Low-temperature-rise local encryption type sine ripple micro-channel radiator

Abstract

The invention relates to the field of heat dissipation, in particular to a low-temperature-rise local encryption type sine wave microchannel radiator which comprises a top plate and a bottom plate, the inner wall of the top plate is provided with a liquid inlet, a heat dissipation cavity and a liquid outlet, and the interior of the heat dissipation cavity is fixedly connected with a heat dissipation mechanism and a bubble eliminating mechanism. The bottom plate is provided with a plurality of groups of micro-channels corresponding to the heat dissipation mechanism; the bubble eliminating mechanism comprises a limiting assembly, an eliminating assembly is arranged in the limiting assembly, and a storage assembly is fixedly connected to the top of the limiting assembly. According to the device, the liquid inlet amount of the bubble eliminating mechanism can be adjusted according to specific working conditions, and when the temperature of a cooled part is increased, in order to maintain stable operation of the cooled part, the cooling efficiency is improved; the flow speed in the radiator can be synchronously increased, so that stable operation of heat dissipation work is guaranteed, the rising speed of bubbles under the same stroke can be relatively slow while the flow speed is increased, the height of the eliminating assembly is reduced, and cooling liquid with the bubbles can be intercepted more effectively.

Description

Technical Field

[0001] The invention relates to the field of heat dissipation, in particular to a low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator. Background Art

[0002] With the continuous development of electronic mechanical systems, the power of chip systems continues to increase, but at the same time it also leads to excessive heat generation inside the system. In addition to generating a large average heat flux, there may also be local hot spots in the system that are many times higher than the average heat flux, which makes traditional air-cooled radiators unable to meet the heat dissipation needs. Microchannel heat dissipation technology is a method of using fluid flow in tiny channels to achieve efficient heat dissipation. Since microchannels have a large surface area to volume ratio, they can significantly improve heat dissipation efficiency. Therefore, they have received widespread attention and application in the field of electronic equipment heat dissipation. Sine corrugated manifold microchannels have the advantages of increasing fluid disturbance, expanding heat exchange area, and improving fluid distribution.

[0003] It is difficult to completely fill the coolant into the radiator in the initial stage, which will cause bubbles to exist inside the coolant. When the coolant contacts the heat dissipation components, part of the liquid will vaporize into bubbles. When the cooling cycle is carried out, the coolant enters the microchannel radiator. After the bubbles in the coolant enter the microchannel, they will occupy the space inside the microchannel, reducing the contact area between the coolant and the inner wall of the heat dissipation channel, thereby reducing the heat transfer efficiency. At the same time, the aggregation of bubbles may also cause unstable liquid flow and increase the flow resistance of the coolant, which will prevent the coolant from absorbing the heat of the heat dissipation components in time and reduce the heat absorption efficiency. Therefore, we designed a low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator. Summary of the invention

[0004] In view of the problem that bubbles in the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator mentioned above or in the prior art are difficult to eliminate, the present invention is proposed.

[0005] Therefore, the object of the present invention is to provide a low temperature rise local encryption type sinusoidal corrugated microchannel radiator.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: a low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator, comprising a top plate and a bottom plate, the inner wall of the top plate is respectively provided with a liquid inlet, a heat dissipation cavity and a liquid discharge port, the heat dissipation cavity is respectively fixedly connected with a heat dissipation mechanism and a bubble elimination mechanism, and the bottom plate is provided with multiple groups of microchannels corresponding to the heat dissipation mechanism; the bubble elimination mechanism comprises a limiting component, an elimination component is arranged inside the limiting component, and a storage component is fixedly connected to the top of the limiting component; the limiting component comprises an installation box, a positioning plate is fixedly connected inside the installation box, an adjustment frame is slidably connected to the positioning plate, a first positioning rod and a second positioning rod are respectively slidably connected to the inner wall of the adjustment frame and the installation box, and a memory metal belt is arranged between the first positioning rod and the second positioning rod.

[0007] As a preferred solution of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator of the present invention, wherein: the elimination component includes a first inclined plate and a second inclined plate fixed inside the installation, the inside of the installation box is located at the bottom of the first inclined plate and the second inclined plate respectively fixedly connected with a first guide plate and a second guide plate, the bottom of the second guide plate is fixedly connected with an anti-slip plate, the bottom of the adjustment frame is fixedly connected with a vertical slide plate, a plurality of drain ports are provided at the corners of the vertical slide plate, a convex strip is fixedly connected to the inner wall of the vertical slide plate, a drainage window is provided on the side of the installation box close to the adjustment frame, and corrugated slits are provided on both sides of the top of the installation box; the storage component includes a storage cavity opened inside the heat dissipation cavity, a connecting seat is fixedly connected to the bottom of the storage cavity, a connecting hole is provided at the bottom of the connecting seat, and the connecting seat is located inside the storage cavity and is fixedly connected with an expansion hood.

[0008] As a preferred solution of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator of the present invention, the memory metal belt is arranged in a corrugated shape, and the outer walls of the first positioning rod and the second positioning rod are both in contact with the corners of the memory metal belt.

[0009] As a preferred solution of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator of the present invention, the storage cavity is located at the highest point of the top of the heat dissipation cavity, the bottom of the connecting seat is inwardly concave, and the connecting hole is located at the highest point of the concave of the connecting seat.

[0010] As a preferred solution of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator of the present invention, wherein: a gap is left between the first inclined plate and the second inclined plate, and the gap is located directly below the connecting hole; the tops of the first guide plate and the second guide plate are both arc-shaped, and a slit is left between the highest points of the tops of the first guide plate and the second guide plate, and the slit is located directly below the connecting hole.

[0011] As a preferred solution of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator of the present invention, the horizontal distance between the first guide plate and the inner wall of the installation box gradually increases from bottom to top, the vertical distance between the first guide plate and the vertical slide plate gradually increases from the first inclined plate to the second inclined plate, and the bottom of the vertical slide plate is inclined.

[0012] As a preferred solution of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator of the present invention, the inner wall of the drainage window is in contact with the outer wall of the adjustment frame, and the adjustment frame is located between the second guide plate and the positioning plate.

[0013] As a preferred solution of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator of the present invention, wherein: the heat dissipation mechanism includes a plurality of fins, a serpentine baffle and a partition plate, and the serpentine baffle is a sinusoidal wave structure; the microchannel includes a liquid inlet channel opened on the bottom plate, a diversion channel is provided at the bottom of the liquid inlet channel, and liquid outlet channels are opened on both sides of the top of the diversion channel.

[0014] As a preferred solution of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator of the present invention, the multiple fins are arranged in a pin-fin array, the serpentine baffle divides the heat dissipation cavity into a liquid inlet cavity and a liquid discharge cavity, and the partition plate and the inner wall of the heat dissipation cavity separate the liquid discharge cavity.

[0015] As a preferred solution of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator of the present invention, wherein: a plurality of the microchannels are distributed on the bottom plate in a rectangular array and are adapted to the serpentine baffle, the fins, serpentine baffles and partition plates are all made of copper, and the materials of the top plate and the bottom plate are both silicon.

[0016] The low-temperature rise local encrypted sinusoidal corrugated microchannel radiator of the present invention has the following beneficial effects: the liquid inlet amount of the bubble elimination mechanism can be adjusted according to specific working conditions. When the temperature of the heat dissipated component rises, in order to maintain the stable operation of the heat dissipated component, the flow rate in the radiator will be increased synchronously to ensure the stable operation of the heat dissipation work. While the flow rate increases, the rising speed of the bubbles will be relatively slow under the same stroke. By reducing the height of the elimination component, the coolant with bubbles can be more effectively intercepted. The partition plate divides the drainage chamber into six parts. The walls of the drainage chamber are provided with sinusoidal corrugations, which can effectively increase fluid disturbance, expand the heat exchange area and improve the fluid distribution. One side of the drainage chamber is corrugated and the other side is flat. When the coolant is discharged, the width of the flow channel changes continuously, so that when the coolant flows, increasing the flow rate can change the flow state and increase the degree of turbulent pulsation. Increasing the flow rate when turbulent in the flow channel has a more significant effect on enhancing heat transfer energy, thereby improving the heat dissipation efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0018] Figure 1 This is a schematic diagram of the overall structure of a low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0019] Figure 2 Schematic diagram of the internal structure of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0020] Figure 3 Schematic diagram of the internal structure of the top plate of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0021] Figure 4 for Figure 3 Enlarged view of point A in the middle.

[0022] Figure 5 Schematic diagram of the elimination component structure of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0023] Figure 6 Schematic diagram of the bubble elimination mechanism of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0024] Figure 7 A cross-sectional view of the bubble elimination mechanism of a low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0025] Figure 8 Schematic diagram of the top and bottom plates of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0026] Fig. 9 Schematic diagram of the limiting component of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0027] Fig.10 Schematic diagram of the microchannel and serpentine baffle of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0028] Fig.11 Schematic diagram of the internal structure of the microchannel of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0029] Fig.12 This is a cross-sectional view of the microchannel of a low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0030] Fig.13 Schematic diagram of the serpentine baffle of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0031] Fig.14 A top view of the serpentine baffle of a low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0032] Fig.15 Schematic diagram of the serpentine baffle and liquid inlet channel of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator.

[0033] In the figure: 1, top plate; 10, liquid inlet; 11, heat dissipation cavity; 12, liquid discharge port; 2, bottom plate; 3, heat dissipation mechanism; 30, fin plate; 31, serpentine baffle; 32, partition plate; 33, liquid inlet cavity; 34, liquid discharge cavity; 4, bubble elimination mechanism; 40, limit assembly; 41, elimination assembly; 42, storage assembly; 401, installation box; 402, positioning plate; 403, adjustment frame; 404, first positioning rod; 405, second positioning rod; 406 , memory metal belt; 410, first inclined plate; 411, second inclined plate; 412, first guide plate; 413, second guide plate; 414, anti-slip plate; 415, vertical slide plate; 416, drain port; 417, convex strip; 418, drainage window; 419, corrugated slit; 421, storage cavity; 422, connecting seat; 423, connecting hole; 424, expansion cover; 5, microchannel; 50, liquid inlet channel; 51, diversion channel; 52, liquid outlet channel. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0035] Example 1, reference Figures 1 to 9 , which is the first embodiment of the present invention, provides a low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator, which can achieve the effect of eliminating and isolating bubbles in the coolant while dissipating heat, and comprises a top plate 1 and a bottom plate 2, the inner wall of the top plate 1 is respectively provided with a liquid inlet 10, a heat dissipation cavity 11 and a liquid discharge port 12, the inside of the heat dissipation cavity 11 is respectively fixedly connected with a heat dissipation mechanism 3 and a bubble elimination mechanism 4, and the bottom plate 2 is provided with a plurality of microchannels 5 corresponding to the heat dissipation mechanism 3.

[0036] Furthermore, the liquid inlet 10 and the liquid drain port 12 are both located at the top of the side wall of the heat dissipation cavity 11, and the cross-sections of the liquid inlet 10 and the liquid drain port 12 are both circular. The circular setting can make the liquid in and out smoother, and the center points of the liquid inlet 10 and the liquid drain port 12 are located on the same horizontal line. The heat dissipation cavity 11 is located at the bottom center of the top plate 1. The setting of the heat dissipation mechanism 3 can effectively transfer the heat on the bottom plate 2 into the coolant, and the setting of the microchannel 5 can effectively increase the contact area between the bottom plate 2 and the coolant, improve the heat conduction efficiency, and thus improve the heat dissipation efficiency.

[0037] The bubble elimination mechanism 4 includes a limit assembly 40, an elimination assembly 41 is provided inside the limit assembly 40, and a storage assembly 42 is fixedly connected to the top of the limit assembly 40; the limit assembly 40 includes an installation box 401, a positioning plate 402 is fixedly connected inside the installation box 401, an adjustment frame 403 is slidably connected to the positioning plate 402, and a first positioning rod 404 and a second positioning rod 405 are respectively slidably connected to the adjustment frame 403 and the inner wall of the installation box 401 in a transverse direction, and a memory metal belt 406 is provided between the first positioning rod 404 and the second positioning rod 405. The memory metal belt 406 is arranged in a corrugated shape, and the outer walls of the first positioning rod 404 and the second positioning rod 405 are both fitted with the corners of the memory metal belt 406.

[0038] Reference Figures 4 to 8 , wherein the setting of the limiting component 40 can effectively limit the eliminating component 41 and the storage component 42, the setting of the installation box 401 can protect the liquid inside it, reduce the impact of external turbulence, and avoid the external turbulence affecting the removal of bubbles, the setting of the storage component 42 can store bubbles, and the bubble elimination mechanism 4 can effectively separate the bubbles in the liquid. The setting of the first positioning rod 404 and the second positioning rod 405 can effectively contact the memory metal belt 406. The material of the memory metal belt 406 is a nickel-titanium-based shape memory alloy and has a two-way memory effect. Figure 8 , the memory metal strip 406 is Figure 8 The shape in the middle upper part has a height of H1, which is Figure 8 The shape is in the middle and lower part, and its height is H2. The height of H1 is greater than H2. The second positioning rod 405 is connected to the installation box 401. The height of the second positioning rod 405 will not change. Because the height of the memory metal belt 406 is reduced, the second positioning rod 405 is driven to descend. The second positioning rod 405 descends and drives the adjustment frame 403 to descend, so as to achieve the purpose of adjusting the elimination component 41. When working, the coolant will heat up after receiving the heat from the bottom plate 2. After reaching 50 degrees, it will drive the adjustment frame 403 to descend, and then drive the elimination component 41 to descend, thereby increasing the liquid intake of the bubble elimination mechanism 4. The adjustment frame 403 and the vertical slide 415 are both lightweight. The materials have densities less than that of the coolant and have buoyancy in the coolant. At the same time, the coolant will generate a certain lift on the bottom of the vertical slide 415 during operation. When the memory metal belt 406 is at room temperature, the memory metal belt 406 returns to its initial state, and the adjustment frame 403 and the vertical slide 415 are reset under the action of buoyancy and lift, and at the same time drive the first positioning rod 404 to fit with the memory metal belt 406, and the second positioning rod 405 and the memory metal belt 406 block the first positioning rod 404 to prevent it from rising excessively, so that the first positioning rod 404, the second positioning rod 405 and the memory metal belt 406 return to their initial states.

[0039] In summary, the setting of the microchannel 5 can effectively increase the contact area between the base plate 2 and the coolant and improve the heat conduction efficiency. The setting of the storage component 42 can store bubbles. The setting of the installation box 401 can protect the liquid inside it and reduce the impact of external turbulence.

[0040] Example 2, reference Figures 1 to 9 , which is the second embodiment of the present invention, is different from the elimination component 41 and the storage component 42 of the previous embodiment. This embodiment provides an elimination component 41 and a storage component 42 of a low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator, which solves the problem of eliminating and isolating bubbles in the coolant. The elimination component 41 includes a first inclined plate 410 and a second inclined plate 411 fixed inside the installation.

[0041] Reference Figure 5 , wherein the length of the first inclined plate 410 is greater than the length of the second inclined plate 411. When the liquid enters the bottom of the first inclined plate 410, according to the Archimedes principle, the buoyancy of the bubbles in the coolant will exceed their own gravity, so the bubbles will be pushed to the top of the coolant, that is, the surface of the liquid. This is because the larger the volume occupied by the bubbles in the liquid, the greater the buoyancy, which causes the bubbles to rise to a higher place. The bubbles in the coolant at the bottom of the first inclined plate 410 rise under the action of buoyancy, but the coolant moves at the bottom of the first inclined plate 410 and moves toward the second inclined plate 411. Therefore, the length of the first inclined plate 410 is set to be greater than the length of the second inclined plate 411, so that the bubbles in the coolant pass through the gap between the first inclined plate 410 and the second inclined plate 411. If the bubbles in the coolant continue to move after passing the first inclined plate 410, they will adhere to the bottom of the second inclined plate 411 and move upward under the action of buoyancy, and can also be discharged through the gap between the first inclined plate 410 and the second inclined plate 411.

[0042] Reference Figures 4 to 9, the inside of the installation box 401 is located at the bottom of the first inclined plate 410 and the second inclined plate 411, and the first guide plate 412 and the second guide plate 413 are fixedly connected respectively, and the bottom of the second guide plate 413 is fixedly connected to the anti-slip plate 414, and the bottom of the adjustment frame 403 is fixedly connected to the vertical slide plate 415, and a plurality of drain ports 416 are provided at the corners of the vertical slide plate 415, and a convex strip 417 is fixedly connected to the inner wall of the vertical slide plate 415, and a drainage window 418 is provided on the side of the installation box 401 close to the adjustment frame 403, and corrugated slits 419 are provided on both sides of the top of the installation box 401; the storage component 42 includes a storage cavity 421 opened in the heat dissipation cavity 11, and a connecting seat 422 is fixedly connected to the bottom of the storage cavity 421, and the bottom of the connecting seat 422 is opened A connecting hole 423 is provided, and a connecting seat 422 is located inside the storage cavity 421 and is fixedly connected with an expansion cover 424. The storage cavity 421 is located at the highest point of the top of the heat dissipation cavity 11, and the bottom of the connecting seat 422 is inwardly concave. The connecting hole 423 is located at the highest point of the concave of the connecting seat 422, so that bubbles can better enter the expansion cover 424 under the action of buoyancy. A gap is left between the first inclined plate 410 and the second inclined plate 411, and the gap is located directly below the connecting hole 423. The tops of the first guide plate 412 and the second guide plate 413 are both arc-shaped, and a slit is left between the highest points of the tops of the first guide plate 412 and the second guide plate 413, and the slit is located directly below the connecting hole 423, so that bubbles floating up in the slit can be collected; Reference Figure 5 and Fig. 9 The first guide plate 412 can effectively divert the coolant entering the installation box 401, so that the coolant at the bottom of the first guide plate 412 is discharged through the first guide plate 412 and the drain port 416, and the coolant at the side of the first guide plate 412 moves along the first guide plate 412 obliquely upward, and when the bubbles in the coolant passing the bottom of the first guide plate 412 rise, they will rise through the anti-slip plate 414, and they will be discharged along the anti-slip plate 414, the second guide plate 413, the slit between the first guide plate 412 and the second guide plate 413, and the second inclined plate 411. The bubbles are located in the coolant in the upper and middle layers. When the bubbles are located in the heat dissipation cavity 11, they move to the surrounding of the mounting box 401 under the action of their buoyancy. The bubbles enter the bottom of the connecting seat 422 when passing through the corrugated slit 419, and enter the expansion hood 424 through the connecting hole 423. When the coolant is heated up, the coolant inside it vaporizes, which increases the pressure inside the radiator. The pressure will drive the expansion hood 424 to expand, thereby better maintaining the pressure inside the radiator and ensuring the stable operation of the radiator.

[0043] Reference Figure 5, the horizontal distance between the first guide plate 412 and the inner wall of the installation box 401 gradually increases from bottom to top. When the coolant passes between the first guide plate 412 and the inner wall of the installation box 401, its flow channel gradually increases, the pressure gradually decreases, and the flow rate decreases due to the change in the flow channel diameter. At this time, the coolant stays in the flow channel for a longer time. When the coolant moves slowly in the flow channel, according to Archimedes' theory, the bubbles in the coolant will gradually rise from the bottom of the flow channel to the top of the flow channel under the action of their own buoyancy, and finally be discharged along the first inclined plate 410 and the second inclined plate 411. The vertical distance between the first guide plate 412 and the vertical slide plate 415 is from The first inclined plate 410 gradually increases toward the second inclined plate 411. When the coolant at the bottom of the first guide plate 412 moves, the bottom of the vertical slide plate 415 is inclined, and its flow channel gradually increases, the pressure gradually decreases, and the flow rate decreases due to the change in the diameter of the flow channel. At this time, the coolant stays in the flow channel for a longer time. When the coolant moves slowly in the flow channel, according to Archimedes' theory, the bubbles in the coolant will gradually rise from the bottom of the flow channel to the top of the flow channel under the action of their own buoyancy, and finally gather in the slits inside the first guide plate 412 and the second guide plate 413, and be discharged through the first inclined plate 410 and the second inclined plate 411. The inner wall of the drain window 418 is in contact with the outer wall of the adjustment frame 403, and the adjustment frame 403 is located between the second guide plate 413 and the positioning plate 402.

[0044] The rest of the structure is the same as that of Example 1.

[0045] Reference Figures 1 to 9 When working, when the coolant is at 50 degrees Celsius or below, the vertical slide 415 is in a normal state. When the temperature of the coolant is greater than 50 degrees Celsius, the memory metal belt 406 drives the second positioning rod 405 to descend. The second positioning rod 405 descends and drives the adjustment frame 403 and the vertical slide 415 to descend, so as to achieve the purpose of adjusting the height of the vertical slide 415 in the bubble elimination component 41. The vertical slide 415 descends, increasing the liquid inlet amount of the bubble elimination mechanism 4, and the coolant at the liquid inlet 10 flows into the heat dissipation cavity 11. The bubbles move in an inclined state under the action of buoyancy and thrust, so that the coolant with bubbles is generally in a heat dissipation state. In the higher area of ​​the cavity 11, the bubble elimination mechanism 4 is located at the top of the heat dissipation cavity 11, which can better collect the coolant with bubbles. When the coolant passes through the bubble elimination mechanism 4, it will be separated into upper and lower flow channels by the first guide plate 412. The bottom flow channel has a faster speed and less bubble content. The bubbles are blocked by the second guide plate 413 and the anti-slip plate 414 during the flow process, so that the bubbles rise under the action of buoyancy and pass through the slit between the first guide plate 412 and the second guide plate 413, the gap between the first inclined plate 410 and the second inclined plate 411, and the connecting hole 423 to enter the expansion cover 424; The flow rate in the upper flow channel is slower than that in the lower flow channel, and the bubble content in the coolant is higher. The bubbles rise during the movement and adhere to the bottom of the first inclined plate 410 and the second inclined plate 411. Under the action of buoyancy, the bubbles pass through the gap between the first inclined plate 410 and the second inclined plate 411 and the connecting hole 423 and enter the expansion cover 424. The bubbles at the top of the heat dissipation cavity 11 enter the expansion cover 424 through the corrugated slits 419 and the connecting holes 423 under the action of buoyancy.

[0046] In summary, setting the length of the first inclined plate 410 to be greater than the length of the second inclined plate 411 can better allow the bubbles in the coolant to pass through the gap between the first inclined plate 410 and the second inclined plate 411. If the bubbles in the coolant continue to move after passing the first inclined plate 410, they will adhere to the bottom of the second inclined plate 411 and move upward along the second inclined plate 411 under the action of buoyancy, and can also be discharged through the gap between the first inclined plate 410 and the second inclined plate 411.

[0047] Example 3, reference Figure 2 to Figure 15 , which is the third embodiment of the present invention. The difference from the previous embodiment is the heat dissipation mechanism 3 and the microchannel 5. This embodiment provides a heat dissipation mechanism 3 and a microchannel 5 of a low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator, which solves the heat dissipation problem of the low-temperature rise locally encrypted sinusoidal corrugated microchannel radiator. The heat dissipation mechanism 3 includes a plurality of fins 30, a serpentine baffle 31 and a partition plate 32.

[0048] Reference Figure 2 and Fig.10 Furthermore, the cross-section of the fin 30 is set in a water drop shape, which can effectively generate turbulence, and the bubbles can attach to the fin 30 and move upward, thereby enhancing fluid mixing and increasing the surface area. The sinusoidal corrugated serpentine baffle 31 and the microchannel 5 can effectively increase fluid disturbance and expand the heat exchange area.

[0049] The serpentine baffle 31 is in a sinusoidal structure; the multiple fins 30 are arranged in a pin-fin array, the serpentine baffle 31 divides the heat dissipation chamber 11 into a liquid inlet chamber 33 and a liquid discharge chamber 34, and the partition plate 32 and the inner wall of the heat dissipation chamber 11 separate the liquid discharge chamber 34. Multiple microchannels 5 are distributed on the bottom plate 2 in a rectangular array and are adapted to the serpentine baffle 31. The fins 30, the serpentine baffle 31, and the partition plate 32 are all made of copper, and the materials of the top plate 1 and the bottom plate 2 are both silicon. The microchannel 5 includes a liquid inlet channel 50 opened on the bottom plate 2, a diversion channel 51 is provided at the bottom of the liquid inlet channel 50, and liquid outlet channels 52 are opened on both sides of the top of the diversion channel 51.

[0050] Reference Figure 10 to Figure 15Among them, when the serpentine baffle 31 enters the microchannel 5, the liquid inlet cavity 33 is connected with the liquid inlet channel 50 of the microchannel 5. After the coolant absorbs part of the heat on the serpentine baffle 31, it enters the diversion channel 51 and the liquid outlet channel 52, which can effectively absorb the heat located in the bottom plate 2 and discharge the coolant through the liquid discharge cavity 34. The coolant absorbs the heat from the serpentine baffle 31 in both the liquid inlet cavity 33 and the liquid discharge cavity 34 of the serpentine baffle 31. The partition plate 32 divides the liquid discharge cavity 34 into six, the liquid inlet cavity 33 into three, and the cavity walls of the liquid discharge cavity 34 and the liquid inlet cavity 33 are provided with sinusoidal corrugations, which can effectively increase the fluid disturbance, expand the heat exchange area, and improve the advantages of fluid distribution. Fig.14 One side of the discharge cavity 34 is corrugated and the other side is flat. When the coolant is discharged, the width of the flow channel changes continuously, so that when the coolant flows, increasing the flow velocity can change the flow state and increase the degree of turbulent pulsation. Increasing the flow velocity when turbulent in the flow channel has a more significant effect on enhancing heat transfer energy, thereby improving the heat dissipation efficiency of the device.

[0051] The rest of the structure is the same as that of Example 2.

[0052] In summary, compared with the prior art, this technical solution can adjust the liquid inlet amount of the bubble elimination mechanism 4 according to the specific working conditions. When the temperature of the heat dissipated component rises, in order to maintain the stable operation of the heat dissipated component, the flow rate in the radiator will be increased synchronously to ensure the stable operation of the heat dissipation work. While the flow rate increases, the rising speed of bubbles will be relatively slow under the same stroke. Reducing the height of the elimination component 41 can more effectively intercept the coolant with bubbles.

[0053] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A low temperature rise local encryption type sinusoidal corrugated microchannel radiator, characterized in that: It comprises a top plate (1) and a bottom plate (2), wherein the inner wall of the top plate (1) is respectively provided with a liquid inlet (10), a heat dissipation cavity (11) and a liquid discharge port (12), wherein the heat dissipation cavity (11) is respectively fixedly connected with a heat dissipation mechanism (3) and a bubble elimination mechanism (4), and the bottom plate (2) is provided with a plurality of groups of microchannels (5) corresponding to the heat dissipation mechanism (3); The bubble elimination mechanism (4) comprises a limiting component (40), an elimination component (41) is provided inside the limiting component (40), and a storage component (42) is fixedly connected to the top of the limiting component (40); The position limiting assembly (40) comprises an installation box (401), a positioning plate (402) is fixedly connected inside the installation box (401), an adjustment frame (403) is slidably connected to the positioning plate (402), a first positioning rod (404) and a second positioning rod (405) are respectively slidably connected to the adjustment frame (403) and the inner wall of the installation box (401) in a transverse manner, and a memory metal belt (406) is provided between the first positioning rod (404) and the second positioning rod (405).

2. The low temperature rise local encrypted sinusoidal corrugated microchannel radiator according to claim 1, characterized in that: The elimination component (41) comprises a first inclined plate (410) and a second inclined plate (411) fixed inside the installation; a first guide plate (412) and a second guide plate (413) are fixedly connected at the bottom of the first inclined plate (410) and the second inclined plate (411) inside the installation box (401), respectively; an anti-slip plate (414) is fixedly connected at the bottom of the second guide plate (413); a vertical slide plate (415) is fixedly connected at the bottom of the adjustment frame (403); a plurality of drain ports (416) are provided at the corners of the vertical slide plate (415); a convex strip (417) is fixedly connected to the inner wall of the vertical slide plate (415); a liquid discharge window (418) is provided on one side of the installation box (401) close to the adjustment frame (403); and corrugated slits (419) are provided on both sides of the top of the installation box (401); The storage assembly (42) comprises a storage cavity (421) opened inside the heat dissipation cavity (11); a connecting seat (422) is fixedly connected to the bottom of the storage cavity (421); a connecting hole (423) is opened at the bottom of the connecting seat (422); and an expansion cover (424) is fixedly connected to the connecting seat (422) located inside the storage cavity (421).

3. The low temperature rise local encrypted sinusoidal corrugated microchannel radiator according to claim 2, characterized in that: The memory metal belt (406) is arranged in a corrugated shape, and the outer walls of the first positioning rod (404) and the second positioning rod (405) are both in contact with the corners of the memory metal belt (406).

4. The low temperature rise local density sinusoidal corrugated microchannel radiator according to claim 2 or 3, characterized in that: The storage cavity (421) is located at the highest point of the top of the heat dissipation cavity (11); the bottom of the connecting seat (422) is arranged to be inwardly concave; and the connecting hole (423) is located at the highest point of the concave portion of the connecting seat (422).

5. The low temperature rise local encrypted sinusoidal corrugated microchannel radiator according to claim 4, characterized in that: A gap is left between the first inclined plate (410) and the second inclined plate (411), and the gap is located directly below the connecting hole (423); the tops of the first guide plate (412) and the second guide plate (413) are both arc-shaped; a slit is left between the highest points of the tops of the first guide plate (412) and the second guide plate (413), and the slit is located directly below the connecting hole (423).

6. The low temperature rise local encrypted sinusoidal corrugated microchannel radiator according to claim 5, characterized in that: The horizontal distance between the first guide plate (412) and the inner wall of the installation box (401) gradually increases from bottom to top, the vertical distance between the first guide plate (412) and the vertical slide plate (415) gradually increases from the first inclined plate (410) to the second inclined plate (411), and the bottom of the vertical slide plate (415) is inclined.

7. The low temperature rise local encrypted sinusoidal corrugated microchannel radiator according to claim 6, characterized in that: The inner wall of the liquid discharge window (418) is in contact with the outer wall of the adjustment frame (403), and the adjustment frame (403) is located between the second guide plate (413) and the positioning plate (402).

8. The low temperature rise local encrypted sinusoidal corrugated microchannel radiator according to claim 7, characterized in that: The heat dissipation mechanism (3) comprises a plurality of fins (30), a serpentine baffle (31) and a partition plate (32), wherein the serpentine baffle (31) is in a sinusoidal wave structure; The microchannel (5) comprises a liquid inlet channel (50) opened on the bottom plate (2), a diversion channel (51) is provided at the bottom of the liquid inlet channel (50), and liquid outlet channels (52) are opened on both sides of the top of the diversion channel (51).

9. The low temperature rise locally encrypted sinusoidal corrugated microchannel radiator according to claim 8, characterized in that: The plurality of fins (30) are arranged in a pin-fin array, the serpentine baffle (31) divides the heat dissipation cavity (11) into a liquid inlet cavity (33) and a liquid discharge cavity (34), and the partition plate (32) and the inner wall of the heat dissipation cavity (11) separate the liquid discharge cavity (34).

10. The low temperature rise local density sinusoidal corrugated microchannel radiator according to claim 9, characterized in that: The plurality of microchannels (5) are distributed on the bottom plate (2) in a rectangular array and are adapted to the serpentine baffle (31); the fin plate (30), the serpentine baffle (31) and the partition plate (32) are all made of copper; and the top plate (1) and the bottom plate (2) are both made of silicon.

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