Electronic assembly and electronic equipment

Abstract

The invention provides an electronic assembly and electronic equipment, the electronic assembly comprises an electronic module and a structural member, a welding layer is arranged between the electronic module and the structural member, and the welding layer is used for connecting the electronic module and the structural member. Wherein the welding layer comprises a thinning area and a thickening area, and the thickness of the thickening area is larger than that of the thinning area, so that the stress of the welding layer is reduced, the connection reliability between the electronic module and the structural part is improved, and the temperature cycle fatigue life of the welding structure is prolonged. The thickening area is located in the edge area of the welding layer, the stress of the edge area of the welding layer is usually large, and the thickening area is arranged in the edge area of the welding layer, so that the stress of the welding layer is reduced. According to the scheme, the thickness of the thinning area in the middle of the welding layer is small, the distance between the electronic module and the structural part is small, and miniaturization of the electronic assembly can be achieved. And when the structural member is the radiator, the thermal resistance between the radiator and the electronic module is relatively small, so that the heat conduction efficiency between the radiator and the electronic module can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic component and an electronic equipment. Background Art

[0002] With the development of electronic technology, electronic components are gradually evolving towards high efficiency, high speed and high power. The heat generated by electronic component groups is increasing, and the demand for heat dissipation is also increasing. Taking the motor control unit (MCU) as an example, the motor control unit includes a power module and a heat sink. The heat sink is bonded to the power module to dissipate heat for the power module. As the power module generates more and more heat, it is necessary to reduce thermal resistance from the wafer to the system to improve the system's outflow capacity.

[0003] At present, the heat dissipation of electronic modules is mainly achieved by thermally connecting the heat sink and the power module through front welding and silicone grease bonding. Among them, front welding refers to the power module being first welded to the heat sink, and then potting is performed to encapsulate the power module and the heat sink together. Silicone grease bonding refers to first encapsulating the power module into a power module, and then bonding the power module to the heat sink through a silicone grease layer. The heat dissipation capacity of the above two heat dissipation methods is difficult to meet the demand, and the performance of electronic components is also limited. For example, it is also difficult to improve the outflow capacity of the motor control unit. Summary of the invention

[0004] The present application provides an electronic component and an electronic device, wherein the welding strength between the electronic module and the structural parts in the electronic component is good, and the volume of the electronic component is small.

[0005] In the first aspect, the present application provides an electronic component, which includes an electronic module and a structural member, and a solder layer is provided between the electronic module and the structural member, and the solder layer is used to connect the electronic module and the structural member. The electronic module and the structural member are connected by welding, and the solder formed by welding forms the solder layer. Wherein, the solder layer includes a thinning area and a thickening area, and the thickness of the thickening area is greater than the thickness of the thinning area, which is conducive to reducing the stress of the solder layer. The thickening area is located in the edge area of ​​the solder layer, and the edge area of ​​the solder layer is usually under greater stress. The thickening area is arranged in the edge area of ​​the solder layer, which is conducive to significantly reducing the stress of the solder layer. In this scheme, the middle area of ​​the solder layer is a thinning area, and the thickness is relatively thin, so that the distance between the electronic module and the structural member is relatively close, which is conducive to miniaturization of the electronic component. When the structural member is a radiator, the thermal resistance between the radiator and the electronic module is also relatively small, which is conducive to improving the heat conduction efficiency between the radiator and the electronic module, improving the heat dissipation capacity of the electronic module, and thus improving the power and performance of the electronic module. In addition, the edge of the solder layer has a thickened area, which can reduce the stress of the solder layer in the edge area, improve the connection reliability between the electronic module and the structural parts, and improve the temperature cycle fatigue life of the solder structure.

[0006] In a specific technical solution, the thickened area of ​​the solder layer on the side facing the electronic module protrudes from the thinned area, the surface of the electronic module on the side facing the solder layer includes a first groove, and the thickened area of ​​the solder layer is welded to the first groove. During welding, the solder material flows and climbs or fills the first groove in a molten state to form the thickened area of ​​the solder layer.

[0007] In another specific technical solution, on the side of the welding layer facing the structural member, the thickened area protrudes from the thinned area, the surface of the structural member facing the welding layer includes a second groove, and the thickened area of ​​the welding layer is welded to the second groove.

[0008] The above-mentioned welding layer also includes a support block, and the support block is located in the thinning area of ​​the welding layer. The support block determines the thickness of the thinning area of ​​the welding layer. By reasonably selecting the size of the support block, the thickness of the thinning area of ​​the welding layer can be designed appropriately.

[0009] There are many options for the shape and position of the thickened area. For example, in an optional technical solution, the thickened area of ​​the weld layer includes an annular thickened area surrounding the thinned area. The edge of the entire weld layer is a thickened area, which has a better effect of reducing stress on one hand, and on the other hand, the stress around the weld layer is more uniform.

[0010] In another optional technical solution, the thickened area of ​​the solder layer includes two strip-shaped thickened areas, which are arranged at opposite ends of the thinned area. Specifically, the thickened area can be located at the edge of the high stress area of ​​the solder layer.

[0011] In another optional technical solution, the thickened area of ​​the solder layer includes a corner thickened area, and the corner thickened area is arranged at the corner of the solder layer. Specifically, the thickened area of ​​the solder layer may include a plurality of corner thickened areas, and a corner thickened area is arranged at each corner of the solder layer. Generally, stress concentration is prone to occur at the corners of the solder layer. By arranging the thickened area at the corner, it is beneficial to reduce the stress of the solder layer in a targeted manner and improve the connection reliability between the electronic module and the structural component.

[0012] The thickness of the thickened area of ​​the solder layer gradually increases in the direction toward the edge of the solder layer. Generally, the closer to the edge of the solder layer, the greater the stress. In this solution, the thickness of the thickened area is greater in the area where the stress is greater. The thickness of the thickened area changes continuously, so that the stress also changes continuously, and stress concentration is not easy to occur, which is beneficial to improving the stress uniformity of the solder layer and improving the connection reliability between the electronic module and the structural parts.

[0013] In another technical solution, the thickened area of ​​the welding layer includes a first sub-area and a second sub-area, the second sub-area is located on the side of the first sub-area facing the edge of the welding layer, and the thickness of the second sub-area at any position is greater than the thickness of the first sub-area at any position, that is, the thickened area forms a step structure in the first sub-area and the second sub-area. The thickness of the thickened area of ​​the welding layer decreases in the direction toward the edge, the stress in the part close to the edge of the welding layer is large, and the thickness of the corresponding thickened area is large, which is conducive to targeted stress release and improves the stress release effect of the welding layer.

[0014] Regarding the thickness of the thickened area and the thinned area, in the technical solution of the present application, the thickness difference between the maximum thickness of the thickened area and the thickness of the thinned area is 0.1mm to 4mm. When the thickness difference is less than 0.1mm, the effect of reducing stress is insufficient; and when the thickness difference is greater than 4mm, the stress release effect is excessive, and the thickened layer does not need to be set too thick. In addition, if the thickness difference is too large, the difficulty of the welding process will also increase.

[0015] The thickness of the thinned area is 0.05-2 mm, so that the welding layer 3 has sufficient welding strength in the thinned area 31 and can conduct heat well, thereby improving the heat conduction efficiency.

[0016] The width of the thickened area in the direction perpendicular to the edge is 1% to 25% of the width of the solder layer in the same direction. Providing the thickened area 32 in the above region can release the stress of the solder layer 3 to meet the connection strength requirements between the electronic module 1 and the structural member 2.

[0017] Specifically, the width of the thickened area along the direction perpendicular to the edge may be 0.5 mm to 20 mm.

[0018] In a specific technical solution, the electronic module is a power module, the structural component is a radiator, and the radiator is used to dissipate heat for the power module. The thickened area at the edge of the solder layer can reduce stress, and the thinned area in the middle can improve the heat exchange efficiency between the radiator and the electronic module.

[0019] In a second aspect, the present application also provides an electronic device. The electronic device includes a circuit board and the electronic component, and the electronic component is connected to the circuit board. The electronic component is small in size, which is conducive to miniaturization of the electronic device. The heat dissipation effect of the electronic component can be better, which can increase the power of the electronic component and improve the power and performance of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0021] Figure 2 A schematic diagram of a top view structure of a welding layer in an embodiment of the present application;

[0022] Figure 3 A schematic diagram of a top view structure of a welding layer in an embodiment of the present application;

[0023] Figure 4 A schematic diagram of a top view structure of a welding layer in an embodiment of the present application;

[0024] Figure 5a A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0025] Figure 5b A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0026] Figure 5c A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0027] Figure 6a A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0028] Figure 6b A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0029] Figure 6c A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0030] Figure 6d A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0031] Figure 6e A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0032] Figure 7a A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0033] Figure 7b A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0034] Figure 7c A schematic diagram of the structure of an electronic component in an embodiment of the present application;

[0035] Figure 8 A schematic diagram of the structure of an electronic component in an embodiment of the present application.

[0036] Reference numerals:

[0037] 1-Electronic module;

[0038] 11-Substrate;

[0039] 12- Electronic module;

[0040] 2-Structural parts;

[0041] 3-welding layer;

[0042] 31-thinning area;

[0043] 32-thickening zone;

[0044] 321-first sub-area;

[0045] 322-Second sub-area;

[0046] 33-Support block. DETAILED DESCRIPTION

[0047] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0048] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0049] References to "one embodiment" or "a specific embodiment" described in this specification mean that one or more embodiments of the present application include a particular feature, structure or characteristic described in conjunction with the embodiment. The terms "include", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0050] In order to facilitate the understanding of the electronic components and electronic devices provided in the embodiments of the present application, the following first introduces their application scenarios. The electronic devices provided in the embodiments of the present application can be electronic devices such as communication devices (such as routers), computing devices (such as servers), network devices (such as switches) or storage devices (such as storage arrays); or, they can also be electronic devices such as optical modules, vehicle-mounted devices, electric vehicles or terminal devices. The present application has a variety of options for the specific types of electronic devices.

[0051] The electronic device in the embodiment of the present application includes a circuit board and an electronic component, and the electronic component is connected to the circuit board. Specifically, the electronic component and the circuit board are electrically connected to realize signal transmission.

[0052] Figure 1 is a schematic diagram of the structure of an electronic component in an embodiment of the present application, such as Figure 1As shown, in one embodiment, the electronic component includes an electronic module 1 and a structural member 2, and a welding layer 3 is provided between the electronic module 1 and the structural member 2, and the welding layer 3 is used to connect the electronic module 1 and the structural member 2. The electronic module 1 and the structural member 2 are connected by a welding process. The welding layer 3 includes a thinning area 31 and a thickening area 32, the thickness of the thickening area 32 is greater than the thickness of the thinning area 31, and the thickening area 32 is located at the edge area of ​​the welding layer 3.

[0053] There are also many options for the specific types of the above-mentioned electronic components, as long as they include an electronic module 1 and a structural part 2 connected by a welding process. The coefficient of thermal expansion (CTE) of the electronic module 1 is different from that of the structural part 2, resulting in a CTE mismatch between the electronic module 1 and the structural part 2, resulting in stress in the solder layer 3, and reducing the connection reliability between the electronic module 1 and the structural part 2. In particular, the larger the welding area between the electronic module 1 and the structural part 2, the greater the stress of the solder layer and the lower the reliability. In order to improve the connection reliability between the electronic module 1 and the structural part 2, the stress of the solder layer 3 can be reduced by thickening the solder layer 3, thereby reducing the degree of CTE mismatch between the electronic module 1 and the structural part 2. However, for some specific application scenarios, such as high requirements for product miniaturization, or the structural part 2 is a heat sink, and the heat conduction efficiency between the electronic module 1 and the structural part 2 is high, the above-mentioned solder layer 3 needs to be thin. There is a contradiction between the need to reduce the stress of the solder layer 3 and the need to thin the solder layer 3.

[0054] In the technical solution of the present application, the middle part of the solder layer 3 is a thinning area 31, which is relatively thin, so that the distance between the electronic module 1 and the structural component 2 is relatively close, which is conducive to the miniaturization of the electronic assembly. When the structural component 2 is a radiator, the thermal resistance between the radiator and the electronic module 1 is also relatively small, which is conducive to improving the heat conduction efficiency between the radiator and the electronic module 1, and is conducive to improving the power of the electronic module 1 and the performance of the electronic module. In addition, the edge of the solder layer 3 has a thickening area 32, which can reduce the stress of the solder layer 3 in the edge area, improve the connection reliability between the electronic module 1 and the structural component 2, and improve the temperature cycle fatigue life of the welding structure.

[0055] In a specific embodiment, the electronic module 1 can be a power module, which can be specifically packaged by a power module. Specifically, two or more power modules can be combined according to certain functions and then packaged into a power module through a packaging process. The structural member 2 can be a radiator, and the radiator and the power module are connected by a welding process to achieve post-welding direct cooling of the power module, which has good thermal conductivity, so that the heat dissipation capacity of the electronic component is stronger, thereby improving the performance of the electronic component. The technical solution of the embodiment of the present application has obvious advantages for scenarios with a large area of ​​the welding layer 3.

[0056] For example, the above-mentioned electronic component is a motor control unit, that is, a motor controller. The motor control unit is used to control the rotation state of the motor according to the instructions of the vehicular communication unit (VCU). The embodiment of this scheme improves the heat dissipation capacity of the motor control unit, which can improve the outflow capacity of the motor control unit. The outflow capacity of the motor control unit is one of the key indicators for evaluating the functional characteristics of the motor control unit. The higher the outflow capacity, the better the performance of the motor control unit. By adopting the technical solution of the present application, the outflow capacity of the motor control unit can be improved by more than 5%. In addition, the structural reliability of the motor control unit is also high.

[0057] In a specific embodiment, the electronic module 1 and the structural component 2 can be connected by welding using a welding process such as sintering welding or soldering, so as to form the welding layer 3 .

[0058] The present application has a variety of options for implementing the solution of making the thickness of the thickened area 32 of the welding layer 3 greater than the thickness of the thinned area 31, for example, Figure 1 As shown, in one embodiment, on the side of the solder layer 3 facing the electronic module 1, the thickened area 32 protrudes from the thinned area 31. Correspondingly, the surface of the electronic module 1 on the side facing the solder layer 3 includes a first groove, and the thickened area 32 of the solder layer 3 is welded to the first groove. The first groove accommodates the thickened area 32 of the solder layer 3. In this embodiment, the first groove is provided on the surface of the electronic module 1 on the side facing the solder layer 3, which facilitates the formation of the thickened area 32 of the solder layer 3. In addition, the surface of the solder layer 3 facing the electronic module 1 is consistent in shape with the surface of the electronic module 1 facing the solder layer 3, which facilitates the improvement of the connection reliability between the electronic module 1 and the solder layer 3.

[0059] In a specific embodiment, during the welding process, the welding material flows and climbs or fills the first groove in a molten state to form a thickened area 32 of the welding layer 3 .

[0060] Please continue to refer to Figure 1 In one embodiment, the thickened area 32 of the solder layer 3 is protruding from the thinned area 31 on the side of the solder layer 3 facing the structural member 2, and the surface of the structural member 2 facing the solder layer 3 includes a second groove, and the thickened area 32 of the solder layer 3 is connected by welding to the second groove. The second groove accommodates the thickened area 32 of the solder layer 3. In this embodiment, the second groove is provided on the surface of the electronic module 1 facing the solder layer 3, so as to facilitate the formation of the thickened area 32 of the solder layer 3. In addition, the surface of the solder layer 3 facing the structural member 2 is consistent with the surface of the structural member 2 facing the solder layer 3, so as to facilitate the improvement of the connection reliability between the structural member 2 and the solder layer 3.

[0061] Please continue to refer to Figure 1In one embodiment, the solder layer 3 includes a support block 33, and the support block 33 is located in the thinning area 31 of the solder layer 3. The thickness of the thinning area 31 is affected by the support block 33. When the support block 33 is small, the thinning area 31 is thinner, and when the support block 33 is large, the thinning area 31 is thicker. By reasonably selecting the size of the support block 33, a suitable thickness of the thinning area 31 of the solder layer 3 can be designed. When the thickness of the thinning area 31 is fixed, the thickness of the thickening area 32 is mainly affected by the groove depth of the first groove of the electronic module 1 and / or the groove depth of the second groove of the structural member 2.

[0062] Similarly, during the welding process, the welding material flows and climbs or fills the second groove in a molten state to form a thickened area 32 of the welding layer 3 .

[0063] In one embodiment, the thickness of the thinning area 31 is 0.05 mm to 2 mm. Specifically, since the thickness of the thinning area 31 is basically determined by the thickness of the support block 33, the thickness of the support block 33 can be 0.05 mm to 2 mm. For example, the thickness of the thinning area 31 can be 0.1 mm, 0.5 mm, 0.8 mm, 1 mm, 1.2 mm, 1.5 mm or 1.8 mm, etc. This allows the welding layer 3 to have sufficient welding strength in the thinning area 31, and to conduct heat well, thereby improving the heat conduction efficiency.

[0064] The thickened area 32 of the above-mentioned welding layer 3 is located at the edge of the welding layer 3, but the specific position and shape of the thickened area 32 of the welding layer 3 at the edge of the welding layer 3 also have many options. For example, Figure 2 Schematic diagram of a top view of the welding layer in the embodiment of the present application. Figure 2 As shown, in one embodiment, the thickened area 32 of the welding layer 3 includes an annular thickened area, and the annular thickened area surrounds the thinned area 31. In this embodiment, the thinned area 31 is located in the annular thickened area, and the edge of the entire welding layer 3 is the thickened area 32. On the one hand, the effect of reducing stress is better, and on the other hand, the stress on the peripheral side of the welding layer 3 is also more uniform.

[0065] Figure 3 Schematic diagram of a top view of the welding layer in the embodiment of the present application. Figure 3 As shown, in one embodiment, the thickened area 32 of the welding layer 3 includes two strip-shaped thickened areas, and the two strip-shaped thickened areas are arranged at opposite ends of the thinned area 31. In this solution, the welding layer 3 has only the strip-shaped thickened areas 32 at opposite ends. Specifically, the thickened areas 32 can be located at the edge of the high stress area of ​​the welding layer 3. Figure 4 Schematic diagram of a top view of the welding layer in the embodiment of the present application. Figure 4As shown, in one embodiment, the thickening area 32 of the welding layer 3 includes a corner thickening area, and the corner thickening area is arranged at the corner of the welding layer 3. Usually, stress concentration is prone to occur at the corners of the welding layer 3. By setting the thickening area 32 at the corner, it is beneficial to reduce the stress of the welding layer 3 in a targeted manner and improve the connection reliability between the electronic module 1 and the structural member 2. In a specific embodiment, a corner thickening area can be provided at each corner of the welding layer. The corners of the welding layer 3 can be a right angle or a rounded corner. When the thickening area 32 is a corner thickening area, the corner thickening area can be L-shaped, especially when the welding layer 3 is a square structure. Alternatively, the corner thickening area can also be a square corner thickening area. In addition, the shape of the welding layer 3 is not limited. In addition to the square shape, the welding layer 3 can also be a circular or irregular shape.

[0066] In addition to the above-mentioned embodiments, the position of the thickened area 32 can also be reasonably arranged according to actual needs, specifically, the thickened area 32 is located at the edge of the welding layer 3. When there are multiple thickened areas 32, the multiple thickened areas 32 can be evenly distributed at the edge of the welding layer 3. In addition, by analyzing the stress distribution of the welding layer 3, the thickened area 32 can be set at a position with higher stress.

[0067] Please continue to refer to Figure 2 and Figure 3 , the width h of the thickened area 32 along the direction perpendicular to the edge is 1% to 25% of the width L of the solder layer 3 in the same direction, that is, 1% L≤h≤25% L. The thickened area 32 is arranged in the above-mentioned area to release the stress of the solder layer 3 to meet the connection strength requirements between the electronic module 1 and the structural component 2. Specifically, the smaller the above-mentioned percentage is, the smaller the width h of the thickened area 32 along the direction perpendicular to the edge, the larger the area of ​​the thinned area 31 is, and the smaller the volume of the electronic component is. When the above-mentioned structural component 2 is a radiator, the higher the heat conduction efficiency between the above-mentioned electronic module 1 and the structural component 2 is. The larger the above-mentioned percentage is, the larger the width h of the thickened area 32 along the direction perpendicular to the edge, and the larger the area of ​​the thickened area 32 is, which is more conducive to improving the connection strength between the electronic module 1 and the structural component 2.

[0068] Specifically, the width of the thickened area 32 along the direction perpendicular to the edge can be 0.5 mm to 20 mm. For example, the width of the thickened area 32 along the direction perpendicular to the edge is 1 mm, 2 mm, 5 mm, 6 mm, 6.5 mm, 7 mm, 8 mm, 10 mm, 10.5 mm, 11 mm, 12 mm, 15 mm or 18 mm.

[0069] The thickened area 32 is formed by providing a first groove in the electronic module 1 and / or providing a second groove in the structural member 2. The definition of the thickened area 32 in the present application is equivalent to the definition of the size, shape and position of the first groove in the electronic module 1, and is also equivalent to the definition of the size, shape and position of the second groove in the structural member 2.

[0070] In the present application, the thickened area 32 can avoid part of the electronic module 1 and the structural member 2, then the first groove can avoid part of the electronic module 1, and / or the second groove can avoid the component area of ​​the structural member 2. The position of the thickened area 32 can be reasonably set according to the actual needs of the electronic module 1 and the structural member 2. For example, the thickened area 32 is set at the position where the electronic module 1 and the structural member 2 are convenient for slotting, and the thinned area 31 is set in the area where the distance between the electronic module 1 and the structural member 2 needs to be smaller.

[0071] like Figure 1 As shown, in a specific embodiment, the thickened area 32 of the solder layer 3 protrudes from the thinned area 31 on the side facing the electronic module 1, and protrudes from the thinned area 31 on the side facing the structural member 2. In other words, the thickened area 32 protrudes from the thinned area 31 on both sides of the solder layer 3. Accordingly, in order to form the above-mentioned thickened area 32, the electronic module 1 has a first groove, and the structural member 2 has a second groove.

[0072] Figure 5a to Figure 5c is a schematic diagram of the structure of the electronic components in the embodiment of the present application, such as Figure 5a to Figure 5c As shown, in a specific embodiment, Figure 5a and Figure 5b As shown, the thickened area 32 of the solder layer 3 can protrude the thinned area 31 only toward one side of the electronic module 1. In this case, only the electronic module 1 is provided with the first groove; or Figure 5c As shown, the thickened area 32 of the welding layer 3 can protrude from the thinned area 31 only toward one side of the structural member 2, and at this time, only the structural member 2 is provided with the second groove.

[0073] The electronic module 1 in the present application includes a substrate 11 and an electronic module 12. For example, the electronic module 12 may be a power module. The electronic module 12 and the substrate 11 are packaged into an integral structure. When the electronic module 1 forms a first groove, Figure 5a As shown, the first groove can be located at the peripheral side of the electronic module 12 to avoid the electronic module 12, and the structure of the electronic module 12 does not need to be improved. Accordingly, in this embodiment, the thickened area 32 of the solder layer 3 is also located at the peripheral side of the electronic module 12. Figure 5bAs shown, the first groove can also be located at the edge of the electronic module 12 and the substrate 11. Accordingly, in this embodiment, the thickened area 32 of the solder layer 3 can partially overlap with the electronic module 12. Alternatively, the first groove can also be set in the electronic module 12 according to the actual product structure. Accordingly, in this embodiment, the thickened area 32 of the solder layer 3 is located in the electronic module 12.

[0074] In the embodiment of the present application, the surface of the thickened area 32 can be a plane, a curved surface, or a stepped surface, and correspondingly, the bottom of the first groove and / or the second groove can be a plane, a curved surface, or a stepped surface.

[0075] like Figure 1 , Figure 5a to Figure 5c As shown, the surface of the thickened area 32 is a plane, and the surface of the thinned area 31 is also a plane. The surface of the thickened area 32 is parallel to the surface of the thinned area 31, and the thickness of different positions of the thickened area 32 is the same. It is worth noting that the thickness of different positions of the thickened area 32 is the same here means that it is roughly the same, or the design thickness of different positions of the thickened area 32 is the same, and the actual product is allowed to have a certain tolerance, error or deviation.

[0076] Figure 6a to Figure 6e is a schematic diagram of the structure of the electronic components in the embodiment of the present application, such as Figure 6a to Figure 6e As shown, in a specific embodiment, Figure 6a As shown, the thickened area 32 of the solder layer 3 only protrudes from the thinned area 31 toward one side of the electronic module 1; or Figure 6b As shown, the thickened area 32 of the welding layer 3 only protrudes from the thinned area 31 toward one side of the structural member 2; or, as Figure 6c to Figure 6e As shown, the thickened area 32 of the solder layer 3 protrudes from the thinned area 31 on the side facing the electronic module 1, and the thinned area 31 protrudes from the side facing the structural member 2. Figure 6c As shown, the structure of the thickened area 32 of the solder layer 3 on the side facing the electronic module 1 is symmetrical with the structure on the side facing the structural member 2. Figure 6d and Figure 6e As shown, the structure of the thickened area 32 of the solder layer 3 on the side facing the electronic module 1 is different from the symmetrical structure of the structure on the side facing the structural component 2 .

[0077] In a specific embodiment, there are many options for the specific structure of the thickened area 32. For example, Figure 6a to Figure 6eAs shown, the thickness of the thickened area 32 of the above-mentioned solder layer 3 gradually increases in the direction toward the edge of the solder layer 3. In this solution, at least one surface of the thickened area 32 is a plane and an inclined surface, and the inclined surface forms a certain angle with the surface of the thinned area 31. Generally, the closer to the edge of the solder layer 3, the greater the stress. In this embodiment, the thickness of the thickened area 32 is greater in the area with greater stress. The continuous change of the thickness of the thickened area 32 can make the stress also change continuously, and stress concentration is not easy to occur, which is beneficial to improve the stress uniformity of the solder layer 3 and improve the connection reliability between the electronic module 1 and the structural component 2.

[0078] Figure 7a to Figure 7c is a schematic diagram of the structure of the electronic components in the embodiment of the present application, such as Figure 7a to Figure 7c As shown, in a specific embodiment, the thickened area 32 of the welding layer 3 includes a first sub-area 321 and a second sub-area 322, the second sub-area 322 is located on the side of the first sub-area 321 facing the edge of the welding layer 3, and the thickness of the second sub-area 322 at any position is greater than the thickness of the first sub-area 321 at any position. In this embodiment, the thickness of the sub-area closer to the edge of the welding layer 3 is greater, and the thickness of the thickened area 32 of the welding layer 3 decreases in the direction toward the edge. The stress in the part close to the edge of the welding layer 3 is greater, and the corresponding thickness of the thickened area 32 is greater, which is conducive to targeted stress release and improves the stress release effect of the welding layer 3. In this embodiment, at least one surface of the thickened area 32 of the welding layer 3 is a step surface. In this solution, the step surface is located on the side of the welding layer 3 facing the electronic module 1, and the first groove on the side of the electronic module 1 is a step groove, which is easier to prepare; the step surface is located on the side of the welding layer 3 facing the structural member 2, and the second groove on the side of the structural member 2 is a step groove, which is easier to prepare.

[0079] The figure only shows that the thickened region 32 includes two gradient parts. In other embodiments, the thickened region 32 may also include more gradients, or the step surface may include more steps.

[0080] In a specific embodiment, the thickness difference between the maximum thickness of the thickened area 32 of the welding layer 3 and the thickness of the thinned area 31 is 0.1 mm to 4 mm. In one embodiment, it can be considered that the difference between the maximum thickness and the minimum thickness of the welding layer 3 is 0.1 mm to 4 mm. When the above thickness difference is less than 0.1 mm, the effect of reducing stress is insufficient; and when the above thickness difference is greater than 4 mm, the stress release effect is excessive, and the thickened layer does not need to be set too thick. In addition, if the thickness difference is too large, the difficulty of the welding process will also increase.

[0081] In a specific embodiment, the electronic module 1 of the electronic assembly is a power module, and the structural member 2 is a heat sink. The thickness of the solder layer 3 in the thinning area 31 is 0.2 mm, the thickness of the thickening area 32 is 0.55 mm, and the width of the thickening area 32 along the direction perpendicular to the edge is 5 mm. In this embodiment, the maximum stress of the solder layer 3 is reduced by 67%, and the heat dissipation efficiency of the module is reduced by 2°C.

[0082] It is worth noting that the solder layer in the above embodiment is an ideal solder layer structure, or can be understood as the shape of the first groove of the electronic module and / or the shape of the second groove of the structural component. Figure 8 is a schematic diagram of the structure of an electronic component in an embodiment of the present application, such as Figure 8 As shown, in actual applications, the solder is in a liquid state, and under the action of its own weight, the solder may flow at the edge, so that the edge of the solder layer is not an ideal plane or a designed shape, and there are tolerances caused by the process, which causes the edge of the solder layer to deform. In particular, during the welding process, the surface of the solder layer located at the top may be partially concave in the edge area.

[0083] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic component, characterized in that: It comprises an electronic module and a structural part, wherein a welding layer is provided between the electronic module and the structural part, and the welding layer is used to connect the electronic module and the structural part, wherein: The welding layer comprises a thinning area and a thickening area, the thickness of the thickening area is greater than the thickness of the thinning area; the thickening area is located at the edge area of ​​the welding layer.

2. The electronic component according to claim 1, wherein: The solder layer faces a side of the electronic module, the thickened area protrudes from the thinned area, a surface of the electronic module facing the solder layer comprises a first groove, and the thickened area of ​​the solder layer is connected to the first groove by welding.

3. The electronic component according to claim 1 or 2, characterized in that: The welding layer faces a side of the structural component, the thickened area protrudes from the thinned area, a surface of the structural component facing the welding layer comprises a second groove, and the thickened area of ​​the welding layer is welded to the second groove.

4. The electronic component according to any one of claims 1 to 3, characterized in that: The solder layer includes a support block, and the support block is located in the thinning area of ​​the solder layer.

5. The electronic component according to any one of claims 1 to 4, characterized in that: The thickened area of ​​the welding layer includes an annular thickened area surrounding the thinned area.

6. The electronic component according to any one of claims 1 to 4, characterized in that: The thickened area of ​​the welding layer includes two strip-shaped thickened areas, and the two strip-shaped thickened areas are arranged at two opposite ends of the thinned area.

7. The electronic component according to any one of claims 1 to 4, characterized in that: The thickened area of ​​the solder layer includes a corner thickened area, and the corner thickened area is arranged at the corner of the solder layer.

8. The electronic component according to any one of claims 1 to 7, characterized in that: The thickness of the thickened area of ​​the solder layer gradually increases in a direction toward an edge of the solder layer.

9. The electronic component according to any one of claims 1 to 7, characterized in that: The thickened area of ​​the welding layer includes a first sub-area and a second sub-area, the second sub-area is located on a side of the first sub-area facing an edge of the welding layer, and the thickness of the second sub-area at any position is greater than the thickness of the first sub-area at any position.

10. The electronic component according to any one of claims 1 to 9, characterized in that: The thickness difference between the maximum thickness of the thickened area and the thickness of the thinned area is 0.1 mm to 4 mm.

11. The electronic component according to any one of claims 1 to 10, characterized in that: The width of the thickened area in a direction perpendicular to the edge is 1% to 25% of the width of the welding layer in the same direction.

12. The electronic component according to any one of claims 1 to 11, characterized in that: The width of the thickened area along the direction perpendicular to the edge is 0.5 mm to 20 mm.

13. The electronic component according to any one of claims 1 to 12, characterized in that: The thickness of the thinned area is 0.05 to 2 mm.

14. The electronic component according to any one of claims 1 to 13, characterized in that: The electronic module is a power module, the structural component is a radiator, and the radiator is used to dissipate heat for the power module.

15. An electronic device, characterized in that: The invention comprises a circuit board and the electronic component according to any one of claims 1 to 14, wherein the electronic component is connected to the circuit board.

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