Full-automatic wafer bonding ultrasonic scanning detection equipment

Abstract

The invention discloses full-automatic wafer bonding ultrasonic scanning detection equipment, and particularly relates to the technical field of wafer bonding detection equipment.The full-automatic wafer bonding ultrasonic scanning detection equipment comprises a mounting rack, a braking device is slidably mounted on the outer side of the upper end of a mounting table, and transmission screw mechanisms are arranged on the two sides of the outer surface of the mounting table; and the two sides of the outer surface of the braking device are in threaded connection with the outer surfaces of the two transmission screw mechanisms, two scanning mechanisms are arranged in the middle of the braking device, and a transmission device is arranged on one side of the upper end of the mounting table. According to the full-automatic wafer bonding ultrasonic scanning detection equipment, by arranging the fixing device, before the wafer is detected, a worker or a mechanical arm can place the wafer in an inner cavity of a fixing disc and slightly press the wafer, so that the wafer can be fixed, and meanwhile, the wafer bonding detection efficiency is greatly improved. And the fixing state of the wafer can be relieved by slightly pressing the wafer again, so that the operation is simple, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer bonding detection equipment, and in particular to a fully automatic wafer bonding ultrasonic scanning detection equipment. Background Art

[0002] Wafers are a common product structure in the field of semiconductor manufacturing. As the horizontal development of wafers is limited, wafers are gradually turning to vertical development, that is, bonding two or more wafers together. The stability of the bonding parts between wafers directly affects the performance of the wafer in practical applications.

[0003] Chinese patent publication number CN117647205A discloses a wafer bonding strength detection device and method, including: a carrying component for carrying and fixing two wafers to be detected that are bonded to each other; a driving component connected to a cutting blade and used to drive the cutting blade to insert into the bonding position between the two wafers to be detected; an ultrasonic detection component for detecting the length of a crack between the two wafers to be detected; a processor connected to the ultrasonic detection component and used to determine the bonding strength between the two wafers to be detected according to the crack length. The device ensures the accuracy of crack length detection on the basis of keeping the cutting blade stably cutting the wafer bonding position, thereby ensuring the accuracy and reliability of the final wafer bonding strength detection. However, in actual use, the device is relatively cumbersome in the process of fixing the wafer. At the same time, after the wafer detection is completed, cumbersome operations are required to remove the wafer, resulting in low work efficiency. Summary of the invention

[0004] The main purpose of the present invention is to provide a fully automatic wafer bonding ultrasonic scanning detection equipment, which can effectively solve the problem that the process of fixing the wafer is relatively cumbersome. At the same time, after the wafer inspection is completed, cumbersome operations are required to remove the wafer, resulting in low work efficiency.

[0005] To achieve the above object, the technical solution adopted by the present invention is:

[0006] A fully automatic wafer bonding ultrasonic scanning detection equipment comprises a mounting frame, a mounting platform is arranged on the outer side of the upper part of the mounting frame, a mounting disk is arranged on the upper end of the mounting frame, a plurality of fixing devices are arranged on the bottom wall of the inner cavity of the mounting disk, a braking device is slidably mounted on the outer side of the upper end of the mounting platform, transmission screw mechanisms are arranged on both sides of the outer surface of the mounting platform, both sides of the outer surface of the braking device are threadedly connected with the outer surfaces of two transmission screw mechanisms, two scanning mechanisms are arranged in the middle of the braking device, and a transmission device is arranged on one side of the upper end of the mounting platform.

[0007] Specifically, before inspecting the wafer, the wafer needs to be placed on the top of multiple fixing devices and fixed by the fixing devices. During the inspection of the wafer, the braking device will drive the scanning mechanism to operate so that the scanning mechanism can conduct a comprehensive inspection of the wafer. When the scanning mechanism completes the inspection of a wafer, the braking device will drive the scanning mechanism to move to the initial position, and then the next wafer fixed on the fixing device will be rotated to the corresponding inspection position by the motor or the staff turning the mounting plate.

[0008] Preferably, the braking device includes two transverse braking mechanisms, the two transverse braking mechanisms are slidably installed on the upper end of the mounting table, both sides of the outer surfaces of the two transverse braking mechanisms are threadedly connected to the outer surfaces of the two transmission screw mechanisms, the outer surfaces of the two transverse braking mechanisms are arranged on the sides away from each other with longitudinal braking mechanisms driven by the transmission screw mechanisms, the lower parts of the outer surfaces of the two longitudinal braking mechanisms are respectively fixedly connected to the outer surfaces of the two scanning mechanisms, connecting rods are slidably installed on both sides of the outer surfaces of the two transverse braking mechanisms, the middle parts of the outer surfaces of the two connecting rods are slidably connected to the upper parts of the outer surfaces of the longitudinal braking mechanisms, and a driven rod is slidably installed on one side of the upper ends of the two connecting rods, a limiting rod is arranged on one side of the outer surface of the driven rod, and two sliding blocks are arranged on the inner surface of the limiting rod.

[0009] Specifically, after the staff fixes the wafer on the upper part of the fixing device, the two scanning mechanisms can be driven to move in the horizontal and vertical directions through the lateral braking mechanism and the longitudinal braking mechanism, so that the scanning mechanism can comprehensively inspect the wafer without the need for manual control by the staff, reflecting the fully automatic nature of the device.

[0010] Preferably, the fixing device includes a fixing plate, which is fixedly mounted on the bottom wall of the inner cavity of the mounting plate, and two elastic hydraulic pushers and two elastic hydraulic parts are fixedly mounted on the outer side of the inner cavity of the fixing plate, the two elastic hydraulic pushers and the two elastic hydraulic parts are distributed at intervals, and the lower ends of the two elastic hydraulic pushers and the two elastic hydraulic parts extend to the lower part of the fixing plate, and a fixing mechanism is provided in the middle part of the inner cavity of the fixing plate, and the lower end of the fixing mechanism extends to the lower part of the fixing plate.

[0011] Specifically, before inspecting the wafer, the staff or the robot can place the wafer in the inner cavity of a fixed plate, and then lightly press the wafer to make the wafer push the two elastic hydraulic pushing parts to operate. During this process, the hydraulic oil in the inner cavity of the two elastic hydraulic pushing parts will enter the inner cavity of the fixing mechanism, thereby driving the fixing mechanism to operate, so that the fixing mechanism will adsorb the wafer, thereby completing the fixing action of the wafer.

[0012] Furthermore, after the scanning mechanism completes the inspection of the wafer and the mounting plate rotates a certain angle to transfer the wafer out of the inspection position, the staff or the robot can press the wafer lightly again to allow the hydraulic oil in the inner cavity of the elastic hydraulic pusher to enter the inner cavity of the fixing mechanism again, so that the fixing mechanism no longer adsorbs the wafer, thereby releasing the fixing state of the wafer by the fixing mechanism.

[0013] Furthermore, when the wafer squeezes the elastic hydraulic pushing member, causing the hydraulic oil in the inner cavity of the elastic hydraulic pushing member to enter the inner cavity of the fixing mechanism, the hydraulic oil that enters the inner cavity of the fixing mechanism will enter the inner cavities of the two elastic hydraulic members after flowing for a certain distance. When the fixing mechanism completes fixing the wafer, the hydraulic oil in the inner cavity of the elastic hydraulic member will return to the inner cavity of the elastic hydraulic pushing member again under the action of the spring.

[0014] Preferably, the fixing mechanism includes a brake member, which is fixedly mounted in the middle of the inner cavity of the fixed disk, and the lower end of the brake member extends to the lower part of the fixed disk, a limiting member is provided in the middle of the inner cavity of the brake member, a ratchet is provided on the outer surface of the limiting member, a support ring is provided at the upper end of the brake member, a limiting plate is slidably mounted in the middle of the inner cavity of the limiting member, and the limiting plate is slidably mounted in the middle of the inner cavity of the brake member.

[0015] Specifically, when the wafer is placed in the inner cavity of the fixed plate and the wafer is lightly pressed, the wafer squeezes the elastic hydraulic pushing member, causing the hydraulic oil in the inner cavity of the elastic hydraulic pushing member to enter the inner cavity of the brake member to operate. During the operation of the brake member, the limit member is driven to rotate by the ratchet. When the limit member rotates, it will pull the limit plate to move downward. Since the surface of the wafer is always in contact with the upper part of the support ring during the process of placing the wafer in the inner cavity of the fixed plate, when the limit plate moves downward, negative pressure will be generated between the limit plate and the wafer, thereby adsorbing the wafer to fix the wafer.

[0016] Furthermore, after the hydraulic oil in the inner cavity of the elastic hydraulic pusher enters the inner cavity of the brake component, after the hydraulic oil moves a certain distance, the hydraulic oil will enter the inner cavity of the elastic hydraulic component from the hydraulic pipe connected to the elastic hydraulic component on the other side. When the wafer is fixed, no force is applied to the wafer. At this time, the two elastic hydraulic pushers will push the wafer to move upward. During this process, the spring in the support ring will also push the wafer to move upward. At this time, the hydraulic oil in the inner cavity of the two elastic hydraulic components will enter the inner cavity of the two elastic hydraulic pushers through the brake component. During this process, due to the action of the ratchet, the brake component cannot drive the limit component to operate, and the limit plate cannot move, thereby further increasing the negative pressure between the limit plate and the wafer.

[0017] Preferably, the braking member includes a brake disc, which is fixedly mounted in the middle of an inner cavity of a fixed disc, the inner cavity of the brake disc is connected to the inner cavities of two elastic hydraulic pushers and two elastic hydraulic parts through a hydraulic pipe, a brake fan is rotatably mounted on the outer side of the inner cavity of the brake disc, and the inner surface of the brake fan is fixedly connected to the outer surface of the ratchet.

[0018] Preferably, the support ring includes an elastic telescopic ring, which is fixedly mounted on the upper end of the brake disc, a partition is provided on the lower part of the inner surface of the elastic telescopic ring, and the partition is rotatably mounted on the upper end of the brake fan, and a rubber ring is provided on the upper end of the protruding ring of the elastic telescopic ring.

[0019] Preferably, the limiting member includes a limiting ring, which is rotatably installed in the middle part of the inner cavity of the brake disc, and the outer surface of the limiting ring is fixedly connected to the inner surface of the ratchet, and partitions are provided on both sides of the inner cavity surface of the limiting ring, and the upper and lower parts of the two partitions are provided with horizontal slides, the inner cavities of the two arc-shaped slides and the two horizontal slides are connected, and the two arc-shaped slides and the two horizontal slides are adapted for use with the limiting plates.

[0020] Specifically, when the elastic hydraulic pushing member is squeezed, the hydraulic oil in its inner cavity enters the inner cavity of the brake disc, and the hydraulic oil will push the brake fan to rotate, and then the brake fan drives the limit ring to rotate through the ratchet. When the limit ring rotates, the slider on the limit plate will slide in the slide composed of the arc slide and the horizontal slide, thereby causing the limit plate to move downward, thereby generating negative pressure between the limit plate and the wafer. When the limit plate moves downward to the corresponding position, the slider on the limit plate will enter the inner cavity of the horizontal slide located at the bottom. At this time, the brake member no longer drives the limit member to rotate, thereby causing the limit member to restrict the limit plate.

[0021] Furthermore, after the wafer is fixed and no force is applied to the wafer, the hydraulic oil in the inner cavity of the elastic hydraulic component flows back into the inner cavity of the elastic hydraulic pusher, and the brake fan will rotate in the opposite direction. However, under the action of the ratchet, the brake fan cannot drive the limit ring to rotate, and thus the limit plate cannot move up and down.

[0022] Furthermore, after the wafer inspection is completed, when force is applied to the wafer again, the hydraulic oil in the inner cavity of the elastic hydraulic pusher will enter the inner cavity of the brake part again, causing the brake fan to drive the limit part to rotate through the ratchet. At this time, the slider on the limit plate enters from the lower horizontal slide into the inner cavity of the arc-shaped slide on the other side, and then the slider enters the inner cavity of the upper horizontal slide. During this process, the limit plate will move upward, causing the negative pressure between the limit plate and the wafer to disappear, thereby releasing the fixed state of the wafer. At this time, the wafer can be taken out from the inner cavity of the fixed disk.

[0023] Preferably, the transmission device includes a transmission rod, which is rotatably mounted on the upper end of the mounting platform, and a transmission member is provided at the upper end of the transmission rod, and the transmission member is adapted for use with the limiting rod. A gap mechanism is provided at the lower part of the outer surface of the transmission rod, and the special-shaped gear in the middle of the gap mechanism is connected to the lower end of the mounting plate through a belt.

[0024] Preferably, the transmission member includes a transmission column, which is rotatably mounted on the upper end of a transmission rod, and the outer surface of the transmission column is provided with two vertical slide grooves and two arc-shaped slide grooves, the two vertical slide grooves and the two arc-shaped slide grooves are spaced apart, and the inner cavities of the two vertical slide grooves and the two arc-shaped slide grooves are connected, and a limit block rotatably mounted on the outer surface of the transmission column is provided at the connection between the lower parts of the two vertical slide grooves and the arc-shaped slide grooves, and a spring is provided at the connection between the limit block and the transmission column.

[0025] Specifically, when the braking device drives the scanning mechanism to complete the inspection of a wafer, the longitudinal braking mechanism drives the scanning mechanism to move upward to return the scanning mechanism to the initial position. At this time, the longitudinal braking mechanism will drive the driven rod to move upward through the connecting rod, and then the driven rod will drive the limit rod to move upward.

[0026] Furthermore, during the upward movement of the limit rod, the slider on the inner surface of the limit rod will slide in the inner cavity of the arc-shaped slide groove on one side. During this process, the limit rod will drive the transmission column to rotate a certain angle, and then the transmission column will drive the gap mechanism through the transmission rod to drive the mounting plate to rotate a certain angle, so that the next fixing device with the wafer fixed on it enters the detection position, and no other power source is required to drive the mounting plate to rotate.

[0027] Furthermore, after the uninspected wafer enters the inspection position, the longitudinal braking mechanism drives the scanning mechanism downward again, so that the scanning mechanism inspects the wafer. During this process, the slider on the limit rod slides in the inner cavity of the vertical slide groove, and the limit rod will not drive the transmission column to rotate.

[0028] Furthermore, when the limit rod moves to the lower part of the vertical slide groove, the slider on the limit rod will contact the surface of the limit block and push the limit block to rotate, so that the slider enters the bottom of the vertical slide groove, and then the slider no longer contacts the limit block. At this time, the limit block returns to the initial position under the action of the spring. When the scanning mechanism completes the wafer inspection again, the limit rod moves upward, but at this time the limit block will guide the slider on the limit rod into the inner cavity of the arc-shaped slide groove on the other side, so that the transmission column drives the mounting plate to rotate again through the gap mechanism, and so on.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] 1. In the present invention, by providing a fixing device, before inspecting the wafer, a worker or a robot can place the wafer in the inner cavity of a fixing plate and lightly press the wafer to complete the fixing action of the wafer. At the same time, lightly pressing the wafer again can release the fixing state of the wafer. The operation is simple and the work efficiency is improved.

[0031] 2. In the present invention, a transmission device is provided and the force of the scanning mechanism driven by the braking device is utilized so that the braking device can simultaneously drive the transmission device to operate, so that the transmission device can mobilize the mounting plate to rotate a certain angle, so that the next wafer mounted on the upper part of the fixing device enters the detection position. No other power source is required to drive the mounting plate, thereby reducing the manufacturing cost of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 The overall structure of the present invention is shown in FIG. Figure 1 ;

[0033] Figure 2 The overall structure of the present invention is shown in FIG. Figure 2 ;

[0034] Figure 3 It is a schematic diagram of the structure of the braking device of the present invention;

[0035] Figure 4 It is a schematic diagram of the assembly of the fixing device of the present invention;

[0036] Figure 5 It is a schematic diagram of the structure of the fixing device of the present invention;

[0037] Figure 6 It is a schematic diagram of the assembly of the fixing mechanism of the present invention;

[0038] Figure 7 It is a schematic diagram of the fixing mechanism structure of the present invention;

[0039] Figure 8 is a cross-sectional view of the fixing mechanism of the present invention;

[0040] Fig. 9 It is a schematic diagram of the brake structure of the present invention;

[0041] Fig.10 It is a schematic diagram of the structure of the position-limiting member of the present invention;

[0042] Fig.11 It is a schematic diagram of the transmission structure of the present invention;

[0043] Fig.12 It is a schematic diagram of the assembly of the transmission parts of the present invention;

[0044] Fig.13 For the present invention Fig.12 A partial enlarged view of point A in the middle.

[0045] In the figure: 1, mounting frame; 2, mounting table; 3, braking device; 31, transverse braking mechanism; 32, connecting rod; 33, driven rod; 34, limiting rod; 35, longitudinal braking mechanism; 4, scanning mechanism; 5, transmission device; 51, transmission rod; 52, transmission member; 521, transmission column; 522, vertical slide; 523, arc slide; 524, limiting block; 53, gap mechanism; 6, mounting plate; 7, fixing device; 7 1. Fixed plate; 72. Elastic hydraulic pusher; 73. Elastic hydraulic part; 74. Fixing mechanism; 741. Braking part; 7411. Braking disc; 7412. Braking fan; 742. Limiting part; 7421. Limiting ring; 7422. Arc slide; 7423. Horizontal slide; 743. Limiting plate; 744. Support ring; 7441. Elastic telescopic ring; 7442. Partition; 7443. Rubber ring; 745. Ratchet. DETAILED DESCRIPTION

[0046] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0047] Embodiment 1, as Figure 1 and Figure 2 As shown, this embodiment discloses a fully automatic wafer ultrasonic scanning and detection equipment, including a mounting frame 1, a mounting platform 2 is arranged on the upper outer side of the mounting frame 1, a mounting disk 6 is arranged on the upper end of the mounting frame 1, a plurality of fixing devices 7 are arranged on the bottom wall of the inner cavity of the mounting disk 6, a braking device 3 is slidably installed on the outer side of the upper end of the mounting platform 2, transmission screw mechanisms are arranged on both sides of the outer surface of the mounting platform 2, both sides of the outer surface of the braking device 3 are threadedly connected to the outer surfaces of the two transmission screw mechanisms, and two scanning mechanisms 4 are arranged in the middle of the braking device 3.

[0048] Specifically, before inspecting the wafer, the wafer needs to be placed on the upper part of multiple fixing devices 7 and fixed by the fixing devices 7. During the inspection of the wafer, the braking device 3 will drive the scanning mechanism 4 to operate so that the scanning mechanism 4 can perform a comprehensive inspection on the wafer. When the scanning mechanism 4 completes the inspection of a wafer, the braking device 3 will drive the scanning mechanism 4 to move to the initial position, and then the next wafer fixed on the fixing device 7 will be rotated to the corresponding inspection position by the motor or the staff rotating the mounting plate 6.

[0049] In order to drive the two scanning mechanisms 4 to move, so that the scanning mechanisms 4 can detect the wafer, such as Figure 3As shown, the braking device 3 includes two transverse braking mechanisms 31, which are slidably installed on the upper end of the mounting table 2, and both sides of the outer surfaces of the two transverse braking mechanisms 31 are threadedly connected to the outer surfaces of the two transmission screw mechanisms, and the outer surfaces of the two transverse braking mechanisms 31 are provided with longitudinal braking mechanisms 35 driven by the transmission screw mechanisms on the sides away from each other, and the lower parts of the outer surfaces of the two longitudinal braking mechanisms 35 are respectively fixedly connected to the outer surfaces of the two scanning mechanisms 4, and connecting rods 32 are slidably installed on both sides of the outer surfaces of the two transverse braking mechanisms 31, and the middle parts of the outer surfaces of the two connecting rods 32 are slidably connected to the upper parts of the outer surfaces of the longitudinal braking mechanisms 35, and a driven rod 33 is slidably installed on one side of the upper ends of the two connecting rods 32, and a limiting rod 34 is provided on one side of the outer surface of the driven rod 33, and two sliders are provided on the inner surface of the limiting rod 34.

[0050] Specifically, after the staff fixes the wafer on the upper part of the fixing device 7, the two scanning mechanisms 4 can be driven to move in the horizontal and vertical directions through the lateral braking mechanism 31 and the longitudinal braking mechanism 35, so that the scanning mechanism 4 can fully detect the wafer without the need for manual control by the staff, reflecting the fully automatic nature of the device.

[0051] In order to fix the wafer, Figure 4 and Figure 5 As shown, the fixing device 7 includes a fixing plate 71, which is fixedly mounted on the bottom wall of the inner cavity of the mounting plate 6, and two elastic hydraulic pushers 72 and two elastic hydraulic parts 73 are fixedly mounted on the outer side of the inner cavity of the fixing plate 71, and the two elastic hydraulic pushers 72 and the two elastic hydraulic parts 73 are distributed at intervals, and the lower ends of the two elastic hydraulic pushers 72 and the two elastic hydraulic parts 73 extend to the lower part of the fixing plate 71, and a fixing mechanism 74 is provided in the middle part of the inner cavity of the fixing plate 71, and the lower end of the fixing mechanism 74 extends to the lower part of the fixing plate 71.

[0052] Specifically, before inspecting the wafer, the staff or the robot can place the wafer in the inner cavity of a fixed plate 71, and then gently press the wafer so that the wafer pushes the two elastic hydraulic pushers 72 to operate. During this process, the hydraulic oil in the inner cavity of the two elastic hydraulic pushers 72 will enter the inner cavity of the fixing mechanism 74, thereby driving the fixing mechanism 74 to operate, so that the fixing mechanism 74 adsorbs the wafer, thereby completing the wafer fixing action.

[0053] Furthermore, after the scanning mechanism 4 completes the inspection of the wafer and the mounting plate 6 rotates a certain angle to transfer the wafer out of the inspection position, the staff or the robot can press the wafer lightly again to allow the hydraulic oil in the inner cavity of the elastic hydraulic pusher 72 to enter the inner cavity of the fixing mechanism 74 again, so that the fixing mechanism 74 no longer adsorbs the wafer, thereby releasing the fixing state of the wafer by the fixing mechanism 74.

[0054] Furthermore, when the wafer squeezes the elastic hydraulic pushing member 72 and the hydraulic oil in the inner cavity of the elastic hydraulic pushing member 72 enters the inner cavity of the fixing mechanism 74, the hydraulic oil entering the inner cavity of the fixing mechanism 74 flows for a certain distance and then enters the inner cavities of the two elastic hydraulic members 73. When the fixing mechanism 74 completes fixing the wafer, the hydraulic oil in the inner cavity of the elastic hydraulic member 73 returns to the inner cavity of the elastic hydraulic pushing member 72 again under the action of the spring.

[0055] In order to fix the wafer, Figure 6 - Figure 8 As shown, the fixing mechanism 74 includes a brake member 741, which is fixedly installed in the middle of the inner cavity of the fixed disk 71, and the lower end of the brake member 741 extends to the lower part of the fixed disk 71, a limiting member 742 is arranged in the middle of the inner cavity of the brake member 741, a ratchet 745 is arranged on the outer surface of the limiting member 742, a supporting ring 744 is arranged at the upper end of the brake member 741, a limiting plate 743 is slidably installed in the middle of the inner cavity of the limiting member 742, and the limiting plate 743 is slidably installed in the middle of the inner cavity of the brake member 741.

[0056] Specifically, when placing the wafer in the inner cavity of the fixed plate 71 and lightly pressing the wafer, the wafer squeezes the elastic hydraulic pusher 72, so that the hydraulic oil in the inner cavity of the elastic hydraulic pusher 72 enters the inner cavity of the brake member 741 to operate the brake member 741. During the operation of the brake member 741, the limit member 742 is driven to rotate through the ratchet 745. When the limit member 742 rotates, it will pull the limit plate 743 to move downward. Since the surface of the wafer is always in contact with the upper part of the support ring 744 during the process of placing the wafer in the inner cavity of the fixed plate 71, when the limit plate 743 moves downward, negative pressure will be generated between the limit plate 743 and the wafer, thereby adsorbing the wafer to fix the wafer.

[0057] Furthermore, after the hydraulic oil in the inner cavity of the elastic hydraulic pusher 72 enters the inner cavity of the brake member 741, after the hydraulic oil moves a certain distance, the hydraulic oil will enter the inner cavity of the elastic hydraulic member 73 from the hydraulic pipe connected to the elastic hydraulic member 73 on the other side. When the wafer is fixed, no force is applied to the wafer. At this time, the two elastic hydraulic pushers 72 will push the wafer to move upward. During this process, the spring in the support ring 744 will also push the wafer to move upward. At this time, the hydraulic oil in the inner cavity of the two elastic hydraulic members 73 will enter the inner cavity of the two elastic hydraulic pushers 72 through the brake member 741. During this process, due to the action of the ratchet 745, the brake member 741 cannot drive the limit member 742 to operate, and then the limit plate 743 cannot move, thereby further increasing the negative pressure between the limit plate 743 and the wafer.

[0058] In order to achieve the purpose of fixing the wafer, such as Fig. 9 As shown, the brake member 741 includes a brake disc 7411, which is fixedly installed in the middle of the inner cavity of the fixed disc 71. The inner cavity of the brake disc 7411 is connected to the inner cavities of two elastic hydraulic pushers 72 and two elastic hydraulic parts 73 through a hydraulic pipe. A brake fan 7412 is rotatably installed on the outer side of the inner cavity of the brake disc 7411, and the inner surface of the brake fan 7412 is fixedly connected to the outer surface of the ratchet 745.

[0059] Further, such as Fig. 9 As shown, the support ring 744 includes an elastic telescopic ring 7441, which is fixedly mounted on the upper end of the brake disc 7411. A partition 7442 is provided on the lower part of the inner surface of the elastic telescopic ring 7441. The partition 7442 is rotatably mounted on the upper end of the brake fan 7412. A rubber ring 7443 is provided on the upper end of the protruding ring of the elastic telescopic ring 7441.

[0060] Further, such as Fig.10 As shown, the limiting member 742 includes a limiting ring 7421, which is rotatably installed in the middle of the inner cavity of the brake disc 7411, and the outer surface of the limiting ring 7421 is fixedly connected to the inner surface of the ratchet 745, and partitions 7442 are provided on both sides of the inner cavity surface of the limiting ring 7421, and horizontal slides 7423 are provided on the upper and lower parts of the two partitions 7442, and the inner cavities of the two arcuate slides 7422 and the two horizontal slides 7423 are connected, and the two arcuate slides 7422 and the two horizontal slides 7423 are adapted for use with the limiting plate 743.

[0061] Specifically, when the elastic hydraulic pusher 72 is squeezed so that the hydraulic pressure in its inner cavity enters the inner cavity of the brake disc 7411, the flowing hydraulic oil will push the brake fan 7412 to rotate, and then the brake fan 7412 drives the limit ring 7421 to rotate through the ratchet 745. When the limit ring 7421 rotates, the slider on the limit plate 743 will slide in the slide composed of the arc slide 7422 and the horizontal slide 7423, thereby causing the limit plate 743 to move downward, thereby generating negative pressure between the limit plate 743 and the wafer. When the limit plate 743 moves downward to the corresponding position, the slider on the limit plate 743 will enter the inner cavity of the horizontal slide 7423 located at the bottom. At this time, the brake member 741 no longer drives the limit member 742 to rotate, thereby causing the limit member 742 to restrict the limit plate 743.

[0062] Furthermore, after the wafer is fixed and no force is applied to the wafer, the hydraulic oil in the inner cavity of the elastic hydraulic component 73 flows back into the inner cavity of the elastic hydraulic push component 72, and the brake fan 7412 will rotate in the opposite direction. However, under the action of the ratchet 745, the brake fan 7412 cannot drive the limit ring 7421 to rotate, and thus the limit plate 743 cannot move up and down.

[0063] Furthermore, after the wafer inspection is completed, when force is applied to the wafer again, the hydraulic oil in the inner cavity of the elastic hydraulic pusher 72 will enter the inner cavity of the brake member 741 again, so that the brake fan 7412 drives the limit member 742 to rotate through the ratchet 745. At this time, the slider on the limit plate 743 enters the inner cavity of the arc-shaped slide 7422 on the other side from the lower horizontal slide 7423, and then the slider enters the inner cavity of the upper horizontal slide 7423. During this process, the limit plate 743 will move upward, so that the negative pressure between the limit plate 743 and the wafer disappears, thereby releasing the fixed state of the wafer. At this time, the wafer can be taken out from the inner cavity of the fixed disk 71.

[0064] Embodiment 2: This embodiment further improves the installation disk 6 based on the embodiment 1, such as Figure 1 and Figure 2 As shown, a transmission device 5 is provided on one side of the upper end of the mounting platform 2 .

[0065] In order to utilize the force of the brake device 3 to drive the scanning mechanism 4 to move, the mounting plate 6 is driven to rotate, such as Fig.11 and Fig.12 As shown, the transmission device 5 includes a transmission rod 51, which is rotatably mounted on the upper end of the mounting platform 2. A transmission member 52 is provided at the upper end of the transmission rod 51, and the transmission member 52 is adapted for use with the limiting rod 34. A clearance mechanism 53 is provided at the lower portion of the outer surface of the transmission rod 51, and a special-shaped gear in the middle of the clearance mechanism 53 is connected to the lower end of the mounting plate 6 through a belt.

[0066] Further, such as Fig.13 As shown, the transmission member 52 includes a transmission column 521, which is rotatably installed on the upper end of the transmission rod 51. The outer surface of the transmission column 521 is provided with two vertical slide grooves 522 and two arc-shaped slide grooves 523. The two vertical slide grooves 522 and the two arc-shaped slide grooves 523 are distributed at intervals, and the inner cavities of the two vertical slide grooves 522 and the two arc-shaped slide grooves 523 are communicated. A limit block 524 rotatably installed on the outer surface of the transmission column 521 is provided at the connection between the lower part of the two vertical slide grooves 522 and the arc-shaped slide grooves 523, and a spring is provided at the connection between the limit block 524 and the transmission column 521.

[0067] Specifically, when the braking device 3 drives the scanning mechanism 4 to complete the inspection of a wafer, the longitudinal braking mechanism 35 drives the scanning mechanism 4 to move upward, so that the scanning mechanism 4 returns to the initial position. At this time, the longitudinal braking mechanism 35 will drive the driven rod 33 to move upward through the connecting rod 32, and then the driven rod 33 drives the limiting rod 34 to move upward.

[0068] Furthermore, during the upward movement of the limit rod 34, the slider on the inner surface of the limit rod 34 will slide in the inner cavity of the arc-shaped slide groove 523 on one side. During this process, the limit rod 34 will drive the transmission column 521 to rotate a certain angle, and then the transmission column 521 will drive the gap mechanism 53 through the transmission rod 51 to drive the mounting plate 6 to rotate a certain angle, so that the next fixing device 7 with the wafer fixed thereon enters the detection position, and no other power source is required to drive the mounting plate 6 to rotate.

[0069] Furthermore, after the uninspected wafer enters the inspection position, the longitudinal braking mechanism 35 drives the scanning mechanism 4 to move downward again, so that the scanning mechanism 4 inspects the wafer. During this process, the slider on the limit rod 34 slides in the inner cavity of the vertical slide groove 522, and the limit rod 34 will not drive the transmission column 521 to rotate.

[0070] Furthermore, when the limit rod 34 moves to the lower part of the vertical slide groove 522, the slider on the limit rod 34 will contact the surface of the limit block 524 and push the limit block 524 to rotate, so that the slider enters the bottom of the vertical slide groove 522, and then the slider no longer contacts the limit block 524. At this time, the limit block 524 returns to the initial position under the action of the spring, and when the scanning mechanism 4 completes the wafer inspection again, the limit rod 34 moves upward, but at this time the limit block 524 will guide the slider on the limit rod 34 into the inner cavity of the arc-shaped slide groove 523 on the other side, so that the transmission column 521 drives the mounting plate 6 to rotate again through the gap mechanism 53, and so on.

[0071] It should be noted that the specific installation method, circuit arrangement and connection method, and control method of the braking device 3 and the scanning mechanism 4 used in the above-mentioned embodiment 1 are conventional designs in the prior art and will not be elaborated in detail in the present invention.

[0072] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A fully automatic wafer bonding ultrasonic scanning detection device, comprising a mounting frame (1), characterized in that: A mounting platform (2) is arranged on the outer side of the upper part of the mounting frame (1), a mounting plate (6) is arranged on the upper end of the mounting frame (1), a plurality of fixing devices (7) are arranged on the bottom wall of the inner cavity of the mounting plate (6), a braking device (3) is slidably mounted on the outer side of the upper end of the mounting frame (2), transmission screw mechanisms are arranged on both sides of the outer surface of the mounting frame (2), both sides of the outer surface of the braking device (3) are threadedly connected to the outer surfaces of the two transmission screw mechanisms, two scanning mechanisms (4) are arranged in the middle of the braking device (3), and a transmission device (5) is arranged on one side of the upper end of the mounting frame (2).

2. The fully automatic wafer bonding ultrasonic scanning detection equipment according to claim 1, characterized in that: The braking device (3) comprises two transverse braking mechanisms (31), the two transverse braking mechanisms (31) are slidably mounted on the upper end of the mounting platform (2), both sides of the outer surfaces of the two transverse braking mechanisms (31) are threadedly connected to the outer surfaces of the two transmission screw mechanisms, the outer surfaces of the two transverse braking mechanisms (31) are provided with longitudinal braking mechanisms (35) driven by the transmission screw mechanisms on the sides away from each other, the lower parts of the outer surfaces of the two longitudinal braking mechanisms (35) are respectively fixedly connected to the outer surfaces of the two scanning mechanisms (4), both sides of the outer surfaces of the two transverse braking mechanisms (31) are slidably mounted with connecting rods (32), the middle parts of the outer surfaces of the two connecting rods (32) are slidably connected to the upper parts of the outer surfaces of the longitudinal braking mechanisms (35), and one side of the upper ends of the two connecting rods (32) is slidably mounted with driven rods (33), one side of the outer surface of the driven rod (33) is provided with a limiting rod (34), and the inner surface of the limiting rod (34) is provided with two sliding blocks.

3. The fully automatic wafer bonding ultrasonic scanning detection equipment according to claim 1, characterized in that: The fixing device (7) comprises a fixing plate (71), wherein the fixing plate (71) is fixedly mounted on the bottom wall of the inner cavity of the mounting plate (6), and two elastic hydraulic pushers (72) and two elastic hydraulic parts (73) are fixedly mounted on the outer side of the inner cavity of the fixing plate (71), wherein the two elastic hydraulic pushers (72) and the two elastic hydraulic parts (73) are arranged at intervals, and the lower ends of the two elastic hydraulic pushers (72) and the two elastic hydraulic parts (73) extend to the lower part of the fixing plate (71), and a fixing mechanism (74) is arranged in the middle of the inner cavity of the fixing plate (71), and the lower end of the fixing mechanism (74) extends to the lower part of the fixing plate (71).

4. The fully automatic wafer bonding ultrasonic scanning detection equipment according to claim 3 is characterized in that: The fixing mechanism (74) comprises a brake member (741), the brake member (741) is fixedly mounted in the middle of the inner cavity of the fixed disk (71), and the lower end of the brake member (741) extends to the lower part of the fixed disk (71), a limiting member (742) is arranged in the middle of the inner cavity of the brake member (741), a ratchet (745) is arranged on the outer surface of the limiting member (742), a supporting ring (744) is arranged at the upper end of the brake member (741), a limiting plate (743) is slidably mounted in the middle of the inner cavity of the limiting member (742), and the limiting plate (743) is slidably mounted in the middle of the inner cavity of the brake member (741).

5. The fully automatic wafer bonding ultrasonic scanning detection equipment according to claim 3, characterized in that: The brake member (741) includes a brake disc (7411), which is fixedly mounted in the middle of the inner cavity of the fixed disc (71). The inner cavity of the brake disc (7411) is connected to the inner cavities of two elastic hydraulic push members (72) and two elastic hydraulic members (73) through a hydraulic pipe. A brake fan (7412) is rotatably mounted on the outer side of the inner cavity of the brake disc (7411), and the inner surface of the brake fan (7412) is fixedly connected to the outer surface of the ratchet (745).

6. The fully automatic wafer bonding ultrasonic scanning detection equipment according to claim 5, characterized in that: The support ring (744) includes an elastic telescopic ring (7441), which is fixedly mounted on the upper end of the brake disc (7411), and a partition (7442) is provided at the lower part of the inner surface of the elastic telescopic ring (7441), and the partition (7442) is rotatably mounted on the upper end of the brake fan (7412), and a rubber ring (7443) is provided at the upper end of the protruding ring of the elastic telescopic ring (7441).

7. The fully automatic wafer bonding ultrasonic scanning detection equipment according to claim 6, characterized in that: The limiting member (742) includes a limiting ring (7421), which is rotatably mounted in the middle of the inner cavity of the brake disc (7411), and the outer surface of the limiting ring (7421) is fixedly connected to the inner surface of the ratchet (745), and partitions (7442) are provided on both sides of the inner cavity surface of the limiting ring (7421), and the upper and lower parts of the two partitions (7442) are provided with horizontal slides (7423), and the inner cavities of the two arc-shaped slides (7422) and the two horizontal slides (7423) are connected, and the two arc-shaped slides (7422) and the two horizontal slides (7423) are adapted for use with the limiting plate (743).

8. The fully automatic wafer bonding ultrasonic scanning detection equipment according to claim 2, characterized in that: The transmission device (5) comprises a transmission rod (51), the transmission rod (51) being rotatably mounted on the upper end of the mounting platform (2), a transmission member (52) being arranged at the upper end of the transmission rod (51), the transmission member (52) being adapted for use with a limit rod (34), a clearance mechanism (53) being arranged at the lower portion of the outer surface of the transmission rod (51), a special-shaped gear in the middle of the clearance mechanism (53) being connected to the lower end of the mounting plate (6) via a belt.

9. The fully automatic wafer bonding ultrasonic scanning detection equipment according to claim 8, characterized in that: The transmission member (52) comprises a transmission column (521), wherein the transmission column (521) is rotatably mounted on the upper end of the transmission rod (51), and the outer surface of the transmission column (521) is provided with two vertical slide grooves (522) and two arc-shaped slide grooves (523), wherein the two vertical slide grooves (522) and the two arc-shaped slide grooves (523) are arranged at intervals, and the inner cavities of the two vertical slide grooves (522) and the two arc-shaped slide grooves (523) are communicated with each other, and a limit block (524) rotatably mounted on the outer surface of the transmission column (521) is provided at the connection between the lower part of the two vertical slide grooves (522) and the arc-shaped slide grooves (523), and a spring is provided at the connection between the limit block (524) and the transmission column (521).

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