Manufacturing method of solar cell and solar cell
By using a patterned mask instead of ink mask in the production of solar cells, the problem of long process paths in the prior art resulting in low yield is solved, and a more efficient electroplating process and better battery performance is achieved.
Patent Information
- Application Number
- CN202411833896.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-03-21
AI Technical Summary
The existing solar cell production methods have long process paths, resulting in low yields.
The patterned mask is used to directly grow the seed layer on the base layer, replacing the ink mask, reducing organic matter inclusions during the electroplating process, reducing the reverse etching steps, and simplifying the process path.
It improves the production yield of solar cells, enhances the conductivity of metal plating, and reduces process steps and time.
Smart Images
Figure CN119677217A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of solar cells, and in particular to a method for manufacturing a solar cell and a solar cell. Background Art
[0002] In the prior art, the process path of crystalline silicon patterned electroplating technology is as follows: crystalline silicon cell - formation of PVD layer on the entire surface - ink mask - electroplating - stripping - reverse etching. However, the above process path is relatively long and reduces the yield of solar cells. Summary of the invention
[0003] The main purpose of the present application is to provide a method for manufacturing a solar cell and a solar cell, so as to at least solve the problem of low yield caused by a long process path in the prior art method for manufacturing a solar cell.
[0004] According to one aspect of the present application, a method for manufacturing a solar cell is provided, comprising: providing a base layer, the base layer having a plurality of grooves arranged along a first direction and a second direction, respectively, two adjacent grooves having a gap, the first direction and the second direction intersecting, the first direction and the second direction being respectively perpendicular to the thickness direction of the base layer; arranging a patterned mask on the surface of the base layer, the patterned mask having a plurality of openings arranged along the first direction, one of the openings exposing a plurality of the grooves; using the patterned mask as a mask, forming a first metal coating in each of the openings; and sequentially forming a second metal coating and a third metal coating on a side of the first metal coating away from the base layer.
[0005] Optionally, providing a base layer includes: providing a preliminary base layer, the preliminary base layer at least including a polysilicon layer and a silicon nitride layer stacked in sequence; removing part of the silicon nitride layer to expose part of the polysilicon layer, and the remaining polysilicon layer and the silicon nitride layer form the base layer.
[0006] Optionally, a diameter of the groove along the first direction or the second direction ranges from 5 to 1000 μm, a depth of the groove ranges from 0.1 to 2 μm, and a distance between two adjacent grooves in the first direction or the second direction ranges from 20 to 50 μm.
[0007] Optionally, the material of the patterned mask is a non-magnetic material, and the thickness of the patterned mask ranges from 0.1 to 2 cm.
[0008] Optionally, a material of the first metal plating layer includes at least one of aluminum, titanium, copper, silver and gold.
[0009] Optionally, forming a first metal plating layer in each of the openings includes: sequentially forming a plurality of conductive seed layers in each of the openings to obtain the first metal plating layer.
[0010] Optionally, the thickness of the second metal coating is in the range of 5 to 30 μm, and the material of the second metal coating includes at least one of copper and nickel.
[0011] Optionally, the thickness of the third metal coating is in the range of 1 to 3 μm, and the material of the third metal coating includes at least one of tin and nickel.
[0012] Optionally, the first metal plating layer fills each of the grooves.
[0013] According to another aspect of the present application, a solar cell is provided. The solar cell is manufactured by any one of the methods for manufacturing a solar cell.
[0014] The technical solution of the present application is applied to provide a method for manufacturing a solar cell. First, a substrate layer is provided, the substrate layer has a plurality of grooves arranged along a first direction and a second direction, two adjacent grooves are spaced, the first direction and the second direction intersect, and the first direction and the second direction are respectively perpendicular to the thickness direction of the substrate layer; then, a patterned mask is arranged on the surface of the substrate layer, the patterned mask has a plurality of openings arranged along the first direction, and one opening exposes a plurality of grooves; then, a first metal plating layer is formed in each opening using the patterned mask as a mask; finally, a second metal plating layer and a third metal plating layer are sequentially formed on the side of the first metal plating layer away from the substrate layer. This solution uses a patterned mask to directly grow the required seed layer on the substrate layer, replacing the use of an ink mask in the prior art, avoiding the problem that a large amount of organic matter is mixed in the metal plating layer and the conductivity of the metal plating layer is reduced due to the decomposition of ink in the plating solution during the electroplating process; since the formed first metal plating layer has been patterned, there is no need to perform reverse etching after electroplating, and compared with the prior art, the steps of forming an ink mask, demolding and reverse etching are reduced, which greatly reduces the length of the process path, thereby improving the production yield of solar cells. The invention solves the technical problem that the manufacturing method of solar cells in the prior art has a long process path leading to low yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0016] Figure 1 A schematic diagram of a process of manufacturing a solar cell provided in accordance with an embodiment of the present application is shown;
[0017] Figure 2 A top view showing a process flow of a method for manufacturing a solar cell provided in accordance with an embodiment of the present application is shown;
[0018] Figure 3 A cross-sectional view showing a process flow of a method for manufacturing a solar cell provided according to an embodiment of the present application.
[0019] The above drawings include the following reference numerals:
[0020] 100, base layer; 101, groove; 102, first metal coating; 103, second metal coating; 104, third metal coating. DETAILED DESCRIPTION
[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0022] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.
[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present application described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0024] As introduced in the background technology, the manufacturing method of solar cells in the prior art has a long process path resulting in low yield. To solve the above problem, the embodiments of the present application provide a manufacturing method of a solar cell and a solar cell.
[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0026] Figure 1FIG. 1 is a flow chart of a method for manufacturing a solar cell according to an embodiment of the present application. Figure 1 As shown, the method comprises the following steps:
[0027] Step S201, providing a base layer, wherein the base layer has a plurality of grooves arranged along a first direction and a second direction, respectively, and there is a gap between two adjacent grooves, the first direction and the second direction intersect, and the first direction and the second direction are respectively perpendicular to the thickness direction of the base layer;
[0028] Specifically, the base layer is the crystalline silicon cell to be electroplated, and the grooves may be spaced equally or unequally.
[0029] Step S202, disposing a patterned mask on the surface of the base layer, wherein the patterned mask has a plurality of openings arranged along the first direction, and one of the openings exposes the plurality of grooves;
[0030] Specifically, a silicon layer (Si), a silicon nitride layer (SiNx), an aluminum oxide (AlOx) and a silicon oxide layer (SiO2) can be used as a non-conductive insulating mask layer, which can be realized by a vacuum magnetron sputtering process or a chemical vapor deposition process. The above-mentioned patterned mask is formed by using laser patterning technology, which can reduce process steps, improve accuracy, and reduce the use of materials.
[0031] Step S203, using the patterned mask as a mask, forming a first metal plating layer in each of the openings;
[0032] Specifically, the above-mentioned first metal coating can be used as a seed layer in a solar cell. The seed layer can improve the adhesion characteristics and electrical properties between the metal electrode and the battery, and enhance the bonding force between the electrode and the battery. In addition, the seed layer can also serve as a barrier layer to prevent the metal ions in the electrode from diffusing into the silicon of the battery, avoid the metal ions from forming deep energy level acceptor impurities in the silicon, and reduce damage to the battery performance. Furthermore, the seed layer can improve the conductivity of the area to be plated, provide an electric potential for the electroplated metal, and facilitate the uniform electroplating of the solar cell. The material of the first metal coating can be prepared using metal copper, nickel, titanium, tungsten, and copper-nickel alloys.
[0033] Step S204 , forming a second metal coating layer and a third metal coating layer in sequence on a side of the first metal coating layer away from the base layer.
[0034] Specifically, the second metal coating and the third metal coating can be formed in sequence by electroplating. The second metal coating is used to form a grid line with conductive properties, and the third metal coating is used to prevent oxidation and corrosion of the second metal coating. In practical applications, the method can be applied to the electroplating of bifacial cells.
[0035] Through this embodiment, a method for manufacturing a solar cell is provided. First, a base layer is provided, the base layer has a plurality of grooves arranged along a first direction and a second direction, two adjacent grooves are spaced apart, the first direction and the second direction intersect, and the first direction and the second direction are respectively perpendicular to the thickness direction of the base layer; then, a patterned mask is formed on the surface of the base layer, the patterned mask has a plurality of openings arranged along the first direction, and one opening exposes a plurality of grooves; then, a first metal plating layer is formed in each opening; finally, a second metal plating layer and a third metal plating layer are sequentially formed on a side of the first metal plating layer away from the base layer. First, this solution uses a patterned mask to directly grow the required seed layer on the base layer, replacing the use of an ink mask in the prior art. In the subsequent electroplating process, this prevents the ink from decomposing in the electroplating solution, causing a large amount of organic matter to be mixed in the metal coating, reducing the conductivity of the metal coating, thereby making the conductivity of the metal coating better. Secondly, since a patterned mask is formed before forming the first metal coating, the first metal coating has been patterned and no reverse etching is required after electroplating. Compared with the prior art solution of reverse etching after electroplating, this solution reduces the steps of forming an ink mask, demolding, and reverse etching, greatly reducing the length of the process path, thereby improving the production yield of solar cells, thereby solving the technical problem of low yield caused by the long process path of the prior art method for producing solar cells.
[0036] In a specific implementation process, the above step S201 can be implemented by the following steps: step S2021, providing a preliminary base layer, the above preliminary base layer at least includes a polysilicon layer and a silicon nitride layer stacked in sequence; step S2022, removing part of the silicon nitride layer to expose part of the polysilicon layer, and the remaining polysilicon layer and the silicon nitride layer form the above base layer. This method can further accurately form the above base layer.
[0037] Specifically, one of laser, etching slurry and ion etching can be used to remove the silicon nitride layer to form multiple discontinuous grooves. Among them, laser is used to drill holes or grooves on the back of the silicon wafer, and part of the film layer on the surface is penetrated to expose the silicon substrate; laser ablation technology can locate the optimal energy density distribution, accurately control the laser action time, and ensure that each pulse is strictly consistent. The etching slurry contains an aqueous matrix resin, an aqueous thickening resin, a filler and an acid solution. The aqueous matrix resin does not basically become thinner after high-temperature baking and is acid-resistant. The preparation method of the etching slurry includes mixing the aqueous matrix resin, the aqueous thickening resin, the filler and the acid solution and the optional solvent and additives to obtain the etching slurry. Compared with traditional laser etching, photoresist wet etching and masking ink wet etching, the use of a specific etching slurry for etching and grooving is faster and will not damage the amorphous silicon substrate; the cost is lower, the process is simpler, and the etching slurry residue is less. Ion etching is a micro-nano processing technology that uses ion beams to process the surface of materials to achieve etching and changes to micro-nano structures. The basic principle of ion etching is to irradiate the ion beam onto the surface of the material, and use the impact force and energy of the ions to knock out the surface atoms or molecules, thereby changing the morphology and chemical composition of the material surface. The following are the specific steps of ion etching: First, place the sample to be etched in a vacuum chamber, and then introduce the reactive gas into the vacuum chamber. Use electrodes to apply an electric field to generate plasma. The electric field accelerates the ions in the plasma to the substrate, causing chemical reactions and physical sputtering on the surface. The plasma is composed of a mixture of ions, free electrons, and neutral particles. The electric field accelerates the ions in the plasma to the substrate, causing chemical reactions and physical sputtering on the surface.
[0038] In order to further improve the yield rate in the process of manufacturing the above-mentioned solar cells, the diameter range of the above-mentioned grooves along the above-mentioned first direction or the above-mentioned second direction is 5-1000μm, the depth range of the above-mentioned grooves is 0.1-2μm, and the spacing range between two adjacent above-mentioned grooves in the above-mentioned first direction or the above-mentioned second direction is 20-50μm.
[0039] Specifically, the solar cell can be a monocrystalline silicon solar cell, a polycrystalline silicon solar cell, a Passivated Emitter Rear Cell (PERC cell), a Tunnel Oxide Passivated Contact (TOPCon cell), a crystalline silicon heterojunction solar cell (HIT cell), and an interdigitated back contact cell (IBC cell). The main structural components of a conventional solar cell include an upper electrode, an anti-reflection film, a diffusion region, a substrate, a back reflection, and a lower electrode. The upper electrode is used to form an ohmic contact and guide current; the anti-reflection film is used to reduce the reflection of incident light and increase the short-circuit current; the diffusion region and the substrate are mainly involved in the photoelectric effect; the back reflection is used to increase the absorption of long waves; and the lower electrode is used to form an ohmic contact and guide current. In the depth direction of the groove, the groove extends to the diffusion region and the substrate to provide for the connection of the subsequent first metal coating, further improving the bonding strength between the metal coating and the solar cell.
[0040] In some embodiments, the material of the patterned mask is a non-magnetic material, and the thickness of the patterned mask is in the range of 0.1 to 2 cm. The above configuration further improves the yield rate in the process of manufacturing the solar cell.
[0041] Specifically, in the production of patterned masks for solar cells, the selection of non-magnetic materials can avoid electromagnetic interference to the cells and production equipment, while ensuring the compatibility of the mask material with the cells and that the cells will not be damaged during subsequent processing. In practical applications, materials such as wax, polymer materials, graphene, and amorphous silicon can be used as the materials for the patterned masks.
[0042] In some embodiments, the material of the first metal coating layer includes at least one of aluminum, titanium, copper, silver and gold. The method can further improve the performance of the solar cell by selecting the material of the first metal coating layer.
[0043] In practical applications, solar cells using an aluminum seed layer show higher efficiency than those using other materials. The first metal coating layer made of a metal alloy material can have good adhesion and low contact resistance, which can effectively improve the fill factor and conversion efficiency of the solar cell.
[0044] In some other embodiments, the above step S203 can be implemented by the following steps: Step S2031, sequentially forming multiple conductive seed layers in each of the above openings to obtain the above first metal plating layer. This method can further improve the electroplating quality and electroplating efficiency, thereby further improving the yield of solar cells.
[0045] Specifically, since the PVD process can generally only achieve a coverage effect of about 1% of the metal layer, the seed layer must have a certain thickness to ensure the quality of the electroplating filling process. The structure of the seed layer can be optimized through the conductive seed layer, which can ensure the effective implementation of the subsequent electroplating process. In addition, the local preparation of a multi-layer conductive seed layer can save the seed layer etching step, reduce process steps and costs. In practical applications, the first metal plating layer can grow 1-5 conductive seed layers according to actual conditions, so that it can flexibly adapt to different process requirements and battery designs, and optimize battery performance. Taking copper electroplating as an example, the specific steps of the above electroplating are as follows: immerse the battery cell in the copper sulfate solution of the electroplating equipment, power on for electrolysis, copper ions are reduced, and copper is deposited on the surface of the battery that needs to be copper plated to form a copper electrode.
[0046] In another specific embodiment, the thickness of the second metal coating is in the range of 5 to 30 μm, and the material of the second metal coating includes at least one of copper and nickel. The above configuration can further reduce the manufacturing cost of solar cells and improve the efficiency of solar cells.
[0047] Specifically, the thickness of the second metal coating, i.e., the grid line, will affect the series resistance of the battery, and thus affect the power loss. Thicker grid lines can reduce resistance and power loss, but at the same time they will also increase the shading area and affect the photocurrent output. Therefore, the thickness of the above-mentioned second metal coating should not be too large or too small. In addition, the use of copper and nickel to replace the precious metal silver can greatly reduce the cost of raw materials. Moreover, the use of copper and nickel electroplating can achieve finer grid lines and lower contact resistance, reduce grid line shadows, and improve the photoelectric conversion efficiency of the battery. And due to the good electrical conductivity of copper and nickel, the electrical conductivity of the battery can be further improved.
[0048] In some other embodiments, the thickness of the third metal coating is in the range of 1 to 3 μm, and the material of the third metal coating includes at least one of tin and nickel.
[0049] Specifically, tin and nickel have good protective properties, providing good corrosion resistance and wear resistance to the second metal plating layer, while also helping to reduce the operating temperature of the battery, thereby improving the efficiency of the component.
[0050] The first metal coating fills each of the grooves. This method can further enhance the bonding strength between the second metal coating and the solar cell.
[0051] Specifically, by filling the grooves of the base layer with the first metal coating layer, the stability of the first metal coating layer can be improved, thereby increasing the bonding force between the second metal coating layer and the solar cell.
[0052] In order to enable those skilled in the art to more clearly understand the technical solution of the present application, the implementation process of the method for manufacturing a solar cell of the present application will be described in detail below in conjunction with specific embodiments.
[0053] This embodiment relates to a specific method for manufacturing a solar cell. Figure 2 and Figure 3 As shown, the following steps are included:
[0054] Step S1: providing a base layer 100, wherein the base layer 100 has a plurality of grooves 101 arranged along a first direction D1 and a second direction D2, respectively, and there is a gap between two adjacent grooves 101, the first direction D1 and the second direction D2 intersect, and the first direction D1 and the second direction D2 are respectively perpendicular to the thickness direction of the base layer 100;
[0055] Step S2: forming a patterned mask on the surface of the base layer 100, wherein the patterned mask has a plurality of openings arranged along the first direction D1, wherein one of the openings exposes a plurality of the grooves 101, and a first metal plating layer 102 is formed in each of the openings;
[0056] Step S3: forming a second metal coating layer 103 on a side of the first metal coating layer 102 away from the base layer 100;
[0057] Step S4: forming a third metal coating layer 104 on a side of the second metal coating layer 103 away from the first metal coating layer 102 .
[0058] Example 1
[0059] Embodiment 1 provides a method for preparing a solar cell, wherein the solar cell is a TOPCon cell, and the method comprises the following steps:
[0060] Step S11: providing a base layer, the base layer having a plurality of grooves arranged along a first direction and a second direction respectively, the first direction and the second direction intersect, the first direction and the second direction are respectively perpendicular to the thickness direction of the base layer, the diameter of the groove is 500 μm, the depth range of the groove is 1 μm, and the distance range between two adjacent grooves is 35 μm;
[0061] Step S12: a patterned mask is arranged on the surface of the base layer, wherein the patterned mask has a plurality of openings arranged along the first direction, one of the openings exposes the plurality of grooves, the material of the patterned mask is a non-magnetic material, and the thickness of the patterned mask is 1 cm;
[0062] Step S13: using the patterned mask as a mask, forming a first metal plating layer with a thickness of 1 μm in each of the openings, wherein the material of the first metal plating layer is nickel;
[0063] Step S14: forming a second metal plating layer with a thickness of 10 μm on a side of the first metal plating layer away from the base layer, wherein the material of the second metal plating layer is copper;
[0064] Step S15: forming a third metal coating layer with a thickness of 2 μm on a side of the second metal coating layer away from the first metal coating layer, wherein the material of the third metal coating layer is tin.
[0065] Example 2
[0066] Embodiment 2 provides a method for preparing a solar cell, wherein the solar cell is a HIT cell, and the method comprises the following steps:
[0067] Step S21: providing a base layer, the base layer having a plurality of grooves arranged along a first direction and a second direction, the first direction and the second direction intersect, the first direction and the second direction are respectively perpendicular to the thickness direction of the base layer, the diameter of the groove is 1000 μm, the depth range of the groove is 2 μm, and the distance range between two adjacent grooves is 50 μm;
[0068] Step S32: a patterned mask is arranged on the surface of the base layer, wherein the patterned mask has a plurality of openings arranged along the first direction, one of the openings exposes the plurality of grooves, the material of the patterned mask is a non-magnetic material, and the thickness of the patterned mask is 2 cm;
[0069] Step S23: using the patterned mask as a mask, forming a first metal plating layer with a thickness of 2 μm in each of the openings, wherein the material of the first metal plating layer is silver;
[0070] Step S24: forming a second metal plating layer with a thickness of 30 μm on a side of the first metal plating layer away from the base layer, wherein the material of the second metal plating layer is nickel;
[0071] Step S25: forming a third metal coating layer with a thickness of 1 μm on a side of the second metal coating layer away from the first metal coating layer, wherein the material of the third metal coating layer is nickel.
[0072] Example 3
[0073] Embodiment 3 provides a method for preparing a solar cell, wherein the solar cell is an IBC cell, and the method comprises the following steps:
[0074] Step S31: providing a base layer, the base layer having a plurality of grooves arranged along a first direction and a second direction respectively, the first direction and the second direction intersect, the first direction and the second direction are respectively perpendicular to the thickness direction of the base layer, the diameter of the groove is 400 μm, the depth range of the groove is 0.2 μm, and the distance range between two adjacent grooves is 40 μm;
[0075] Step S32: a patterned mask is arranged on the surface of the base layer, wherein the patterned mask has a plurality of openings arranged along the first direction, one of the openings exposes the plurality of grooves, the material of the patterned mask is a non-magnetic material, and the thickness of the patterned mask is 1.5 cm;
[0076] Step S33: using the patterned mask as a mask, forming a first metal plating layer with a thickness of 0.2 μm in each of the openings, wherein the material of the first metal plating layer is copper;
[0077] Step S34: forming a second metal plating layer with a thickness of 20 μm on a side of the first metal plating layer away from the base layer, wherein the material of the second metal plating layer is copper;
[0078] Step S35: forming a third metal coating layer with a thickness of 3 μm on a side of the second metal coating layer away from the first metal coating layer, wherein the material of the third metal coating layer is tin.
[0079] The embodiment of the present application also provides a solar cell, which is manufactured by any of the above-mentioned methods for manufacturing solar cells, and the solar cell comprises a base layer, a first metal coating layer, a second metal coating layer and a third metal coating layer stacked in sequence. The base layer has a plurality of grooves arranged along a first direction and a second direction, respectively, and there is a gap between two adjacent grooves, the first direction and the second direction intersect, and the first direction and the second direction are respectively perpendicular to the thickness direction of the base layer.
[0080] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.
[0081] From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:
[0082] The manufacturing method of the solar cell of the present application. First, a base layer is provided, the base layer has a plurality of grooves arranged along the first direction and the second direction respectively, two adjacent grooves have a gap, the first direction and the second direction intersect, and the first direction and the second direction are respectively perpendicular to the thickness direction of the base layer; then a patterned mask is formed on the surface of the base layer, the patterned mask has a plurality of openings arranged along the first direction, and one opening exposes a plurality of grooves; then, a first metal plating layer is formed in each opening; finally, a second metal plating layer and a third metal plating layer are sequentially formed on the side of the first metal plating layer away from the base layer. This scheme adopts a patterned mask to grow the required seed layer directly on the base layer, replacing the use of the ink mask in the prior art, avoiding the problem that the ink will decompose in the electroplating solution during the electroplating process, causing a large amount of organic matter to be mixed in the metal plating layer, and reducing the conductivity of the metal plating layer; since the formed first metal plating layer has been patterned, there is no need to perform reverse etching after electroplating, which reduces the steps of forming the ink mask, demolding and reverse etching compared with the prior art, greatly reducing the length of the process path, thereby improving the production yield of solar cells. The invention solves the technical problem that the manufacturing method of solar cells in the prior art has a long process path leading to low yield.
[0083] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A method for manufacturing a solar cell, characterized in that: include: Providing a base layer, the base layer having a plurality of grooves arranged along a first direction and a second direction respectively, two adjacent grooves having a gap, the first direction and the second direction intersecting, the first direction and the second direction being respectively perpendicular to a thickness direction of the base layer; A patterned mask is arranged on the surface of the base layer, wherein the patterned mask has a plurality of openings arranged along the first direction, and one of the openings exposes a plurality of the grooves; Using the patterned mask as a mask, forming a first metal plating layer in each of the openings; A second metal plating layer and a third metal plating layer are sequentially formed on a side of the first metal plating layer away from the base layer.
2. The method according to claim 1, characterized in that Provides a base layer including: Providing a preliminary base layer, the preliminary base layer at least comprising a polysilicon layer and a silicon nitride layer stacked in sequence; A portion of the silicon nitride layer is removed to expose a portion of the polysilicon layer, and the remaining polysilicon layer and the silicon nitride layer form the base layer.
3. The method according to claim 1, characterized in that The diameter of the groove along the first direction or the second direction ranges from 5 to 1000 μm, the depth of the groove ranges from 0.1 to 2 μm, and the distance between two adjacent grooves in the first direction or the second direction ranges from 20 to 50 μm.
4. The method according to claim 1, characterized in that: The material of the patterned mask is a non-magnetic material, and the thickness of the patterned mask is in the range of 0.1 to 2 cm.
5. The method according to claim 1, characterized in that: The material of the first metal plating layer includes at least one of aluminum, titanium, copper, silver and gold.
6. The method according to claim 1, characterized in that Forming a first metal plating layer in each of the openings, comprising: A plurality of conductive seed layers are sequentially formed in each of the openings to obtain the first metal plating layer.
7. The method according to claim 1, characterized in that The thickness of the second metal coating is in the range of 5 to 30 μm, and the material of the second metal coating includes at least one of copper and nickel.
8. The method according to claim 1, characterized in that The thickness of the third metal plating layer is in the range of 1 to 3 μm, and the material of the third metal plating layer includes at least one of tin and nickel.
9. The method according to claim 1, characterized in that: The first metal plating layer fills the grooves.
10. A solar cell, characterized in that: The solar cell is manufactured by the method for manufacturing a solar cell according to any one of claims 1 to 9.