Printed circuit board, manufacturing method thereof, printed circuit board assembly and electronic equipment

Abstract

The embodiment of the invention provides a printed circuit board, a manufacturing method of the printed circuit board, a printed circuit board assembly and electronic equipment. The printed circuit board comprises n stacked insulating layers, and a metal layer is arranged between any two adjacent insulating layers. A metal layer is arranged on the outer side surface of at least one of the first insulating layer and the nth insulating layer; the metal layer on the outer side face comprises a bonding pad used for being connected with an electronic component. N is a natural number greater than 2. A cooling liquid total flow channel is formed in the whole n insulating layers and used for conducting heat dissipation on electronic components at the bonding pads. According to the embodiment of the invention, a fixing structure for fixing the radiator does not need to be additionally arranged on the printed circuit board, the space is saved, and the printed circuit board can be miniaturized.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit boards, and in particular to a printed circuit board and a manufacturing method thereof, a printed circuit board assembly and an electronic device. Background Art

[0002] Printed Circuit Board (PCB) is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. Because it is made using electronic printing technology, it is called a printed circuit board.

[0003] However, currently, electronic components that generate a lot of heat require additional heat sinks, which prevents the miniaturization of printed circuit boards. Summary of the invention

[0004] In view of the shortcomings of the existing methods, the present application proposes a printed circuit board and a manufacturing method thereof, a printed circuit board assembly and an electronic device to solve the technical problem that the existing printed circuit boards cannot be miniaturized.

[0005] In a first aspect, an embodiment of the present application provides a printed circuit board, comprising:

[0006] n stacked insulating layers; a metal layer is provided between any two adjacent insulating layers, and a metal layer is provided on the outer side of at least one of the first or nth insulating layers; the metal layer on the outer side includes a pad for connecting electronic components; n is a natural number greater than 2;

[0007] A cooling liquid main flow channel is opened in the overall n insulating layers to dissipate heat from the electronic components at the pads.

[0008] Optionally, the coolant main flow channel includes at least one coolant flow channel;

[0009] The cooling liquid flow channel is arranged in any one of the 2nd to n-1th insulating layers. Optionally, the first insulating layer where the solder pad is arranged is closer to at least one insulating layer where the cooling liquid flow channel is arranged than the nth insulating layer where the solder pad is not arranged.

[0010] Optionally, the coolant flow channel includes a first connecting flow channel, and in a plane parallel to the insulating layer, the first connecting flow channel is in a meandering, wavy or tortuous shape;

[0011] The orthographic projection of the closed figure surrounding the first connecting flow channel at the first or nth insulating layer at least partially overlaps with the orthographic projection of the electronic component connected by the pad at the same insulating layer.

[0012] Optionally, the coolant main flow channel further includes a coolant inlet and a coolant outlet;

[0013] The coolant inlet and the coolant outlet are both arranged in the first or nth insulating layer; or, the coolant inlet is arranged in one of the first or nth insulating layers, and the coolant outlet is arranged in another of the first or nth insulating layers.

[0014] Optionally, a first connecting hole and a second connecting hole are respectively formed at both ends of the first connecting flow channel;

[0015] Each of the second to n-1th insulating layers not provided with the coolant flow channel is provided with an interlayer through hole;

[0016] The first communication hole is aligned and communicated with one of the coolant inlet and the coolant outlet, and the second communication hole is aligned and communicated with the interlayer through hole.

[0017] Optionally, a third communication hole is provided in each of the second to n-1th insulation layers, and the third communication hole is aligned and communicated with the other interface of the coolant inlet and the coolant outlet;

[0018] At least one of the insulating layers not provided with the coolant flow channel is provided with a second connecting flow channel connecting the interlayer through hole and the third connecting hole, and / or at least one of the insulating layers provided with the coolant flow channel is provided with a third connecting flow channel connecting the second connecting hole and the third connecting hole.

[0019] Optionally, the metal layer between any two adjacent insulating layers includes a routing area;

[0020] The orthographic projection of the routing area at each of the insulating layers from the 2nd to the (n-1th) th layers where the coolant flow channel is not provided is located between the interlayer through hole and the third connecting hole.

[0021] Optionally, the metal layer on the outer side further includes a first joint pad and a second joint pad, wherein the first joint pad is closely connected to the outer periphery of the surface of the coolant inlet and is used to be connected to the first coolant joint;

[0022] The second joint pad is closely connected to the outer periphery of the surface of the coolant outlet and is used for connecting with the second cooling joint.

[0023] In a second aspect, an embodiment of the present application provides a printed circuit board assembly, comprising at least one electronic component and the printed circuit board described in the first aspect;

[0024] The electronic components are connected to the pads of the metal layer on the outer side of the printed circuit board.

[0025] Optionally, the printed circuit board assembly further includes a first coolant connector and a second coolant connector, wherein the first coolant connector is connected to the coolant inlet of the printed circuit board via a first connector pad; and the second coolant connector is connected to the coolant outlet of the printed circuit board via a second connector pad.

[0026] In a third aspect, an embodiment of the present application provides an electronic device, comprising: the printed circuit board described in the first aspect, or the printed circuit board assembly described in the second aspect.

[0027] In a fourth aspect, an embodiment of the present application provides a method for manufacturing a printed circuit board as described in the first aspect, comprising:

[0028] According to the designed routing set, a routing area is manufactured on the initial metal layer on the side of each insulating layer to obtain a metal layer corresponding to the insulating layer;

[0029] According to the design path of the coolant main flow channel, a coolant flow channel layer is opened in each insulating layer, and the coolant flow channel layer includes at least one of a coolant flow channel, a coolant inlet, a coolant outlet or an interlayer through hole;

[0030] The n insulating layers are aligned and pressed together to form the printed circuit board, and the coolant flow channel layers are connected to form a total coolant flow channel.

[0031] The beneficial technical effects brought about by the technical solution provided by the embodiment of the present application include:

[0032] By setting a total coolant flow channel in each insulating layer of the printed circuit board, the effect of heat dissipation for electronic components can be achieved without the need for an additional radiator or an additional fixing structure for fixing the radiator on the printed circuit board, which is conducive to saving space and can make the printed circuit board more miniaturized, thereby miniaturizing the electronic equipment.

[0033] Moreover, by setting a coolant flow channel layer in each insulating layer, n insulating layers are aligned and pressed to form a total coolant flow channel, that is, a two-dimensional structure (coolant flow channel layer) is formed in each insulating layer, and a three-dimensional structure (the total coolant flow channel) is formed after lamination, which is conducive to simplifying the production process.

[0034] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0036] Figure 1 A schematic cross-sectional view of a printed circuit board provided in an embodiment of the present application;

[0037] Figure 2 A schematic diagram of a three-dimensional structure of n insulating layers provided in an embodiment of the present application;

[0038] Figure 3 A schematic diagram of another three-dimensional structure of n insulating layers provided in an embodiment of the present application;

[0039] Figure 4 A schematic diagram of a three-dimensional structure of an embodiment of a printed circuit board provided in an embodiment of the present application, comprising five insulating layers;

[0040] Figure 5 A schematic diagram of a three-dimensional structure of an embodiment of a printed circuit board provided in an embodiment of the present application, comprising three insulating layers;

[0041] Figure 6 An exploded schematic diagram of a printed circuit board assembly provided in an embodiment of the present application;

[0042] Figure 7 A schematic diagram of a printed circuit board assembly provided in an embodiment of the present application;

[0043] Figure 8 for Figure 7 A schematic diagram of the three-dimensional structure of the cross section at AA is included in the figure;

[0044] Fig. 9 A schematic flow chart of a method for manufacturing a printed circuit board assembly provided in an embodiment of the present application.

[0045] Description of reference numerals:

[0046] 1-insulating layer; 11-cooling liquid main flow channel; 111-cooling liquid flow channel; 1111-first connecting flow channel; 1112-first connecting hole; 1113-second connecting hole; 112-cooling liquid inlet; 113-cooling liquid outlet; 114-interlayer through hole; 115-third connecting hole; 116-second connecting flow channel; 117-third connecting flow channel;

[0047] 2-metal layer; 21-pad;

[0048] 10- Printed circuit board;

[0049] 20-Electronic components;

[0050] 30-first coolant joint; 31-first joint pad;

[0051] 40 - second coolant connector; 41 - second connector pad. DETAILED DESCRIPTION

[0052] The embodiments of the present application are described below in conjunction with the drawings in the present application. It should be understood that the implementation methods described below in conjunction with the drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions of the embodiments of the present application.

[0053] Those skilled in the art will appreciate that, unless expressly stated otherwise, the singular forms "a", "an", "said" and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present application refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the implementation of other features, information, data, steps, operations, elements, components and / or combinations thereof supported by the technical field. The term "and / or" used herein refers to at least one of the items defined by the term, for example, "A and / or B" may be implemented as "A", or as "B", or as "A and B".

[0054] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0055] The research and development ideas of this application include: In the related technology, it is necessary to cover the surface of the electronic components with high heat generation with additional heat sinks. The heat sink occupies a large volume, and it is necessary to design a structure to fix the heat sink on the printed circuit board, such as screw holes, which is not conducive to the miniaturization of the printed circuit board. Moreover, the heat sink needs air flow to dissipate heat, and the housing of the electronic device needs to be designed with special air holes, which makes the design of the electronic device more complicated.

[0056] The following is a detailed description of the technical solution of the present application and how the technical solution of the present application solves the above technical problems with specific embodiments. It should be noted that the following implementations can refer to, draw on or combine with each other, and the same terms, similar features and similar implementation steps in different implementations will not be described repeatedly.

[0057] The present application embodiment provides a printed circuit board 10. The structural diagram of the printed circuit board 10 is as follows: Figures 1 to 5 As shown, it comprises: n stacked insulating layers 1; a metal layer 2 is arranged between any two adjacent insulating layers 1.

[0058] A metal layer 2 is disposed on the outer side of at least one of the first or nth insulating layers 1; the metal layer 2 on the outer side includes a pad 21 for connecting electronic components; and n is a natural number greater than 2.

[0059] A cooling liquid main flow channel 11 is provided in the overall n insulating layers 1 for dissipating heat from the electronic components 20 at the pads 21 .

[0060] In this embodiment, the printed circuit board 10 is a multi-layer printed circuit board, and a cooling liquid main flow channel 11 is opened in the overall n insulating layers 1. The cooling liquid is passed into the cooling liquid main flow channel 11, and the electronic components 20 at the pads 21 can be cooled. The present application can achieve the effect of cooling the electronic components 20 by setting the cooling liquid main flow channel 11 in each insulating layer 1 of the printed circuit board 10, without the need to set up an additional radiator, and without setting up an additional fixing structure for fixing the radiator on the printed circuit board 10, which is conducive to saving space, and can make the printed circuit board 10 more miniaturized, thereby miniaturizing the electronic equipment.

[0061] It should be noted that the outer side surfaces of the first and nth insulating layers 1 may be provided with metal layers 2 for welding other electronic components. Figure 1 The dashed arrow in the middle indicates the flow direction of the coolant. Figure 1 It just indicates one flow direction, and the specific flow direction setting can be designed according to needs.

[0062] Optionally, refer to Figure 2 and Figure 3 The cooling liquid main flow channel 11 includes at least one cooling liquid flow channel 111, and the cooling liquid flow channel 111 is arranged in the 2nd to n-1th insulating layers 1.

[0063] In this embodiment, a coolant flow channel 111 is provided in the insulating layer 1 , so that the area through which the coolant flows in the insulating layer 1 can be increased, thereby increasing the heat dissipation area for the electronic components 20 .

[0064] It can be understood that the coolant flow channel 111 can be provided in any one insulating layer 1 or multiple insulating layers 1 from the 2nd to the (n-1)th insulating layers 1, and can be selected according to actual needs.

[0065] In an optional implementation, a pad 21 for connecting electronic components is provided on the first insulating layer 1 .

[0066] Optionally, refer to Figure 2 and Figure 3 The first insulating layer 1 where the solder pad 21 is located is closer to the insulating layer 1 where at least one coolant flow channel 111 is located than the nth insulating layer 1 where no solder pad 21 is provided.

[0067] In this embodiment, the insulating layer 1 where the coolant flow channel 111 is located is closer to the first insulating layer 1 where the pad 21 is located. In other words, the distance between the insulating layer 1 where at least one coolant flow channel 111 is located and the first insulating layer 1 where the pad 1 is located is smaller than the distance between the insulating layer 1 where at least one coolant flow channel 111 is located and the nth insulating layer 1 where no pad 21 is provided. Then, the straight-line distance between the coolant flow channel 111 and the pad 21 is shorter, and the coolant flow channel 111 can dissipate heat from the pad 21 faster.

[0068] In one embodiment, a solder pad 21 is provided in the first insulating layer 1, and a coolant channel 111 is provided in the second insulating layer 1. Then, the straight-line distance between the coolant channel 111 and the solder pad 21 is the shortest, and the coolant in the coolant channel 111 can dissipate heat from the solder pad 21 most quickly.

[0069] Optionally, refer to Figure 2 and Figure 3 The cooling liquid flow channel 111 includes a first connecting flow channel 1111. In a plane parallel to the insulating layer 1, the first connecting flow channel 1111 is in a meandering, wavy or tortuous shape.

[0070] The orthographic projection of the closed figure surrounding the first connecting flow channel 1111 on the first or nth insulating layer 1 at least partially overlaps with the orthographic projection of the electronic component 20 to which the pad 21 is used for connection on the same insulating layer 1 .

[0071] In this embodiment, the first connecting flow channel 1111 may be in a circular, wavy or zigzag shape, which can increase the path of the first connecting flow channel 1111 relative to a straight line, thereby increasing the cooling area of ​​the coolant in the first connecting flow channel 1111, thereby being able to more quickly remove the heat generated by the electronic components 20. Figure 2 and Figure 3 , the first connecting flow channel 1111 is in a zigzag shape. Specifically, the first connecting flow channel 1111 can be a groove.

[0072] In one embodiment, the orthographic projection of the closed figure surrounding the first connecting channel 1111 at the first or nth insulating layer 1 partially overlaps with the orthographic projection of the electronic component 20 connected by the pad 21 at the same insulating layer 1.

[0073] In this embodiment, part of the closed figure surrounding the first connecting channel 1111 can be arranged opposite to part of the electronic component 20, so that the first connecting channel 1111 of this part can directly cool the electronic component 20, which is conducive to taking away the heat generated by the electronic component 20 more quickly.

[0074] In another embodiment, the orthographic projection of the closed figure surrounding the first connecting channel 1111 at the first or nth insulating layer 1 completely overlaps with the orthographic projection of the electronic component 20 connected by the pad 21 at the same insulating layer 1 .

[0075] In this embodiment, the closed figure surrounding the first connecting flow channel 1111 can be arranged directly opposite to the electronic component 20 , so that the cooling area of ​​the electronic component 20 can be increased.

[0076] In another embodiment, the orthographic projection of the electronic component 20 for connection with the pad 21 at the same insulating layer 1 falls within the orthographic projection of the closed figure surrounding the first connecting channel 1111 at the first or nth insulating layer 1 .

[0077] In this embodiment, the closed pattern of the first connecting flow channel 1111 can cover the electronic component 20 , thereby being able to take away more heat generated by the electronic component 20 .

[0078] Optionally, refer to Figure 2 and Figure 3 The coolant main flow channel 11 further includes a coolant inlet 112 and a coolant outlet 113. The coolant inlet 112 and the coolant outlet 113 are both arranged in the first or nth insulating layer 1; or, the coolant inlet 112 is arranged in one of the first or nth insulating layers 1, and the coolant outlet 113 is arranged in another of the first or nth insulating layers 1.

[0079] In this embodiment, a coolant inlet 112 is provided in the first or nth insulating layer 1, and a coolant outlet 113 is provided in the first or nth insulating layer 1. The coolant enters other structures of the coolant main flow channel 11 through the coolant inlet 112, flows through other insulating layers 1, and then flows out through the coolant outlet 113. The coolant enters through the coolant inlet 112, takes away the heat generated by the electronic components 20, and then flows out through the coolant outlet 113, which can always ensure that the temperature of the coolant will not increase due to the heat generated by the electronic components 20, and can timely dissipate heat for the electronic components 20.

[0080] Specifically, refer to Figure 2 and Figure 3 The cooling liquid inlet 112 and the cooling liquid outlet 113 are both arranged in the first insulating layer 1, and the cooling liquid inlet 112 and the cooling liquid outlet 113 are respectively arranged on two opposite sides.

[0081] Alternatively, the cooling liquid inlet 112 and the cooling liquid outlet 113 are both arranged in the nth insulating layer 1, and the cooling liquid inlet 112 and the cooling liquid outlet 113 are respectively arranged on opposite sides; alternatively, the cooling liquid inlet 112 is arranged in the first insulating layer 1, and the cooling liquid outlet 113 is arranged in the nth insulating layer 1, and the cooling liquid inlet 112 and the cooling liquid outlet 113 can be arranged on both sides or on the same side; alternatively, the cooling liquid inlet 112 is arranged in the nth insulating layer 1, and the cooling liquid outlet 113 is arranged in the first insulating layer 1, and the cooling liquid inlet 112 and the cooling liquid outlet 113 can be arranged on both sides or on the same side.

[0082] Optionally, refer to Figure 2 and Figure 3 A first connecting hole 1112 and a second connecting hole 1113 are respectively formed at both ends of the first connecting channel 1111.

[0083] An interlayer through hole 114 is formed in each of the second to n-1th insulating layers 1 which are not provided with the coolant flow channel 111 .

[0084] The first communication hole 1112 is aligned and communicated with one of the coolant inlet 112 and the coolant outlet 113 , and the second communication hole 1113 is aligned and communicated with the interlayer through hole 114 .

[0085] In this embodiment, the second connecting hole 1113 is aligned and connected with the interlayer through hole 114, so that the coolant can flow from the first connecting channel 1111 to other insulating layers 1, or the coolant can flow from other insulating layers 1 to the first connecting channel 1111. The interlayer through hole 114 is provided to realize the layer exchange of the coolant, and the electronic components on the top and the electronic components on the bottom can both be cooled.

[0086] In one embodiment, reference Figure 2 The first connecting hole 1112 is aligned and connected with the coolant inlet 112, so the coolant flows into the first connecting channel 111 through the coolant inlet 112 and the first connecting hole 1112, and then flows into other insulating layers 1 through the second connecting hole 1113 and the interlayer through hole 114.

[0087] In another embodiment, reference Figure 3 , the first connecting hole 1112 is aligned and connected with the coolant outlet 113, so the coolant flows from the other insulating layer 1 into the first connecting channel 1111 through the interlayer through hole 114 and the second connecting hole 1113, and then flows out from the coolant outlet 113 through the first connecting hole 1112.

[0088] Optionally, refer to Figure 2 and Figure 3A third connecting hole 115 is provided in each of the 2nd to n-1th insulating layers 1 , and the third connecting hole 115 is aligned and connected with another interface of the coolant inlet 112 and the coolant outlet 113 .

[0089] like Figure 2 and Figure 3 As shown, at least one insulating layer 1 not provided with a coolant flow channel 111 is provided with a second connecting flow channel 116 connecting the interlayer through hole 114 and the third connecting hole 115, and / or, as Figure 5 As shown, at least one insulating layer 1 provided with a coolant flow channel 111 is provided with a third connecting flow channel 117 connecting the second connecting hole 1113 and the third connecting hole 115 .

[0090] In this embodiment, the third communication hole 115 is connected to the coolant inlet 112 or the coolant outlet 113 , so the coolant can flow in or out through the third communication hole 115 in the insulation layer 1 .

[0091] In one embodiment, the third connecting hole 115 is connected to the coolant inlet 112 , and the coolant flows into the second connecting channel 116 through the third connecting hole 115 , and then flows into the interlayer through hole 114 .

[0092] In another embodiment, the third connecting hole 115 is connected to the coolant outlet 113 , and the coolant flows into the second connecting channel 116 through the interlayer through hole 114 , and then flows into the third connecting hole 115 and then flows out.

[0093] Furthermore, the present application sets a third connecting channel 117 to connect the second connecting hole 1113 and the third connecting hole 115, so that the cooling liquid inlet 112, the first connecting channel 1111, the third connecting channel 117 and the cooling liquid outlet 113 are connected, so that the cooling liquid can directly form a loop in the insulating layer 1 where the cooling liquid channel 111 is set, which can speed up the circulation of the cooling liquid and further speed up the heat dissipation of the electronic components 20.

[0094] For example, Figure 4As shown, five insulating layers 1 are provided, a coolant inlet 112 and a coolant outlet 113 are provided in the first insulating layer 1, a first connecting hole 1112, a first connecting channel 1111, a second connecting hole 1113 and a third connecting hole 115 are provided in the second insulating layer 1, an interlayer through hole 114 and a third connecting hole 115 are provided in the third insulating layer 1, an interlayer through hole 114, a second connecting channel 116 and a third connecting hole 115 are provided in the fourth insulating layer 1, and a metal layer 2 (omitted in the figure) is provided on the outer side of the fifth insulating layer 1. Then, the coolant enters the first connecting channel 1111 through the coolant inlet 112 in the first insulating layer 1 and the first connecting hole 1112 in the second insulating layer 1, and then enters the interlayer through-hole 114 in the third insulating layer 1 and the fourth insulating layer 1 through the second connecting channel 116 and the third connecting hole 115 in the fourth insulating layer 1, and then enters the third insulating layer 1 and the third connecting hole 115 in the second insulating layer 1, and then flows out through the coolant outlet 113 in the first insulating layer 1. This is the flow direction of the coolant.

[0095] For example, Figure 5 As shown, three insulating layers 1 are provided, a coolant inlet 112 and a coolant outlet 113 are provided in the first insulating layer 1, a first connecting hole 1112, a first connecting channel 1111, a second connecting hole 1113, a third connecting channel 117 and a third connecting hole 115 are provided in the second insulating layer 1, and a metal layer 2 (omitted in the figure) is provided on the outer side of the third insulating layer 1. Then the coolant will enter the first connecting channel 1111 through the coolant inlet 112 and the first connecting hole 1112, and then enter the third connecting channel 117 through the second connecting hole 1113, and then enter the coolant outlet 113 through the third connecting hole 115, and flow out from the coolant outlet 113, thereby the flow direction of the coolant dissipates heat for the electronic components 20 in this process.

[0096] Optionally, the metal layer 2 between any two adjacent insulating layers 1 includes a routing area.

[0097] The orthographic projection of the routing area at each of the second to n−1th insulating layers 1 not provided with the cooling liquid flow channel 111 is located between the interlayer through hole 114 and the third connecting hole 115 .

[0098] In this embodiment, the interlayer vias 114 and the third connecting holes 115 need to avoid the routing area of ​​the metal layer 2 to prevent the routing area of ​​the metal layer 2 from failing and causing damage to the printed circuit board 10. When the coolant needs to avoid the routing area, the coolant can be switched to other insulating layers 1 through the interlayer vias 114.

[0099] Optionally, the metal layer 2 on the outer side of at least one of the first or nth insulating layers 1 further includes a first joint pad 31 and a second coolant joint 40 .

[0100] The first joint pad 31 is closely connected to the outer surface of the coolant inlet 112 for connecting with the first coolant joint 30 ; the second coolant joint 40 is closely connected to the outer surface of the coolant outlet 113 for connecting with the second coolant joint 40 .

[0101] In this embodiment, the first joint pad 31 and the second joint pad 41 are respectively arranged on the surface of the coolant inlet 112 and the coolant outlet 113, and can be used to connect with the first coolant joint 30 and the second coolant joint 40. Specifically, the connection method can be welding, and no additional new manufacturing equipment is required. The manufacturing process is simple and easy to operate.

[0102] Based on the same inventive concept, the embodiment of the present application provides a printed circuit board assembly, the schematic diagram of the printed circuit board assembly is as shown in Figures 6 to 8 As shown, it includes: at least one electronic component 20 and the printed circuit board 10 provided in the above embodiment.

[0103] The electronic component 20 is connected to the pad 21 of the metal layer 2 on the outer side of the printed circuit board 10 .

[0104] In this embodiment, by providing a cooling liquid main flow channel 11 in each insulating layer 1 of the printed circuit board 10, the effect of heat dissipation for the electronic components 20 can be achieved without the need to provide an additional radiator or an additional fixing structure for fixing the radiator on the printed circuit board 10. This can make the printed circuit board 10 more miniaturized, thereby miniaturizing the electronic device.

[0105] Alternatively, if Figures 6 to 8 As shown, the printed circuit board assembly also includes a first coolant connector 30 and a second coolant connector 40. The first coolant connector 30 is connected to the coolant inlet 112 of the printed circuit board 10 through a first connector pad 31; the second coolant connector 40 is connected to the coolant outlet 113 of the printed circuit board 10 through a second connector pad 41.

[0106] In this embodiment, the coolant is introduced or discharged through the first coolant joint 30 or the second coolant joint 40 to dissipate the heat of the electronic component 20, without the need to install an additional radiator externally, which can save space and is conducive to miniaturization of the electronic device. Moreover, the first joint pad 31, the first coolant joint 30, the second joint pad 41 and the second coolant joint 40 can be manufactured by welding, without the need for additional new manufacturing equipment, and the manufacturing process is simple and easy to operate.

[0107] Based on the same inventive concept, an embodiment of the present application provides an electronic device, including the printed circuit board provided by the above embodiment, or including the printed circuit board assembly provided by the above embodiment.

[0108] In this embodiment, since the electronic device adopts any one of the printed circuit boards or printed circuit board assemblies provided in the aforementioned embodiments, its principles and technical effects can be referred to in the aforementioned embodiments and will not be described in detail here.

[0109] Optionally, the electronic device may include a smart phone, a computer, a tablet computer, artificial intelligence, a wearable device or a smart mobile terminal.

[0110] It should be noted that electronic devices are not limited to the above-mentioned ones. Those skilled in the art can set any printed circuit board or printed circuit board assembly provided in the above-mentioned embodiments of the present application in different devices according to actual application requirements, so as to obtain the electronic device provided in the embodiments of the present application.

[0111] Based on the same inventive concept, the present application embodiment provides a method for manufacturing a printed circuit board as provided in the above embodiment, and the flow chart of the manufacturing method is as follows: Fig. 9 As shown, the following steps S1 to S3 are included:

[0112] S1: According to the designed routing set, a routing area is manufactured on the initial metal layer on the side of each insulating layer 1 to obtain a metal layer 2 corresponding to the insulating layer 1.

[0113] S2: According to the design path of the coolant main flow channel 11, a coolant flow channel layer is opened in each insulating layer 1, and the coolant flow channel layer includes at least one of the coolant flow channel 111, the coolant inlet 112, the coolant outlet 113 or the interlayer through hole 114.

[0114] S3: aligning and pressing n insulating layers 1 to form a printed circuit board 10, and connecting the coolant flow channel layers to form a coolant main flow channel.

[0115] In this embodiment, when manufacturing each insulating layer 1, it is necessary to design the cooling liquid main flow channel 11 in advance to dissipate heat for the electronic components 20 that need to be dissipated. The present application can achieve the effect of dissipating heat for the electronic components 20 by setting the cooling liquid main flow channel 11 in each insulating layer 1 of the printed circuit board 10, without the need to set up an additional radiator, and without the need to set up an additional fixing structure for fixing the radiator on the printed circuit board 10, which can make the printed circuit board 10 more miniaturized, and thus make the electronic equipment miniaturized.

[0116] Moreover, during the manufacturing process, the coolant main flow channel 11 can be processed by CNC milling, laser processing and other methods used in the process of manufacturing the metal layer 2, without the need for additional production equipment, which can save costs.

[0117] Furthermore, by setting a coolant flow channel layer in each insulating layer 1, n insulating layers 1 are aligned and pressed together to form a main coolant flow channel 11, that is, a two-dimensional structure (coolant flow channel layer) is formed in each insulating layer 1, and a three-dimensional structure (main coolant flow channel 11) is formed after lamination, which is conducive to simplifying the production process.

[0118] It should be noted that the wiring area of ​​the metal layer 2 can be designed according to actual needs; the design path of the cooling liquid main flow channel 11 is the path provided in the above embodiment, which will not be repeated here.

[0119] Optionally, in step S2,

[0120] The coolant channel layer further includes at least one of a third connecting hole 115 , a second connecting channel 116 or a third connecting channel.

[0121] In this embodiment, the specific design of the cooling liquid main flow channel 11 can refer to the printed circuit board provided in the above embodiment, and the cooling liquid main flow channel 11 is used to dissipate heat for the electronic components 20 that need to be dissipated.

[0122] Based on the same inventive concept, an embodiment of the present application provides a method for manufacturing a printed circuit board assembly as provided in the above embodiment, comprising the following steps:

[0123] The design routing set and the design path of the cooling liquid main flow channel 11 are determined according to the electronic components 20 that need to dissipate heat and the design positions of the electronic components 20 on the printed circuit board 10 .

[0124] According to the designed routing set, a routing area is manufactured on the initial metal layer on the side of each insulating layer 1 to obtain the metal layer 2 corresponding to the insulating layer 1.

[0125] According to the design path of the coolant main flow channel 11 , a coolant flow channel layer is opened in each insulating layer 1 , and the coolant flow channel layer includes at least one of a coolant flow channel 111 , a coolant inlet 112 , a coolant outlet 113 or an interlayer through hole 114 .

[0126] The n insulating layers 1 are aligned and pressed together to form a printed circuit board 10, and the coolant flow channel layers are connected to form a coolant main flow channel.

[0127] The electronic components 20 are connected to the pads 21 of the metal layer 2 on the outside of the printed circuit board 10 .

[0128] A first joint pad 31 on the metal layer 2 on the outside of the printed circuit board 10 and located at the periphery of the surface of the coolant inlet 112 is connected to the first coolant joint 30; a second joint pad 41 on the metal layer 2 on the outside of the printed circuit board 10 and located at the periphery of the surface of the coolant outlet 113 is connected to the second coolant joint 40.

[0129] In this embodiment, the first joint pad 31, the first coolant joint 30, the second joint pad 41 and the second coolant joint 40 can be manufactured by welding, without the need for additional new manufacturing equipment, and the manufacturing process is simple and easy to operate.

[0130] By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

[0131] 1. In the embodiment of the present application, by providing a cooling liquid main flow channel in each insulating layer of the printed circuit board, the effect of heat dissipation for electronic components can be achieved, without the need to additionally provide a radiator, nor is there any need to additionally provide a fixing structure for fixing the radiator on the printed circuit board, which is conducive to saving space, can make the printed circuit board more miniaturized, and further miniaturize the electronic equipment.

[0132] 2. In the embodiment of the present application, a coolant flow channel layer is provided in each insulating layer, and n insulating layers are aligned and pressed together to form a main coolant flow channel, that is, a two-dimensional structure (coolant flow channel layer) is formed in each insulating layer, and a three-dimensional structure (main coolant flow channel) is formed after lamination, which is conducive to simplifying the production process.

[0133] Those skilled in the art will appreciate that the various operations, methods, steps, measures, and schemes in the processes discussed in this application may be alternated, altered, combined, or deleted. Further, other steps, measures, and schemes in the various operations, methods, and processes discussed in this application may also be alternated, altered, rearranged, decomposed, combined, or deleted. Further, the steps, measures, and schemes in the prior art that are similar to those disclosed in this application may also be alternated, altered, rearranged, decomposed, combined, or deleted.

[0134] In the description of the present application, the directions or positional relationships indicated by words such as "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the exemplary directions or positional relationships shown in the accompanying drawings. They are for the convenience of describing or simplifying the description of the embodiments of the present application, and do not indicate or imply that the referred device or component must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present application.

[0135] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0136] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0137] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0138] It should be understood that, although the various steps in the flowchart of the accompanying drawings are displayed in sequence according to the indication of the arrows, the order of implementation of these steps is not limited to the order indicated by the arrows. Unless there is a clear description herein, in some implementation scenarios of the embodiments of the present application, the steps in each process can be performed in other orders according to demand. Moreover, some or all of the steps in each flow chart may include multiple sub-steps or multiple stages based on actual implementation scenarios. Some or all of these sub-steps or stages may be executed at the same time, or may be executed at different times in different scenarios at the execution time, and the execution order of these sub-steps or stages may be flexibly configured according to demand, and the embodiments of the present application do not limit this.

[0139] The above is only a partial implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the technical concept of the scheme of the present application, other similar implementation methods based on the technical ideas of the present application are also within the protection scope of the embodiments of the present application.

Claims

1. A printed circuit board, characterized in that: include: n stacked insulating layers; A metal layer is provided between any two adjacent insulating layers, and a metal layer is provided on the outer side surface of at least one of the first or nth insulating layers; the metal layer on the outer side surface includes a pad for connecting electronic components; n is a natural number greater than 2; A cooling liquid main flow channel is opened in the overall n insulating layers to dissipate heat from the electronic components at the pads.

2. The printed circuit board according to claim 1, characterized in that: The coolant main flow channel includes at least one coolant flow channel; The cooling liquid flow channel is arranged in any one of the 2nd to n-1th insulating layers.

3. The printed circuit board according to claim 2, characterized in that: The first insulating layer where the soldering pad is located is closer to the insulating layer where at least one coolant flow channel is located than the nth insulating layer where the soldering pad is not provided.

4. The printed circuit board according to claim 2, characterized in that: The coolant flow channel comprises a first connecting flow channel, and in a plane parallel to the insulating layer, the first connecting flow channel is in a zigzag, wavy or tortuous shape; The orthographic projection of the closed figure surrounding the first connecting flow channel at the first or nth insulating layer at least partially overlaps with the orthographic projection of the electronic component connected by the pad at the same insulating layer.

5. The printed circuit board according to claim 4, characterized in that: The coolant main flow channel also includes a coolant inlet and a coolant outlet; The coolant inlet and the coolant outlet are both arranged in the first or nth insulating layer; or, the coolant inlet is arranged in one of the first or nth insulating layers, and the coolant outlet is arranged in another of the first or nth insulating layers.

6. The printed circuit board according to claim 5, characterized in that: A first connecting hole and a second connecting hole are respectively formed at both ends of the first connecting flow channel; Each of the second to n-1th insulating layers not provided with the coolant flow channel is provided with an interlayer through hole; The first communication hole is aligned and communicated with one of the coolant inlet and the coolant outlet, and the second communication hole is aligned and communicated with the interlayer through hole.

7. The printed circuit board according to claim 6, characterized in that: A third connecting hole is provided in each of the second to n-1th insulating layers, and the third connecting hole is aligned and connected with the other interface of the coolant inlet and the coolant outlet; At least one of the insulating layers not provided with the coolant flow channel is provided with a second connecting flow channel connecting the interlayer through hole and the third connecting hole, and / or at least one of the insulating layers provided with the coolant flow channel is provided with a third connecting flow channel connecting the second connecting hole and the third connecting hole.

8. The printed circuit board according to claim 7, characterized in that: The metal layer between any two adjacent insulating layers includes a routing area; The orthographic projection of the routing area at each of the insulating layers from the 2nd to the (n-1th) th layers not provided with the coolant flow channel is located between the interlayer through hole and the third connecting hole.

9. The printed circuit board according to claim 5, characterized in that: The metal layer on the outer side further comprises a first joint pad and a second joint pad, wherein the first joint pad is closely connected to the outer periphery of the surface of the coolant inlet and is used to be connected to the first coolant joint; The second joint pad is closely connected to the outer periphery of the surface of the coolant outlet and is used for connecting with the second cooling joint.

10. A printed circuit board assembly, characterized in that: A printed circuit board comprising at least one electronic component and any one of claims 1 to 9; The electronic components are connected to the pads of the metal layer on the outer side of the printed circuit board.

11. The printed circuit board assembly according to claim 10, characterized in that It also includes a first coolant connector and a second coolant connector, wherein the first coolant connector is connected to the coolant inlet of the printed circuit board via a first connector pad; and the second coolant connector is connected to the coolant outlet of the printed circuit board via a second connector pad.

12. An electronic device comprising the printed circuit board according to any one of claims 1 to 9, or comprising the printed circuit board assembly according to any one of claims 10 to 11.

13. A method for manufacturing a printed circuit board according to any one of claims 1 to 9, characterized in that: include: According to the designed routing set, a routing area is manufactured on the initial metal layer on the side of each insulating layer to obtain a metal layer corresponding to the insulating layer; According to the design path of the coolant main flow channel, a coolant flow channel layer is opened in each insulating layer, and the coolant flow channel layer includes at least one of a coolant flow channel, a coolant inlet, a coolant outlet or an interlayer through hole; The n insulating layers are aligned and pressed together to form the printed circuit board, and the coolant flow channel layers are connected to form a total coolant flow channel.

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