On-chip end face coupler test structure
By designing the test structure on the chip, including the optically coupled incident component and the exit component, the problem of difficult measurement of mode conversion efficiency loss in the end-face coupler is solved, and the precise measurement and process optimization of mode conversion loss are achieved, and the coupling efficiency is improved.
CN119688242AActive Publication Date: 2025-03-25WUHAN OPTICAL VALLEY INFORMATION OPTOELECTRONICS INNOVATION CENT CO LTD
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Patent Information
- Application Number
- CN202510117872.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2045-01-24
AI Technical Summary
Technical Problem
During the design process of end-face coupler, it is difficult to accurately measure the loss caused by mode conversion efficiency, which affects the evaluation of coupling efficiency and process optimization.
Method used
An on-chip end-face coupler testing structure is provided, including an optically coupled incident assembly and an optically coupled exit assembly, and the precise measurement of mode conversion loss is achieved through several coupler pairs arranged in a docking manner.
Benefits of technology
It can accurately measure the loss caused by mode conversion efficiency, realize the end-face coupler mode conversion loss testing and process problem positioning and evaluation, thereby optimizing the design of end-face coupler to improve coupling efficiency.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to an on-chip end face coupler test structure, which comprises an optical coupling incident assembly and an optical coupling emergent assembly, and is characterized in that the optical coupling incident assembly is used for transmitting light from one end of a to-be-tested assembly to the to-be-tested assembly, the to-be-tested assembly comprises a plurality of coupler pairs cascaded along the light transmission direction, and the coupler pairs are used for transmitting the light to the to-be-tested assembly. The coupler pair comprises two end face couplers which are arranged in a butt joint mode, and the head ends and the tail ends of the two end face couplers are opposite in the light transmission direction. The optical coupling emitting assembly is used for emitting light emitted from the other end of the to-be-detected assembly. According to the invention, the loss caused by coupling interface mode field mismatch can be eliminated, so that the loss caused by the mode conversion efficiency can be accurately measured, the mode conversion loss test and process problem positioning and evaluation of the end face coupler can be realized, and the end face coupler is optimized to obtain the end face coupler with higher coupling efficiency.
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