Automatic micro-module mounting equipment

Abstract

According to the automatic micro-module mounting equipment disclosed by the invention, the positioning detection mechanism, the black glue dispensing mechanism, the micro-module mounting mechanism and the UV glue dispensing mechanism are intensively arranged on the XY bidirectional transplanting mechanism, so that the micro-module mounting operation is intensively performed in one area, and frequent transfer of a circuit board on which a micro-module is to be mounted is avoided; the positioning difficulty of dispensing and mounting is reduced, so that the mounting precision and efficiency of the micro module are improved; the processing jigs are detachably arranged on the horizontal carrier plate along the X axis and the Y axis in an array manner, so that the mounting and positioning difficulty of the micro module is further reduced, and meanwhile, the feeding efficiency of the mounting equipment can also be improved; the micro module is transferred and mounted in a negative pressure adsorption mode, and the grabbing efficiency of the micro module is high; the upper camera and the lower camera are adopted to correct the position of the micro-module, so that the mounting precision of the micro-module is improved; meanwhile, the invention further discloses a micro-module feeding bin capable of automatically positioning and feeding the micro-modules, upper and lower cameras do not need to be used for correcting the positions of the micro-modules, and the mounting efficiency of the micro-modules is further improved.

Description

Technical Field

[0001] The invention relates to the technical field of micro-module assembly, and in particular to a micro-module automatic mounting device. Background Art

[0002] A micromodule on a circuit board is a miniaturized electronic component that is often used in applications such as radio frequency, communications, and sensors. For example, a heat sink helps electronic components dissipate heat to prevent performance degradation or damage due to overheating. Micromodules are characterized by integration, miniaturization, high performance, and versatility. They are installed with extremely high positioning accuracy to ensure proper alignment of optical paths or other critical functions.

[0003] In the process of micro-module mounting, multiple steps are required, such as applying black glue, mounting micro-modules, applying UV glue, and curing UV glue. Currently, the main mounting method is segmented operation. Circuit boards and micro-modules need to be transferred many times, and the position of the circuit boards needs to be repeatedly determined, which makes it difficult to improve the efficiency and accuracy of mounting.

[0004] Therefore, in view of the shortcomings of the prior art, it is necessary to design a micro-module automatic mounting device.

[0005] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solution of the present invention and facilitating the understanding of those skilled in the art. It cannot be considered that the above contents are well known to those skilled in the art simply because they are explained in the background technology of the present invention. Summary of the invention

[0006] In order to overcome the above-mentioned deficiencies in the prior art, the present invention aims to disclose a micro-module automatic mounting device for solving the problem that it is difficult to improve the precision of traditional micro-module mounting efficiency.

[0007] The present invention discloses a micro-module automatic mounting device, comprising a workbench, on which are provided: X-axis transplanting mechanism: a horizontal carrier is provided at the moving end of the X-axis transplanting device, and a plurality of processing jigs are detachably provided on the horizontal carrier, and the processing jigs are driven to move along the direction of the horizontal X-axis through the horizontal carrier; XY bidirectional transfer mechanism, the moving end of the XY bidirectional transfer mechanism is provided with a first slide in the vertical direction, and the first slide is located above the X-axis transfer mechanism, so that the first slide can move freely in the horizontal X-axis and Y-axis directions; the first slide is provided with a positioning detection mechanism, a black glue dispensing mechanism, a micro-module mounting mechanism and a UV glue dispensing mechanism; the positioning detection mechanism includes a CDD camera fixed on the first slide, and the horizontal positioning of the product to be processed is determined by shooting with the CDD camera. A distance sensor is provided on one side of the CDD camera for determining the vertical positioning of the processed product; the black glue dispensing mechanism includes a first lifting drive fixed on the first slide, and the moving end of the first lifting drive is connected to a first swing motor arranged along the Y-axis direction, and the moving end of the first swing motor is along its rotating shaft. A first glue dispensing gun is provided in the vertical direction, and black glue is applied to the product to be processed through the first glue dispensing gun; the micro-module mounting mechanism includes a second lifting drive provided on the first slide, and the moving end of the second lifting drive is provided with a turntable that can rotate in the horizontal direction, and the moving end of the turntable is provided with a micro-module mounting head, and the micro-module is grasped and mounted by the micro-module mounting head; the UV glue dispensing mechanism includes a third lifting drive provided on the first slide, and the moving end of the third lifting drive is connected to a second swing motor provided along the X-axis direction, and the moving end of the second swing motor is provided with a third swing motor, and the rotating shaft of the third swing motor is perpendicular to the rotating shaft direction of the second swing motor, and the moving end of the third swing motor is provided with a second glue dispensing gun along the vertical direction of its rotating shaft, and UV glue is applied through the second glue dispensing gun; The invention discloses a Y-direction transplanting mechanism, wherein a second slide is arranged at the moving end of the Y-direction transplanting mechanism in the vertical direction, and a UV curing unit is arranged on the second slide, and the UV curing unit is driven by the second slide to move in the horizontal Y-axis direction; the UV curing unit comprises a fourth lifting drive and a fifth lifting drive arranged on the second slide, and a micro-module pressing plate is arranged at the moving end of the fourth lifting drive, and a force sensor is arranged on the micro-module pressing plate, and the lower pressing surface of the micro-module pressing plate is made of a flexible material, and the micro-module is pressed with a certain force by the micro-module pressing plate to improve the installation stability of the micro-module; a horizontal telescopic drive is arranged at the moving end of the fifth lifting drive, and a mounting plate is arranged at the moving end of the horizontal telescopic drive, and a plurality of curing lamps are arranged on the mounting plate for accelerating the curing of the UV glue.

[0008] Preferred technical solution: The processing jig is arranged in an array along the X-axis and Y-axis directions on the horizontal carrier to facilitate processing positioning; the processing jig is provided with a circuit board placement groove, through which the circuit board of the micro-module to be assembled is placed and fixed.

[0009] Preferred technical solution: A negative pressure suction head is provided at the moving end of the micro-module placement head for grabbing the micro-module by negative pressure adsorption.

[0010] Optimal technical solution: a micro-module upper camera is provided above the negative pressure suction head, and the micro-module upper camera is arranged on the first slide plate, and is used to photograph and determine the upper end surface of the micro-module for detection and positioning; a micro-module lower camera is also provided on the workbench, and the micro-module lower camera is located below the XY bidirectional transplanting mechanism, and is used to detect and position the lower end surface of the micro-module; a micro-module placement groove is also provided on the processing fixture, which is convenient for using the negative pressure suction head to position and place the micro-module.

[0011] Preferred technical solution: Micro-module clamping mechanisms are also provided on both sides of the negative pressure suction head to assist the negative pressure suction head in clamping and fixing the micro-module to prevent the micro-module from shifting during transportation.

[0012] Preferred technical solution: a micro-module feeding bin is vertically arranged on one side of the negative pressure suction head, in which micro-modules can be stacked in the vertical direction; a micro-module feeding drive is provided on one side of the micro-module feeding bin, and a feeding push plate is provided on the moving end of the micro-module feeding drive in the horizontal direction, and a micro-module positioning groove for positioning the micro-module is provided on the upper surface of the feeding push plate, and the feeding push plate can pass through the bottom of the micro-module feeding bin from the side to reach the bottom of the negative pressure suction head, and the micro-modules in the micro-module feeding bin can be sent to the bottom of the negative pressure suction head through the feeding push plate.

[0013] Preferred technical solution: A guiding slope is provided on the outer periphery of the upper end of the micro-module positioning groove to facilitate the micro-modules in the micro-module feeding bin to enter the micro-module positioning groove.

[0014] Preferred technical solution: A glue gun needle alignment mechanism is also provided on the horizontal carrier plate to position the output end of the glue gun.

[0015] Optimal technical solution: A flip-up fill light is provided below the CDD camera, and the fill light is fixed to the first slide plate through a mounting frame, so that the shooting accuracy of the CDD camera is improved by the fill light.

[0016] Preferred technical solution: The horizontal carrier is also provided with a glass slide for testing the dispensing effect of the dispensing gun.

[0017] Due to the application of the above technical solution, the present invention has the following beneficial effects compared with the prior art: The present invention discloses an automatic micro-module mounting device. By centrally arranging a positioning detection mechanism, a black glue dispensing mechanism, a micro-module mounting mechanism and a UV glue dispensing mechanism on an XY bidirectional transfer mechanism, the micro-module mounting operation is concentrated in one area, thereby avoiding frequent transportation of the circuit board to be mounted with the micro-module, reducing the positioning difficulty of the glue dispensing and mounting, and thus improving the precision and efficiency of the micro-module mounting. The processing jigs are detachably arranged in an array along the X-axis and the Y-axis on a horizontal carrier plate, thereby further reducing the positioning difficulty of the micro-module mounting and improving the loading efficiency of the mounting device. The micro-modules are transported and mounted in a negative pressure adsorption manner, and the micro-module grabbing efficiency is high. The upper and lower cameras are used to perform position correction on the micro-modules, thereby improving the mounting precision of the micro-modules. At the same time, a micro-module feeding bin for automatic positioning and loading of the micro-modules is also disclosed, which does not need to use the upper and lower cameras to perform position correction on the micro-modules, thereby further improving the installation efficiency of the micro-modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a structural schematic diagram of a micro-module automatic placement device of the present invention; Figure 2 It is a structural schematic diagram of the X-direction transplanting mechanism in the present invention; Figure 3 It is a structural schematic diagram of the XY bidirectional transplanting mechanism in the present invention; Figure 4 It is a structural schematic diagram of the positioning detection mechanism in the present invention; Figure 5 It is a structural schematic diagram of the black glue mechanism in the present invention; Figure 6 It is a structural schematic diagram of a micro-module mounting mechanism in Embodiment 1 of the present invention; Figure 7 It is a structural schematic diagram of a micro-module mounting mechanism in the second embodiment of the present invention; Figure 8 It is a structural schematic diagram of the midpoint UV glue mechanism of the present invention; Fig. 9 It is a schematic diagram of the structure of the Y-axis transplanting mechanism and the UV curing unit in the present invention.

[0020] In the above drawings, 100, workbench; 1, X-axis transfer mechanism; 11, horizontal carrier; 12, micromodule bottom camera; 13, glue gun needle alignment mechanism; 14, slide; 2, processing fixture; 21, circuit board placement slot; 22, micromodule placement slot; 3, XY bidirectional transfer mechanism; 31, first slide; 4, positioning detection mechanism; 41, CDD camera; 42, distance sensor; 43, fill light; 5, black glue dispensing mechanism; 51, first lifting drive; 52, first swing motor; 53, first glue dispensing gun; 6, micromodule mounting mechanism; 61, second lifting drive; 62, turntable; 63, micromodule mounting head; 631, Negative pressure suction head; 632, micromodule clamping mechanism; 633, micromodule feeding bin; 634, micromodule feeding drive; 634a, feeding push plate; 634b, micromodule positioning groove; 634c, guide ramp; 64, micromodule upper camera; 7, UV glue dispensing mechanism; 71, third lifting drive; 72, second swing motor; 73, third swing motor; 74, second glue dispensing gun; 8, Y-axis transplanting mechanism; 81, second slide; 9, UV curing unit; 91, fourth lifting drive; 92, fifth lifting drive; 93, micromodule pressure plate; 94, force sensor; 95, horizontal telescopic drive; 96, mounting plate; 97, curing lamp. DETAILED DESCRIPTION

[0021] The following is a description of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0022] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application are described here. In addition, the terms "including" and "having" and their synonyms are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0023] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0024] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0025] In addition, the terms "install", "set", "provided with", "connect", "connected", "sleeved", and "fitted" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For another example, "fitted" can be completely close or partially close. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] Embodiment 1: like Figure 1 As shown, the present invention discloses a micro-module automatic placement device, including a workbench 100, on which an X-direction transfer mechanism 1, an XY bidirectional transfer mechanism 3 and a Y-direction transfer mechanism 8 are provided. The main components of the present invention are described in detail below: like Figure 1 and Figure 2 As shown, the moving end of the X-axis transplanting device 1 is provided with a horizontal carrier plate 11, and four processing jigs 2 are detachably provided on the horizontal carrier plate 11. The processing jigs 2 are arranged in an array along the X-axis and Y-axis directions on the horizontal carrier plate 11. The processing jigs 2 are provided with circuit board placement grooves 21 and micro-module placement grooves 22. The circuit board placement grooves 21 are used to place circuit boards, and the micro-module placement grooves 22 are used to place micro-modules; the workbench 100 is also provided with a micro-module bottom camera 12, and the micro-module bottom camera 12 is located below the XY bidirectional transplanting mechanism 3.

[0028] like Figure 1 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 8As shown, the moving end of the XY bidirectional transfer mechanism 3 is provided with a first slide 31 in the vertical direction, and the first slide 31 is located above the X-axis transfer mechanism 1; the first slide 31 is provided with a positioning detection mechanism 4, a black glue dispensing mechanism 5, a micro-module mounting mechanism 6 and a UV glue dispensing mechanism 7; the positioning detection mechanism 4 includes a CDD camera 41 fixed on the first slide 31, and a distance sensor 42 is provided on one side of the CDD camera 41; the black glue dispensing mechanism 5 includes a first lifting drive 51 fixed on the first slide 31, and the moving end of the first lifting drive 51 is connected to a first swing motor 52 arranged along the Y-axis direction, and the moving end of the first swing motor 52 is provided with a first glue dispensing gun 53 along the vertical direction of its rotating shaft; the micro-module mounting mechanism 6 includes a second lifting drive 6 arranged on the first slide 31 1, a moving end of the second lifting drive 61 is provided with a turntable 62 which can rotate in the horizontal direction, a moving end of the turntable 62 is provided with a micro-module mounting head 63, a moving end of the micro-module mounting head 63 is provided with a negative pressure suction head 631, a micro-module upper camera 64 is provided above the negative pressure suction head 631, and the micro-module upper camera 64 is provided on the first slide 31; the UV glue dispensing mechanism 7 includes a third lifting drive 71 provided on the first slide 31, a moving end of the third lifting drive 71 is connected to a second swing motor 72 provided along the X-axis direction, a moving end of the second swing motor 72 is provided with a third swing motor 73, a rotating shaft of the third swing motor 73 is perpendicular to the rotating shaft direction of the second swing motor 72, and a second glue dispensing gun 74 is provided at the moving end of the third swing motor 73 along the vertical direction of its rotating shaft.

[0029] like Figure 1 and Fig. 9 As shown, the moving end of the Y-axis transplanting mechanism 8 is provided with a second slide 81 in the vertical direction, and the second slide 81 is provided with a UV curing unit 9, and the UV curing unit 9 includes a fourth lifting drive 91 and a fifth lifting drive 92 arranged on the second slide 81, and the moving end of the fourth lifting drive 91 is provided with a micro-module pressing plate 93, and the micro-module pressing plate 93 is provided with a force sensor 94, and the lower pressing surface of the micro-module pressing plate 93 is made of flexible material; the moving end of the fifth lifting drive 92 is provided with a horizontal telescopic drive 95, and the moving end of the horizontal telescopic drive 95 is provided with a mounting plate 96, and the mounting plate 96 is provided with three groups of curing lamps 97.

[0030] refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 and Fig. 9 As shown, the steps and principles of the present invention are as follows: S1, manually scan the work order number to install the processing fixture 2 on the horizontal carrier 11, and transport it to the processing area through the X-axis transfer device 1; S2. The positioning detection mechanism 4 is driven by the XY bidirectional transfer mechanism 3 to move to the top of the circuit board placement slot 21, the CDD camera 41 is used to scan the horizontal position of the circuit board, and the placement height of the circuit board is located by the distance sensor 42.

[0031] S3, drive the black glue dispensing mechanism 5 to move to the top of the circuit board placement slot 21 through the XY bidirectional transfer mechanism 3, control the first lifting drive 51 to lower the first glue dispensing gun 53 to the circuit board according to the detection data of the positioning detection mechanism 4, and control the first swing motor 52 to control the first glue dispensing gun 53 to swing back and forth to evenly apply black glue on the designated area of ​​the circuit board.

[0032] S4. After the black glue coating is completed, the micro-module mounting mechanism 6 is driven by the XY bidirectional transfer mechanism 3 to reach the top of the micro-module placement groove 22, and the second lifting drive 61 drives the micro-module mounting head 63 to descend, and the micro-module is positioned by the micro-module upper camera 64. The turntable 62 adjusts the angle according to the feedback of the micro-module upper camera 64, and the micro-module is adsorbed and grasped by the negative pressure suction head 631. The second lifting drive 61 rises and drives the micro-module to move to the top of the micro-module lower camera 12 for photo positioning, and then moves to the top of the circuit board placement groove 21 to complete the mounting with the circuit board. After the mounting is completed, the negative pressure suction head 631 releases pressure and separates from the micro-module.

[0033] S5. The UV glue dispensing mechanism 7 is driven to move to the circuit board where the micromodule is mounted through the XY bidirectional transfer mechanism 3. The third lifting drive 71 drives the second swing motor 72 to descend. The second swing motor 72 drives the third swing motor 73 to swing left and right in the Y-axis direction. The third swing motor 73 drives the second glue dispensing gun 74 to swing in the X-axis direction. Through the combined movement of the second swing motor 72 and the third swing motor 73, the glue dispensing angle range of the second glue dispensing gun 74 is increased, and UV glue can be applied from the side.

[0034] S6. After the UV glue is applied, the Y-axis transfer mechanism 8 drives the UV curing unit 9 to move to the circuit board where the micro-module is mounted, and the fourth lifting drive 91 drives the micro-module pressing plate 93 to press the micro-module, and controls the pressing force through the force sensor 94, so that the micro-module and the circuit board are installed more firmly; at the same time, the fifth lifting drive 92 drives the curing lamp 97 to move downward so that the curing lamp 97 is focused on the UV glue application point of the circuit board, and the horizontal telescopic drive 95 drives the curing lamp 97 to move in the horizontal direction to ensure that the UV glue is completely irradiated by the curing lamp 97.

[0035] S7, repeat the above steps to assemble the micro-modules on the circuit board on the processing fixture 2 along the X-axis direction, and continue to process another row after completing the micro-module assembly on the circuit board on the processing fixture 2 in the X-axis direction.

[0036] Furthermore, in order to ensure the accuracy of micro-module mounting, micro-module clamping mechanisms 632 are provided on both sides of the negative pressure suction head 631 to assist in fixing the micro-module and prevent the micro-module from deflecting during transportation.

[0037] Furthermore, in order to improve the dispensing accuracy, a dispensing gun needle mechanism 13 is also provided on the horizontal carrier plate 11 to ensure the accuracy of the dispensing position of the dispensing gun 13 and avoid direct collision between the dispensing gun and the micromodule or circuit board to affect the assembly accuracy of the micromodule.

[0038] Furthermore, in order to ensure the positioning and recognition accuracy of the circuit board, a flip-up fill light 43 is provided below the CDD camera 41 . The fill light 43 is fixed to the first slide 31 through a mounting frame to ensure the shooting accuracy of the CDD camera 41 .

[0039] Furthermore, in order to facilitate testing of the glue dispensing guns, the horizontal carrier plate 11 is also provided with a glass slide 14, and the first glue dispensing gun 53 and the second glue dispensing gun 74 can perform glue dispensing operations on the glass slide 14 to observe the glue dispensing effect.

[0040] Embodiment 2: like Figure 1 , Figure 7 and Fig. 9 As shown, the difference between this embodiment and the first embodiment is that there is no need to set the micro-module placement groove 22 on the processing fixture 2, there is no need to set the micro-module bottom camera 12 on the workbench 100, and there is no need to set the micro-module top camera 64 above the negative pressure suction head 631; a micro-module feeding bin 633 is arranged in the vertical direction on one side of the negative pressure suction head 631, a micro-module feeding drive 634 is arranged on one side of the micro-module feeding bin 633, a feeding push plate 634a is arranged at the moving end of the micro-module feeding drive 634 in the horizontal direction, and a micro-module positioning groove 634b is arranged on the upper end surface of the feeding push plate 634a, and the feeding The push plate 634a can pass through the bottom of the micro-module feeding bin 633 from the side to reach the bottom of the negative pressure suction head 631. The upper periphery of the micro-module positioning groove 634b is provided with a guide slope 634c. During the micro-module mounting operation in step S4, the negative pressure suction head 631 is directly used to align the position with the circuit board, and then the feeding push plate 634a corrects the micro-module through the micro-module positioning groove 634b, and then directly sends it to the bottom of the negative pressure suction head 631. After the negative pressure suction head 631 absorbs the micro-module, it moves down directly for mounting, which saves the time for micro-module calibration and greatly improves the mounting efficiency.

[0041] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A micro-module automatic placement device, comprising a workbench (100), characterized in that: The workbench (100) is provided with: An X-axis transplanting mechanism (1), wherein a horizontal carrier plate (11) is provided at a moving end of the X-axis transplanting mechanism (1), and a plurality of processing jigs (2) are detachably provided on the horizontal carrier plate (11); An XY bidirectional transfer mechanism (3), wherein a first slide (31) is provided at a moving end of the XY bidirectional transfer mechanism (3) along a vertical direction, and the first slide (31) is located above the X-axis transfer mechanism (1); a positioning detection mechanism (4), a black glue dispensing mechanism (5), a micro-module mounting mechanism (6), and a UV glue dispensing mechanism (7) are provided on the first slide (31); the positioning detection mechanism (4) comprises a CDD camera (41) fixed on the first slide (31), and a distance sensor (42) is provided on one side of the CDD camera (41); the black glue dispensing mechanism (5) comprises a first lifting drive (51) fixed on the first slide (31), and the moving end of the first lifting drive (51) is connected to a first swing motor (52) arranged along the Y-axis direction, and the moving end of the first swing motor (52) is arranged along the vertical direction of its rotation axis. A first glue dispensing gun (53) is provided; the micro-module mounting mechanism (6) comprises a second lifting drive (61) arranged on the first slide (31); the moving end of the second lifting drive (61) is provided with a turntable (62) that can rotate in the horizontal direction; the moving end of the turntable (62) is provided with a micro-module mounting head (63); the UV glue dispensing mechanism (7) comprises a third lifting drive (71) arranged on the first slide (31); the moving end of the third lifting drive (71) is connected to a second swing motor (72) arranged along the X-axis direction; the moving end of the second swing motor (72) is provided with a third swing motor (73); the rotating shaft of the third swing motor (73) is perpendicular to the rotating shaft direction of the second swing motor (72); and the moving end of the third swing motor (73) is provided with a second glue dispensing gun (74) along the vertical direction of its rotating shaft; A Y-direction transfer mechanism (8), wherein a second slide (81) is provided at a moving end of the Y-direction transfer mechanism (8) in a vertical direction, a UV curing unit (9) is provided on the second slide (81), the UV curing unit (9) comprises a fourth lifting drive (91) and a fifth lifting drive (92) arranged on the second slide (81), a micro-module pressing plate (93) is provided at the moving end of the fourth lifting drive (91), a force sensor (94) is provided on the micro-module pressing plate (93), and a lower pressing surface of the micro-module pressing plate (93) is made of a flexible material; a horizontal telescopic drive (95) is provided at the moving end of the fifth lifting drive (92), a mounting plate (96) is provided at the moving end of the horizontal telescopic drive (95), and a plurality of curing lamps (97) are provided on the mounting plate (96).

2. The micro-module automatic placement device according to claim 1, characterized in that: The processing jigs (2) are arranged in an array along the X-axis and Y-axis directions on the horizontal carrier plate (11), and circuit board placement grooves (21) are provided on the processing jigs (2).

3. The micro-module automatic placement device according to claim 2, characterized in that: A negative pressure suction head (631) is provided at the moving end of the micro-module mounting head (63).

4. The micro-module automatic placement device according to claim 3, characterized in that: A micro-module upper camera (64) is provided above the negative pressure suction head (631), and the micro-module upper camera (64) is arranged on the first slide (31). A micro-module lower camera (12) is also provided on the workbench (100), and the micro-module lower camera (12) is located below the XY bidirectional transplanting mechanism (3). A micro-module placement groove (22) is also provided on the processing jig (2).

5. The micro-module automatic placement device according to claim 4, characterized in that: Micro-module clamping mechanisms (632) are also provided on both sides of the negative pressure suction head (631).

6. The micro-module automatic placement device according to claim 2, characterized in that: A micro-module feeding bin (633) is provided on one side of the negative pressure suction head (631) in the vertical direction, a micro-module feeding drive (634) is provided on one side of the micro-module feeding bin (633), a feeding push plate (634a) is provided on the moving end of the micro-module feeding drive (634) in the horizontal direction, a micro-module positioning groove (634b) is provided on the upper end surface of the feeding push plate (634a), and the feeding push plate (634a) can pass through the bottom of the micro-module feeding bin (633) from the side to reach the bottom of the negative pressure suction head (631).

7. The micro-module automatic placement device according to claim 6, characterized in that: A guiding inclined surface (634c) is provided on the outer periphery of the upper end of the micro-module positioning groove (634b).

8. The micro-module automatic placement device according to claim 1, characterized in that: The horizontal carrier plate (11) is also provided with a glue gun needle alignment mechanism (13).

9. The micro-module automatic placement device according to claim 1, characterized in that: A flippable fill light (43) is provided below the CDD camera (41), and the fill light (43) is fixed to the first slide (31) via a mounting frame.

10. The micro-module automatic placement device according to claim 1, characterized in that: The horizontal carrier plate (11) is also provided with a glass slide (14).

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