Circuit board

Abstract

The embodiment of the invention provides a circuit board which is characterized in that at least one crimping hole penetrating from a first surface to a second surface is formed in a circuit board body, and at least part of the inner wall of each crimping hole is covered with a conductive layer; at least parts of the crimping elements are located in the crimping holes in a one-to-one correspondence mode, at least one crimping element is provided with a first crimping part and a second crimping part, the first crimping part is located outside the crimping holes and makes contact with the conductive layer, the first crimping part is provided with a conductive material, and the second crimping part is located in the crimping holes covered with the conductive layer and makes contact with the conductive layer. The second crimping part is provided with at least an insulating material in contact with the conductive layer, and / or the at least one crimping element is provided with a third crimping part and a fourth crimping part which are positioned in the crimping hole, the third crimping part is isolated on two sides of the fourth crimping part by the fourth crimping part and is in contact with the conductive layer, the third crimping part is provided with a conductive material, and the fourth crimping part is provided with an insulating material. The problem of low signal integrity of a high-speed signal of a circuit board in the prior art is at least solved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of electronic products, and in particular, to a circuit board. Background Art

[0002] In the design of PCB boards with high-speed signal transmission, there is a greater demand for press-fit components. At the same time, the press-fit holes are required to have a certain signal anti-interference ability to reduce signal transmission loss. The advantages of the press-fit process are that there is no need for welding, which reduces the manufacturing cost of electronic products; parts can be replaced quickly, reducing downtime and repair. There is no additional thermal strain on the PCB, which avoids board defects and damage caused by secondary welding.

[0003] As electronic products gradually develop towards miniaturization and multi-function, the core components of electronic products, PCB boards, are gradually developing towards high density and high-speed signal transmission. Press-fit components are gradually replacing wave soldering components. However, press-fit components have many design defects in high-speed circuit boards and cannot be perfectly used in high-speed PCB board design. The disadvantages of using press-fit components for high-speed PCB design are as follows:

[0004] 1. The physical pins of the crimped components are far away, resulting in increased impedance of differential signals and discontinuous impedance;

[0005] 2. After the crimped components are crimped onto the PCB, the thickness of the high-speed signal copper traces on the lower layers of the PCB becomes thinner and the distance is longer, which results in an increase in the differential signal impedance and excessive deviation;

[0006] 3. The fisheye depth requirement of crimped components is relatively strict. The high-speed signal hole cannot be completely back-drilled, resulting in the high-speed signal stub being too long, causing signal reflection; or the high-speed signal is not allowed to pass through the 3rd or even 5th layer of the PCB board, resulting in an increase in the number of PCB board layers, which in turn causes an increase in the cost of the PCB board. Summary of the invention

[0007] An embodiment of the present application provides a circuit board to at least solve the problem of low signal integrity of high-speed signals of the circuit board in the related art.

[0008] According to one embodiment of the present application, a circuit board is provided, comprising: a circuit board body, the circuit board body having a first surface and a second surface relative to each other, and the circuit board body having at least one crimping hole extending from the first surface to the second surface, at least part of the inner wall of each crimping hole being covered with a conductive layer; at least one crimping element, at least part of which is located in the crimping hole in a one-to-one correspondence, wherein: at least one of the crimping elements has a first crimping portion and a second crimping portion, the first crimping portion is located outside the crimping hole and in contact with the conductive layer, and the first crimping portion has a conductive material, the second crimping portion is located in the crimping hole covered with the conductive layer, and the second crimping portion has at least an insulating material in contact with the conductive layer, and / or at least one of the crimping elements has a third crimping portion and a fourth crimping portion located in the crimping hole, the third crimping portion is isolated on both sides of the third crimping portion by the fourth crimping portion and in contact with the conductive layer, and the third crimping portion has a conductive material, and the fourth crimping portion has an insulating material.

[0009] In an exemplary embodiment, the first crimping element has the first crimping portion and the second crimping portion, the first crimping portion is in contact with the first surface, the conductive layer located in the same crimping hole as the first crimping element is a first conductive layer, the first conductive layer extends from the first surface to the second surface and covers part of the inner wall of the crimping hole, the second crimping portion has a first connecting portion and a first expansion portion, the circuit board body includes at least one first functional layer and at least one second functional layer stacked in sequence from the first surface to the second surface, wherein: any one of the first functional layers is distributed with a first high-speed signal line in contact with the first conductive layer, the first conductive layer is located at the periphery of the first connecting portion, the first expansion portion is in contact with the inner wall, and / or any one of the second functional layers is distributed with a second high-speed signal line, the circuit board body also includes a conductive portion filled in the crimping hole and in contact with the second high-speed signal line, the conductive portion is located at one end of the crimping hole close to the second surface and in contact with the first conductive layer, and the first conductive layer is located at the periphery of the first connecting portion and the first expansion portion and in contact with the first expansion portion.

[0010] In an exemplary embodiment, the second crimping element has the first crimping portion and the second crimping portion, the first crimping portion is in contact with the second surface, the second crimping portion is an elastic structure, the conductive layer located in the same crimping hole as the second crimping element is a second conductive layer, and the circuit board body includes at least one first functional layer and at least one second functional layer stacked in sequence from the first surface to the second surface, wherein: any one of the first functional layers is distributed with a third high-speed signal line in contact with the second conductive layer, and the second conductive layer covers the entire inner wall of the crimping hole, and / or any one of the second functional layers is distributed with a fourth high-speed signal line in contact with the second conductive layer, and the second conductive layer extends along the second surface toward the first surface and covers part of the inner wall of the crimping hole.

[0011] In an exemplary embodiment, the elastic structure includes a conductive core and an elastic insulating film, wherein the elastic insulating film wraps the conductive core, wherein: when the crimping hole provided with the second crimping element has a first length, the conductive core has a plurality of first bending segments connected in sequence; when the crimping hole provided with the second crimping element has a second length greater than the first length, the conductive core has a plurality of second bending segments connected in sequence, and the curvature of the second bending segment is smaller than the curvature of the first bending segment, or the conductive core is a straight segment.

[0012] In an exemplary embodiment, a plurality of third crimping elements respectively have the third crimping portion and the fourth crimping portion and are located in adjacent crimping holes, the conductive layer located in the same crimping hole as the third crimping element is a third conductive layer, the circuit board body includes a plurality of functional layers stacked sequentially, at least one layer of the functional layer is provided with a plurality of fifth high-speed signal lines in contact with the third conductive layer, the fifth high-speed signal line is used to transmit high-speed differential signals, and the spacing between adjacent third crimping elements is 0.5 to 0.8 mm.

[0013] In an exemplary embodiment, the third crimping element has a third crimping portion and a fourth crimping portion, the conductive layer located in the same crimping hole as the third crimping element is a third conductive layer, the circuit board body includes a plurality of functional layers stacked sequentially, at least one of the functional layers is provided with a plurality of sixth high-speed signal lines in contact with the third conductive layer, the sixth high-speed signal lines are used to transmit high-speed differential signals, and the two third crimping portions located in the same crimping hole are connected to the plurality of sixth high-speed signal lines through the third conductive layer.

[0014] In an exemplary embodiment, the third crimping element has the third crimping portion and the fourth crimping portion, the fourth crimping portion has the second connecting portion and the second expansion portion connected sequentially along the first direction, each of the third crimping portions covers the second connecting portion and the second expansion portion at the same time, and the thickness of the first part of the third crimping portion covering the second connecting portion is greater than the thickness of the first part of the third crimping portion covering the second expansion portion.

[0015] According to another embodiment of the present application, another circuit board is provided, including: a circuit board body, the circuit board body having a first surface and a second surface relative to each other, and the circuit board body having a plurality of crimping holes extending from the first surface to the second surface, wherein: any two adjacent crimping holes respectively include a first hole segment and a second hole segment that are connected, the aperture of the first hole segment is larger than the aperture of the second hole segment, and the spacing between adjacent first hole segments is smaller than the spacing between adjacent second hole segments, the inner wall of the first hole segment is covered with a conductive layer, the conductive layer includes a first side wall and a second side wall that are relative and connected, the first side wall being located on a side of the second side wall close to the adjacent first hole segment in the same first hole segment, and the thickness of the first side wall being greater than the thickness of the second side wall; and at least one crimping element, at least part of which is located in the crimping hole in a one-to-one correspondence.

[0016] In an exemplary embodiment, the surface of the crimping element located in the first hole segment and in contact with the conductive layer has a first projection on the second surface, the side wall of the first hole segment has a second annular projection on the second surface, and the first projection is located within the area enclosed by the second annular projection and has a line segment with the same curvature as the first projection.

[0017] In an exemplary embodiment, the crimping element includes at least one first crimping element and / or at least one second crimping element, the first crimping element and the second crimping element respectively having a first crimping portion and a second crimping portion, wherein: in the first crimping element, the first crimping portion is located outside the crimping hole and in contact with the first surface, and the first crimping portion has a conductive material, the second crimping portion is located in the crimping hole covered with the conductive layer, and the second crimping portion has an insulating material, the conductive layer located in the same crimping hole as the first crimping element is a first conductive layer, the first conductive layer extends from the first surface to the second surface and covers part of the inner wall of the crimping hole, the second crimping portion has a first connecting portion and a first expansion portion, the circuit board body includes at least one first functional layer and at least one second functional layer sequentially stacked along the first surface pointing to the second surface, any one of the first functional layers is distributed with a first high-speed signal line in contact with the first conductive layer, the first conductive layer is located at the periphery of the first connecting portion, the first expansion portion is in contact with the inner wall, and / or any The second functional layer is provided with a second high-speed signal line, the circuit board body further comprises a conductive part filled in the crimping hole and in contact with the second high-speed signal line, the conductive part is located at one end of the crimping hole close to the second surface and in contact with the first conductive layer, the first conductive layer is located at the periphery of the first connecting part and the first expansion part and in contact with the first expansion part; in the second crimping element, the first crimping part is in contact with the second surface, the second crimping part is an elastic structure, the conductive layer located in the same crimping hole as the second crimping element is a second conductive layer, the circuit board body comprises at least one first functional layer and at least one second functional layer sequentially stacked along the first surface pointing to the second surface, any one of the first functional layers is provided with a third high-speed signal line in contact with the second conductive layer, the second conductive layer covers the entire inner wall of the crimping hole, and / or any one of the second functional layers is provided with a fourth high-speed signal line in contact with the second conductive layer, the second conductive layer extends from the second surface to the first surface and covers part of the inner wall of the crimping hole.

[0018] Through this application, mainly from the perspective of the physical packaging of press-fit components and their corresponding printed circuit board (PCB) board design, with its PCB board processing and assembly of press-fit components, a new pin physical structure of press-fit components and a corresponding PCB board design method are proposed, which avoids the difficulties of high-speed signal wiring of PCB boards of conventional press-fit components, increases the number of high-speed PCB board layers, impedance discontinuity and other problems, thereby improving the high-speed signal transmission quality of press-fit components, while reducing the number of PCB board layers, reducing the overall production cost of electronic products, and facilitating the promotion and use of press-fit components in high-speed and high-density PCB boards. At the same time, the circuit board is mainly used in the research and development design of server products, mainly for the physical packaging of high-speed and high-density press-fit connector devices and their corresponding PCB design. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic structural diagram of a circuit board according to an embodiment of the present application;

[0020] Figure 2 is a schematic structural diagram of another circuit board according to an embodiment of the present application;

[0021] Figure 3 is a schematic structural diagram of another circuit board according to an embodiment of the present application;

[0022] Figure 4 is a schematic structural diagram of a first crimping element according to an embodiment of the present application;

[0023] Figure 5 is a structural schematic diagram of a second crimping element according to an embodiment of the present application;

[0024] Figure 6 is a schematic structural diagram of a third crimping element according to an embodiment of the present application;

[0025] Figure 7 is based on Figure 3 A schematic diagram of a cross-sectional structure of a third crimping element at aa′ is shown;

[0026] Figure 8 is based on Figure 3 A schematic diagram of the cross-sectional structure of a crimping hole at aa′ is shown;

[0027] Fig. 9 is based on Figure 3 Another schematic diagram of the cross-sectional structure of the third crimping element at aa′ is shown;

[0028] Fig.10 is a schematic diagram of the structure of another circuit board according to an embodiment of the present application;

[0029] Fig.11 is based on Fig.10 A schematic diagram of the cross-sectional structure of a crimping hole at position bb′ is shown;

[0030] Fig.12 is a schematic diagram of the structure of another circuit board according to an embodiment of the present application;

[0031] Fig.13 It is a schematic diagram of the structure of another circuit board according to an embodiment of the present application.

[0032] Among them, the above reference numerals include:

[0033] 1. Circuit board body; 101. First surface; 102. Second surface; 11. Press-fit hole; 1101. First hole section; 1102. Second hole section; 1103. First side wall; 1104. Second side wall; 111. Conductive layer; 1111. First conductive layer; 1112. Second conductive layer; 1113. Third conductive layer; 20. Press-fit element; 21. First press-fit element; 22. Second press-fit element; 23. Third press-fit element; 221. First press-fit portion; 222. Second press-fit portion; 2221. Third press-fit portion A connecting portion; 2222, a first expansion portion; 2223, a conductive core; 2224, an elastic insulating film; 223, a third crimping portion; 224, a fourth crimping portion; 2241, a second connecting portion; 2242, a second expansion portion; 31, a first high-speed signal line; 32, a second high-speed signal line; 33, a third high-speed signal line; 34, a fourth high-speed signal line; 35, a fifth high-speed signal line; 36, a sixth high-speed signal line; 40, a conductive portion; 50, a backdrilling area; 61, a first projection; 62, a second annular projection. DETAILED DESCRIPTION

[0034] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0036] In this embodiment, a circuit board is provided, such as Figure 1 to Figure 2 and Figure 3 As shown, it includes: a circuit board body 1, the circuit board body 1 has a first surface 101 and a second surface 102 opposite to each other, and the circuit board body 1 has at least one crimping hole 11 penetrating from the first surface 101 to the second surface 102, and at least part of the inner wall of each crimping hole 11 is covered with a conductive layer 111; at least one crimping element 20, at least part of the crimping element 20 is located in the crimping hole 11 in a one-to-one correspondence, wherein: Figure 1 to Figure 2As shown, at least one crimping element 20 has a first crimping portion 221 and a second crimping portion 222, the first crimping portion 221 is located outside the crimping hole 11 and contacts the conductive layer 111, and the first crimping portion 221 has a conductive material, the second crimping portion 222 is located in the crimping hole 11 covered with the conductive layer 111, and the second crimping portion 222 has at least an insulating material in contact with the conductive layer 111, and / or as Figure 3 As shown, at least one crimping element 20 has a third crimping portion 223 and a fourth crimping portion 224 located in the crimping hole, the third crimping portion 223 is isolated on both sides by the fourth crimping portion 224 and contacts the conductive layer 111, and the third crimping portion 223 has a conductive material, and the fourth crimping portion 224 has an insulating material.

[0037] The above-mentioned circuit board is mainly based on the physical packaging of press-fit components and their corresponding printed circuit board (PCB) board design, with its PCB board processing and assembly of press-fit components, and proposes a new pin physical structure of press-fit components and a corresponding PCB board design method, which avoids the difficulties of high-speed signal wiring of PCB boards of conventional press-fit components, increases the number of high-speed PCB board layers, impedance discontinuity and other problems, thereby improving the high-speed signal transmission quality of press-fit components, while reducing PCB board layers, reducing the overall production cost of electronic products, and facilitating the promotion and use of press-fit components in high-speed and high-density PCB boards. At the same time, the circuit board is mainly used in the research and development design of server products, mainly for the physical packaging of high-speed and high-density press-fit connector devices and their corresponding PCB design.

[0038] Specifically, the pins of the crimping element are improved. When at least one crimping element includes a first crimping part and a second crimping part, the first crimping part with conductive material is located outside the crimping hole and in contact with the conductive layer, while the second crimping part with insulating material is located inside the crimping hole. When at least one crimping element includes a third crimping part and a fourth crimping part, the third crimping part with conductive material is isolated on both sides of the crimping hole by the fourth crimping part with insulating material, so that after the crimping component is crimped on the high-speed PCB board, the crimping pins are only connected to the TOP layer of the board by metal, and there is no connection in the through hole. High-speed routing can be performed on any layer of the PCB board, and back drilling can be performed, so that the PCB board is no longer limited by the minimum fisheye depth, and the maximum value control requirements of the high-speed signal stub are met, thereby improving the quality of high-speed signal transmission and the integrity of the signal. At the same time, there is no need to increase the stacking of the PCB board, thereby reducing the manufacturing cost of the PCB board.

[0039] In one alternative, Figure 1As shown, the first crimping element 21 has a first crimping portion 221 and a second crimping portion 222, the first crimping portion 221 contacts the first surface 101, the conductive layer 111 located in the same crimping hole 11 as the first crimping element 21 is a first conductive layer 1111, the first conductive layer 1111 extends along the first surface 101 to the second surface 102 and covers a portion of the inner wall of the crimping hole 11, the second crimping portion 222 has a first connecting portion 2221 and a first expansion portion 2222, and the circuit board body 1 includes at least one first functional layer and at least one second functional layer stacked in sequence along the first surface 101 pointing to the second surface 102.

[0040] In the above optional solution, any one of the first functional layers may be provided with a first high-speed signal line 31 in contact with the first conductive layer 1111, the first conductive layer 1111 is located at the periphery of the first connecting portion 2221, and the first expansion portion 2222 is in contact with the inner wall. Figure 1 The first crimping element 21 shown in the figure is located in the left crimping hole 11; any second functional layer can be distributed with a second high-speed signal line 32, the circuit board body 1 also includes a conductive portion 40 filled in the crimping hole 11 and in contact with the second high-speed signal line 32, the conductive portion 40 is located at one end of the crimping hole 11 close to the second surface 102 and in contact with the first conductive layer 1111, the first conductive layer 1111 is located at the periphery of the first connecting portion 2221 and the first expansion portion 2222 and in contact with the first expansion portion 2222, as shown in the figure. Figure 1 The first crimping element 21 shown in FIG. 1 is located in the right crimping hole 11 .

[0041] Specifically, the first crimping element of the above scheme is crimped onto the high-speed PCB board, so that the pins of the crimped components have only metal connections with the TOP layer of the board, and the crimping through-holes only play a crimping and fixing role without any connection. This allows the high-speed PCB board to carry out high-speed signal routing on any signal layer and can be back-drilled. It is no longer restricted by the minimum fisheye depth and meets the maximum value control requirements of the high-speed signal stub, thereby improving the quality of high-speed signal transmission. At the same time, there is no need to increase the PCB board stacking, thereby reducing the manufacturing cost of the PCB board. Figure 1 It can be seen that the first high-speed signal line 31 is on the third layer of the PCB board, the through hole is back-drilled, and the connection point of the press-fit pin is in the back-drilled area 50, which has a large expansion; the second high-speed signal line 3 is on the third to last layer of the PCB board, no back-drilling is required, and the connection point of the press-fit pin is in the metal area of ​​the through hole, which has a small expansion; both can meet the expansion connection. At the same time, the press-fit component pins are only connected to the PCB board at the TOP layer, and high-speed signal routing and back-drilling can be performed at any layer of the PCB board to meet the stub requirements; there is no need to increase the PCB board stacking.

[0042] In the above embodiment, the cross-sectional structure of the first crimping element which is not crimped into the crimping hole of the circuit board body is as follows: Figure 4 As shown, the first crimping element 21 has a first crimping portion 221 and a second crimping portion 222, wherein the first crimping portion 221 may include various shapes such as spherical, ellipsoidal, and polyhedron, and a first direction A and a second direction B are established, wherein the first direction B is the direction in which the first crimping portion 221 points to the second crimping portion 222, and the second direction A is perpendicular to the first direction B. The longest diameter of the first crimping portion 221 in the first direction B is 0.35 mm to 0.45 mm, and the maximum thickness of the first crimping portion 221 in the second direction B is 0.1 mm to 0.2 mm; the conductive material constituting the first crimping portion may include various materials such as copper, aluminum, silver, carbon film, and lead-tin alloy, and the shape and material of the first crimping portion 221 are not specifically limited in this application, and the above structure can facilitate the crimping of the crimping components on the PCB board, and have good contact with the pads on the PCB board. The second crimping portion 222 is made of insulating material including non-metallic material, such as plastic, glass fiber, etc. The thickness of the second crimping portion 222 in the second direction B (i.e., fisheye depth) is 0.65mm-0.9mm, and the diameter of the first expansion portion in the first direction is 0.3mm-0.5mm. This range is expanded, so that the first crimping element 21 can be used on PCB boards with different thicknesses. In addition, if Figure 1 As shown, when the first crimping element 21 is crimped into the crimping hole 11, the expansion coefficient of the first expansion part 2222 is larger, and it can play an insulating isolation role in the crimping hole 11. In the crimping hole 11 containing the back-drilled area 50 (the crimping hole 11 on the left side of the figure), due to the existence of the back-drilled area 50, the diameter range of the first expansion part 2222 is expanded. Even if the first conductive layer 1111 has been back-drilled and removed at the connection point, resulting in the inner diameter of the hole at the connection point being increased by 0.15 to 0.2 mm compared with the non-back-drilled area, the crimping components can still be crimped and installed well, which is more firm and reliable.

[0043] Specifically, when the first crimping element is inserted into the crimping hole of the PCB board, the first crimping portion will form a metal contact with the first surface (i.e., the TOP layer) of the PCB board, thereby establishing an electrical path for the signal or power supply, and realizing efficient transmission of the signal; the first expansion portion will expand due to the material properties, filling the gap between the crimping hole and the crimping pin, thereby playing an insulating and fixing role, to ensure that the crimping element will not be electrically connected to other layers of the PCB board except for the metal contact point with the TOP layer and the first conductive layer, thereby avoiding undesirable short circuits or signal leakage. Since the crimping element only forms a metal connection with the TOP layer and the first conductive layer of the PCB board, and is isolated from the metal parts of other areas in the hole, this allows the back drilling operation to be performed without damaging the crimping pin, so as to control the stub length (back drilling area) of the via, thereby ensuring the continuity of impedance, reducing signal reflections, and improving the integrity of high-speed signals.

[0044] In one alternative, Figure 2 As shown, the second crimping element 22 has a first crimping portion 221 and a second crimping portion 222, the first crimping portion 221 contacts the second surface 102, the second crimping portion 222 is an elastic structure, the conductive layer 111 located in the same crimping hole 11 as the second crimping element 22 is a second conductive layer 1112, and the circuit board body 1 includes at least one first functional layer and at least one second functional layer stacked in sequence from the first surface 101 to the second surface 102.

[0045] In the above optional solution, any one of the first functional layers may be distributed with a third high-speed signal line 33 in contact with the second conductive layer 1112, and the second conductive layer 1112 covers the entire inner wall of the crimping hole 11. Figure 2 The second crimping element 22 is shown in the left crimping hole 11; any second functional layer may be distributed with a fourth high-speed signal line 34 in contact with the second conductive layer 1112, and the second conductive layer 1112 extends along the second surface 102 toward the first surface 101 and covers a portion of the inner wall of the crimping hole 11, such as Figure 2 The second crimping element 22 shown in FIG. 1 is located in the right crimping hole 11 .

[0046] Specifically, in the above scheme, the second crimping component is crimped on the high-speed PCB board and has a metal connection with the board bottom layer (the second surface of the circuit board body), and there is no connection between the PCB board TOP layer (the first surface of the circuit board body) and the crimping hole. There is no fisheye depth limit, so any layer of the PCB board can be high-speed routing, and back drilling can be started from the PCB board TOP layer. Therefore, high-speed signal design is completed without increasing the high-speed PCB board stacking, reducing the manufacturing cost of the PCB board.

[0047] In the above embodiment, the cross-sectional structure of the second crimping element is as follows: Figure 5 As shown, the second crimping element 22 has a first crimping portion 221 and a second crimping portion 222, wherein the first crimping portion 221 is a cone, a sphere, an ellipsoid, a polyhedron, etc., and the maximum diameter of the first crimping portion in the second direction B is 0.3mm to 0.5mm, and its maximum diameter is greater than the diameter of the crimping hole on the second surface. The second crimping portion 222 can be elastically stretched, with a length between 1.7 and 2.5mm, and its material can include conductive materials and elastic materials, such as glass fiber, plastic, silicone rubber, epoxy resin and polyester film, which can be widely used in various PCB board thickness requirements; the periphery of the crimping tube foot column is made of glass fiber or other elastic insulating materials to isolate it from the connection inside the crimping hole of the PCB board.

[0048] Specifically, the second crimping element is designed to be in the shape of an elastic funnel, the head of which is conical, and the periphery of the column part is made of elastic insulating material. This design allows the crimping pin to be elastically stretched during the process of being pressed into the PCB board, thereby adapting to PCB boards of different thicknesses, and enhancing its versatility and adaptability in different application scenarios. When the conical head of the second crimping element is pressed into the PCB board, it will form a stable metal contact with the second surface (BOTTOM layer) of the board, which is the main contact point of the crimping connection. The good formation of the contact point is the key to electrical connection, ensuring the reliable transmission of high-speed signals or power. The elastic insulating material on the periphery of the crimping pin column will expand during the crimping process, filling the gap between the crimping hole and the crimping pin, playing an insulating and fixing role. The use of this insulating material ensures that the crimping pin will not form additional electrical connections with other PCB board layers except for the metal contact points with the BOTTOM layer, avoiding the problem of signal short circuit or crosstalk, while ensuring the stable installation of the crimping pin. Since the crimped pins only form metal contact with the BOTTOM layer of the PCB board, and other areas in the hole are isolated by insulating materials, high-speed signal routing can be freely performed on any layer of the PCB board, and back drilling can be performed from the TOP layer to control the stub length of the through hole, ensure the impedance continuity and stability of the entire signal path, reduce signal reflections, and improve signal integrity.

[0049] In one alternative, Figure 5 As shown, the elastic structure includes a conductive core 2223 and an elastic insulating film 2224, and the elastic insulating film 2224 wraps the conductive core 2223, wherein: Figure 2 As shown, when the crimping hole provided with the second crimping element 22 has a first length, the conductive core 2223 has a plurality of first bending segments connected in sequence; when the crimping hole provided with the second crimping element 22 has a second length greater than the first length, the conductive core has a plurality of second bending segments connected in sequence, and the curvature of the second bending segment is smaller than the curvature of the first bending segment, or the conductive core 2223 is a straight segment.

[0050] In the above embodiment, the conductive core 2223 is usually metal, which is difficult to achieve elastic stretching together with the elastic insulating film 2224. However, for the conductive core 2223 in the present application, when applied to a thinner PCB board, it can be achieved by compressing multiple bending segments with a larger curvature, and when applied to a thicker PCB board, it can be achieved by stretching multiple bending segments with a smaller curvature. When stretched to a certain extent, the conductive core 2223 approaches a straight line segment, so that the elastic insulating film 2224 can be adjusted to have different bending degrees to adapt to different thicknesses of the PCB board; the use of the elastic insulating film enables the crimped pin column to adapt to different PCB thicknesses when pressed into the crimping hole of the PCB board card, and at the same time, the gap between the pin and the hole wall is filled by the elastic expansion of the material, providing a stable physical connection, ensuring the reliability of the connection, and avoiding the problem of poor contact or unstable fixation due to changes in PCB thickness. The outer elastic insulating film isolates the second crimping part from direct contact with other conductive layers in the crimping hole of the PCB board, preventing short circuits and electrical interference, and avoiding data transmission errors or system performance degradation during high-speed signal transmission because short circuits or interference will seriously affect signal integrity. The internal conductive core forms a stable metal contact point with the bottom (BOTTOM layer) of the PCB board, improving the quality and integrity of the signal. In addition, since the crimped pin column is only in contact at the BOTTOM layer, the back drilling operation can be performed without destroying the connection point, effectively controlling the stub length, thereby further optimizing the impedance matching of the signal path. Due to the separation design of the outer elastic insulating film and the internal conductive core in the elastic structure, high-speed signals can be routed at any layer of the PCB board, and back drilling operations can be performed, greatly enhancing the flexibility of circuit design and the freedom of signal routing.

[0051] In an optional scheme, multiple third crimping elements respectively have a third crimping portion and a fourth crimping portion and are located in adjacent crimping holes. The conductive layer located in the same crimping hole as the third crimping element is the third conductive layer. The circuit board body includes a plurality of functional layers stacked in sequence. At least one functional layer is provided with a plurality of fifth high-speed signal lines in contact with the third conductive layer. The fifth high-speed signal line is used to transmit high-speed differential signals. The spacing between adjacent third crimping elements is 0.5 to 0.8 mm.

[0052] In the above embodiment, in the process of designing high-speed circuits, effective control of impedance matching can reduce signal reflection and improve signal integrity. In the prior art, the spacing of the crimping elements is 0.9mm. In the above embodiment, the spacing of the third crimping element is reduced to 0.5-0.8mm, making it closer to the impedance value of the high-speed differential signal routing in the conventional design, such as the impedance requirement of 85Ω for the high-speed differential signal routing, which can better control the transmission impedance of the high-speed differential signal and maintain the impedance continuity of the high-speed signal. It should be noted that only the impedance at the connection between the crimping pin and the crimping hole of the PCB board is changed here, and the impedance at the non-connection point will still be greater than 85 ohms. At the same time, reducing the distance between the return GND crimping pins can also reduce the impedance, and the method is the same. In addition, the reduction in the spacing of the third crimping element reduces the size of the crimping components, which is conducive to the miniaturization design of the PCB board and reduces the manufacturing cost of the PCB board.

[0053] In one alternative, Figure 3 As shown, the third crimping element 23 has a third crimping portion 223 and a fourth crimping portion 224, the conductive layer 111 located in the same crimping hole as the third crimping element 23 is the third conductive layer 1113, the circuit board body 1 includes a plurality of functional layers stacked in sequence, at least one functional layer is provided with a plurality of sixth high-speed signal lines in contact with the third conductive layer 1113, the sixth high-speed signal line 36 is used to transmit a high-speed differential signal, and the two third crimping portions 223 located in the same crimping hole 11 are connected to the plurality of sixth high-speed signal lines 36 through the third conductive layer 1113.

[0054] In the above embodiment, the circuit board body 1 includes multiple functional layers stacked in sequence, and at least one functional layer is distributed with multiple sixth high-speed signal lines 36 in contact with the third conductive layer 1113, that is, the third conductive layer 1113 in the crimping hole 11 is connected to multiple high-speed signal lines, which makes it possible to perform high-speed signal wiring on PCB boards of different layers. In particular, when the crimping hole is designed as two metal networks with a disconnection in the middle, it can be ensured that the high-speed signal can maintain good signal quality even in a complex multi-layer PCB design.

[0055] In one alternative, Figure 6 As shown, the third crimping element 23 has a third crimping portion 223 and a fourth crimping portion 224, the fourth crimping portion 224 has a second connecting portion 2241 and a second expansion portion 2242 connected sequentially along a first direction B, each third crimping portion 223 covers the second connecting portion 2241 and the second expansion portion 2242 at the same time, and the thickness of the first part of the third crimping portion 223 covering the second connecting portion 2241 is greater than the thickness of the first part of the third crimping portion 223 covering the second expansion portion 2242.

[0056] In the above embodiment, the third crimping element has a third crimping portion and a fourth crimping portion, and the third crimping portion is isolated on both sides by the fourth crimping portion and contacts the conductive layer, so as to realize dividing the third crimping element into two parts, and is isolated by glass fiber isolation in the middle; the third crimping element can be connected to different high-speed signal lines, which can prevent electromagnetic interference (EMI) between differential pairs and between differential pairs and ground lines, and avoid additional coupling that may damage signal integrity. At the same time, it can ensure the impedance matching and continuity of high-speed differential signals in the crimping hole. This design can keep the signal at a stable impedance (e.g., 85 ohms) during transmission, thereby reducing signal reflection and interference and improving signal quality and stability.

[0057] For example, after calculation, it is found that without changing the conventional crimping element, the crimping pin diameter and the crimping pin spacing, the high-speed signal crimping pin is divided into a pair of differential signals, while meeting the 85Ω impedance requirement. The thickness of the fourth crimping part is required to be between 0.12 and 0.14 mm; the thickness of the third crimping part of the non-contact point (i.e., the first part) is 0.12 mm, and the thickness of the third crimping part of the contact point (i.e., the second part) is 0.09 mm. Because the contact point contacts the crimping hole of the PCB board, the thickness of the third conductive layer in the crimping hole is about 0.025 mm, so the thickness of the third crimping part of the second expansion part in the third crimping element is slightly smaller than the thickness of the third crimping part of the second connection part by about 0.025 mm.

[0058] In some options, Figure 3 The cross section of the third crimping element 23 at aa′ shown may be as follows: Figure 7 As shown, the fourth crimping portion 224 separates the third crimping portion 223, and the third crimping portions 223 located on both sides of the fourth crimping portion 224 do not contact each other. Figure 3 The cross-sectional view of the crimping hole 11 at aa′ is shown in FIG. Figure 8 As shown, the third conductive layer 1113 is located on both sides of the crimping hole 11, and the third conductive layers 1113 located on both sides of the crimping hole 11 do not touch each other. When the third crimping portion 223 is inserted into the crimping hole 11 in the circuit board body 1, the third crimping portions 223 located on both sides of the third crimping element 23 form an electrical connection with the third conductive layers 1113 located on both sides of the crimping hole 11, so that high-speed signal transmission can be achieved.

[0059] In the above scheme, the third crimping element is crimped onto the corresponding crimping pin package on the high-speed PCB board, and the high-speed signal crimping through hole is cut into two network signals. In the PCB board processing process, other processing techniques and processes are the same as the conventional method. After the through hole is electroplated with conductive material, a milling cutter is used to mill through the crimping through hole from the top and bottom surfaces of the PCB board, disconnecting the third crimping ring, and the crimping pins on both sides remain unchanged, and the middle differential pin is divided into two, thereby forming a pair of differential signals, reducing the number of crimping pins of the crimping connector, reducing the volume of crimping components, and facilitating the miniaturization design of PCB boards.

[0060] In other options, Figure 3 The cross section of the third crimping element 23 at aa′ shown may be as follows: Fig. 9 As shown, the cross-section of the third crimping element 23 is elliptical, the semicircular third conductive layers 1113 on both sides are the positive and negative poles of the high-speed differential signal, and the middle is the fourth crimping part 224; this design is easier to control the impedance of the high-speed differential signal, and at the same time, there are more fourth crimping parts isolated in the middle, and the expansion coefficient is larger, which is more conducive to the firmness of the crimping.

[0061] According to another embodiment of the present application, Figures 10 to 13 As shown, another circuit board is provided, comprising: a circuit board body 1, the circuit board body 1 having a first surface 101 and a second surface 102 opposite to each other, and the circuit board body 1 having a plurality of crimping holes 11 penetrating from the first surface 101 to the second surface 102, wherein: any two adjacent crimping holes 11 respectively include a first hole segment 1101 and a second hole segment 1102 connected to each other, the aperture of the first hole segment 1101 is larger than the aperture of the second hole segment 1102, and the spacing between adjacent first hole segments 1101 is smaller than the spacing between adjacent first hole segments 1101. The spacing between the adjacent second hole segments 1102, the inner wall of the first hole segment 1101 is covered with a conductive layer, the conductive layer includes a first side wall 1103 and a second side wall 1104 that are opposite and connected, the first side wall 1103 in the same first hole segment 1101 is located on the side of the second side wall 1104 close to the adjacent first hole segment 1101, and the thickness of the first side wall 1103 is greater than the thickness of the second side wall 1104; at least one crimping element 20, at least part of the crimping element 20 is located in the crimping hole 11 in a one-to-one correspondence.

[0062] Specifically, a thickened first side wall is formed in the first hole section of the crimping hole in the above-mentioned circuit board, which ensures the impedance continuity of the high-speed signal in the crimping hole area, avoids signal reflection caused by impedance discontinuity, optimizes signal integrity, and improves the transmission quality of high-speed signals. In addition, by adjusting the thickness of the first side wall and the second side wall, as well as the spacing between adjacent first hole ends, the same impedance requirement (e.g., 85Ω) as the conventional design can be achieved, so that the entire signal link from the crimping pin to the routing on the PCB board can maintain a stable impedance characteristic and reduce signal distortion. At the same time, since the crimping hole design allows high-speed signals to be routed at any layer, designers enjoy greater freedom when laying out signal lines, and can plan circuit layouts more flexibly without being strictly restricted by the position of crimping components.

[0063] In addition, the above-mentioned crimping hole can solve the contradiction between the minimum fisheye depth requirement of the crimped tube pins of the crimped components and the maximum value requirement of the backdrill stub of the high-speed differential signal, avoiding the increase in manufacturing costs due to the increase in the number of layers of the high-speed PCB board; at the same time, it solves the problem of high-speed signal transmission signal integrity caused by the discontinuity of high-speed signal impedance in the crimped tube pins and the crimping holes of the PCB board.

[0064] In the above embodiment, Fig.10 The schematic diagram of the projection of the crimping hole 11 at the structure bb′ on the second surface is as follows: Fig.11 As shown in the figure, in addition to the connection point, a semi-deep elliptical slot is added to the area of ​​the crimping hole, which can avoid signal reflection caused by impedance discontinuity, optimize signal integrity, and improve the transmission quality of high-speed signals. In addition, by increasing the aperture of the first hole section and reducing the spacing of the first hole section, the same 85Ω impedance requirement as the conventional design can be achieved. In this way, the entire signal link from the crimping pin to the routing on the PCB board can maintain a stable impedance characteristic and reduce signal distortion.

[0065] In one alternative, Fig.11 As shown, the surface of the crimping element located in the first hole segment and in contact with the conductive layer has a first projection 61 on the second surface, and the side wall of the first hole segment has a second annular projection 62 on the second surface. The first projection 61 is located within the area enclosed by the second annular projection 62 and has a line segment with the same curvature as the first projection 61.

[0066] In the above scheme, only the high-speed signal crimping hole is changed, and the return ground crimping pin crimping hole remains unchanged; in the high-speed signal crimping hole, except for the crimping pin contact point and the high-speed signal stub area which are circular, the crimping pin pad to the high-speed signal routing layer area is changed to a half-depth slot hole similar to an ellipse, such as Fig.11As shown, one side of the crimping hole and one side of the half-deep slot hole are concentric circles with the crimping pin, the diameter of the half-deep slot hole is 0.3-0.36mm, the diameter of the crimping hole is twice the diameter of the half-deep slot hole, and the width is 0.3-0.36mm. The above scheme can fully ensure the continuity of the impedance of the high-speed signal crimping hole throughout the entire process, avoiding the reflection noise caused by impedance discontinuity during the high-speed signal transmission process, thereby causing high-speed signal integrity problems.

[0067] In an exemplary embodiment, Fig.12 As shown, the crimping element 20 includes at least one first crimping element 21, and the first crimping element 21 and the second crimping element 22 respectively have a first crimping portion 221 and a second crimping portion 222. In the first crimping element 21, the first crimping portion 221 is located outside the crimping hole and contacts the first surface 101, and the first crimping portion 221 has a conductive material, the second crimping portion 222 is located in the crimping hole 11 covered with a conductive layer 111, and the second crimping portion 222 has an insulating material, the conductive layer 111 located in the same crimping hole 11 as the first crimping element 21 is a first conductive layer 1111, the first conductive layer 1111 extends along the first surface 101 to the second surface 102 and covers a portion of the inner wall of the crimping hole 11, the second crimping portion 222 has a first connecting portion 2221 and a first expansion portion 2222, and the circuit board body 1 includes at least one first functional layer and at least one second functional layer stacked in sequence from the first surface 101 to the second surface 102.

[0068] In the above exemplary embodiments, any one of the first functional layers may be provided with a first high-speed signal line 31 in contact with the first conductive layer 1111, the first conductive layer 1111 is located at the periphery of the first connecting portion 2221, and the first expansion portion 2222 is in contact with the inner wall. Fig.12 The first crimping element 21 shown in the figure is located in the left crimping hole 11; any second functional layer can be distributed with a second high-speed signal line 32, the circuit board body 1 also includes a conductive portion 40 filled in the crimping hole 11 and in contact with the second high-speed signal line 32, the conductive portion 40 is located at one end of the crimping hole 11 close to the second surface 102 and in contact with the first conductive layer 1111, the first conductive layer 1111 is located at the periphery of the first connecting portion 2221 and the first expansion portion 2222 and in contact with the first expansion portion 2222, as shown in the figure. Fig.12 The first crimping element 21 shown in FIG. 1 is located in the right crimping hole 11 .

[0069] In another exemplary embodiment, Fig.13As shown, the crimping element 20 includes at least one second crimping element 22, in which the first crimping portion 221 contacts the second surface 102, the second crimping portion 222 is an elastic structure, the conductive layer 111 located in the same crimping hole 11 as the second crimping element 22 is a second conductive layer 1112, and the circuit board body 1 includes at least one first functional layer and at least one second functional layer stacked in sequence from the first surface 101 to the second surface 102.

[0070] In the above exemplary embodiments, any one of the first functional layers may be distributed with a third high-speed signal line 33 in contact with the second conductive layer 1112, and the second conductive layer 1112 covers the entire inner wall of the crimping hole 11. Fig.13 The second crimping element 22 is shown in the left crimping hole 11; any second functional layer may be distributed with a fourth high-speed signal line 34 in contact with the second conductive layer 1112, and the second conductive layer 1112 extends along the second surface 102 toward the first surface 101 and covers a portion of the inner wall of the crimping hole 11, such as Fig.13 The second crimping element 22 shown in FIG. 1 is located in the right crimping hole 11 .

[0071] The physical structure of the pins of the crimping components of the above-mentioned circuit board and the corresponding PCB board design method avoid the difficulties in high-speed signal wiring of the PCB board of conventional crimping components, increase of high-speed PCB board layers, impedance discontinuity and other problems, thereby improving the high-speed signal transmission quality of the crimping components, while reducing the PCB board layers, reducing the overall production cost of electronic products, and facilitating the promotion and use of crimping components in high-speed and high-density PCB boards. At the same time, the circuit board is mainly used in the research and development design of server products, mainly for the physical packaging of high-speed and high-density crimping connector devices and their corresponding PCB design. In addition, the contradiction between the minimum fisheye depth requirement of the crimping pins of the crimping components and the maximum value requirement of the backdrill stub of the high-speed differential signal is solved, avoiding the increase in manufacturing costs caused by the increase in the number of high-speed PCB board layers; at the same time, the problem of high-speed signal transmission signal integrity caused by the high-speed signal impedance discontinuity in the crimping pins of the high-speed differential signal and the crimping holes of the PCB board is solved.

[0072] For example, Fig.12 As shown, the first crimping element 21 is crimped to the Fig.10In the crimping hole 11 shown, the problems such as impedance discontinuity between the crimping element 20 and the crimping hole 11, fisheye depth limitation of the crimping device, and high-speed differential signal backdrill stub requirements can be solved. Among them, in the process of high-speed PCB board processing, if there are high-speed signal routing on the upper layers of the PCB board, back drilling is used in the conventional process. Due to the minimum fisheye depth requirement, it cannot meet the high-speed signal stub requirements. To solve this problem, first drill through the PCB board according to the crimping holes; second, control the depth of the milling groove from the TOP layer, and mill an elliptical groove of the corresponding depth from the TOP layer to the high-speed routing layer; third, copper is electroplated on the entire PCB board; fourth, back drilling is performed under the condition of meeting the high-speed signal backdrill stub requirements, ignoring the minimum fisheye depth requirement; thereby completing the manufacture of the high-speed PCB board. Meet various index requirements of crimping components and high-speed differential signals. Such as Fig.12 The high-speed signals on the right side of the main board of the circuit board shown are routed in the lower layers of the PCB board, and no back drilling is required. Since one side of the semi-deep elliptical slot is concentric with the crimping pin, the expansion coefficient of the crimping pin expansion point is large, so the firmness of the crimping components and the PCB board can still be met.

[0073] Exemplarily, the first crimping element 21 is crimped to Fig.10 In the crimping hole 11 shown, it is possible to ensure continuous impedance control during high-speed differential signal transmission, avoid reflection noise, and enhance signal integrity; at the same time, it is possible to avoid the fisheye depth of the crimping tube pin and the back drilling stub requirements, and there is no need to increase the high-speed PCB board stacking, thereby reducing the manufacturing cost of the high-speed PCB board while ensuring the high-speed differential signal transmission performance.

[0074] The circuit board changes the materials of the crimping pin connection column and the expansion point to non-metallic materials, and is connected only through the TOP layer of the PCB board, thereby eliminating the fisheye depth requirement of the crimping components, so that high-speed differential signals can be routed and back-drilled at any layer; the crimping pin connection column is wrapped with non-metallic materials, and the connection point is only connected and fixed to the bottom layer of the PCB board, thereby eliminating the fisheye depth requirement of the crimping components, so that high-speed differential signals can be routed and back-drilled at any layer; the impedance value at the connection point between the crimping pin and the high-speed PCB board meets the impedance requirement of the high-speed differential signal by changing the crimping pin spacing of the high-speed differential signal; a half-depth slot is added to the high-speed signal transmission area at the crimping through hole of the high-speed PCB board, so that the impedance consistency and continuity of the high-speed signal transmission area in the crimping hole is met; the crimping pin of the crimping component and the high-speed signal transmission at the through hole of the high-speed PCB board are changed. Half-depth slots are added to the transmission area to meet the requirements of high-speed signal routing on any layer of the high-speed PCB board, ensuring the continuity of high-speed signal transmission impedance, and at the same time, there is no need to increase the PCB board stacking; the high-speed signal crimping pin of the crimping component is divided into two and changed into a pair of differential signals, which can keep the impedance of the high-speed differential signal from the entire crimping pin to the PCB board continuous, while reducing the number of crimping pins of the crimping connector, reducing the volume of the crimping component, and facilitating the miniaturization design of the PCB board; by changing the connection method between the crimping pin of the crimping component and the PCB board, and dividing the crimping pin into two, a high-speed pin transmits a pair of high-speed differential signals at the same time, which can meet the continuity of the entire transmission impedance of the high-speed signal from the high-speed crimping pin in the crimping component to the high-speed PCB board, and at the same time, there is no need to increase the high-speed PCB board stacking, and the high-speed differential signal can be routed and back-drilled on any layer of the PCB board.

[0075] The above is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board, characterized in that: include: A circuit board body, the circuit board body having a first surface and a second surface opposite to each other, and the circuit board body having at least one crimping hole extending from the first surface to the second surface, and at least a portion of the inner wall of each crimping hole being covered with a conductive layer; At least one crimping element, at least part of which is located in the crimping hole in a one-to-one correspondence, wherein: At least one of the crimping elements has a first crimping portion and a second crimping portion, the first crimping portion is located outside the crimping hole and in contact with the conductive layer, and the first crimping portion has a conductive material, the second crimping portion is located in the crimping hole covered with the conductive layer, and the second crimping portion has at least an insulating material in contact with the conductive layer, and / or at least one of the crimping elements has a third crimping portion and a fourth crimping portion located in the crimping hole, the third crimping portion is isolated on both sides of the third crimping portion and in contact with the conductive layer, and the third crimping portion has a conductive material, and the fourth crimping portion has an insulating material.

2. The circuit board according to claim 1, characterized in that: The first crimping element has the first crimping portion and the second crimping portion, the first crimping portion contacts the first surface, the conductive layer located in the same crimping hole as the first crimping element is a first conductive layer, the first conductive layer extends from the first surface to the second surface and covers a portion of the inner wall of the crimping hole, the second crimping portion has a first connecting portion and a first expansion portion, and the circuit board body includes at least one first functional layer and at least one second functional layer sequentially stacked along the first surface toward the second surface, wherein: Any one of the first functional layers is provided with a first high-speed signal line in contact with the first conductive layer, the first conductive layer is located at the periphery of the first connecting portion, the first expansion portion is in contact with the inner wall, and / or A second high-speed signal line is distributed on any layer of the second functional layer, and the circuit board body also includes a conductive part filled in the crimping hole and in contact with the second high-speed signal line, the conductive part is located at one end of the crimping hole close to the second surface and in contact with the first conductive layer, and the first conductive layer is located at the periphery of the first connecting part and the first expansion part and in contact with the first expansion part.

3. The circuit board according to claim 1, characterized in that: The second crimping element has the first crimping portion and the second crimping portion, the first crimping portion contacts the second surface, the second crimping portion is an elastic structure, the conductive layer located in the same crimping hole as the second crimping element is a second conductive layer, and the circuit board body includes at least one first functional layer and at least one second functional layer stacked in sequence from the first surface to the second surface, wherein: Any one of the first functional layers is provided with a third high-speed signal line in contact with the second conductive layer, the second conductive layer covers the entire inner wall of the crimping hole, and / or A fourth high-speed signal line in contact with the second conductive layer is distributed on any layer of the second functional layer, and the second conductive layer extends along the second surface toward the first surface and covers a portion of the inner wall of the crimping hole.

4. The circuit board according to claim 3, characterized in that: The elastic structure comprises a conductive core and an elastic insulating film, wherein the elastic insulating film wraps the conductive core, wherein: In the case where the crimping hole provided with the second crimping element has a first length, the conductive core has a plurality of first bending sections connected in sequence; When the crimping hole provided with the second crimping element has a second length greater than the first length, the conductive core has a plurality of second bending segments connected in sequence, and the curvature of the second bending segments is smaller than the curvature of the first bending segments, or the conductive core is a straight segment.

5. The circuit board according to claim 1, characterized in that: A plurality of third crimping elements respectively have the third crimping portion and the fourth crimping portion and are located in adjacent crimping holes, the conductive layer located in the same crimping hole as the third crimping element is a third conductive layer, the circuit board body comprises a plurality of functional layers stacked sequentially, at least one of the functional layers is provided with a plurality of fifth high-speed signal lines in contact with the third conductive layer, the fifth high-speed signal line is used to transmit a high-speed differential signal, and the spacing between adjacent third crimping elements is 0.5 to 0.8 mm.

6. The circuit board according to claim 1, characterized in that: The third crimping element has a third crimping portion and a fourth crimping portion, the conductive layer located in the same crimping hole as the third crimping element is a third conductive layer, the circuit board body includes a plurality of functional layers stacked sequentially, at least one of the functional layers is provided with a plurality of sixth high-speed signal lines in contact with the third conductive layer, the sixth high-speed signal lines are used to transmit high-speed differential signals, and the two third crimping portions located in the same crimping hole are connected to the plurality of sixth high-speed signal lines through the third conductive layer.

7. The circuit board according to claim 6, characterized in that: The third crimping element has the third crimping portion and the fourth crimping portion, the fourth crimping portion has the second connecting portion and the second expansion portion connected sequentially along the first direction, each of the third crimping portions covers the second connecting portion and the second expansion portion at the same time, and the thickness of the first part of the third crimping portion covering the second connecting portion is greater than the thickness of the first part of the third crimping portion covering the second expansion portion.

8. A circuit board, characterized in that: include: A circuit board body, the circuit board body having a first surface and a second surface opposite to each other, and the circuit board body having a plurality of crimping holes extending from the first surface to the second surface, wherein: Any two adjacent crimping holes respectively include a first hole segment and a second hole segment that are connected, the aperture of the first hole segment is larger than the aperture of the second hole segment, and the spacing between adjacent first hole segments is smaller than the spacing between adjacent second hole segments, the inner wall of the first hole segment is covered with a conductive layer, the conductive layer includes a first side wall and a second side wall that are opposite and connected, the first side wall is located on a side of the second side wall close to the adjacent first hole segment in the same first hole segment, and the thickness of the first side wall is greater than the thickness of the second side wall; At least one crimping element, at least a portion of which is located in the crimping holes in a one-to-one correspondence.

9. The circuit board according to claim 8, characterized in that: The surface of the crimping element located in the first hole segment and in contact with the conductive layer has a first projection on the second surface, the side wall of the first hole segment has a second annular projection on the second surface, and the first projection is located within the area enclosed by the second annular projection and has a line segment with the same curvature as the first projection.

10. The circuit board according to claim 8, characterized in that: The crimping element comprises at least one first crimping element and / or at least one second crimping element, wherein the first crimping element and the second crimping element respectively have a first crimping portion and a second crimping portion, wherein: In the first crimping element, the first crimping portion is located outside the crimping hole and contacts the first surface, and the first crimping portion has a conductive material, the second crimping portion is located in the crimping hole covered with the conductive layer, and the second crimping portion has an insulating material, the conductive layer located in the same crimping hole as the first crimping element is a first conductive layer, the first conductive layer extends from the first surface to the second surface and covers a portion of the inner wall of the crimping hole, the second crimping portion has a first connecting portion and a first expansion portion, and the circuit board body includes at least one first layer stacked in sequence from the first surface to the second surface functional layer and at least one second functional layer, any one of the first functional layers is distributed with a first high-speed signal line in contact with the first conductive layer, the first conductive layer is located at the periphery of the first connecting portion, the first expansion portion is in contact with the inner wall, and / or any one of the second functional layers is distributed with a second high-speed signal line, the circuit board body further comprises a conductive part filled in the crimping hole and in contact with the second high-speed signal line, the conductive part is located at one end of the crimping hole close to the second surface and in contact with the first conductive layer, the first conductive layer is located at the periphery of the first connecting portion and the first expansion portion and in contact with the first expansion portion; In the second crimping element, the first crimping portion is in contact with the second surface, the second crimping portion is an elastic structure, the conductive layer located in the same crimping hole as the second crimping element is a second conductive layer, the circuit board body includes at least one first functional layer and at least one second functional layer stacked in sequence from the first surface to the second surface, any one of the first functional layers is distributed with a third high-speed signal line in contact with the second conductive layer, the second conductive layer covers the entire inner wall of the crimping hole, and / or any one of the second functional layers is distributed with a fourth high-speed signal line in contact with the second conductive layer, and the second conductive layer extends from the second surface to the first surface and covers part of the inner wall of the crimping hole.

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