 117 includes a seventh conversion component (not shown) that facilitates converting the transport vehicle from traveling along the first track 112 to traveling along the eighth track 142, such as at least one of a branch, a switch, etc. In some embodiments, the controller 115 controls the seventh conversion component of the seventh joint 117 to facilitate converting the third transport vehicle 180 from traveling along the first track 112 to traveling along the eighth track 142.

[0056] In some embodiments, the joint management controller is configured to manage the movement of the transport carrier along the eighth track 142. In some embodiments, the controller 115 includes a joint management controller. In some embodiments, the first processing station 102 includes a joint management controller. In some embodiments, the joint management controller is configured to manage the movement of the transport carrier along the first portion 142a of the eighth track 142, and the first track 112 is connected to the first portion 142a of the eighth track 142 via the seventh joint 117. In some embodiments, the third transport carrier 180 travels along the first portion 142a of the eighth track 142 in the fifth movement operation.

[0057] In some embodiments, the joint management controller is configured to manage the movement of the transport carrier along the eighth track 142 based on the first transfer operation. In some embodiments, the joint management controller enables one or more first transport carriers of the automated material handling system 100 to travel along the first portion 142a of the eighth track 142 when the first carrier 154 is received using the third carrier support assembly. In some embodiments, the joint management controller enables the one or more first transport carriers to travel along the first portion 142a of the eighth track 142 based on the first transfer operation being in progress and / or incomplete. In some embodiments, the joint management controller enables the one or more first transport carriers to travel along the first portion 142a of the eighth track 142 when the first transfer operation is performed using at least one of the third transport carrier 180 or the first processing station 102.

[0058] Return to reference Figure 1J In some embodiments, the joint management controller enables the fourth transport vehicle 196 of the automated material handling system 100 to travel along the first portion 142a of the eighth track 142 when the first carrier 154 is received using the third carrier support assembly. In some embodiments, the joint management controller enables the fourth transport vehicle 196 to travel along the first portion 142a of the eighth track 142 based on the first transfer operation being in progress and / or incomplete, such as along the travel path 198. In some embodiments, the joint management controller enables the fourth transport vehicle 196 to travel along the first portion 142a of the eighth track 142 when the first transfer operation is performed using at least one of the third transport vehicle 180 or the first processing station 102. In some embodiments, during the first transfer operation, the joint management controller enables the fourth transport vehicle 196 to travel along the first portion 142a of the eighth track 142 regardless of whether the priority associated with the fourth transport vehicle 196 is greater than the first priority associated with at least one of the third transport vehicle 180 or the first carrier 154 transported using the third transport vehicle 180.

[0059] In some embodiments, in response to receiving the first carrier 154 using the third carrier support assembly, the joint management controller prevents one or more second transport vehicles of the automated material handling system 100 from traveling along the first portion 142a of the eighth track 142. In some embodiments, the joint management controller prevents the one or more second transport vehicles from traveling along the first portion 142a of the eighth track 142 based on the completion of the first transfer operation. In some embodiments, the joint management controller prevents the one or more second transport vehicles from traveling along the first portion 142a of the eighth track 142 in response to the completion of the first transfer operation. In some embodiments, the joint management controller prevents the one or more second transport vehicles from traveling along the first portion 142a of the eighth track 142 during the fifth move operation to enable the third transport vehicle 180 to travel from the first track 112 to the eighth track 142 via the seventh joint 117.

[0060] Return to reference Figure 1K In some embodiments, upon receiving the first carrier 154 using the third carrier support assembly, the joint management controller blocks the fifth transport vehicle 105 of the automated material handling system 100 from traveling along the first portion 142a of the eighth track 142. In some embodiments, the joint management controller blocks the fifth transport vehicle 105 from traveling along the first portion 142a of the eighth track 142 based on the completion of the first transfer operation. In some embodiments, the joint management controller blocks the fifth transport vehicle 105 from traveling along the first portion 142a of the eighth track 142 in response to the completion of the first transfer operation. In some embodiments, the joint management controller blocks the fifth transport vehicle 105 from traveling along the first portion 142a of the eighth track 142 during the fifth move operation to enable the third transport vehicle 180 to travel from the first track 112 to the eighth track 142 via the seventh joint 117.

[0061] In some embodiments, the joint management controller blocks the fifth transport vehicle 105 from traveling along the first portion 142a of the eighth track 142 based on a first priority level associated with at least one of the third transport vehicle 180 or the first carrier 154 transported using the third transport vehicle 180 being greater than a second priority level associated with at least one of the fifth transport vehicle 105 or the carrier (not shown) transported using the fifth transport vehicle 105. In some embodiments, the joint management controller enables the fifth transport vehicle 105 to travel along the first portion 142a of the eighth track 142 in response to the third transport vehicle 180 traveling from the first track 112 to the eighth track 142 via the seventh joint 117 in the fifth movement operation. In some embodiments, the joint management controller enables the fifth transport vehicle 105 to travel along the first portion 142a of the eighth track 142 in response to the third transport vehicle 180 completing the fifth movement operation.

[0062] In some embodiments, the first priority is based on at least one of: (i) a scheduled time for a subsequent process scheduled to be performed on a semiconductor wafer stored in the first carrier 154 (e.g., a first processed semiconductor wafer); (ii) a scheduled production time corresponding to a time scheduled to complete the fabrication of the semiconductor wafer stored in the first carrier 154; (iii) a delivery time requirement corresponding to a duration required to deliver the first carrier to a processing station, a stock location, or another location; (iv) a sensitivity of the first processed semiconductor wafer stored in the first carrier 154; (v) a priority value assigned to at least one of the first carrier 154 or the first processed semiconductor wafer stored in the first carrier 154; (vi) a scheduled production time; or (vii) other suitable information.

[0063] Figure 1L1. Communications between one or more components of the automated material handling system 100 are illustrated according to some embodiments. In some embodiments, the automated material handling system 100 includes at least one of a manufacturing execution system (MES) 121, a material control system (MCS) 123, a material control planner (MCP) 125, a transport controller 127 (e.g., an overhead hoist transport (OHT) controller), one or more transport vehicles 129 (e.g., one or more OHT vehicles), a joint management controller (shown using reference number 131), or a communication system 133. In some embodiments, the controller 115 includes the joint management controller 131. In some embodiments, the first processing station 102 includes the joint management controller 131. In some embodiments, the communication system 133 includes at least one of a wired communication system, a wireless communication system, a Bluetooth communication system, a wireless fidelity (WiFi) communication system, an E84 communication system, or another type of communication system. In some embodiments, the components of the automated material handling system 100 communicate with each other using the communication system 133. In some embodiments, the joint management controller 131 communicates 151 with the one or more transport vehicles 129 using the communication system 133. In some embodiments, the joint management controller 131 communicates 161 with the MES 121 using at least one of the communication system 133 or another communication system.

[0064] In some embodiments, the one or more transport vehicles 129 include at least one of a transport vehicle TV1, a transport vehicle TV2, or a transport vehicle TV3. In some embodiments, the transfer operation 135 is performed by the transport vehicle TV1 and the first processing station 102. In some embodiments, the transport vehicle TV2 has at least one of the following features: traveling along the eighth track 142, engaging with the eighth track 142, or being scheduled to travel along the eighth track 142. In some embodiments, in response to the transfer operation 135 not being completed 157, the joint management controller 131 performs at least one of the following operations: (i) instructing the transport vehicle TV1 to complete the transfer operation 135; or (ii) instructing the transport vehicle TV2 to travel along the first portion 142a of the eighth track 142 associated with the seventh joint 117. In some embodiments, the transport vehicle TV3 has at least one of the following features: traveling along the eighth track 142, engaging with the eighth track 142, or being scheduled to travel along the eighth track 142. In some embodiments, in response to the transfer operation 135 being completed 159, the joint management controller 131 performs at least one of the following operations: (i) instructing the transport vehicle TV1 to move along the first portion 142a of the eighth track 142 associated with the seventh joint 117; or (ii) instructing the transport vehicle TV3 to perform at least one of the following operations: (A) waiting for the transport vehicle TV1 to release the seventh joint 117; or (B) moving along the first portion 142a of the eighth track 142 associated with the seventh joint 117 after the transport vehicle TV1 releases the seventh joint 117.

[0065] In some embodiments, the transfer operation 135 includes transferring the carrier from the first processing station 102 to the transport vehicle TV1. In some embodiments, at least one of the following conditions exists: the transport vehicle TV1 includes the third transport vehicle 180, the transport vehicle TV2 includes the fourth transport vehicle 196, or the transport vehicle TV3 includes the fifth transport vehicle 105. In some embodiments, the transfer operation 135 includes transferring 194 (at the first processing station 102) the first carrier 154 from the first processing station 102 to the transport vehicle TV1. Figure 1J ) to a third transport vehicle 180.

[0066] In some embodiments, the transfer operation 135 includes transferring a carrier from a transport vehicle TV1 to a first processing station 102. In some embodiments, the transport vehicle TV1 includes a second transport vehicle 178. In some embodiments, the transfer operation 135 includes transferring 190 a first carrier 154 from the second transport vehicle 178 to the first processing station 102. In some embodiments, during the transfer 190 of the first carrier 154 from the second transport vehicle 178 to the first processing station 102, the joint management controller 131 enables the transport vehicle TV2 to travel along the first portion 142a of the eighth track 142 associated with the seventh joint 117. In some embodiments, in response to completing the transfer 190 of the first carrier 154 from the second transport vehicle 178 to the first processing station 102, the joint management controller 131 prevents the transport vehicle TV3 from traveling along the first portion 142a of the eighth track 142 associated with the seventh joint 117, so that the second transport vehicle 178 can travel from the first track 112 to the eighth track 142 via the seventh joint 117.

[0067] In some embodiments, the first transport track system 150 includes one or more track coupling components. In some embodiments, the first track 112 includes the one or more track coupling components. In some embodiments, the one or more track coupling components include the first track coupling component 132, the second track coupling component 134, the third track coupling component 136, the fourth track coupling component 138, or one or more other track coupling components. In some embodiments, the supplemental track is connected to the first track 112 via the one or more track coupling components. In some embodiments, the supplemental track has one or more of the features, structures, etc. of the second track 104.

[0068] Figure 1MThe first track assembly 171 is shown coupled 175 to the first track 112 via the first track coupling component 132 and the second track coupling component 134 according to some embodiments. In some embodiments, the first track assembly 171 includes at least one of the first supplemental track 173 or the first set of supplemental buffer support components. In some embodiments, the first supplemental track 173 has one or more of the features, structures, relationships with other elements, etc. provided herein for the second track 104. In some embodiments, the first set of supplemental buffer support components has one or more of the features, structures, relationships with other elements, etc. provided herein for the one or more first buffer support components. In some embodiments, the first supplemental track 173 can be attached to the first track 112 and / or can be removed from the first track 112. In some embodiments, the first track assembly 171 is used to serve a first supplemental processing station (not shown). In some embodiments, the first supplemental processing station is located between the second track 104 and the first supplemental track 173. In some embodiments, the first supplemental track 173 is coupled 175 to the first track 112 in response to a first equipment change in a semiconductor manufacturing environment. In some embodiments, the first equipment change includes at least one of adding a first supplemental processing station to the semiconductor manufacturing environment or positioning the first supplemental processing station proximate to the first track 112 .

[0069] In some embodiments, the second track assembly 177 is coupled 181 to the first track 112 via the third track coupling component 136 and the fourth track coupling component 138 according to some embodiments. In some embodiments, the second track assembly 177 includes at least one of a second supplemental track 179 or a second set of supplemental buffer support components. In some embodiments, the second supplemental track 179 has one or more of the features, structures, relationships with other elements, etc. provided herein for the second track 104. In some embodiments, the second set of supplemental buffer support components has one or more of the features, structures, relationships with other elements, etc. provided herein for the one or more first buffer support components. In some embodiments, the second supplemental track 179 can be attached to the first track 112 and / or can be removed from the first track 112. In some embodiments, the second track assembly 177 is used to serve a second supplemental processing station (not shown). In some embodiments, the second supplemental processing station is located between the first supplemental track 173 and the second supplemental track 179. In some embodiments, the second supplemental track 179 is coupled 181 to the first track 112 in response to a second equipment change in the semiconductor manufacturing environment. In some embodiments, the second equipment change includes at least one of adding a second supplemental processing station to the semiconductor manufacturing environment or positioning the second supplemental processing station proximate to the first track 112 .

[0070] In some embodiments, the second track 104 can be detached from the first track 112 and / or attached to the first track 112 via one or more first track coupling components (not shown) of the one or more track coupling components. In some embodiments, the one or more first track coupling components include at least a portion of the first coupling portion 108 or the second coupling portion 110. In some embodiments, the second track 104 is detached from the first track 112 in response to a third equipment change in the semiconductor manufacturing environment. In some embodiments, the third equipment change includes at least one of the following operations: removing the first processing station 102 from the semiconductor manufacturing environment or moving the first processing station 102 to another location in the semiconductor manufacturing environment.

[0071] Figure 3 A perspective view of a second transport vehicle 178 and a third transport vehicle 180 engaged with a second track 104 according to some embodiments is illustrated. In some embodiments, at least one of the height level of the second transport vehicle 178 or the height level of the third transport vehicle 180 is higher than at least one of the height level of the first buffer support component 106a, the height level of the second buffer support component 106b, the height level of the third buffer support component 106c, or the height level of the fourth buffer support component 106d. In some embodiments, at least one of the height level of the second transport vehicle 178 or the height level of the third transport vehicle 180 is substantially the same as at least one of the height level of the first buffer support component 106a, the height level of the second buffer support component 106b, the height level of the third buffer support component 106c, or the height level of the fourth buffer support component 106d. In some embodiments, at least one of the height level of the second transport vehicle 178 or the height level of the third transport vehicle 180 is lower than at least one of the height level of the first buffer support component 106a, the height level of the second buffer support component 106b, the height level of the third buffer support component 106c, or the height level of the fourth buffer support component 106d.

[0072] In some embodiments, at least some of the cushioning support assemblies of the automated material handling system 100 have one or more of the features, structures, relationships with other elements, etc. provided herein for the one or more first cushioning support assemblies.

[0073] Figure 4 The automated material handling system 100 is illustrated with a second transport rail system 450 according to some embodiments. In some embodiments, the second transport rail system 450 is configured to facilitate the movement of a transport vehicle to transport semiconductor wafers to one or more locations within a semiconductor manufacturing environment. In some embodiments, the controller 115 is configured to manage the movement of the transport vehicle along one or more rails of the second transport rail system 450. In some embodiments, Figure 4 Shown in and / or for Figure 4 Some or all of the components discussed herein have Figures 1A to 1M Some or all of the features, structures, relationships with other elements, etc. provided.

[0074] In some embodiments, the semiconductor manufacturing environment includes a second processing station 402. In some embodiments, the second processing station 402 includes a semiconductor fabrication station. In some embodiments, the second processing station 402 is configured to perform processes such as semiconductor fabrication procedures on semiconductor wafers. In some embodiments, the second processing station 402 includes at least one of a cleaning device, a PVD device, a plating device, an etching device, a lithography device, a CMP device, a CVD device, a furnace, or another device.

[0075] In some embodiments, the second transport track system 450 includes a second plurality of tracks. In some embodiments, one, some, or all of the second plurality of tracks each include one or more rails, waterways, sidewalls, etc. and are configured to accommodate a transport vehicle of the automated material handling system 100. In some embodiments, one, some, or all of the second plurality of tracks each include at least one of metal, phenolic resin, nylon, or another suitable material. In some embodiments, at least one of the second plurality of tracks is suspended from the top plate. In some embodiments, at least one of the second plurality of tracks is erected relative to at least one of the bottom plate or the wall. In some embodiments, at least one of the second plurality of tracks is erected using a grating support structure.

[0076] In some embodiments, the second plurality of tracks includes at least one of the first track 412, the second track 416, the third track 414, the fourth track 446, the fifth track 426, the sixth track 428, the seventh track 430, the eighth track 442, the ninth track 444, or one or more other suitable tracks. In some embodiments, the second transport track system 450 includes a plurality of track system segments. In some embodiments, the plurality of track system segments include at least one of the first track system segment 440, the second track system segment 448, or one or more other suitable track system segments. In some embodiments, the first track system segment 440 includes an intra-compartment segment for transporting a carrier from one location within a compartment to another location within the (same) compartment. In some embodiments, the first track system segment 440 includes at least one of the first track 412, the second track 416, the third track 414, the fifth track 426, the sixth track 428, or one or more other suitable tracks. In some embodiments, the second track system segment 448 includes an inter-compartment segment for transporting a carrier from a first compartment to a second compartment different from the first compartment. In some embodiments, second track system segment 448 includes at least one of eighth track 442, ninth track 444, fourth track 446, or one or more other suitable tracks.

[0077] In some embodiments, a transport vehicle of the automated material handling system 100 travels along a first track 412. According to some embodiments, guide rails, guard rails, etc. are used to maintain the transport vehicle on the first track 412. In some embodiments, the first track 412 is configured to facilitate movement of the transport vehicle in a first direction 462. In some embodiments, the third track 414 is configured to facilitate movement of the transport vehicle in a second direction 464 that is different from the first direction 462. In some embodiments, the second direction 464 is opposite to the first direction 462.

[0078] In some embodiments, the second track 416 is connected to the first track 412 via at least one of the first joint 418 or the second joint 420. In some embodiments, the second track 416 is connected to the third track 414 via at least one of the third joint 422 or the fourth joint 424. In some embodiments, the second track 416 includes a track loop, such as an inner track loop of the first track system segment 440. In some embodiments, the second track 416 includes a first portion 416a and a second portion 416b. In some embodiments, the first portion 416a of the second track 416 is substantially parallel to the second portion 416b of the second track 416. In some embodiments, the first portion 416a of the second track 416 is configured to facilitate movement of the transport vehicle in a third direction 466. In some embodiments, the second portion 416b of the second track 416 is configured to facilitate movement of the transport vehicle in a fourth direction 468 that is different from the third direction 466. In some embodiments, the fourth direction 468 is opposite to the third direction 466. In some embodiments, at least one of the third direction 466 or the fourth direction 468 is substantially parallel to at least one of the first direction 462 or the second direction 464. In some embodiments, the first joint 418 includes a first conversion component (not shown) that facilitates converting the transport vehicle from traveling along the second track 416 to traveling along the first track 412, such as at least one of a shunt, a switch, etc. In some embodiments, the second joint 420 includes a second conversion component (not shown) that facilitates converting the transport vehicle from traveling along the first track 412 to traveling along the second track 416, such as at least one of a shunt, a switch, etc. In some embodiments, the third joint 422 includes a fifth conversion component (not shown) that facilitates converting the transport vehicle from traveling along the third track 414 to traveling along the second track 416, such as at least one of a shunt, a switch, etc. In some embodiments, the fourth joint 424 includes a fourth conversion component (not shown) that facilitates converting the transport vehicle from traveling along the second track 416 to traveling along the third track 414, such as at least one of a shunt, a switch, etc.

[0079] In some embodiments, the automated material handling system 100 includes one or more second buffer support assemblies, the one or more second buffer support assemblies including at least one of the first buffer support assembly 406a, the second buffer support assembly 406b, the third buffer support assembly 406c, or the fourth buffer support assembly 406d. In some embodiments, the one or more second buffer support assemblies include at least one of the first group of buffer support assemblies 480 or the second group of buffer support assemblies 482. In some embodiments, the first group of buffer support assemblies 480 includes buffer support assemblies near the first portion 416a of the second track 416, such as a row of buffer support assemblies. In some embodiments, the second group of buffer support assemblies 482 includes buffer support assemblies near the second portion 416b of the second track 416, such as a row of buffer support assemblies. In some embodiments, the one or more second buffer support assemblies are used to temporarily store one or more carriers carrying one or more semiconductor wafers, which are waiting to be received and / or processed using the second processing station 402.

[0080] In some embodiments, a buffer support assembly of the one or more second buffer support assemblies is used to store a carrier that is scheduled to undergo a process performed using the second processing station 402. In some embodiments, the buffer support assembly is used to store the carrier during a time period before the time when the second processing station 402 is scheduled to receive and / or process the carrier. In some embodiments, the buffer support assembly is used to store the carrier when the second processing station 402 is in at least one of an occupied state or a state of not receiving a semiconductor wafer carried by the carrier. In some embodiments, the buffer support assembly is used to store the carrier during downtime between a previous process performed on a semiconductor wafer carried by the carrier and a subsequent process scheduled to be performed on the semiconductor wafer using the second processing station 402. In some embodiments, the carrier is transferred from the buffer support assembly to the second processing station 402 in response to the second processing station 402 becoming available to receive a semiconductor wafer.

[0081] In some embodiments, one or more of the one or more second buffer support assemblies are used to store one or more carriers. In some embodiments, the one or more carriers include at least one of carrier 403a, carrier 403b, or carrier 403c. In some embodiments, the automated material handling system 100 includes a transport carrier 478 that travels from the second track 416 to the first track 412 along the travel path 472 to transfer the carrier 403b to the second processing station 402 after receiving the carrier 403b from the third buffer support assembly 406c. In some embodiments, the automated material handling system 100 includes at least one of transport carrier 415, transport carrier 484, transport carrier 488, transport carrier 490, or transport carrier 492.

[0082] Figure 5 The automated material handling system 100 is illustrated with a third transport rail system 550 according to some embodiments. In some embodiments, the third transport rail system 550 is configured to facilitate the movement of a transport vehicle to transport semiconductor wafers to one or more locations within a semiconductor manufacturing environment. In some embodiments, the controller 115 is configured to manage the movement of the transport vehicle along one or more rails of the third transport rail system 550. In some embodiments, Figure 5 Shown in and / or for Figure 5 Some or all of the components discussed herein have Figures 1A to 1M Some or all of the features, structures, relationships with other elements, etc. provided.

[0083] In some embodiments, the semiconductor manufacturing environment includes at least one of the third processing station 502 or the fourth processing station 504. In some embodiments, the third processing station 502 includes a semiconductor fabrication station. In some embodiments, the third processing station 502 is configured to perform processes such as semiconductor fabrication procedures on semiconductor wafers. In some embodiments, the third processing station 502 includes at least one of a cleaning device, a PVD device, a plating device, an etching device, a lithography device, a CMP device, a CVD device, a furnace, or another device. In some embodiments, the fourth processing station 504 includes a semiconductor fabrication station. In some embodiments, the fourth processing station 504 is configured to perform processes such as semiconductor fabrication procedures on semiconductor wafers. In some embodiments, the fourth processing station 504 includes at least one of a cleaning device, a PVD device, a plating device, an etching device, a lithography device, a CMP device, a CVD device, a furnace, or another device.

[0084] In some embodiments, the third transport track system 550 includes a third plurality of tracks. In some embodiments, one, some, or all of the third plurality of tracks each include one or more rails, waterways, sidewalls, etc. and are configured to accommodate a transport vehicle of the automated material handling system 100. In some embodiments, one, some, or all of the third plurality of tracks each include at least one of metal, phenolic resin, nylon, or another suitable material. In some embodiments, at least one of the third plurality of tracks is suspended from the top plate. In some embodiments, at least one of the third plurality of tracks is erected relative to at least one of the bottom plate or the wall. In some embodiments, at least one of the third plurality of tracks is erected using a grating support structure.

[0085] In some embodiments, the third plurality of tracks includes at least one of the first track 512, the second track 516, the third track 514, the fourth track 546, the fifth track 526, the sixth track 528, the seventh track 530, the eighth track 542, the ninth track 544, the tenth track 522, the eleventh track 532, the twelfth track 524, the thirteenth track 536, the fourteenth track 558, or one or more other suitable tracks. In some embodiments, the third transport track system 550 includes a plurality of track system segments. In some embodiments, the plurality of track system segments includes at least one of the first track system segment 540, the second track system segment 548, the third track system segment 552, or one or more other suitable track system segments. In some embodiments, the first track system segment 540 includes an intra-compartment segment for transporting a carrier from one location within the first compartment to another location within the first compartment. In some embodiments, the first track system segment 540 includes at least one of the first track 512, the second track 516, the third track 514, the fifth track 526, the sixth track 528, or one or more other suitable tracks. In some embodiments, the second track system segment 548 includes an inter-compartment segment for transporting a carrier from a first compartment to a second compartment different from the first compartment. In some embodiments, the second track system segment 548 includes at least one of the eighth track 542, the ninth track 544, the fourth track 546, or one or more other suitable tracks. In some embodiments, the third track system segment 552 includes an intra-compartment segment for transporting a carrier from one position in the second compartment to another position in the second compartment. In some embodiments, the third track system segment 552 includes at least one of the tenth track 522, the eleventh track 532, the twelfth track 524, the thirteenth track 536, the fourteenth track 558, or one or more other suitable tracks. In some embodiments, the second track 516 has at least one of the following features: removable from the first track 512 or attachable to the first track 512. In some embodiments, the eleventh rail 532 has at least one of the following features: detachable from the tenth rail 522 or attachable to the tenth rail 522 .

[0086] In some embodiments, a transport vehicle of the automated material handling system 100 travels along a first track 512. According to some embodiments, guide rails, guard rails, etc. are used to maintain the transport vehicle on the first track 512. In some embodiments, the first track 512 is configured to facilitate movement of the transport vehicle in a first direction 562. In some embodiments, the third track 514 is configured to facilitate movement of the transport vehicle in a second direction 564 that is different from the first direction 562. In some embodiments, the second direction 564 is opposite to the first direction 562.

[0087] In some embodiments, the second track 516 is connected to the first track 512 via at least one of the first joint 518 or the second joint 520. In some embodiments, the second track 516 includes a side track. In some embodiments, the second track 516 includes a track loop. In some embodiments, the second track 516 is configured to facilitate movement of the transport vehicle in the third direction 565. In some embodiments, the first joint 518 includes a first conversion component (not shown) that facilitates conversion of the transport vehicle along the second track 516 to travel along the first track 512, such as at least one of a shunt, a turnout, etc. In some embodiments, the second joint 520 includes a second conversion component (not shown) that facilitates conversion of the transport vehicle along the first track 512 to travel along the second track 516, such as at least one of a shunt, a turnout, etc.

[0088] In some embodiments, the automated material handling system 100 includes one or more third buffer support assemblies, the one or more third buffer support assemblies including at least one of the first buffer support assembly 506a, the second buffer support assembly 506b, the third buffer support assembly 506c, the fourth buffer support assembly 506d, the fifth buffer support assembly 506e, or the sixth buffer support assembly 506f. In some embodiments, a buffer support assembly of the one or more third buffer support assemblies is used to store carriers scheduled for undergoing a process performed using the third processing station 502. In some embodiments, the buffer support assembly is used to store the carriers during a time period before the time when the third processing station 502 is scheduled for receiving and / or processing the carriers. In some embodiments, the buffer support assembly is used to store the carriers when the third processing station 502 is in at least one of an occupied state or a state of not receiving semiconductor wafers carried by the carriers. In some embodiments, the buffer support assembly is used to store the carriers during a downtime between a previous process performed on the semiconductor wafers carried by the carriers and a subsequent process scheduled for performing on the semiconductor wafers using the third processing station 502. In some embodiments, the carrier is transferred from the buffer support assembly to the third processing station 502 in response to the third processing station 502 becoming available to receive the semiconductor wafer.

[0089] In some embodiments, a transport vehicle of the automated material handling system 100 travels along the tenth track 522. According to some embodiments, the transport vehicle is maintained on the tenth track 522 using guide rails, guard rails, etc. In some embodiments, the tenth track 522 is configured to facilitate movement of the transport vehicle in a fourth direction 566. In some embodiments, the twelfth track 524 is configured to facilitate movement of the transport vehicle in a fifth direction 568 that is different from the fourth direction 566. In some embodiments, the fifth direction 568 is opposite to the fourth direction 566.

[0090] In some embodiments, the eleventh track 532 is connected to the tenth track 522 via at least one of the third joint 519 or the fourth joint 521. In some embodiments, the eleventh track 532 includes a side track. In some embodiments, the eleventh track 532 includes a track loop. In some embodiments, the eleventh track 532 is configured to facilitate the movement of the transport vehicle in the sixth direction 569. In some embodiments, the third joint 519 includes a third conversion component (not shown) that facilitates the conversion of the transport vehicle along the eleventh track 532 to the tenth track 522, such as at least one of a shunt, a turnout, etc. In some embodiments, the fourth joint 521 includes a fourth conversion component (not shown) that facilitates the conversion of the transport vehicle along the tenth track 522 to the eleventh track 532, such as at least one of a shunt, a turnout, etc.

[0091] In some embodiments, the automated material handling system 100 includes one or more fourth buffer support assemblies, the one or more fourth buffer support assemblies including at least one of the seventh buffer support assembly 505a, the eighth buffer support assembly 505b, the ninth buffer support assembly 505c, the tenth buffer support assembly 505d, the eleventh buffer support assembly 505e, or the twelfth buffer support assembly 505f. In some embodiments, a buffer support assembly of the one or more fourth buffer support assemblies is used to store carriers scheduled for undergoing a process performed using the fourth processing station 504. In some embodiments, the buffer support assembly is used to store the carriers during a time period before the time when the fourth processing station 504 is scheduled for receiving and / or processing the carriers. In some embodiments, the buffer support assembly is used to store the carriers when the fourth processing station 504 is in at least one of an occupied state or a state of not receiving semiconductor wafers carried by the carriers. In some embodiments, the buffer support assembly is used to store the carriers during a downtime between a previous process performed on the semiconductor wafers carried by the carriers and a subsequent process scheduled for performing on the semiconductor wafers using the fourth processing station 504. In some embodiments, the carrier is transferred from the buffer support assembly to the fourth processing station 504 in response to the fourth processing station 504 becoming available to receive the semiconductor wafer.

[0092] In some embodiments, automated material handling system 100 includes at least one of transport vehicle 570 , transport vehicle 572 , transport vehicle 574 , transport vehicle 576 , transport vehicle 578 , transport vehicle 580 , transport vehicle 582 , transport vehicle 584 , or transport vehicle 586 .

[0093] Figure 6An automated material handling system 100 is illustrated according to some embodiments. In some embodiments, the automated material handling system 100 includes a transfer automation system 604 and a transport vehicle control system 620. In some embodiments, the transfer automation system 604 includes at least one of a manufacturing execution system (MES) 606, a material control system (MCS) 608, a material control planner (MCP) 610, a transport controller 612 (e.g., an overhead crane transport (OHT) controller), a transport vehicle 614 (e.g., an OHT vehicle), or a processing station 616. In some embodiments, the controller 115 includes the transport controller 612. In some embodiments, the transport vehicle 614 includes at least one of the first transport vehicle 152, the second transport vehicle 178, the third transport vehicle 180, the fourth transport vehicle 196, the fifth transport vehicle 105, or another transport vehicle of the automated material handling system 100. In some embodiments, the processing station 616 includes at least one of the first processing station 102, the second processing station 402, the third processing station 502, or the fourth processing station 504.

[0094] In some embodiments, the transport vehicle control system 620 includes at least one of a flexible route 622 or a communication system 626 (e.g., a smart communication system). In some embodiments, the flexible route 622 includes at least one of the second track 104, the one or more first buffer support assemblies, the second track 416, the one or more second buffer support assemblies, the second track 516, the eleventh track 532, or the one or more third buffer support assemblies. In some embodiments, the communication system 626 includes at least one of a wired communication system, a wireless communication system, a Bluetooth communication system, a WiFi communication system, an E84 communication system, or another type of communication system. In some embodiments, the components of the automated material handling system 100 communicate with each other using the communication system 626. In some embodiments, the transport vehicle 614 communicates 630 with the processing station 616 using the communication system 626. In some embodiments, the transport vehicle control system 620 performs pattern recognition to recognize the pattern of movement of the transport vehicle of the automated material handling system 100 and adjusts one or more parameters of the transport vehicle 614 based on the recognized pattern.

[0095] According to some embodiments, Figure 7700 is illustrated in the example of a method for transporting a first carrier using an automated material handling system. In some embodiments, the automated material handling system includes a first transport carrier, a second transport carrier, a buffer support assembly, and a transport track system, wherein the transport track system includes a first track and a second track connected to the first track via a first joint. At 702, in response to a processing station being scheduled for receiving semiconductor wafers carried by a first carrier, the first transport carrier is moved from the first track to the second track via the first joint when the first carrier is supported by the first carrier support assembly of the first transport carrier. At 704, the first carrier is transferred from the first carrier support assembly to the buffer support assembly when the first transport carrier is engaged with the second track. At 706, in response to the processing station being available for receiving semiconductor wafers, the first carrier is transferred from the buffer support assembly to the second carrier support assembly of the second transport carrier. At 708, the first carrier is transferred from the second carrier support assembly to the processing station.

[0096] In some embodiments, the second track is connected to the first track via the second joint. In some embodiments, in response to transferring the first carrier from the buffer support assembly to the second carrier support assembly, the second transport carrier is moved from the second track to the first track via the second joint. In some embodiments, the first carrier is transferred from the second carrier support assembly to the processing station when the second transport carrier is engaged with the first track.

[0097] In some embodiments, the automated material handling system includes a third transport carrier. In some embodiments, the transport track system includes a third track connected to the first track via a third joint. In some embodiments, a processing station is used to process semiconductor wafers to produce processed semiconductor wafers. In some embodiments, the processed semiconductor wafers are loaded into a first carrier. In some embodiments, in response to loading the processed semiconductor wafers into the first carrier, the first carrier is transferred from the processing station to a third carrier support assembly of the third transport carrier. In some embodiments, in response to loading the processed semiconductor wafers into the first carrier, the first carrier is transferred from the processing station to a third carrier support assembly of the third transport carrier. In some embodiments, in response to transferring the first carrier from the processing station to the third carrier support assembly, the third transport carrier is moved from the first track to the third track via the third joint.

[0098] In some embodiments, upon receipt of the first carrier at the third carrier support assembly, the fourth transport carrier is enabled to travel along the third track. In some embodiments, the fourth transport carrier is enabled to travel along the third track during a transfer operation of the third carrier support assembly to transfer the first carrier from the processing station to the third transport carrier. In some embodiments, the fourth transport carrier is enabled to travel along the third track based on the first transfer operation being in progress and / or incomplete. In some embodiments, the fifth transport carrier is prevented from traveling along the third track in response to receipt of the first carrier by the third carrier support assembly so that the third transport carrier can travel from the first track to the third track via the third joint. In some embodiments, the fifth transport carrier is prevented from traveling along the third track in response to completion of the first transport operation.

[0099] In some embodiments, the transport track system discussed with respect to method 700 includes: Figures 1A to 1M Shown in and / or for Figures 1A to 1M In some embodiments, at least one of the following conditions exists: (i) the first transport vehicle discussed for method 700 includes first transport vehicle 152; (ii) the second transport vehicle discussed for method 700 includes second transport vehicle 178; (iii) the third transport vehicle discussed for method 700 includes third transport vehicle 180; (iv) the fourth transport vehicle discussed for method 700 includes fourth transport vehicle 196; (v) the fifth transport vehicle discussed for method 700 includes fifth transport vehicle 105; (vi) the first track discussed for method 700 includes the third transport vehicle 180; a track 112; (vii) the second track discussed in connection with method 700 includes the second track 104; (viii) the first joint discussed in connection with method 700 includes the first joint 108; (ix) the second joint discussed in connection with method 700 includes the second joint 110; (x) the third track discussed in connection with method 700 includes the eighth track 142; (xi) the processing station discussed in connection with method 700 includes the first processing station 102; or (xii) the buffer support assembly discussed in connection with method 700 includes a buffer support assembly among the one or more first buffer support assemblies.

[0100] In some embodiments, the transport track system discussed with respect to method 700 includes: Figure 4 Shown in and / or for Figure 4The second transport track system 450 discussed. In some embodiments, at least one of the following exists: (i) the first track discussed for method 700 includes at least one of the first track 412 or the third track 414; (ii) the second track discussed for method 700 includes the second track 416; (iii) the first joint discussed for method 700 includes at least one of the second joint 420 or the third joint 422; (iv) the second joint discussed for method 700 includes at least one of the first joint 418 or the fourth joint 424; (v) the third track discussed for method 700 includes the eighth track 442; (vi) the processing station discussed for method 700 includes the second processing station 402; or (vii) the buffer support assembly discussed for method 700 includes a buffer support assembly of the one or more second buffer support assemblies.

[0101] In some embodiments, the transport track system discussed with respect to method 700 includes: Figure 5 Shown in and / or for Figure 5 The third transport track system 550 discussed. In some embodiments, at least one of the following situations exists: (i) the first track discussed for method 700 includes at least one of the first track 512 or the tenth track 522; (ii) the second track discussed for method 700 includes at least one of the second track 516 or the eleventh track 532; (iii) the first joint discussed for method 700 includes at least one of the second joint 520 or the fourth joint 521; (iv) the second joint discussed for method 700 includes at least one of the first joint 518 or the third joint 519; (v) the third track discussed for method 700 includes the eighth track 542; (vi) the processing station discussed for method 700 includes at least one of the third processing station 502 or the fourth processing station 504; or (vii) the buffer support assembly discussed for method 700 includes at least one of the one or more third buffer support assemblies or the one or more fourth buffer support assemblies.

[0102] In some embodiments, the first transport carrier discussed with respect to method 700 is the same transport carrier as the second transport carrier discussed with respect to method 700. For example, according to some embodiments, the same transport carrier used to transfer the first carrier to the buffer support assembly is used to perform at least one of the following operations: receiving the first carrier from the buffer support assembly or transferring the first carrier to the processing station.

[0103] In some embodiments, the second transport vehicle discussed with respect to method 700 is the same transport vehicle as the third transport vehicle discussed with respect to method 700 .

[0104] In some embodiments, the first transport vehicle discussed with respect to method 700 is the same transport vehicle as the third transport vehicle discussed with respect to method 700 .

[0105] One or more embodiments are directed to a computer-readable medium including processor-executable instructions configured to implement one or more of the techniques presented herein. Figure 8 An exemplary computer-readable medium is illustrated in Figure 8 The embodiment 800 includes a computer-readable medium 808 (e.g., a compact disc-recordable (CD-R), a digital versatile disc-recordable (DVD-R), a flash drive, a platter of a hard drive, etc.) having computer-readable data 806 encoded thereon. Such computer-readable data 806 in turn includes a set of processor-executable computer instructions 804, which, when executed by a processor, are configured to implement one or more of the principles described herein. In some embodiments 800, the processor-executable computer instructions 804, when executed by a processor, are configured to implement a method 802, such as at least some of the methods described above. In some embodiments, the processor-executable computer instructions 804, when executed by a processor, are configured to implement a system, such as at least some of the one or more of the systems described above. In some embodiments, the processor-executable computer instructions 804, when executed by a processor, are configured to implement an apparatus, such as at least some of the one or more of the apparatus described above. Numerous such computer-readable media configured to operate in accordance with the techniques presented herein may be devised by those of ordinary skill in the art.

[0106] In some embodiments, an automated material handling system is provided. The automated material handling system includes a first transport carrier, the first transport carrier including a first carrier support assembly configured to support a first carrier carrying a semiconductor wafer. The automated material handling system includes a transport track system configured to facilitate the movement of the first transport carrier. The transport track system includes a first track and a second track connected to the first track via a first joint. The automated material handling system includes a buffer support assembly configured to support the first carrier. The automated material handling system includes a second transport carrier, the second transport carrier including a second carrier support assembly. In response to a processing station being scheduled to receive the semiconductor wafer, the first transport carrier is configured to: (i) travel from the first track to the second track via the first joint when the first carrier is supported by the first carrier support assembly; and (ii) transfer the first carrier from the first carrier support assembly to the buffer support assembly when the first transport carrier engages with the second track. In response to the processing station being operable to receive the semiconductor wafer, the second transport carrier is configured to: (i) receive the first carrier from the buffer support assembly using the second carrier support assembly; and (ii) transfer the first carrier from the second carrier support assembly to the processing station.

[0107] In some embodiments, the second track is connected to the first track via a second joint; in response to receiving the first carrier using the second carrier support assembly, the second transport vehicle is configured to move from the second track to the first track via the second joint; and the second transport vehicle is configured to transfer the first carrier from the second carrier support assembly to the processing station when the second transport vehicle engages with the first track.

[0108] In some embodiments, the first track described above is configured to facilitate the movement of the first transport vehicle in a first direction; and the transport track system includes a third track, the third track having at least one of the following characteristics: substantially parallel to the first track; or configured to facilitate the movement of the transport vehicle in a second direction different from the first direction.

[0109] In some embodiments, the above-mentioned second track includes a loop track, which includes: a first part, configured to facilitate the movement of the first carrier in a third direction; and a second part, having at least one of the following characteristics: substantially parallel to the first part of the second track; or configured to facilitate the movement of the carrier in a fourth direction different from the third direction.

[0110] In some embodiments, the second track is located between the first track and the third track.

[0111] In some embodiments, the buffer support assembly is located between the first portion of the second track and the second portion of the second track.

[0112] In some embodiments, the first track is located between the second track and the processing station.

[0113] In some embodiments, the first track is located between the second track and the third track.

[0114] In some embodiments, the above-mentioned automated material handling system includes: a third transport carrier, including a third carrier support component, wherein: the transport track system includes a third track; the third track is connected to the first track via a third joint; and in response to the use of the semiconductor wafer at the processing station to produce processed semiconductor wafers and the processed semiconductor wafers are loaded into the first carrier, the third transport carrier is configured to: receive the first carrier from the processing station using the third carrier support component; and travel from the first track to the third track via the third joint when the first carrier is supported by the third carrier support component.

[0115] In some embodiments, the above-mentioned controller is configured to manage the movement of the transport vehicle along the third track, wherein: when the first carrier is received using the third carrier support assembly, the controller enables the fourth transport vehicle to move along the third track; and in response to receiving the first carrier using the third carrier support assembly, the controller prevents the fifth transport vehicle from moving along the third track, so that the third transport vehicle can move from the first track to the third track via the third joint.

[0116] In some embodiments, the first coupling portion includes: a first conversion component configured to facilitate conversion of the first transport vehicle from traveling along the first track to traveling along the second track.

[0117] In some embodiments, the first carrier is received using the second carrier support assembly when the second transport vehicle is engaged with the second track.

[0118] In some embodiments, a method for transporting a first carrier using an automated material handling system is provided. The automated material handling system includes a first transport carrier, a second transport carrier, a buffer support assembly, and a transport track system, wherein the transport track system includes a first track and a second track connected to the first track via a first joint. The method includes: in response to a processing station being scheduled for receiving semiconductor wafers carried by the first carrier, the first transport carrier is moved from the first track to the second track via the first joint when the first carrier is supported by the first carrier support assembly of the first transport carrier. The method includes transferring the first carrier from the first carrier support assembly to the buffer support assembly when the first transport carrier is engaged with the second track. The method includes: in response to the processing station being available for receiving the semiconductor wafer, transferring the first carrier from the buffer support assembly to the second carrier support assembly of the second transport carrier. The method includes transferring the first carrier from the second carrier support assembly to the processing station.

[0119] In some embodiments, the method further includes transferring the semiconductor wafer from the first carrier to the processing station via a loading port of the processing station.

[0120] In some embodiments, the method includes processing the semiconductor wafer using the processing station in response to transferring the semiconductor wafer from the first carrier to the processing station via the load port.

[0121] In some embodiments, the second track is connected to the first track via a second joint; and the method includes: in response to transferring the first carrier from the buffer support component to the second carrier support component, the second transport carrier is moved from the second track to the first track via the second joint, wherein the first carrier is transferred from the second carrier support component to the processing station when the second transport carrier is engaged with the first track.

[0122] In some embodiments, the automated material handling system includes a third transport carrier; the transport track system includes a third track; the third track is connected to the first track via a third joint; and the method includes: processing the semiconductor wafer using the processing station to produce a processed semiconductor wafer; loading the processed semiconductor wafer into the first carrier;

[0123] In response to loading the processed semiconductor wafer into the first carrier, the first carrier is transferred from the processing station to the third carrier support component of the third transport carrier; and in response to transferring the first carrier from the processing station to the third carrier support component, the third transport carrier is moved from the first track to the third track via the third joint.

[0124] As in some embodiments, the above method includes: when the first carrier is received at the third carrier support component, enabling the fourth transport vehicle to move along the third track; and in response to the first carrier being received by the third carrier support component, preventing the fifth transport vehicle from moving along the third track, so that the third transport vehicle can move from the first track to the third track via the third joint.

[0125] In some embodiments, a method for transporting a first carrier using an automated material handling system is provided. The automated material handling system includes a first transport carrier, a buffer support assembly, and a transport track system, wherein the transport track system includes a first track and a second track connected to the first track via a first joint. The method includes: in response to a processing station being scheduled for receiving semiconductor wafers carried by the first carrier, moving the first transport carrier from the first track to the second track via the first joint when the first carrier is supported by the first carrier support assembly of the first transport carrier. The method includes transferring the first carrier from the first carrier support assembly to the buffer support assembly when the first transport carrier is engaged with the second track. The method includes: in response to the processing station being available for receiving the semiconductor wafer, transferring the first carrier from the buffer support assembly to the first carrier support assembly. The method includes transferring the first carrier from the first carrier support assembly to the processing station.

[0126] In some embodiments, the second track is connected to the first track via a second joint; and the method includes: in response to transferring the first carrier from the buffer support component to the first carrier support component, the first transport carrier is moved from the second track to the first track via the second joint, wherein the first carrier is transferred from the first carrier support component to the processing station when the first transport carrier is engaged with the first track.

[0127] The features of several embodiments are summarized above so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should understand that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to implement the same purposes or achieve the same advantages as the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and modifications to it without departing from the spirit and scope of the present disclosure.

[0128] Although the subject matter has been described in language specific to structural features or methodological actions, it should be understood that the subject matter of the appended claims is not necessarily limited to the specific features or actions described above. Rather, the specific features and actions described above are disclosed as exemplary forms of implementing at least some of the claims.

[0129] Various operations of the embodiments are provided herein. The order in which some or all of the operations are described should not be interpreted as implying that the operations must be performed in order. Alternative orders with the beneficial effects of this description will be understood. In addition, it will be understood that not all operations must be present in each embodiment provided herein. In addition, it should be understood that in some embodiments, not all operations are necessary.

[0130] It should be understood that in some embodiments, for example, for the purpose of simplicity and ease of understanding, the layers, features, elements, etc. illustrated herein are illustrated with specific dimensions (e.g., structural dimensions or orientations) relative to each other, and the actual dimensions of the layers, features, elements, etc. are substantially different from the dimensions illustrated herein. In addition, for example, there are various techniques such as at least one of the following to form the layers, regions, features, elements, etc. mentioned herein: etching techniques, planarization techniques, implantation techniques, doping techniques, spin coating techniques, sputtering techniques, growth techniques, or deposition techniques (e.g., chemical vapor deposition (CVD)).

[0131] In addition, "exemplary" and / or similar terms are used herein to refer to serving as examples, instances, illustrations, etc., and not necessarily to be advantageous. "Or" used in this application is intended to be inclusive "or" rather than exclusive "or". In addition, unless otherwise specified or clearly indicated from the context to refer to the singular form, "a and an" used in this application and the attached application items are generally deemed to refer to "one or more". In addition, at least one of A and B and / or similar expressions generally refer to A or B, or both A and B. In addition, with the use of "include", "having, has", "with" or variations thereof, such terms are intended to indicate inclusion in a manner similar to the term "comprising". In addition, unless otherwise specified, "first", "second" or similar terms are not intended to imply a temporal aspect, a spatial aspect, an order, etc. Specifically, such terms are used only as identifiers, names, etc. of features, elements, items, etc. For example, a first element and a second element generally correspond to element A and element B, or two different elements, or two identical elements, or the same element.

[0132] In addition, although the present disclosure has been shown and described for one or more embodiments, those with ordinary knowledge in the art will think of equivalent changes and modifications after reading and understanding this specification and the drawings. The present disclosure includes all such modifications and changes, and is limited only to the scope of the following application items. In particular, for the various functions implemented by the above-mentioned components (e.g., elements, resources, etc.), even if the components are not structurally equivalent to the disclosed structures, the terms used to describe such components are intended to correspond to any components (e.g., functionally equivalent) that implement the specified functions of the components (unless otherwise indicated). In addition, although specific features of the present disclosure may be disclosed only for one embodiment among several embodiments, such features may be combined with one or more other features of other embodiments when it may be desirable and advantageous for any given application or specific application.

Claims

1. An automated material handling system comprising: A first transport carrier includes a first carrier support assembly configured to support a first carrier carrying a semiconductor wafer; A transport track system configured to facilitate movement of the first transport vehicle, wherein the transport track system comprises: Track 1; and a second rail connected to the first rail via a first coupling portion; a buffer support assembly configured to support the first carrier; and A second transport vehicle comprises a second carrier support assembly, wherein: In response to a processing station being scheduled to receive the semiconductor wafer, the first transport carrier is configured to: traveling from the first track to the second track via the first coupling portion when the first carrier is supported by the first carrier support assembly; and transferring the first carrier from the first carrier support assembly to the buffer support assembly when the first transport carrier engages the second track; and In response to the processing station being configured to receive the semiconductor wafer, the second transport carrier is configured to: receiving the first carrier from the buffer support assembly using the second carrier support assembly; and The first carrier is transferred from the second carrier support assembly to the processing station.

2. The automated material handling system of claim 1, wherein: The second track is connected to the first track via a second coupling portion; In response to receiving the first carrier using the second carrier support assembly, the second transport vehicle is configured to travel from the second track to the first track via the second joint; and The second transport vehicle is configured to transfer the first carrier from the second carrier support assembly to the processing station when the second transport vehicle is engaged with the first track.

3. The automated material handling system of claim 1, wherein: The first track is configured to facilitate movement of the first transport vehicle in a first direction; and The transport track system includes a third track having at least one of the following features: substantially parallel to said first track; or Configured to facilitate movement of the transport vehicle in a second direction different from the first direction.

4. The automated material handling system of claim 3, wherein: The second track includes a loop track, and the loop track includes: a first portion configured to facilitate movement of the first carrier in a third direction; and The second part has at least one of the following characteristics: substantially parallel to said first portion of said second track; or The device is configured to facilitate movement of the carrier in a fourth direction different from the third direction.

5. The automated material handling system of claim 1, comprising: A third transport vehicle comprises a third carrier support assembly, wherein: The transport track system includes a third track; The third rail is connected to the first rail via a third connecting portion; and In response to using the semiconductor wafer at the processing station to produce a processed semiconductor wafer and the processed semiconductor wafer being loaded into the first carrier, the third transport carrier is configured to: receiving the first carrier from the processing station using the third carrier support assembly; and When the first carrier is supported by the third carrier supporting assembly, the first carrier travels from the first track to the third track via the third coupling portion.

6. The automated material handling system of claim 5, comprising: A controller configured to manage movement of the transport vehicle along the third track, wherein: Upon receipt of the first carrier using the third carrier support assembly, the controller enables a fourth transport vehicle to travel along the third track; and In response to receiving the first carrier using the third carrier support assembly, the controller prevents the fifth transport vehicle from traveling along the third track to enable the third transport vehicle to travel from the first track to the third track via the third joint.

7. A method for transporting a first carrier using an automated material handling system, the automated material handling system comprising a first transport carrier, a second transport carrier, a buffer support assembly, and a transport track system, the transport track system comprising a first track and a second track connected to the first track via a first joint, the method comprising: In response to a processing station being scheduled to receive a semiconductor wafer carried by the first carrier, moving the first transport carrier from the first track to the second track via the first coupling portion while the first carrier is supported by the first carrier support assembly of the first transport carrier; transferring the first carrier from the first carrier support assembly to the buffer support assembly when the first transport carrier engages the second track; In response to the processing station being operable to receive the semiconductor wafer, transferring the first carrier from the buffer support assembly to a second carrier support assembly of the second transport carrier; as well as The first carrier is transferred from the second carrier support assembly to the processing station.

8. The method according to claim 7, comprising: The semiconductor wafer is transferred from the first carrier to the processing station via a load port of the processing station.

9. The method according to claim 8, comprising: In response to transferring the semiconductor wafer from the first carrier to the processing station via the load port, the semiconductor wafer is processed using the processing station.

10. A method for transporting a first carrier using an automated material handling system, the automated material handling system comprising a first transport carrier, a buffer support assembly, and a transport track system, the transport track system comprising a first track and a second track connected to the first track via a first joint, the method comprising: In response to a processing station being scheduled to receive a semiconductor wafer carried by the first carrier, moving the first transport carrier from the first track to the second track via the first coupling portion while the first carrier is supported by the first carrier support assembly of the first transport carrier; transferring the first carrier from the first carrier support assembly to the buffer support assembly when the first transport carrier engages the second track; In response to the processing station being operable to receive the semiconductor wafer, transferring the first carrier from the buffer support assembly to the first carrier support assembly; as well as The first carrier is transferred from the first carrier support assembly to the processing station.

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