Method and device for generating hierarchical layout of semiconductor production equipment

Abstract

The present invention discloses a method and device for generating a hierarchical layout of semiconductor production equipment. The method for generating a hierarchical layout specifically includes: obtaining the layout requirements for semiconductor production; determining the factor indicators for the hierarchical layout of semiconductor production equipment, classifying the factor indicators, and giving the first-class factor indicators and the second-class factor indicators; obtaining the attribute data of each semiconductor production equipment, and analyzing the layout level of each semiconductor production equipment in combination with a pre-constructed factor evaluation model; and based on the strategy of hierarchical layout, responding to the analysis of the layout level of each semiconductor production equipment, and completing the generation of the hierarchical layout of semiconductor production equipment. The present invention overcomes the qualitative layout scheme designed based on experience, and through the division of factor indicators, connects and matches the layout level of semiconductor equipment with the strategy of hierarchical layout, and realizes the hierarchical layout of semiconductor production equipment in the form of hierarchical layout evaluation of production equipment in different links in the semiconductor field.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production equipment layout, and particularly relates to a method and device for generating a hierarchical layout of semiconductor production equipment. Background Art

[0002] The hierarchical layout of industrial production plants and related production equipment is also known as "industrial buildings for upper floors". Industrial buildings for upper floors can transfer industrial production activities from traditional single-story factories to multi-story or high-rise buildings, enabling more industrial enterprises to be accommodated on a limited land area and greatly improving land utilization efficiency.

[0003] High-end manufacturing usually requires high-precision production equipment and a good production environment. For example, industries such as electronic information, biomedicine, and precision instruments have high requirements for temperature, humidity, cleanliness, etc. of the production environment. Multi-story or high-rise buildings can provide a stable production environment through centralized air-conditioning systems, purification equipment, etc., and can also conduct centralized environmental governance and pollution control to better meet these requirements.

[0004] For example, Patent CN116862316A provides a method and related equipment for evaluating an industrial building for upper floors mode, including obtaining the product process requirements and target industry type of a target industry, and determining the industrial safety factor according to the product process requirements, where the target industry is the industry about to move to upper floors; predicting R & D conditions, production conditions, and testing conditions according to the industrial safety factor and product process requirements; calculating the R & D upper floor, production upper floor, and testing upper floor through the industry type and R & D conditions, production conditions, and testing conditions respectively; and evaluating the upper floor of the target industry according to the R & D upper floor, production upper floor, and testing upper floor. It solves the problem of relying too much on the ability of judges to evaluate industrial buildings for upper floors, and this solution has the effect of improving the efficiency and rationality of evaluating industrial buildings for upper floors.

[0005] However, in the current semiconductor field, the hierarchical layout of production equipment in different production links still relies on qualitative judgments designed by experience. That is, technicians rely on experience to hierarchically arrange the production equipment involved in each link of semiconductor production. However, the problems of inconsistent layering judgment criteria, low accuracy, and low hierarchical layout efficiency in the hierarchical layout of production equipment brought about by experience design have always been difficult problems plaguing the development of "industrial buildings for upper floors" in the semiconductor industry.

[0006] Therefore, how to get rid of the qualitative judgment method, through unified and quantitative analysis, considering production equipment of different specifications in the production links in the semiconductor field, so as to achieve an efficient, accurate, and standardized hierarchical layout of semiconductor production equipment is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0007] In view of the defects existing in the above-mentioned prior art, the present invention provides a method and device for generating a hierarchical layout of semiconductor production equipment. The method for generating a hierarchical layout specifically includes: obtaining the layout requirements for semiconductor production; determining the element indicators for the hierarchical layout of semiconductor production equipment, classifying the element indicators, and giving the first-class element indicators and the second-class element indicators; obtaining the attribute data of each semiconductor production equipment, and combining with the pre-constructed element evaluation model to analyze the layout level of each semiconductor production equipment; based on the strategy of hierarchical layout, in response to the analysis of the layout level of each semiconductor production equipment, completing the generation of the hierarchical layout of semiconductor production equipment. The present invention overcomes the qualitative layout scheme designed by experience, connects and matches the layout level of semiconductor equipment with the strategy of hierarchical layout through the division of element indicators, and realizes the hierarchical layout of semiconductor production equipment in the form of hierarchical layout evaluation of production equipment in different links in the semiconductor field.

[0008] In the first aspect, the present invention provides a method for generating a hierarchical layout of semiconductor production equipment, which specifically includes the following steps:

[0009] Obtain the layout requirements for semiconductor production;

[0010] Determine the element indicators for the hierarchical layout of semiconductor production equipment, classify the element indicators, and give the first-class element indicators and the second-class element indicators;

[0011] Obtain the attribute data of each semiconductor production equipment, and combine with the pre-constructed element evaluation model to analyze the layout level of each semiconductor production equipment;

[0012] Based on the strategy of hierarchical layout, in response to the analysis of the layout level of each semiconductor production equipment, complete the generation of the hierarchical layout of semiconductor production equipment.

[0013] Further, the layout requirements for semiconductor production specifically include: the layout area requirements and supply requirements for semiconductor production.

[0014] Further, determining the element indicators for the hierarchical layout of semiconductor production equipment, classifying the element indicators, and giving the first-class element indicators and the second-class element indicators specifically includes:

[0015] Based on the layout requirements for semiconductor production, screen the element indicators corresponding to the hierarchical layout of semiconductor production equipment;

[0016] Classify each element indicator, and determine the first-class element indicators and the second-class element indicators; among them, the first-class element indicators are conditional indicators, and the second-class element indicators are quantitative indicators.

[0017] Further, obtain the attribute data of each semiconductor production equipment, and analyze the layout level of each semiconductor production equipment in combination with the pre-constructed factor evaluation model, specifically including the following steps:

[0018] Based on the first-class factor indicators and the second-class factor indicators, determine the attribute parameters of each semiconductor production equipment, specifically expressed as:

[0019] ;

[0020] where f() is a matching array, E is the set of factor indicators, P is the set of attribute parameters of the semiconductor production equipment, is the x-th first-class factor indicator, is the y-th attribute parameter, is the p-th second-class factor indicator, is the q-th attribute parameter, is the first-class matching function, is the second-class matching function;

[0021] Combine the attribute parameters to determine the attribute data matching each semiconductor production equipment;

[0022] Perform calculation and analysis on the attribute data in the pre-constructed evaluation model, and give the layout level of each semiconductor production equipment.

[0023] Further, the construction of the factor evaluation model specifically includes the following steps:

[0024] Determine the weight coefficients of each second-class factor indicator;

[0025] Based on the correlation relationships between each second-class factor indicator, respectively establish the weight relationship formulas of multiple second-class factor indicators;

[0026] Based on the weight relationship formula of each second-class factor indicator, match each first-class factor indicator to form a fusion relationship formula;

[0027] Superimpose the fusion relationship formulas to form a factor evaluation relationship, and construct a factor evaluation model.

[0028] Further, performing calculation and analysis on the attribute data in the pre-constructed evaluation model, and giving the layout level of each semiconductor production equipment, specifically including the following steps:

[0029] Perform normalization processing on the attribute data to form normalized attribute data;

[0030] For the normalized attribute data of each semiconductor production equipment, combine with the evaluation model to form an attribute data score;

[0031] Match the attribute data scores of each semiconductor production equipment with the preset layout levels to determine the layout level results of each semiconductor production equipment.

[0032] Further, based on the strategy of hierarchical layout, in response to the layout level analysis of each semiconductor production equipment, generate a hierarchical layout of semiconductor production equipment, which specifically includes the following steps:

[0033] Based on the strategy of hierarchical layout, associate the layout level results of each semiconductor production equipment with the levels of the hierarchical layout, and set the level tags for each semiconductor production equipment;

[0034] According to the level tags of each semiconductor production equipment, complete the generation of the hierarchical layout of semiconductor production equipment.

[0035] Further, the strategy of hierarchical layout specifically includes:

[0036] Combined with the layout requirements of semiconductor production, perform hierarchical division on the semiconductor layout area to be laid out;

[0037] Set the layout level thresholds of the semiconductor production equipment matched in each divided level;

[0038] Based on the layout level thresholds of the semiconductor production equipment set in each level, associate each semiconductor production equipment with the semiconductor layout area.

[0039] Further, based on the layout level thresholds of the semiconductor production equipment set in each level, associating each semiconductor production equipment with the semiconductor layout area specifically includes the following steps:

[0040] Based on the layout level thresholds of the semiconductor production equipment set in each level, determine the candidate level tags of each semiconductor production equipment;

[0041] Combined with the layout requirements of semiconductor production, determine the connection relationship between semiconductor production equipment to form a semiconductor production equipment connection diagram;

[0042] Combined with the candidate level tags of each semiconductor production equipment and the semiconductor production equipment connection diagram, determine the initial level tags of each semiconductor production equipment;

[0043] Optimize the initial level tags of each semiconductor production equipment until the cumulative similarity threshold requirement is met, and determine them as the level tags of each semiconductor production equipment;

[0044] Based on the level tags of each semiconductor production equipment, associate each semiconductor production equipment with the semiconductor layout area;

[0045] Among them, meeting the cumulative similarity threshold requirement means that the cumulative similarity of the initial level labels of each semiconductor production device is not greater than the cumulative similarity threshold. The cumulative similarity is specifically expressed as:

[0046] ;

[0047] Among them, R is the cumulative similarity, is the similarity pairing of all possible semiconductor production devices, m is the total number of similarity types of semiconductor production devices, i is the i-th similarity type of semiconductor production devices, j and k are the j-th and k-th semiconductor production devices, are the initial level labels of the j-th and k-th semiconductor production devices, is the indicator function. If , the value is 1, otherwise the value is 0.

[0048] In a second aspect, the present invention also provides a hierarchical layout generation device for semiconductor production equipment, which adopts the hierarchical layout generation method of any of the above semiconductor production equipment, and specifically includes:

[0049] An acquisition unit for obtaining the layout requirements of semiconductor production and the attribute data of each semiconductor production device;

[0050] An analysis unit for determining the element indicators for the hierarchical layout of semiconductor production equipment, classifying the element indicators, giving the first-class element indicators and the second-class element indicators, and analyzing the layout levels of each semiconductor production device in combination with the pre-constructed element evaluation model;

[0051] An association unit for responding to the layout level analysis of each semiconductor production device based on the strategy of hierarchical layout;

[0052] A generation unit for generating a hierarchical layout of semiconductor production equipment.

[0053] A hierarchical layout generation method and device for semiconductor production equipment provided by the present invention have at least the following beneficial effects:

[0054] (1) The present invention overcomes the qualitative layout scheme designed by experience. Through the division of element indicators, it connects and matches the layout levels of semiconductor devices with the strategy of hierarchical layout, and realizes the hierarchical layout of semiconductor production equipment by means of the hierarchical layout evaluation method of production equipment in different links in the semiconductor field.

[0055] (2) In the element evaluation model, the fusion relation is the combination of the weight relation of the secondary element indicators and a single primary element indicator. The superposition of the fusion relation is achieved by multiplying the weight relations of each primary element indicator and the secondary element indicators. Thus, in the element evaluation model, the absolute characteristics of the primary element indicators and the relative characteristics of the secondary element indicators are fully considered, and an element evaluation that meets the layout level requirements is given.

[0056] (3) The cumulative similarity can measure the level accuracy of semiconductor manufacturing equipment that constitutes similar types during the optimization process of the hierarchical labels of semiconductor manufacturing equipment. Only when the overall setting of the hierarchical labels of each semiconductor manufacturing equipment meets the cumulative similarity threshold, the hierarchical labels of the semiconductor manufacturing equipment are qualified. Select the optimal one from all the solutions that meet the cumulative similarity threshold and determine it as the label of each semiconductor manufacturing equipment. Description of the Drawings

[0057] Figure 1 It is a schematic flow chart of a method for generating a hierarchical layout of a semiconductor manufacturing equipment provided by the present invention;

[0058] Figure 2 It is a schematic flow chart of a process for giving primary element indicators and secondary element indicators in an embodiment provided by the present invention;

[0059] Figure 3 It is a schematic flow chart of a process for analyzing the layout level of each semiconductor manufacturing equipment in an embodiment provided by the present invention;

[0060] Figure 4 It is an example diagram of element evaluation in an embodiment provided by the present invention;

[0061] Figure 5 It is a schematic flow chart of a strategy for hierarchical layout in an embodiment provided by the present invention;

[0062] Figure 6 It is a schematic flow chart of a process for associating the layout levels of each semiconductor manufacturing equipment in an embodiment provided by the present invention;

[0063] Figure 7 It is an architecture diagram of a device for generating a hierarchical layout of a semiconductor manufacturing equipment provided by the present invention. Detailed Embodiments

[0064] To better understand the above technical solutions, the above technical solutions will be described in detail below in conjunction with the accompanying drawings of the specification and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0065] The terms used in the embodiments of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The singular forms "a", "the" and "said" used in the embodiments of the present invention and the appended claims are also intended to include the plural forms, unless the context clearly dictates otherwise. "Plural" generally includes at least two.

[0066] It should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a commodity or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such commodity or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the commodity or device comprising said element.

[0067] In the current semiconductor field, the standards for "industrial production on upper floors" mainly rely on qualitative judgments. There is still a lack of hierarchical layout judgment criteria for production equipment in different production links of the semiconductor industrial chain, and it is still necessary to rely on experience to design the production equipment that can be arranged on different floors.

[0068] Overcoming the qualitative layout scheme designed by experience, through the detailed classification of semiconductor production equipment and the analysis of each floor in "industrial production on upper floors", in an evaluation and matching manner, the connection between the layout level of semiconductor production equipment and the hierarchical layout level of "industrial production on upper floors" can be achieved, and the hierarchical layout of semiconductor production equipment can be realized.

[0069] As Figure 1 shown, the present invention provides a method for generating a hierarchical layout of semiconductor production equipment, which specifically includes the following steps:

[0070] Obtain the layout requirements for semiconductor production;

[0071] Determine the element indicators for the hierarchical layout of semiconductor production equipment, classify the element indicators, and give the first-class element indicators and the second-class element indicators;

[0072] Obtain the attribute data of each semiconductor production equipment, and analyze the layout level of each semiconductor production equipment in combination with the pre-constructed element evaluation model;

[0073] Based on the strategy of hierarchical layout, in response to the analysis of the layout level of each semiconductor production equipment, complete the generation of the hierarchical layout of semiconductor production equipment.

[0074] The present invention overcomes the qualitative layout scheme designed based on experience, connects and matches the layout level of semiconductor equipment with the strategy of hierarchical layout through the division of factor indicators, and realizes the hierarchical layout of semiconductor production equipment in a hierarchical layout evaluation method of production equipment in different links of the semiconductor field.

[0075] Among them, the layout requirements of semiconductor production specifically include: layout area requirements and supply requirements of semiconductor production.

[0076] The layout area requirements of semiconductor production mainly include environmental requirements, functional zoning requirements, etc. Environmental requirements include carrying capacity, vibration control, fire protection performance, etc. Functional zoning requirements include production area, auxiliary area, power equipment area, logistics and storage area, etc.

[0077] The supply demand of semiconductor production mainly includes the supply demand of raw materials, the supply demand of production equipment, etc. Raw materials include both raw materials of semiconductor products and key auxiliary materials such as necessary chemicals and gases; the supply demand of production equipment includes the index requirements of the required production equipment determined according to the raw materials, environmental requirements, functional zoning requirements, etc.

[0078] By obtaining the above environmental requirements, functional zoning requirements, raw material supply requirements, production equipment supply requirements, etc., the semiconductor production equipment that meets the above requirements can be determined to form a set of semiconductor production equipment to be hierarchically laid out. And the semiconductor production equipment of different specifications in the semiconductor production equipment set is associated, that is, the connection relationship and connection method between each production equipment are determined.

[0079] For example, taking the midstream manufacturing, downstream packaging and testing, and modules in the semiconductor production process as an example, midstream manufacturing mainly involves integrated circuit chip manufacturing, discrete devices, optoelectronic devices, sensor manufacturing, etc., including photolithography equipment, etching equipment, thin film deposition equipment, ion implantation equipment, cleaning equipment, heat treatment equipment, detection and yield testing, etc.; downstream packaging and testing and modules mainly involve traditional packaging and testing and modules, advanced packaging and testing and modules, including thinning machines, dicing machines, placement machines, wire bonding machines, flip-chip machines, etc.

[0080] Through environmental requirements, functional zoning requirements, raw material supply requirements, production equipment supply requirements, etc., we first determine the various production equipment required for midstream manufacturing, downstream packaging and testing, and modules, and determine the specific types and models of various equipment based on the production equipment supply requirements to form a semiconductor production equipment collection. Then, we associate the production equipment reported with different specifications. The principle of association also follows the production requirements and functional zoning requirements of semiconductors. For example, photolithography equipment and etching equipment are close to each other, connected, and coordinated with each other, because the etching process needs to be based on photoresist patterns.

[0081] Based on the determined set of semiconductor production equipment above, it is necessary to hierarchically layout each different model of semiconductor production equipment. First, according to the own attributes of each semiconductor production equipment and the layout requirements of the above semiconductor production, set the element indicators.

[0082] The specific process of setting the element indicators is as Figure 2 shown, determine the element indicators for the hierarchical layout of semiconductor production equipment, classify the element indicators, and give the first-class element indicators and the second-class element indicators, specifically including:

[0083] Based on the layout requirements of semiconductor production, screen the element indicators corresponding to the hierarchical layout of semiconductor production equipment;

[0084] Classify each element indicator to determine the first-class element indicators and the second-class element indicators; among them, the first-class element indicators are conditional indicators, and the second-class element indicators are quantitative indicators.

[0085] The first-class element indicators mainly refer to absolute indicators, which can be called conditional indicators. For example, the access indicators of national standards and industry standards, the allowable indicators of safety and environmental protection, etc.; the second-class element indicators mainly refer to relative indicators, which can also be called important indicators and quantitative indicators. For example, the civil engineering indicators for hierarchical layout (such as load, micro-vibration, floor height, etc.) and the electromechanical indicators for water, electricity and gas matching of different models of semiconductor production equipment (such as explosion-proof, distance of water, electricity and gas matching equipment), etc.

[0086] Generally speaking, the conditional indicators belong to the indicators of one-vote veto, while the quantitative indicators belong to the indicators of good or bad evaluation. According to the conditional indicators and quantitative indicators, a model for evaluating the layout of semiconductor production equipment can be constructed. Thus, the layout level of each semiconductor production equipment is given.

[0087] Specifically, as Figure 3 shown, obtain the attribute data of each semiconductor production equipment, and combine it with the pre-constructed element evaluation model to analyze the layout level of each semiconductor production equipment, specifically including the following steps:

[0088] Based on the first-class element indicators and the second-class element indicators, determine the attribute parameters of each semiconductor production equipment, specifically expressed as:

[0089] ;

[0090] Among them, f() is the matching array, E is the set of element indicators, P is the set of attribute parameters of semiconductor production equipment, is the x-th first-class element indicator, is the y-th attribute parameter, is the p-th second-class element indicator, is the q-th attribute parameter, is the first type of matching function, is the second type of matching function;

[0091] Combined with the attribute parameters, determine the attribute data matching each semiconductor production equipment;

[0092] In the pre-constructed evaluation model, calculate and analyze the attribute data, and give the layout level of each semiconductor production equipment.

[0093] The attribute parameters of semiconductor production equipment refer to the performance indicators of semiconductor production equipment. The attribute parameters of the matching semiconductor production equipment are determined by the first type of element indicators and the second type of element indicators respectively, that is, the performance indicators of the semiconductor production equipment related to the element indicators are determined, and the various performance indicators of the determined semiconductor production equipment are matched with the first type of element indicators and the second type of element indicators. For example, for the civil engineering index - load in the second type of element indicators, the performance indicators of the semiconductor production equipment matched with it include the weight of the semiconductor production equipment; for the civil engineering index - micro-vibration in the second type of element indicators, the performance indicators of the semiconductor production equipment matched with it include the performance indicators of the vibration isolation system, the performance indicators of the production equipment base, etc.

[0094] The matching of the attribute parameters of semiconductor production equipment with the first type of element indicators and the second type of element indicators can be a one-to-one relationship, or a one-to-many, many-to-one, many-to-many, etc.

[0095] According to the attribute parameters of the semiconductor production equipment after matching, give the attribute data of the attribute category corresponding to each semiconductor production equipment, calculate and analyze the attribute data in the pre-constructed evaluation model, and give the layout level of each semiconductor production equipment.

[0096] In a certain embodiment, such as Figure 4 As shown, analyze different links in semiconductor production (taking midstream manufacturing as an example), and give the attribute data corresponding to the attribute parameters of semiconductor production equipment under the first type of element indicators such as safety and environmental protection and the second type of element indicators such as load and micro-vibration. Of course, the attribute data of different semiconductor production equipment are different, and specific numerical limitations are not made here.

[0097] Among them, safety and environmental protection belong to conditional indicators and must meet the requirements; load and micro-vibration belong to quantitative indicators. Then, quantitative processing is performed on the above attribute data. The quantitative processing method can adopt typical quantitative scoring, etc., and specific limitations are not made here.

[0098] After obtaining the attribute data of the semiconductor production equipment, calculate and analyze the attribute data in the pre-constructed evaluation model. Among them, the construction of the element evaluation model specifically includes the following steps:

[0099] Determine the weight coefficients of each secondary element index;

[0100] Based on the correlation relationships among the secondary element indexes, establish weight relationship formulas for multiple secondary element indexes respectively;

[0101] Based on the weight relationship formula of each secondary element index, match each primary element index to form a fusion relationship formula;

[0102] Superimpose the fusion relationship formulas to form an element evaluation relationship, and construct an element evaluation model.

[0103] For a certain semiconductor production equipment, the determination of the weight coefficients of the secondary element indexes involved is generally carried out by taking values according to the importance degree. The weight coefficients of different secondary element indexes are different. Based on the correlation relationships among the secondary element indexes, establish the weight relationship formula of the secondary element indexes corresponding to this semiconductor production equipment. The weight relationship formula of the secondary element indexes is specifically expressed as:

[0104]

[0105] Among them, S1 is the weight relationship formula of the secondary element indexes, N is the total number of secondary element indexes, is the weight coefficient corresponding to the p-th secondary element index, is the p-th secondary element index.

[0106] In addition, after establishing the weight relationship formula of the secondary element indexes corresponding to this semiconductor production equipment, it is also necessary to determine the matching primary element indexes, form a fusion relationship formula, superimpose the fusion relationship formulas to form an element evaluation relationship, and obtain an element evaluation model. The element evaluation model is specifically expressed as:

[0107] ;

[0108] Among them, S is the element evaluation model, S1 is the weight relationship formula of the secondary element indexes, is the multiplication operation, is the x-th primary element index, M is the total number of primary element indexes, indicates that x is an integer between 1 and M.

[0109] In the element evaluation model, the fusion relationship formula is the fusion of the weight relationship formula of the secondary element indexes and a single primary element index. The superimposition of the fusion relationship formula is realized by multiplying the weight relationship formulas of each primary element index and the secondary element indexes. Thus, in the element evaluation model, the absolute characteristics of the primary element indexes and the relative characteristics of the secondary element indexes are fully considered, and an element evaluation that meets the layout level requirements is given.

[0110] For a hierarchical semiconductor production equipment layout, it is necessary to correspond and match the layout level of each semiconductor production equipment with the strategy of the semiconductor hierarchical layout. Specifically, based on the strategy of the hierarchical layout, in response to the analysis of the layout levels of each semiconductor production equipment, the generation of the hierarchical semiconductor production equipment layout is completed, which specifically includes the following steps:

[0111] Based on the strategy of the hierarchical layout, associate the layout level results of each semiconductor production equipment and the levels of the hierarchical layout, and set the level labels for each semiconductor production equipment;

[0112] According to the level labels of each semiconductor production equipment, complete the generation of the hierarchical semiconductor production equipment layout.

[0113] Through the strategy of the hierarchical layout, associate the layout level of each semiconductor production equipment, perform level labeling processing on each semiconductor production equipment, and finally, based on the level labels of each semiconductor production equipment, arrange the layout in sequence, and finally realize the layout of the hierarchical semiconductor production equipment.

[0114] Such as Figure 5 shown, the strategy of the hierarchical layout specifically includes:

[0115] Combined with the layout requirements of semiconductor production, perform level division on the semiconductor layout area to be laid out;

[0116] Set the layout level thresholds of the semiconductor production equipment to be matched in each divided level;

[0117] Based on the layout level thresholds of the semiconductor production equipment set for each level, associate each semiconductor production equipment and the semiconductor layout area.

[0118] In the strategy of the hierarchical layout, the factors to be considered in the level division of the semiconductor layout area mainly include three aspects, namely: building height, storey height control, and production process restrictions on the corresponding floors.

[0119] Taking a 70m high factory building as an example, the number of floors that can be set is 10 floors, and the heights of each floor are divided in a gradient manner. Among them, the heights of the first and second floors are higher than those of the third to sixth floors, and the heights of the third to sixth floors are higher than those of the seventh to tenth floors. In addition, the production functions of each floor are divided. The first to sixth floors are mainly used as production workshops, and the seventh to tenth floors are mainly for R & D, design and testing. Then, a layout level threshold of semiconductor production equipment is set for each floor. For example, the layout levels of semiconductor production equipment required for the first and second floors are relatively low, and the set layout level thresholds are relatively low. Almost all semiconductor production equipment can be laid out on the first and second floors; the layout levels of semiconductor production equipment required for the seventh floor and above are relatively high, and the set layout level thresholds are relatively high. Only a very small part of semiconductor production equipment can meet the requirements.

[0120] According to the layout level thresholds of semiconductor production equipment set for each level, the association between the layout level results of each semiconductor production equipment and the levels of hierarchical layout can be realized, and hierarchical labeling is set for each semiconductor production equipment.

[0121] Specifically, as Figure 6 shown, based on the layout level thresholds of semiconductor production equipment set for each level, each semiconductor production equipment and the semiconductor layout area are associated. The specific steps are as follows:

[0122] Based on the layout level thresholds of semiconductor production equipment set for each level, determine the candidate level labels of each semiconductor production equipment;

[0123] Combined with the layout requirements of semiconductor production, determine the connection relationship between semiconductor production equipment to form a semiconductor production equipment connection diagram;

[0124] Combined with the candidate level labels of each semiconductor production equipment and the semiconductor production equipment connection diagram, determine the initial level labels of each semiconductor production equipment;

[0125] Optimize the initial level labels of each semiconductor production equipment until the cumulative similarity threshold requirement is met, and determine the level labels of each semiconductor production equipment;

[0126] Based on the level labels of each semiconductor production equipment, associate each semiconductor production equipment and the semiconductor layout area;

[0127] Among them, meeting the cumulative similarity threshold requirement means that the cumulative similarity of the initial level labels of each semiconductor production equipment is not greater than the cumulative similarity threshold. The cumulative similarity is specifically expressed as:

[0128] ;

[0129] Among them, R is the cumulative similarity, is the similar pairing of all possible semiconductor production equipment, m is the total number of similar types of semiconductor production equipment, i is the i-th similar type of semiconductor production equipment, and j and k are the j-th and k-th semiconductor production equipment, is the initial level label of the j-th and k-th semiconductor production equipment, is an indicator function. If , the value is 1, otherwise the value is 0.

[0130] Based on the layout level result of the semiconductor production equipment, the corresponding levels of the hierarchical layout are associated. There may be a one-to-many situation. For example, meeting the layout level threshold of the seventh layer may also meet the layout level thresholds of the first to sixth layers at the same time.

[0131] In order to meet the layout requirements of semiconductor production and rationalize the layout of semiconductor production equipment as much as possible, when associating semiconductor production equipment and semiconductor layout areas, by considering two factors, the candidate level label and the connection relationship between each semiconductor production equipment, optimization is carried out on the basis of the given initial level label. Through the judgment of the cumulative similarity threshold, the most suitable association scheme is given. Among them, the connection relationship between each semiconductor production equipment mainly refers to the connection of various semiconductor production equipment given to meet the requirements of functional zoning and environmental requirements. Here, the semiconductor production equipment connected in pairs of similar types of semiconductor production equipment is generally described.

[0132] The cumulative similarity can measure the level accuracy of the semiconductor production equipment that constitutes the similar type in the process of optimizing the level label of the semiconductor production equipment. Only when the overall setting of the level labels of each semiconductor production equipment meets the cumulative similarity threshold, the level label of the semiconductor production equipment meets the requirements. Select the optimal one from all the schemes that meet the cumulative similarity threshold and determine it as the label of each semiconductor production equipment.

[0133] In the second aspect, as Figure 7 shown, the present invention also provides a hierarchical layout generation device for semiconductor production equipment, which adopts any one of the above-mentioned hierarchical layout generation methods for semiconductor production equipment, and specifically includes:

[0134] An acquisition unit for obtaining the layout requirements of semiconductor production and the attribute data of each semiconductor production equipment;

[0135] An analysis unit for determining the element indicators for the hierarchical layout of semiconductor production equipment, classifying the element indicators, giving the first-class element indicators and the second-class element indicators, and analyzing the layout level of each semiconductor production equipment in combination with the pre-constructed element evaluation model;

[0136] An association unit, configured to analyze the layout levels of respective semiconductor manufacturing devices based on a strategy of hierarchical layout.

[0137] A generation unit, configured to generate a hierarchical layout of semiconductor manufacturing devices.

[0138] A method and apparatus for generating a hierarchical layout of semiconductor manufacturing devices provided by the present invention at least have the following beneficial effects:

[0139] (1) The present invention overcomes the qualitative layout scheme designed based on experience. By dividing the element indicators, the layout levels of semiconductor devices are connected and matched with the strategy of hierarchical layout. With the hierarchical layout evaluation method for production devices in different links of the semiconductor field, the hierarchical layout of semiconductor manufacturing devices is achieved.

[0140] (2) In the element evaluation model, the fusion relation is the fusion of the weight relations of the secondary element indicators and a single primary element indicator. The superposition of the fusion relation is realized by multiplying the weight relations of the respective primary element indicators and secondary element indicators. Thus, the absolute characteristics of the primary element indicators and the relative characteristics of the secondary element indicators are fully considered in the element evaluation model, and an element evaluation that meets the layout level requirements is given.

[0141] (3) The cumulative similarity can measure the hierarchical accuracy of semiconductor manufacturing devices that constitute similar types during the optimization process of the hierarchical labels of semiconductor manufacturing devices. Only when the overall setting of the hierarchical labels of respective semiconductor manufacturing devices meets the cumulative similarity threshold, the hierarchical labels of the semiconductor manufacturing devices are qualified. The optimal one is selected from all the solutions that meet the cumulative similarity threshold and determined as the label of each semiconductor manufacturing device.

[0142] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications once they learn the basic creative concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present invention. Obviously, those skilled in the art can make various changes and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. A hierarchical layout generation method for a semiconductor production device, characterized in that, Specifically, it includes the following steps: Obtain the layout requirements for semiconductor production; Determine the element indicators for the hierarchical layout of semiconductor production equipment, classify the element indicators, and give the first-class element indicators and the second-class element indicators; Obtain the attribute data of each semiconductor production equipment, and analyze the layout level of each semiconductor production equipment in combination with the pre-constructed element evaluation model; The construction of the element evaluation model includes: determining the weight coefficients of each second-class element indicator; respectively establishing the weight relationship formulas of multiple second-class element indicators based on the correlation relationship between each second-class element indicator; matching each first-class element indicator based on the weight relationship formula of each second-class element indicator to form a fusion relationship formula; superimposing the fusion relationship formulas to form an element evaluation relationship, and constructing the element evaluation model; Based on the hierarchical layout strategy, in response to the layout level analysis of each semiconductor production equipment, complete the generation of the hierarchical layout of semiconductor production equipment; the hierarchical layout strategy includes: combining the layout requirements of semiconductor production, dividing the semiconductor layout area to be laid out into levels; setting the layout level threshold of the semiconductor production equipment matched in each divided level; based on the layout level threshold of the semiconductor production equipment set in each level, determining the candidate level labels of each semiconductor production equipment; combining the layout requirements of semiconductor production, determining the connection relationship between semiconductor production equipment to form a semiconductor production equipment connection diagram; combining the candidate level labels of each semiconductor production equipment and the semiconductor production equipment connection diagram, determining the initial level labels of each semiconductor production equipment; optimizing the initial level labels of each semiconductor production equipment until the cumulative similarity threshold requirement is met, and determining the level labels of each semiconductor production equipment; based on the level labels of each semiconductor production equipment, associating each semiconductor production equipment and the semiconductor layout area; among them, meeting the cumulative similarity threshold requirement means that the cumulative similarity of the initial level labels of each semiconductor production equipment is not greater than the cumulative similarity threshold.

2. The method for generating a hierarchical layout of a semiconductor manufacturing equipment according to claim 1, wherein The layout requirements for semiconductor production specifically include: the layout area requirements and supply requirements for semiconductor production.

3. The hierarchical layout generation method of the semiconductor production equipment according to claim 1, characterized in that, Determine the element indicators for the hierarchical layout of semiconductor production equipment, classify the element indicators, and give the first-class element indicators and the second-class element indicators, specifically including: Based on the layout requirements of semiconductor production, screen the element indicators corresponding to the hierarchical layout of semiconductor production equipment; Classify each element indicator to determine the first-class element indicators and the second-class element indicators; among them, the first-class element indicators are conditional indicators, and the second-class element indicators are quantitative indicators.

4. The method for generating a hierarchical layout of the semiconductor manufacturing equipment according to claim 3, wherein, Obtain the attribute data of each semiconductor production equipment, and analyze the layout level of each semiconductor production equipment in combination with the pre-constructed element evaluation model, specifically including the following steps: Based on the first-class element indicators and the second-class element indicators, determine the attribute parameters of each semiconductor production equipment, specifically expressed as: ； Among them, f() is a matching array, E is a set of element indicators, and P is a set of attribute parameters of semiconductor production equipment. is the x-th type-I element indicator, is the y-th attribute parameter, is the p-th type-II element indicator, is the q-th attribute parameter, is the first type of matching function, is the second type of matching function; Combine the attribute parameters to determine the attribute data matched with each semiconductor production equipment; Perform calculation and analysis on the attribute data in the pre-constructed evaluation model to give the layout level of each semiconductor production equipment.

5. The method for generating a hierarchical layout of a semiconductor manufacturing device according to claim 4, wherein Calculate and analyze the attribute data in the pre-constructed evaluation model, and give the layout levels of each semiconductor production equipment, specifically including the following steps: Normalize the attribute data to form normalized attribute data; For the normalized attribute data of each semiconductor production equipment, combine with the evaluation model to form attribute data scores; Match the attribute data scores of each semiconductor production equipment and the preset layout levels to determine the layout level results of each semiconductor production equipment.

6. The method for generating a hierarchical layout of a semiconductor manufacturing device according to claim 1, wherein Based on the strategy of hierarchical layout, respond to the layout level analysis of each semiconductor production equipment, and complete the generation of hierarchical semiconductor production equipment layout, specifically including the following steps: Based on the strategy of hierarchical layout, associate the layout level results of each semiconductor production equipment and the levels of hierarchical layout, and set the level labels of each semiconductor production equipment; According to the level labels of each semiconductor production equipment, complete the generation of hierarchical semiconductor production equipment layout.

7. The hierarchical layout generation method of the semiconductor production equipment according to claim 1, wherein The cumulative similarity is specifically expressed as: ； where R is the cumulative similarity, is the similar pairing of all possible semiconductor production devices, m is the total number of similar types of semiconductor production devices, i is the i-th similar type of semiconductor production device, and j and k are the j-th and k-th semiconductor production devices, is the initial level label of the j-th and k-th semiconductor production devices, is an indicator function. If , the value is 1; otherwise, the value is 0.

8. A hierarchical layout generation device for a semiconductor production equipment, characterized in that Adopt the method for generating hierarchical layout of semiconductor production equipment as described in any one of claims 1-7, specifically including: A collection unit for obtaining the layout requirements of semiconductor production and the attribute data of each semiconductor production equipment; An analysis unit for determining the factor indicators for hierarchical layout of semiconductor production equipment, classifying the factor indicators, giving the first-class factor indicators and the second-class factor indicators, and analyzing the layout levels of each semiconductor production equipment in combination with the pre-constructed factor evaluation model; An association unit for responding to the layout level analysis of each semiconductor production equipment based on the strategy of hierarchical layout; A generation unit for generating hierarchical semiconductor production equipment layout.

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