Rapid low-cost manufacturing method of glass adapter plate for chip 3D packaging

Abstract

The invention relates to the field of three-dimensional packaging, and discloses a rapid low-cost manufacturing method of a glass adapter plate for chip 3D packaging. A single-plate electrode electric field is adopted to drive a multi-nozzle spray deposition micro-nano 3D printing technology, and according to optimized printing process parameters and a set printing path, efficient defect-free metallization of a high-aspect-ratio glass through hole and rapid printing of a conductive pattern on the surface of a glass adapter plate are carried out. According to the rapid and low-cost manufacturing method of the glass adapter plate for chip 3D packaging provided by the invention, integrated manufacturing of the double-sided conductive pattern and the metalized TGV of the glass adapter plate can be realized by using single electric field driven jet micro-nano 3D printing equipment.

Description

Technical Field

[0001] The present application belongs to the field of advanced three-dimensional packaging involving glass transfer plates and micro-nano additive manufacturing technology, and in particular, to a method for rapid and low-cost manufacturing of glass transfer plates for chip 3D packaging. Background Art

[0002] Chips are the cornerstone of the vigorous development of the information society. Mastering the manufacturing technology of high-end chips is related to the country's future global competitiveness in key areas such as artificial intelligence, high-performance computing, 5G / 6G communications and the Internet of Everything. As the nano-process technology of integrated circuits gradually approaches the physical limit, the importance of continuing and expanding Moore's Law through three-dimensional heterogeneous integration of chips is becoming increasingly prominent. The key to the development and integration of heterogeneous integration technology lies in the integration of multi-scale and multi-dimensional chip interconnection, thereby improving bandwidth and power efficiency and reducing latency, providing smaller size and higher performance chips for high-performance computing, artificial intelligence and smart terminals. The vertical interconnection of chips relies on technologies such as through silicon vias (TSV) or through glass vias (TGV), and the horizontal interconnection is carried out through redistribution layer (RDL) technology.

[0003] As an advanced system integration technology, silicon-based adapter board 2.5D integration technology has developed rapidly in recent years. However, there are two main problems with silicon-based adapter boards: 1) High cost. The production of through silicon vias (TSV) uses silicon etching process, and then the through silicon vias require oxidation insulation layer, thin wafer holding and other technologies; 2) Poor electrical performance. Silicon material is a semiconductor material. When the transmission line transmits the signal, the signal has a strong electromagnetic coupling effect with the substrate material, and eddy currents are generated in the substrate, resulting in poor signal integrity (insertion loss, crosstalk, etc.). As a material that may replace silicon-based adapter boards, through glass via (TGV) adapter boards are becoming a research hotspot for domestic and foreign semiconductor companies and research institutes due to their many advantages.

[0004] Compared with silicon-based adapters, the advantages of glass adapters are mainly reflected in the following aspects. 1) Low cost: Benefiting from the easy availability of large-size ultra-thin panel glass and the lack of the need to deposit an insulating layer, the production cost of glass adapters is only about 1 / 8 of that of silicon-based adapters; 2) Excellent high-frequency electrical properties: Glass material is an insulator material with a dielectric constant of only about 1 / 3 of that of silicon material, and a loss factor 2 to 3 orders of magnitude lower than that of silicon material, which greatly reduces substrate loss and parasitic effects, and can effectively improve the integrity of the transmission signal; 3) Large-size ultra-thin glass substrates are easy to obtain; 4) Simple process flow: There is no need to deposit an insulating layer on the substrate surface and the inner wall of the TGV, and the ultra-thin adapter does not require secondary thinning; 5) Strong mechanical stability: When the thickness of the adapter is less than 100μm, the warping is still small; 6) Wide application fields: In addition to having good application prospects in the high-frequency field, the performance advantages of transparency, good airtightness, and corrosion resistance make glass through-holes have huge application prospects in the fields of optoelectronic system integration and MEMS packaging.

[0005] Glass micropore metallization is one of the most important process steps in the manufacture of glass adapter plates. It is mainly achieved through metallization filling. The main methods currently include chemical vapor deposition (CVD), physical vapor deposition (PVD), electroless plating, and electroplating. Electroplating copper is the most widely used technology (especially in the industry). However, the above methods all have certain shortcomings and limitations, such as expensive equipment, high production costs, low efficiency, and complex process flows. It is difficult to achieve defect-free and high-quality glass through-hole metal filling.

[0006] In order to achieve low-cost and rapid manufacturing of high-precision, high-density conductive patterns on the surface of glass transfer plates, the current manufacturing process still has obvious shortcomings. For example, laser ablation technology can achieve high-density circuit production, but it is inefficient, the production equipment is expensive, the production cost is high, and it is difficult to achieve large-scale production; wet etching technology or electroplating technology has complex process flows and generates a large amount of waste liquid and waste materials; screen printing is difficult to achieve high-density circuit manufacturing due to its low precision, etc.

[0007] The various existing technologies are not only difficult to meet the requirements of defect-free high aspect ratio glass through hole metallization of glass transfer plate; effective and reliable connection between metallized glass through hole and surface conductive pattern with controllable size and shape of connection point; high precision, high density, excellent impact resistance, stability and reliability of surface conductive pattern; in particular, the existing technology requires dozens of processes and dozens of equipment to complete the manufacturing of surface conductive pattern and TGV metallization of glass transfer plate, resulting in long production cycle, high production cost and expensive equipment. Therefore, the existing technology and solutions are completely unable to meet the actual needs of the glass transfer plate product development stage (only design verification, few samples need to be manufactured; design schemes are constantly changing, etc.), and it is urgent to develop new technologies and solutions for efficient and low-cost manufacturing of glass transfer plate metallized TGV and surface conductive pattern, especially new methods and equipment that can realize the integrated (integrated) manufacturing of glass transfer plate metallized TGV and surface conductive pattern.

[0008] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0009] In order to achieve the integrated manufacturing of the metallized TGV and the surface conductive pattern of the glass transfer plate with short production cycle, low production cost, short process flow; high production flexibility (adapting to the manufacturing of different conductive patterns, different hole shapes, apertures, and holes with different aspect ratios); reliable connection of the metallized TGV and the surface conductive pattern, and controllable size and shape of the connection point, green and environmentally friendly production, this application discloses a fast and low-cost manufacturing method for glass transfer plates for chip 3D packaging based on electric field driven jet micro-nano 3D printing. The single flat electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing technology is used, and according to the optimized printing process parameters and the set printing path, efficient and defect-free metallization of high aspect ratio glass through holes and rapid printing of conductive patterns on the surface of the glass transfer plate are performed.

[0010] The present application proposes a rapid and low-cost manufacturing method for glass transfer plates for chip 3D packaging. Using a single electric field-driven jet micro-nano 3D printing device, it is possible to realize the integrated manufacturing of double-sided conductive patterns on the glass transfer plates (printing of high-density redistribution wiring in the XY plane to achieve horizontal interconnection of chips) and metallized TGV (metallization of vertically interconnected glass through-holes between layers to achieve vertical interconnection of chips).

[0011] In addition, the present application adopts an array of multi-nozzles, which can realize efficient filling of multiple micropores in parallel and efficient printing of conductive patterns on the surfaces of multiple glass transfer plates.

[0012] In some embodiments of the present application, a method for rapidly and low-cost manufacturing a glass transfer plate for chip 3D packaging is provided, comprising the following steps:

[0013] Step 1: Pretreatment of glass plate;

[0014] Step 2: Micro-hole forming: using TGV hole forming technology, punch holes in the pre-treated glass plate according to the design requirements. After the punching is completed, the glass plate is cleaned and dried;

[0015] Step 3: Micropore 3D printing metal filling, specifically: (1) placing the punched glass plate on the fixture and clamping it; (2) placing the fixture on the workbench of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device; (3) using the CCD machine vision positioning module of the micro-nano 3D printing device, move the print head to the marked point of the glass plate; (4) evacuating the printing chamber; (5) starting from the bottom of the micropores according to the set printing process parameters, printing mode and printing path, continuously spray-deposit the filling metal material to achieve complete filling of the micropores without defects; (6) after completing the filling of the first or first group of micropores, repeat the operation of (5) and complete the printing of all micropores according to the pre-designed printing path; (7) the print head returns to the initial printing position, and the vacuum environment of the printing chamber is broken;

[0016] Step 4: Fill the conductive metal and place the glass plate filled with microporous metal in a vacuum sintering furnace, set the sintering time, temperature and sintering curve for sintering; evaluate the filling effect, if the filling effect meets the requirements, the glass plate through-hole filling is completed; if not, repeat steps 3 and 4 to fill the filled micropores twice or multiple times, and finally achieve the expected filling effect;

[0017] Step 5: Printing the conductive pattern on the surface of the glass transfer plate, specifically: (1) placing the filled glass plate on the fixture and clamping it; (2) placing the fixture on the workbench of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device; (3) using the CCD machine vision positioning module of the micro-nano 3D printing device, move the print head to the marking point of the glass plate; (4) evacuating the printing chamber and performing a vacuum treatment on the entire printing chamber; (5) according to the set printing process parameters and printing path, and determining the number of printing layers according to the electrical performance requirements of the conductive pattern, start printing from the set starting point; (6) until all the conductive patterns on the surface of the glass plate are printed; (7) the print head returns to the initial printing position, and the vacuum environment of the printing chamber is broken;

[0018] Step 6: The conductive pattern on the surface of the glass transfer plate is solidified;

[0019] Step 7: Manufacturing the conductive pattern on the bottom surface of the glass transfer board. Repeat steps 5 and 6 to complete the printing and curing of the required conductive pattern on the bottom surface of the glass transfer board to obtain a glass transfer board with integrated metallized TGV and double-sided conductive pattern.

[0020] In some embodiments of the present application, the micropore forming method in step 2 includes: laser etching, laser induced denaturation, sandblasting, mechanical drilling, ultrasonic drilling, wet etching, deep reactive ion etching, photosensitive glass, laser induced deep etching, focused discharge pore formation, etc.

[0021] In some embodiments of the present application, the micropore forming method in step 2 is laser induced denaturation.

[0022] In some embodiments of the present application, the metal ink of the printing material in step 3 includes but is not limited to the following materials: high solid content nanometal (gold, silver, copper) conductive paste, nanometal particle size 10nm-1μm, solid content 85-98wt.%.

[0023] In some embodiments of the present application, the printing process parameters of step 3 are: printing voltage 300-2000V; printing speed 0.1-20mm / s; printing air pressure 0.1-300kPa: printing nozzle size: 1-100μm.

[0024] In some embodiments of the present application, the printing mode of step 3 includes but is not limited to the following modes: spiral lifting printing mode; stacking lifting printing mode; Z-direction vertical lifting printing mode. For micropores below 20 μm, the Z-direction vertical lifting printing mode is adopted. For circular micropores or anisotropic pores with a size greater than 20 μm, a spiral or stacking lifting printing mode is adopted.

[0025] In some embodiments of the present application, the step 3 printing device includes a plurality of printing heads (array heads), and the nozzles of the printing heads are all at the same height (Z direction); the spacing between the nozzles is consistent with the spacing between the glass plates in the fixture.

[0026] In some embodiments of the present application, the fixture in step 3 can place a plurality of glass plates in a linear array, and the number of glass plates in the direction of the array nozzles should be an integer multiple of the number of nozzles.

[0027] In some embodiments of the present application, the printing path of step 3: when setting the printing path, the array nozzle should be taken as a unit, and the glass plate on the fixture should be divided into several unit printing areas. After filling each unit area of ​​the glass plate, move to the next unit printing area, and complete the filling of all the glass plates in sequence; the filling of the micropores is planned based on the corresponding relationship between a single nozzle and a single glass plate.

[0028] In some embodiments of the present application, the sintering temperature of step 4 is 50-300° C., and the sintering time is 20 minutes to 120 minutes.

[0029] In some embodiments of the present application, the metal ink printed in step 5 includes but is not limited to the following materials: high solid content nanometal (gold, silver, copper) conductive paste, nanometal particle size 10nm-1μm, solid content 85-98wt.%.

[0030] In some embodiments of the present application, the printing process parameters of step 5 are: printing voltage 100-5000V; printing speed 0.01-200mm / s; printing air pressure 0.01-800kPa: printing nozzle size: 1-1000μm.

[0031] In some embodiments of the present application, the conductive pattern printing path generation method of step 5 includes but is not limited to the following forms: drawing a printing pattern, using CAM software to convert the conductive pattern into a printer-adaptive code, and then importing the code into a 3D printer to print the conductive pattern.

[0032] In some embodiments of the present application, step 5 can control the amount of printed material to fill the uneven surface or depression of the metallized TGV at the connection between the surface conductive pattern of the substrate and the metallized TGV, and adjust the size and shape of the connection point between the surface conductive pattern and the metallized TGV, so that the connection between the surface conductive pattern and the metallized TGV is more reliable after curing.

[0033] In some embodiments of the present application, the number of printed layers of the conductive pattern in step 5 is 1-10 layers.

[0034] In some embodiments of the present application, the printing device in step 5 includes a plurality of printing heads (array heads), and the nozzles of the printing heads are all at the same height (Z direction); the spacing between the nozzles is consistent with the spacing between the glass plates in the fixture.

[0035] In some embodiments of the present application, the fixture in step 5 can place a plurality of glass plates in a linear array, and the number of glass plates in the direction of the array nozzles should be an integer multiple of the number of nozzles.

[0036] In some embodiments of the present application, the printing path of step 5: when setting the printing path, the array nozzle should be taken as a unit, and the glass plate on the fixture should be divided into a number of unit printing areas. After printing the conductive pattern on the surface of the glass plate in each unit area, move to the next unit printing area, and complete the printing of the conductive pattern on the surface of all glass plates in sequence; the path planning of surface conductive pattern printing is based on the correspondence between a single nozzle and a single glass plate.

[0037] In some embodiments of the present application, the sintering temperature of step 6 is 50-250° C., and the sintering time is 10 minutes to 120 minutes.

[0038] Compared with the prior art, the present invention has the following advantages:

[0039] (1) The manufacturing method provided in this application has unique advantages in the product development stage of the glass transfer plate: short production cycle; fewer processes; low production cost; high production flexibility (adaptable to the manufacture of conductive patterns of different densities, precisions, and patterns, and different hole shapes, hole diameters, and holes with different aspect ratios). In addition, the TGV filling and surface conductive pattern printing of the glass transfer plate are completely manufactured using additive manufacturing methods, which avoids material waste and environmental pollution, and is a green and environmentally friendly manufacturing method.

[0040] (2) The manufacturing method provided by the present application has the advantage of a short production cycle. Compared with the most commonly used copper electroplating method, the production cycle for TGV metallization is shorter. For micropores with larger pore sizes (>100 μm), the copper electroplating method usually requires a reduced copper deposition rate and the use of low current density and low temperature in order to achieve defect-free filling of the micropores. However, the electroplating time is greatly extended, which ultimately leads to a relatively low efficiency of electroplating hole filling. Compared with the use of dry etching processes such as physical etching, chemical etching, and physical and chemical etching, and wet etching processes such as dissolution etching and redox etching to manufacture surface circuits, the production cycle is also shorter.

[0041] (3) The manufacturing method provided by the present application has the advantage of fewer processes. The common electroplated copper TGV metallization process includes cumbersome process steps such as deposition of barrier layer and seed layer, electroplating-deposition of copper, annealing and CMP chemical mechanical polishing. Common surface circuit production such as photolithography preparation method includes surface coating, photolithography, electroplating, film stripping and other processes. The wet etching preparation method includes metal coating, preparation of mask with conductive pattern, etching, film stripping and other processes. The integrated manufacturing method of metallized TGV and surface conductive pattern provided by the present application only includes the processes of filling holes, curing and printing and curing of surface conductive pattern. There are few types of processes and the process flow is short.

[0042] (4) The manufacturing method provided by the present application has the advantage of low production cost. Only a fully functional electric field driven jet micro-nano 3D printer and a curing and sintering device are needed to complete the preparation of metallized TGV and surface conductive patterns. Few and expensive equipment are required, and the equipment investment is small; the additive manufacturing method requires fewer types of materials and less material consumption.

[0043] (5) The manufacturing method provided by the present application has high production flexibility and unique advantages in the product development stage. Conductive patterns of various line widths, densities, precisions, and patterns can be prepared according to different application requirements; it can adapt to the preparation of blind holes or through holes with different hole shapes (such as V-shaped, X-shaped, cylindrical), pore diameters (10-500μm), and different aspect ratios (1-50), and in particular, it can realize the metallization of blind holes and through holes with different hole shapes, pore diameters, and different aspect ratios on the same glass plate.

[0044] (6) The manufacturing method provided by the present application is green and environmentally friendly. The common electroplating copper TGV metallization method and the surface circuit manufacturing method using photolithography or etching are relatively polluting and generate a large amount of waste materials and waste liquids. The glass transfer plate metallization TGV and surface conductive pattern preparation of the present application completely adopt green additive manufacturing methods, avoiding many problems such as material waste and the generation of "three wastes" (wastewater, waste gas and solid waste).

[0045] (7) The manufacturing method provided in the present application has unique advantages in defect-free metal filling of ultra-large high aspect ratio glass through holes and defect-free metal filling of small aperture glass through holes; it can achieve high-efficiency, high-precision, high-density manufacturing of surface conductive patterns with strong adhesion to the glass transfer plate.

[0046] (8) The manufacturing method provided in the present application can control the amount of printed material to fill the uneven surface or depression of the metallized TGV at the connection between the surface conductive pattern of the substrate and the metallized TGV, and adjust the size and shape of the connection point between the surface conductive pattern and the metallized TGV, so that the connection between the surface conductive pattern and the metallized TGV after curing is more reliable.

[0047] (9) The manufacturing method provided by the present application can achieve high-precision glass through-hole filling and RDL printing. The error compensation of the print head is realized by relying on the X-direction vision module and the Y-direction vision module; the precise positioning of the glass plate and the fixture is realized by relying on the Z-direction vision positioning module installed at the print head.

[0048] (10) The manufacturing method provided in this application is a disruptive glass transition plate manufacturing technology. Using high-solid content micro-nano silver paste (or nano conductive silver paste) as the printing metal material, it has good conductivity after sintering, especially when using metal paste containing glass powder, the metal filled in the glass through hole and the surface conductive pattern can be integrated with the glass plate. The prepared glass transition plate has excellent impact resistance, stability and reliability, and can be used in extreme environments such as high vibration, high and low temperature. For example, in the fields of space, aerospace, hypersonic missiles, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The drawings in the specification, which constitute a part of the present application, are used to provide further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0050] Figure 1 Schematic diagram of the glass transfer plate results of the rapid and low-cost manufacturing method of the glass transfer plate for chip 3D packaging provided in this application.

[0051] Figure 2 A schematic flow chart of a method for rapid and low-cost manufacturing of a glass transfer plate for chip 3D packaging provided in this application.

[0052] Figure 3 Schematic diagram of the rapid and low-cost manufacturing process flow of the glass transfer plate provided for this application.

[0053] Figure 4 Schematic diagram of the glass plate clamp provided for this application.

[0054] Figure 5 Schematic diagram of the micro-nano 3D printing working device provided in this application based on a single flat electrode electric field driven multi-nozzle jet deposition.

[0055] Figure 6 A schematic diagram of the path for the nozzle provided in this application to perform metallization filling (printing mode) on a through-glass hole. DETAILED DESCRIPTION

[0056] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings and specific implementation methods. However, those skilled in the art will understand that the embodiments described below are part of the embodiments of the present application, rather than all of the embodiments, and are only used to illustrate the present application and should not be regarded as limiting the scope of the present application.

[0057] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0058] In the description of this application, it should be understood that the terms "upper", "lower", "left", "right", "front", "back", "inside", "outside", etc. indicate directions or positional relationships based on the directions or relative positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on this application. Unless otherwise specified, the above-mentioned directional description can be flexibly set in the process of actual application under the condition that the relative positional relationship shown in the accompanying drawings is met.

[0059] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0060] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "connected" should be understood in a broad sense, such as fixed connection, detachable connection, and integral connection. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components or the electrical connection between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] In the present application, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, article or device including the element.

[0062] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0063] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. If the specific conditions are not specified in the embodiments, they are carried out according to conventional conditions or conditions recommended by the manufacturer. If the manufacturer of the reagents or instruments is not specified, they are all conventional products that can be purchased commercially.

[0064] A rapid and low-cost manufacturing method for glass transfer plates for chip 3D packaging based on electric field driven jet micro-nano 3D printing. Figure 2 As shown:

[0065] Step 1: Glass plate pretreatment.

[0066] Step 2: Micropore forming.

[0067] Step 3: Metal filling of micropores by 3D printing. (1) Place the punched glass plates one by one on the fixture (the maximum number of glass plates placed is an integer multiple of the number of nozzles) and clamp them; (2) Place the fixture on the workbench of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing device to move the print nozzle to the marked point of the glass plate; (4) Vacuum the printing chamber. Perform vacuum treatment on the entire printing chamber. Reach the set vacuum degree to ensure that there is no residual air in the micropores; (5) According to the set printing process parameters (printing voltage, back pressure, printing speed, etc.), printing mode and printing path, start from the bottom of the micropores, continuously spray and deposit the filling metal material to achieve complete filling of the micropores without defects; (6) After completing the filling of the first (first group) micropores, repeat the operation of (5) and complete the printing of all micropores according to the pre-designed printing path; (7) The print nozzle returns to the initial printing position and the vacuum environment of the printing chamber is broken.

[0068] Step 4: Fill metal for conductivity.

[0069] Step 5: Printing the conductive pattern on the surface of the glass transfer plate. (1) Place the filled glass plates one by one on the fixture (the maximum number of glass plates placed is an integer multiple of the number of nozzles) and clamp them; (2) Place the fixture on the workbench of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing device to move the print nozzle to the marked point of the glass plate; (4) Vacuum the printing chamber. Perform a vacuum treatment on the entire printing chamber; (5) According to the set printing process parameters (printing voltage, back pressure, printing speed, etc.) and printing path, and according to the electrical performance requirements of the conductive pattern, determine the number of printing layers (repeat the number of times the same printing path is used), and start printing from the set starting point; (6) Until the conductive pattern printing on all glass plates is completed; (7) The print nozzle returns to the initial printing position, and the vacuum environment in the printing chamber is broken.

[0070] Step 6: The conductive pattern on the surface of the glass transfer plate is solidified.

[0071] Step 7: Manufacturing the bottom conductive pattern of the glass transfer board. A glass transfer board integrating metallized TGV and double-sided conductive patterns is obtained.

[0072] Example 1

[0073] The size of the glass plate is 35×35×0.25mm, the diameter of the microholes to be filled is 50μm and 100μm, and the depth of the through hole is 250μm (depth-to-width ratio 5:1, 2.5:1). The 50μm through holes are distributed in a 9×9 array with a spacing of 300μm on the left side of the glass plate, and the 100μm through holes are distributed in a 6×6 array with a spacing of 300μm on the right side of the glass plate.

[0074] Step 1: Pre-treat the glass plate by washing the glass plate with acetone, alcohol and deionized water in ultrasonic wave for 5 minutes, and heat and dry the washed glass plate.

[0075] Step 2: Micropore forming: Using laser-induced degeneration pore forming technology, the pre-treated glass plate is punched according to the design requirements. After the punching is completed, the glass plate is cleaned and dried.

[0076] Steps 3-7 are as follows Figure 3 shown.

[0077] Step 3: Micropore 3D printing metal filling. (1) Place the punched glass plates one by one on the fixture and clamp them firmly. Figure 4 (2) placing the fixture on the workbench of a multi-nozzle single-plate electrode electric field driven jet deposition micro-nano 3D printing device, as shown in FIG. Figure 5 As shown; (3) Using the CCD machine vision positioning module of the micro-nano 3D printing equipment, move the print head to the marked point of the glass plate; (4) Evacuate the printing chamber. Evacuate the entire printing chamber. Set the vacuum degree to -20kPa to ensure that there is no residual air in the micropores; (5) Set the printing process parameters (printing voltage 1600V, back pressure 100kPa, printing speed 0.1mm / s), and the filling path adopts a spiral lifting method, as shown Figure 6 As shown in (b), the pitch is 30 μm, the spiral diameter is 15 μm, and the nozzle diameter is 20 μm; starting from the bottom of the micropores, the filling metal material is continuously sprayed and deposited, and the micropores of a single glass plate are completely filled without defects in one filling; (6) After the first glass plate (the first unit area) is filled, the operation of (5) is repeated to complete the printing and filling of the micropores of all unit areas of the glass plate according to the pre-designed printing path; (7) The print head returns to the initial printing position; and the vacuum environment of the printing forming chamber is broken.

[0078] Step 4: Filling metal for conductivity. The metal material filled in this embodiment is low-temperature sintering type silver paste. The glass plate after the microporous metal filling is placed in a vacuum sintering furnace and the heating condition is set to 180° C. for 30 minutes to complete the conductive treatment of the filled metal.

[0079] Step 5: Printing the conductive pattern on the surface of the glass transfer plate. (1) Place the filled glass plates one by one on the fixture (the maximum number of glass plates placed is an integer multiple of the number of nozzles) and clamp them; (2) Place the fixture on the workbench of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing device to move the print head to the marked point of the glass plate; (4) Perform vacuum treatment on the entire printing chamber; (5) According to the set printing process parameters (printing voltage 1800V, back pressure 300kPa, printing speed 0.3mm / s) and printing path, set the number of conductive pattern printing layers to 2 layers, and start printing from the set starting point; (6) Until the conductive pattern printing on all glass plates is completed; (6) The print head returns to the initial printing position, and the vacuum environment in the printing chamber is broken.

[0080] Step 6: Curing of the conductive pattern on the surface of the glass transfer plate. The glass plate with the conductive pattern printed on the surface is placed in a vacuum sintering furnace, and the sintering time is set to 50 minutes and the temperature is set to 150°C for sintering.

[0081] Step 7: Fabrication of the conductive pattern on the bottom surface of the glass transfer board. Repeat steps 5 and 6 to complete the printing and curing of the conductive pattern required on the bottom surface of the glass transfer board. The metallized TGV and double-sided conductive pattern integrated glass transfer board is obtained. Figure 1 shown.

[0082] Example 2

[0083] The size of the glass plate is 20×20×0.2 mm, the diameter of the microhole to be filled is 10 μm, and the depth of the through hole is 200 μm (depth-to-width ratio 20:1). Multiple through holes are arrayed on the surface of the glass plate, and one unit is evenly distributed on the glass plate at 4×4.

[0084] Step 1: Pre-treat the glass plate by washing the glass plate with acetone, alcohol and deionized water in ultrasonic wave for 10 minutes, and heat and dry the washed glass plate.

[0085] Step 2: Micropore forming: Using laser-induced degeneration pore forming technology, the pre-treated glass plate is punched according to the design requirements. After the punching is completed, the glass plate is cleaned and dried.

[0086] Steps 3-7 are as follows Figure 3 Shown

[0087] Step 3: Micropore 3D printing metal filling. (1) Place the punched glass plates one by one on the fixture and clamp them firmly. Figure 4 (2) placing the fixture on the workbench of a multi-nozzle single-plate electrode electric field driven jet deposition micro-nano 3D printing device, as shown in FIG. Figure 5As shown; (3) Using the CCD machine vision positioning module of the micro-nano 3D printing equipment, move the print head to the mark point of the glass plate; (4) Evacuate the printing chamber. Perform vacuum treatment on the entire printing chamber. Set the vacuum degree to -20kPa to ensure that there is no residual air in the micropores; (5) Set the printing process parameters (printing voltage 1800V, back pressure 50kPa, printing speed 0.08mm / s), and the filling path adopts a vertical lifting method, as shown Figure 6 As shown in (a), the nozzle diameter is 5 μm; starting from the bottom of the micropores, the filling metal material is continuously sprayed and deposited, and the micropores of a single glass plate are completely filled without defects in one filling; (6) After the first glass plate (the first unit area) is filled, the operation of (5) is repeated to complete the printing and filling of the micropores of all unit areas of the glass plate according to the pre-designed printing path; (7) The print head returns to the initial printing position; and the vacuum environment of the printing forming chamber is broken.

[0088] Step 4: Conductive filling metal: The metal material used in this embodiment is low-temperature sintering silver paste. The glass plate filled with microporous metal is placed in a vacuum sintering furnace and heated at 150° C. for 60 minutes to complete the conductive filling metal treatment.

[0089] Step 5: Printing the conductive pattern on the surface of the glass transfer plate. (1) Place the filled glass plates one by one on the fixture (the maximum number of glass plates placed is an integer multiple of the number of nozzles) and clamp them; (2) Place the fixture on the workbench of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing device to move the print head to the marked point of the glass plate; (4) Perform vacuum treatment on the entire printing chamber; (5) According to the set printing process parameters (printing voltage 2000V, back pressure 400kPa, printing speed 0.2mm / s) and printing path, set the number of conductive pattern printing layers to 1, and start printing from the set starting point; (6) Until the conductive pattern printing on all glass plates is completed; (6) The print head returns to the initial printing position, and the vacuum environment in the printing chamber is broken.

[0090] Step 6: Curing of the conductive pattern on the surface of the glass transfer plate. The glass plate with the conductive pattern printed on the surface is placed in a vacuum sintering furnace, and the sintering time is set to 40 minutes and the temperature is set to 170°C for sintering.

[0091] Step 7: Fabrication of the conductive pattern on the bottom surface of the glass transfer board. Repeat steps 5 and 6 to complete the printing and curing of the conductive pattern required on the bottom surface of the glass transfer board. The metallized TGV and double-sided conductive pattern integrated glass transfer board is obtained. Figure 1 shown.

[0092] Example 3

[0093] Based on the above embodiments, a micro-nano 3D printing device is proposed, such as Figure 5 As shown, it includes: an XYZ three-axis motion module 1, an air pressure module 2, a multi-nozzle module 3, a high-voltage power supply 4, a signal generator 5, a frame 6, a printing platform 7, and a nozzle error compensation module 8.

[0094] The XYZ three-axis motion module 1 includes an X-axis motion module 101, a Z-axis motion module 102, and a Y-axis motion module 103. The Z-axis motion module 102 of the XYZ three-axis motion module 1 is connected to the X-axis motion module 101 of the XYZ three-axis motion module, and the X-axis motion module 101 is connected to the Y-axis motion module 103 of the XYZ three-axis motion module; the Y-axis motion module 103 of the XYZ three-axis motion module is fixed on the frame 6.

[0095] The multi-nozzle module 3 includes a CCD machine vision positioning module (Z-direction vision positioning module) 301, a first connecting frame 302, a second connecting frame 303, a back pressure connection unit 304, a laser rangefinder 305, a print needle 306, and a barrel 307. The multi-nozzle module 3 includes 25 (5×5 array distribution) print nozzle modules, and the print nozzle module includes a print needle 306 and a barrel 307. The print needle 306 is placed at the bottom of the nozzle and is perpendicular to the glass plate. The upper part of the barrel 307 is connected to the back pressure connection unit 304. The back pressure connection unit 304 is connected to the air pressure module 2. The CCD machine vision positioning module 301 is fixed on the first connecting frame 302. The first connecting frame 302 and the laser rangefinder 305 are connected to the Z-direction motion module 102 of the XYZ three-axis motion module. The multi-nozzle module is fixed to the Z-direction motion module 102 of the XYZ three-axis motion module 1 by the second connecting frame 303.

[0096] The printing platform 7 includes a base 701, a flat electrode 702, and a fixture 703. The flat electrode 702 is placed and fixed on the base 701. The positive electrode (or negative electrode) of the high-voltage power supply 4 connected to the signal generator 5 is connected to the flat electrode 702. The fixture 703 (fixed and clamped on the fixture after the micropores of the glass plate are formed) is in direct contact with the flat electrode 702 and is placed on the flat electrode 702.

[0097] The nozzle error compensation module 8 includes a Y motion direction vision module 801, a connecting frame 802, and an X motion direction vision module 803. The Y motion direction vision module 801 and the X motion direction vision module 803 are fixed on two connecting frames 802, and the connecting frames 802 are fixed on the frame 6.

[0098] The XYZ three-axis motion module 1 adopts a gantry structure. The self-weight X-axis motion module 101 includes precision motion platforms such as a linear motor module and a servo motor module. The stroke of the X-axis motion module 101 is 200mm, the repeatability accuracy is ±0.5μm, the positioning accuracy is ±1μm, and the maximum acceleration is 1g. The Y-axis motion module 103 includes precision motion platforms such as a linear motor module and a servo motor module. The stroke of the Y-axis motion module 103 is 200mm, the repeatability accuracy is ±0.5μm, the positioning accuracy is ±1μm, and the maximum acceleration is 1g. The Z-axis motion module 102 uses a servo motor module. The stroke of the Z-axis motion module 102 is 50mm, the repeatability accuracy is ±0.5μm, and the positioning accuracy is ±3μm.

[0099] The pressure range of the air pressure module 2 is 0 bar-4 bar, and the pressure regulation accuracy of the back pressure control module is greater than or equal to 1 kPa.

[0100] The printing needle 306 is a glass nozzle with an inner diameter ranging from 0.1 to 1000 μm.

[0101] The high voltage power supply 4 has the following functions: outputting DC high voltage; outputting AC high voltage; outputting pulse high voltage, and being able to set bias. The bias voltage range is 0-2kV and is continuously adjustable, the DC high voltage is 0-5kV, the output pulse DC voltage is 0-±4kV and is continuously adjustable, the output pulse frequency is 0Hz-3000Hz and is continuously adjustable, and the AC high voltage is 0-±4kV.

[0102] The flat electrode 702 is a copper electrode, and the thickness of the flat electrode 702 is in the range of 15 mm. The flatness of the flat electrode 702 is of tolerance grade 5 accuracy.

[0103] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for rapidly and cheaply manufacturing a glass transfer plate for chip 3D packaging, characterized in that: The following steps are involved: Step 1: Pretreatment of glass plate; Step 2: Micro-hole forming: using TGV hole forming technology, punch holes in the pre-treated glass plate according to the design requirements. After the punching is completed, the glass plate is cleaned and dried; Step 3: Micropore 3D printing metal filling, specifically: (1) placing the punched glass plate on the fixture and clamping it; (2) placing the fixture on the workbench of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device; (3) using the CCD machine vision positioning module of the micro-nano 3D printing device, move the printing nozzle to the marking point of the glass plate; (4) evacuate the printing forming chamber; (5) starting from the bottom of the micropores, continuously jet deposit the filling metal material according to the set printing process parameters, printing mode and printing path to achieve complete filling of the micropores without defects; (6) After the first or first group of micropores are filled, the operation of (5) is repeated to complete the printing of all micropores according to the pre-designed printing path; (7) the print head returns to the initial printing position, and the vacuum environment of the printing forming chamber is broken; Step 4: Fill the conductive metal and place the glass plate filled with microporous metal in a vacuum sintering furnace, set the sintering time, temperature and sintering curve for sintering; evaluate the filling effect, if the filling effect meets the requirements, the glass plate through-hole filling is completed; if not, repeat steps 3 and 4 to fill the filled micropores twice or multiple times, and finally achieve the expected filling effect; Step 5: Printing the conductive pattern on the surface of the glass transfer plate, specifically: (1) placing the filled glass plate on the fixture and clamping it; (2) placing the fixture on the workbench of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device; (3) using the CCD machine vision positioning module of the micro-nano 3D printing device, move the print head to the marking point of the glass plate; (4) evacuating the printing chamber and performing a vacuum treatment on the entire printing chamber; (5) determining the number of printing layers according to the set printing process parameters and printing path and the electrical performance requirements of the conductive pattern, and starting printing from the set starting point; (6) until all the conductive patterns on the glass plate surface are printed; (7) the print head returns to the initial printing position, and the vacuum environment in the printing chamber is broken; Step 6: The conductive pattern on the surface of the glass transfer plate is solidified; Step 7: Manufacturing the conductive pattern on the bottom surface of the glass transfer board. Repeat steps 5 and 6 to complete the printing and curing of the required conductive pattern on the bottom surface of the glass transfer board to obtain a glass transfer board with integrated metallized TGV and double-sided conductive pattern.

2. A method for rapidly and cheaply manufacturing a glass transfer plate for chip 3D packaging according to claim 1, characterized in that: The micropore forming method in step 2 includes: laser etching, laser induced denaturation, sandblasting, mechanical drilling, ultrasonic drilling, wet etching, deep reactive ion etching, photosensitive glass, laser induced deep etching, and focused discharge pore forming.

3. The method for rapidly and low-cost manufacturing of a glass transfer plate for chip 3D packaging according to claim 1, characterized in that: The printing material of step 3 includes: nano-metal conductive paste with high solid content, nano-metal particle size of 10nm-1μm, solid content of 85-98wt.%; the printing process parameters of step 3: printing voltage 300-2000V; printing speed 0.1-20mm / s; printing pressure 0.1-300kPa: printing nozzle size: 1-100μm.

4. The method for rapidly and low-cost manufacturing of a glass transfer plate for chip 3D packaging according to claim 1, characterized in that: The printing modes of step 3 include: spiral lifting printing mode; stacking lifting printing mode; Z-direction vertical lifting printing mode; for micropores below 20μm, the Z-direction vertical lifting printing mode is adopted; for circular micropores or anisotropic pores with a size greater than 20μm, a spiral or stacking lifting printing mode is adopted.

5. The method for rapidly and low-cost manufacturing of a glass transfer plate for chip 3D packaging according to claim 1, characterized in that: The printing device in step 3 includes several printing heads, and the nozzles of the printing heads are all at the same height; the spacing between the nozzles is consistent with the spacing between the glass plates in the fixture; the fixture in step 3 can place several glass plates in a linear array, and the number of glass plates in the direction of the array nozzles should be an integer multiple of the number of nozzles; the printing path in step 3: when setting the printing path, the array nozzles should be taken as a unit, and the glass plates on the fixture should be divided into several unit printing areas. After filling each unit area of ​​glass plate, move to the next unit printing area, and complete the filling of all glass plates in sequence; the filling of micropores is planned based on the corresponding relationship between a single nozzle and a single glass plate.

6. The method for rapidly and low-cost manufacturing of a glass transfer plate for chip 3D packaging according to claim 1, characterized in that: The sintering temperature of step 4 is 50-300° C., and the sintering time is 20 minutes to 120 minutes.

7. A method for rapidly and cheaply manufacturing a glass transfer plate for chip 3D packaging according to claim 1, characterized in that: The printing material of step 5 includes: nano-metal conductive paste with high solid content, nano-metal particle size of 10nm-1μm, solid content of 85-98wt.%; the printing process parameters of step 5: printing voltage 100-5000V; printing speed 0.01-200mm / s; printing air pressure 0.01-800kPa: printing nozzle size: 1-1000μm; the conductive pattern printing path generation method of step 5 includes but is not limited to the following forms: drawing a printing pattern, using CAM software to convert the conductive pattern into a printer-adaptive code, and then importing the code into a 3D printer to print the conductive pattern.

8. The method for rapidly and low-cost manufacturing of a glass transfer plate for chip 3D packaging according to claim 1, characterized in that: In step 5, the amount of printed material can be controlled to fill the uneven surface or depression of the metallized TGV at the connection between the surface conductive pattern of the glass plate and the metallized TGV, and the size and shape of the connection point between the surface conductive pattern and the metallized TGV can be adjusted, so that the connection between the surface conductive pattern and the metallized TGV after curing is more reliable.

9. The method for rapidly and low-cost manufacturing of a glass transfer plate for chip 3D packaging according to claim 1, characterized in that: The number of printed layers of the conductive pattern in step 5 is 1-10 layers; the printing device in step 5 includes several printing nozzles, and the nozzles of the printing nozzles are all at the same height; the spacing between the nozzles is consistent with the spacing between the glass plates in the fixture; the fixture in step 5 can place several glass plates in a linear array, and the number of glass plates in the direction of the array nozzles should be an integer multiple of the number of nozzles; the printing path in step 5: when setting the printing path, the array nozzles should be taken as a unit, and the glass plate on the fixture should be divided into several unit printing areas. After printing the conductive pattern on the surface of each unit area of ​​the glass plate, move to the next unit printing area, and complete the printing of the conductive pattern on the surface of all glass plates in turn; the path planning of surface conductive pattern printing is based on the correspondence between a single nozzle and a single glass plate.

10. The method for rapidly and low-cost manufacturing of a glass transfer plate for chip 3D packaging according to claim 1, characterized in that: The sintering temperature of step 6 is 50-250° C., and the sintering time is 10 minutes to 120 minutes.

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