Wave soldering machine for soldering plug-in type original part of lamp panel
By using an eccentric rotating disc in the wave soldering machine to control the contact area of the solder wave peaks and installing mesh plates to filter impurities in the disc, the solder waste, blockage and impurities during welding are solved, and the local welding effect is achieved with high efficiency and good quality.
Patent Information
- Application Number
- CN202411969143.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-03-21
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
When the existing wave soldering machine solderes the original lamp board, it causes solder waste and solder holes to be blocked. At the same time, the solder surface is prone to floating impurities and difficult to clean.
A wave soldering machine for welding lamp plate plug-in original parts is designed, and two eccentric rotating discs are used to control the contact area of solder wave peaks, targeted welding of local areas of the lamp plate, and a mesh plate is installed in the filter chamber of the disc to filter impurities in the solder.
It effectively reduces the waste of solder and the blockage of welding holes, ensures the cleanliness of solder, improves the welding quality, and adapts to the needs of local welding.
Smart Images

Figure CN119658058A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of lamp board component welding, in particular to a wave soldering machine for lamp board plug-in component welding. Background Art
[0002] The circuit boards of lamps often need to be welded with plug-in components such as resistors and capacitors. When using a wave soldering machine to solder the components, first insert the pins of the components into the soldering holes of the lamp board. The conveying mechanism of the soldering machine clamps the lamp board through a clamp and conveys the lamp board to the top of the molten solder tank. The molten solder is sprayed by a mechanical pump or an electromagnetic pump to form a solder wave. The solder points of the plug-in components pass through the solder wave and melt into the solder holes. After the solder cools and solidifies, the pins of the components are welded and fixed to the lamp board. During the process of soldering the original components of the light board with a wave soldering machine, most of the time, the entire soldering surface of the light board is in contact with the solder wave crest. When only the original components need to be soldered in a local area of the light board, the entire soldering surface of the light board is still in contact with the solder wave crest, which will cause a waste of solder. In addition, the solder will clog the soldering holes on the light board where the original components are not installed. Moreover, the molten solder in the solder tank of the wave soldering machine will have floating impurities on the solder surface after multiple soldering of circuit boards. These impurities mainly include tin slag, oxides, and compounds generated by the reaction of other metal elements with solder. Most wave soldering machines are not easy to clean up the floating impurities while soldering the light board. Summary of the invention
[0003] The purpose of the present invention is to provide a wave soldering machine for soldering lamp board plug-in components to solve the problems raised in the above-mentioned background technology.
[0004] To achieve the above object, the present invention provides the following technical solutions: A wave soldering machine for soldering lamp board plug-in components, comprising: chassis; A carrier plate is supported and fixed at one end of the housing, and a heating box is fixed on the top of the carrier plate; A fluxing assembly, fixed at one end of the carrier board, is used to spray flux onto the light board; A welding module is fixed in the middle of the casing, and the welding module includes a control box, a solder tank is fixed on the top of the control box, molten solder liquid is contained in the solder tank, a solder spraying part for spraying solder liquid is fixed in the middle of the solder tank, connecting arms are fixed at both ends of the solder tank, and a disc is rotatably disposed at one end of the connecting arm; The cooling module is fixed at the other end of the carrier board and is used to cool the light board after welding; The conveying mechanism is installed and fixed in the middle of the casing and is used to convey the lamp panels to different processing stations.
[0005] Furthermore, a filter chamber is provided on the bottom surface of the disc, the inner bottom surface of the filter chamber is an inclined surface, and a mesh plate is detachably embedded and fixed on the inner bottom surface of the filter chamber.
[0006] Furthermore, the eccentric position of the disc is rotatably connected to the connecting arm, and a cover plate is detachably fixed on the top of the disc.
[0007] Furthermore, pulleys are fixed at both ends of the connecting arm, and a synchronous belt is connected between the two pulleys for transmission, wherein one of the pulleys is fixedly connected to a corresponding position disc through a rotating shaft.
[0008] Furthermore, the welding module also includes a motor 1 fixed to the solder tank, and the output end of the motor 1 is fixedly connected to a pulley at a corresponding position.
[0009] Furthermore, an electromagnetic pump is fixedly installed on the inner top of the control box, and the output end of the electromagnetic pump is connected and fixed to the solder spraying part.
[0010] Further, the cooling module comprises: The fan is fixed on the bottom surface of the casing, and the air outlet end of the fan is connected and fixed with a hose; A cooling box is rotatably connected to the control box, and the cooling box is connected and fixed to the top end of the hose; A support column is fixed on the inner bottom surface of the casing, the support column is rotatably connected to the cooling box, a second motor is fixedly mounted on the top of the support column, and an output end of the second motor is fixedly connected to the cooling box.
[0011] Further, the conveying mechanism comprises: Two crossbeams are fixed inside the casing; The second crossbeam is two in number and both are fixed to the bottom of the first crossbeam; A plurality of sprockets are rotatably connected to the ends of the corresponding cross beams 2, and a chain is transmission-connected between two sprockets on the same cross beam 2; Multiple clamps, evenly fixed on the outside of the chain.
[0012] Furthermore, the fluxing assembly comprises a fluxing box, and an atomizing nozzle is fixedly installed on the top of the fluxing box.
[0013] Furthermore, both ends of the housing are provided with rectangular through holes, and a touch screen is fixedly mounted on one end of the housing.
[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. Two discs are arranged above the solder spraying part of the solder tank. The eccentric position of the disc is rotatably connected to the connecting arm through a rotating shaft. The motor drives the pulley to rotate. Under the transmission action of the synchronous belt, the rotating column rotates with the disc. When a disc away from the rotating shaft rotates to block the top of the solder spraying part, the conveying mechanism carries the light board to the position above the solder spraying part. Since the disc separates the solder wave peak and the light board, the disc blocks the solder spraying part located in the area below the disc from forming a solder wave peak that can contact the light board. According to needs, two discs at different positions can be rotated to block the top of the solder wave peak, so that the solder wave peak can selectively weld one side of the light board separately.
[0015] 2. By gradually rotating the shielding areas on the two disks away from the rotating axis toward the solder spraying part at the same time, the solder wave peak can be gradually blocked from both ends of the solder spraying part. The length of the gap between the two disks after they rotate and stop can be kept the same as the width of the area to be welded in the middle of the lamp board. Therefore, when the lamp board passes the position of the solder spraying part, the solder spraying part can target the area to be welded in the middle of the lamp board for wave welding, thereby preventing the waste of solder caused by welding the entire lamp board when a local area of the lamp board needs to be welded.
[0016] 3. By opening a filter chamber on the bottom surface of the disc, when the disc rotates to cover the top of the wave crest, the solder wave will continuously enter the filter chamber, and the molten solder will flow along the bottom slope of the filter chamber to the mesh plate position, and then the molten solder will be filtered through the mesh plate and fall into the solder tank. The mesh holes on the mesh plate can effectively filter the tin slag, oxides and other impurities in the molten solder, so as to achieve the simultaneous filtration of floating impurities in the molten solder in the process of controlling the solder wave soldering area by the disc, which is conducive to ensuring the cleanliness of the molten solder, and then ensuring the quality of wave soldering. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention and the external transport unit; Figure 2 It is a schematic diagram of the overall structure of the present invention; Figure 3 It is a schematic diagram of the internal structure of the casing in the present invention; Figure 4 It is a schematic diagram of the top structure of the carrier board in the present invention; Figure 5 It is a structural schematic diagram of the welding module and the conveying mechanism in the present invention; Figure 6 It is a schematic diagram of the structure of the conveying mechanism in the present invention; Figure 7 It is a schematic diagram of the structure of the welding module and the cooling module in the present invention; Figure 8It is a schematic diagram of the structure of two disks shielding solder wave crests in the present invention; Fig. 9 It is a schematic diagram of the internal structure of two discs in the present invention.
[0018] In the figure: 100, housing; 110, rectangular through hole; 120, touch screen; 130, glass door; 140, baffle; 200, carrier; 210, heating box; 300, soldering assembly; 310, soldering box; 320, atomizing nozzle; 400, welding module; 410, control box; 420, solder tank; 421, solder spraying part; 430, connecting arm; 431, pulley; 440, Disc; 441, filter chamber; 442, mesh plate; 443, cover plate; 450, motor 1; 500, cooling module; 510, fan; 520, cooling box; 530, support column; 531, motor 2; 600, conveying mechanism; 610, beam 1; 620, beam 2; 630, sprocket; 631, chain; 640, clamp; 700, conveying unit; 800, light board body. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0020] For example, see Figure 1 - Figure 8 In an embodiment of the present invention, a wave soldering machine for soldering a lamp board plug-in component includes a housing 100, a carrier board 200 is fixed at one end of the top surface of the housing 100, a heating box 210 is fixed on the top of the carrier board 200, an infrared heater is fixed inside the heating box 210, a soldering assembly 300 for spraying soldering flux on the lamp board is fixed at one end of the carrier board 200, a soldering module 400 is fixed at the middle position inside the housing 100, and the soldering module 400 includes a control box 410, and the top of the control box 410 A solder tank 420 is installed and fixed, and molten solder liquid is contained in the solder tank 420. A solder spraying part 421 for spraying the solder liquid is installed and fixed in the middle of the solder tank 420. Connecting arms 430 are fixed at both ends of the solder tank 420. A disc 440 is rotatable at one end of the connecting arm 430. A cooling module 500 for air-cooling the lamp board is fixed at one end of the carrier board 200 away from the carrier board 200. A conveying mechanism 600 for conveying the lamp board to different processing stations is installed and fixed inside the casing 100.
[0021] Specifically, two disks 440 are eccentrically rotated above the solder spraying portion 421 of the traditional solder wave forming component. When one disk 440 rotates to cover the upper position of the solder wave, it can cover that part of the solder wave to solder the lamp board. By rotating the disks 440 at different positions to cover the solder wave, it is convenient to perform separate welding on any side of the bottom surface of the lamp board. By rotating the two disks 440 above the solder wave at the same time, the eccentrically rotated disks 440 move from the two ends of the solder spraying portion 421 to the middle thereof, which will gradually reduce the welding area of the solder wave. The gap length between the two disks 440 after the rotation and stopping can be made the same as the width of the middle area to be welded of the lamp board, so that the sprayed solder wave can target the middle area of the lamp board for welding, thereby preventing the entire lamp board from being welded when a local area of the lamp board needs to be welded, thereby preventing the welding holes on the lamp board where no original parts are installed from being blocked, so that the wave soldering machine can adapt to the requirements of local welding.
[0022] like Figure 1 and Figure 2 As shown, in the present embodiment, both ends of the housing 100 are provided with rectangular through holes 110, and the positions of the rectangular through holes 110 are convenient for the external conveying part 700 to be installed on the two ends of the conveying mechanism 600. The commonly used conveying part 700 is mainly a conveyor belt, which can convey the lamp board to the conveying mechanism 600, and then the conveying mechanism 600 conveys the lamp board to the inside of the wave soldering machine for welding, and finally the conveying mechanism 600 conveys the welded lamp board to another conveyor belt for transmission, or a manipulator can be used to directly put the lamp board into the loading end of the conveying mechanism 600. The specific prior art of upper and lower material positions and the detailed working principle are not described in detail.
[0023] In this embodiment, a touch screen 120 is installed and fixed at one end of the casing 100, and the user can control the wave soldering machine through the touch screen 120. A plurality of glass doors 130 are detachably installed and fixed on the outside of the casing 100. The glass doors 130 allow the user to observe the welding condition of the lamp board and the solder condition inside the solder tank 420. A heat dissipation ventilation hole is also provided at one end of the outside of the casing 100.
[0024] like Fig. 9 As shown, in this embodiment, a filter chamber 441 is opened on the bottom surface of the disk 440, and the inner bottom surface of the filter chamber 441 is an inclined surface. The inner bottom surface of the filter chamber 441 is detachably embedded with a mesh plate 442. When the disk 440 rotates to cover the solder wave peak, the solder wave peak will flow into the filter chamber 441 and flow to the position of the mesh plate 442 along the inclined surface of the inner bottom surface of the filter chamber 441. A cover plate 443 is detachably fixed on the top of the disk 440. The mesh holes on the mesh plate 442 can filter floating impurities mixed in the molten solder, so that the solder remains clean and the quality of the welded product is improved.
[0025] In this embodiment, the inner bottom surface of the filter chamber 441 is an inclined surface to facilitate the solder entering the filter chamber 441 to flow to the mesh plate 442 for filtering. When it is necessary to clean the impurities intercepted on the mesh plate 442 inside the disc 440, the disc 440 can be rotated to one end of the solder groove 420, and then the glass door 130 or the baffle 140 on the rear side of the housing 100 can be opened, so that the user can remove the cover plate 443 on the top of the disc 440, and then clean the impurities on the mesh plate 442, and finally install the cover plate 443 on the disc 440.
[0026] like Figure 8 As shown, in the present embodiment, the eccentric position of the disk 440 is rotatably connected to the connecting arm 430, so that when the disk 440 rotates toward the middle of the solder groove 420, it can move from both ends of the solder wave peak toward the middle of the solder wave peak, thereby realizing the use of two disks 440 to cover solder waves of different lengths, making it easy to adjust solder waves of different lengths to weld the lamp boards in local areas.
[0027] like Figure 7 and Figure 8 As shown, in the present embodiment, pulleys 431 are fixed at both ends of the connecting arm 430, and a synchronous belt is connected between the two pulleys 431, wherein one pulley 431 is fixedly connected to a corresponding position disk 440 via a rotating shaft, and the welding module 400 also includes a motor 450 fixed to the solder tank 420, and the output end of the motor 450 is fixedly connected to the pulley 431 at the corresponding position. When the disk 440 needs to be rotated, the motor 450 rotates the pulley 431 at its output end, and under the transmission action of the synchronous belt, the other pulley 431 rotates with the rotating shaft, and the rotating shaft rotates with the disk 440, so that the disk 440 blocks the solder wave peak.
[0028] like Figure 7 As shown, in this embodiment, an electromagnetic pump is fixedly installed on the inner top of the control box 410, and the output end of the electromagnetic pump is connected and fixed to the solder spraying part 421. The electromagnetic pump or mechanical pump transports the solder to the position of the solder spraying part 421 to form an upward wave peak, and welding is achieved when the lamp board contacts the solder wave peak. The specific electromagnetic pump cooperates with the solder spraying part 421 to form a solder wave peak, which is a prior art, and the specific working principle will not be elaborated herein.
[0029] like Figure 5 and Figure 6As shown, in this embodiment, the conveying mechanism 600 includes two beams 1 610 fixed to the inner side of the casing 100, two beams 2 620 are fixed between the bottoms of the two beams 1 610, sprockets 630 are rotated at both ends of the bottom of the beams 2 620, and a chain 631 is connected for transmission between the two sprockets 630, and a motor 3 for driving the sprocket 630 at the corresponding position to rotate is embedded and fixed at both ends of a beam 1 610, and a plurality of clamps 640 for supporting and conveying the light board are evenly fixed on the outside of the chain 631.
[0030] In this embodiment, during the process of conveying the light board, motor three rotates the sprocket 630, and the sprocket 630 supports the light board with multiple clamps 640 through the chain 631 and conveys the light board to different workstations. When conveyed to the welding station, the solder wave can weld the light board. The specific conveying mechanism 600 for conveying the light board is existing technology, and the specific working principle will not be elaborated herein.
[0031] like Figure 4 As shown, in this embodiment, the flux assembly 300 includes a flux box 310, and an atomizing nozzle 320 is fixedly installed on the top of the flux box 310. The flux box 310 is used to store flux. The flux sprayed by the atomizing nozzle 320 is perpendicular to the lower end surface of the lamp board, so that the flux can be evenly applied to the bottom of the lamp board, forming a better protection for the lamp board and improving the welding quality of the lamp board.
[0032] like Figure 4 As shown, in this embodiment, a fixed infrared heater is installed inside the heating box 210 to preheat the lamp board to be welded, which is a prior art, and the specific heating principle is not described in detail.
[0033] Embodiment 2, based on embodiment 1, is to enable targeted air cooling of the local welding area on the lamp board.
[0034] like Figure 3 and Figure 7 As shown, in this embodiment, the cooling module 500 includes a fan 510 fixed to the inner bottom surface of the casing 100, the air outlet end of the fan 510 is connected and fixed with a hose, one end of the hose is connected and fixed with a cooling box 520, a plurality of air outlet holes are provided on the top of the cooling box 520, a support column 530 rotatably connected to the cooling box 520 is fixed to the inner bottom surface of the casing 100, a motor 2 531 is installed and fixed on the top of the support column 530, and the output end of the motor 2 531 is fixedly connected to the cooling box 520.
[0035] Specifically, after the welded lamp board is transported to the upper position of the cooling box 520 by the conveying mechanism 600, the fan 510 conveys air to the cooling box 520 through the hose, and the wind blows through the air outlet holes on the cooling box 520, so that the air can quickly cool the welded lamp board. When only one side of the bottom surface of the lamp board is welded, the motor 2 531 drives the cooling box 520 to rotate and tilt toward the welding area of the lamp board, so that the heat outlet holes of the cooling box 520 are concentrated on cooling the welding area, thereby achieving the effect of targeted cooling of the welding position.
[0036] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.
[0037] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A wave soldering machine for soldering lamp board plug-in components, characterized in that: include: Casing (100); A carrier plate (200) is supported and fixed at one end inside the housing (100), and a heating box (210) is fixed on the top of the carrier plate (200); A soldering assembly (300) is fixed to one end of the carrier board (200) and is used to spray soldering flux onto the lamp board; A welding module (400) is fixed at a middle position inside the housing (100), the welding module (400) comprising a control box (410), a solder tank (420) being fixedly mounted on the top of the control box (410), the solder tank (420) containing molten solder liquid, a solder spraying portion (421) for spraying the solder liquid being fixedly mounted in the middle of the solder tank (420), connecting arms (430) being fixedly mounted at both ends of the solder tank (420), and a disc (440) being rotatable at one end of the connecting arm (430); A cooling module (500) is fixed to the other end of the carrier board (200) and is used to cool the light board after welding; The conveying mechanism (600) is installed and fixed in the middle of the housing (100) and is used to convey the lamp panels to different workstations for processing.
2. The wave soldering machine for soldering lamp board plug-in components according to claim 1, characterized in that: A filter chamber (441) is provided on the bottom surface of the disc (440); the inner bottom surface of the filter chamber (441) is an inclined surface; a mesh plate (442) is detachably embedded and fixed on the inner bottom surface of the filter chamber (441).
3. The wave soldering machine for soldering lamp board plug-in components according to claim 1, characterized in that: The eccentric position of the disk (440) is rotatably connected to the connecting arm (430), and a cover plate (443) is detachably fixed to the top of the disk (440).
4. The wave soldering machine for soldering light board plug-in components according to claim 1, characterized in that: The soldering assembly (300) comprises a soldering box (310), and an atomizing nozzle (320) is fixedly mounted on the top of the soldering box (310).
5. The wave soldering machine for soldering light board plug-in components according to claim 1, characterized in that: Rectangular through holes (110) are provided at both ends of the housing (100), and a touch screen (120) is fixedly mounted on one end of the housing (100).
6. The wave soldering machine for soldering lamp board plug-in components according to claim 1, characterized in that: An electromagnetic pump is fixedly mounted on the inner top of the control box (410), and an output end of the electromagnetic pump is connected and fixed to the solder spraying portion (421).
7. The wave soldering machine for soldering lamp board plug-in components according to claim 1, characterized in that: The cooling module (500) comprises: The fan (510) is fixed to the inner bottom surface of the housing (100), and a hose is connected and fixed to the air outlet end of the fan (510); A cooling box (520) is rotatably connected to the control box (410), and the cooling box (520) is connected and fixed to the top end of the hose; The support column (530) is fixed to the inner bottom surface of the housing (100), the support column (530) is rotatably connected to the cooling box (520), a second motor (531) is fixedly mounted on the top of the support column (530), and an output end of the second motor (531) is fixedly connected to the cooling box (520).
8. The wave soldering machine for soldering lamp board plug-in components according to claim 1, characterized in that: The conveying mechanism (600) comprises: Two crossbeams (610) are fixed inside the casing (100); Two crossbeams (620) are fixed to the bottom of the crossbeam (1); A plurality of sprocket wheels (630) are rotatably connected to the ends of the second crossbeam (620) at corresponding positions, and a chain (631) is transmission-connected between two sprocket wheels (630) on the same second crossbeam (620); A plurality of clamps (640) are evenly fixed on the outside of the chain (631).
9. The wave soldering machine for soldering light board plug-in components according to claim 1, characterized in that: Pulleys (431) are fixed at both ends of the connecting arm (430), and a synchronous belt is connected between the two pulleys (431), wherein one pulley (431) is fixedly connected to a corresponding position disc (440) via a rotating shaft.
10. The wave soldering machine for soldering lamp board plug-in components according to claim 9, characterized in that: The welding module (400) further comprises a motor 1 (450) fixed to the solder tank (420), and an output end of the motor 1 (450) is fixedly connected to a pulley (431) at a corresponding position.