Launching assembly structure

Abstract

The invention discloses a transmitting assembly structure which comprises a control panel, an attenuation unit, a delay unit, a correction detection unit and a radio frequency unit. The control panel is connected with the attenuation unit, the delay unit and the correction detection unit respectively; the attenuation unit and the time delay unit are respectively connected with the radio frequency unit and receive radio frequency signal input, the attenuation unit is connected with the time delay unit, the time delay unit is connected with a radio frequency output end, and processed radio frequency signals are combined and output; the correction detection unit is connected with a correction signal input end, a detection signal input end of the correction detection unit is connected with the control panel, and the correction detection unit is provided with a correction signal output end. According to the invention, external cascade interfaces and the number of cores are simplified, the hardware cost is reduced, and the production efficiency and the maintainability of products are improved.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a transmitting component structure. Background Art

[0002] With the development of wireless communication technology, the demand for high-performance and low-cost wireless communication equipment continues to increase. RF / microwave components operating at higher frequencies can provide wider bandwidths, thereby achieving large communication capacity and meeting the requirements of high-quality communication and anti-interference. As an important component of active transmitting phased arrays, the performance, cost and maintainability of the transmitting component greatly affect the performance and cost of the phased array.

[0003] At present, conventional RF / microwave components are often designed using the traditional hybrid two-dimensional integration method, that is, a two-dimensional integration method of digital PCB board + single-layer microwave circuit chip, or LTCC substrate + microwave device. In the Journal of Electronic Industry Technology (Volume 41, Issue 4, July 2020), a multi-layer circuit substrate manufacturing technology for radar high-frequency T / R components was disclosed. The TSV multi-layer circuit realized an ultra-high integrated three-dimensional chip component. Its product has high integration, but high cost and poor maintainability. In the Journal of Electronic Mechanical Engineering (Volume 38, Issue 3, June 2022), a study on the micro-assembly technology of satellite-borne microwave components was introduced. It also followed the traditional design concept and adopted a two-dimensional integration method of LTCC substrate + microwave devices. Its product reliability is high, but the cost, integration and maintainability also do not meet current needs. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a transmitting component structure, which combines the input 4-way RF signals for output after amplification, 8-way digital controlled delay, 6-way digital controlled attenuation and other shaping processes, and the control board is connected to the ports of each functional chip through a control bus. Based on the control signal, the component is enabled to simultaneously have the functions of amplifying, detecting or attenuating and detecting the 4-way correction signals through switch control, thereby realizing the compatible design of the component's working modes.

[0005] The present invention provides a launching assembly structure, and the specific technical solution is as follows:

[0006] It includes a control board, an attenuation unit, a delay unit, a correction detection unit and a radio frequency unit;

[0007] The control board is connected to the attenuation unit, the delay unit, and the correction and detection unit respectively;

[0008] The attenuation unit and the delay unit are respectively connected to the RF unit to receive RF signal input, the attenuation unit is connected to the delay unit, the delay unit is connected to the RF output end, and the processed RF signal is combined and output;

[0009] The correction detection unit is connected to the correction signal input end, the detection signal input end of the correction detection unit is connected to the control board, and the correction detection unit is provided with a correction signal output end.

[0010] Furthermore, the radio frequency unit includes four radio frequency signal inputs, which are respectively connected to the attenuation unit and the delay unit through radio frequency connectors.

[0011] Furthermore, the attenuation unit includes a first attenuation module and a second attenuation module. The first attenuation module and the second attenuation module respectively receive one RF signal through the RF connector and output the signals as two RF signals.

[0012] Furthermore, the delay unit includes a first delay module and a second delay module, and the first delay module and the second delay module respectively receive one RF signal input through the RF connector, and respectively receive one RF signal output from the first attenuation module and the second attenuation module.

[0013] Furthermore, the attenuation unit, the delay unit and the correction detection unit all use a multifunctional chip as a processor, and the multifunctional chip uses SIPFC-CB-0116.

[0014] Furthermore, the correction detection unit is connected to the correction signal input terminal through four radio frequency connectors to receive four correction signal inputs respectively.

[0015] Furthermore, the control board includes four wave control chips connected in parallel, and the wave control chips are connected to the attenuation unit, the delay unit, and the correction detection unit through a power bus and a control bus respectively.

[0016] Furthermore, the wave control chip adopts GND2004CQ.

[0017] Furthermore, the control board is also connected to a low-frequency connector, which receives and outputs the detection signal transmitted by the control board, and transmits the power signal and control signal of the host computer to the control board.

[0018] Furthermore, the low frequency connector adopts J63A-2F2-21-431-TH.

[0019] The beneficial effects of the present invention are as follows:

[0020] Compared with the traditional structure, the transmitting component structure of the present invention greatly reduces the number of external low-frequency connector cores. Based on this structure, the number of control signal lines of the wave control chip is reduced, the cascade interface and the number of cores are simplified, the use efficiency of the product is improved, and at the same time the hardware cost is reduced, and the product production efficiency and maintainability are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the radio frequency link structure of the present invention.

[0022] Figure 2 It is a schematic diagram of the control panel structure of the present invention. DETAILED DESCRIPTION

[0023] The following description clearly and completely describes the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In the description of the embodiments of the present invention, it should be noted that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the invention product is usually placed when in use, or the orientation or positional relationship commonly understood by those skilled in the art, or the orientation or positional relationship in which the invention product is usually placed when in use, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0025] In the description of the embodiments of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] Example 1

[0027] Embodiment 1 of the present invention discloses a transmitting component structure, such as Figure 1 As shown, the details are as follows:

[0028] It includes a control board, an attenuation unit, a delay unit, a correction detection unit and a radio frequency unit;

[0029] In this embodiment, the RF unit includes four RF signal inputs, which are respectively connected to the attenuation unit and the delay unit through RF connectors;

[0030] Specifically, four RF connectors for receiving RF signals are provided to form a RF input port.

[0031] The control board is connected to the attenuation unit, the delay unit, and the correction and detection unit respectively;

[0032] As a preferred embodiment, Figure 2 As shown, the control board includes four wave control chips connected in parallel, and the wave control chips are connected to the processor via a power bus and a control bus respectively;

[0033] Specifically, the wave control chip adopts GND2004CQ.

[0034] As a preferred embodiment, the control board is also connected to a low-frequency connector, which receives and outputs the detection signal transmitted by the control board, and transmits the power signal and control signal of the host computer to the control board;

[0035] Specifically, the low-frequency connector adopts J63A-2F2-21-431-TH.

[0036] The attenuation unit and the delay unit are respectively connected to the RF unit to receive RF signal input, the attenuation unit is connected to the delay unit, the delay unit is connected to the RF output end, and the processed RF signal is combined and output;

[0037] As a preferred embodiment, the attenuation unit includes a first attenuation module and a second attenuation module. The first attenuation module and the second attenuation module respectively receive one RF signal through the RF connector and output it as two RF signals.

[0038] The delay unit includes a first delay module and a second delay module. The first delay module and the second delay module respectively receive one RF signal input through the RF connector, and respectively receive one RF signal output of the first attenuation module and the second attenuation module. The first delay module and the second delay module are respectively connected to two RF connectors to form four RF output ports. After the first delay module and the second delay module combine the received signals, they are divided into two RF outputs through the two connected RF connectors.

[0039] Specifically, the attenuation unit, the delay unit and the correction detection unit all use a multifunctional chip as a processor, and the multifunctional chip uses SIPFC-CB-0116;

[0040] The radio frequency connector adopts LRM / RFM12JEE-2.

[0041] The correction detection unit is connected to the correction signal input end, the detection signal input end of the correction detection unit is connected to the control board, and the correction detection unit is provided with a correction signal output end;

[0042] The correction detection unit is connected to the correction signal input terminal through four radio frequency connectors to receive four correction signal inputs respectively;

[0043] The correction detection unit performs amplification detection processing or attenuation detection processing on the received correction signal through a control signal, and outputs it to the control board; the correction detection unit is also connected to a radio frequency connector to form a correction signal output port to output the received correction signal.

[0044] The present invention is not limited to the above-mentioned specific embodiments, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. A transmitting component structure, characterized in that: It includes a control board, an attenuation unit, a delay unit, a correction detection unit and a radio frequency unit; The control board is connected to the attenuation unit, the delay unit, and the correction and detection unit respectively; The attenuation unit and the delay unit are respectively connected to the RF unit to receive RF signal input, the attenuation unit is connected to the delay unit, the delay unit is connected to the RF output end, and the processed RF signal is combined and output; The correction detection unit is connected to the correction signal input end, the detection signal input end of the correction detection unit is connected to the control board, and the correction detection unit is provided with a correction signal output end.

2. The launch assembly structure according to claim 1, characterized in that: The radio frequency unit includes four radio frequency signal inputs, which are respectively connected to the attenuation unit and the delay unit through radio frequency connectors.

3. The launching assembly structure according to claim 2, characterized in that: The attenuation unit includes a first attenuation module and a second attenuation module. The first attenuation module and the second attenuation module respectively receive one RF signal through the RF connector and output the signals as two RF signals.

4. The launching assembly structure according to claim 3, characterized in that: The delay unit includes a first delay module and a second delay module. The first delay module and the second delay module respectively receive a radio frequency signal input through the radio frequency connector, and respectively receive a radio frequency signal output from the first attenuation module and the second attenuation module.

5. The launching assembly structure according to claim 4, characterized in that: The attenuation unit, the delay unit and the correction detection unit all use a multifunctional chip as a processor, and the multifunctional chip uses SIPFC-CB-0116.

6. The launching assembly structure according to claim 1, characterized in that: The correction detection unit is connected to the correction signal input end through four radio frequency connectors to receive four correction signal inputs respectively.

7. The launching assembly structure according to claim 1, characterized in that: The control board includes four wave control chips connected in parallel, and the wave control chips are respectively connected to the attenuation unit, the delay unit, and the correction detection unit through a power bus and a control bus.

8. The launching assembly structure according to claim 7, characterized in that: The wave control chip adopts GND2004CQ.

9. The launching assembly structure according to claim 7, characterized in that: The control board is also connected to a low-frequency connector, which receives and outputs the detection signal transmitted by the control board, and transmits the power signal and control signal of the host computer to the control board.

10. The launching assembly structure according to claim 9, characterized in that: The low frequency connector adopts J63A-2F2-21-431-TH.

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