Anti-dazzle LED display panel and preparation method and maintenance method thereof

Abstract

The invention relates to the technical field of LED display, solves the problem that an LED display panel in the prior art cannot effectively prevent glare, and provides an anti-glare LED display panel and a preparation method and maintenance method thereof.The LED display panel comprises an LED chip, a circuit board, a packaging layer, a smooth surface layer and a thermosetting anti-glare coating; wherein the packaging layer is made of epoxy resin; the thermosetting anti-glare coating is made of AG anti-glare liquid medicine, and the AG anti-glare liquid medicine comprises SiO2 nano particles, an alcohol solvent and a siloxane auxiliary agent; the surface of the thermosetting anti-dazzle coating is provided with a regular partial top spherical surface. The LED display panel provided by the invention can effectively prevent glare.

Description

[0001] This invention is a divisional application of the invention patent application filed on December 29, 2023, with the invention name “A LED display panel, its preparation method and maintenance method” and application number 202311870039.4. Technical Field

[0002] The present invention relates to the technical field of LED display, and in particular to an anti-glare LED display panel, a preparation method thereof and a maintenance method thereof. Background Art

[0003] LED display is a flat panel display, composed of LED display panels, used to display text, images, videos and other information. LED display integrates microelectronics technology, computer technology and information processing, and has the advantages of bright colors, wide dynamic range, high brightness, long life, stable and reliable operation. LED display is widely used in commercial media, cultural performance market, sports stadiums, information dissemination, news release, securities trading, etc., and can meet the needs of different environments.

[0004] The anti-glare design of LED display panels is of great necessity, which is mainly reflected in four aspects: protecting user eyesight, improving viewing experience, enhancing display effects and adapting to a variety of usage environments. First of all, glare can cause direct stimulation to the human eye. Long-term exposure to high-brightness or reflected light environments may cause visual fatigue and even damage visual health. The anti-glare design can effectively reduce unnecessary reflected light and protect the eyes. Secondly, anti-glare technology can improve the viewing experience and make the displayed content clearer and more readable in strong light environments (such as outdoors or bright indoors). Thirdly, anti-glare treatment helps to enhance the picture quality, make the color performance purer and more realistic, and avoid light reflections interfering with the details of the picture, which is especially important in the display of high-precision content. In addition, the anti-glare design adapts to the needs of a variety of usage scenarios, such as complex light conditions such as conference rooms, classrooms, and outdoor billboards, and improves the practicality and market competitiveness of LED display screens. Therefore, anti-glare design plays an important role in improving the functionality and user experience of LED display panels.

[0005] Existing LED display panels have certain limitations in terms of anti-glare, which are mainly reflected in technical implementation, adaptability to usage scenarios, and cost-effectiveness balance; first, the surface of many LED display panels still uses ordinary glass or smooth materials, which are easy to form mirror reflections, causing the screen content to be blurred or unrecognizable in strong light environments (such as direct sunlight outdoors or strong indoor lighting), seriously affecting the user experience; second, although existing anti-glare technologies, such as surface coating or frosting, can reduce reflected light to a certain extent, they may cause problems such as reduced screen brightness, reduced image clarity or color distortion, and cannot take into account both anti-glare and display effects; third, the requirements of different usage scenarios vary greatly. For example, outdoor billboards require higher anti-glare performance, while conference rooms or home scenes emphasize image quality. It is difficult for existing technologies to provide targeted optimization solutions. In addition, some high-efficiency anti-glare technologies, such as low-reflection glass or nano-coatings, have not been widely popularized due to high manufacturing costs, limiting the scope of market applications. Therefore, existing LED display panels have technical bottlenecks and cost barriers in terms of anti-glare, and innovative solutions are urgently needed to achieve a better visual experience and a wider range of scene adaptability.

[0006] Therefore, how to provide an effective anti-glare LED display panel is an urgent problem to be solved. Summary of the invention

[0007] The present invention aims at the problem that the LED display panel in the above-mentioned prior art cannot effectively prevent glare. In order to achieve one purpose of the present invention, an anti-glare LED display panel is provided, comprising: an LED chip, a circuit board, a packaging layer, a glossy surface layer and a thermosetting anti-glare coating; wherein the packaging layer is made of epoxy resin; the thermosetting anti-glare coating is made of AG anti-glare solution, and the AG anti-glare solution comprises SiO2 nanoparticles, an alcohol solvent and a silicone additive; the surface of the thermosetting anti-glare coating has a regular partial top spherical surface.

[0008] Preferably, there are multiple LED chips; the LED chip is arranged on the mounting surface of at least one of the circuit boards; the packaging layer is arranged on the mounting surface and covers the LED chip; the smooth surface layer is arranged on the outer surface of the packaging layer; and the thermosetting anti-glare coating is arranged on the smooth surface layer.

[0009] Preferably, the AG anti-glare solution comprises, by weight: 7 to 12 parts of SiO2 nanoparticles of different particle sizes, 76 to 86 parts of alcohol solvents, and 7 to 12 parts of silicone additives; the thermosetting anti-glare coating is set to: unit weight: 80 to 120 g / m2, thickness: 5-7 μm, and 60° glossiness ≤10%.

[0010] To achieve another object of the present invention, a method for preparing an anti-glare LED display panel is provided, comprising the following steps:

[0011] S11: providing a circuit board having a plurality of LED chips disposed on at least one mounting surface thereof;

[0012] S12: molding a packaging layer on the mounting surface to cover the LED chip;

[0013] S13: using a smooth release film to mold the encapsulation layer to obtain a smooth surface layer, and heating and curing the smooth surface layer;

[0014] S14: first heating the smooth surface layer, and then performing plasma treatment;

[0015] S15: coating a thermosetting anti-glare coating on the glossy surface layer;

[0016] S16: performing a second heating on the thermosetting anti-glare coating.

[0017] Preferably, the first heating in step S14 comprises preheating the glossy surface layer at 50-100° C. for 1-4 hours; and the second heating in step S16 comprises heating the thermosetting anti-glare coating at 160-180° C. for 20-30 minutes.

[0018] Preferably, the high-quality thermosetting anti-glare coating made of AG anti-glare solution needs to meet the following preparation conditions: coating amount: 80-120 g / m2, curing temperature: 160-180°C, curing time: 20-30 min, thickness: 5-7 μm.

[0019] To achieve another object of the present invention, a method for repairing an anti-glare LED display panel is provided, wherein there is at least one faulty LED chip that cannot work normally among the plurality of LED chips, and the repair method comprises:

[0020] S21: digging a hole at the location of the faulty LED chip to obtain an opening, taking out the exposed faulty LED chip and replacing it with a new LED chip;

[0021] S22: Filling the opening with a packaging layer, and curing the packaging layer;

[0022] S23: grinding the adjacent area of ​​the opening to remove the thermosetting anti-glare coating thereon, and grinding the encapsulation layer to make the surfaces of the encapsulation layer and the adjacent area where the thermosetting anti-glare coating has been removed flush;

[0023] S24: performing plasma treatment on the encapsulation layer and the adjacent area from which the thermosetting anti-glare coating has been removed;

[0024] S25: coating the plasma-treated encapsulation layer and the adjacent region with a thermosetting anti-glare coating;

[0025] S26: heating and curing the thermosetting anti-glare coating.

[0026] Preferably, the curing treatment in step S22 includes baking for dehumidification and preheating at 50-100° C. for 1-4 hours; and the heating curing in step S26 includes heating at 160-180° C. for 20-30 minutes.

[0027] Preferably, the S21 includes:

[0028] If multiple adjacent LED chips are faulty and multiple faulty LED chips need to be repaired, sulfuric acid is first used to remove a large area of ​​the original encapsulation layer and the original thermosetting anti-glare coating in the corresponding area above the multiple faulty LED chips, and the large area is set to a circular hole shape and expands outward by a dot pitch;

[0029] After rinsing with clean water, laser finishing is used to remove the remaining encapsulation layer and thermosetting anti-glare coating;

[0030] The exposed multiple faulty LED chips are removed and replaced with multiple new LED chips.

[0031] Preferably, in the step S21, laser drilling is used to dig holes, the adjacent area is set to a circular area with the faulty LED chip as the center and a radius of 0.5 to 2 mm, and the thermosetting anti-glare coating is applied by spraying, and the spraying of the thermosetting anti-glare coating is controlled to meet the following requirements: unit weight: 80 to 120 g / m2, thickness: 5-7 μm, and 60° glossiness ≤10%.

[0032] The beneficial effects of the present invention are:

[0033] The present invention provides an anti-glare LED display panel, a preparation method and a maintenance method thereof, wherein the LED display panel comprises: an LED chip, a circuit board, a packaging layer, a glossy surface layer and a thermosetting anti-glare coating; wherein the packaging layer is made of epoxy resin; the thermosetting anti-glare coating is made of AG anti-glare solution, and the AG anti-glare solution comprises SiO2 nanoparticles, an alcohol solvent and a silicone additive; and the surface of the thermosetting anti-glare coating has a regular partial top round spherical surface. The above-mentioned thermosetting anti-glare coating can change the light direction of the LED chip by, for example, diffuse reflection, thereby achieving an anti-glare effect. The material of the encapsulation layer is epoxy resin, which has the advantages of high hardness, a wide variety of mature curing agents and low price; the material of the thermosetting anti-glare coating is AG anti-glare solution, which includes: SiO2 nanoparticles, alcohol solvents and silicone additives. The AG anti-glare solution has a lower glossiness and can reduce the specular reflection of the surface of the encapsulation layer. Moreover, the thermosetting anti-glare coating can obtain an AG texture from the AG anti-glare solution, and the AG texture can achieve diffuse reflection of light, thereby achieving an anti-glare effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0035] Figure 1 A schematic diagram of the layer structure of an LED display panel provided by an embodiment of the present invention;

[0036] Figure 2 A schematic flow chart of a method for preparing an LED display panel provided in an embodiment of the invention;

[0037] Figure 3 A schematic flow chart of a method for repairing an LED display panel provided by an embodiment of the invention;

[0038] Description of reference numerals:

[0039] 1-circuit board; 2-packaging layer; 3-thermosetting anti-glare coating. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described in conjunction with the drawings in the embodiment of the present invention. It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. Moreover, the term "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such a process, method, article or device. In the absence of further restrictions, the elements defined by the phrase "comprising..." do not exclude the existence of other identical elements in the process, method, article or device comprising the elements. If there is no conflict, the embodiments of the present invention and the various features in the embodiments can be combined with each other and are all within the protection scope of the present invention.

[0041] refer to Figure 1 As an object of the present invention, an LED display panel is provided, wherein the LED display panel is preferably a Micro-LED display panel or a Mini-LED display panel. The LED display panel comprises a plurality of LED chips, a circuit board 1, a packaging layer 2, a glossy surface layer and a thermosetting anti-glare coating 3, wherein an LED chip is arranged on at least one mounting surface of the circuit board 1, the packaging layer 2 is arranged on the mounting surface and covers the LED chip, the glossy surface layer is arranged on the outer surface of the packaging layer 2, i.e., a surface away from and facing away from the LED chip, the glossy surface layer can be obtained by molding the packaging layer 2 with a glossy release film (for details, please refer to the description of the preparation method of the LED display panel below), and the thermosetting anti-glare coating 3 is arranged on the glossy surface layer. Preferably, in order to make the combination of the packaging layer 2 and the circuit board 1 and the combination of the thermosetting anti-glare coating 3 and the glossy surface layer meet the combination requirements, the surface water drop angle is reduced by plasma treatment, thereby improving the wettability. In addition, if Figure 1As shown, the surface of the thermosetting anti-glare coating 3 preferably has a regular partial top spherical surface, so the thermosetting anti-glare coating 3 can change the light direction of the LED chip by, for example, diffuse reflection, thereby achieving an anti-glare effect. In this way, since the outer surface of the encapsulation layer 2 is provided with a smooth surface layer and a thermosetting anti-glare coating 3, the adverse effects of the prior art using a patterned release film, such as susceptibility to pressure and poor pattern consistency of the patterned release film, are avoided, thereby obtaining a highly consistent surface layer on the surface of the encapsulation layer 2, and the cost is lower than that of using a patterned release film. In addition, for the subsequent maintenance of the LED display panel, there is no need to restore the pattern by re-embossing the maintenance area, thereby ensuring that the LED display panel has a high quality even after maintenance.

[0042] Specifically, the material of the encapsulation layer 2 is epoxy resin, which has the advantages of high hardness (Shore hardness D>80), a wide variety of mature curing agents and low prices. The material of the thermosetting anti-glare coating 3 is AG anti-glare solution, which includes by weight: SiO2 nanoparticles of different particle sizes: 7 to 12 parts, alcohol solvents: 76 to 86 parts, and silicone additives: 7 to 12 parts. Referring to Table 1 below, the AG anti-glare solution has a lower glossiness, which can reduce the specular reflection of the surface of the encapsulation layer 2, and has a strong adhesion to the encapsulation layer 2, so it has a strong scratch resistance. Moreover, the thermosetting anti-glare coating 3 can obtain an AG texture from the AG anti-glare solution, and the AG texture can achieve diffuse reflection of light, thereby achieving an anti-glare effect.

[0043] Specifically, according to repeated experimental tests by the applicant, it is determined that the relevant parameters of the thermosetting anti-glare coating 3 made of AG anti-glare solution are set to the following specific numerical ranges: Unit weight: 80-120 g / m 2 , thickness: 5-7μm, 60° glossiness ≤10%. And referring to the following Table 1, when the thermosetting anti-glare coating 3 meets the specific numerical range of the above parameters, the LED display panel will not have flash points and can meet the quality requirements for shipment.

[0044] As another object of the present invention, in conjunction with reference Figure 2 The present invention also provides a method for preparing an LED display panel. In the absence of conflict, the preparation method described below is applied to the above LED display panel embodiments, and the relevant repeated contents are not repeated here. The preparation method comprises the following steps:

[0045] S11: providing a circuit board 1 having a plurality of LED chips disposed on at least one mounting surface thereof, and the circuit board 1 and the LED chips thereon may be prepared by a SMT process;

[0046] S12: Molding a packaging layer 2 such as epoxy resin on the mounting surface to cover the LED chip. Molding means that the packaging layer 2 is directly laminated and coated with glue;

[0047] S13: using a smooth release film to mold the encapsulation layer 2 to obtain a smooth surface layer, and heating and curing the smooth surface layer. The heating and curing may be pre-curing at 110° C. for 3 minutes and post-curing at 150° C. for 4 hours. In addition, corresponding matching and adjustment are performed according to different types of epoxy resin used in the encapsulation layer 2;

[0048] S14: first heating the smooth surface layer and then performing plasma treatment, so as to fully activate the surface groups of the smooth surface layer;

[0049] S15: coating a thermosetting anti-glare coating 3 made of, for example, AG anti-glare solution on the glossy surface;

[0050] S16: performing a second heating on the thermosetting anti-glare coating 3 .

[0051] The LED display panel of the present invention can be obtained by the method for preparing the LED display panel of the present invention, so that the LED display panel directly obtained by the preparation method also has the above-mentioned beneficial technical effects. In addition, the preparation method also has the advantages of strong operability and compact steps and processes.

[0052] Preferably, the first heating in step S14 includes preheating the glossy surface layer at 50-100° C. for 1-4 hours, so that the purpose of dehumidification is achieved by baking the glossy surface layer. Dehumidification can remove water vapor, which is beneficial to the reliable bonding of the glossy surface layer and the thermosetting anti-glare coating.

[0053] Preferably, the second heating in step S16 includes heating the thermosetting anti-glare coating 3 at 160-180°C for 20-30 minutes, so as to achieve the purpose of making the thermosetting anti-glare coating 3 have better consistency. Referring to the following Table 1, in the experimental tests divided into 7 times, and in combination with the above-mentioned numerical ranges set for the relevant parameters of the thermosetting anti-glare coating 3 using the AG anti-glare solution: Unit weight: 80-120 g / m 2 , thickness: 5-7μm, 60° gloss ≤10%. In test number 1, since its coating amount is 60g / m 2 That is less than 80g / m 2, its glossiness is 20.5, which exceeds 10%, and thus does not meet the shipment requirements. In test number 2, the curing temperature is 130°C, which is not within the range of 160-180°C, and its adhesion is 2B, which does not meet the requirement of qualified adhesion of 5B or above, and thus does not meet the shipment requirements. In test number 3, the curing time is 15min, which is lower than the lower limit of 20-30min, and its 60° glossiness is 10.1%, which exceeds 10%, and its adhesion is 3B, which does not meet the requirement of qualified adhesion: 5B or above, and thus does not meet the shipment requirements. In test number 6, the curing temperature is 150°C, which is not within the range of 160-180°C, and its 60° glossiness is 11.2, which exceeds 10%, and thus does not meet the shipment requirements. In test number 7, since its coating amount is 150g / m 2 That is greater than 120g / m 2 And the curing temperature is 150°C, which is not within the range of 160-180°C, so that its thickness is 8μm, which is not within the range of 5-7μm, and thus does not meet the shipment requirements. If the shipment quality requirements cannot be met in the above tests, the LED display panel will have more obvious flash points. For test numbers 4 and 5 in Table 1, since the coating amount, curing temperature and thickness all meet the above-set numerical ranges, they can meet the shipment requirements. In addition, for test number 5, although the curing time is 50min, which is higher than the upper limit of 20-30min, it can meet the curing effect, but the curing efficiency is low. Therefore, the above curing time: 20-30min is the preferred time range and cannot be lower than the lower limit of 20min, but higher than 30min only affects the curing efficiency but not the curing effect.

[0054] In summary, in order to ensure the high quality of the thermosetting anti-glare coating 3 made of AG anti-glare solution, the following preparation conditions need to be met: coating amount: 80-120 g / m 2 , curing temperature: 160~180℃, curing time: 20~30min, thickness: 5-7μm.

[0055] Table 1: Comparison of different test conditions for thermosetting anti-glare coatings

[0056]

[0057] As another object of the present invention, in conjunction with reference Figure 3The present invention also provides a method for repairing an LED display panel. In the absence of conflicts, the repair method described below is applied to the LED display panels of the above LED display panel embodiments and the LED display panels prepared by the above preparation method embodiments. The repeated contents are not repeated here. Since it is difficult to avoid the LED display panel needing repair due to a faulty LED chip, when there is at least one faulty LED chip that cannot work properly among the multiple LED chips, the repair method includes the following steps:

[0058] S21: digging a hole at the location of the faulty LED chip to obtain an opening, taking out the exposed faulty LED chip and replacing it with a new LED chip;

[0059] Specifically, an opening is obtained by digging out the original packaging layer 2 and the original thermosetting anti-glare coating 3 covering the packaged faulty LED chip. The specific opening range is the point spacing size corresponding to the position to be repaired. For example, assuming the point spacing is P1.2, the opening range expands by 1.2mm, that is, the outer hole diameter value is 2.4mm. In this way, the opening range will not affect the adjacent normal LED chips.

[0060] In addition, if multiple adjacent LED chips are faulty and multiple faulty LED chips occupying a large area need to be repaired, sulfuric acid is first used to remove a large area of ​​the original encapsulation layer 2 and the original thermosetting anti-glare coating 3 in the corresponding area above the multiple faulty LED chips. The large area can be set as a circular hole shape and expand outward by one dot spacing as mentioned above, and then rinsed with water, and then laser finishing is used to remove the remaining encapsulation layer 2 and thermosetting anti-glare coating 3. Finally, the exposed multiple faulty LED chips are taken out and replaced with multiple new LED chips. This can improve the repair efficiency and quality of multiple faulty LED chips, and after implementing the subsequent steps, a thermosetting anti-glare coating 3 with good consistency can be obtained on the outer surface of the opening area and the adjacent area of ​​the multiple faulty LED chips.

[0061] S22: Filling the opening with the encapsulation layer 2, and curing the encapsulation layer 2. It is known that the newly filled encapsulation layer 2 is heated and cured as a new encapsulation layer like the original encapsulation layer. In addition, the following encapsulation layers can be understood as the new encapsulation layer.

[0062] S23: grinding the adjacent area of ​​the opening to remove the thermosetting anti-glare coating 3 thereon, and grinding the encapsulation layer 2 flat, that is, grinding away the redundant portion of the encapsulation layer 2, especially the portion that is higher than the surface of the adjacent area, so that the surface of the encapsulation layer 2 and the adjacent area where the thermosetting anti-glare coating 3 is removed are flush;

[0063] S24: performing plasma treatment on the encapsulation layer 2 and the adjacent area from which the thermosetting anti-glare coating 3 has been removed, so as to fully activate the surface groups of the encapsulation layer 2 and the adjacent area;

[0064] S25: coating the encapsulation layer 2 and the adjacent area after the plasma treatment with a thermosetting anti-glare coating 3, wherein the thermosetting anti-glare coating 3 can diffusely reflect light, thereby achieving an anti-glare effect;

[0065] S26: Heat and cure the thermosetting anti-glare coating 3, so as to achieve the purpose of improving the consistency of the thermosetting anti-glare coating 3.

[0066] In summary, the repair method of the LED display panel of the present invention adopts a hole-digging method to replace the faulty LED chip with a new LED chip, and then fills the encapsulation layer 2 for encapsulating the new LED chip, and adopts a grinding method to grind the encapsulation layer 2 and the thermosetting anti-glare coating 3 of the adjacent area. Since the LED chip itself is at the micron level, it is only necessary to dig a hole at a very small size where the faulty LED chip is located and then fill the encapsulation layer 2, and then grind the encapsulation layer 2 and its adjacent area. On the basis of not needing to use a smooth release film, the encapsulation layer 2 and its adjacent area can obtain a smooth surface layer and coat the thermosetting anti-glare coating 3 thereon, which can not only save maintenance time, but also the encapsulation layer 2 and its adjacent area only need to be coated with the thermosetting anti-glare coating 3 without setting the pattern obtained by the patterned release film in the prior art, and there is no need to maintain the consistency of the pattern, so that the surface structures of the two are highly consistent and there is no relatively abrupt situation, so that there is basically no difference in appearance between the repaired areas on the LED display panel, and there is no difference in the light output effects of the two, ensuring that the quality after repair is still very high, thereby extending the service life of the LED display panel and saving the use cost.

[0067] Preferably, the curing treatment in step S22 includes baking and dehumidification and preheating at 50-100°C for 1-4h; thus, this can achieve the purpose of baking and dehumidifying the encapsulation layer 2. The heating curing in step S26 includes heating at 130-170°C for 10-30min. Therefore, this can achieve the purpose of making the thermosetting anti-glare coating 3 have better consistency.

[0068] Specifically, as described above, the encapsulation layer 2 in step S22 is an epoxy resin layer, and the material of the thermosetting anti-glare coating 3 in step S25 is AG anti-glare solution, which includes by weight: SiO2 nanoparticles of different particle sizes: 7 to 12 parts, alcohol solvents: 76 to 86 parts, and silicone additives: 7 to 12 parts. Referring to Table 1 above, by coating the newly filled encapsulation layer 2 with the thermosetting anti-glare coating 3 made of AG anti-glare solution, all the thermosetting anti-glare coatings 3 of the LED display panel are kept consistent, achieving the same diffuse reflectivity of light, thereby achieving a good anti-glare effect.

[0069] Preferably, laser drilling is used to dig holes in step S21. Since the LED chip is at the micron level, laser drilling has sufficient accuracy to accurately remove the packaging layer 2 above the faulty LED chip. Laser drilling can form a circular hole, so the regular shape of the opening is convenient for taking and placing the faulty LED chip and the new LED chip and filling the packaging layer 2. The adjacent area is set as a circular area with a radius of 0.5 to 2 mm with the faulty LED chip as the center. For micron-level LED chips, compared with a circular area with a radius of millimeters, the volume of the faulty LED chip is basically negligible, so it can be regarded as a point as the center of the circle. The polishing method can be laser burning polishing. The coating of the thermosetting anti-glare coating 3 is sprayed. The coating can be dipped, sprayed, slit coated, scraped, etc. The spraying method is preferably used during maintenance, which can effectively reduce the use of the thermosetting anti-glare coating 3 and is conducive to cost saving. The spraying of the thermosetting anti-glare coating 3 is controlled to meet the following requirements: Unit weight: 60 to 120 g / m 2 , thickness: 3-5μm, 60° glossiness: ≤10%. This will prevent flash points from appearing in the repair area of ​​the LED display panel, and ensure that the repaired LED display panel meets the quality requirements for shipment.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An anti-glare LED display panel, characterized in that: include: LED chip, circuit board, packaging layer, glossy surface layer and thermosetting anti-glare coating; wherein the packaging layer is made of epoxy resin; The material of the thermosetting anti-glare coating is AG anti-glare solution, and the AG anti-glare solution includes SiO2 nanoparticles, alcohol solvents and silicone additives; the surface of the thermosetting anti-glare coating has a regular partial top spherical surface.

2. The anti-glare LED display panel according to claim 1, characterized in that: The number of the LED chips is multiple; the LED chips are arranged on the mounting surface of at least one circuit board; the packaging layer is arranged on the mounting surface and covers the LED chips; the smooth surface layer is arranged on the outer surface of the packaging layer; The thermosetting anti-glare coating is arranged on the glossy surface layer.

3. The anti-glare LED display panel according to claim 1, characterized in that: The AG anti-glare solution includes, by weight: 7 to 12 parts of SiO2 nanoparticles of different particle sizes, 76 to 86 parts of alcohol solvents, and 7 to 12 parts of siloxane additives; the thermosetting anti-glare coating is set to: unit weight: 80 to 120 g / m 2 , thickness: 5-7μm, 60° gloss ≤10%.

4. A method for preparing an anti-glare LED display panel, applied to the LED display panel according to any one of claims 1 to 3, characterized in that: The steps include: S11: providing a circuit board having a plurality of LED chips disposed on at least one mounting surface thereof; S12: molding a packaging layer on the mounting surface to cover the LED chip; S13: using a smooth release film to mold the encapsulation layer to obtain a smooth surface layer, and heating and curing the smooth surface layer; S14: first heating the smooth surface layer, and then performing plasma treatment; S15: coating a thermosetting anti-glare coating on the glossy surface layer; S16: performing a second heating on the thermosetting anti-glare coating.

5. The method for preparing an anti-glare LED display panel according to claim 4, characterized in that: The first heating in step S14 includes preheating the glossy surface layer at 50-100° C. for 1-4 hours; the second heating in step S16 includes heating the thermosetting anti-glare coating at 160-180° C. for 20-30 minutes.

6. The method for preparing an anti-glare LED display panel according to claim 4, characterized in that: High-quality thermosetting anti-glare coating made of AG anti-glare solution needs to meet the following preparation conditions: coating amount: 80-120g / m 2 , curing temperature: 160~180℃, curing time: 20~30min, thickness: 5-7μm.

7. An anti-glare LED display panel maintenance method, applied to the LED display panel according to any one of claims 1 to 3, characterized in that: Among the plurality of LED chips, there is at least one faulty LED chip that cannot work normally, and the repair method comprises: S21: digging a hole at the location of the faulty LED chip to obtain an opening, taking out the exposed faulty LED chip and replacing it with a new LED chip; S22: Filling the opening with a packaging layer, and curing the packaging layer; S23: grinding the adjacent area of ​​the opening to remove the thermosetting anti-glare coating thereon, and grinding the encapsulation layer to make the surfaces of the encapsulation layer and the adjacent area where the thermosetting anti-glare coating has been removed flush; S24: performing plasma treatment on the encapsulation layer and the adjacent area from which the thermosetting anti-glare coating has been removed; S25: coating the plasma-treated encapsulation layer and the adjacent region with a thermosetting anti-glare coating; S26: heating and curing the thermosetting anti-glare coating.

8. The anti-glare LED display panel maintenance method according to claim 7, characterized in that: The curing treatment in step S22 includes baking for dehumidification and preheating at 50-100° C. for 1-4 hours; the heating curing in step S26 includes heating at 160-180° C. for 20-30 minutes.

9. The anti-glare LED display panel maintenance method according to claim 8, characterized in that: The S21 includes: If multiple adjacent LED chips are faulty and multiple faulty LED chips need to be repaired, sulfuric acid is first used to remove a large area of ​​the original encapsulation layer and the original thermosetting anti-glare coating in the corresponding area above the multiple faulty LED chips, and the large area is set to a circular hole shape and expands outward by a dot pitch; After rinsing with clean water, laser finishing is used to remove the remaining encapsulation layer and thermosetting anti-glare coating; The exposed multiple faulty LED chips are removed and replaced with multiple new LED chips.

10. The anti-glare LED display panel maintenance method according to claim 8, characterized in that: In the step S21, a hole is dug by laser drilling, the adjacent area is set as a circular area with the faulty LED chip as the center and a radius of 0.5 to 2 mm, the thermosetting anti-glare coating is applied by spraying, and the spraying of the thermosetting anti-glare coating is controlled to meet the following conditions: unit weight: 80 to 120 g / m 2 , thickness: 5-7μm, 60° gloss ≤10%.

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