Hollow waveguide antenna based on LOP chip

By designing the adapter structural metal block and thermal interface material in the LOP chip hollow waveguide antenna, the risk of SMT process and the shortcomings of traditional heat dissipation methods are solved, efficient antenna assembly and heat dissipation are achieved, and the reliability and accuracy of the radar are improved.

CN119726093APending Publication Date: 2025-03-28JIANGSU SHUOBAID MICROELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202411855198.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-17
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

In the existing LOP technical solutions, due to the complex internal lines of the hollow waveguide antenna, the SMT process has a negative risk, and the detection of the hollow structure is difficult and costly; at the same time, the traditional heat dissipation method is prone to thermal failure and mechanical damage due to vibration and impact under on-board conditions.

Method used

A hollow waveguide antenna based on LOP chip is designed to diverge the radiation port of the LOP chip through a metal block adapter to provide sufficient multi-feeding space to meet the assembly requirements of the gap waveguide antenna, and to achieve efficient heat dissipation through the combination of thermal interface material and hollow waveguide transmission line.

Benefits of technology

This design effectively avoids the adverse risks of the SMT process, reduces costs, improves production yield, and avoids thermal failure and mechanical damage through efficient heat dissipation methods, ensuring the accuracy and reliability of the radar.

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Abstract

The invention discloses a hollow waveguide antenna based on an LOP chip, which comprises a hollow waveguide antenna body, an LOP chip and a PCB, and is characterized in that the hollow waveguide antenna body and the LOP chip are respectively positioned on the same side of the PCB; the PCB is located between a switching structure metal block and the hollow waveguide antenna body, the switching structure metal block is attached to the copper surface of the PCB, and the LOP chip is wrapped by the hollow waveguide antenna body; the surface, facing the PCB, of the switching structure metal block is provided with a switching inlet corresponding to a radiation port of the LOP chip, and the position, right facing the PCB, of a switching outlet located in the same surface with the switching inlet is provided with a PTH hole which is connected with a feed port of the gap waveguide antenna on the other side. According to the gap waveguide antenna, compact chip radiation ports can be dispersedly switched, and enough multi-feed-port space is provided for application of the gap waveguide antenna; and the heat dissipation mode is good, and the failure and damage risks caused by contact between the chip and the shell are avoided.
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Description

Technical Field

[0001] The invention relates to the technical field of waveguide antennas, and in particular to a hollow waveguide antenna based on a LOP chip. Background Art

[0002] With the competition of L3 intelligent driving technology at home and abroad, 77G 4D millimeter wave radar has become a key technical route. In order to improve the radar's transceiver performance, the 4D millimeter wave radar uses a three-dimensional waveguide antenna to replace the planar microstrip antenna in the 3D millimeter wave radar. At the same time, several major mainstream chip manufacturers have successively proposed LOP (Launch on Package) technology (also known as ROP technology, Radiator on Package) - the package radiation port is directly connected to the three-dimensional waveguide antenna feed point, which can further improve the gain of the waveguide radar compared to the traditional package port - PCB (Printed Circuit Board) - waveguide feed.

[0003] In the existing LOP technical solutions, such as Figure 1 , the radar rear shell wall 700 may transmit adverse factors of the external environment to the LOP chip 100. The SMT chip is placed on one side of the PCB, and the three-dimensional waveguide antenna is fixed on the other side. A PTH (Plating Through Hole) is set at the position where the package radiation port on the PCB is directly opposite to the waveguide antenna feed point, forming a very short hollow waveguide transmission line to maximize the chip performance. The LOP chip pursues miniaturization and multi-ports, making the package radiation port layout extremely compact; the waveguide antenna adopts the hollow waveguide principle, and its four-sided closed hollow structure must be processed in layers and then SMT precision welding.

[0004] The shortcomings of existing technologies are: 1. Hollow waveguide antennas have complex internal circuits and SMT processes have the risk of defects. In addition, SMT inspection of hollow structures is difficult and costly. In addition, the high temperature of the SMT process can cause potential damage to the plastic metallized antenna. The non-enclosed gap waveguide antenna using array pins along the transmission line does not have high assembly requirements, and the antenna can be assembled using a variety of methods such as scattered point SMT, screws, rivets, and hot melt. However, due to the compact arrangement of the LOP chip radiation port and the pin array around the gap waveguide transmission line, the high-performance, high-yield gap waveguide antenna cannot be used in the existing LOP solution.

[0005] 2. In existing LOP applications, the common heat dissipation method is to set a thermal interface material (thermal pad, thermal grease, etc.) on the top surface of the chip, and then contact it with the radar back shell (material: metal or plastic partially embedded in metal) to dissipate heat. This will cause thermal failure due to long-term vibration, impact, high and low temperature, etc., which will cause gaps in the thermal interface material, or mechanical damage to the chip due to impact, collision, etc. in vehicle-mounted conditions. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a hollow waveguide antenna based on a LOP chip. The hollow waveguide antenna based on the LOP chip can not only disperse and transfer the compact chip radiation port to provide sufficient multi-feed port space for the application gap waveguide antenna, but also improve the heat dissipation method to avoid the failure and damage risks caused by the contact between the chip and the shell.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is: a hollow waveguide antenna based on a LOP chip, comprising: a hollow waveguide antenna body, a LOP chip and a PCB circuit board, wherein the hollow waveguide antenna body and the LOP chip are respectively located on the same side of the PCB circuit board; The PCB circuit board is located between a switching structure metal block and the hollow waveguide antenna body, the switching structure metal block is bonded to the copper surface of the PCB circuit board, and the LOP chip is wrapped by the hollow waveguide antenna body; The surface of the transfer structure metal block facing the PCB circuit board has a transfer entrance corresponding to the radiation port of the LOP chip, and the transfer exit located on the same surface as the transfer entrance has a PTH hole at a position facing the PCB circuit board and is connected to the feed port of the gap waveguide antenna on the other side.

[0008] The further improved scheme in the above technical scheme is as follows: 1. In the above solution, a thermal conductive interface material is filled between the TOP surface of the LOP chip and the hollow waveguide antenna body.

[0009] 2. In the above scheme, a transmission line half groove is provided on the surface of the transfer structure metal block, and the transmission line half groove is bonded to the PCB circuit board to form a hollow waveguide transmission line.

[0010] 3. In the above scheme, the transmission line half slot extends radiating from the chip end entrance facing the LOP chip to the antenna end exit.

[0011] 4. In the above solution, a waveguide transfer transmission line is arranged inside the transfer structure metal block.

[0012] 5. In the above solution, the LOP chip is connected to the PCB circuit board through SMT solder balls.

[0013] 6. In the above solution, the transfer structure metal block is bonded to the copper surface of the PCB circuit board through SMT welding or fasteners, and the transfer structure metal block is a copper transfer structure block, a silver transfer structure block or an aluminum transfer structure block.

[0014] 7. In the above solution, the surface of the transfer structure metal block that is in contact with the PCB circuit board is provided with a positioning structure part and a fixing structure part.

[0015] 8. In the above scheme, the hollow waveguide antenna body includes a gap waveguide transmission line, and the gap waveguide transmission line further includes a transmission line half slot and a pin array; a plurality of EBG pins are arranged around the feed port of the hollow waveguide antenna body.

[0016] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: 1. The hollow waveguide antenna based on the LOP chip of the present invention can disperse and transfer the compactly arranged LOP radiation ports, so that the feed port spacing of the rear-end antenna is relatively large, so as to achieve sufficient space for the radiation antenna based on the gap waveguide principle. In actual production, the gap waveguide antenna can avoid the adverse risks of the SMT process compared to the hollow waveguide antenna, and at the same time prevent the thermal damage of the SMT high-temperature furnace to the plastic metallized antenna sheet, which can not only improve the production yield and reduce costs, but also ensure the antenna life and radar accuracy.

[0017] 2. The hollow waveguide antenna based on the LOP chip of the present invention quickly conducts the heat loss of the LOP chip to the outside through high thermal conductivity, avoiding high temperature generated by local heat concentration and reducing chip performance; compared with the traditional chip plus thermal conductive interface material, the heat dissipation method of conducting heat to the radar casing avoids thermal failure and mechanical damage caused by driving vibration, mechanical shock, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Attached Figure 1 It is a schematic diagram of an existing hollow waveguide antenna based on a LOP chip; Attached Figure 2 This is a schematic diagram of the structure of a gap waveguide antenna according to Embodiment 1 of the present invention; Attached Figure 3 This is a schematic diagram of the structure of a gap waveguide antenna according to Embodiment 2 of the present invention; Attached Figure 4 is an exploded view of the hollow waveguide antenna of the present invention; Attached Figure 5 It is an exploded view of the hollow waveguide antenna body of the present invention; Attached Figure 6 A three-dimensional diagram of a metal block of a transfer structure of the present invention; Attached Figure 7 It is a front perspective view of the transfer structure metal block of the present invention.

[0019] In the above drawings: 100, LOP chip; 1001, radiation port; 200, SMT solder ball; 300, PCB circuit board; 3001, PTH hole; 3002, welding interface between PCB and the transfer structure of the present invention; 400, existing hollow waveguide antenna; 4001, existing hollow waveguide transmission line; 500, hollow waveguide antenna body; 5001, gap waveguide transmission line; 500A, gap waveguide upper antenna sheet; 500B, gap waveguide lower antenna sheet; 5001A, transmission line half slot of gap waveguide antenna; 5001B, pin array; 5002, radiation port; 5003, EBG pin; 600, thermal conductive interface material; 700, radar rear shell wall; 2, transfer structure metal block; 21, transmission line half slot; 22, transfer outlet; 23, fixing hole; 24, positioning hole; 2021, waveguide transfer transmission line. DETAILED DESCRIPTION

[0020] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0021] Embodiment 1: A hollow waveguide antenna based on a LOP chip, comprising: a hollow waveguide antenna body 500, a LOP chip 100 and a PCB circuit board 300, characterized in that: the hollow waveguide antenna body 500 and the LOP chip 100 are respectively located on the same side of the PCB circuit board 300; The PCB circuit board 300 is located between a transfer structure metal block 2 and a hollow waveguide antenna body 500. The transfer structure metal block 2 is bonded to the copper surface of the PCB circuit board 300, and the LOP chip 100 is wrapped by the hollow waveguide antenna body 500. The surface of the transfer structure metal block 2 facing the PCB circuit board 300 has a transfer entrance corresponding to the radiation port 1001 of the LOP chip 100, and the transfer exit 22 located on the same surface as the transfer entrance has a PTH hole 3001 at a position facing the PCB circuit board 300 and is connected to the feed port of the gap waveguide antenna 500 on the other side.

[0022] A thermal interface material 600 is filled between the TOP surface of the LOP chip 100 and the hollow waveguide antenna body 500, which can dissipate heat through heat conduction to the hollow waveguide antenna body 500. It is worth noting that the thermal interface material 600 is completely between two objects inside the radar.

[0023] A transmission line half slot 21 is disposed on the surface of the transition structure metal block 2 , and the transmission line half slot 21 forms a hollow waveguide transmission line after being bonded to the PCB circuit board 300 .

[0024] The transmission line half slot 21 radiates from the chip end entrance facing the LOP chip 100 to the antenna end exit.

[0025] The LOP chip 100 is connected to the PCB circuit board 300 via the SMT solder balls 200 .

[0026] The transfer structure metal block 2 is bonded to the copper surface of the PCB circuit board 300 by SMT welding or fasteners. The transfer structure metal block 2 is a copper transfer structure block.

[0027] The surface of the transfer structure metal block 2 that is in contact with the PCB circuit board 300 is provided with positioning holes 24 and fixing holes 23 .

[0028] The hollow waveguide antenna body 500 comprises a gap waveguide transmission line 5001 , which further comprises a transmission line half slot 5001A and a pin array 5001B of the gap waveguide antenna. A plurality of EBG pins 5003 are arranged around the feed port of the hollow waveguide antenna body 500 .

[0029] Embodiment 2: A hollow waveguide antenna based on a LOP chip, comprising: a hollow waveguide antenna body 500, a LOP chip 100 and a PCB circuit board 300, characterized in that: the hollow waveguide antenna body 500 and the LOP chip 100 are respectively located on the same side of the PCB circuit board 300; The PCB circuit board 300 is located between a transfer structure metal block 2 and a hollow waveguide antenna body 500. The transfer structure metal block 2 is bonded to the copper surface of the PCB circuit board 300, and the LOP chip 100 is wrapped by the hollow waveguide antenna body 500. The surface of the transfer structure metal block 2 facing the PCB circuit board 300 has a transfer entrance corresponding to the radiation port 1001 of the LOP chip 100, and the transfer exit 22 located on the same surface as the transfer entrance has a PTH hole 3001 at a position facing the PCB circuit board 300 and is connected to the feed port of the gap waveguide antenna 500 on the other side.

[0030] A thermal interface material 600 is filled between the TOP surface of the LOP chip 100 and the hollow waveguide antenna body 500, which can dissipate heat through heat conduction to the hollow waveguide antenna body 500. It is worth noting that the thermal interface material 600 is completely between two objects inside the radar.

[0031] A waveguide transfer transmission line 2021 is disposed inside the transfer structure metal block 2 .

[0032] The LOP chip 100 is connected to the PCB circuit board 300 via the SMT solder balls 200 .

[0033] The transfer structure metal block 2 is bonded to the copper surface of the PCB circuit board 300 by SMT welding or fasteners, and the transfer structure metal block 2 is a silver transfer structure block.

[0034] The surface of the transfer structure metal block 2 that is in contact with the PCB circuit board 300 is provided with positioning holes 24 and fixing holes 23 .

[0035] The hollow waveguide antenna body 500 comprises a gap waveguide transmission line 5001 , which further comprises a transmission line half slot 5001A and a pin array 5001B of the gap waveguide antenna. A plurality of EBG pins 5003 are arranged around the feed port of the hollow waveguide antenna body 500 .

[0036] In actual production, the hollow waveguide antenna body 500 is often disassembled and processed and then reassembled. The disassembly method can be divided into two layers of antenna sheets 500A / 500B, or more layers; the transmission line half slot 5001A and the pin array 5001B of the gap waveguide antenna can be set on the same antenna sheet, or on different antenna sheets; the feed port of the hollow waveguide antenna body 500 requires a larger spacing than that of the hollow waveguide antenna, because a pin array needs to be set around its transmission line, and no less than a certain number of pins must be set between adjacent channels to achieve a decoupling effect; a number of pins also need to be set around the feed port of the hollow waveguide antenna body 500 to form an EBG pin 5003, and the radiation port 5002 of the hollow waveguide antenna body 500 realizes the transmission and reception of electromagnetic signals in space.

[0037] The waveguide transfer transmission line 1021 of Example 2 is arranged inside the structural block. Such structural blocks can be processed by metal 3D printing technology, or by disassembling and then assembling.

[0038] When using the above-mentioned hollow waveguide antenna based on the LOP chip, the compactly arranged LOP radiation ports can be dispersed and transferred, so that the feed port spacing of the rear antenna is relatively large, so as to achieve sufficient space for the radiation antenna based on the gap waveguide principle. In actual production, the gap waveguide antenna can avoid the adverse risks of the SMT process compared to the hollow waveguide antenna, and at the same time prevent the thermal damage of the SMT high-temperature furnace to the plastic metallized antenna sheet, which can not only improve the production yield and reduce costs, but also ensure the antenna life and radar accuracy; In addition, it quickly transfers the heat loss of the LOP chip to the outside through high thermal conductivity, avoiding high temperature caused by local heat concentration and reducing chip performance; compared with the traditional chip plus thermal conductive interface material, the heat dissipation method of conducting heat to the radar casing avoids thermal failure and mechanical damage caused by driving vibration, mechanical shock, etc.

[0039] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A hollow waveguide antenna based on a LOP chip, comprising: A hollow waveguide antenna body (500), a LOP chip (100) and a PCB circuit board (300), characterized in that the hollow waveguide antenna body (500) and the LOP chip (100) are respectively located on the same side of the PCB circuit board (300); The PCB circuit board (300) is located between a switching structure metal block (2) and a hollow waveguide antenna body (500); the switching structure metal block (2) is bonded to the copper surface of the PCB circuit board (300); and the LOP chip (100) is wrapped by the hollow waveguide antenna body (500); The surface of the transfer structure metal block (2) facing the PCB circuit board (300) has a transfer entrance corresponding to the radiation port (1001) of the LOP chip (100), and the transfer exit (22) located on the same surface as the transfer entrance has a PTH hole (3001) at a position facing the PCB circuit board (300) and is connected to the feed port of the gap waveguide antenna (500) on the other side.

2. The hollow waveguide antenna based on the LOP chip according to claim 1, characterized in that: A heat-conducting interface material (600) is filled between the TOP surface of the LOP chip (100) and the hollow waveguide antenna body (500).

3. The hollow waveguide antenna based on the LOP chip according to claim 1 or 2, characterized in that: A transmission line half slot (21) is provided on the surface of the transition structure metal block (2), and the transmission line half slot (21) forms a hollow waveguide transmission line after being bonded to the PCB circuit board (300).

4. The hollow waveguide antenna based on the LOP chip according to claim 3, characterized in that: The transmission line half slot (21) extends radiating from a chip end entrance facing the LOP chip (100) to an antenna end exit.

5. The hollow waveguide antenna based on the LOP chip according to claim 1 or 2, characterized in that: A waveguide switching transmission line (2021) is arranged inside the switching structure metal block (2).

6. The hollow waveguide antenna based on the LOP chip according to claim 1, characterized in that: The LOP chip (100) is connected to the PCB circuit board (300) via an SMT solder ball (200).

7. The hollow waveguide antenna based on the LOP chip according to claim 1, characterized in that: The transfer structure metal block (2) is bonded to the copper surface of the PCB circuit board (300) by SMT welding or fasteners, and the transfer structure metal block (2) is a copper transfer structure block, a silver transfer structure block or an aluminum transfer structure block.

8. The hollow waveguide antenna based on the LOP chip according to claim 1, characterized in that: The surface of the transfer structure metal block (2) that is in contact with the PCB circuit board (300) is provided with a positioning hole (24) and a fixing hole (23).

9. The hollow waveguide antenna based on the LOP chip according to claim 1, characterized in that: The hollow waveguide antenna body (500) comprises a gap waveguide transmission line (5001), and the gap waveguide transmission line (5001) further comprises a transmission line half slot (5001A) and a pin array (5001B) of the gap waveguide antenna; a plurality of EBG pins (5003) are arranged around the feed port of the hollow waveguide antenna body (500).

Citation Information

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