Multi-layer circuit board with through holes and blind holes and manufacturing method thereof

Abstract

The invention relates to the technical field of printed circuit board manufacturing, in particular to a multilayer circuit board with through holes and blind holes and a manufacturing method thereof.The manufacturing method of the multilayer circuit board comprises the steps that a substrate is provided, and the substrate comprises a first core board, a dielectric layer and a second core board which are sequentially arranged in the first direction; processing a first through hole and a second through hole in the substrate, wherein the first through hole and the second through hole both penetrate through the first core plate, the dielectric layer and the second core plate; and first filling media are arranged in the second through holes, one part of the second through holes are filled with the first filling media, and the other part of the second through holes form first blind holes. According to the multilayer circuit board with the through holes and the blind holes and the manufacturing method of the multilayer circuit board, the hole position precision of the through holes and the blind holes can be improved, and the performance and reliability of the multilayer circuit board are guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board manufacturing, and in particular to a multilayer circuit board with through holes and blind holes and a manufacturing method thereof. Background Art

[0002] In the production of printed circuit boards, with the increasing complexity and integration of electronic devices, the application of multi-layer circuit boards is becoming more and more extensive. In the production process of these multi-layer circuit boards, the production of through holes and blind holes is often involved, and then the through holes and blind holes need to be metallized to achieve electrical connections between different layers of the multi-layer circuit board, so as to realize various complex functions.

[0003] In the related art, a method for manufacturing a multi-layer circuit board with through holes and blind holes is generally to first drill through holes on the multi-layer circuit board by mechanical drilling using a previously positioned target hole, and then laser drill blind holes in the blind hole design area of ​​the multi-layer circuit board using a previously drilled through hole. Since this method requires two positioning drillings, the hole position accuracy of the through holes and the blind holes is relatively poor, which may affect the performance and reliability of the multi-layer circuit board. Summary of the invention

[0004] The present application provides a multilayer circuit board with through holes and blind holes and a manufacturing method thereof, which can improve the hole position accuracy of the through holes and the blind holes and ensure the performance and reliability of the multilayer circuit board.

[0005] In a first aspect, an embodiment of the present application provides a method for manufacturing a multilayer circuit board having through holes and blind holes, comprising:

[0006] Providing a substrate, the substrate comprising a first core board, a dielectric layer, and a second core board arranged in sequence along a first direction;

[0007] Processing a first through hole and a second through hole on the substrate, wherein the first through hole and the second through hole both penetrate the first core plate, the dielectric layer and the second core plate;

[0008] A first filling medium is disposed in the second through hole, the first filling medium fills a portion of the second through hole, and another portion of the second through hole forms a first blind hole.

[0009] In some embodiments, the step of providing a first filling medium in the second through hole comprises:

[0010] A gas is introduced into the second through hole along a second direction, and a first filling medium is disposed in the second through hole along the first direction. The gas acts on the first filling medium so that the first filling medium flows a preset distance along the first direction. The second direction is opposite to the first direction.

[0011] In some embodiments, the step of introducing gas into the second through hole along the second direction includes:

[0012] Placing the substrate on a blowing assembly, wherein the second core plate is in contact with the blowing assembly;

[0013] The blowing assembly is used to introduce gas into the second through hole along the second direction.

[0014] In some embodiments, the blowing assembly includes a gas generating part and a supporting plate, the supporting plate having an air guide hole; placing the substrate on the blowing assembly, with the second core plate in contact with the blowing assembly, includes: placing the substrate on the supporting plate, with the second core plate in contact with the supporting plate, and the air guide hole being connected to the second through hole; using the blowing assembly to pass gas into the second through hole along the second direction includes: using the gas generating part to pass gas into the second through hole along the second direction through the air guide hole.

[0015] In some embodiments, the blowing assembly includes a support platform, the support platform is provided with an upper air hole, the upper air hole is connected to the gas generating element, the supporting plate is arranged on the support platform, and the air guide hole is connected to the upper air hole.

[0016] In some embodiments, a plurality of upper air holes are provided, and the plurality of upper air holes are all connected to the air guide hole.

[0017] In some of the embodiments, the support platform is provided with a groove, the carrying plate cover is provided at the notch of the groove, the groove is connected to the air guide hole, and the plurality of upper air holes are all connected to the groove.

[0018] In some embodiments, a supporting portion is disposed inside the groove, the supporting portion is connected to the bottom wall of the groove, and the supporting portion is supported by the supporting plate.

[0019] In some of the embodiments, when the first through hole and the second through hole are processed on the substrate, a third through hole is processed on the substrate, and the third through hole passes through the first core board, the dielectric layer and the second core board; after the first filling medium is arranged in the second through hole, the first filling medium fills a part of the second through hole, and the other part of the second through hole forms a first blind hole, the second filling medium is arranged in the third through hole, and the second filling medium fills a part of the third through hole, and the other part of the third through hole forms a second blind hole.

[0020] In a second aspect, an embodiment of the present application provides a multilayer circuit board having through holes and blind holes, and the multilayer circuit board is processed by the manufacturing method of the multilayer circuit board as described in the first aspect.

[0021] The method for manufacturing a multi-layer circuit board provided in the embodiment of the present application has the beneficial effect that: since the first through hole and the second through hole are first processed on the substrate, the first through hole and the second through hole both penetrate the first core board, the dielectric layer and the second core board, and then the first filling medium is arranged in the second through hole, the first filling medium fills a part of the second through hole, and the other part of the second through hole forms a first blind hole, the hole position accuracy of the first through hole and the first blind hole can be made higher, thereby ensuring the performance and reliability of the multi-layer circuit board.

[0022] The beneficial effects of the multilayer circuit board with through holes and blind holes provided in the present application compared with the prior art can be referred to the description of the beneficial effects of the method for manufacturing the multilayer circuit board provided in the present application compared with the prior art, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 is a flow chart of a method for manufacturing a multilayer circuit board having through holes and blind holes in one embodiment of the present application;

[0025] Figure 2 This is a schematic diagram of the structure of a substrate in one of the embodiments of the present application;

[0026] Figure 3 is Figure 2 A schematic diagram of processing a first through hole, a second through hole and a third through hole on a substrate shown;

[0027] Figure 4 is Figure 3A schematic diagram showing that a first filling medium is disposed in a second through hole of a substrate;

[0028] Figure 5 is Figure 3 A schematic diagram showing that a second filling medium is disposed in a third through hole of a substrate;

[0029] Figure 6 Yes Figure 5 A schematic diagram of hole metallization of a first through hole, a second blind hole and a third blind hole of a substrate is shown.

[0030] The meanings of the marks in the figure are:

[0031] 100. Substrate;

[0032] 10. First core board; 11. First circuit layer; 12. First connection layer; 20. Dielectric layer; 30. Second core board; 31. Second circuit layer; 32. Second connection layer; 40. First through hole; 50. Second through hole; 51. First blind hole; 60. Third through hole; 61. Second blind hole; 70. First filling medium; 80. Second filling medium; 90. Electroplating layer;

[0033] 200, load-bearing plate;

[0034] 210, air guide hole;

[0035] 300, support platform;

[0036] 310, upper air hole; 320, support portion; 330, groove;

[0037] 400, plug hole mesh plate;

[0038] 410. Lower oil hole. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0040] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0041] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0042] References to "one embodiment", "some embodiments" or "an embodiment" described in the specification of this application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some other embodiments", "in some other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, particular features, structures or characteristics may be combined in any suitable manner.

[0043] In order to illustrate the technical solution of the present application, a description is given below with reference to specific drawings and embodiments.

[0044] In the related art, the method for making a multi-layer circuit board with through holes and blind holes is generally to first use mechanical drilling to position the 2.0mm positioning target hole drilled by a previous X-ray (X-ray) target shooting machine, drill four through holes on the multi-layer circuit board, and then use laser drilling to grasp the target positioning of the previously drilled through holes, and use laser drilling to drill blind holes in the blind hole design area of ​​the multi-layer circuit board. This method requires two positioning drillings (if blind holes are drilled on both sides of the multi-layer circuit board, three positionings are required to complete the production). Each positioning may be due to equipment errors or the multi-layer circuit board shifting when the two blind holes need to be flipped over and then positioned for drilling, resulting in relatively poor hole position accuracy of the through holes and blind holes after drilling, which may affect the performance and reliability of the multi-layer circuit board, and this method requires the investment of two types of equipment.

[0045] In addition, the dielectric layer of the multi-layer circuit board is relatively complex. When laser drilling is performed, the blind hole wall glue dielectric layer is easily absorbing heat from the laser, causing the dielectric layer to be severely concave, affecting the hole shape of the blind hole and further affecting its electrical performance.

[0046] At the same time, when the blind hole of the layer circuit board is relatively deep, the laser energy gradually decays from top to bottom during laser drilling. The blind hole is often trumpet-shaped, and the laser taper (the ratio of the upper and lower apertures) is difficult to control, which will affect the electrical performance and mechanical strength of the blind hole.

[0047] In view of this, the present application provides a multilayer circuit board with through holes and blind holes and a manufacturing method thereof. Since the first through hole and the second through hole are first processed on the substrate, the first through hole and the second through hole both penetrate the first core board, the dielectric layer and the second core board, and then the first filling medium is arranged in the second through hole, the first filling medium fills a part of the second through hole, and the other part of the second through hole forms a first blind hole, the hole position accuracy of the first through hole and the first blind hole can be made higher, thereby ensuring the performance and reliability of the multilayer circuit board.

[0048] Please refer to Figures 1 to 4 In a first aspect, an embodiment of the present application provides a method for manufacturing a multilayer circuit board having through holes and blind holes, comprising:

[0049] S100 : providing a substrate 100 , wherein the substrate 100 comprises a first core board 10 , a dielectric layer 20 , and a second core board 30 arranged in sequence along a first direction.

[0050] Specifically, the first core board 10 may include a first circuit layer 11, and the second core board 30 may include a second circuit layer 31. Both the first core board 10 and the second core board 30 may be double-sided FCCL (Flexible Copper Clad Laminate). The double-sided FCCL is subjected to coil film exposing and etching to produce circuits, and then the stacking positioning holes are punched out by an automatic punching machine, and then the stacking positioning holes are cut into corresponding sizes by an automatic cutting machine. The dielectric layer 20 may include a semi-cured sheet, which is cut into preset sizes, and the stacking alignment holes are drilled by a mechanical drill. The above three materials are stacked in a stacking order by PIN (pin) nails, and then the four-layer board is pressed and cured by a press to obtain a substrate 100. Then, an X-Ray shooting machine is used to capture the copper PAD (pad) made of the inner layer pattern of the substrate 100 through X-ray perspective, and four 2.0 mm positioning through holes are punched out by a punch.

[0051] In this embodiment, the first direction may be the direction indicated by arrow b in the figure.

[0052] The substrate 100 may be a four-layer board, the first core board 10 includes two first circuit layers 11 and a first connection layer 12 disposed between the two first circuit layers 11 , and the second core board 30 includes two second circuit layers 31 and a second connection layer 32 disposed between the two second circuit layers 31 .

[0053] It should be noted that, in other embodiments, the substrate 100 may be a multi-layer board with other numbers of layers.

[0054] S200 : processing a first through hole 40 and a second through hole 50 on the substrate 100 , wherein the first through hole 40 and the second through hole 50 both penetrate the first core board 10 , the dielectric layer 20 and the second core board 30 .

[0055] Specifically, the first through hole 40 and the second through hole 50 can be processed on the substrate 100 by mechanical drilling or laser drilling, and only one device is needed. Since the first through hole 40 and the second through hole 50 can be processed simultaneously using the same set of drilling positioning references (such as the four 2.0 mm positioning through holes previously drilled by the X-Ray target machine), the hole position accuracy of the two is relatively high, there is no risk of relative misalignment, and the hole position accuracy reaches a good level.

[0056] It is understandable that the drilling data of the drilling machine can combine the previous blind hole drilling data with the through hole drilling data layer to make through hole drilling data. The six-axis drilling machine uses the four 2.0 mm positioning through holes punched by the X-ray target machine as the machine drill positioning holes, and drills holes at the original design positions of the substrate 100, and drills all through holes and blind holes into through holes, thereby obtaining the first through hole 40 and the second through hole 50.

[0057] S300 : a first filling medium 70 is disposed in the second through hole 50 , the first filling medium 70 fills a portion of the second through hole 50 , and another portion of the second through hole 50 forms a first blind hole 51 .

[0058] Specifically, the first filling medium 70 can be a plugging resin or ink, etc. The ink can be an insulating material with epoxy resin, polyimide resin, etc. as the main component, which is not limited here. The first filling medium 70 can be flush with the side of the first core board 10 away from the dielectric layer 20 or the side of the second core board 30 away from the dielectric layer 20.

[0059] It should be noted that the first blind hole 51 may penetrate the two first circuit layers 11 of the first core board 10 but not the dielectric layer 20. Alternatively, the first blind hole 51 may penetrate the two second circuit layers 31 of the second core board 30 but not the dielectric layer 20. Alternatively, the first blind hole 51 may penetrate the first core board 10, the dielectric layer 20, and a second circuit layer 31 but not the second connection layer 32. After the first filling medium 70 is set in the second through hole 50, the first piece can be made, and the state of the first filling medium 70 in the second through hole 50 can be confirmed by microsectioning.

[0060] From the above, it can be seen that the manufacturing method of the multilayer circuit board provided in the embodiment of the present application is that the first through hole 40 and the second through hole 50 are first processed on the substrate 100, and the first through hole 40 and the second through hole 50 both penetrate the first core board 10, the dielectric layer 20 and the second core board 30, and then the first filling medium 70 is arranged in the second through hole 50. The first filling medium 70 fills a part of the second through hole 50, and the other part of the second through hole 50 forms the first blind hole 51. Therefore, the hole position accuracy of the first through hole 40 and the first blind hole 51 can be made higher, thereby ensuring the performance and reliability of the multilayer circuit board.

[0061] The method for manufacturing a multilayer circuit board provided in the embodiment of the present application can avoid the problem of serious concavity of the hole wall of the dielectric layer 20 of the blind hole, and can solve the problem of poor laser taper (upper and lower aperture ratio) when the blind hole is relatively deep.

[0062] Please refer to Figure 5 In this embodiment, when the first through hole 40 and the second through hole 50 are processed on the substrate 100, the third through hole 60 is processed on the substrate 100, and the third through hole 60 passes through the first core board 10, the dielectric layer 20 and the second core board 30; a first filling medium 70 is arranged in the second through hole 50, and the first filling medium 70 fills a part of the second through hole 50, and the other part of the second through hole 50 forms the first blind hole 51, and then a second filling medium 80 is arranged in the third through hole 60, and the second filling medium 80 fills a part of the third through hole 60, and the other part of the third through hole 60 forms the second blind hole 61.

[0063] By adopting the above solution, the hole position accuracy of the first through hole 40, the first blind hole 51 and the second blind hole 61 can be higher, thereby ensuring the performance and reliability of the multi-layer circuit board.

[0064] It is understood that the second filling medium 80 can be a plugging resin or ink, etc. The ink can be an insulating material with epoxy resin, polyimide resin, etc. as the main component, which is not limited here. The method of setting the second filling medium 80 in the third through hole 60 can be similar to the method of setting the first filling medium 70 in the second through hole 50.

[0065] The second blind hole 61 may penetrate the two first circuit layers 11 of the first core board 10 but not the dielectric layer 20. Alternatively, the second blind hole 61 may penetrate the two second circuit layers 31 of the second core board 30 but not the dielectric layer 20. Alternatively, the second blind hole 61 may penetrate the first core board 10, the dielectric layer 20, and one second circuit layer 31 but not the second connection layer 32.

[0066] For example, the first blind hole 51 penetrates the two second circuit layers 31 of the second core board 30 but does not penetrate the dielectric layer 20 , and the second blind hole 61 penetrates the two first circuit layers 11 of the first core board 10 but does not penetrate the dielectric layer 20 .

[0067] Please refer to Figure 6Optionally, after setting the second filling medium 80 in the third through hole 60, the substrate 100 is electroplated so that the first core board 10 and the second core board 30 are covered with an electroplating layer 90, and the electroplating layer 90 can be copper. Part of the electroplating layer 90 covers the surface of the first core board 10 away from the dielectric layer 20, and part of the electroplating layer 90 covers the surface of the second core board 30 away from the dielectric layer 20. Part of the electroplating layer 90 covers the inner hole wall of the first blind hole 51 and electrically connects the two second circuit layers 31. Part of the electroplating layer 90 covers the inner hole wall of the second blind hole 61 and electrically connects the two first circuit layers 11. Part of the electroplating layer 90 covers the inner hole wall of the first through hole 40.

[0068] Among them, plasma equipment can be used first to ionize O2 / CF4 gas under a high electric field to remove the glue in the hole, remove the residual glue on the wall of the first blind hole 51, the second blind hole 61 and the first through hole 40, and at the same time increase the contact surface area of ​​the first core plate 10 and the second core plate 30.

[0069] Then, the substrate 100 is subjected to copper deposition or black shadow treatment, and a layer of copper or graphite powder with a thickness of 3 μm-5 μm is deposited on the surface of the first core board 10 , the surface of the second core board 30 , and the walls of the first blind hole 51 , the second blind hole 61 and the first through hole 40 .

[0070] Then, a vertical continuous electroplating line is used to plate copper on the basis of the original copper plating using the electrolytic plating principle in chemical reaction. An electroplating layer 90 of the required thickness is plated on the surface of the first core board 10, the surface of the second core board 30, and the walls of the first blind hole 51, the second blind hole 61 and the first through hole 40 to achieve electrical conduction of the first through hole 40, the first blind hole 51 and the second blind hole 61. The thickness standard of the electroplating layer 90 can be selected according to the requirements of different circuit boards for electroplating parameters.

[0071] Subsequent processes: Complete the production according to conventional production methods.

[0072] It is understandable that the first filling medium 70 should be located between the conductive layer and the nearest non-conductive layer, that is, deeper than the conductive layer and not in contact with the nearest non-conductive layer. For example, in this embodiment, the lower end of the first filling medium 70 is located between the second circuit layer 31 of the second core board 30 close to the dielectric layer 20 and the first circuit layer 11 of the first core board 10 close to the dielectric layer 20.

[0073] For example, the distance between the lower end of the first filling medium 70 and the first circuit layer 11 is greater than or equal to 10um, and the distance between the lower end of the first filling medium 70 and the second circuit layer 31 is greater than or equal to 10um, which can ensure that the two first circuit layers 11 of the first core board 10 are electrically conductive and electrically isolated from the second circuit layer 31, thereby ensuring the stability of the electrical performance of the first blind hole 51.

[0074] Please refer to Figure 3 , Figure 4 and Figure 5 In this embodiment, a first filling medium 70 is disposed in the second through hole 50, including:

[0075] Gas is introduced into the second through hole 50 along the second direction, and a first filling medium 70 is set in the second through hole 50 from the first direction. The gas acts on the first filling medium 70 so that the first filling medium 70 flows a preset distance along the first direction. The second direction is opposite to the first direction, and the second direction can be the direction indicated by arrow a in the figure.

[0076] By adopting the above solution, when the first filling medium 70 is arranged in the second through hole 50 , it can be ensured that the first filling medium 70 flows along the first direction for a preset distance without exceeding the preset distance.

[0077] It should be noted that the first filling medium 70 can be ink, and the ink can be set in the second through hole 50 from the first direction through the plugging screen 400. The plugging screen 400 is provided with a lower oil hole 410, and the hole surface is screen-printed. The ink is spread on the surface of the plugging screen 400, and the scraper plugs the ink downward to plug the ink into the second through hole 50 through the lower oil hole 410. The scraper pressure is controlled to be 3kg / ㎝2-7kg / ㎝2, and the number of scraping times is 1-3. The amount of ink in the second through hole 50 can be controlled by adjusting the scraper pressure and the number of scraping times. At this time, the gas introduced into the second through hole 50 along the second direction acts on the first filling medium 70 to form an air column, and the overall shape of the ink will be quite smooth and full. By adjusting the gas pressure of the gas at the bottom of the hole and the parameters of the scraper pressure, a relatively high depth control capability can be achieved to obtain a preset distance, and then the first filling medium 70 is subjected to a high temperature curing treatment at 150°C-160°C, and then the substrate 100 can be turned over, and a second filling medium 80 is set in the third through hole 60 using a similar method, and a high temperature curing treatment is performed at 150°C-160°C. After the first blind hole 51 and the second hole are made, the substrate 100 can be subjected to a high temperature curing treatment at 150°C-160°C to stabilize the characteristics of the first filling medium 70 and the second filling medium 80.

[0078] It should also be noted that the plugging mesh plate 400 can be an aluminum sheet, which can be cut into a preset size first, and a drill can be used to drill the lower oil hole 410 at the position corresponding to the second through hole 50. The aperture of the lower oil hole 410 can be 0.1mm-0.15mm larger than the aperture of the second through hole 50 on one side to facilitate alignment.

[0079] The step of introducing gas into the second through hole 50 along the second direction includes:

[0080] First, the substrate 100 is placed on the blowing assembly, and the second core plate 30 is in contact with the blowing assembly.

[0081] Next, a gas is introduced into the second through hole 50 along a second direction using a gas blowing assembly.

[0082] By adopting the above solution, the blowing assembly can be used to introduce gas into the second through hole 50 along the second direction, so that the first filling medium 70 flows along the first direction for a preset distance.

[0083] Optionally, the blowing assembly includes a gas generating part and a carrier plate 200, the carrier plate 200 has an air guide hole 210; the substrate 100 is placed on the blowing assembly, and the second core plate 30 is in contact with the blowing assembly, including: the substrate 100 is placed on the carrier plate 200, the second core plate 30 is in contact with the carrier plate 200, and the air guide hole 210 is connected with the second through hole 50; the blowing assembly is used to pass gas into the second through hole 50 along the second direction, including: using the gas generating part to pass gas into the second through hole 50 along the second direction through the air guide hole 210.

[0084] Such a configuration can ensure that when gas is introduced into the second through hole 50 along the second direction, the substrate 100 can obtain better support from the carrier plate 200 and can also achieve better sealing performance between the gas guide hole 210 and the second through hole 50 .

[0085] It should be noted that the gas generating member may include an air pump, etc. The carrier plate 200 may be FR4 (epoxy glass cloth laminate) or an aluminum sheet. In other embodiments, the carrier plate 200 may also be other materials. In the embodiment of the present application, the carrier plate 200 is FR4, which has a lower cost. The carrier plate 200, the substrate 100 and the plug-hole mesh plate 400 may be positioned using the same set of PIN pins. The pressure of the gas introduced into the second through hole 50 along the second direction may be controlled at 0.4MPa-0.6MPa.

[0086] Optionally, the blowing assembly includes a support platform 300 , the support platform 300 is provided with an upper air hole 310 , the upper air hole 310 is connected to the gas generating component, the supporting plate 200 is arranged on the support platform 300 , and the air guide hole 210 is connected to the upper air hole 310 .

[0087] Such an arrangement can provide better support for the carrying plate 200 .

[0088] In order to better control the air pressure in the air guide hole 210 , a plurality of upper air holes 310 are provided, and the plurality of upper air holes 310 are all connected to the air guide hole 210 .

[0089] For example, the support table 300 may be a positive air pressure table of a plugging machine, and the gas generating component is disposed inside the plugging machine.

[0090] With such arrangement, multiple upper air holes 310 can be connected to one air guide hole 210, and the gas generated by the gas can enter the second through hole 50 through the upper air holes 310 and the air guide holes 210 in turn. Therefore, it is only necessary to block part of the upper air holes 310 connected to the air guide holes 210 to reduce the air pressure in the air guide holes 210, thereby reducing the air pressure in the second through hole 50, thereby making it easier for the first filling medium 70 to flow a preset distance along the first direction.

[0091] It is understandable that a plurality of gas generating members may be provided, and the upper air holes 310 are provided one-to-one with the gas generating members. When it is necessary to reduce the air pressure in the air guide holes 210, it is only necessary to close some of the gas generating members or block some of the upper air holes 310. Alternatively, only one gas generating member is provided, and the plurality of upper air holes 310 are all connected to the gas generating member. When it is necessary to reduce the air pressure in the air guide holes 210, it is only necessary to block some of the upper air holes 310.

[0092] In this embodiment, the support platform 300 is provided with a groove 330 , the carrying plate 200 is covered at the notch of the groove 330 , the groove 330 is connected to the air guide hole 210 , and the plurality of upper air holes 310 are all connected to the groove 330 .

[0093] Such an arrangement can more conveniently realize the connection between the gas generating component and the plurality of upper gas holes 310 .

[0094] Optionally, a support portion 320 is disposed inside the groove 330 , the support portion 320 is connected to the bottom wall of the groove 330 , and the support portion 320 is supported against the supporting plate 200 .

[0095] Such a configuration can provide better support for the carrier plate 200 , thereby preventing the substrate 100 from collapsing due to the carrier plate 200 , thereby affecting the first filling medium 70 being set in the second through hole 50 from the first direction.

[0096] It should be noted that the support portion 320 can also play a role in guiding air, and the gas in the upper air hole 310 can flow through the support portion 320 and then enter the air guide hole 210 .

[0097] In a second aspect, an embodiment of the present application provides a multilayer circuit board having through holes and blind holes, and the multilayer circuit board is processed by the manufacturing method of the multilayer circuit board of the first aspect.

[0098] The multilayer circuit board provided in the embodiment of the present application has a first through hole 40 and a second through hole 50 processed on the substrate 100 during processing. The first through hole 40 and the second through hole 50 both penetrate the first core board 10, the dielectric layer 20 and the second core board 30. Then, a first filling medium 70 is arranged in the second through hole 50. The first filling medium 70 fills a part of the second through hole 50, and the other part of the second through hole 50 forms a first blind hole 51. Therefore, the hole position accuracy of the first through hole 40 and the first blind hole 51 can be made higher, thereby ensuring the performance and reliability of the multilayer circuit board.

[0099] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for manufacturing a multilayer circuit board having through holes and blind holes, characterized in that: include: Providing a substrate, the substrate comprising a first core board, a dielectric layer, and a second core board arranged in sequence along a first direction; Processing a first through hole and a second through hole on the substrate, wherein the first through hole and the second through hole both penetrate the first core plate, the dielectric layer and the second core plate; A first filling medium is disposed in the second through hole, the first filling medium fills a portion of the second through hole, and another portion of the second through hole forms a first blind hole.

2. The method for manufacturing a multilayer circuit board according to claim 1, characterized in that: The step of providing a first filling medium in the second through hole comprises: A gas is introduced into the second through hole along a second direction, and a first filling medium is disposed in the second through hole along the first direction. The gas acts on the first filling medium so that the first filling medium flows a preset distance along the first direction. The second direction is opposite to the first direction.

3. The method for manufacturing a multilayer circuit board according to claim 2, characterized in that: The step of introducing gas into the second through hole along the second direction includes: Placing the substrate on a blowing assembly, wherein the second core plate is in contact with the blowing assembly; The blowing assembly is used to introduce gas into the second through hole along the second direction.

4. The method for manufacturing a multilayer circuit board according to claim 3, characterized in that: The blowing assembly includes a gas generating part and a carrier plate, and the carrier plate has an air guide hole; placing the substrate on the blowing assembly, and the second core plate is in contact with the blowing assembly, including: placing the substrate on the carrier plate, the second core plate is in contact with the carrier plate, and the air guide hole is connected with the second through hole; using the blowing assembly to pass gas into the second through hole along the second direction, including: using the gas generating part to pass gas into the second through hole along the second direction through the air guide hole.

5. The method for manufacturing a multilayer circuit board according to claim 4, characterized in that: The blowing assembly comprises a supporting platform, the supporting platform is provided with an upper air hole, the upper air hole is communicated with the gas generating component, the carrying plate is arranged on the supporting platform, and the air guide hole is communicated with the upper air hole.

6. The method for manufacturing a multilayer circuit board according to claim 5, characterized in that: A plurality of upper air holes are provided, and all of the plurality of upper air holes are connected to the air guide hole.

7. The method for manufacturing a multilayer circuit board according to claim 6, characterized in that: The support platform is provided with a groove, the bearing plate cover is arranged at the notch of the groove, the groove is connected with the air guide hole, and the plurality of upper air holes are all connected with the groove.

8. The method for manufacturing a multilayer circuit board according to claim 7, characterized in that: A supporting portion is arranged inside the groove, the supporting portion is connected to the bottom wall of the groove, and the supporting portion is supported by the carrying plate.

9. The method for manufacturing a multilayer circuit board according to any one of claims 1 to 8, characterized in that: When the first through hole and the second through hole are processed on the substrate, a third through hole is processed on the substrate, and the third through hole passes through the first core board, the dielectric layer and the second core board; after the first filling medium is set in the second through hole, the first filling medium fills a part of the second through hole, and the other part of the second through hole forms a first blind hole, the second filling medium is set in the third through hole, and the second filling medium fills a part of the third through hole, and the other part of the third through hole forms a second blind hole.

10. A multilayer circuit board having through holes and blind holes, characterized in that: The multilayer circuit board is manufactured by the method for manufacturing a multilayer circuit board according to any one of claims 1 to 9.

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