Spray rolling preparation method of copper alloy strip and spray rolling preparation device for implementing method

Abstract

The invention discloses a spray rolling preparation method of a copper alloy strip. The spray rolling preparation method comprises the following steps: S101, a smelting process: smelting copper alloy serving as a raw material; wherein the smelting temperature ranges from 1100 DEG C to 1300 DEG C; the smelted liquid copper alloy is atomized and then sprayed to a roller in a deposition cavity, a molten-state spraying deposition body is formed, and the spraying deposition distance ranges from 400 mm to 600 mm; s103, rolling process: rolling the copper alloy subjected to spray co-deposition to obtain a plate blank; and S104, the rolled plate blank is subjected to a follow-up treatment process, and the copper alloy strip is obtained. The invention further discloses a spray rolling preparation device for the copper alloy strip. According to the method and the device, the copper alloy strip is prepared through the spray co-deposition superposition rolling technology, grains of the copper alloy strip are refined, the strength and the electric conductivity of the copper alloy strip are improved, composition segregation is reduced, and continuous production is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of copper alloy strip preparation, and in particular relates to a spray-rolling preparation method for a copper alloy strip and a spray-rolling preparation device for implementing the method. Background Art

[0002] With the development of high-tech industries, the demand for copper alloy materials is growing, especially in the fields of electronic information, aerospace, high-speed rail transportation, etc. Copper alloys play an important role in these fields due to their excellent electrical conductivity, thermal conductivity, corrosion resistance and machinability.

[0003] At present, the common methods for preparing copper alloy strips mainly include: melt casting deformation method, powder metallurgy method, rapid solidification method (spray deposition), and electrochemical deposition method. However, these methods all have obvious shortcomings. The melt casting deformation method is prone to serious segregation; the powder metallurgy method has a complex process, high cost, and low production efficiency; the blanks prepared by the rapid solidification method are limited in size and have problems with surface quality. 2 O 3 Limited by the size of the depositor and the deposition distance, the material performance obtained by electrochemical deposition is poor.

[0004] Therefore, developing a copper alloy strip processing method with low energy consumption and high resource utilization is of great significance for the engineering application of copper alloy strip. Summary of the invention

[0005] Based on this, and in view of the above-mentioned deficiencies in the prior art, a method for preparing a copper alloy strip by spraying and a device for preparing the copper alloy strip by spraying and rolling are provided.

[0006] In order to achieve the above purpose, the following technical solutions are adopted: The present invention provides a method for preparing a copper alloy strip by spraying, comprising the following steps: S101, smelting process: using copper alloy as raw material for smelting; wherein the smelting temperature is 1100°C~1300°C; S102, spray co-deposition process: the smelted liquid copper alloy is sprayed onto the roller in the deposition chamber after atomization to form a molten spray deposition body, and the spray deposition distance is 400 mm to 600 mm; S103, rolling process: rolling the spray-co-deposited copper alloy to obtain a slab; S104, subjecting the rolled slab to subsequent processing to obtain a copper alloy strip.

[0007] In some embodiments, the smelting process of step S101 includes: using the copper alloy as the raw material for vacuum smelting, wherein the smelting time is 3h~6h, the vacuum degree is 10-2 Pa~10 -1 Pa, stirring is carried out during the smelting process.

[0008] In some embodiments, during the spray co-deposition process of step S102, the cooling rate of the atomized liquid copper alloy sprayed onto the roller in the deposition chamber is 10 2 ~10 4 K / s.

[0009] In some embodiments, during the spray co-deposition process of step S102, the smelted liquid copper alloy is atomized into small liquid droplets and then sprayed onto the roller in the deposition chamber through a nozzle to form a molten spray deposition body; Among them, the spray angle of the atomized liquid droplets is 10°~30°, and the deposition chamber uses inert gas to maintain the pressure in the chamber at 0.8MPa~0.95MPa.

[0010] In some embodiments, the spray deposition distance is the distance from the nozzle to the roller.

[0011] In some embodiments, during the rolling process of step S103, the copper alloy after spray co-deposition is rolled on a rolling mill with a roller linear speed of 1-5 r / s and a roller diameter of 700-1000 mm, and then the slab is completely separated from the roller by gas cooling.

[0012] In some embodiments, the slab obtained by rolling has a width of 150-300 mm and a thickness of 5-10 mm.

[0013] The present invention also provides a spray-rolling preparation device for a copper alloy strip, wherein the spray-rolling preparation device implements the spray-rolling preparation method for the copper alloy strip as described above, and the spray-rolling preparation device comprises: Liquid copper alloy container; at least one atomizer, which is disposed below the liquid alloy container and is in communication with the liquid alloy container, and is capable of atomizing the liquid alloy in the liquid alloy container and then spraying it out; A rolling mill group, the rolling mill group comprising at least two symmetrically arranged rolls, the at least two rolls rotating towards each other; A cooling device is provided at the bottom of the rolling roller to cool the slab after being rolled from the rolling roller.

[0014] In some embodiments, the at least one atomizer is disposed above the roller, the at least one atomizer comprises a nozzle, and the distance between the nozzle and the roller is a spray deposition distance, and the spray deposition distance is 400 mm to 600 mm.

[0015] In some embodiments, the nozzle of the at least one atomizer is set at a spray angle of 10-30°.

[0016] The present invention has the following beneficial technical effects: The method and device of the present invention prepare copper alloy strips by using the spray co-deposition superimposed rolling technology, and control the cooling rate of the atomized liquid copper alloy sprayed onto the rollers in the deposition chamber by controlling the melting temperature at 1100°C to 1300°C and the spray deposition distance at 400mm to 600mm, so that the obtained copper alloy strips have refined grains, improved strength, improved conductivity, and reduced component segregation; and through the roller rolling method of the spray rolling preparation device, the slab can be continuously rolled without considering the size limitation of the depositor, thereby realizing continuous production. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a flow chart of the method for preparing the copper alloy strip by spraying and rolling of the present invention; Figure 2 It is a schematic diagram of the spray rolling preparation device of the copper alloy strip of the present invention.

[0019] Reference numerals 1. Spray deposition body; 2. Thermocouple; 3. Crucible; 4. Roller; 5. Roller surface cleaning knife; 6. Steering tensioning device; 7. Nozzle; 8. Deposition chamber; 9. Liquid copper alloy; R, spray deposition distance. DETAILED DESCRIPTION

[0020] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0021] It should be understood that the embodiments of the present invention shown in the exemplary embodiments are only illustrative. Although only a few embodiments are described in detail in the present invention, it is easy for those skilled in the art to appreciate that multiple modifications are feasible without actually departing from the teaching of the subject matter of the present invention. Accordingly, all such modifications should be included within the scope of the present invention. Without departing from the gist of the present invention, other replacements, modifications, changes and deletions may be made to the design, operating conditions and parameters of the following exemplary embodiments.

[0022] Based on the above objectives, a first aspect of an embodiment of the present invention provides a method for preparing a copper alloy strip by spraying. Figure 1 Shown is a schematic flow chart of the method. Figure 2 It is a schematic diagram of a spray-rolling preparation device for implementing the method.

[0023] The spraying preparation method of the copper alloy strip comprises the following steps: S101, smelting process: using copper alloy as raw material for smelting; wherein the smelting temperature is 1100°C~1300°C; S102, spray co-deposition process: the smelted liquid copper alloy is sprayed onto the roller 4 in the deposition chamber 8 after atomization to form a molten spray deposition body 1, and the spray deposition distance R is 400 mm to 600 mm; S103, rolling process: rolling the spray-co-deposited copper alloy to obtain a slab; S104, subjecting the rolled slab to subsequent processing to obtain a copper alloy strip; the subsequent processing includes finishing rolling, heat treatment, coiling and other subsequent processing according to product requirements.

[0024] In a preferred embodiment of the present invention, the smelting process of step S101 includes: vacuum smelting with copper alloy as raw material and the rest as inevitable impurities, wherein the smelting temperature is 1100°C to 1300°C, the smelting time is 3h to 6h, and the vacuum degree is 10 -2 Pa~10 -1 Pa, stirring is performed during the smelting process. Among them, copper alloy is a copper alloy with a wide solid-liquid phase region. Mechanical stirring is generally used for stirring.

[0025] In a preferred embodiment of the present invention, during the spray co-deposition process of step S102, the cooling rate of the atomized liquid copper alloy sprayed onto the roller 4 in the deposition chamber 8 is 10 2 ~10 4 K / s.

[0026] In the spray co-deposition process of step S102, the smelted liquid copper alloy is atomized into liquid droplets and then sprayed onto the roller 4 in the deposition chamber 8 through the nozzle 7 to form a molten spray deposition body 1; The spray angle of the atomized liquid droplets is 10° to 30°, and the deposition chamber 8 uses an inert gas to maintain the pressure in the chamber at 0.8 MPa to 0.95 MPa.

[0027] The spray deposition distance R is the distance from the nozzle 7 to the roller 4. This distance is the shortest straight line distance from the nozzle 7 to the roller 4, such as Figure 2As shown. The spray deposition distance R is 400mm~600mm, preferably 450mm~550mm; when the spray deposition distance is less than 400mm, the droplet cooling effect is insufficient due to the insufficient spray deposition distance, and the final copper alloy strip has large grain refinement, reduced strength and easy segregation; when the spray deposition distance is greater than 600mm, the spray deposition distance is too long, and the droplets solidify into solid metal powder when reaching the roller surface. After the roller 4 is compacted, the porosity is too high, which makes the strip low in toughness and there is a risk of strip breakage.

[0028] The reason why the copper alloy strip obtained by the method and device of the present invention has fine grains, improved strength, improved conductivity, and reduced component segregation is: In the process of spray co-deposition, the small metal droplets can transfer heat through the convection and radiation of the high-speed gas in the cavity and the roller at room temperature. In addition, the spray deposition distance is controlled to be 400mm~600mm, so that the cooling rate of the atomized liquid copper alloy sprayed onto the roller in the deposition cavity can be controlled within 10 2 ~10 4 K / s, thus having a higher cooling rate than ordinary casting processes, and obtaining a microcrystalline structure with fine grains and no macroscopic segregation, thereby increasing the strength of the alloy and improving the performance of its electrode. Increasing the cooling rate can inhibit segregation to a certain extent, inhibit the formation of coarse solidification dendrites, and reduce the difficulty of subsequent homogenization annealing.

[0029] In a preferred embodiment of the present invention, during the rolling process of step S103, the copper alloy after spray co-deposition is rolled on a rolling mill with a roller 4 linear speed of 1-5 r / s, the roller 4 diameter is 700-1000 mm, and then the slab is completely separated from the roller 4 by gas cooling. The length of the roller 4 is not limited and can be adjusted according to the size of the deposition chamber 8. The roller 4 is preferably made of metal, and the metal roller 4 can better conduct heat and promote the cooling of the spray deposited body 1.

[0030] In a preferred embodiment of the present invention, the slab width obtained by rolling is 150-300 mm and the thickness is 5-10 mm. The reason for the thickness of 5-10 mm is that the slab of this thickness can be cooled quickly, saving process time.

[0031] like Figure 2 As shown, in a second aspect of the embodiment of the present invention, a spray-rolling preparation device for a copper alloy strip is provided. The spray-rolling preparation device implements the spray-rolling preparation method for the copper alloy strip as described above. The spray-rolling preparation device comprises: The liquid copper alloy container is preferably a crucible 3 , in which the liquid copper alloy 9 is contained; a thermocouple 2 is placed in the crucible 3 for heating.

[0032] At least one atomizer, Figure 2 Only one atomizer is shown. In other embodiments, there may be two or more atomizers. The atomizer is disposed below the crucible 3 and is connected to the crucible 3 to atomize the liquid copper alloy and then spray it out. The rolling mill group includes two symmetrically arranged rollers 4, which rotate towards each other; a roller surface cleaning knife 5 is arranged at the lower end of the side of each roller 4, which is used to clean the residue on the roller surface of the roller 4. A steering tensioning device 6 is arranged at the lower end of the roller 4.

[0033] A cooling device is provided at the lower part of the roll 4 to cool the slab after rolling from the roll 4. Figure 2 As shown, the cooling device is gas cooling, and the gas used can be an inert gas.

[0034] The atomizer is arranged above the roller 4. The atomizer comprises a nozzle 7. The nozzle 7 is spaced a certain distance from the roller 4. The distance is the spray deposition distance R. The spray deposition distance is 400 mm to 600 mm.

[0035] The spray angle of the nozzle 7 of the atomizer is set to 10-30°.

[0036] Through the roller rolling method of the spraying and rolling preparation device, the slab can be rolled continuously without considering the size limitation of the depositor, so as to realize continuous production. The process of spraying co-deposition + rolling has a short manufacturing cycle and high efficiency. Compared with powder metallurgy, it eliminates the processes of powder storage, transportation, pressing, sintering, etc.; compared with casting metallurgy, the thickness of the billet is greatly reduced, eliminating a series of subsequent processing of the casting mold and the casting billet. Compared with simple spraying and co-deposition, the material size is not limited, which overcomes the disadvantage that the strip throwing can only prepare small-sized amorphous thin strips. In addition, spraying can control the flow rate and effectively reduce the loss of materials. It solves the strip throwing problem and size limitation caused by the rapid solidification of the strip.

[0037] The present invention is further illustrated by the following examples.

[0038] The copper alloy prepared by "melting and casting" in the following comparative example is prepared by the method of the prior art, so it is not specifically limited in the present invention. The brief steps are: 1. Smelting process: smelting the copper alloy as the raw material; 2. Casting into copper ingots through a mold; 3. Performing subsequent treatments such as fine rolling, heat treatment, and coiling according to product requirements.

[0039] σ b / MPa is the tensile strength, the unit is megapascal (MPa). b) is an important indicator of the mechanical properties of materials, indicating the maximum load-bearing capacity of materials under static tensile conditions. When metal materials are subjected to tension, they will undergo a transition from uniform plastic deformation to local concentrated plastic deformation. In this process, tensile strength reflects the maximum tensile stress that the material can withstand before tensile fracture. Specifically, tensile strength refers to the maximum stress value that the specimen withstands before breaking, that is, the stress value obtained by dividing the specimen by the original cross-sectional area during the breaking process.

[0040] σ s / MPa represents the yield strength of the material, in megapascals (MPa). Yield strength refers to the minimum stress value at which the material begins to produce plastic deformation when subjected to external force. For materials without obvious yield phenomenon, the stress value that produces 0.2% residual deformation is usually used as its yield strength, also known as conditional yield limit or yield strength. This parameter is an important indicator for evaluating the material's ability to resist trace plastic deformation. External forces greater than the yield strength will cause the part to fail permanently and cannot be restored to its original state.

[0041] Conductivity / %IACS is an important indicator to measure the conductivity of materials. The larger the value, the better the conductivity. %IACS is a percentage of the International Annealed Copper Standard, which is a unit of conductivity. This standard is based on the conductivity of international annealed copper as a reference, which is defined as 100%IACS. For other metal materials, their conductivity can be calculated by comparing it with the conductivity of international annealed copper and converting it into a %IACS value. In practical applications, a high %IACS value means that the material has better electron transfer efficiency and conductivity, which is very important for applications that require high-quality, high-conductivity metal materials. Therefore, when selecting alloy materials, people usually tend to choose materials with higher %IACS values.

[0042] Example 1 (1) Melting The cathode copper and Cu-10Be master alloy were used as raw materials, and the rest were inevitable impurities. Vacuum melting was carried out at a melting temperature of 1100°C, a melting time of 4h, and a vacuum degree of 10. -1 Pa, and mechanical stirring is performed at the same time, and finally a Cu-3Be alloy is prepared. Among them, Cu-10Be means that the content of beryllium (Be) in the alloy is 10%, and Cu-3Be means that the content of beryllium (Be) in the alloy is 3%.

[0043] (2) Spraying co-deposition + rolling The liquid alloy is atomized into small liquid droplets by a gas atomizer and sprayed into the deposition chamber. The inert gas pressure is maintained at 0.9 MPa and the inclination angle of the atomizer nozzle is 20°. The small droplets collide with the cast iron roll to form a molten spray deposition body. The spray deposition distance is 400 mm and the roll linear speed is 2 r / s. After gas cooling, the slab is completely separated from the roll to obtain a Cu-3Be slab with a strip width of 200 mm and a thickness of 6 mm.

[0044] (3) Strip preparation Follow-up processing such as finishing rolling, heat treatment and coiling is carried out according to product requirements.

[0045] Table 1. Comparison of properties of Cu-3Be alloy strips prepared by different preparation methods after aging

[0046] Example 2 (1) Melting Using cathode copper, pure nickel block and pure tin block as raw materials, and the rest as inevitable impurities, vacuum smelting was carried out at a smelting temperature of 1300°C, a smelting time of 4h, and a vacuum degree of 10 -1 Pa, and mechanical stirring is performed at the same time, and finally a Cu-15Ni-8Sn alloy is prepared. Cu-15Ni-8Sn means that the content of Ni in the alloy is 15% and the content of Sn is 8%.

[0047] (2) Spray co-deposition rolling The liquid alloy is atomized into small liquid droplets by a gas atomizer and sprayed into the deposition chamber. The inert gas pressure is maintained at 0.9 MPa. The inclination angle of the atomizer nozzle is 20°. The small droplets collide with the cast iron roll to form a molten spray deposition body. The spray deposition distance is 600 mm and the roller linear speed is 2 r / s. After gas cooling, the slab is completely separated from the roll to obtain a strip. A Cu-15Ni-8Sn slab with a strip width of 200 mm and a thickness of 6 mm is obtained.

[0048] (3) Strip preparation Follow-up processing such as finishing rolling, heat treatment and coiling is carried out according to product requirements.

[0049] Table 2. Comparison of properties of Cu-15Ni-8Sn alloy strips prepared by different preparation methods after aging

[0050] Example 3 (1) Melting The cathode copper and Cu-20Ti master alloy were used as raw materials, and the rest were inevitable impurities. Vacuum smelting was carried out at a smelting temperature of 1200°C, a smelting time of 4h, and a vacuum degree of 10 -1 Pa, and mechanical stirring was performed at the same time, and finally a Cu-3Ti alloy was prepared. Among them, Cu-20Ti means that the content of Ti in the alloy is 20%, and Cu-3Ti means that the content of Ti in the alloy is 3%.

[0051] (2) Spraying co-deposition + rolling The liquid alloy is atomized into small liquid droplets by a gas atomizer and sprayed into the deposition chamber. The inert gas pressure is maintained at 0.9 MPa. The inclination angle of the atomizer nozzle is 20°. The small droplets collide with the cast iron roll to form a molten spray deposition body. The spray deposition distance is 500 mm and the roll linear speed is 2 r / s. After gas cooling, the slab is completely separated from the roll to obtain a strip. A Cu-3Ti slab with a strip width of 200 mm and a thickness of 6 mm is obtained.

[0052] (3) Strip preparation According to product requirements, subsequent processing such as finishing rolling, heat treatment and coiling is carried out.

[0053] Table 3. Comparison of properties of Cu-3Ti alloy strips prepared by different preparation methods after aging

[0054] Example 4 (1) Melting The cathode copper and Cu-20Ti master alloy were used as raw materials, and the rest were inevitable impurities. Vacuum smelting was carried out at a smelting temperature of 1200°C, a smelting time of 3h, and a vacuum degree of 10 -2 Pa, and mechanical stirring was performed at the same time, and finally a Cu-3Ti alloy was prepared. Among them, Cu-20Ti means that the content of Ti in the alloy is 20%, and Cu-3Ti means that the content of Ti in the alloy is 3%.

[0055] (2) Spraying co-deposition + rolling The liquid alloy is atomized into small liquid droplets by a gas atomizer and sprayed into the deposition chamber. The inert gas pressure is maintained at 0.8 MPa. The inclination angle of the atomizer nozzle is 10°. The small droplets collide with the cast iron roll to form a molten spray deposition body. The spray deposition distance is 550 mm, and the roller linear speed is 5 r / s. After gas cooling, the slab is completely separated from the roll to obtain a strip. A Cu-3Ti slab with a strip width of 200 mm and a thickness of 6 mm is obtained.

[0056] (3) Strip preparation Follow-up processing such as finishing rolling, heat treatment and coiling is carried out according to product requirements.

[0057] Table 3. Comparison of properties of Cu-3Ti alloy strips prepared by different preparation methods after aging

[0058] Example 5 (1) Melting The cathode copper and Cu-20Ti master alloy were used as raw materials, and the rest were inevitable impurities. Vacuum smelting was carried out at a smelting temperature of 1200°C, a smelting time of 6 hours, and a vacuum degree of 10 -1 Pa, and mechanical stirring was performed at the same time, and finally a Cu-3Ti alloy was prepared. Among them, Cu-20Ti means that the content of Ti in the alloy is 20%, and Cu-3Ti means that the content of Ti in the alloy is 3%.

[0059] (2) Spraying co-deposition + rolling The liquid alloy is atomized into small liquid droplets by a gas atomizer and sprayed into the deposition chamber. The inert gas pressure is maintained at 0.95 MPa. The inclination angle of the atomizer nozzle is 30°. The small droplets collide with the cast iron roll to form a molten spray deposition body. The spray deposition distance is 450 mm, and the roller linear speed is 1 r / s. After gas cooling, the slab is completely separated from the roll to obtain a strip. A Cu-3Ti slab with a strip width of 200 mm and a thickness of 6 mm is obtained.

[0060] (3) Strip preparation Follow-up processing such as finishing rolling, heat treatment and coiling is carried out according to product requirements.

[0061] Table 3. Comparison of properties of Cu-3Ti alloy strips prepared by different preparation methods after aging

[0062] The above are exemplary embodiments disclosed in the present invention, but it should be noted that various changes and modifications may be made without departing from the scope of the embodiments disclosed in the claims. Although the elements disclosed in the embodiments of the present invention may be described or required in individual form, they may also be understood as multiple unless explicitly limited to the singular.

[0063] A person skilled in the art should understand that the discussion of any of the above embodiments is only exemplary and is not intended to imply that the scope of the disclosure of the embodiments of the present invention (including the claims) is limited to these examples; under the concept of the embodiments of the present invention, the technical features in the above embodiments or different embodiments can also be combined, and there are many other changes in different aspects of the above embodiments of the present invention, which are not provided in detail for the sake of simplicity. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present invention should be included in the protection scope of the embodiments of the present invention.

Claims

1. A method for preparing a copper alloy strip by spraying, characterized in that: The following steps are involved: S101, smelting process: using copper alloy as raw material for smelting; wherein the smelting temperature is 1100°C~1300°C; S102, spray co-deposition process: the smelted liquid copper alloy is sprayed onto the roller in the deposition chamber after atomization to form a molten spray deposition body, and the spray deposition distance is 400 mm to 600 mm; S103, rolling process: rolling the spray-co-deposited copper alloy to obtain a slab; S104, subjecting the rolled slab to subsequent processing to obtain a copper alloy strip.

2. The method for preparing a copper alloy strip by spraying according to claim 1, characterized in that: The smelting process of step S101 includes: using the copper alloy as raw material for vacuum smelting, wherein the smelting time is 3h~6h, the vacuum degree is 10 -2 Pa~10 -1 Pa, stirring is carried out during the smelting process.

3. The method for preparing a copper alloy strip by spraying according to claim 1, characterized in that: During the spray co-deposition process of step S102, the cooling rate of the atomized liquid copper alloy sprayed onto the roller in the deposition chamber is 10 2 ~10 4 K / s.

4. The method for preparing a copper alloy strip by spraying according to claim 1, characterized in that: In the spray co-deposition process of step S102, the smelted liquid copper alloy is atomized into small liquid droplets and then sprayed onto the roller in the deposition chamber through a nozzle to form a molten spray deposition body; Among them, the spray angle of the atomized liquid droplets is 10°~30°, and the deposition chamber uses inert gas to maintain the pressure in the chamber at 0.8MPa~0.95MPa.

5. The method for preparing a copper alloy strip by spraying according to claim 4, characterized in that: The spray deposition distance is the distance from the nozzle to the roller.

6. The method for preparing a copper alloy strip by spraying according to claim 4, characterized in that: During the rolling process of step S103, the copper alloy after spray co-deposition is rolled on a rolling mill with a roller linear speed of 1-5 r / s and a roller diameter of 700-1000 mm, and then the slab is completely separated from the roller by gas cooling.

7. The method for preparing a copper alloy strip by spraying according to claim 6, characterized in that: The width of the rolled slab is 150~300mm and the thickness is 5~10mm.

8. A spray rolling preparation device for copper alloy strip, characterized in that: The spray-rolling preparation device implements the spray-rolling preparation method for the copper alloy strip according to any one of claims 1 to 7, and the spray-rolling preparation device comprises: Liquid copper alloy container; at least one atomizer, which is disposed below the liquid alloy container and is in communication with the liquid alloy container, and is capable of atomizing the liquid alloy in the liquid alloy container and then spraying it out; A rolling mill group, the rolling mill group comprising at least two symmetrically arranged rolls, the at least two rolls rotating towards each other; A cooling device is provided at the bottom of the rolling roller to cool the slab after being rolled from the rolling roller.

9. The spray-rolling preparation device for copper alloy strip according to claim 8, characterized in that: The at least one atomizer is disposed above the roller, the at least one atomizer comprises a nozzle, and the distance between the nozzle and the roller is a spray deposition distance, and the spray deposition distance is 400 mm to 600 mm.

10. The spray-rolling preparation device for copper alloy strip according to claim 9, characterized in that: The nozzle of the at least one atomizer is arranged at a spray angle of 10-30°.

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