Cutting device and cutting method for manufacturing thin film pressure sensitive chip

Abstract

The invention belongs to the technical field of thin film pressure sensitive chip manufacturing, and particularly relates to a cutting device for thin film pressure sensitive chip manufacturing and a cutting method. The lower side and the front side of the placing frame are in an opening state; a cutting motor is mounted on the outer side wall of the placing frame; a first rotating shaft is arranged at the output end of the cutting motor, and the first rotating shaft extends into the placing frame; a diamond sheet is mounted at the end part of the first rotating shaft; a pair of symmetrically-distributed collecting blocks is arranged in the containing frame, and the pair of collecting blocks are symmetrically distributed relative to the diamond piece. The opposite faces of the pair of collecting blocks are inclined faces, and each inclined face is composed of a first inner arc face and a transition arc face. A first cavity is formed in the collecting block; a first through groove is formed in the first inner arc surface, and the first through groove communicates with the first cavity; the problem that when an existing diamond piece is used for cutting a wafer, particulate matter generated during cutting influences the wafer cutting quality is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of thin film pressure sensitive chip manufacturing, in particular to a cutting device and a cutting method for thin film pressure sensitive chip manufacturing. Background Art

[0002] A thin film pressure sensitive chip is a sensor chip made using thin film technology that can sense and respond to pressure changes.

[0003] In the process of preparing thin-film pressure-sensitive chips, wafer cutting is an important step. Through wafer cutting, the chips produced in batches can be divided into independent individuals, which is convenient for subsequent packaging and testing. At the same time, the accuracy and efficiency of the cutting technology also directly affect the performance and cost of the chip. In the prior art, when a diamond sheet is used to cut a round wafer, the cutting friction between the diamond sheet and the wafer surface when the diamond sheet rotates at high speed will cause the generation of small debris or particles. These particles include diamond powder, wafer cutting chips and other tiny substances. Although the use of coolant can reduce the impact of the particles, when the diamond sheet rotates at high speed, some particles will follow the rotation of the diamond sheet and be thrown to a longer distance by centrifugal force, but will still remain on the surface of the round wafer, making it impossible to effectively clean it. In addition, a large amount of residual particles will affect the subsequent cutting of the round wafer by the diamond sheet.

[0004] To this end, the present invention provides a cutting device and a cutting method for manufacturing a thin film pressure sensitive chip. Summary of the invention

[0005] In order to make up for the shortcomings of the prior art and solve the problem that when the existing diamond sheet is used to cut a round wafer, the particles generated by the cutting affect the cutting quality of the round wafer. The present invention proposes a cutting device and a cutting method for manufacturing a thin film pressure sensitive chip.

[0006] The technical solution adopted by the present invention to solve its technical problem is: a cutting device for manufacturing thin film pressure sensitive chips described in the present invention comprises a placing frame and a cutting motor; the lower side and the front side of the placing frame are both in an open state; a cutting motor is installed on the outer wall of the placing frame; a first rotating shaft is provided at the output end of the cutting motor, and the first rotating shaft extends into the placing frame; a diamond sheet is installed at the end of the first rotating shaft; a pair of symmetrically distributed collecting blocks are provided in the placing frame, and the pair of collecting blocks are symmetrically distributed about the diamond sheet; the opposite surfaces of the pair of collecting blocks are both inclined surfaces, and the inclined surfaces are both composed of a first inner arc surface and a transition arc surface; a first cavity is provided in the collecting block; a first through groove is provided on the first inner arc surface, and the first through groove and the first cavity are interconnected; a first filter is provided in the first cavity, and the first filter covers the first through groove; a cooling member is provided in the placing frame, and the cooling member sprays cooling liquid on the diamond sheet; the position of the collecting block is adjusted by an adjusting member; a water through groove is provided at the bottom end of the collecting block, and the water through groove and the first cavity are interconnected.

[0007] Preferably, the first filter screen is composed of a group of first plane screens and a group of inner arc screens alternatingly; a group of scraper plates are fixedly connected to the first through groove; the scraper plates and the first filter screen are in contact with each other; the first filter screen is circulated back and forth by a power part; the first filter screen is arranged parallel to the first inner arc surface and has the same shape.

[0008] Preferably, the power part includes a second through slot and a first covering plate; the side wall of the first cavity is provided with a second through slot; the side wall of the collecting block is installed with a first covering plate by bolts, and the first covering plate covers the second through slot; the first slide plate and the second slide plate are respectively fixedly connected to the two side walls of the first filter; the first slide plate and the second slide plate slide on the inner wall of the first cavity; the first slide plate and the second slide plate are symmetrically arranged with respect to the first filter; the first slide plate and the second slide plate are connected by a connecting column; the side wall of the first slide plate is fixedly connected to the side wall of the first covering plate by a first spring; the side wall of the second slide plate is fixedly connected with a movable plate, and the movable plate and the first filter are parallel to each other and have similar shapes; the movable plate passes through and extends out of the collecting block; the movable plate is moved by the circulation unit.

[0009] Preferably, the circulation unit includes a first groove and a second groove; a first groove is provided on the inner wall of the placement frame; a first gear is provided in the first groove, and the first gear is fixedly connected to the first rotating shaft; the second gear is rotatably connected in the first groove; the second gear and the first gear are meshed with each other; a first pin is rotatably connected on the side wall of the second gear; a circular plate is slidably connected in the first groove, and the first pin is slidably connected in the inner wall of the circular plate; a pair of second grooves symmetrically distributed about the first groove is provided on the inner wall of the placement frame; the top view of the second groove is a right-angled triangle; a push plate is slidably connected on the right-angled inclined surface of the second groove; the end of the push plate and the moving plate are in contact with each other; a first slide groove is provided on the side wall of the push plate; push rods are fixedly connected to the side walls on both sides of the circular plate, the end of the push rod passes through the placement frame and extends into the second groove, and the end of the push rod is slidably connected in the first slide groove.

[0010] Preferably, the adjusting member includes an upper and lower unit and a first inclined surface; a pair of symmetrically distributed first inclined surfaces are provided on the side walls on both sides of the placement frame, and the pair of first inclined surfaces are in an inverted "eight" shape; a second inclined surface is provided on the side wall of the collection block, and the first inclined surface and the second inclined surface are arranged in parallel; the second inclined surface of the collection block is slidably connected to the first inclined surface.

[0011] Preferably, the upper and lower units include a threaded rod; a second slide groove is opened on the top of the collecting block; an adjustment block is slidably connected in the second slide groove; a threaded rod is threadedly connected on the placement frame, and the bottom end of the threaded rod extends into the placement frame and is rotatably connected to the top of the adjustment block.

[0012] Preferably, the cooling member includes a V-shaped nozzle; the upper side of the placement frame is in an open state, and a placement plate is bolted to the upper opening; a pair of connecting pipes symmetrically distributed about the diamond sheet are fixedly connected to the placement plate, and a V-shaped nozzle is fixedly connected to the bottom end of the connecting pipe; a water pump is installed on the cutting motor; the water pump is connected to the connecting pipe through a hose; and a group of water outlets are opened on the V-shaped nozzle.

[0013] Preferably, the bottom ends of the pair of collection blocks are fixedly connected to adsorption blocks; second inner arc surfaces are provided on the opposite surfaces of the pair of adsorption blocks; a second cavity is provided in the adsorption block; a group of connecting grooves are provided on the second inner arc surface; the connecting grooves and the second cavity are connected to each other; a pair of water grooves are located between the pair of adsorption blocks; a second filter net is fixedly connected in the second cavity; a straw is provided on the outer side wall of the placement frame, and the other end of the straw is connected to the second cavity.

[0014] Preferably, the second filter is arranged at an angle; the cross-section of the second cavity is in the shape of "7"; the horizontal bottom wall of the second cavity is concave; the second filter is fixedly connected to the horizontal cavity of the second cavity; an arc-shaped through groove is provided on the side wall of the adsorption block, and the arc-shaped through groove and the horizontal cavity of the second cavity are interconnected; an arc-shaped baffle is provided in the arc-shaped through groove, and the arc-shaped baffle is installed on the side wall of the adsorption block by bolts; the second filter is composed of a group of second plane meshes and inverted isosceles triangle meshes; and the vertical length of the tip of a group of inverted isosceles triangle meshes increases successively from the direction away from the second inner arc surface.

[0015] A cutting method for manufacturing a thin film pressure sensitive chip, the method adopts the above-mentioned cutting device for manufacturing a thin film pressure sensitive chip, and the steps of the method are as follows: S1: Before cutting the wafer, the positions of the collecting block and the adsorption block are adjusted by adjusting the adjusting member according to the thickness of the wafer; S2: When the wafer is cut, the cutting motor works, the diamond slice cuts the wafer, and the cooling element sprays coolant to ensure the cutting state; S3: Through the setting of the first filter and the second filter, the particles generated by the cutting of the diamond sheet are collected and processed to reduce the impact on the wafer cutting.

[0016] The beneficial effects of the present invention are as follows: 1. The present invention discloses a cutting device and a cutting method for manufacturing a thin film pressure sensitive chip. The position of the collecting block is adjusted by an adjusting member so that the high-speed rotating diamond sheet can carry water and cutting powder for throwing out. Most of the thrown-out water will be received by the first inner arc surface and poured onto the first filter net. The water will be filtered by the first filter net, and the particles carried by the thrown-out water will be filtered by the first filter net. The excess water will flow out for a second time through the first cavity and the water groove. The purified water will merge with the unthrown water in the coolant, so that the water can have enough water flow to drive the remaining particles to flow. Because a part of the particles have been filtered by the first filter net, the particles remaining on the wafer surface can be driven by the coolant to flow, which is convenient for detaching from the wafer surface.

[0017] 2. The cutting device and cutting method for manufacturing a thin film pressure sensitive chip described in the present invention enable the first filter net to be pushed back and forth under the action of a movable plate and a first spring. The back and forth movement of the first filter net can not only accelerate the filtering and penetration of water flow, but also enable the particles on the first filter net to scrape off the particles on the first plane net through the action of a scraper plate, and at the same time allow them to be collected in the inner arc net, thereby ensuring that the first plane net is not blocked. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below in conjunction with the accompanying drawings.

[0019] Figure 1 is a stereogram of the present invention; Figure 2 is a partial cross-sectional view of the present invention; Figure 3 yes Figure 2 A partial enlarged view of the middle part; Figure 4 is a partial top sectional view of the present invention; Figure 5 is a cross-sectional view of the present invention; Figure 6 It is a stereogram of the collection block; Figure 7 is a three-dimensional diagram of a first filter; Figure 8 It is a three-dimensional picture of the adsorption block; Fig. 9 is a partial stereogram of the second filter; Fig.10 It is a three-dimensional diagram of the V-shaped nozzle.

[0020] In the figure: 1, cutting motor; 11, first rotating shaft; 12, diamond sheet; 13, placing frame; 14, collecting block; 15, first inner arc surface; 16, transition arc surface; 17, first cavity; 18, first through groove; 2, first filter screen; 21, inner arc screen; 22, first plane screen; 23, scraper plate; 3, second through groove; 31, first covering plate; 32, first slide plate; 33, second slide plate; 34, connecting column; 35, first spring; 36, moving plate; 4, first groove; 41, first gear; 42, second gear; 43, first pin; 4 4. Reciprocating plate; 45. Push rod; 46. Second groove; 47. First slide groove; 48. Push plate; 5. First inclined surface; 51. Second inclined surface; 52. Second slide groove; 53. Threaded rod; 54. Adjustment block; 6. Placement plate; 61. V-shaped nozzle; 62. Connecting pipe; 63. Water pump; 64. Hose; 7. Adsorption block; 71. Second inner arc surface; 72. Straw; 73. Second cavity; 74. Connecting groove; 75. Second filter screen; 76. Water through groove; 8. Arc through groove; 81. Arc baffle; 82. Second plane net; 83. Inverted isosceles triangle net. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0022] like Figures 1 to 10As shown, a cutting device for manufacturing a thin film pressure sensitive chip according to an embodiment of the present invention comprises a placement frame 13 and a cutting motor 1; the lower side and the front side of the placement frame 13 are both in an open state; the cutting motor 1 is installed on the outer wall of the placement frame 13; the output end of the cutting motor 1 is provided with a first rotating shaft 11, and the first rotating shaft 11 extends into the placement frame 13; a diamond sheet 12 is installed at the end of the first rotating shaft 11; a pair of symmetrically distributed collecting blocks 14 are provided in the placement frame 13, and the pair of collecting blocks 14 are symmetrically distributed about the diamond sheet 12; the opposite surfaces of the pair of collecting blocks 14 are both inclined surfaces, and the inclined surfaces are both composed of a first inner arc surface 15 and a transition arc surface 16; a first cavity 17 is provided in the collection block 14; a first through groove 18 is provided on the first inner arc surface 15, and the first through groove 18 and the first cavity 17 are connected to each other; a first filter screen 2 is provided in the first cavity 17, and the first The filter screen 2 covers the first through groove 18; a cooling member is provided in the placement frame 13, and the cooling member sprays cooling liquid on the diamond sheet 12; the collecting block 14 is adjusted in position by an adjusting member; a water through groove 76 is provided at the bottom of the collecting block 14, and the water through groove 76 and the first cavity 17 are interconnected; in the prior art, when the diamond sheet 12 is used to cut a round wafer, the cutting friction force generated by the diamond sheet 12 and the wafer surface during the high-speed rotation will cause the generation of small debris or particles. These particles include diamond powder, wafer cutting chips and other tiny substances. Although the use of coolant can reduce the impact of particles, when the diamond sheet 12 rotates at a high speed, some particles will follow the rotation of the diamond sheet 12 and be thrown to a longer distance by the centrifugal force, but they will still remain on the surface of the round wafer, and effective cleaning cannot be achieved. Moreover, a large amount of residual particles will affect the subsequent cutting of the round wafer by the diamond sheet 12;Therefore, when the present invention is working, the position of the collecting block 14 is first adjusted by the adjusting member, so that the high-speed rotating diamond piece 12 can carry the water flow and the cutting powder to be thrown out, and most of the thrown-out water flow will be received by the first inner arc surface 15 and poured on the first filter screen 2, and the water flow will be filtered by the first filter screen 2, and the particles carried by the thrown-out water flow will also be filtered by the first filter screen 2, and the excess water flow will flow out for the second time through the first cavity 17 and the water groove 76, and the purified water flow will merge with the water flow in the coolant that has not been thrown out, so that the water flow can have enough water flow to drive The remaining particles flow, because part of the particles have been filtered by the first filter 2, the particles remaining on the wafer surface can be driven by the coolant to flow, which is convenient for leaving the wafer surface (it is impossible to completely clean the particles, but only to effectively reduce the particles remaining on the wafer surface), and the first inner arc surface 15 and the transition arc surface 16 are set with reference to the trajectory of the water flow thrown out under the action of centrifugation when the diamond sheet 12 rotates, which is convenient for collecting and filtering the thrown water flow (wherein the wafer cutting device is a prior art, and the cutting device of the present invention is used in the existing wafer cutting machine). ;

[0023] The first filter screen 2 is composed of a group of first plane screens 22 and a group of inner arc screens 21 alternately; a group of scraper plates 23 are fixedly connected to the first through groove 18; the scraper plates 23 and the first filter screen 2 are mutually attached; the first filter screen 2 is moved back and forth by the power member; the first filter screen 2 is arranged parallel to the first inner arc surface 15 and has the same shape; The power member includes a second through slot 3 and a first covering plate 31; the side wall of the first cavity 17 is provided with a second through slot 3; the side wall of the collecting block 14 is installed with a first covering plate 31 by bolts, and the first covering plate 31 covers the second through slot 3; the first slide plate 32 and the second slide plate 33 are respectively fixedly connected to the two side walls of the first filter screen 2; the first slide plate 32 and the second slide plate 33 slide on the inner wall of the first cavity 17; the first slide plate 32 and the second slide plate 33 are symmetrically arranged with respect to the first filter screen 2; the first slide plate 32 and the second slide plate 33 are connected by a connecting column 34; the side wall of the first slide plate 32 is fixedly connected to the side wall of the first covering plate 31 by a first spring 35; the side wall of the second slide plate 33 is fixedly connected with a moving plate 36, and the moving plate 36 and the first filter screen 2 are parallel to each other and have similar shapes; the moving plate 36 passes through and extends out of the collecting block 14; the moving plate 36 is moved by the circulation unit; The circulation unit includes a first groove 4 and a second groove 46; the first groove 4 is opened on the inner wall of the placement frame 13; a first gear 41 is arranged in the first groove 4, and the first gear 41 is fixed to the first rotating shaft 11; a second gear 42 is rotatably connected in the first groove 4; the second gear 42 and the first gear 41 are meshed with each other; a first pin 43 is rotatably connected on the side wall of the second gear 42; a circular plate 44 is slidably connected in the first groove 4, and the first pin 43 is slidably connected in the inner wall of the circular plate 44; the A pair of second grooves 46 symmetrically distributed about the first groove 4 are provided on the inner wall of the placement frame 13; the top view of the second groove 46 is a right triangle; a push plate 48 is slidably connected to the right-angled slope of the second groove 46; the end of the push plate 48 and the moving plate 36 are in contact with each other; a first slide groove 47 is provided on the side wall of the push plate 48; push rods 45 are fixedly connected to the side walls of both sides of the circular plate 44, the ends of the push rods 45 penetrate the placement frame 13 and extend into the second grooves 46, and the ends of the push rods 45 are slidably connected in the first slide grooves 47; During operation, since the particle size of the particles is small, the aperture of the first filter 2 is smaller in order to filter the particles. Moreover, when the diamond sheet 12 is cut for a long time, the particles are easily blocked when being filtered by the first filter 2. Moreover, due to the small aperture, the infiltration of water flow is affected, resulting in the water flow not passing through the first filter 2, but flowing back along the first filter 2 and the transition arc surface 16 on the surface of the round crystal, and the particles filtered by the first filter 2 will also flow back, affecting the collection effect of the particles. Therefore, when the diamond sheet 12 rotates through the first rotating shaft 11, the first rotating shaft 11 will drive the second gear 42 to rotate due to the meshing of the first gear 41 and the second gear 42. The rotation of the second gear 42 will drive the circular plate 44 to move horizontally left and right through the first pin 43. The circular movement of the circular plate 44 will drive the push plate 48 to move back and forth on the right-angled slope of the second groove 46 through the push rod 45 (the push plate 48 only moves on the right-angled slope of the second groove 46, and the two will not separate. The prior art It is realized by the slider slide technology, which will not be elaborated in detail), and then push the moving plate 36 to move, so that the first filter screen 2 can push the first filter screen 2 back and forth under the action of the moving plate 36 and the first spring 35, which can not only speed up the filtering and penetration of the water flow, but also scrape the particles on the first plane net 22 through the scraper plate 23, and collect them in the inner arc net 21 (the bottom position of the inner arc net 21 is basically equivalent to the horizontal state, which can ensure the accumulation of particles and effectively avoid the situation where the water flow refluxes and carries particles), and then ensure that the first plane net 22 is not blocked, because the first filter screen 2 can effectively ensure the state of non-ineffective filtration, and the particles can be collected through the inner arc net 21; after the wafer is cut in the later stage, the first cover plate 31 can be manually removed, and the first cover plate 31, the first slide plate 32, the second slide plate 33, the first filter screen 2 and the moving plate 36 can be taken out as a whole, and the first filter screen 2 is cleaned and removed, and then installed and used, and can be disassembled and cleaned to ensure the use efficiency of the first filter screen 2.

[0024] The adjusting member includes an upper and lower unit and a first inclined surface 5; a pair of symmetrically distributed first inclined surfaces 5 are provided on the side walls of both sides of the placing frame 13, and the pair of first inclined surfaces 5 are in an inverted "eight" shape; a second inclined surface 51 is provided on the side wall of the collecting block 14, and the first inclined surface 5 and the second inclined surface 51 are arranged in parallel; the second inclined surface 51 of the collecting block 14 is slidably connected to the first inclined surface 5; The upper and lower units include a threaded rod 53; a second slide groove 52 is provided on the top of the collecting block 14; an adjusting block 54 is slidably connected in the second slide groove 52; the placing frame 13 is threadedly connected with the threaded rod 53, and the bottom end of the threaded rod 53 extends into the placing frame 13 and is rotatably connected to the top of the adjusting block 54; During operation, because the diamond sheet 12 is circular and is rotated for cutting, when wafers of different thicknesses need to be cut, the entire cutting motor 1 needs to be adjusted up and down, but the contact area between the diamond sheet 12 and the crystal will increase and increase in a step-like manner, and the water flow throwing angle changes, so the position of the collecting block 14 needs to be adjusted. The collecting block 14 not only needs to move up and down, but also needs to move left and right, so a first inclined surface 5 and a second inclined surface 51 are provided (the second inclined surface 51 slides on the first inclined surface 5 through a slider slot, and the prior art is not specifically described), and the threaded rod 53 is rotated to drive the collecting block 14 away from the diamond sheet 12 during the upward movement, so as to adapt to the change of the water flow throwing position when cutting wafers of different thicknesses; the cross-sections of the second slot 52 and the adjustment block 54 are both inverted T-shaped.

[0025] The cooling member includes a V-shaped nozzle 61; the upper side of the placement frame 13 is open, and the upper opening is bolted to a placement plate 6; a pair of connecting pipes 62 symmetrically distributed about the diamond sheet 12 are fixedly connected to the placement plate 6, and the bottom end of the connecting pipe 62 is fixedly connected to the V-shaped nozzle 61; a water pump 63 is installed on the cutting motor 1; the water pump 63 is connected to the connecting pipe 62 through a hose 64; a group of water outlets are opened on the V-shaped nozzle 61; when working, the coolant passes through the water pump 63 and hose 64, allowing the coolant to pass through the connecting pipe 62 and the V-shaped nozzle 61, and then sprayed out through the water outlet. The water outlet is set in an arc shape, which can be suitable for the diamond sheet 12 to cut wafers of different thicknesses. The coolant outlet can not only be sprayed at the cutting position, but also can be sprayed on the surface of the diamond sheet 12, which can clean the particles attached to the surface of the diamond sheet 12. Among a pair of connecting pipes 62, the connecting pipe 62 on the other side can be bent (existing technology) without affecting the rotation of the first rotating shaft 11.

[0026] A pair of the collecting blocks 14 are fixedly connected to the bottom ends of the adsorption blocks 7; a second inner arc surface 71 is provided on the opposite surfaces of the pair of the adsorption blocks 7; a second cavity 73 is provided in the adsorption block 7; a group of connecting grooves 74 is provided on the second inner arc surface 71; the connecting grooves 74 and the second cavity 73 are connected to each other; a pair of the water grooves 76 are located between the pair of adsorption blocks 7; a second filter screen 75 is fixedly connected in the second cavity 73; a straw 72 is provided on the outer wall of the placement frame 13, and the other end of the straw 72 is connected to the second cavity 73; The second filter screen 75 is arranged obliquely; the cross section of the second cavity 73 is in the shape of "7"; the horizontal cavity bottom wall of the second cavity 73 is arranged concavely; the second filter screen 75 is fixedly connected to the horizontal cavity of the second cavity 73; an arc-shaped through groove 8 is provided on the side wall of the adsorption block 7, and the arc-shaped through groove 8 and the horizontal cavity of the second cavity 73 are interconnected; an arc-shaped baffle plate 81 is provided in the arc-shaped through groove 8, and the arc-shaped baffle plate 81 is installed on the side wall of the adsorption block 7 by bolts; the second filter screen 75 is composed of a group of second plane nets 82 and inverted isosceles triangle nets 83; and the vertical length of the tip of a group of inverted isosceles triangle nets 83 increases in sequence from the direction away from the second inner arc surface 71; During operation, the coolant will flow on the surface of the wafer and will be blocked by the adsorption block 7 (the lowest point of the adsorption block 7 does not contact the surface of the wafer, and the distance is at the micron level). Then, the second cavity 73 is adsorbed through the suction pipe 72 (the suction pipe 72 is connected to an external power source), so that the blocked coolant can pass through the connecting groove 74 and the second cavity 73, and then be filtered and adsorbed by the second filter 75. At the same time, the coolant thrown out by the diamond sheet 12 will flow again on the surface of the wafer by the first cavity 17 and the water groove 76, so that the total amount of coolant on the wafer remains basically unchanged, but the particulate matter is reduced, so it can be easily The suction pipe 72 performs adsorption treatment, and the second cavity 73 is provided with a "7" shape, which can effectively facilitate the filtration of the second filter 75, and the particulate matter can be retained on the horizontal cavity bottom surface of the second cavity 73. At the same time, the second filter 75 is composed of a group of second plane nets 82 and inverted isosceles triangle nets 83. The setting of a group of inverted isosceles triangle nets 83 can effectively avoid the complete blockage of the second filter 75. After the subsequent wafer cutting, the arc baffle 81 can be removed to allow the suction pipe 72 to spray in reverse to clean the particulate matter in the second cavity 73 and the particulate matter on the second filter 75.

[0027] A cutting method for manufacturing a thin film pressure sensitive chip, the method adopts the above-mentioned cutting device for manufacturing a thin film pressure sensitive chip, and the steps of the method are as follows: S1: Before cutting the wafer, the positions of the collecting block 14 and the adsorption block 7 are adjusted by adjusting the adjusting member according to the thickness of the wafer; S2: When the round wafer is cut, the cutting motor 1 works, the diamond sheet 12 cuts the wafer, and the cooling element sprays coolant to ensure the cutting state; S3: Through the provision of the first filter 2 and the second filter 75, the particles generated by the cutting of the diamond sheet 12 are collected and processed to reduce the impact on the wafer cutting.

[0028] Working principle: first adjust the position of the collecting block 14 through the adjusting piece, so that the high-speed rotating diamond piece 12 can carry water and cutting powder to be thrown out, most of the thrown water will be received by the first inner arc surface 15, and poured on the first filter 2, the water will be filtered by the first filter 2, and the particles carried by the thrown water will also be filtered by the first filter 2, and the excess water will flow out for the second time through the first cavity 17 and the water groove 76, and the purified water will merge with the water in the coolant that has not been thrown out, so that the water can have enough water flow to drive the remaining particles to flow, because part of the particles have been filtered by the first filter 2, and the particles remaining on the surface of the wafer The particles can be driven by the coolant to flow, which is convenient for leaving the surface of the wafer (it is impossible to completely clean the particles, but only effectively reduce the particles remaining on the surface of the wafer), and the first inner arc surface 15 and the transition arc surface 16 are set with reference to the trajectory of the water flow thrown out under the action of centrifugation when the diamond piece 12 rotates, so as to facilitate the collection and filtration of the thrown water flow; because the particle size of the particles is small, the aperture of the first filter 2 is smaller when filtering the particles, and when the diamond piece 12 is cut for a long time, the particles are easily blocked when filtered by the first filter 2, and because the aperture is small, it will affect the infiltration of the water flow, resulting in the water flow not passing through the first filter 2, but following the first filter. 2 and the transition arc surface 16 flow back on the surface of the round crystal, and will also carry the particles filtered by the first filter screen 2 backflow, affecting the collection effect of the particles. Therefore, when the diamond sheet 12 rotates through the first rotating shaft 11, the first rotating shaft 11 will drive the second gear 42 to rotate due to the meshing of the first gear 41 and the second gear 42. The rotation of the second gear 42 will drive the circular plate 44 to move horizontally left and right through the first pin 43. The circular movement of the circular plate 44 will drive the push plate 48 to move back and forth on the right-angled slope of the second groove 46 through the push rod 45 (the push plate 48 only moves on the right-angled slope of the second groove 46, and the two will not separate. The prior art is to slide the slider The first filter screen 2 can be pushed back and forth under the action of the moving plate 36 and the first spring 35. The back and forth movement of the first filter screen 2 can not only speed up the filtration and penetration of the water flow, but also scrape off the particles on the first plane screen 22 through the scraper plate 23, and collect them in the inner arc screen 21 (the bottom position of the inner arc screen 21 is basically equivalent to the horizontal state, which can ensure the accumulation of particles and effectively avoid the situation where the water flow refluxes and carries particles), thereby ensuring that the first plane screen 22 is not blocked, because the first filter screen 2 can effectively ensure that the filtration is not invalid, and the particles can be collected through the inner arc screen 21;After the wafer is cut at a later stage, the first cover plate 31 can be manually removed, and the first cover plate 31, the first slide plate 32, the second slide plate 33, the first filter screen 2 and the movable plate 36 can be taken out as a whole, and the first filter screen 2 can be cleaned and removed before installation and use. The first filter screen 2 can be disassembled and cleaned to ensure the use efficiency of the first filter screen 2. ;

[0029] The above-mentioned front, back, left, right, top and bottom are all based on the figures in the specification. Figure 1 As a benchmark, according to the person's observation perspective, the side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and so on.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the scope of protection of the present invention.

[0031] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A cutting device for manufacturing a thin film pressure sensitive chip, characterized in that: The invention comprises a placement frame (13) and a cutting motor (1); the lower side and the front side of the placement frame (13) are both in an open state; the cutting motor (1) is installed on the outer wall of the placement frame (13); the output end of the cutting motor (1) is provided with a first rotating shaft (11), and the first rotating shaft (11) extends into the placement frame (13); a diamond sheet (12) is installed at the end of the first rotating shaft (11); a pair of symmetrically distributed collecting blocks (14) are provided in the placement frame (13), and the pair of collecting blocks (14) are symmetrically distributed with respect to the diamond sheet (12); the opposite surfaces of the pair of collecting blocks (14) are both inclined surfaces, and the inclined surfaces are both passed through the first inner arc surface (15 ) and a transition arc surface (16); a first cavity (17) is provided in the collecting block (14); a first through groove (18) is provided on the first inner arc surface (15), and the first through groove (18) and the first cavity (17) are interconnected; a first filter net (2) is provided in the first cavity (17), and the first filter net (2) covers the first through groove (18); a cooling element is provided in the placement frame (13), and the cooling element sprays cooling liquid on the diamond sheet (12); the position of the collecting block (14) is adjusted by an adjusting element; a water through groove (76) is provided at the bottom end of the collecting block (14), and the water through groove (76) and the first cavity (17) are interconnected.

2. A cutting device for manufacturing a thin film pressure sensitive chip according to claim 1, characterized in that: The first filter screen (2) is composed of a group of first plane screens (22) and a group of inner arc screens (21) alternately; a group of scraper plates (23) are fixedly connected to the first through groove (18); the scraper plates (23) and the first filter screen (2) are mutually fitted; the first filter screen (2) is circulated back and forth by a power part; the first filter screen (2) and the first inner arc surface (15) are arranged in parallel and have the same shape.

3. A cutting device for manufacturing a thin film pressure sensitive chip according to claim 2, characterized in that: The power member comprises a second through slot (3) and a first covering plate (31); the side wall of the first cavity (17) is provided with the second through slot (3); the side wall of the collecting block (14) is provided with the first covering plate (31) by means of bolts, and the first covering plate (31) covers the second through slot (3); the first slide plate (32) and the second slide plate (33) are respectively fixedly connected to the two side walls of the first filter screen (2); the first slide plate (32) and the second slide plate (33) slide on the inner wall of the first cavity (17); the first slide plate (32) and the second slide plate ( 33) are symmetrically arranged with respect to the first filter screen (2); the first slide plate (32) and the second slide plate (33) are connected via a connecting column (34); the side wall of the first slide plate (32) is fixedly connected to the side wall of the first covering plate (31) via a first spring (35); a movable plate (36) is fixedly connected to the side wall of the second slide plate (33), and the movable plate (36) and the first filter screen (2) are parallel to each other and have similar shapes; the movable plate (36) penetrates through and extends out of the collecting block (14); the movable plate (36) is moved by the circulation unit.

4. A cutting device for manufacturing a thin film pressure sensitive chip according to claim 3, characterized in that: The circulation unit comprises a first groove (4) and a second groove (46); the first groove (4) is provided on the inner wall of the placement frame (13); a first gear (41) is provided in the first groove (4), and the first gear (41) is fixedly connected to the first rotating shaft (11); a second gear (42) is rotatably connected in the first groove (4); the second gear (42) and the first gear (41) are meshed with each other; a first pin (43) is rotatably connected on the side wall of the second gear (42); a circular plate (44) is slidably connected in the first groove (4), and the first pin (43) is slidably connected in the inner wall of the circular plate (44); A pair of second grooves (46) symmetrically distributed about the first groove (4) are provided on the inner wall of the placement frame (13); the top view of the second groove (46) is a right triangle; a push plate (48) is slidably connected to the right-angled inclined surface of the second groove (46); the end of the push plate (48) and the movable plate (36) are in contact with each other; a first slide groove (47) is provided on the side wall of the push plate (48); push rods (45) are fixedly connected to the side walls of both sides of the circular plate (44), the end of the push rod (45) passes through the placement frame (13) and extends into the second groove (46), and the end of the push rod (45) is slidably connected to the first slide groove (47).

5. A cutting device for manufacturing a thin film pressure sensitive chip according to claim 4, characterized in that: The adjusting member comprises an upper and lower unit and a first inclined surface (5); a pair of symmetrically distributed first inclined surfaces (5) are provided on both side walls of the placement frame (13), and the pair of first inclined surfaces (5) are in an inverted "eight" shape; a second inclined surface (51) is provided on the side wall of the collection block (14), and the first inclined surface (5) and the second inclined surface (51) are arranged in parallel; the second inclined surface (51) of the collection block (14) is slidably connected to the first inclined surface (5).

6. A cutting device for manufacturing a thin film pressure sensitive chip according to claim 5, characterized in that: The upper and lower units include a threaded rod (53); a second slide groove (52) is provided on the top of the collecting block (14); an adjusting block (54) is slidably connected in the second slide groove (52); a threaded rod (53) is threadedly connected on the placement frame (13), and the bottom end of the threaded rod (53) extends into the placement frame (13) and is rotatably connected to the top end of the adjusting block (54).

7. A cutting device for manufacturing a thin film pressure sensitive chip according to claim 6, characterized in that: The cooling member comprises a V-shaped nozzle (61); the upper side of the placement frame (13) is in an open state, and a placement plate (6) is bolted to the upper opening; a pair of connecting pipes (62) symmetrically distributed about the diamond sheet (12) are fixedly connected to the placement plate (6), and the bottom end of the connecting pipe (62) is fixedly connected to the V-shaped nozzle (61); a water pump (63) is installed on the cutting motor (1); the water pump (63) is connected to the connecting pipe (62) through a hose (64); and a group of water outlets are opened on the V-shaped nozzle (61).

8. A cutting device for manufacturing a thin film pressure sensitive chip according to claim 7, characterized in that: The bottom ends of the pair of collecting blocks (14) are fixedly connected to adsorption blocks (7); the opposite surfaces of the pair of adsorption blocks (7) are provided with second inner arc surfaces (71); a second cavity (73) is provided in the adsorption block (7); a group of connecting grooves (74) are provided on the second inner arc surface (71); the connecting grooves (74) and the second cavity (73) are connected to each other; a pair of water passage grooves (76) are located between the pair of adsorption blocks (7); a second filter screen (75) is fixedly connected to the second cavity (73); a suction pipe (72) is provided on the outer wall of the placement frame (13), and the other end of the suction pipe (72) is connected to the second cavity (73).

9. A cutting device for manufacturing a thin film pressure sensitive chip according to claim 8, characterized in that: The second filter screen (75) is arranged in an inclined manner; the cross section of the second cavity (73) is in the shape of a letter "7"; the horizontal cavity bottom wall of the second cavity (73) is arranged in a concave manner; the second filter screen (75) is fixedly connected to the horizontal cavity of the second cavity (73); an arc-shaped through groove (8) is provided on the side wall of the adsorption block (7), and the arc-shaped through groove (8) and the horizontal cavity of the second cavity (73) are interconnected; an arc-shaped baffle (81) is provided in the arc-shaped through groove (8), and the arc-shaped baffle (81) is installed on the side wall of the adsorption block (7) by bolts; the second filter screen (75) is composed of a group of second plane nets (82) and inverted isosceles triangle nets (83); and the vertical length of the tip of a group of inverted isosceles triangle nets (83) increases in sequence from the direction away from the second inner arc surface (71).

10. A cutting method for manufacturing a thin film pressure sensitive chip, the method using the cutting device for manufacturing a thin film pressure sensitive chip as claimed in claim 9, characterized in that: The steps of this method are as follows: S1: Before cutting the round wafer, the positions of the collecting block (14) and the adsorption block (7) are adjusted by adjusting the adjusting member according to the thickness of the round wafer; S2: When the round wafer is cut, the cutting motor (1) works, the diamond sheet (12) cuts the wafer, and the cooling element sprays coolant to ensure the cutting state; S3: by setting up the first filter (2) and the second filter (75), the particles generated by the cutting of the diamond sheet (12) are collected and processed, thereby reducing the impact on the wafer cutting.

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