Semiconductor assembly equipment

Abstract

The invention relates to the technical field of automation equipment, in particular to semiconductor assembly equipment which comprises a rack, a carrier, a conveying track, a wafer fixing mechanism, a wafer conveying mechanism, a first clamping assembly, a tape winding feeding mechanism and a second clamping assembly, and the conveying track, the wafer fixing mechanism, the wafer conveying mechanism, the first clamping assembly, the tape winding feeding mechanism and the second clamping assembly are all arranged on the rack. The wafer fixing mechanism adjusts the angle of a wafer, the wafer conveying mechanism conveys the wafer to the wafer fixing mechanism, the first clamping assembly grabs a chip on the wafer and conveys the chip to a circuit substrate on the carrier, and the tape feeding mechanism is used for conveying components on a tape. The second clamping assembly is used for grabbing the components on the tape feeding mechanism and conveying the components to the circuit substrate on the carrier. Through the cooperative work of the mechanisms, the surface mounting process of the semiconductor circuit chip and the components of the semiconductor circuit chip is jointly completed, the production efficiency is improved, and the surface mounting precision and quality are also ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, in particular to semiconductor assembly equipment. Background Art

[0002] At present, components are mounted by specific equipment, including automatic die bonding machines for chips and SMT equipment for resistors and capacitors, but the equipment efficiency is low and UPH is redundant. As semiconductor circuits tend to be highly integrated and miniaturized, heat dissipation requirements increase, and mounting accuracy directly affects the heat dissipation effect. Therefore, higher-precision, low-cost mounting equipment is needed to meet market demand.

[0003] In the current semiconductor manufacturing process, the loading and unloading process of wafers often relies on manual operation. This link is particularly cumbersome and complicated for different types of chip mounting operations. Since each chip may require different processing methods and equipment settings, manual loading and unloading not only increases the difficulty of operation, but also affects the accuracy of wafer placement, and efficiency will be significantly affected when the task is frequently changed. The instability of manual operation also increases the risk of errors in the production process, thereby affecting the quality of the wafer and the continuity of production. Summary of the invention

[0004] The technical problem to be solved by the present invention is to solve one or more technical problems existing in the prior art and at least provide a beneficial choice or create conditions.

[0005] The solution of the present invention to solve its technical problem is: a semiconductor assembly equipment, including a frame, a carrier and a conveying track, a wafer fixing mechanism, a wafer transport mechanism, a first clamping component, a tape loading mechanism and a second clamping component all arranged on the frame, the carrier is used to carry a circuit substrate, the carrier moves through the conveying track, the wafer fixing mechanism is used to adjust the angle of the wafer, the wafer transport mechanism is used to transport the wafer to the wafer fixing mechanism, the first clamping component is arranged above the wafer fixing mechanism, the first clamping component is used to grab the chip on the wafer and transport it to the circuit substrate on the carrier, the tape loading mechanism is used to transport components on the reel, the second clamping component is arranged above the tape loading mechanism, and the second clamping component is used to grab the components on the tape loading mechanism and transport them to the circuit substrate on the carrier.

[0006] The beneficial effects of the present invention are as follows: the carrier carrying the circuit substrate is transported to the bottom of the first clamping assembly through the conveying track, the wafer transport mechanism grabs the wafer and places it on the wafer fixing mechanism, the wafer fixing mechanism clamps the wafer and rotates it to the optimal position, the first clamping assembly absorbs the chip of the wafer on the wafer fixing mechanism and places it on the circuit substrate, and the above is the mounting process of the semiconductor circuit chip; after the chip is mounted, the carrier will transport the circuit substrate with the chip mounted to the bottom of the second clamping assembly along the conveying track, and the second clamping assembly grabs the components on the tape loading mechanism and places them on the circuit substrate, and the above is the mounting process of semiconductor circuit components; after completing the above steps, the carrier will transport the product to the next process through the conveying track. The coordinated work of this series of automated equipment not only improves production efficiency, but also ensures the accuracy and quality of mounting, providing a strong guarantee for efficient production.

[0007] As a further improvement of the above technical solution, the semiconductor assembly equipment also includes a first loading device and a second loading device, the first loading device and the second loading device are fixed on the frame, the first loading device and the second loading device are used to place wafers, the wafer transport mechanism is used to transport the wafers on the first loading device to the wafer fixing mechanism, and the wafer transport mechanism is used to transport the wafers on the second loading device to the wafer fixing mechanism.

[0008] As a further improved beneficial effect of the above technical solution, by using the first loading device and the second loading device, multiple wafers can be processed simultaneously, thereby speeding up the wafer mounting process and improving the overall production efficiency. The design of the wafer placement groove can ensure the accurate position of the wafer during the loading process. The first loading device and the second loading device are fixed in the same installation space, which effectively utilizes limited space resources and saves the space occupied by the equipment.

[0009] As a further improvement of the above technical solution, the semiconductor assembly equipment also includes a wafer unloading mechanism, which includes a wafer unloading device and a unloading guide rail, the unloading guide rail is fixed on the frame, the wafer unloading device is slidably set on the unloading guide rail, the wafer unloading device is used to place used wafers, and the wafer transport mechanism is used to transport the used wafers on the wafer fixing mechanism to the wafer unloading device.

[0010] As a further improvement of the above technical solution, when all the single chips on the wafer are mounted, the wafer transportation mechanism will grab the used wafers from the wafer fixing device and transfer them to the wafer unloading device. The unloading device can place no less than 20 wafers at the same time, which can reduce the frequency of manual unloading. When a certain number of wafers are collected, they will be taken out for recycling, reducing the number of shutdowns for unloading and improving production efficiency.

[0011] As a further improvement of the above technical solution, the wafer transport mechanism includes a first guide rail fixed on the frame, a first moving device, a second guide rail, a second moving device, a robot arm rotating device, a third guide rail, a third moving device, a robot head telescopic device and a robot head clamping device, the first guide rail is horizontally fixed on the frame, the first moving device is slidably set on the first guide rail, the second guide rail is fixed on the first moving device, the second guide rail is vertically set to the first guide rail, the second moving device is slidably set on the second guide rail, the robot arm rotating device is fixed on the second moving device, the third guide rail is vertically fixed on the robot arm rotating device, the third moving device is slidably set on the third guide rail, the robot head telescopic device is fixed on the third moving device, the robot head clamping device is fixedly connected to the telescopic part of the robot head telescopic device, and the robot head clamping device is used to clamp wafers.

[0012] As a further improved beneficial effect of the above technical solution, the robot head retractable device and the robot head clamping device cooperate to move to clamp and fix the wafer, the first moving device moves in the X-axis direction on the first guide rail, the second moving device moves in the Y-axis direction on the second guide rail, the third moving device moves in the Z-axis direction on the third guide rail, and the robot arm rotating device is used to rotate the third guide rail to realize the transportation of wafers in any direction in space.

[0013] As a further improvement of the above technical solution, the wafer fixing mechanism includes a wafer fixing base, a vacuum suction cup installed on the wafer fixing base, a negative pressure device and a wafer rotation device, the wafer rotation device is fixed on the partition, the wafer fixing base is fixedly connected to the rotating part of the wafer rotation device, the wafer rotation device is used to drive the wafer fixing base to rotate, the negative pressure device is fixed on the partition, and the vacuum suction cup is connected to the negative pressure device for adsorbing the wafer.

[0014] As a further improved beneficial effect of the above technical solution, in order to ensure the precise placement and positioning of the wafer, a vacuum suction cup technology is used to adsorb and fix the wafer. The vacuum suction cup firmly adsorbs the surface of the wafer through the negative pressure environment formed inside, ensuring that it will not move or shift during subsequent processing. This adsorption method not only provides sufficient adsorption force, but also relatively less damage to the surface of the wafer due to the small contact area. The wafer rotation device is responsible for driving the wafer fixing base to rotate, so that the wafer adsorbed on the vacuum suction cup can rotate at a predetermined angle. By precisely controlling the angle and speed of rotation, the wafer can be accurately positioned, thereby meeting the strict requirements for wafer position accuracy in semiconductor manufacturing.

[0015] As a further improvement of the above technical solution, the wafer rotation device includes a fixed shaft, a ratchet, a driving pawl, a non-return pawl, a cylinder and a movable rod. The fixed shaft is arranged on the partition, the ratchet sleeve is arranged on the fixed shaft, the ratchet sleeve is rotatably connected to the fixed shaft, the wafer fixing base is fixed on the ratchet, a slide groove is provided on the movable rod, the cylinder is slidably connected to the slide groove through bolts, the driving pawl is arranged corresponding to the ratchet, the driving pawl is fixedly connected to the movable rod, the non-return pawl is arranged corresponding to the ratchet, and the non-return pawl is fixed on the partition.

[0016] As a further improved beneficial effect of the above technical solution, the ratchet is engaged with the driving pawl and the non-return pawl, and intermittent rotation is achieved through the movement of the movable rod, ensuring that the wafer is accurately positioned and adjusted during the loading process.

[0017] As a further improvement of the above technical solution, the first clamping assembly includes a fourth guide rail fixed on the frame, a first robotic arm slidably set on the fourth guide rail, a fifth guide rail fixed under the first robotic arm, a second robotic arm slidably set under the fifth guide rail, a first telescopic device set on the second robotic arm and a first suction nozzle set on the first telescopic device, the fourth guide rail is arranged vertically to the fifth guide rail, and the first suction nozzle is used to suck the chips on the wafer surface on the wafer fixing mechanism.

[0018] As a further improved beneficial effect of the above technical solution, the first robot arm moves in the X-axis direction on the fourth guide rail, the third robot arm moves in the Y-axis direction on the fifth guide rail, the first telescopic device drives the first suction nozzle to move in the Z-axis direction, and the first suction nozzle sucks the chip on the surface of the wafer on the wafer fixing mechanism and transfers it to the circuit substrate; the wafer chip is quickly and accurately positioned to the specified position on the circuit substrate to achieve higher production efficiency. In addition, this design is also extremely flexible and scalable. As production needs change, the movement trajectory and speed of the robot arm can be adjusted, or different types of gripping tools can be replaced to adapt to chips of different sizes and shapes.

[0019] As a further improvement of the above technical solution, the second clamping assembly includes a sixth guide rail fixed on the frame, a third robotic arm slidably set on the sixth guide rail, a seventh guide rail fixed under the third robotic arm, a fourth robotic arm slidably set under the seventh guide rail, a second telescopic device set on the fourth robotic arm and a second suction nozzle set on the second telescopic device, the sixth guide rail is arranged vertically to the seventh guide rail, and the second suction nozzle is used to suck components on the tape loading mechanism.

[0020] As a further improved beneficial effect of the above technical solution, the third robot arm moves in the X-axis direction on the sixth guide rail, the fourth robot arm moves in the Y-axis direction on the seventh guide rail, the second telescopic device drives the second suction nozzle to move in the Z-axis direction, and the second suction nozzle absorbs the components on the tape feeding mechanism and transfers them to the circuit substrate; the components are quickly and accurately positioned at the designated positions on the circuit substrate to achieve higher production efficiency. In addition, this design is also highly flexible and scalable. As production needs change, the movement trajectory and speed of the robot arm can be adjusted, or different types of gripping tools can be replaced to adapt to components of different sizes and shapes.

[0021] As a further improvement of the above technical solution, the output end of the fourth guide rail is connected to the input end of the sixth guide rail.

[0022] As a further improvement of the above technical solution, valuable production space resources are effectively saved, which is particularly important for the semiconductor assembly industry with high-density layout in limited space. In addition, the design flexibility of the system allows more robotic arms and rails to be added in the future according to production needs. Such scalability provides the possibility for further upgrading of equipment and improving the level of automation, thereby further improving production capacity and automation level, and meeting the growing technical needs of the semiconductor industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural diagram of the wafer loading system of the automation equipment;

[0024] Figure 2 This is the front view of the wafer loading system of the automated equipment;

[0025] Figure 3 This is a side view of the wafer loading system of the automated equipment;

[0026] Figure 4 This is a top view of the wafer loading system of the automated equipment;

[0027] Figure 5 It is a first structural schematic diagram of the wafer fixing mechanism.

[0028] Figure 6 2 is a second structural schematic diagram of the wafer fixing mechanism.

[0029] In the accompanying drawings: 1-frame, 2-transport rail, 3-carrier, 4-wafer fixing mechanism, 5-wafer transport mechanism, 6-first clamping assembly, 7-tape loading mechanism, 8-second clamping assembly, 9-first loading device, 10-second loading device, 11-wafer unloading mechanism, 12-wafer unloading device, 13-unloading guide rail, 14-first guide rail, 15-first moving device, 16-second guide rail, 17-second moving device, 18-mechanical arm rotating device, 19-third guide rail, 20-third moving device, 21-mechanical head telescopic device, 22 - Mechanical head clamping device, 23- Wafer fixing base, 24- Vacuum suction cup, 25- Negative pressure device, 26- Wafer rotation device, 27- Fixed shaft, 28- Ratchet, 29- Driving pawl, 30- Check pawl, 31- Cylinder, 32- Movable rod, 33- Fourth guide rail, 34- First mechanical arm, 35- Fifth guide rail, 36- Second mechanical arm, 37- First telescopic device, 38- First suction nozzle, 39- Sixth guide rail, 40- Third mechanical arm, 41- Seventh guide rail, 42- Fourth mechanical arm, 43- Second telescopic device, 44- Second suction nozzle. DETAILED DESCRIPTION

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the above briefly describes the drawings required for use in the description of the embodiments. Obviously, the drawings described are only part of the embodiments of the present invention, not all of the embodiments, and those skilled in the art can also obtain other design solutions and drawings based on these drawings without creative work.

[0031] The following will clearly and completely describe the concept, specific structure and technical effects of the present invention in combination with the embodiments and drawings, so as to fully understand the purpose, characteristics and effects of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, other embodiments obtained by technicians in this field without creative work are all within the scope of protection of the present invention. In addition, all the connection / connection relationships mentioned in the text do not refer to the direct connection of components, but refer to the formation of a better connection structure by adding or reducing connection accessories according to the specific implementation situation. The various technical features in the present invention can be combined interchangeably without conflicting with each other.

[0032] At present, components are mounted by specific equipment, including automatic die bonding machines for chips and SMT equipment for resistors and capacitors, but the equipment efficiency is low and UPH is redundant. As semiconductor circuits tend to be highly integrated and miniaturized, heat dissipation requirements increase, and mounting accuracy directly affects the heat dissipation effect. Therefore, higher-precision, low-cost mounting equipment is needed to meet market demand.

[0033] In the current semiconductor manufacturing process, the loading and unloading process of wafers often relies on manual operation. This link is particularly cumbersome and complicated for different types of chip mounting operations. Since each chip may require different processing methods and equipment settings, manual loading and unloading not only increases the difficulty of operation, but also affects the accuracy of wafer placement, and efficiency will be significantly affected when the task is frequently changed. The instability of manual operation also increases the risk of errors in the production process, thereby affecting the quality of the wafer and the continuity of production.

[0034] To this end, a semiconductor assembly equipment, referring to Figure 1 to Figure 6 , including: a semiconductor assembly equipment, including a frame 1, a carrier 3 and a conveying track 2, a wafer fixing mechanism 4, a wafer transport mechanism 5, a first clamping component 6, a tape loading mechanism 7 and a second clamping component 8 all arranged on the frame 1, the carrier 3 is used to carry a circuit substrate, the carrier 3 moves through the conveying track 2, the wafer fixing mechanism 4 is used to adjust the angle of the wafer, the wafer transport mechanism 5 is used to transport the wafer to the wafer fixing mechanism 4, the first clamping component 6 is arranged above the wafer fixing mechanism 4, the first clamping component 6 is used to grab the chip on the wafer and transport it to the circuit substrate on the carrier 3, the tape loading mechanism 7 is used to transport components on the reel, the second clamping component 8 is arranged above the tape loading mechanism 7, and the second clamping component 8 is used to grab the components on the tape loading mechanism 7 and transport them to the circuit substrate on the carrier 3.

[0035] First, multiple wafers to be mounted are placed on the first loading device 9 and the second loading device 10, and no less than 20 wafers can be placed at the same time, which can reduce the frequency of manual loading. The carrier 3 with the circuit substrate is transported to the bottom of the first clamping component 6 through the conveying track 2. The wafer transportation mechanism 5 grabs the wafer and places it on the wafer fixing mechanism 4. The wafer fixing mechanism 4 clamps the wafer and rotates it to the optimal position. The first clamping component 6 absorbs the chip of the wafer on the wafer fixing mechanism 4 and places it on the circuit substrate; when all the single chips on the wafer are mounted, the wafer transportation mechanism 5 will grab and transfer the used wafers from the wafer fixing device to the wafer unloading device 12. The unloading device can hold no less than 20 wafers at the same time, which can reduce the frequency of manual unloading. When a certain number of wafers are collected, they are taken out for recycling. The above is the entire chip mounting process. After the chip is mounted, the carrier 3 will transport the circuit substrate with the chip mounted to the bottom of the second clamping assembly 8 along the conveying track 2. The second clamping assembly 8 grabs the components on the tape loading mechanism 7 and places them on the circuit substrate. The above is the mounting process of semiconductor circuit components. After completing the above steps, the carrier 3 will transfer the product to the next process through the conveying track 2. The coordinated work of this series of automated equipment not only improves production efficiency, but also ensures the accuracy and quality of mounting, providing a strong guarantee for efficient production.

[0036] Based on multiple factors such as protecting wafers from environmental damage, improving production efficiency and automation level, reducing pollution risks, and optimizing space layout. Therefore, in one embodiment, the rack 1 includes a partition horizontally arranged inside the rack 1, the partition is provided with a first opening connecting the upper and lower spaces of the partition, the wafer fixing mechanism 4 is arranged on the partition, the wafer transportation mechanism 5, the first loading device 9, the second loading device 10, and the wafer unloading mechanism 11 are arranged below the partition, the wafer transportation mechanism 5 transports the wafer on the first loading device 9 to the wafer fixing mechanism 4 through the first opening, the wafer transportation mechanism 5 transports the wafer on the second loading device 10 to the wafer fixing mechanism 4 through the first opening, and the wafer transportation mechanism 5 transports the wafer on the wafer fixing mechanism 4 to the wafer unloading mechanism 11 through the first opening. In order to ensure the quality and efficiency of wafers during the production process, the wafer storage area and the wafer mounting work area are clearly divided, so as to achieve strict control of the wafer storage environment and maintain the cleanliness of the wafers during storage. The wafer transport mechanism 5 effectively connects the storage space with the mounting space to ensure that the transfer of wafers between the two areas is both rapid and accurate, reducing the risk of contamination of wafers during the transfer process, and improving the automation level and production efficiency of the entire production process.

[0037] In the production process, different wafers are generally required to be mounted on a circuit substrate. Therefore, in one embodiment, the semiconductor assembly equipment further includes a first loading device 9 and a second loading device 10, the first loading device 9 and the second loading device 10 are fixed on the frame 1, the first loading device 9 and the second loading device 10 are used to place wafers, the wafer transport mechanism 5 is used to transport the wafers on the first loading device 9 to the wafer fixing mechanism 4, and the wafer transport mechanism 5 is used to transport the wafers on the second loading device 10 to the wafer fixing mechanism 4. By using the first loading device 9 and the second loading device 10, multiple wafers can be processed at the same time, thereby speeding up the wafer mounting process and improving the overall production efficiency. The design of the wafer placement slot can ensure the accurate position of the wafer during the loading process. The first loading device 9 and the second loading device 10 are fixed in the same installation space, which effectively utilizes limited space resources and saves the space occupied by the equipment.

[0038] However, after all the single chips on the wafer are mounted, it is generally necessary to stop the machine to recycle the wafer. Therefore, in one embodiment, the semiconductor assembly equipment further includes a wafer unloading mechanism 11, which includes a wafer unloading device 12 and an unloading guide rail 13, the unloading guide rail 13 is fixed on the frame 1, the wafer unloading device 12 is slidably arranged on the unloading guide rail 13, the wafer unloading device 12 is used to place the used wafers, and the wafer transportation mechanism 5 is used to transport the used wafers on the wafer fixing mechanism 4 to the wafer unloading device 12. When all the single chips on the wafer are mounted, the wafer transportation mechanism 5 will grab and transfer the used wafers from the wafer fixing device to the wafer unloading device 12. The unloading device can place no less than 20 wafers at the same time, which can reduce the frequency of manual unloading. When a certain number of wafers are collected, they will be taken out uniformly for recycling, reducing the number of shutdowns for unloading and improving production efficiency.

[0039] In order to realize efficient, flexible and accurate transportation of wafers in three-dimensional space. Therefore, in one embodiment, the wafer transportation mechanism 5 includes a first guide rail 14 fixed to the frame 1, a first moving device 15, a second guide rail 16, a second moving device 17, a robot arm rotating device 18, a third guide rail 19, a third moving device 20, a robot head telescopic device 21 and a robot head clamping device 22, wherein the first guide rail 14 is horizontally fixed to the frame 1, the first moving device 15 is slidably arranged on the first guide rail 14, the second guide rail 16 is fixed to the first moving device 15, and the second guide rail 16 is connected to the first moving device 15. The first guide rail 14 is vertically arranged, the second moving device 17 is slidably arranged on the second guide rail 16, the robot arm rotating device 18 is fixed on the second moving device 17, the third guide rail 19 is vertically fixed on the robot arm rotating device 18, the third moving device 20 is slidably arranged on the third guide rail 19, the robot head telescopic device 21 is fixed on the third moving device 20, the robot head clamping device 22 is fixedly connected to the telescopic part of the robot head telescopic device 21, and the robot head clamping device 22 is used to clamp the wafer. The robot head telescopic device 21 and the robot head clamping device 22 cooperate to achieve the clamping and fixing of the wafer, the first moving device 15 moves in the X-axis direction on the first guide rail 14, the second moving device 17 moves in the Y-axis direction on the second guide rail 16, the third moving device 20 moves in the Z-axis direction on the third guide rail 19, and the robot arm rotating device 18 is used to rotate the third guide rail 19 to realize the transportation of the wafer in any direction in space.

[0040] In order to meet the strict requirements of accurate placement, positioning, rotation of wafers and reduction of surface damage to wafers in semiconductor manufacturing, the quality and performance of semiconductor products are ensured. Therefore, in one embodiment, the wafer fixing mechanism 4 includes a wafer fixing base 23, a vacuum suction cup 24 mounted on the wafer fixing base 23, a negative pressure device 25 and a wafer rotating device 26, wherein the wafer rotating device 26 is fixed on the partition, the wafer fixing base 23 is fixedly connected to the rotating part of the wafer rotating device 26, the wafer rotating device 26 is used to drive the wafer fixing base 23 to rotate, the negative pressure device 25 is fixed on the partition, and the vacuum suction cup 24 is connected to the negative pressure device 25 for adsorbing the wafer. In order to ensure the accurate placement and positioning of the wafer, the vacuum suction cup 24 technology is used to adsorb and fix the wafer. The vacuum suction cup 24 firmly adsorbs the surface of the wafer through the negative pressure environment formed inside, ensuring that it will not move or deflect during subsequent processing. This adsorption method not only provides sufficient adsorption force, but also, due to the small contact area, the damage to the surface of the wafer is relatively small. The wafer rotating device 26 is responsible for driving the wafer fixing base 23 to rotate, so that the wafer adsorbed on the vacuum suction cup 24 can rotate at a predetermined angle. By accurately controlling the angle and speed of rotation, the precise positioning of the wafer can be achieved, thereby meeting the strict requirements for the position accuracy of the wafer in semiconductor manufacturing.

[0041] In order to ensure that the wafer can be accurately positioned and adjusted during the loading process, and at the same time improve the stability, reliability, accuracy, maintainability, adaptability and flexibility of the equipment. Therefore, in one embodiment, the wafer rotating device 26 includes a fixed shaft 27, a ratchet 28, a driving pawl 29, a non-return pawl 30, a cylinder 31 and a movable rod 32, the fixed shaft 27 is arranged on the partition, the ratchet 28 is sleeved on the fixed shaft 27, the ratchet 28 sleeve is rotatably connected with the fixed shaft 27, the wafer fixing base 23 is fixed on the ratchet 28, the movable rod 32 is provided with a slide groove, the cylinder 31 is slidably connected with the slide groove by bolts, the driving pawl 29 is arranged corresponding to the ratchet 28, the driving pawl 29 is fixedly connected to the movable rod 32, the non-return pawl 30 is arranged corresponding to the ratchet 28, and the non-return pawl 30 is fixed on the partition. The ratchet 28 is meshed with the driving pawl 29 and the non-return pawl 30, and intermittent rotation is achieved through the movement of the movable rod 32, thereby ensuring that the wafer is accurately positioned and adjusted during the loading process.

[0042] In order to achieve efficient, flexible and scalable chip mounting, to meet the ever-changing production needs and improve production efficiency. Therefore, in one embodiment, the first clamping assembly 6 includes a fourth guide rail 33 fixed on the frame 1, a first mechanical arm 34 slidably arranged on the fourth guide rail 33, a fifth guide rail 35 fixed under the first mechanical arm 34, a second mechanical arm 36 slidably arranged under the fifth guide rail 35, a first telescopic device 37 arranged on the second mechanical arm 36, and a first suction nozzle 38 arranged on the first telescopic device 37, the fourth guide rail 33 is vertically arranged with the fifth guide rail 35, and the first suction nozzle 38 is used to suck the chip on the wafer surface of the wafer fixing mechanism 4. The first robot arm 34 moves on the fourth guide rail 33 in the X-axis direction, the third robot arm 40 moves on the fifth guide rail 35 in the Y-axis direction, the first telescopic device 37 drives the first suction nozzle 38 to move in the Z-axis direction, and the first suction nozzle 38 sucks the chip on the surface of the wafer on the wafer fixing mechanism 4 and transfers it to the circuit substrate; quickly and accurately locates the wafer chip to the specified position on the circuit substrate to achieve higher production efficiency. In addition, this design is also highly flexible and scalable. As production needs change, the movement trajectory and speed of the robot arm can be adjusted, or different types of gripping tools can be replaced to adapt to chips of different sizes and shapes.

[0043] In order to achieve efficient, flexible and scalable component placement to meet the ever-changing production needs and improve production efficiency. Therefore, in one embodiment, the second clamping assembly 8 includes a sixth guide rail 39 fixed to the frame 1, a third mechanical arm 40 slidably disposed on the sixth guide rail 39, a seventh guide rail 41 fixed under the third mechanical arm 40, a fourth mechanical arm 42 slidably disposed under the seventh guide rail 41, a second telescopic device 43 disposed on the fourth mechanical arm 42, and a second suction nozzle 44 disposed on the second telescopic device 43, the sixth guide rail 39 is vertically disposed to the seventh guide rail 41, and the second suction nozzle 44 is used to suck the components on the reel loading mechanism 7. The third robot arm 40 moves on the sixth guide rail 39 in the X-axis direction, the fourth robot arm 42 moves on the seventh guide rail 41 in the Y-axis direction, the second telescopic device 43 drives the second suction nozzle 44 to move in the Z-axis direction, and the second suction nozzle 44 sucks the components on the tape loading mechanism 7 and transfers them to the circuit substrate; quickly and accurately locates the components to the specified position on the circuit substrate to achieve higher production efficiency. In addition, this design is also highly flexible and scalable. As production needs change, the movement trajectory and speed of the robot arm can be adjusted, or different types of gripping tools can be replaced to adapt to components of different sizes and shapes.

[0044] The semiconductor industry is experiencing a rapid development stage. Therefore, in one embodiment, the output end of the fourth rail 33 is connected to the input end of the sixth rail 39. This effectively saves valuable production space resources, which is particularly important for the semiconductor assembly industry that performs high-density layout in a limited space. In addition, the design flexibility of the system allows more robotic arms and rails to be added in the future according to production needs. Such scalability provides the possibility for further upgrading of the equipment and improving the level of automation, thereby further improving production capacity and automation level, and meeting the growing technical needs of the semiconductor industry.

[0045] The preferred embodiments of the present invention are described in detail above, but the present invention is not limited to the embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A semiconductor assembly equipment, characterized in that: include: Rack (1); A conveying track (2), the conveying track (2) being horizontally arranged on the frame (1); a carrier (3), the carrier (3) being arranged on the conveying track (2), the carrier (3) being used to carry a circuit substrate, and the carrier (3) moving through the conveying track (2); A wafer fixing mechanism (4), wherein the wafer fixing mechanism (4) is arranged on the frame (1), and the wafer fixing mechanism (4) is used to adjust the angle of the wafer; A wafer transport mechanism (5), the wafer transport mechanism (5) being arranged on the frame (1), and the wafer transport mechanism (5) being used to transport the wafer to the wafer fixing mechanism (4); a first clamping assembly (6), the first clamping assembly (6) being arranged on the frame (1), the first clamping assembly (6) being arranged above the wafer fixing mechanism (4), and the first clamping assembly (6) being used for grabbing the chip on the wafer and transporting it to the circuit substrate on the carrier (3); A tape loading mechanism (7), the tape loading mechanism (7) being arranged on the frame (1), and the tape loading mechanism (7) being used for conveying components on the tape; A second clamping assembly (8), wherein the second clamping assembly (8) is arranged on the frame (1), and the second clamping assembly (8) is arranged above the reel loading mechanism (7), and the second clamping assembly (8) is used to grab components on the reel loading mechanism (7) and transport them to the circuit substrate on the carrier (3).

2. A semiconductor assembly equipment according to claim 1, characterized in that: It also includes a first loading device (9) and a second loading device (10), wherein the first loading device (9) and the second loading device (10) are fixed on the frame (1), the first loading device (9) and the second loading device (10) are used to place wafers, the wafer transport mechanism (5) is used to transport the wafers on the first loading device (9) to the wafer fixing mechanism (4), and the wafer transport mechanism (5) is used to transport the wafers on the second loading device (10) to the wafer fixing mechanism (4).

3. A semiconductor assembly equipment according to claim 2, characterized in that: It also comprises a wafer unloading mechanism (11), which comprises a wafer unloading device (12) and an unloading guide rail (13), wherein the unloading guide rail (13) is fixed on the frame (1), the wafer unloading device (12) is slidably arranged on the unloading guide rail (13), the wafer unloading device (12) is used to place used wafers, and the wafer transport mechanism (5) is used to transport used wafers on the wafer fixing mechanism (4) to the wafer unloading device (12).

4. The semiconductor assembly equipment according to claim 1, characterized in that: The wafer transport mechanism (5) is arranged on the frame (1), and comprises a first guide rail (14) fixed on the frame (1), a first moving device (15), a second guide rail (16), a second moving device (17), a robot arm rotating device (18), a third guide rail (19), a third moving device (20), a robot head telescopic device (21) and a robot head clamping device (22), wherein the first guide rail (14) is horizontally fixed on the frame (1), the first moving device (15) is slidably arranged on the first guide rail (14), the second guide rail (16) is fixed on the first moving device (15), and the third guide rail (19) is a third moving device (20). The second guide rail (16) is vertically arranged with respect to the first guide rail (14); the second moving device (17) is slidably arranged on the second guide rail (16); the robot arm rotating device (18) is fixed on the second moving device (17); the third guide rail (19) is vertically fixed on the robot arm rotating device (18); the third moving device (20) is slidably arranged on the third guide rail (19); the robot head telescopic device (21) is fixed on the third moving device (20); the robot head clamping device (22) is fixedly connected to the telescopic part of the robot head telescopic device (21); and the robot head clamping device (22) is used for clamping wafers.

5. The semiconductor assembly equipment according to claim 1, characterized in that: The wafer fixing mechanism (4) comprises a wafer fixing base (23), a vacuum suction cup (24) mounted on the wafer fixing base (23), a negative pressure device (25) and a wafer rotating device (26); the wafer rotating device (26) is fixed on the frame (1); the wafer fixing base (23) is fixedly connected to a rotating part of the wafer rotating device (26); the wafer rotating device (26) is used to drive the wafer fixing base (23) to rotate; the negative pressure device (25) is fixed on the frame (1); and the vacuum suction cup (24) is connected to the negative pressure device (25) for adsorbing the wafer.

6. The semiconductor assembly equipment according to claim 5, characterized in that: The wafer rotating device (26) comprises a fixed shaft (27), a ratchet (28), a driving pawl (29), a non-return pawl (30), a cylinder (31) and a movable rod (32), wherein the fixed shaft (27) is arranged on the frame (1), the ratchet (28) is sleeved on the fixed shaft (27), the ratchet (28) sleeve is rotatably connected to the fixed shaft (27), the wafer fixing base (23) is fixed on the ratchet (28), a sliding groove is provided on the movable rod (32), the cylinder (31) is slidably connected to the sliding groove by bolts, the driving pawl (29) is correspondingly arranged with the ratchet (28), the driving pawl (29) is fixedly connected with the movable rod (32), the non-return pawl (30) is correspondingly arranged with the ratchet (28), and the non-return pawl (30) is fixed on the frame (1).

7. The semiconductor assembly equipment according to claim 1, characterized in that: The first clamping assembly (6) comprises a fourth guide rail (33) fixed on the frame (1), a first mechanical arm (34) slidably arranged on the fourth guide rail (33), a fifth guide rail (35) fixed under the first mechanical arm (34), a second mechanical arm (36) slidably arranged under the fifth guide rail (35), a first telescopic device (37) arranged on the second mechanical arm (36) and a first suction nozzle (38) arranged on the first telescopic device (37), the fourth guide rail (33) and the fifth guide rail (35) are arranged vertically, and the first suction nozzle (38) is used to suck chips on the surface of the wafer on the wafer fixing mechanism (4).

8. The semiconductor assembly equipment according to claim 1, characterized in that: The second clamping assembly (8) comprises a sixth guide rail (39) fixed on the frame (1), a third mechanical arm (40) slidably arranged on the sixth guide rail (39), a seventh guide rail (41) fixed under the third mechanical arm (40), a fourth mechanical arm (42) slidably arranged under the seventh guide rail (41), a second telescopic device (43) arranged on the fourth mechanical arm (42) and a second suction nozzle (44) arranged on the second telescopic device (43), the sixth guide rail (39) is arranged perpendicular to the seventh guide rail (41), and the second suction nozzle (44) is used to suck components on the roll feeding mechanism (7).

9. A semiconductor assembly equipment according to claim 7 or 8, characterized in that: The output end of the fourth guide rail (33) is connected to the input end of the sixth guide rail (39).

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