Electronic equipment and vibration assembly thereof

Abstract

The invention provides electronic equipment and a vibration assembly thereof. The vibration assembly comprises a supporting frame body and a vibration motor, the vibration motor and the supporting frame body are connected through memory hydrogel, and the vibration motor transmits vibration to the supporting frame body through the memory hydrogel. According to the vibration assembly provided by the embodiment of the invention, the memory hydrogel is filled between the vibration motor and the supporting frame body, so that the transmission loss in the vibration process can be reduced, the vibration quantity of the whole machine is further improved, the vibration effect of the electronic equipment is improved under the condition that the vibration motor is not changed, and the product competitiveness of the electronic equipment is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment structures, and in particular to an electronic equipment and a vibration component thereof. Background Art

[0002] Vibration motors are commonly used vibration configuration structures in electronic devices such as mobile phones. In conventional technical solutions, the vibration of the motor is mainly increased by enhancing the vibration intensity of the motor unit, that is, the amplitude of the vibration source; the solutions to enhance the vibration intensity of the motor unit are: 1) increase the size of the motor, use a larger ring magnet, and increase the magnetic induction intensity; 2) use expensive N54 magnetic steel material, also to enhance the induction intensity of the ring magnetic circuit. However, the above solutions have the following problems: 1) It is necessary to reserve more space for the vibration motor, which is not conducive to the overall lightweight design of the electronic device and will occupy the stacking space of other devices; 2) The cost is greatly increased, thereby reducing the overall competitive advantage of the electronic device and sacrificing product profits. Summary of the invention

[0003] A first aspect of an embodiment of the present application provides a vibration component, which includes a supporting frame and a vibration motor, wherein the vibration motor is connected to the supporting frame via a memory hydrogel, and the vibration motor transmits vibration to the supporting frame via the memory hydrogel.

[0004] In a second aspect, an embodiment of the present application provides an electronic device, which includes a display screen, a control circuit board, and the vibration component described in the above embodiment, wherein the supporting frame of the vibration component is the middle frame of the electronic device and is connected to the display screen, and the control circuit board is electrically connected to the display screen and the vibration motor.

[0005] The vibration component provided in the embodiment of the present application can reduce the transmission loss of the vibration process by filling memory hydrogel between the vibration motor and the supporting frame, thereby increasing the vibration amount of the whole machine, improving the vibration effect of the electronic device without changing the vibration motor, and increasing the product competitiveness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0007] Figure 1 It is a schematic diagram of the partial structure of a conventional vibration component;

[0008] Figure 2It is a structural schematic diagram of an embodiment of a vibration assembly of the present application;

[0009] Figure 3 is a structural schematic diagram of another embodiment of the vibration assembly of the present application;

[0010] Figure 4 is a structural schematic diagram of another embodiment of the vibration assembly of the present application;

[0011] Figure 5 is a structural schematic diagram of yet another embodiment of the vibration assembly of the present application;

[0012] Figure 6 It is a structural schematic diagram of another embodiment of the vibration assembly of the present application;

[0013] Figure 7 It is a structural schematic diagram of an embodiment of the electronic device of the present application;

[0014] Figure 8 yes Figure 7 A schematic cross-sectional view of the structure of the electronic device at DD in the embodiment;

[0015] Fig. 9 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0016] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0017] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0018] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0019] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0020] In the design of increasing the vibration of electronic equipment, it is easy to overlook that there is a transmission path for the motor vibration to reach the center of the whole machine. On this vibration transmission path, there are many impedance matching problems of vibration transmission, which will significantly reduce the vibration.

[0021] See also Figure 1 , Figure 1 This is a partial structural diagram of a conventional vibration component, in which the motor 10a is attached to the middle frame 10c through the adhesive 10b, and there is a gap 10d between the left and right sides and the middle frame 10c. The functions of this certain spacing gap 10d are: 1) the motor 10a can be installed; 2) to prevent the motor 10a from vibrating and hitting the middle frame 10c to produce structural noise; 3) to prevent the middle frame 10c from deforming and damaging the motor 10a when it falls. In fact, for the X-axis (arrow direction in the figure) linear motor, the largest deformation is on the shell walls on both sides of the motor, but because of the gap 10d, this vibration cannot be directly transmitted to the middle frame 10c, and must be turned and transmitted through the adhesive 10b at the bottom of the motor. The transmission path of the vibration is as follows: the X-axis vibration of the motor 10a is transmitted to the Z-axis bottom adhesive 10b to pull the middle frame 10c, and finally to the X-axis vibration of the middle frame 10c, which will cause a large loss of vibration.

[0022] In view of this, the present application embodiment provides a structure of a vibration component, please refer to Figure 2 , Figure 2 : is a schematic diagram of the structure of an embodiment of a vibration component of the present application. It should be noted that the vibration component in the present application can be used in electronic devices, and the electronic devices may include mobile phones, tablet computers, laptop computers, wearable devices and other electronic devices with vibration motors. The vibration component includes but is not limited to the following structures: a support frame 100 and a vibration motor 200. The vibration motor 200 is connected to the support frame 100 through a memory hydrogel 300, and the vibration motor 200 transmits vibration to the support frame 100 through the memory hydrogel 300. The support frame 100 can be the middle frame of an electronic device.

[0023] Optionally, see Figure 2 In this embodiment, the support frame 100 is provided with a mounting groove 110, the vibration motor 200 is arranged in the mounting groove 110, and the memory hydrogel 300 is filled between the vibration motor 200 and the inner side wall of the mounting groove 110. The memory hydrogel 300 is added to the gap between the vibration motor 200 and the inner side wall of the mounting groove 110, so that the deformation energy generated by the vibration motor 200 can be directly transmitted to the support frame 100.

[0024] Among them, the memory hydrogel 300 is also called shape-memory hydrogel, which is a hydrophilic polymer with stimulus response behavior to a special stimulus source, and the shape-memory hydrogel has the following properties: on the one hand, there is at least one stable permanent network to maintain its permanent shape; on the other hand, after applying a certain stimulus source to the hydrogel, at least a reversible dynamic network (physical cross-linking or chemical cross-linking) can be formed inside the hydrogel to fix the temporary shape caused by the external force. After the external force is removed, the gel can remember the temporary shape. When a stimulus source of opposite nature is applied to the hydrogel, the hydrogel can recover from the temporary shape to the initial shape. Among them, the memory hydrogel 300 in the embodiment of the present application can be a material composition method in which a polymer material is doped in a gel colloid, for example, a polymer material with magnetic field sensitivity or light sensitivity can be doped in polyacrylamide, so that the shape can be restored or changed under the corresponding stimulus. The detailed characteristics of the material components of the memory hydrogel 300 are within the understanding of those skilled in the art and will not be repeated here.

[0025] When the memory hydrogel 300 is squeezed and deformed, it absorbs the energy of the vibration and temporarily changes its shape. Then, after a short period of time or a corresponding stimulus (the stimulus varies depending on the material of the memory hydrogel 300), it can return to its original state. The hydrogel plays a role similar to a spring and can reduce the vibration loss caused by impedance mismatch. Unlike foam, which only absorbs vibration and converts kinetic energy into heat energy, the hydrogel in the embodiment of the present application basically does not lose vibration, but can release the vibration again, which has a memory effect, thereby reducing the vibration transmission loss and increasing the vibration amount of the whole machine.

[0026] See also Figure 3 , Figure 3 : is a schematic diagram of the structure of another embodiment of the vibration component of the present application, wherein the vibration component in this embodiment may also include: a support frame 100 and a vibration motor 200. The vibration motor 200 is connected to the support frame 100 through a memory hydrogel 300, and the vibration motor 200 transmits vibration to the support frame 100 through the memory hydrogel 300.

[0027] Optionally, see Figure 3The support frame 100 in this embodiment may also be provided with a mounting groove 110, and the vibration motor 200 is disposed in the mounting groove 110. Different from the above-mentioned embodiment, the vibration motor 200 in this embodiment is fixedly connected to the bottom wall 111 of the mounting groove 110 through a glue layer 102, and the glue layer 102 may be adhesive or glue. The memory hydrogel 300 is filled between the vibration motor 200 and the side wall 112 of the mounting groove 110, and the deformation energy generated by the vibration motor 200 is transmitted to the support frame 100 through the glue layer 102 and the memory hydrogel 300. Please refer to the relevant description of the above-mentioned embodiment for the material characteristics of the memory hydrogel 300, which will not be repeated here.

[0028] Optionally, optionally, the vibration direction of the vibration motor 200 in this embodiment is parallel to the bottom wall 111 of the mounting groove 110, that is, the X direction in the figure, and the thickness T of the memory hydrogel 300 on the opposite sides of the vibration direction of the vibration motor 200 is 2-5mm, specifically 2mm, 2.3mm, 2.5mm, 2.8mm, 3mm, 3.2mm, 3.6mm, 4mm, 4.5mm, 4.8mm, 5mm and the like. If the thickness of the memory hydrogel 300 is too thick, the timeliness or response speed of the vibration transmission will deteriorate, and if the thickness is too thin, the functional characteristics of the memory hydrogel 300 cannot be displayed or excessive extrusion and exceeding the deformation limit will occur, and the effect is not obvious. Among them, the thickness range of 2-5mm is the thickness range obtained after multiple experiments, which has both the timeliness of vibration transmission or the fast response speed and the effectiveness of ensuring the functional characteristics of the memory hydrogel.

[0029] The structure of the vibration component in this embodiment ensures the reliability of the connection between the vibration motor and the support frame by designing a combination of adhesive backing and memory hydrogel, while ensuring the effective transmission of vibration of the vibration motor in the vibration direction.

[0030] See also Figure 4 , Figure 41 is a structural schematic diagram of another embodiment of the vibration component of the present application, wherein the vibration component in this embodiment may also include: a support frame 100 and a vibration motor 200. The support frame 100 may also be provided with a mounting groove 110, and the vibration motor 200 is arranged in the mounting groove 110. Different from the above-mentioned embodiment, the vibration motor 200 in this embodiment is fixedly connected to the bottom wall 111 of the mounting groove 110 by a glue layer 102, and the glue layer 102 may be a back glue or glue. The memory hydrogel 300 is filled between the vibration motor 200 and the side wall 112 of the mounting groove 110, and the deformation energy generated by the vibration motor 200 is transmitted to the support frame 100 through the glue layer 102 and the memory hydrogel 300. The vibration direction of the vibration motor 200 is parallel to the bottom wall 111 of the mounting groove 110, that is, the X direction in the figure, and the thickness T of the memory hydrogel 300 on the opposite sides of the vibration direction of the vibration motor 200 is 2-5 mm.

[0031] Different from the above-mentioned embodiment, the side wall 112 of the mounting groove 110 in this embodiment is provided with a concavo-convex structure 1121 for increasing the contact area with the memory hydrogel 300. Since the vibration direction of the vibration motor 200 in this embodiment is the X direction in the figure, the memory hydrogel 300 is easily separated from the side wall 112 of the mounting groove 110 and the vibration motor 200 during the vibration process of the vibration motor 200. Therefore, in this embodiment, a concavo-convex structure 1121 is formed on the side wall 112 of the mounting groove 110, thereby increasing the contact area between the side wall 112 of the mounting groove 110 and the memory hydrogel 300, and reducing the risk of separation of the memory hydrogel 300 from the side wall 112 of the mounting groove 110.

[0032] Please also refer to Figure 5 and Figure 6 , Figure 5 is a structural schematic diagram of another embodiment of the vibration component of the present application, Figure 6 1 is a structural diagram of another embodiment of the vibration assembly of the present application; in order to increase the connection strength between the side wall 112 of the mounting groove 110 and the memory hydrogel 300, other structures can also be set on the side wall 112 of the mounting groove 110, such as Figure 5 In the embodiment, a dovetail groove 1122 is provided on the side wall 112 of the mounting groove 110, and the memory hydrogel 300 is filled in the dovetail groove 1122, and Figure 6 In the embodiment, an inverted T-shaped groove 1123 is provided on the side wall 112 of the installation groove 110, and the memory hydrogel 300 is filled in the inverted T-shaped groove 1123. Figure 5 and Figure 6 The structures in the embodiments can increase the connection strength between the side wall 112 of the mounting groove 110 and the memory hydrogel 300 , that is, improve the connection strength between the memory hydrogel 300 and the supporting frame 100 .

[0033] In addition, the present application also provides an electronic device. The electronic device in this embodiment may include a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. This embodiment is described by taking a mobile phone as an example. Figure 7 and Figure 8 , Figure 7 is a structural diagram of an embodiment of the electronic device of the present application, Figure 8 yes Figure 7 The electronic device in the embodiment is a schematic cross-sectional view of the structure at DD. The electronic device in this embodiment may include a display module 30, a middle frame 10, a control circuit board 20 and a back cover 40. The middle frame 10 may be the support frame 100 in the above embodiment.

[0034] Optionally, the display screen module 30 and the back cover 40 are respectively matched with the middle frame 10 to form an accommodating space 1000, and the control circuit board 20 is disposed in the accommodating space 1000. The control circuit board 20 is electrically connected to the display screen module 30 and a vibration motor (not shown) of the vibration assembly, and the control circuit board 20 is used to control the display screen module 30 and the vibration motor. The detailed technical features of the other parts of the electronic device are within the scope of understanding of those skilled in the art and will not be repeated here.

[0035] See also Fig. 9 , Fig. 9 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The diagram of this embodiment takes a mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen module 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the above embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device.

[0036] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.

[0037] The electronic device in this embodiment can reduce the transmission loss of the vibration process by filling memory hydrogel between the vibration motor and the supporting frame, thereby increasing the vibration amount of the whole machine, improving the vibration effect of the electronic device without changing the vibration motor, and increasing the product competitiveness of the electronic device.

[0038] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A vibration component, characterized in that: The vibration component includes a supporting frame and a vibration motor. The vibration motor is connected to the supporting frame via a memory hydrogel, and the vibration motor transmits vibration to the supporting frame via the memory hydrogel.

2. The vibration assembly according to claim 1, characterized in that The support frame is provided with a mounting groove, the vibration motor is arranged in the mounting groove, and the memory hydrogel is filled between the vibration motor and the inner side wall of the mounting groove.

3. The vibration assembly according to claim 2, characterized in that: The vibration motor is fixedly connected to the bottom wall of the installation groove via a glue layer, and the memory hydrogel is filled between the vibration motor and the side wall of the installation groove.

4. The vibration assembly according to claim 3, characterized in that The vibration direction of the vibration motor is parallel to the bottom wall of the installation groove.

5. The vibration assembly according to claim 4, characterized in that: The thickness of the memory hydrogel on two opposite sides of the vibration direction of the vibration motor is 2-5 mm.

6. The vibration assembly according to claim 4, characterized in that The side wall of the installation groove is provided with a concave-convex structure for increasing the contact area with the memory hydrogel.

7. The vibration assembly according to claim 4, characterized in that The side wall of the installation groove is provided with a dovetail groove, and the memory hydrogel is filled in the dovetail groove.

8. The vibration assembly according to claim 4, characterized in that An inverted T-shaped groove is provided on the side wall of the installation groove, and the memory hydrogel is filled in the inverted T-shaped groove.

9. The vibration assembly according to any one of claims 1 to 8, characterized in that: The memory hydrogel comprises a gel colloid and a polymer material doped in the gel colloid.

10. An electronic device, characterized in that: The electronic device comprises a display screen, a control circuit board and the vibration component according to any one of claims 1 to 9, the support frame of the vibration component is the middle frame of the electronic device and is connected to the display screen, and the control circuit board is electrically connected to the display screen and the vibration motor.

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