Method for producing optoelectronic structure and packaging structure

Abstract

The invention provides a method for manufacturing an optoelectronic structure and a packaging structure. The method includes providing a substrate, and providing a light source module and a photonic assembly over the substrate; and adjusting a lens structure to a cell-specific position relative to the substrate to couple an optical signal from the light source module to the photonic assembly.

Description

Technical Field

[0001] The present disclosure generally relates to a method for manufacturing an optoelectronic structure and a packaging structure. Background Art

[0002] The light source module is usually manufactured by assembling optical components / assemblies using active alignment, and then the light source module is actively aligned with the photonic assembly to form a package. During the active alignment process, the light source module transmits optical signals directly to the photonic assembly and monitors the optical signals received by the photonic assembly as the light source module continues to change position. The light source module must be turned on and moved until the photonic assembly detects the optimal optical signal to complete the active alignment process. Summary of the invention

[0003] In one or more configurations, a method for manufacturing an optoelectronic structure includes: providing a substrate, and providing a light source module and a photonic component over the substrate; and adjusting a lens structure to a unit-specific position relative to the substrate to couple an optical signal from the light source module to the photonic component.

[0004] In one or more configurations, a method for manufacturing an optoelectronic structure includes: providing a substrate, and providing a first light source module, a first photonic component, a second light source module, and a second photonic component above the substrate; actively aligning the first light source module with the first photonic component by moving a first lens structure to a first unit-specific position relative to the first photonic component; and actively aligning the second light source module with the second photonic component by moving a second lens structure to a second unit-specific position relative to the second photonic component.

[0005] In one or more configurations, a package structure includes an optoelectronic structure. The optoelectronic structure includes a first optical component, a second optical component, and an optical alignment component configured to define an optical path between the first optical component and the second optical component. The optical alignment component is disposed at a unit-specific position relative to the first optical component and the second optical component. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Aspects of the present disclosure will be better understood from the following detailed description when read in conjunction with the accompanying drawings.It should be noted that various features may not be drawn to scale and that the sizes of various features may be arbitrarily increased or reduced for clarity of discussion.

[0007] Figure 1A , Figure 1B , Figure 1C , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 Various stages of an exemplary method for fabricating an optoelectronic structure according to some configurations of the present disclosure are shown.

[0008] Fig. 9 , Fig.10 , Fig.11 , Fig.12 and Fig.13 Various stages of an exemplary method for fabricating an optoelectronic structure according to some configurations of the present disclosure are shown.

[0009] Fig.14A is a top view of a package structure according to some configurations of the present disclosure.

[0010] Fig. 14B is a cross-section of a portion of a package structure according to some configurations of the present disclosure.

[0011] Fig. 14C is a cross-section of a portion of a package structure according to some configurations of the present disclosure.

[0012] Fig.15A is a top view of a package structure according to some configurations of the present disclosure.

[0013] Fig. 15B is a cross-section of a portion of a package structure according to some configurations of the present disclosure.

[0014] Fig.16A is a top view of a package structure according to some configurations of the present disclosure.

[0015] Fig. 16B is a cross-section of a portion of a package structure according to some configurations of the present disclosure.

[0016] Common reference numbers are used throughout the drawings and detailed description to indicate the same or similar elements. DETAILED DESCRIPTION

[0017] Figure 1A , Figure 1B , Figure 1C , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 Various stages of an example of a method for fabricating an optoelectronic structure according to some configurations of the present disclosure are shown.

[0018] A diagram showing various stages of an exemplary method for fabricating an optoelectronic structure Figure 1A and Figure 1BThe cross-sectional view and top view of the substrate 100A and the optical assembly are shown respectively. The optical assembly may include light source modules 10 and 10' and photon assemblies 20 and 20'. The light source modules 10 and 10' and the photon assemblies 20 and 20' may be disposed above the substrate 100A.

[0019] In some configurations, the light source modules 10 and 10' and the photonic components 20 and 20' are disposed on (e.g., attached to) above the substrate 100A. In some configurations, the light source modules 10 and 10' are disposed on (e.g., attached to) above the substrate 100A through the adhesive element 10A. In some configurations, the photonic components 20 and 20' are attached to or attached to the substrate 100A through the adhesive element 20A. In some configurations, the light source modules 10 and 10' are moved to the substrate 100A without turning on the light source modules 10 and 10'. In some configurations, during the process of moving the light source modules 10 and 10' to the substrate 100A, and before the light source modules 10 and 10' are attached to or attached to the substrate 100A, the light source modules 10 and 10' are not turned on (i.e., not powered on), that is, no voltage is supplied to the light sources of the light source modules 10 and 10'.

[0020] In some configurations, the light source module 10 includes a substrate layer 110, waveguides 120 and 120A, photodetectors 130 and 130A, a light source 140, an active optical element 150, and a dielectric layer 160. The substrate layer 110 may include a silicon-based layer and one or more circuit layers formed in the silicon-based layer. The circuit layer may include a driver circuit (e.g., a laser diode driver circuit). The substrate layer 110 and the dielectric layer 160 together define cavities 10C1 and 10C2. The waveguides 120 and 120A may be formed on the dielectric layer 160, and the photodetectors 130 and 130A may be formed above the dielectric layer 160 and optically coupled to the waveguides 120 and 120A, respectively. The photodetector 130 may be configured to detect one or more optical signals transmitted through the waveguide 120, and the photodetector 130A may be configured to detect one or more optical signals transmitted through the waveguide 120A. The dielectric layer 160 may serve as a protective layer or passivation layer for the waveguides 120 and 120A and the photodetectors 130 and 130A. The light source 140 may be or include a laser diode. The light source 140 may include a light emitting layer 141 and electrodes 142 and 143. The light source 140 may be adhered to the bottom of the cavity 10C1 by an adhesive layer 140A. The active optical element 150 may be adhered to the bottom of the cavity 10C2 by an adhesive layer 150A. The active optical element 150 may include an amplifier, such as a semiconductor optical amplifier (SOA). The active optical element 150 may be passively aligned by the waveguides 120 and / or 120A.

[0021] In some configurations, the photonic component 20 includes a substrate layer 210, a waveguide 220, a photodetector 230, and a dielectric layer 260. The substrate layer 210 may include a silicon-based layer and one or more circuit layers formed in the silicon-based layer. The circuit layer may include a driver circuit (e.g., a photonic integrated circuit). The waveguide 220 may be formed on a portion of the substrate layer 210, and the photodetector 230 may be formed on the waveguide 220 and optically coupled to the waveguide. The photodetector 230 may be configured to detect and / or monitor one or more optical signals transmitted from the waveguide 220. The dielectric layer 260 may serve as a protective layer or passivation layer for the waveguide 220 and the photodetector 230.

[0022] In some configurations, the structure of the light source module 10' is similar to that of the light source module 10, and thus its description is omitted herein. In some configurations, the structure of the photon assembly 20' has a structure similar to that of the photon assembly 20, except that the thickness of the light detector 230 is different, the thickness of the dielectric layer 260 is different, the waveguide 220 is at a different elevation, and the waveguide 220 is misaligned from a top view.

[0023] See also Figure 1C , which shows various stages of an exemplary method for manufacturing an optoelectronic structure, is a top view of a substrate 100A and an optical assembly. In some configurations, the photon assembly 20' may be misaligned with the light source module 10'. In some configurations, the long side of the photon assembly 20' may not be parallel to the long side of the light source module 10'. In some configurations, the photon assembly 20' is rotated offset from the light source module 10'. In some configurations, the waveguide 220 may be misaligned with the waveguide 120A. In some configurations, the waveguide 220 may not be parallel to the waveguide 120A. In some configurations, the waveguide 220 is rotated offset from the waveguide 120A.

[0024] See also Figure 2 , the light source modules 10 and 10' may be connected to a power source configured to provide power to turn on the light source 140. Probes 200 and 200' (or terminals) of the power source may be connected to electrodes 142 and 143 of the light source 140 (or laser diode). The photonic components 20 and 20' may be connected to a device configured to receive the result of the detected and / or monitored optical signal from the light detector 230. Probes 300 and 300' (or terminals) of the device may be connected to the light detector 230 of the photonic components 20 and 20'.

[0025] See also Figure 3, active alignment between the waveguide 120A of the light source module 10 and the photon assembly 20 may be performed. In some configurations, a lens 30 (also referred to as a "lens structure" or an "optical alignment assembly") may be provided. In some configurations, the lens 30 is configured to couple one or more optical signals from the waveguide 120A of the light source module 10 to the photon assembly 20. In some configurations, the lens 30 is further configured to focus the light (e.g., optical signal) emitted by the light source module 10 and guide the focused light to the waveguide 220 of the photon assembly 20. In some configurations, active alignment between the waveguide 120A of the light source module 10 and the photon assembly 20 is performed using the lens 30. In some configurations, aligning (or actively aligning) the light source module 10 and the photon assembly 20 includes or is performed by moving the lens 30 to actively align the waveguide 120A and the photon assembly 20. In some configurations, the lens 30 may be adjusted to a unit specific position P1 relative to the substrate 100A to couple the optical signal from the light source module 10 to the photonic component 20. In some configurations, active alignment includes aligning (or actively aligning) the optical path O1 between the waveguide 120A and the photonic component 20 by adjusting or moving the lens 30 to the unit specific position P1.

[0026] In some configurations, active alignment between the waveguide 120A of the light source module 10 and the photon assembly 20 may include the following operations. In some configurations, when the lens 30 is adjusted or moved, the optical signal passing through the lens 30 and received by the photon assembly 20 is monitored. The lens 30 may be adjusted by moving the lens 30 in multiple directions (e.g., in the x-axis, y-axis, z-axis, and / or any direction in three-dimensional space) to maximize or optimize the optical signal received and monitored by the photon assembly 20. For example, the lens 30 may be moved to change the elevation of the lens 30 relative to the substrate 100A, the distance between the lens 30 and the light source module 10 and / or the photon assembly 20, the tilt angle of the main axis of the lens 30 relative to the surface of the light source module 10 and / or the photon assembly 20, etc. The lens 30 may be adjusted or moved by the vacuum suction mechanism 400. In some configurations, the flat upper surface of the lens 30 may be attached to the vacuum suction mechanism 400, and the position of the vacuum suction mechanism 400 may be adjusted to adjust the lens 30. In some configurations, the lens 30 is adjusted or moved during the active alignment process so that the lens 30 eventually reaches a position configured for optimal coupling (e.g., the unit-specific position P1), which ensures optimal optical alignment between the light source module 10 (e.g., the waveguide 120A) and the photonic assembly 20. In some configurations, when the monitored optical signal (or the optical signal being monitored) reaches a predetermined optimization threshold, it is determined whether the lens 30 has reached the unit-specific position P1. In some configurations, the predetermined optimization threshold includes a predetermined intensity, a predetermined pattern, a predetermined intensity distribution, a predetermined signal-to-noise (S / N) ratio, or any combination thereof.

[0027] The unit-specific position can be generated for each individual unit (e.g., each set of components including the light source module 10, the photon assembly 20, and the lens 30) according to the measured or monitored optical signals received by the photon assembly 20. The unit-specific position of the lens 30 for different sets (or different individual units) of manufactured light source modules 10, photon assemblies 20, and lenses 30 can be different so that each light source module 10 is correctly or optimally aligned with each photon assembly 20. That is, each unit-specific position of the lens 30 can be specifically created for each set (or each individual unit) of light source modules 10, photon assemblies 20, and lenses 30.

[0028] The unit specific position P1 may be a position relative to the substrate 100A, or a position relative to the light source module 10 and / or the photonic component 20. The unit specific position P1 may be or include a variety of positions, such as the elevation of the lens 30 relative to the substrate 100A, the distance between the lens 30 and the substrate 100A, the distance between the lens 30 and the waveguide 120A, the distance between the lens 30 and the photonic component 20, the elevation difference between the lens 30 and the waveguide 120A, the elevation difference between the lens 30 and the photonic component 20, and any combination thereof.

[0029] In some configurations, aligning (or actively aligning) the optical path O1 further includes adjusting or moving the lens 30 without moving the positions of the light source module 10 and the photon assembly 20. In some configurations, the alignment (or active alignment) of the optical path O1 is performed or started after the light source module 10 and the photon assembly 20 are completely placed (e.g., attached) above the substrate 100A. In some configurations, when only the active alignment of the light source module 10 and the photon assembly 20 is performed, the probes (or terminals) 200, 200', 300, and 300' for the light source modules 10 and 10' and the photon assemblies 20 and 20' may all be configured (e.g., the probes 200, 200', 300, and 300' are all connected to the light source modules 10 and 10' and the photon assemblies 20 and 20').

[0030] See also Figure 4 After determining the unit-specific position P1 of the lens 30, the lens 30 may be removed from the unit-specific position P1. In some configurations, the unit-specific position P1 is stored in a processing unit of a device connected to the probe 300 (or terminal). In some configurations, the adhesive element 30A is then placed (or positioned) adjacent to the unit-specific position P1. In some configurations, the position of the adhesive element 30A is determined according to the unit-specific position P1 stored in the processing unit. The adhesive element 30A may be or include a photosensitive adhesive.

[0031] See also Figure 5, the lens 30 can be placed on the unit-specific position P1 (for example, attached to the unit-specific position). In some configurations, the lens 30 is guided to contact or connect to the adhesive element 30A so as to attach the lens 30 to the unit-specific position P1 through the adhesive element 30A. In some configurations, the lens 30 is movably placed on the unit-specific position P1 (or attached to the unit-specific position) through the adhesive element 30A, and then post-alignment can be further performed. In some configurations, a portion of the lens 30 can be inserted into the adhesive element 30A. In some configurations, post-alignment includes post-aligning the optical path O1 by adjusting or moving the lens 30 to the unit-specific position P1 after positioning the adhesive element 30A. In some configurations, the light source module 10 is actively aligned with the photonic component 20 by adjusting or moving the lens 30 relative to the adhesive element 30A. After the lens 30 is moved again, the position of the lens 30 contacting the adhesive element 30A may be slightly shifted from the accurate unit specific position P1. Therefore, a post-alignment including operations similar to those for the aforementioned active alignment between the light source module 10 and the photon assembly 20 may be performed to fine-tune the accurate position of the lens 30 to ensure optimal optical alignment between the light source module 10 (e.g., the waveguide 120A) and the photon assembly 20 through the lens 30. In some configurations, the light source module 10 is positioned at the optical position of the optical element 20. Figure 3-5 In some other configurations, the Figure 3 Another lens substantially identical or equivalent to the active alignment lens 30 shown in FIG. 1 may be configured to be disposed at the unit-specific position P1. In some configurations, two lenses 30 having substantially identical or equivalent structures may be used in the active alignment operation and disposed at the unit-specific position P1, respectively.

[0032] In some configurations, you can execute Figure 3, to actively align the waveguide 120A of the light source module 10' with the photon assembly 20' by moving the lens 30' to actively align the waveguide 120A of the light source module 10' with the photon assembly 20'. In some configurations, the lens 30' may be adjusted to a unit-specific position P2 relative to the substrate 100A to couple an optical signal from the light source module 10' to the photon assembly 20'. In some configurations, the active alignment includes aligning (or actively aligning) an optical path O2 between the waveguide 120A of the light source module 10' and the photon assembly 20' by adjusting or moving the lens 30' to the unit-specific position P2. In some configurations, the active alignment is performed after the active alignment of the light source module 10 and the photon assembly 20 is completed. The operation of actively aligning the light source module 10 and the photon assembly 20 by the lens 30 is the same as or similar to the operation of actively aligning the light source module 10 ′ and the photon assembly 20 ′ by the lens 30 ′ described herein, and thus the description thereof is omitted here.

[0033] See also Figure 6 , executable with Figure 4 , to remove the lens 30 from the unit specific position P2 and to dispose the adhesive element 30A′ adjacent to the unit specific position P2.

[0034] See also Figure 7 , executable with Figure 5 , to place the lens 30' on the unit-specific position P2 or connect (or attach) the lens 30' to the unit-specific position. In some configurations, the light source module 10' is actively aligned with the photon assembly 20' by adjusting or moving the lens 30' to the unit-specific position P2 relative to the light source module 10' and / or the photon assembly 20'. In some configurations, the lens 30' is movably placed on the unit-specific position P2 (or attached to the unit-specific position) by the adhesive element 30A', and then the light source module 10' is actively aligned with the photon assembly 20' by adjusting or moving the lens 30' relative to the adhesive element 30A'. The operation of attaching the lens 30' to the unit-specific position P2 is the same or similar to the operation performed to attach the lens 30 to the unit-specific position P1 described herein, so its description is omitted here.

[0035] See also Figure 8, lens 30 may be placed on (or permanently fixed at) a unit-specific position P1, and lens 30' may be placed on (or permanently fixed at) a unit-specific position P2. In some configurations, placing (or permanently fixing) lens 30 at unit-specific position P1 and placing (or permanently fixing) lens 30' at unit-specific position P2 are performed in the same operation. In some configurations, after post-aligning optical paths O1 and O2, adhesive elements 30A and 30A' may be cured (e.g., by UV) to attach (or permanently fix) lenses 30 and 30' at unit-specific positions P1 and P2, respectively. In some configurations, active alignment of light source module 10 with photonic assembly 20 and active alignment of light source module 10' with photonic assembly 20' are performed in different operations. In some configurations, adhesive element 30A and adhesive element 30A' are cured in the same operation.

[0036] In some configurations, a monomerization operation may be performed on the substrate 100A to form a monomerized structure (e.g., optoelectronic structure 1) including a light source module 10, a photonic component 20, and a lens 30 on the substrate 100, and a monomerized structure (e.g., optoelectronic structure 1A) including a light source module 10', a photonic component 20', and a lens 30' on the substrate 100'.

[0037] In some other configurations, Figure 3 The active alignment between the light source module 10 and the photonic assembly 20 shown in FIG. Figure 5 Prior to the active alignment between the light source module 10' and the photonic assembly 20' shown in , the adhesive elements 30A and 30A' may be disposed on the substrate 100A. In some configurations, the lens 30 may be movably disposed on the adhesive element 30A during the active alignment operation, and the lens 30' may be movably disposed on the adhesive element 30A' during the active alignment operation. In some configurations, the adhesive elements 30A and 30A' may be cured after the active alignment of the lenses 30 and 30'.

[0038] In some other configurations, executing Figure 3 The duration of the active alignment between the light source module 10 and the photonic assembly 20 shown in FIG. 1 may be at least partially related to the execution of Figure 5 The duration of active alignment between the light source module 10' and the photonic assembly 20' shown in FIG. Figure 3 The active alignment and Figure 5The active alignment between the light source module 10' and the photonic assembly 20' shown in FIG. 4 can be performed using different vacuum suction mechanisms 400. For example, the operation duration of adjusting the lens 30 using the first vacuum suction mechanism 400 can at least partially overlap the operation duration of adjusting the lens 30' using the second vacuum suction mechanism 400.

[0039] In some cases, the light source module includes an actively aligned optical element / assembly and is actively aligned with the photon assembly by monitoring an optical signal transmitted directly from the light source module and received by the photon assembly. The light source module must be turned on and moved until the active alignment process is completed by monitoring the optimal optical signal by the photon assembly. The light source module has a relatively large volume and a relatively complex structure, and therefore requires a relatively complex setting to move the light source module, wherein the light source module is turned on or powered on (connected to a power source), and a pick-up head for moving the light source module requires a relatively special design in order to pick up and move the complex and heavy module during the active alignment process.

[0040] According to some configurations of the present disclosure, the light source module includes an optical component that is passively aligned, and the light source module is then actively aligned with the photonic component through a lens (or lens structure). Therefore, the time and cost for actively aligning the optical components in the light source module can be reduced. In addition, the lens (or lens structure) has a relatively simple structure, a small weight, and a relatively small volume, so that moving the lens (or lens structure) to perform the active alignment process is easier and consumes less time than moving the entire light source module.

[0041] In addition, according to some configurations of the present disclosure, before actively aligning the light source module with the photon assembly by adjusting or moving the lens (or lens structure), the light source module and the photon assembly are placed above the substrate or attached to the substrate. Therefore, the settings during the alignment process are simplified because the light source module does not move when powered on (connected to a power source). In addition, since active alignment only involves adjusting or moving a lens (or lens structure) with a relatively simple structure, small weight, and relatively small volume, there is no need to set a pickup head with a special design. For example, a general vacuum head can be used to move the lens (or lens structure). Therefore, the processing equipment is simplified and the alignment setting is more flexible.

[0042] Fig. 9 , Fig.10 , Fig.11 , Fig.12 and Fig.13 The various stages of an example of a method for manufacturing an optoelectronic structure according to some configurations of the present disclosure are shown. To simplify the description and to facilitate comparison between various embodiments of the present disclosure, similar components in the following examples have the same reference numerals and are not described redundantly.

[0043] See also Fig. 9 , executable with Figure 1A-1B The operations similar to those shown in FIG. 1 are used to set the substrate 100A, the light source modules 10 and 10', and the photonic components 20 and 20', and the same operations as those shown in FIG. 1 can be performed. Figure 2-3 1 and 2 to set the lens structure 50 and perform active alignment between the waveguide 120A of the light source module 10 and the photon assembly 20. In some configurations, the active alignment includes aligning (or actively aligning) the optical path O1 between the waveguide 120A and the photon assembly 20 by moving the lens structure 50 to a unit-specific position P1. In some configurations, a planarization operation may be performed on the upper surfaces of the light source modules 10 and 10' and the photon assemblies 20 and 20' so that the upper surfaces of the light source modules 10 and 10' and the photon assemblies 20 and 20' may be substantially coplanar.

[0044] In some configurations, the lens structure 50 includes a support plate 40 and a lens 30 connected to the support plate 40. In some configurations, the lens 30 is supported by the support plate 40. The lens structure 50 (or the support plate 40) has a flat upper surface 40a configured to be attached to the vacuum suction mechanism 400. In some configurations, the lens structure 50 is a single-piece lens element. In some configurations, the support plate 40 and the lens 30 are integrally formed into a monolithic lens structure 50.

[0045] See also Fig.10 , executable with Figure 5 , and perform active alignment between the waveguide 120A of the light source module 10' and the photon assembly 20'. In some configurations, after determining the unit-specific position P1 of the lens structure 50, the lens structure 50 may be removed from the unit-specific position P1. In some configurations, the active alignment includes aligning (or actively aligning) the optical path O2 between the waveguide 120A and the photon assembly 20' by moving the lens structure 50' to the unit-specific position P2.

[0046] In some configurations, the lens structure 50' includes a support plate 40' and a lens 30' connected to the support plate 40'. The lens structure 50' (or support plate 40') has a flat upper surface 40a' configured to be attached to the vacuum suction mechanism 400. In some configurations, the lens structure 50' is a single-piece lens element. In some configurations, the support plate 40' and the lens 30' are integrally formed into a unitary lens structure 50'.

[0047] See also Fig.11, after determining the unit-specific position P2 of the lens structure 50', the lens structure 50' can be removed from the unit-specific position P2. In some configurations, the adhesive elements 60 and 60A are then placed (or positioned) adjacent to the unit-specific position P1. In some configurations, the positions of the adhesive elements 60 and 60A are determined according to the unit-specific position P1. In some configurations, the adhesive elements 60' and 60A' are then placed (or positioned) adjacent to the unit-specific position P2. In some configurations, the positions of the adhesive elements 60' and 60A' are determined according to the unit-specific position P2. The adhesive elements 60, 60A, 60' and 60A' may be or include photosensitive glue.

[0048] In some configurations, at least two or more of the adhesive elements (e.g., adhesive elements 60, 60A, 60', and 60A') may have different heights, thicknesses, and / or volumes. According to some configurations of the present disclosure, the differences in height, thickness, and / or volume between the adhesive elements may provide different predetermined spaces or gaps between the lens structure and the upper surface of the light source module, and may also provide different predetermined spaces or gaps between the lens structure and the upper surface of the photon assembly. For example, an adhesive element having a relatively large height, thickness, and / or volume may provide a relatively large space or gap between the lens structure and the light source / photon assembly. Therefore, the displacement of the position of the lens structure may be compensated, the processing window may be enlarged, and the flexibility of determining the specific position of the unit may be increased.

[0049] See also Fig.12 , the lens structure 50 can be disposed on the unit specific position P1 or attached to the unit specific position, and the lens structure 50' can be disposed on the unit specific position P2 or attached to the unit specific position. Figure 5 and 7 In the operation shown in the figure for placing the lenses 30 and 30' on the adhesive elements 30A and 30A' or attaching the lenses 30 and 30' to the adhesive elements, the lens structures 50 and 50' can be placed at (or movably attached to) the corresponding unit specific positions P1 and P2, and post-alignment can be further performed by adjusting or moving the lens structures 50 and 50' to ensure that the optimal optical alignment between the light source module 10 (for example, waveguide 120A) and the photonic component 20 is achieved through the lens structure 50, and the optimal optical alignment between the light source module 10' (for example, waveguide 120A) and the photonic component 20' is achieved through the lens structure 50.

[0050] In some configurations, the post-alignment of the light source module 10 with the photon assembly 20 may be performed by moving the lens structure 50 with the vacuum suction mechanism 400, then removing the vacuum suction mechanism 400 from the lens structure 50 after the post-alignment is completed, and then the post-alignment of the light source module 10' with the photon assembly 20' may be performed by moving the lens structure 50' with the vacuum suction mechanism 400. In some configurations, the post-alignment of the light source module 10 with the photon assembly 20 and the post-alignment of the light source module 10' with the photon assembly 20' may be performed simultaneously or in the same operation by moving the lens structures 50 and 50' with the vacuum suction mechanisms 400 and 400A, respectively.

[0051] See also Fig.13 , executable with Figure 8 , to place or permanently fix lens structures 50 and 50' at unit-specific locations P1 and P2, respectively. In some configurations, adhesive elements 60, 60A, 60' and 60A' can be cured (e.g., by UV) to place or permanently fix lens structures 50 and 50' at unit-specific locations P1 and P2, respectively.

[0052] In some configurations, a monomerization operation may be performed on the substrate 100A to form a monomerized structure including a light source module 10, a photonic component 20, and a lens structure 50 on the substrate 100 (e.g., an optoelectronic structure 1B), and a monomerized structure including a light source module 10', a photonic component 20', and a lens structure 50' on the substrate 100' (e.g., an optoelectronic structure 1C).

[0053] According to some configurations of the present disclosure, the lens structure includes a support plate that is close to the upper surface of the light source module and the photon assembly at the beginning of the active alignment process. With the configuration, the support plate can be close to and placed on the upper surface of the light source module and the photon assembly during the active alignment process. In other words, this configuration can play a role of pre-alignment in the vertical direction. Therefore, the moving distance of the lens structure along the vertical direction (or along the vertical axis) can be reduced, and the time for adjusting the position of the lens structure along the vertical direction (or along the vertical axis) can be reduced.

[0054] In addition, according to some configurations of the present disclosure, the lens structure is disposed on or attached to the upper surface of the light source module and the photon assembly, rather than being attached to the substrate. For example, the lens structure is disposed above the substrate and is spaced apart from the substrate. Therefore, the lens structure does not contact or connect to the substrate, and particles or adhesive elements that connect the light source module and / or the photon assembly to the substrate can be disposed or extended above the area of ​​the substrate below the lens structure without adversely affecting the configuration of the lens structure. In addition, since the lens structure is not disposed on or connected to a portion of the substrate, the lens structure can be prevented from shifting its position due to contact with particles or adhesive elements on the substrate. Thus, the process can be simplified and the yield can be increased.

[0055] Fig.14A is a top view of a package structure 1000 according to some configurations of the present disclosure, and Fig. 14B is a cross-section of a portion of a package structure 1000 according to some configurations of the present disclosure. Fig. 14B for Fig.14A The package structure 1000 includes a carrier 1100 and optoelectronic structures 1D and 1E on the carrier 1100 .

[0056] In some configurations, the optoelectronic structures 1D and 1E include different structures. In some configurations, the upper surfaces of the light source module 10 and the photonic assembly 20 are at different elevations. In some configurations, the waveguides 220 of the optoelectronic structures 1D and 1E are at different elevations. In some configurations, the lens structure 50 of the optoelectronic structure 1D is different from the lens structure 50' of the optoelectronic structure 1D. In some configurations, the lens structure 50 (or the optical alignment component) is disposed at a unit-specific position P1 relative to the light source module 10 and the photonic assembly 20, and the lens structure 50' (or the optical alignment component) is disposed at a unit-specific position P2 relative to the light source module 10' and the photonic assembly 20'. In some configurations, the unit-specific positions P1 and P2 are different. In some configurations, each unit-specific position P1 and P2 includes the elevation of the lens structure (or optical alignment component) relative to the carrier, the distance between the lens structure (or optical alignment component) and the carrier, the distance between the lens structure (or optical alignment component) and the light source module, the distance between the lens structure (or optical alignment component) and the photon component, the elevation difference between the lens structure (or optical alignment component) and the light source module, the elevation difference between the lens structure (or optical alignment component) and the photon component, and any combination thereof.

[0057] In some configurations, the lens structure 50 includes a support plate 40 and a lens 30 connected to the support plate 40, and the lens structure 50' includes a support plate 40' and a lens 30' connected to the support plate 40'. In some configurations, the support plate 40 is connected to the light source module 10 and the photon assembly 20 by adhesive elements 60 and 60A, and the support plate 40' is connected to the light source module 10' and the photon assembly 20' by adhesive elements 60' and 60A'. In some configurations, the lens 30 of the lens structure 50 is configured to define an optical path between the waveguide 120A of the light source module 10 and the waveguide 220 of the photon assembly 20. In some configurations, the lens 30' of the lens structure 50' is configured to define an optical path between the waveguide 120A of the light source module 10' and the waveguide 220 of the photon assembly 20'. In some configurations, the lens 30 is spaced apart from the substrate 100, and the lens 30' is spaced apart from the substrate 100'. In some configurations, the height or thickness of lenses 30 and 30' is different. In some configurations, the distance of lens 30' to light source module 10' is shorter than the distance to photon assembly 20'. In some configurations, adhesive element 60A covers a portion of the upper surface of support plate 40'.

[0058] Fig. 14C FIG. 1 is a cross-section of a portion of a package structure 1000A according to some configurations of the present disclosure. The package structure 1000A may include optoelectronic structures 1F and 1G. Fig. 14C The structure shown in Figures 14A-14B The differences between the structures are as follows.

[0059] In some configurations, optoelectronic structures 1F and 1G include different structures. In some configurations, the photon assembly 20 has a groove that is recessed from the upper surface of the photon assembly 20. In some configurations, the adhesive elements 60 and 60A have different thicknesses. In some configurations, the optoelectronic structure 1G includes a lens structure 50A, which includes a lens 30, a support plate 40, and an adhesive element 30A that connects the lens 30 to the support plate 40. In some configurations, the support plate 40 includes or is made of a material different from the material of the lens 30. In some configurations, the support plate 40 includes an opaque material. In some configurations, the support plate 40 includes an organic material (e.g., a plastic plate), an inorganic material (e.g., a silicon-based plate or a ceramic plate), a metal material (e.g., a metal plate) or a combination thereof.

[0060] According to some configurations of the present disclosure, the photon assembly 20 has a groove for accommodating and attaching to the adhesive element 60A, and thus the size of the optoelectronic structure in the vertical direction can be reduced. In addition, according to some configurations of the present disclosure, the support plate 40 is formed separately and then connected to the lens 30 through the adhesive element 30A, so that the processing flexibility is increased, and the material, shape and / or structure of the support plate 40 can be relatively flexibly selected according to the actual application.

[0061] Fig.15A is a top view of a package structure 1000B according to some configurations of the present disclosure, and Fig. 15B FIG. 1 is a cross-section of a portion of a package structure 1000B according to some configurations of the present disclosure. The package structure 1000B may include optoelectronic structures 1H and 1I. Figures 15A-15B The structure shown in Figures 14A-14B or Fig. 14C The differences between the structures are as follows.

[0062] In some configurations, the optoelectronic structure 1H includes a lens structure 50P including a lens 30 and a protrusion 30P having a flat upper surface 301 configured to be attached to a vacuum suction mechanism, and the optoelectronic structure 1I includes a lens structure 50P' including a lens 30 and a protrusion 30P having a flat upper surface 301' configured to be attached to a vacuum suction mechanism. In some configurations, the lens structure 50P' is tilted toward the photonic component 20'.

[0063] According to some configurations of the present disclosure, the flat upper surface of the lens 30 configured to be attached to the vacuum suction mechanism is advantageous for picking up and adjusting or moving the lens 30 during the active alignment process. Therefore, the structure of the lens 30 does not require a complex design for connecting with the pickup device during the alignment process, and the lens 30 can be kept relatively small and light, which facilitates the movement of the lens 30 during the active alignment process.

[0064] Fig.16A is a top view of a package structure 1000C according to some configurations of the present disclosure, and Fig. 16B FIG. 1 is a cross-section of a portion of a package structure 1000C according to some configurations of the present disclosure. The package structure 1000C may include optoelectronic structures 1J and 1K. Figures 16A-16B The structure shown in Figures 14A-14B , Fig. 14C or Figures 15A-15B The differences between the structures are as follows.

[0065] In some configurations, the optoelectronic structure 1J includes a lens structure 50", which includes a lens array (e.g., lenses 30, 30', and 30"). The lenses 30, 30', and 30" may have different shapes or structures. In some configurations, the lenses 30, 30', and 30" are all connected to the substrate 100 by a single-piece adhesive element 30A. The lenses 30, 30', and 30" may have a flat upper surface (not shown). In some configurations, the adhesive element 30A may contact a portion of the adhesive element 10A and a portion of the adhesive element 20A. In some configurations, the optoelectronic structure 1K includes a lens structure 50P", which includes a lens 30 and a protrusion 30P having a flat upper surface configured to attach to a vacuum suction mechanism. In some configurations, the width of the protrusion 30P is greater than the width of the lens 30.

[0066] According to some configurations of the present disclosure, the lenses 30, 30' and 30" are all connected to the substrate 100 by a single-piece adhesive element 30A, so that the space between the light source module 10 and the photonic component 20 can be reduced, while providing improved alignment for multiple lenses. In addition, according to some configurations of the present disclosure, the protrusion 30P is relatively wider than the lens 30, and therefore the flat upper surface can be relatively large, which is more advantageous for picking up and moving the lens structure 50P" during the active alignment process.

[0067] Unless otherwise specified, spatial descriptions such as "above", "below", "up", "left", "right", "lower", "top", "bottom", "vertical", "horizontal", "side", "above", "below", "upper", "above", "below", etc. are indicated relative to the orientation shown in the figure. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and that embodiments of the structures described herein may be spatially configured in any orientation or manner, provided that the advantages of the embodiments of the present disclosure are not deviated by such configurations.

[0068] As used herein, the terms "approximately," "substantially," "generally," "about," and "about" are used to describe and explain minor variations. When used in conjunction with an event or circumstance, these terms may refer to instances where the event or circumstance occurred exactly as well as instances where the event or circumstance occurred very approximately. For example, when used in conjunction with a numerical value, these terms may refer to a range of variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first numerical value is within a range of variation of less than or equal to ±10% of a second numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first numerical value may be considered to be "substantially" the same as or equal to the second numerical value. For example, "substantially" vertical can refer to an angular variation range of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0069] If the displacement between the two surfaces is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm, then the two surfaces can be considered to be coplanar or substantially coplanar. If the displacement between the highest point and the lowest point of a surface is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm, then the surface can be considered to be substantially flat.

[0070] As used herein, the singular forms "a," "an," and "the" may include plural or plural referents unless the context clearly indicates otherwise.

[0071] As used herein, the terms "conductive," "electrically conductive," and "conductivity" refer to the ability to carry an electric current. Conductive materials are materials that present little or no resistance to the flow of electric current. One unit of measurement for conductivity is Siemens per meter (S / m). Typically, a conductive material is one that has a conductivity greater than about 10 4 S / m, for example at least 10 5 S / m or at least 10 6 S / m of a material. The conductivity of a material sometimes varies with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0072] In addition, amounts, ratios and other numerical values ​​are sometimes presented herein in a range format. It should be understood that such a range format is used for the sake of convenience and brevity, and should be flexibly construed to include not only the values ​​explicitly specified as the limits of the range, but also all individual values ​​or sub-ranges encompassed within the range, as if each value and sub-range were explicitly specified.

[0073] Although the present disclosure has been described and illustrated with reference to the specific embodiments of the present disclosure, these descriptions and illustrations are not restrictive. It should be understood by those skilled in the art that various changes may be made and equivalents may be replaced without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in the present disclosure and the actual equipment. There may be other embodiments that are not specifically described in the present disclosure. The description and drawings should be regarded as illustrative rather than restrictive. Modifications may be made to make specific situations, materials, material compositions, methods or processes suitable for the goals, spirit and scope of the present disclosure. All such modifications are deemed to be included within the scope of the appended claims. Although the disclosed method has been described herein with reference to specific operations performed in a specific order, it should be understood that these operations may be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the present disclosure.

Claims

1. A method for manufacturing an optoelectronic structure, comprising: Providing a substrate, and providing a light source module and a photon component above the substrate; as well as A lens structure is adjusted to a unit-specific position relative to the substrate to couple an optical signal from the light source module to the photonic assembly.

2. The method according to claim 1, further comprising: When the monitored optical signal reaches a predetermined optimization threshold, it is determined that the lens structure is at the unit-specific position. 3 . The method according to claim 2 , wherein the predetermined optimization threshold comprises a predetermined intensity, a predetermined pattern, a predetermined intensity distribution, a predetermined signal-to-noise (S / N) ratio, or any combination thereof.

4. The method according to claim 1, further comprising: An adhesive element is disposed adjacent to the unit at a specific location.

5. The method according to claim 4, further comprising: The lens structure is aligned to the unit specific position and connected to the adhesive element.

6. The method according to claim 5, further comprising: The adhesive element is cured.

7. The method according to claim 1, further comprising: attaching the flat upper surface of the lens structure to a vacuum suction mechanism; as well as The position of the vacuum suction mechanism is adjusted to adjust the lens structure.

8. The method according to claim 1, wherein adjusting the lens structure comprises moving the lens structure without moving positions of the light source module and the photonic component after providing the light source module and the photonic component above the substrate without turning on the light source module.

9. A method for manufacturing an optoelectronic structure, comprising: Providing a substrate, and providing a first light source module, a first photon component, a second light source module, and a second photon component above the substrate; actively aligning the first light source module with the first photon assembly by moving a first lens structure to a first unit specific position relative to the first photon assembly; as well as The second light source module is actively aligned with the second photon assembly by moving the second lens structure to a second unit specific position relative to the second photon assembly.

10. The method of claim 9, wherein the first unit-specific position relative to the first photonic component is different from the second unit-specific position relative to the second photonic component.

11. The method according to claim 9, further comprising: The first adhesive element and the second adhesive element are cured in the same operation to attach the first lens structure and the second lens structure to the first unit-specific location and the second unit-specific location, respectively.

12. A packaging structure, comprising: an optoelectronic structure comprising a first optical component, a second optical component, and an optical alignment component configured to define an optical path between the first optical component and the second optical component, Wherein the optical alignment component is disposed at a unit-specific position relative to the first optical component and the second optical component.

13. The package structure according to claim 12, wherein the optical alignment component comprises: a support plate connected to the first optical assembly and the second optical assembly; as well as A lens is supported by the support plate and configured to define the optical path between the first optical component and the second optical component. 14 . The package structure of claim 13 , wherein the optoelectronic structure further comprises a substrate, the first optical component and the second optical component are disposed above the substrate, and the lens is spaced apart from the substrate.

15. The package structure of claim 12, wherein the optoelectronic structure further comprises a substrate, the first optical component and the second optical component are disposed above the substrate, and the optical alignment component comprises a lens having a flat upper surface and connected to the substrate by an adhesive element.

16. The package structure of claim 12, wherein the optoelectronic structure further comprises a substrate, the first optical component and the second optical component are attached to the substrate, and the optical alignment component comprises a lens array. 17 . The package structure of claim 12 , further comprising a carrier and a plurality of the optoelectronic structures over the carrier, wherein at least two of the cell-specific locations of the optoelectronic structures are different.

18. The packaging structure according to claim 17, wherein each of the unit specific positions includes the elevation of the optical alignment component relative to the carrier, the distance between the optical alignment component and the carrier, the distance between the optical alignment component and the first optical component, the distance between the optical alignment component and the second optical component, the elevation difference between the optical alignment component and the first optical component, the elevation difference between the optical alignment component and the second optical component, and any combination thereof.

19. The package structure of claim 18, wherein at least two of the first optical components each include a first waveguide, a light source optically coupled to the first waveguide, and an active optical element passively aligned by the first waveguide.

20. The package structure of claim 19, wherein at least two of the optical alignment components of the optoelectronic structure comprise different structures.

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