Balun-integrated full-wave oscillator radiation unit

Abstract

The invention discloses a balun-integrated full-wave oscillator radiation unit, and aims to solve the problems that a low-frequency bowl-shaped oscillator and a high-frequency die-casting half-wave oscillator are used in an existing high and low frequency nesting scheme, the miniaturization and light weight requirements of an antenna are difficult to meet, the processing cost is extremely high, the antenna is not compact, and the like. And meanwhile, the high-frequency oscillator is arranged in the bowl-shaped oscillator, so that the horizontal plane wave width deformation of the high-frequency oscillator is caused, the gain is influenced, and the market demand cannot be met. The Balun-integrated full-wave oscillator radiation unit comprises a fixed support and a PCB radiation plate installed on the fixed support. The structure of the full-wave oscillator is relatively simple, assembly can be completed only by installing the single-balun integrated feed sheet in the fixing support and welding and fixing the single-balun integrated feed sheet and the PCB radiant panel, due to the fact that single-face embedded coupling is adopted, miniaturization design can be achieved through the micro-strip technology, the printed circuit technology and the like, the requirement of miniaturization equipment is met, machining is easy, and the overall performance of the full-wave oscillator is improved. The production efficiency can be greatly improved, and the production cost is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of mobile communications, and in particular relates to a balun-integrated full-wave dipole radiation unit. Background Art

[0002] With the rapid development of wireless communication technology, the role of antennas in communication systems is becoming increasingly important. Antenna technology mainly focuses on parameters such as antenna gain, bandwidth, and polarization. However, a single antenna design often cannot meet these requirements at the same time. Therefore, a high- and low-frequency nested solution is needed that can provide ultra-wideband, high gain, dual-polarization, multi-port, and multi-band characteristics.

[0003] The existing high- and low-frequency nesting solutions mainly use a low-frequency bowl-shaped oscillator + a high-frequency die-cast half-wave oscillator. Since the PCB half-wave array cannot meet the market's high-gain requirements, and the bowl-mounted die-cast array cannot meet the market's multi-frequency antenna requirements, it is even more difficult to meet the needs of antenna miniaturization and lightweight. The processing cost is extremely high. At the same time, the high-frequency oscillator is inside the bowl-mounted oscillator, which will cause the horizontal plane wave width of the high-frequency oscillator to deform, affecting the gain and failing to meet market demand. Summary of the invention

[0004] (1) Technical issues to be solved

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a balun-integrated full-wave dipole radiation unit. The balun-integrated full-wave dipole radiation unit is intended to solve the technical problem that the existing high- and low-frequency nested solution uses a low-frequency bowl-shaped dipole + a high-frequency die-cast half-wave dipole, which is difficult to meet the needs of miniaturization and lightweight of the antenna and has an extremely high processing cost. At the same time, the high-frequency dipole is inside the bowl-shaped dipole, which will cause the horizontal plane wave width of the high-frequency dipole to deform, affecting the gain and failing to meet market demand.

[0006] (2) Technical solution

[0007] In order to solve the above technical problems, the present invention provides such a balun integrated full-wave dipole radiation unit, comprising a fixed bracket and a PCB radiation board installed on the fixed bracket, the PCB radiation board comprising a PCB dielectric substrate, a folded dipole and a radiation microstrip line arranged on the PCB dielectric substrate, the PCB dielectric substrate is a single-layer PCB and the folded dipole and the radiation microstrip line are located in the same plane, a long strip coupling microstrip is arranged between the folded dipole and the radiation microstrip line, the folded dipole comprises two dipole arms and two coupling dipoles, the two dipole arms are connected to each other near the middle of the PCB dielectric substrate and form a feeding plate welding point, the two dipole arms are separated from each other and then close to each other and fixedly connected to the coupling dipole at the parts away from the middle of the PCB dielectric substrate, and a filtering node extends from the side where the two dipole arms are close to each other;

[0008] A single balun integrated feeding plate and a feeding microstrip line, wherein the single balun integrated feeding plate is installed inside a fixed bracket, the single balun integrated feeding plate is a single-sided copper-clad plate and the feeding microstrip line is arranged on the single balun integrated feeding plate, and the feeding microstrip line is electrically connected to a PCB radiation board and is used to feed the PCB radiation board.

[0009] Preferably, the fixed bracket includes a column, the top of the column is fixedly connected to a balance arm, the middle of the balance arm is diagonally fixedly connected to a guide column, the top of the guide column is fixedly connected to a conical guide portion, the outer side of the balance arm is fixedly connected to a plurality of elastic clamping columns, the PCB dielectric substrate is provided with guide holes and clamping holes corresponding to the guide columns and the elastic clamping columns, the interior of the column is provided with a through hole, and the single balun integrated feeding plate is located inside the through hole.

[0010] Furthermore, the single balun integrated feeding plate includes a positioning portion and a connecting portion connected in sequence, a positioning hole corresponding to the positioning portion is opened in the middle of the PCB dielectric substrate, the feeding microstrip line includes a feeding plate -45° microstrip line and a feeding plate +45° microstrip line arranged on the connecting portion, the top ends of the feeding plate -45° microstrip line and the feeding plate +45° microstrip line extend to the positioning portion and are provided with a bent dielectric substrate welding point, and the bottom ends of the feeding plate -45° microstrip line and the feeding plate +45° microstrip line are provided with a cable network welding point.

[0011] Furthermore, the balancing arm is larger than the area of ​​the fixed bracket, and the balancing arm is formed by connecting multiple horizontal arms and multiple vertical arms. The upper surfaces of the horizontal arms and the vertical arms are provided with support blocks, and the support blocks are provided with heat dissipation holes. The elastic clamping column includes a cylinder integrally formed with the balancing arm, a protrusion is fixedly connected to the top of the cylinder, and a through groove penetrating the protrusion is provided on the cylinder.

[0012] Furthermore, the PCB dielectric substrate is square and has rounded corners. There are four groups of folded vibrators. The four groups of folded vibrators are fixed at the four corners of one side of the PCB dielectric substrate away from the single balun integrated feeding plate to form a field-shaped structure. The folded vibrators are located on the inner side of the radiating microstrip line.

[0013] Furthermore, the two vibrator arms and the two coupling vibrators are symmetrically arranged along the diagonal line of the PCB dielectric substrate.

[0014] Furthermore, there are four groups of radiating microstrip lines and long strip coupling microstrips, and the four groups of radiating microstrip lines and long strip coupling microstrips respectively surround the center point of the PCB dielectric substrate and are evenly and symmetrically arranged on the four sides of the PCB dielectric substrate in the horizontal and vertical directions.

[0015] Furthermore, the vibrator arm includes a starting part and a connecting part which are connected to each other, the starting part and the connecting part form an L-shaped structure, the other end of the starting part is connected to the welding point of the feeding plate, the other end of the connecting part is connected to the coupling vibrator, and the filtering node is an L-shaped structure and is connected to the starting part.

[0016] Furthermore, vias are provided at four corners of the PCB dielectric substrate, and the vias extend into the interior of the coupling oscillator.

[0017] Furthermore, the widths of the filter node, the connection portion, the radiating microstrip line and the long strip coupling microstrip are all smaller than the width of the starting portion, and the long strip coupling microstrip is located between the connection portion and the radiating microstrip line and is arranged in parallel.

[0018] (5) Beneficial effects

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. In the above scheme, the structure of the full-wave oscillator is relatively simple. It only needs to install the single balun integrated feed plate in the fixed bracket and weld it to the PCB radiation plate to complete the assembly. Due to the use of single-sided embedded coupling, miniaturized design can be achieved through microstrip technology, printed circuit technology, etc., to meet the needs of miniaturized equipment, and it is easy to process, which is very suitable for mass production, can greatly improve production efficiency and reduce production costs. At the same time, mass production can also ensure product consistency and stability and improve product quality;

[0021] 2. In the above scheme, by using single-sided copper-clad board for the radiation surface of the PCB radiation board and the single balun integrated feed plate, not only the production cost is lower, but also the original double-sided copper-clad coupling point of the PCB radiation board is changed to a single-sided embedded coupling, which can also effectively improve the unit isolation and high gain, and can also ensure the PIM index requirements, effectively enhance the radiation efficiency, improve the directivity, and increase the gain. At the same time, the filter node design can effectively reduce the coupling between the oscillators and the mutual influence, improve the coverage of the communication system, and better meet the market demand. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of the exploded structure of the full-wave oscillator radiation unit integrated with the balun;

[0023] Figure 2 It is a schematic diagram of the front view structure of the full-wave oscillator radiation unit integrated in the balun;

[0024] Figure 3 A schematic diagram of the three-dimensional structure of a PCB radiation board of a full-wave oscillator radiation unit integrated with a balun;

[0025] Figure 4 A schematic diagram of the three-dimensional structure of a fixing bracket for a full-wave dipole radiation unit integrated in a balun;

[0026] Figure 5 A schematic diagram of the structure of a single balun integrated feed plate of a balun integrated full-wave dipole radiating unit;

[0027] Figure 6 A schematic diagram of the top view of the PCB radiation board of the full-wave oscillator radiation unit integrated with the balun;

[0028] Figure 7 The full-wave oscillator radiating unit integrated in the balun Figure 4 Schematic diagram of the enlarged structure at point A in the middle.

[0029] The marks in the attached drawings are: 1, fixed bracket; 2, PCB radiation board; 3, PCB dielectric substrate; 4, folded vibrator; 401, vibrator arm; 402, coupling vibrator; 403, feeding plate welding point; 404, filtering node; 5, radiating microstrip line; 6, long strip coupling microstrip; 7, single balun integrated feeding plate; 8, feeding microstrip line; 9, fillet; 10, via hole; 101, column; 102, balance arm; 103, guide column; 104, tapered guide; 105, elastic clamping column; 106 , through hole; 1021, horizontal arm; 1022, vertical arm; 1023, support block; 1024, heat dissipation hole; 1051, cylinder; 1052, bump; 1053, through groove; 301, guide hole; 302, clamping hole; 303, positioning hole; 701, positioning part; 702, connecting part; 801, feeding plate -45° microstrip line; 802, feeding plate +45° microstrip line; 803, dielectric substrate welding point; 804, cable network welding point; 4011, starting part; 4012, connecting part. DETAILED DESCRIPTION

[0030] This specific implementation is a balun integrated full-wave dipole radiation unit, and its structural schematic diagram is as follows Figure 1-Figure 7 As shown, the balun integrated full-wave dipole radiation unit includes a fixed bracket 1 and a PCB radiation board 2 installed on the fixed bracket 1. The PCB radiation board 2 is a full-wave dipole radiation, which can achieve more efficient electromagnetic radiation at a specific frequency, convert the input electrical energy into electromagnetic wave energy and effectively transmit it. Compared with other types of antennas, it can generate stronger signal radiation at the same input power. The PCB radiation board 2 includes a PCB dielectric substrate 3, a folded dipole 4 and a radiation microstrip line 5 arranged on the PCB dielectric substrate 3. The PCB dielectric substrate 3 is a single The folded vibrator 4 and the radiating microstrip line 5 are located in the same plane, a long strip coupling microstrip 6 is arranged between the folded vibrator 4 and the radiating microstrip line 5, the folded vibrator 4 includes two vibrator arms 401 and two coupling vibrators 402, the two vibrator arms 401 are connected to each other near the middle of the PCB dielectric substrate 3 and form a feeding plate welding point 403, the two vibrator arms 401 are separated from each other and then close to each other and fixedly connected to the coupling vibrator 402 at the parts away from the middle of the PCB dielectric substrate 3, and a filtering node 404 extends from the side where the two vibrator arms 401 are close to each other;

[0031] A single balun integrated feeding plate 7 and a feeding microstrip line 8, wherein the single balun integrated feeding plate 7 is installed inside the fixing bracket 1, the single balun integrated feeding plate 7 is a single-sided copper-clad plate and the feeding microstrip line 8 is arranged on the single balun integrated feeding plate 7, and the feeding microstrip line 8 is electrically connected to the PCB radiation plate 2 and is used to feed the PCB radiation plate 2;

[0032] By using single-sided copper-clad board materials for the radiation surface of the PCB radiation board 2 and the single balun integrated feeding plate 7, not only the production cost is lowered, but also the original double-sided copper-clad coupling point is changed to embedded coupling, which can also effectively improve the unit isolation and high gain, and can also ensure the PIM index requirements, effectively enhance the radiation efficiency, improve the directivity, and increase the gain. At the same time, the filter node 404 design set can effectively reduce the coupling between the oscillators and the influence between each other.

[0033] like Figure 4 and Figure 6 As shown, in this embodiment, the fixed bracket 1 includes a column 101, the top of the column 101 is fixedly connected to a balance arm 102, the middle diagonally fixedly connected to a guide column 103, the top of the guide column 103 is fixedly connected to a conical guide portion 104, the outer side of the balance arm 102 is fixedly connected to a plurality of elastic clamping columns 105, the PCB dielectric substrate 3 is provided with guide holes 301 and clamping holes 302 corresponding to the guide columns 103 and the elastic clamping columns 105, the interior of the column 101 is provided with a through hole 106, and the single balun integrated feeding plate 7 is located inside the through hole 106.

[0034] Specifically, the entire fixing bracket 1 is made of one-piece injection molding. During installation, the PCB dielectric substrate 3 is placed on the balance arm 102. At this time, it is guided by the conical guide part 104 and the guide column 103 and inserted into the guide hole 301. At this time, the elastic clamping column 105 is inserted into the clamping hole 302 to fix the PCB dielectric substrate 3, so that the installation through the buckle is simple and quick.

[0035] like Figure 5 and Figure 6 As shown, in this embodiment, the single balun integrated feeding plate 7 includes a positioning portion 701 and a connecting portion 702 connected in sequence, a positioning hole 303 corresponding to the positioning portion 701 is opened in the middle of the PCB dielectric substrate 3, and the feeding microstrip line 8 includes a feeding plate -45° microstrip line 801 and a feeding plate +45° microstrip line 802 arranged on the connecting portion 702, the top ends of the feeding plate -45° microstrip line 801 and the feeding plate +45° microstrip line 802 extend to the positioning portion 701 and are provided with a bent dielectric substrate welding point 803, and the bottom ends of the feeding plate -45° microstrip line 801 and the feeding plate +45° microstrip line 802 are provided with a cable network welding point 804.

[0036] By integrating the positive and negative polarized feed microstrips on a single balun integrated feed plate 7, the positioning portion 701 is inserted into the positioning hole 303 when fixed to the PCB dielectric substrate 3, and the dielectric substrate welding point 803 is welded and fixed to the feed plate welding point 403 to achieve signal connectivity, thereby simplifying the assembly process and reducing costs.

[0037] like Figure 4 and Figure 7 As shown, in this embodiment, the balancing arm 102 is larger than the area of ​​the fixed bracket 1, and the balancing arm 102 is formed by connecting multiple horizontal arms 1021 and multiple vertical arms 1022. The upper surfaces of the horizontal arms 1021 and the vertical arms 1022 are provided with support blocks 1023, and the support blocks 1023 are provided with heat dissipation holes 1024. The elastic clamping column 105 includes a cylinder 1051 integrally formed with the balancing arm 102, and the top of the cylinder 1051 is fixedly connected with a protrusion 1052, and the cylinder 1051 is provided with a through groove 1053 that penetrates the protrusion 1052.

[0038] In this way, when the PCB dielectric substrate 3 is installed on the balance arm 102, the PCB dielectric substrate 3 contacts the support block 1023. Since the balance arm 102 is composed of multiple horizontal arms 1021 and multiple vertical arms 1022, and the support block 1023 is provided with heat dissipation holes 1024, the PCB dielectric substrate 3 can be better cooled to improve the radiation performance.

[0039] like Figure 1 and Figure 3 As shown, in this embodiment, the PCB dielectric substrate 3 is square and has rounded corners 9 at the four corners. The folded vibrators 4 are four groups. The four groups of folded vibrators 4 are fixed at the four corners on one side of the PCB dielectric substrate 3 away from the single balun integrated feeding plate 7 to form a field-shaped structure. The folded vibrator 4 is located on the inner side of the radiating microstrip line 5, and the two vibrator arms 401 and the two coupling vibrators 402 are symmetrically arranged along the diagonal line of the PCB dielectric substrate 3.

[0040] A circuit that radiates electromagnetic waves is specifically arranged on the PCB dielectric substrate 3. The PCB dielectric substrate 3 adopts FRA4 single-sided copper-clad plate material to reduce costs. By adjusting the coupling degree and impedance matching between the folded oscillator 4, the radiating microstrip line 5 and the long strip coupling microstrip 6, the standing wave and isolation indicators of the radiating unit can be improved. At the same time, the diagonally symmetrical setting makes the overall appearance more beautiful.

[0041] like Figure 3 and Figure 6 As shown, in this embodiment, the radiating microstrip lines 5 and the long strip coupling microstrips 6 are each in four groups, and the four groups of radiating microstrip lines 5 and the long strip coupling microstrips 6 respectively surround the center point of the PCB dielectric substrate 3 and are evenly and symmetrically arranged on the four sides of the PCB dielectric substrate 3 along the horizontal and vertical directions.

[0042] like Figure 3 and Figure 6 As shown, in this embodiment, the vibrator arm 401 includes a starting portion 4011 and a connecting portion 4012 that are connected to each other, the starting portion 4011 and the connecting portion 4012 form an L-shaped structure, the other end of the starting portion 4011 is connected to the feeding plate welding point 403, and the other end of the connecting portion 4012 is connected to the coupling vibrator 402, the filter node 404 is an L-shaped structure and is connected to the starting portion 4011, and the four corners of the PCB dielectric substrate 3 are provided with vias 10, and the vias 10 extend to the inside of the coupling vibrator 402.

[0043] like Figure 6 As shown, in this embodiment, the widths of the filter node 404, the connecting portion 4012, the radiating microstrip line 5 and the long strip coupling microstrip 6 are all smaller than the width of the starting portion 4011, and the long strip coupling microstrip 6 is located between the connecting portion 4012 and the radiating microstrip line 5 and is arranged in parallel.

[0044] The technical solution provided by the present invention adopts a single-sided copper-clad plate material for the radiation surface of the PCB radiation board 2 and the single balun integrated feed plate 7, which not only reduces the production cost, but also changes the original double-sided copper-clad coupling point into a single-sided embedded coupling, which can also effectively improve the unit isolation and high gain, and can also ensure the PIM index requirements, effectively enhance the radiation efficiency, improve the directivity, and increase the gain. At the same time, the filter node 404 design set can effectively reduce the coupling between the oscillators and the influence between them, and improve the coverage of the communication system. At the same time, the structure of the full-wave oscillator is relatively simple, and the assembly can be completed by installing the single balun integrated feed plate 7 in the fixed bracket 1 and welding it to the PCB radiation board 2. Due to the use of single-sided embedded coupling, miniaturized design can be achieved through microstrip technology, printed circuit technology, etc., to meet the needs of miniaturized equipment, and it is easy to process, which is very suitable for mass production, can greatly improve production efficiency, and reduce production costs. At the same time, mass production can also ensure product consistency and stability, and improve product quality.

[0045] All technical features in this embodiment can be freely combined according to actual needs.

[0046] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention may also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the protection scope of the present invention.

Claims

1. A balun integrated full-wave dipole radiation unit, characterized in that: include: A fixed bracket (1) and a PCB radiation plate (2) mounted on the fixed bracket (1), the PCB radiation plate (2) comprising a PCB dielectric substrate (3), a folded vibrator (4) and a radiation microstrip line (5) arranged on the PCB dielectric substrate (3), the PCB dielectric substrate (3) being a single-layer PCB and the folded vibrator (4) and the radiation microstrip line (5) being located in the same plane, a long strip coupling microstrip (6) being arranged between the folded vibrator (4) and the radiation microstrip line (5), the folded vibrator (4) comprising two vibrator arms (401) and two coupling vibrators (402), the two vibrator arms (401) being connected to each other at parts close to the middle of the PCB dielectric substrate (3) and forming a feeding plate welding point (403), the two vibrator arms (401) being separated from each other at parts far from the middle of the PCB dielectric substrate (3) and then being close to each other and fixedly connected to the coupling vibrator (402), and a filtering node (404) extending from the side where the two vibrator arms (401) are close to each other; A single balun integrated feeding plate (7) and a feeding microstrip line (8), wherein the single balun integrated feeding plate (7) is installed inside a fixed bracket (1), the single balun integrated feeding plate (7) is a single-sided copper-clad plate, and the feeding microstrip line (8) is arranged on the single balun integrated feeding plate (7), and the feeding microstrip line (8) is electrically connected to a PCB radiation plate (2) and is used to feed the PCB radiation plate (2).

2. The balun integrated full-wave dipole radiation unit according to claim 1, characterized in that: The fixed bracket (1) comprises a column (101), the top end of the column (101) is fixedly connected to a balance arm (102), the middle part of the balance arm (102) is diagonally fixedly connected to a guide column (103), the top end of the guide column (103) is fixedly connected to a conical guide portion (104), the outer side of the balance arm (102) is fixedly connected to a plurality of elastic clamping columns (105), the PCB dielectric substrate (3) is provided with guide holes (301) and clamping holes (302) corresponding to the guide columns (103) and the elastic clamping columns (105), the interior of the column (101) is provided with a through hole (106), and the single balun integrated feeding plate (7) is located inside the through hole (106).

3. The balun integrated full-wave dipole radiation unit according to claim 2, characterized in that: The single balun integrated feeding plate (7) comprises a positioning portion (701) and a connecting portion (702) connected in sequence; a positioning hole (303) corresponding to the positioning portion (701) is provided in the middle of the PCB dielectric substrate (3); the feeding microstrip line (8) comprises a feeding plate -45° microstrip line (801) and a feeding plate +45° microstrip line (802) arranged on the connecting portion (702); the top ends of the feeding plate -45° microstrip line (801) and the feeding plate +45° microstrip line (802) extend to the positioning portion (701) and are provided with a bent dielectric substrate welding point (803); and the bottom ends of the feeding plate -45° microstrip line (801) and the feeding plate +45° microstrip line (802) are provided with a cable network welding point (804).

4. The balun integrated full-wave dipole radiation unit according to claim 3, characterized in that: The balancing arm (102) is larger than the area of ​​the fixed bracket (1); the balancing arm (102) is formed by connecting a plurality of horizontal arms (1021) and a plurality of vertical arms (1022); the upper surfaces of the horizontal arms (1021) and the vertical arms (1022) are both provided with support blocks (1023); the support blocks (1023) are provided with heat dissipation holes (1024); the elastic clamping column (105) comprises a cylinder (1051) integrally formed with the balancing arm (102); a protrusion (1052) is fixedly connected to the top of the cylinder (1051); and a through groove (1053) penetrating the protrusion (1052) is provided on the cylinder (1051).

5. The balun integrated full-wave dipole radiation unit according to claim 1, characterized in that: The PCB dielectric substrate (3) is square and has four rounded corners (9). The folded oscillators (4) are four groups. The four groups of folded oscillators (4) are fixed to the four corners of the PCB dielectric substrate (3) away from the single balun integrated feeding plate (7) on one side to form a field-shaped structure. The folded oscillators (4) are located on the inner side of the radiating microstrip line (5).

6. The balun integrated full-wave dipole radiation unit according to claim 5, characterized in that: The two vibrator arms (401) and the two coupling vibrators (402) are symmetrically arranged along the diagonal lines of the PCB dielectric substrate (3).

7. The balun-integrated full-wave dipole radiation unit according to claim 6, characterized in that: The radiation microstrip lines (5) and the long strip coupling microstrips (6) are each in four groups, and the four groups of radiation microstrip lines (5) and the long strip coupling microstrips (6) are respectively arranged around the center point of the PCB dielectric substrate (3) and are evenly and symmetrically arranged on the four sides of the PCB dielectric substrate (3) in the horizontal and vertical directions.

8. The balun-integrated full-wave dipole radiation unit according to claim 7, characterized in that: The vibrator arm (401) comprises a starting portion (4011) and a connecting portion (4012) which are connected to each other, wherein the starting portion (4011) and the connecting portion (4012) form an L-shaped structure, the other end of the starting portion (4011) is connected to a feeding plate welding point (403), the other end of the connecting portion (4012) is connected to a coupling vibrator (402), and the filtering node (404) is an L-shaped structure and is connected to the starting portion (4011).

9. The balun-integrated full-wave dipole radiation unit according to claim 8, characterized in that: Vias (10) are provided at the four corners of the PCB dielectric substrate (3), and the vias (10) extend into the interior of the coupling oscillator (402).

10. The balun integrated full-wave dipole radiation unit according to claim 9, characterized in that: The widths of the filtering node (404), the connecting portion (4012), the radiating microstrip line (5) and the long strip coupling microstrip (6) are all smaller than the width of the starting portion (4011); the long strip coupling microstrip (6) is located between the connecting portion (4012) and the radiating microstrip line (5) and is arranged in parallel.

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