Thermal insulation performance testing device for thermal insulation material

Abstract

A thermal insulation performance testing device of a thermal insulation material comprises a heat flow meter, a cold plate, a hot plate, a temperature control system and a data acquisition system. The micro thermopile heat flow meter accurately detects the heat flow change of a sample in real time through an array thermocouple sensor, and provides heat flow data with high sensitivity and quick response. The temperature control system monitors the environment temperature, and the stability in the testing process is ensured. And the data acquisition system records the detection result in real time and optimizes the whole detection process through intelligent control. The automatic design in the embodiment enables the equipment to realize efficient batch detection, reduces manual intervention, improves the working efficiency and testing precision of a production line, and is suitable for testing the heat conductivity and heat flow performance of the thermal insulation material in large-scale industrial production.

Description

Technical Field

[0001] The invention belongs to the technical field, and specifically refers to a device for testing the thermal insulation performance of a thermal insulation material. Background Art

[0002] With the growing demand for construction, cold chain transportation and industrial insulation, thermal performance testing of insulation materials has gradually become an important part of related industries. As a commonly used insulation material, the thermal conductivity of insulation board is an important indicator for evaluating its insulation performance. The heat flow meter method has become one of the mainstream methods for testing the thermal conductivity of insulation board due to its fast test speed, high accuracy and simple operation.

[0003] The heat flow meter method calculates the thermal conductivity of the material by measuring the heat flux density of the sample under the temperature difference on both sides. However, in actual testing, this method is extremely sensitive to the flatness and contact thermal resistance of the sample surface. During the production process of the insulation board, the surface may be rough, uneven or locally concave and convex. These defects will cause the following problems: poor contact between the sample surface and the heat flow meter will increase the contact thermal resistance, resulting in errors in the measurement of heat flux density, so that the calculated value of the thermal conductivity deviates from the actual value; in different test batches, due to the inconsistency of the sample surface state, the test results may fluctuate greatly, affecting the reliability of the test; additional processing is required for samples with rough surfaces, such as polishing or adding thermal conductive media (such as thermal paste), which not only increases the complexity of the operation, but also reduces the detection efficiency in large-scale production environments. Summary of the invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a device for testing the thermal insulation performance of thermal insulation materials to at least partially solve the above technical problems.

[0005] The technical solution adopted by the present invention is as follows: The present invention proposes a device for testing the thermal insulation performance of thermal insulation materials, including a temperature difference control component, a heat flux meter component and a sample clamping mechanism, the temperature difference control component includes a hot plate, a cold plate and a semiconductor refrigeration sheet, the hot plate and the cold plate are respectively connected to the two sides of the semiconductor refrigeration sheet; the cold plate and the hot plate are arranged on both sides of the sample, the hot plate and the cold plate are used to provide a temperature difference on both sides of the sample to drive the heat flow through the sample, the heat flux meter component is used to measure the heat flux density passing through the sample and calculate the thermal conductivity of the sample; the sample clamping mechanism is used to fix the sample so that it contacts the hot plate, the cold plate and the semiconductor refrigeration sheet, a flexible thermal conductive pad is provided on the hot plate, and the flexible thermal conductive pad is located between the hot plate and the sample.

[0006] Furthermore, temperature sensors are provided on the hot plate and the cold plate, and the temperature sensors are used to measure the temperature of the two side surfaces of the sample and calculate the temperature difference on both sides of the sample; heat pipes are provided on the two side surfaces of the semiconductor refrigeration plate, and the semiconductor refrigeration plate is connected to the hot plate and the cold plate through the heat pipes.

[0007] Furthermore, a laser rangefinder is provided on the hot plate and the cold plate, and the laser rangefinder is used to detect the distance between the hot plate and the cold plate.

[0008] Furthermore, the hot plate and the cold plate are provided with temperature measuring holes at corresponding positions, and the heat flux meter assembly includes a micro-thermopile probe, which corresponds to the position of the temperature measuring holes and is used to detect the heat flux density passing through the sample.

[0009] Furthermore, the heat flux meter assembly also includes a lifting bracket and a data acquisition card, the micro-thermopile probe is arranged on the lifting bracket, the lifting bracket drives the micro-thermopile probe to move up and down, and the data acquisition card is electrically connected to the temperature sensor, laser rangefinder, semiconductor refrigeration sheet and micro-thermopile probe.

[0010] Furthermore, the sample clamping mechanism includes a pneumatic clamping block, a pressure regulating cylinder and a cylinder bracket, the pressure regulating cylinder is arranged on the cylinder bracket, the pneumatic clamping block is arranged on the piston rod of the pressure regulating cylinder, and the pneumatic clamping block is fixedly connected to the hot plate and the cold plate.

[0011] Furthermore, it also includes an automated conveying system, which includes a conveyor belt, and the conveyor belt is used to convey the sample, and the plane where the conveyor belt is located passes between the hot plate and the cold plate.

[0012] Compared with the prior art, the present invention has the following advantages: The present invention optimizes the contact between the sample and the hot plate and the cold plate through a flexible thermal pad and a sample clamping mechanism, significantly reduces the contact thermal resistance, ensures the accuracy of heat flux density and temperature difference measurement, and thus improves the accuracy of thermal conductivity calculation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A right side view of a device for testing the thermal insulation performance of a thermal insulation material provided by an embodiment of the present invention; Figure 2 A front view of a device for testing the thermal insulation performance of a thermal insulation material provided by an embodiment of the present invention; Figure 3 A three-dimensional diagram of a device for testing the thermal insulation performance of a thermal insulation material provided in an embodiment of the present invention; Figure 4 for Figure 3 The enlarged view at center Ⅰ; Figure 5 A top view of a device for testing the thermal insulation performance of a thermal insulation material provided in an embodiment of the present invention; Figure 6 for Figure 5 The cross-sectional view along the AA direction; Figure 7 for Figure 6 Magnified view at center II; Figure 8 The figure is a left view of a device for testing the thermal insulation performance of a thermal insulation material according to an embodiment of the present invention.

[0014] Among them, 100, temperature difference control component, 200, heat flow meter component, 300, sample clamping mechanism, 400, automated conveying system, 101, hot plate, 102, cold plate, 103, semiconductor refrigeration sheet, 104, temperature measuring hole, 105, flexible thermal pad, 106, temperature sensor, 107, laser rangefinder, 108, heat pipe, 201, lifting bracket, 202, micro-thermopile probe, 203, data acquisition card, 301, pneumatic clamping block, 302, pressure regulating cylinder, 303, cylinder bracket, 401, conveyor belt.

[0015] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0017] In the description of the present invention, it should be understood that terms such as “upper”, “lower”, “front”, “back”, “left”, “right”, “top”, “bottom”, “inside” and “outside” indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0018] The insulation material detection device based on the heat flow meter method has technical bottlenecks such as low precision, low efficiency, and complex operation when dealing with the problem of rough or uneven sample surface. It cannot fully meet the needs of fast, accurate, and non-destructive detection in modern insulation board production. Therefore, there is an urgent need for a new detection device that can effectively solve the problem of rough sample surface to improve detection accuracy and efficiency.

[0019] like Figure 1-Figure 8As shown, the device proposed in this embodiment detects the thermal conductivity of the insulation material by the heat flow meter method. When working, the sample is placed between the hot plate 101 and the cold plate 102. The hot plate 101 and the cold plate 102 respectively provide constant high and low temperatures to form a temperature difference on both sides of the sample. The semiconductor refrigeration plate 103 measures the heat flux density passing through the sample in real time. At the same time, the device is equipped with a sample clamping mechanism 300 to ensure good contact between the sample and the heat flow meter assembly 200, thereby reducing the influence of contact thermal resistance on the test accuracy.

[0020] In this embodiment, the semiconductor refrigeration sheet 103 adopts the thermoelectric refrigeration principle based on the Peltier effect. When current passes through the junction surface composed of P-type and N-type semiconductor materials, the P-type semiconductor absorbs heat, while the N-type semiconductor releases heat, thereby forming a temperature difference on the junction surface, causing the temperature of one side (cold side) to drop, while the temperature of the other side (hot side) to rise. By adjusting the current flowing through the semiconductor refrigeration sheet 103, the temperature difference between the cold side and the hot side can be accurately controlled, thereby adjusting the temperature of the hot plate 101 and the cold plate 102. The temperature difference on both sides of the sample is accurately controlled through the efficient thermoelectric effect of the semiconductor refrigeration sheet 103. The cold side of the refrigeration sheet contacts the cold plate 102 and absorbs the heat transferred from the sample surface, while the hot side transfers the heat to the other side of the sample through the hot plate 101, ensuring a stable temperature difference on both sides of the sample, thereby providing the required test conditions for the heat flow meter method.

[0021] The efficient temperature control capability of the semiconductor refrigeration chip 103 enables it to accurately control the temperature of the cold plate, meeting the strict requirements for temperature difference stability in the heat flow meter test. In addition, the design without mechanical parts avoids the noise and vibration in the traditional compressor refrigeration system, reducing the probability of equipment failure.

[0022] In this embodiment, a flexible thermal pad 105 is arranged on the hot plate 101, which significantly improves the thermal contact efficiency and measurement accuracy during the thermal conductivity test of the thermal insulation material. The flexible thermal pad 105 is made of silicone and is easily deformed when under pressure. The flexible thermal pad 105 optimizes the heat transfer path by filling the poor contact part, effectively reduces the contact thermal resistance, and ensures the precise control of the temperature difference and the stable conduction of the heat flow. Due to its high thermal conductivity, good elasticity and high temperature resistance, the flexible thermal pad 105 also enhances the durability and adaptability of the equipment, so that the detection device can cope with the requirements of different sample types and working conditions. At the same time, the flexible thermal pad 105 is reusable and will not cause contamination to the sample like other coated thermal conductive media. Therefore, the provision of the flexible thermal pad 105 reduces the manufacturing and maintenance costs of the equipment.

[0023] When this embodiment is in use, a temperature difference is formed on both sides of the semiconductor refrigeration sheet 103 due to the thermal effect generated by the passage of electric current, thereby achieving a cooling or heating effect. Through the heat pipe 108, the temperature change is quickly conducted to the hot plate 101 and the cold plate 102, and the surface temperature thereof is accurately controlled. The heat pipe 108 is filled with heat-conducting oil with excellent thermal conductivity, which can effectively reduce thermal resistance and ensure that heat is quickly and efficiently transferred from the semiconductor refrigeration sheet 103 to the hot plate 101 and the cold plate 102. The heat-conducting oil forms a good heat conduction channel inside the heat pipe 108, greatly improving the transfer efficiency of the heat flow. Through this efficient heat flow mode, the temperature change of the semiconductor refrigeration sheet 103 can be quickly and stably controlled within the required range, and then the temperature of the hot plate 101 and the cold plate 102 can be accurately adjusted, so that the entire system can work more efficiently, while improving the uniformity and stability of the heat flow. This design not only optimizes the heat conduction efficiency, but also maintains the stability of the equipment under different temperature requirements, ensuring the accuracy and efficiency of the entire heat flow measurement system.

[0024] At the same time, in this embodiment, a plurality of high-precision temperature sensors 106 are respectively arranged on the hot plate 101 and the cold plate 102, and these temperature sensors 106 are used to measure the temperature changes on both sides of the sample in real time. The temperature sensor 106 can accurately record the temperature difference between the sample surface and the cold plate and the hot plate, thereby obtaining the temperature difference on both sides of the sample. The temperature difference is one of the key parameters for calculating the thermal conductivity and thermal performance of the sample. By combining the heat flow data collected by the micro-thermopile heat flow meter assembly 200, the system can further use the thermal conductivity formula to accurately calculate the thermal conductivity parameters of the sample. The thermal conductivity formula combines the temperature difference, heat flux density and the geometric characteristics of the sample, and can accurately evaluate the thermal conductivity of the sample under different heat loads. In addition, by evaluating the thermal insulation performance of the sample, the heat insulation material can be obtained in actual application. The blocking ability and thermal isolation effect of the heat flow. Through this precise measurement and data analysis method, the present embodiment can not only provide the thermal conductivity of the sample, but also accurately evaluate its thermal insulation effect, providing a scientific basis and data support for the optimal design of the thermal insulation material.

[0025] A laser rangefinder 107 is specially designed between the cold plate 102 and the hot plate 101 proposed in this embodiment to detect the distance between the hot plate 101 and the cold plate 102 in real time. The laser rangefinder 107 uses the reflection principle of the laser beam to accurately measure the change in the spacing between the two plates. In actual use, the laser rangefinder 107 can quickly and accurately measure the distance between the hot plate 101 and the cold plate 102 by emitting laser and receiving the reflected signal. This distance value is the thickness of the sample. Through this technology, the thickness change of the sample during the heat flow measurement process can be monitored in real time. Especially in the long-term test process, the physical properties of the sample may change slightly, and the impact of these changes on the test results cannot be ignored. The laser rangefinder 107 can continuously track the slight changes in the thickness of the sample to ensure the accuracy of the thickness data during each test. By combining with the data collected by other sensors (such as temperature sensors, heat flow meters), the system can more comprehensively evaluate the thermal conductivity and insulation effect of the sample. This function not only improves the accuracy of the measurement, but also provides a more detailed reference for the thermal performance analysis of the sample.

[0026] The hot plate 101 and the cold plate 102 proposed in this embodiment are provided with temperature measuring holes 104 so that the micro-thermopile probe 202 can accurately contact the surfaces on both sides of the sample through these holes. The design of the temperature measuring holes 104 enables the micro-thermopile probe 202 to easily penetrate the hot plate 101 and the cold plate 102 and directly contact the surface of the sample, thereby achieving high-precision detection of the heat flux density of the sample. Specifically, when the system is running, the micro-thermopile probe 202 detects and obtains the temperature change data on both sides of the sample through the temperature measuring holes 104. These data directly reflect the thermal conductivity of the sample under the action of heat flow. The micro-thermopile probe 202 can sensitively capture the subtle changes in the conduction of heat flow on the sample surface, and convert it into an electrical signal for analysis, ensuring accurate measurement of the heat flux density of the sample.

[0027] Through this design, the temperature measuring hole 104 not only provides a precise contact channel for the micro-thermopile probe 202, but also avoids heat loss, improves the stability and reliability of the test, and at the same time, enables the micro-thermopile probe 202 to accurately monitor the heat flux density in real time without affecting the operation of other equipment.

[0028] In this embodiment, a micro-thermopile probe 202 is used as a core component for heat flow measurement, which has multiple advantages such as high precision, fast response, contactless measurement, miniaturized design, high temperature resistance, and long-term stability. It can provide accurate and reliable heat flow data in the thermal conductivity test of insulation materials. The fast response and high sensitivity of the micro-thermopile probe 202 make it outstanding in dynamic heat flow measurement and suitable for large-scale production line detection. The non-destructive measurement method of the micro-thermopile probe 202 ensures the safety of the test process and the accuracy of the data. In addition, the low power consumption and high reliability of the micro-thermopile probe 202 make it an ideal long-term testing tool, which can meet the high requirements for heat flow measurement in modern industry and scientific research.

[0029] The heat flow meter assembly 200 proposed in this embodiment also includes a lifting bracket 201 and a data acquisition card 203, wherein the lifting bracket 201 can drive the micro-thermopile probe 202 to move up and down, so that the micro-thermopile probe 202 is kept in contact with the sample surface. When detecting the heat flux of the sample, the lifting bracket 201 drives the micro-thermopile probe 202 to pass through the temperature measuring hole 104, so that the micro-thermopile probe 202 is in contact with the sample surface. When the detection is completed, the lifting bracket 201 drives the micro-thermopile probe 202 to leave the temperature measuring hole 104 so as to detect subsequent samples.

[0030] At the same time, the data acquisition card 203 is electrically connected to the temperature sensor 106, the laser rangefinder 107, the semiconductor refrigeration sheet 103 and the micro-thermopile probe 202. The temperature sensor 106 detects the temperature on both sides of the sample and inputs it into the data acquisition card 203. The laser rangefinder 107 detects the real-time thickness of the sample and inputs it into the data acquisition card 203. The semiconductor refrigeration sheet 103 inputs the temperature on both sides of itself into the data acquisition card 203. The micro-thermopile probe 202 detects the heat flux of the sample and inputs it into the data acquisition card 203. The data acquisition card 203 collects heat flux density and temperature difference data, and combines the sample thickness, automatically calculates through the thermal conductivity formula, and finally obtains the thermal conductivity performance parameters of the sample.

[0031] The sample clamping mechanism 300 provided in this embodiment is used to clamp the sample. The piston rod of the pressure regulating cylinder 302 drives the pneumatic clamping block 301 to apply pressure to both sides of the sample, thereby achieving the clamping of the sample. At the same time, the pressure provided by the pressure regulating cylinder 302 in this embodiment can be detected and adjusted. By applying appropriate pressure, the contact quality between the sample and the hot plate 101 and the cold plate 102 is improved, and at the same time, excessive pressure is avoided to damage the structure of the insulation plate or affect the authenticity of the thermal performance test.

[0032] This embodiment is equipped with an automated conveying system 400, which automatically conveys samples to the testing device via a conveyor belt 401 to improve testing efficiency. After the test is completed, the conveyor belt 401 moves the samples to the unloading area. By setting up the automated conveying system 400, the testing efficiency is improved, human errors are reduced, the sample position is accurately controlled, the system stability is enhanced, the labor cost is reduced, and work safety is improved, the overall performance and reliability of the insulation material testing are significantly improved, and the system is particularly suitable for the high-efficiency testing needs of large-scale production lines.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] The present invention and its embodiments are described above, and such description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the present invention.

Claims

1. A device for testing the thermal insulation performance of a thermal insulation material, characterized in that: It comprises a temperature difference control component (100), a heat flow meter component (200) and a sample clamping mechanism (300), wherein the temperature difference control component (100) comprises a hot plate (101), a cold plate (102) and a semiconductor cooling sheet (103), wherein the hot plate (101) and the cold plate (102) are respectively connected to two sides of the semiconductor cooling sheet (103); The cold plate (102) and the hot plate (101) are arranged on both sides of the sample, the hot plate (101) and the cold plate (102) are used to provide a temperature difference on both sides of the sample to drive heat flow through the sample, and the heat flow meter assembly (200) is used to measure the heat flux density passing through the sample and calculate the thermal conductivity of the sample; The sample clamping mechanism (300) is used to fix the sample so that it contacts the hot plate (101), the cold plate (102) and the semiconductor cooling plate (103); a flexible thermal pad (105) is provided on the hot plate (101); and the flexible thermal pad (105) is located between the hot plate (101) and the sample.

2. The thermal insulation performance testing device of the thermal insulation material according to claim 1, characterized in that: The hot plate (101) and the cold plate (102) are provided with temperature sensors (106), and the temperature sensors (106) are used to measure the temperature of the surfaces on both sides of the sample and calculate the temperature difference between the two sides of the sample; Heat conducting pipes (108) are respectively provided on the two side surfaces of the semiconductor refrigeration sheet (103), and the semiconductor refrigeration sheet (103) is connected to the hot plate (101) and the cold plate (102) via the heat conducting pipes (108).

3. The thermal insulation performance testing device of the thermal insulation material according to claim 2, characterized in that: The hot plate (101) and the cold plate (102) are provided with a laser distance meter (107), and the laser distance meter (107) is used to detect the distance between the hot plate (101) and the cold plate (102).

4. The thermal insulation performance testing device of the thermal insulation material according to claim 3, characterized in that: The hot plate (101) and the cold plate (102) are provided with temperature measuring holes (104) at corresponding positions. The heat flow meter assembly (200) comprises a micro-thermopile probe (202). The micro-thermopile probe (202) corresponds to the position of the temperature measuring hole (104). The micro-thermopile probe (202) is used to detect the heat flux density passing through the sample.

5. The thermal insulation performance testing device of the thermal insulation material according to claim 4, characterized in that: The heat flow meter assembly (200) further comprises a lifting bracket (201) and a data acquisition card (203); the micro-thermopile probe (202) is arranged on the lifting bracket (201); the lifting bracket (201) drives the micro-thermopile probe (202) to move up and down; and the data acquisition card (203) is electrically connected to the temperature sensor (106), the laser rangefinder (107), the semiconductor cooling sheet (103) and the micro-thermopile probe (202).

6. The thermal insulation performance testing device of the thermal insulation material according to claim 1, characterized in that: The sample clamping mechanism (300) comprises a pneumatic clamping block (301), a pressure regulating cylinder (302) and a cylinder support (303); the pressure regulating cylinder (302) is arranged on the cylinder support (303); the pneumatic clamping block (301) is arranged on the piston rod of the pressure regulating cylinder (302); and the pneumatic clamping block (301) is fixedly connected to the hot plate (101) and the cold plate (102).

7. The thermal insulation performance testing device of the thermal insulation material according to claim 1, characterized in that: It also includes an automated conveying system (400), wherein the automated conveying system (400) includes a conveyor belt (401), wherein the conveyor belt (401) is used to convey the sample, and the plane where the conveyor belt (401) is located passes between the hot plate (101) and the cold plate (102).

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