Millimeter wave phased-array antenna of pure metal dipole and packaging process of millimeter wave phased-array antenna

Abstract

The invention provides a millimeter wave phased-array antenna of a pure metal dipole and a packaging process of the millimeter wave phased-array antenna. The millimeter wave phased array antenna mainly solves the problems that a traditional millimeter wave phased array antenna is high in complexity, angle scanning of the antenna is limited, antenna packaging efficiency is low, and machining difficulty is large. According to the invention, a pure metal dipole antenna structure is adopted to complete an antenna radiation function, and metal walls are arranged at the periphery of the antenna, so that the influence of mutual radiation between antenna dipoles is avoided. The millimeter wave antenna array is integrally packaged and integrated on an Al2O3 ceramic packaging structure, and connection and packaging of the millimeter wave phased array antenna and the chip assembly are realized through a single-layer ceramic packaging layer. The antenna provided by the invention has the advantages of simpler structure, wide-angle scanning, low loss of a packaging process and high efficiency. The method can be used for realizing a high-integration and miniaturized millimeter wave packaging phased-array antenna.

Description

Technical Field

[0001] The present invention belongs to the field of radar communication technology, and further relates to a pure metal dipole millimeter wave phased array antenna and its packaging process in the field of antenna technology. The present invention can be used for packaging and integration of millimeter wave phased array antenna and chip. Background Art

[0002] Due to the advantages of small size, flexible beam scanning, and strong anti-interference ability, millimeter-wave phased array antennas have been widely used in radar remote sensing and satellite navigation, and will gradually be used in mobile communications, automobile autonomous driving and other fields. However, the structure of traditional millimeter-wave phased array antennas usually uses T / R components for feeding. In the millimeter-wave frequency band, the size of the corresponding phased array antenna is small, and the processing accuracy of the fine structure is required to be high. The key point of the packaged millimeter-wave phased array antenna technology is to integrate it on the package of the RF integrated circuit. Using packaged antenna technology, the antenna and the RF integrated circuit are horizontally or vertically integrated into a device that can be sealed on the chip component, which reduces the package size of the RF system, shortens the length of the interconnection line, and reduces the noise and loss caused by parasitic effects. When the millimeter-wave phased array antenna is packaged and integrated, it is necessary to ensure that the signal is transmitted with low loss in the package. Therefore, it is difficult to achieve high integration of the antenna and chip components.

[0003] The University of Electronic Science and Technology of China disclosed a three-dimensional integrated millimeter-wave all-metal phased array packaged antenna in its patent application document "A three-dimensional integrated millimeter-wave all-metal phased array packaged antenna" (application number 202410029826.4, application publication number CN 117543200 A). The antenna is used to solve the application problem of all-metal phased array packaged antennas in the millimeter wave frequency band. The antenna uses current zigzag technology to reduce the lateral size of the unit, ensure the requirements of the grating lobe of the phased array antenna, and eliminate the coupling between adjacent antenna units through the concave decoupling structure and the I-shaped decoupling structure. At the same time, the asymmetric dipole is used in conjunction with the asymmetric feeding balun to overcome the contradiction between the process requirements and the consistency of the unit spacing, so that the antenna has high-efficiency radiation characteristics and has the advantages of no grating lobe and no blind spot under large-angle scanning conditions. However, the antenna still has two shortcomings: First, because the antenna introduces a support structure and a variety of decoupling structures, the antenna design complexity is increased, and the antenna cost and installation difficulty are increased. Secondly, the angular scanning result of the antenna is limited to ±50°, and the scanning result at a larger angle is not ideal.

[0004] Chengdu Zhixin Leitong Microsystem Technology Co., Ltd. disclosed a new type of time-sharing dual-polarization AIP antenna in its patent application "A new type of time-sharing dual-polarization AIP antenna" (application number 202311825644.X, application publication number CN 117791109 A). The time-sharing dual-polarization AIP antenna embeds the active polarization switch chip into the multi-layer HTCC board to form a highly integrated integrated packaging structure, which realizes the time-sharing dual-polarization switching of the dual-polarization antenna in a smaller packaging structure, and realizes the interconnection of RF signals in the multi-layer board, eliminating the loss and size of the RF connector, optimizing the signal transmission path, and reducing the transmission loss between the polarization switch and the antenna. However, the antenna still has two shortcomings: First, the antenna adopts a multi-layer structure, and the connection between the antenna and the chip is realized by embedding the switch chip into the multi-layer HTCC board. Due to the dielectric loss of the multi-layer packaging structure, the efficiency of the time-sharing dual-polarization AIP antenna is low. Secondly, the number of vias required to achieve the functions of the antenna structure is large, which increases the difficulty of actual processing and realization of the antenna. Summary of the invention

[0005] The purpose of the present invention is to address the deficiencies of the above-mentioned prior art and propose a pure metal dipole millimeter-wave phased array antenna and its packaging process, aiming to solve the problems of high complexity and limited angle scanning of traditional millimeter-wave phased array antennas, as well as the low efficiency and great processing difficulty of phased array packaged antennas caused by dielectric loss in the multi-layer packaging structure.

[0006] The technical idea for achieving the purpose of the present invention is as follows: Since the millimeter-wave phased array antenna unit of the present invention adopts metal walls arranged around the unit, by applying an alternating voltage, the charge on the metal dipole is in a state of continuous back-and-forth oscillation, which causes the electric field and the magnetic field to propagate to a distant place to form electromagnetic radiation, and propagate energy to the surrounding space in the form of electromagnetic waves, thereby realizing the antenna radiation function. At the same time, metal walls are arranged around the antenna, and a heightening structure is arranged on the vertical surface of the metal dipole to reduce the influence of mutual radiation between the antenna dipoles, thereby reducing interference such as directional pattern distortion caused by coupling between antennas. The antenna of the present invention can realize the antenna radiation function by heightening the dipole structure and the metal wall. While solving the high complexity of the millimeter-wave phased array antenna in the prior art, the millimeter-wave phased array antenna structure of the present invention is made simpler and convenient for antenna processing. The antenna of the present invention has a reflection coefficient of less than -11dB in the required frequency band of 32GHz to 38GHz, thereby enabling the antenna to work normally in this frequency band, and controlling the phase of the millimeter-wave phased array antenna unit through the feeding function of the chip to achieve precise beam scanning, and achieving a gain drop of less than 4.5dB within a ±55° scanning angle in the frequency band, thereby achieving a maximum scanning effect of ±55°, thereby solving the problem of limited angle scanning of the millimeter-wave phased array antenna in the prior art. Since the present invention adopts a ceramic packaging process for antenna packaging, a ceramic packaging layer is added between the metal antenna and the chip assembly, and a feeding structure is cut out of the metal layer above the ceramic packaging layer, and a metal through hole is added to the ceramic layer to connect the upper metal layer feeding with the bottom chip feeding, thereby realizing the connection and packaging of the millimeter-wave antenna and the chip assembly through the ceramic packaging layer.

[0007] The millimeter wave phased array antenna of the pure metal dipole of the present invention comprises an antenna array consisting of N×N closely arranged antennas with a gap of 0.3 mm, each millimeter wave phased array antenna unit is surrounded by metal walls, and a pure metal dipole antenna with a heightened structure is arranged on the vertical surface of the metal dipole, wherein N is an integer greater than or equal to 2.

[0008] Furthermore, each antenna array includes 2×2 millimeter wave antenna units spliced ​​in a rectangular array, and each antenna array feeding position is connected to its corresponding chip module feeding point.

[0009] Furthermore, each millimeter wave antenna unit includes, from bottom to top, a first metal layer, a ceramic packaging layer, a second metal layer, a metal wall and a metal dipole.

[0010] The first metal layer is provided with a circular feeding through hole at the chip feeding position.

[0011] The ceramic packaging layer is provided with a metal through-hole structure to provide power feeding and isolation functions.

[0012] The second metal layer is provided with a coplanar waveguide structure between the metal dipole antenna feeding position and the ceramic packaging layer feeding position. The second metal layer forms a hollow structure for placing the metal dipole at its center.

[0013] The metal wall has a heightened metal structure portion having the same height as the metal dipole on the vertical plane of the metal dipole. The metal wall has triangular metal structures at the four corners.

[0014] The metal dipole is composed of a metal-air dielectric coaxial line and a pair of metal arms; the metal dipole is slotted on both sides of the coaxial line.

[0015] Furthermore, the feeding through hole of the first metal layer is arranged below the millimeter-wave antenna unit and is connected to the feeding of the corresponding chip component module. Through the feeding function of the chip, the phase of the electrical signal fed into each millimeter-wave phased array antenna unit is adjusted according to preset requirements to achieve a beam scanning function.

[0016] Furthermore, horizontal cross-sections of the first metal layer, the ceramic packaging layer, and the second metal layer are regular quadrilaterals with equal areas.

[0017] Furthermore, the circular metal through hole of the ceramic packaging layer is composed of a first part, a second part and a third part. The first part is distributed at equal intervals around the ceramic packaging layer, and the second part is distributed around the coplanar waveguide. The coplanar waveguide has an isolation function from the rest of the second metal layer, and the third part matches the lower coaxial feed to provide feeding to the coplanar waveguide.

[0018] Furthermore, a pair of metal arms of the metal dipole is connected to the top of the metal air dielectric coaxial housing, and the metal arms are composed of a tie-knot-shaped metal arm and a rectangular-shaped metal arm. The rectangular-shaped metal arm is directly connected to the metal air dielectric coaxial central metal column feeder.

[0019] The packaging process of the millimeter wave phased array antenna of the present invention refers to that the millimeter wave antenna array is integrated on the Al2O3 ceramic packaging structure in the form of an integral package. A ceramic packaging layer is provided between the millimeter wave phased array antenna using a pure metal dipole and the chip component. The ceramic packaging layer realizes the interconnection of the upper metal layer feed and the bottom layer feed by means of metal through holes, and realizes the connection and packaging of the millimeter wave phased array antenna and the chip component through a single-layer ceramic packaging layer.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] First, the antenna of the present invention adopts a pure metal dipole antenna structure for millimeter wave phased array antenna design, which simplifies the structure of the multi-layer package, realizes the antenna radiation function through the metal dipole, and the metal walls around the antenna are heightened on the vertical plane of the metal dipole, which can reduce the influence of the directional pattern distortion caused by the coupling between antennas, overcomes the defect of high complexity of the millimeter wave phased array antenna in the prior art, and makes the millimeter wave phased array antenna of the present invention have the advantage of simpler structure.

[0022] Second, the antenna of the present invention can achieve precise beam scanning within the required frequency band of 32GHz to 38GHz by controlling the phase of the millimeter-wave phased array antenna unit, while achieving a maximum scanning effect of ±55° within the frequency band, overcoming the defect of the limited angle scanning of the millimeter-wave phased array antenna in the prior art, so that the millimeter-wave phased array antenna of the present invention has the advantage of wide-angle scanning, and can be used to realize a highly integrated and miniaturized millimeter-wave packaged phased array antenna.

[0023] Third, due to the packaging process of the millimeter-wave phased array antenna of the present invention, a ceramic packaging process is used for antenna packaging, a ceramic packaging layer is added between the metal antenna and the chip assembly, and a metal through hole is added to the ceramic layer to connect the upper metal layer feed with the bottom layer feed, thereby realizing the connection and packaging of the millimeter-wave phased array antenna and the chip assembly through a single-layer ceramic packaging layer, avoiding the dielectric loss caused by the multi-layer packaging structure of the millimeter-wave phased array antenna in the prior art, so that the packaging process of the millimeter-wave phased array antenna of the present invention has the advantages of low loss and high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a front view of the array structure of the millimeter wave antenna according to an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the first metal layer of the millimeter wave antenna array according to an embodiment of the present invention;

[0026] Figure 3 Schematic diagram of a ceramic packaging layer of a millimeter wave antenna array according to an embodiment of the present invention;

[0027] Figure 4 This is a schematic diagram of the second metal layer of the millimeter wave antenna array according to an embodiment of the present invention;

[0028] Figure 5 It is a schematic diagram of the structure of a metal dipole in a millimeter wave antenna array according to an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram of the millimeter wave phased array antenna structure composed of a 4×4 antenna array according to an embodiment of the present invention;

[0030] Figure 7 It is a simulation diagram of the present invention, wherein: Figure 7(a) is the reflection coefficient curve of the millimeter wave phased array antenna. Figure 7 (b) is the radiation scanning pattern of the millimeter wave phased array at 32GHz frequency point phi = 0°, Figure 7 (c) The radiation scanning pattern of the millimeter wave phased array at 35GHz frequency phi = 0° is: Figure 7 (d) is the radiation scanning pattern of the millimeter-wave phased array when phi=0° at the 38GHz frequency. DETAILED DESCRIPTION

[0031] The antenna of the present invention is a millimeter wave phased array antenna of pure metal dipole, and the number of antenna arrays N×N is determined by the actual use of the antenna. The millimeter wave phased array antenna of the embodiment of the present invention adopts a 4×4 closely arranged antenna array with a gap of 0.3mm, but those skilled in the art should understand that the millimeter wave phased array antenna can also be other combinations, for example, 2×2, 4×4, 6×6, 8×8... The embodiment of the present invention does not limit this.

[0032] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0033] Reference Figure 1 , the millimeter wave phased array antenna array of pure metal dipoles according to an embodiment of the present invention is further described.

[0034] The antenna array of the millimeter wave antenna of the present invention includes 2×2 millimeter wave antenna units spliced ​​in a rectangular array. The feeding position of the antenna array corresponds to the feeding point of the chip module. The millimeter wave antenna units distributed in a rectangular array can be used to match the chip feeding.

[0035] Each antenna array includes, from bottom to top: a first metal layer 1 , a ceramic packaging layer 2 , a second metal layer 3 , a metal wall 4 and a metal dipole 5 .

[0036] The horizontal cross-sections of the first metal layer 1 , the ceramic packaging layer 2 , and the second metal layer 3 are regular quadrilaterals with equal areas.

[0037] Reference Figure 2 , the structure of the first metal layer 1 of the millimeter wave antenna array according to an embodiment of the present invention is further described.

[0038] The first metal layer 1 is provided with a circular feeding metal through hole 101 at the feeding position of the antenna array. The feeding through hole 101 of the first metal layer 1 is arranged below the millimeter wave antenna unit, corresponding to the chip component module feeding.

[0039] Reference Figure 3 , the structure of the ceramic packaging layer 2 of the millimeter wave antenna array according to an embodiment of the present invention is further described.

[0040] The metal through hole 201 provided in the ceramic packaging layer 2 consists of three parts, namely, the first part 2011, the second part 2012 and the third part 2013. The first part 2011 is evenly distributed between the antenna units at equal intervals around the ceramic packaging layer 2. These through holes form a similar electromagnetic shielding structure, thereby reducing unnecessary electromagnetic mutual interference between the antenna units and improving the isolation between the antenna units. The second part 2012 is distributed around the coplanar waveguide 301 and also has an electromagnetic shielding function to improve the isolation between the coplanar waveguide 301 and the rest of the second metal layer 3. The third part 2013 is connected to the lower coaxial feed 101 to provide feeding for the coplanar waveguide 301.

[0041] Reference Figure 4 , the structure of the second metal layer 3 of the millimeter wave antenna array according to an embodiment of the present invention is further described.

[0042] The second metal layer 3 adds a coplanar waveguide 301 structure at the feeding position to connect the transmission line and the feeding structure composed of through holes in the ceramic packaging layer 2. The second metal layer 3 is provided with a hollow structure at the center of the antenna unit to place the metal dipole 5. The metal wall 4 has a raised metal structure part 401 of the same height as the metal dipole on the vertical plane of the metal dipole 5. The raised metal wall can reduce the influence of mutual radiation between antenna dipoles, thereby reducing interference such as directional pattern distortion caused by coupling between antennas. Triangular metal structures 402 are added to the four corners of the metal wall 4 to improve current distribution, thereby improving the broadband performance of the antenna. The metal dipole 5 is composed of a metal air dielectric coaxial 501 and a pair of metal arms 502, and slots are opened on both sides of the coaxial to balance the feeding function.

[0043] Reference Figure 5 , the structure of the millimeter wave antenna array metal dipole 5 of the embodiment of the present invention is further described.

[0044] A pair of metal arms of the metal dipole 5 are distributed on the top of the coaxial metal shell 501, and the metal arm 502 is composed of a tie-knot-shaped metal arm and a rectangular-shaped metal arm. The rectangular-shaped metal arm is directly connected to the coaxial central metal column for feeding. A pair of metal arms of the metal dipole 5 are distributed on the top of the coaxial metal shell 501, and the metal arm is composed of a tie-knot-shaped metal arm and a rectangular-shaped metal arm. The rectangular-shaped metal arm is directly connected to the coaxial central metal column for feeding.

[0045] Reference Figure 6 , the millimeter wave phased array antenna structure composed of a 4×4 antenna array in an embodiment of the present invention is further described.

[0046] The present invention provides a millimeter wave phased array antenna based on the above-mentioned millimeter wave antenna array. In order to ensure safe assembly when the millimeter wave antenna array is arranged, an assembly gap of 0.3 mm is maintained between adjacent antenna arrays. The feed through hole of the phased array antenna needs to correspond to the feed of the chip component module, and the feed structure is a metal layer with a chip component feed port arranged below the millimeter wave antenna array.

[0047] The millimeter-wave phased array antenna structure of the present invention adjusts the phase of the electrical signal fed into each millimeter-wave phased array antenna unit according to preset requirements through the feeding function of the chip, and flexibly adjusts the phase with the help of the feeding structure composed of the first metal layer arranged below the antenna array and having the chip component feeding port. At the same time, the pure metal dipole antenna radiation structure is used to control the phase of the antenna unit to achieve functions such as beam scanning.

[0048] The packaging process of the millimeter wave phased array antenna of the present invention is to integrate the whole packaging of the millimeter wave antenna array on the Al2O3 ceramic packaging structure, that is, the ceramic packaging layer 2. The Al2O3 ceramic has a relatively high thermal conductivity and high chemical stability in a high temperature environment, so this packaging structure is also helpful for the heat dissipation of the antenna. The ceramic packaging layer (2) realizes the interconnection between the upper metal layer feed and the bottom layer feed by means of the metal through hole (2013), and realizes the connection and packaging of the millimeter wave phased array antenna and the chip component through the single-layer ceramic packaging layer.

[0049] The effect of the present invention can be further demonstrated through the following simulation.

[0050] 1. Simulation conditions.

[0051] The simulation experiment of the present invention uses the Ansys Electronics Desktop software platform installed on computer hardware to complete the millimeter wave phased array antenna simulation.

[0052] 2. Simulation content and result analysis.

[0053] The simulation experiment of the present invention is to simulate the millimeter wave phased array antenna of the embodiment of the present invention in the range of 32 GHz to 38 GHz. The simulation results are plotted into curve graphs, such as Figure 7 As shown. Among them, Figure 7 (a) is the simulation result of the millimeter wave phased array antenna reflection coefficient. Figure 7 (b) is the radiation scanning pattern obtained by simulating the millimeter wave phased array antenna when the millimeter wave phased array is at 32 GHz frequency point phi = 0°. Figure 7 (c) is the radiation scanning pattern obtained by simulating the millimeter wave phased array antenna when the millimeter wave phased array is at the frequency point of 35 GHz, phi = 0°. Figure 7(d) is the radiation scanning pattern obtained by simulating the millimeter-wave phased array antenna when the millimeter-wave phased array is at a frequency of 38 GHz and phi = 0°.

[0054] The effects of the present invention are further described below in conjunction with simulation diagrams.

[0055] Figure 7 The horizontal axis in (a) is the operating frequency of the millimeter wave phased array antenna, in GHz, and the vertical axis is the reflection coefficient of the phased array antenna, in dB. Figure 7 In (a), the curve marked with a square represents the reflection coefficient curve of the antenna array port one, the curve marked with a circle represents the reflection coefficient curve of the antenna array port two, the curve marked with an equilateral triangle represents the reflection coefficient curve of the antenna array port three, and the curve marked with an inverted triangle represents the reflection coefficient curve of the antenna array port four.

[0056] from Figure 7 It can be seen from (a) that the reflection coefficients of the four ports of the millimeter wave antenna array in the present invention are all less than -11dB in the frequency band of 32GHz to 38GHz, indicating that the millimeter wave phased array has good reflection characteristics in the frequency band.

[0057] Figure 7 (b) Figure 7 (c) Figure 7 The horizontal axis of (d) is the angle of the Theta plane of the millimeter-wave phased array antenna, in degrees, and the vertical axis represents the gain value of the phased array antenna, in dB. Figure 7 (b) Figure 7 (c) Figure 7 In (d), the curve marked with a square represents the gain curve of the millimeter-wave phased array antenna when the scanning angle is 0°, the curve marked with a circle represents the gain curve of the millimeter-wave phased array antenna when the scanning angle is 30°, the curve marked with an equilateral triangle represents the gain curve of the millimeter-wave phased array antenna when the scanning angle is 45°, and the curve marked with an inverted triangle represents the gain curve of the millimeter-wave phased array antenna when the scanning angle is 55°.

[0058] from Figure 7 It can be seen from (b) that the millimeter-wave phased array antenna of the embodiment of the present invention is simulated under the above conditions. The millimeter-wave phased array antenna in the simulation experiment of the present invention has radiation patterns at scanning angles of 0°, 30°, 45° and 55° at a frequency of 32 GHz, where phi is 0°. The scanning angles obtained by the simulation experiment are detailed in Table 1.

[0059] Table 1 32GHz frequency data list

[0060] Maximum gain angle / deg Maximum gain / dB 0° 21.53 30° 21.14 45° 20.62 55° 19.06

[0061] from Figure 7 It can be seen from (c) that under the above conditions, the millimeter wave phased array antenna of the embodiment of the present invention is simulated, and the radiation patterns of the millimeter wave phased array antenna in the simulation experiment of the present invention at the 35 GHz frequency point when the scanning angles are 0°, 30°, 45° and 55°, where phi is 0°. The scanning angles obtained by the simulation experiment are detailed in Table 2.

[0062] Table 2 35GHz frequency data list

[0063] Maximum gain angle / deg Maximum gain / dB 0° 22.63 30° 22.18 45° 20.95 55° 18.58

[0064] from Figure 7 It can be seen from (d) that under the above conditions, the millimeter wave phased array antenna of the embodiment of the present invention is simulated, and the radiation pattern of the millimeter wave phased array antenna in the simulation experiment of the present invention at the 38 GHz frequency point when the scanning angles are 0°, 30°, 45° and 55°, where phi is 0°. The scanning angles obtained by the simulation experiment are detailed in Table 3.

[0065] Table 3 38GHz frequency data list

[0066] Maximum gain angle / deg Maximum gain / dB 0° 22.84 30° 22.34 45° 21.21 55° 18.42

[0067] from Figure 7 It can be seen from (b), (c) and (d) that within the required frequency band of 32 GHz to 38 GHz, the millimeter-wave phased array antenna of the simulation experiment of the present invention can achieve precise beam scanning by controlling the phase of the millimeter-wave phased array antenna unit. At the same time, the gain drop within the ±55° scanning angle within the frequency band is less than 4.5 dB, thereby achieving a maximum scanning effect of ±55° within the frequency band, achieving the goal of developing a highly integrated and miniaturized millimeter-wave packaged phased array antenna.

[0068] The above description is only a part of the examples of the present invention and does not constitute any limitation to the present invention. Any person skilled in the art can think of making possible changes and modifications to the technical solution of the present invention by using the above disclosed methods and technical contents without departing from the content of the technical solution of the present invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A millimeter wave phased array antenna of pure metal dipole, characterized in that: It includes an antenna array consisting of N×N closely arranged antennas with a gap of 0.3mm, each millimeter wave phased array antenna unit is surrounded by metal walls, and a pure metal dipole antenna with a heightened structure is arranged on the vertical surface of the metal dipole, wherein N is an integer greater than or equal to 2.

2. The millimeter wave phased array antenna of pure metal dipole according to claim 1, characterized in that: The antenna array includes 2×2 millimeter wave antenna units spliced ​​in a rectangular array, and each antenna array feeding position is connected to its corresponding chip module feeding point.

3. The millimeter wave phased array antenna of pure metal dipole according to claim 2, characterized in that: The millimeter wave antenna unit comprises, from bottom to top, a first metal layer (1), a ceramic packaging layer (2), a second metal layer (3), a metal wall (4) and a metal dipole (5); The first metal layer (1) is provided with a circular feeding through hole (101) at the chip feeding position; The ceramic packaging layer (2) is provided with a metal through hole (201) structure to provide power feeding and isolation functions; The second metal layer (3) is provided with a coplanar waveguide (301) structure between the metal dipole (5) antenna feeding position and the ceramic packaging layer (2) feeding position; the second metal layer (3) forms a hollow structure for placing the metal dipole at the center of the antenna unit; The metal wall (4) has a raised metal structure portion having the same height as the metal dipole (5) on a vertical surface thereof; and triangular metal structures (402) are arranged at the four corners of the metal wall (4); The metal dipole (5) is composed of a metal-air dielectric coaxial (501) and a pair of metal arms (502); the metal dipole (5) is slotted on both sides of the coaxial.

4. The millimeter wave phased array antenna of pure metal dipole according to claim 3, characterized in that: The feeding through hole (101) of the first metal layer (1) is arranged below each millimeter wave antenna unit and is connected to the corresponding chip component module feeding. Through the feeding function of the chip, the phase of the electrical signal fed into each millimeter wave phased array antenna unit is adjusted according to preset requirements to achieve a beam scanning function.

5. The millimeter wave phased array antenna of pure metal dipole according to claim 3, characterized in that: The horizontal cross-sections of the first metal layer (1), the ceramic packaging layer (2), and the second metal layer (3) are regular quadrilaterals with equal areas.

6. The millimeter wave phased array antenna of pure metal dipole according to claim 3, characterized in that: The circular metal through hole (201) of the ceramic packaging layer (2) consists of a first part (2011), a second part (2012) and a third part (2013); the first part (2011) is distributed at equal intervals around the ceramic packaging layer (2), the second part (2012) is distributed around the coplanar waveguide (301), and the third part (2013) matches the lower coaxial feed (101) to provide feeding to the coplanar waveguide (301).

7. The millimeter wave phased array antenna of pure metal dipole according to claim 3, characterized in that: A pair of metal arms of the metal dipole (5) is connected to the top of the metal air dielectric coaxial housing (501), the metal arm (502) is composed of a tie-knot-shaped metal arm and a rectangular-shaped metal arm, and the rectangular-shaped metal arm is directly connected to the central metal column of the metal air dielectric coaxial (501) for feeding.

8. The millimeter wave phased array antenna packaging process of a pure metal dipole of the millimeter wave phased array antenna according to claim 6, characterized in that: The millimeter wave antenna array is integrated on an Al2O3 ceramic packaging structure in the form of an integral package; a ceramic packaging layer (2) is provided between the millimeter wave phased array antenna of the pure metal dipole and the chip component; the ceramic packaging layer (2) realizes the interconnection of the upper metal layer feeding and the bottom metal layer feeding through the metal through-hole (2013), and realizes the connection and packaging of the millimeter wave phased array antenna and the chip component through the single-layer ceramic packaging layer.

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