Grinding unit and CMP grinding equipment

Abstract

The invention discloses a grinding unit and CMP grinding equipment, the grinding unit comprises a grinding pad and a grinding assembly, the grinding assembly comprises a supporting seat and a grinding head assembly connected with the supporting seat, the supporting seat is arranged on one side of the grinding pad, the grinding head assembly is arranged above the grinding pad, and the grinding head assembly can transversely move relative to the supporting seat; by means of the arrangement, on the basis of the grinding unit, maintenance personnel can maintain and replace the grinding head assembly only on one side of the grinding pad, operation is safe and convenient, and the grinding head assembly can move towards the circumferential side of the grinding pad. The technical problems that according to an existing grinding unit, a maintainer needs to stand on a grinding pad to maintain and replace a grinding head assembly, operation is inconvenient, the grinding pad is prone to being damaged, and the grinding unit is polluted are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of CMP polishing, and in particular to a polishing unit and a CMP polishing device. Background Art

[0002] In the manufacturing process of the chip industry, in order to achieve high-quality surface flatness of the wafer and solve the problems caused by bumps and depressions, the wafer surface usually needs to be polished. CMP (Chemical Mechanical Polishing) is a key technical process to achieve wafer flatness and is very important in modern semiconductor manufacturing. However, when repairing the grinding unit of the existing CMP grinding equipment, the maintenance personnel need to stand on the grinding pad to repair and replace it, which is inconvenient to operate and easily damages the grinding pad and contaminates the grinding unit. Summary of the invention

[0003] The purpose of the present invention is to address the technical problems existing in the background technology and to propose a grinding unit, including a grinding pad and a grinding assembly, wherein the grinding assembly includes a support seat and a grinding head assembly connected to the support seat, the support seat is arranged on one side of the grinding pad, and the grinding head assembly is arranged above the grinding pad, and the grinding head assembly can move laterally relative to the support seat so that the grinding head assembly moves toward the circumferential side of the grinding pad.

[0004] Further, in some embodiments, the support seat includes a support portion extending outward, the grinding head assembly includes a connecting portion and a grinding head disposed below the connecting portion, and the connecting portion is connected to the support portion.

[0005] Furthermore, in some embodiments, a sliding groove is provided on the support portion, a sliding rack is provided in the sliding groove, and a sliding wheel is provided on the side protrusion of the connecting portion, the sliding wheel is provided in the sliding groove and connected to the sliding rack.

[0006] Furthermore, in some embodiments, the grinding unit further includes a grinding table for carrying a grinding pad, and a liquid supplier, a grinding pad dresser, a dresser cleaner, and a grinding pad cleaner arranged around the grinding table.

[0007] Furthermore, in some embodiments, the present invention also provides a CMP polishing device, comprising a pre-zone, a cleaning zone and a polishing zone, wherein the cleaning zone is disposed adjacent to the pre-zone and the polishing zone, and the polishing zone comprises a polishing unit as claimed in any one of the above claims.

[0008] Furthermore, in some embodiments, the cleaning area includes two cleaning lines and a transmission module arranged between the two cleaning lines, the cleaning lines are used to clean and / or dry the workpieces, and the transmission module is used to transfer the workpieces between the pre-area and the grinding area.

[0009] Further, in some embodiments, the cleaning line includes a first functional module, a second functional module and a third functional module arranged in sequence, the first functional module and the second functional module each include a cleaning unit stacked up and down, and the third functional module includes a cleaning unit and a drying unit stacked up and down.

[0010] Furthermore, in some embodiments, a first manipulator and a second manipulator are also included. The first manipulator is movably disposed between the cleaning area and the grinding area to realize the flipping of the workpiece and the transfer of the workpiece between the cleaning area and the grinding area. The second manipulator is movably disposed on one side of the cleaning line to realize the transfer of the workpiece between various functional modules.

[0011] Further, in some embodiments, a first maintenance channel is vertically arranged between the cleaning area and the grinding area, a second maintenance channel is horizontally arranged between the cleaning line and the transmission module, and the first maintenance channel is connected to the second maintenance channel;

[0012] The first manipulator is disposed in the first maintenance channel and can move along the extension direction of the first maintenance channel. The second manipulator is disposed in the second maintenance channel and can move along the extension direction of the second maintenance channel.

[0013] Furthermore, in some embodiments, a third robot is also included, the front area includes a wafer loading table, the third robot is arranged between the front area and the cleaning area, and is used to realize the transfer of the processed parts between the front area and the cleaning area, and the wafer loading table is arranged side by side on the side of the front area facing away from the cleaning area.

[0014] Furthermore, in some embodiments, a wafer measurement table and / or an emergency discharge table is also provided on the side of the front area facing away from the cleaning area, and the wafer measurement table and / or the emergency discharge table are arranged side by side with the wafer loading table.

[0015] Further, in some embodiments, the grinding area includes a first grinding unit, a second grinding unit, a third grinding unit and a fourth grinding unit, the first grinding unit and the second grinding unit are arranged on one side of the grinding area to form a first grinding system, and the third grinding unit and the fourth grinding unit are arranged on the other side of the grinding area to form a second grinding system;

[0016] The grinding area also includes a loading platform, which is arranged between the first grinding system and the second grinding system. The loading platform is used for transferring the workpiece between the cleaning area and the first grinding system and between the cleaning area and the second grinding system.

[0017] Furthermore, in some embodiments, the grinding area also includes a cleaning mechanism, and the cleaning mechanism is disposed at a loading station of the workpiece.

[0018] Further, in some embodiments, a third maintenance channel is formed laterally between the first grinding system and the second grinding system, the third maintenance channel is connected to the first maintenance channel, the loading platform is arranged in the third maintenance channel, and can move along the extension direction of the third maintenance channel.

[0019] Compared with the prior art, the present invention has the following beneficial technical effects:

[0020] 1. The grinding head assembly of the present invention can move laterally relative to the support seat so that the grinding head assembly moves toward the peripheral side of the grinding pad. Through the above arrangement, maintenance personnel only need to repair and replace the grinding head assembly on one side of the grinding pad, which is safe and convenient to operate, and solves the technical problem that "the maintenance personnel of the existing grinding unit need to stand on the grinding pad to repair and replace the grinding head assembly, which is inconvenient to operate and easily damages the grinding pad and pollutes the grinding unit.

[0021] 2. The cleaning area of ​​the present invention is arranged between the grinding area and the pre-area, which is more conducive to the process selection of wafer pre-cleaning before grinding. At the same time, because the CMP grinding equipment of the present invention includes two sets of processing lines arranged at the upper and lower parts, the upper and lower sets of processing lines can operate independently. When one set of processing lines is shut down for maintenance, the other set of processing lines can operate normally. The two sets of processing lines are alternately operated and maintained, which can achieve the minimum downtime and improve the processing efficiency of the equipment.

[0022] 3. The present invention configures the first functional module, the second functional module and the third functional module into a mode of five cleaning units and one drying unit respectively, which is compatible with a variety of cleaning processes. For example, it can be configured as three roller cleaning units, two pen cleaning units, one drying unit or four roller cleaning units, one pen cleaning unit, one drying unit and other cleaning processes, effectively decomposing a single cleaning module with a bottleneck and improving the cleaning efficiency and the efficiency of the whole machine.

[0023] 4. The present invention is provided with a first maintenance channel, a second maintenance channel, and a third maintenance channel. Maintenance personnel can enter the above maintenance channels from the outside to repair and maintain the grinding area and the cleaning area, which is convenient for maintenance and debugging of components inside the equipment. Furthermore, the first maintenance channel, the second maintenance channel, and the third maintenance channel of the present invention do not occupy additional space of the equipment. Under the condition of ensuring that the overall volume of the equipment remains unchanged, three additional maintenance channels are added with a reasonable layout, which solves the technical problem of difficult maintenance of existing equipment.

[0024] 5. The present invention arranges a wafer measuring platform side by side on one side of the wafer loading platform, which further optimizes the overall layout space of the equipment and reduces the size of the equipment.

[0025] 6. The present invention provides an emergency discharge table to solve the problem that such equipment on the market cannot remove the wafers inside the equipment in time when it stops abnormally, resulting in wafer transition reaction caused by the wafers existing in a humid environment for a long time, thereby causing wafer defects. The emergency discharge table is compatible with the wafer drying function. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the structure of the grinding unit of the present invention (corresponding to Figure 4 Enlarged view of point A in the middle);

[0027] Figure 2 Another structural schematic diagram of the grinding unit of the present invention;

[0028] Figure 3 A top view of the grinding device of the present invention;

[0029] Figure 4 is a three-dimensional diagram of the grinding device of the present invention;

[0030] Figure 5 This is a positional relationship diagram of the cleaning mechanism, the grinding head, and the loading platform of the present invention (stereoscopic perspective);

[0031] Figure 6 The figure is a positional relationship diagram of the cleaning mechanism, the grinding head and the loading platform of the present invention (cross-sectional view);

[0032] Figure 7 It is a material loading flow chart of the grinding equipment of the present invention;

[0033] Figure 8 It is a material return flow chart of the grinding equipment of the present invention;

[0034] Fig. 9 It is a schematic diagram of the moving direction of each mechanism in the grinding equipment of the present invention. DETAILED DESCRIPTION

[0035] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0036] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a specific connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0038] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0039] like Figure 1-Figure 8 As shown, the present invention proposes a grinding unit 10 for processing and grinding wafers. The grinding unit of the present invention includes a grinding pad 11 and a grinding assembly 12. The grinding assembly 12 includes a support seat 121 and a grinding head assembly 122 connected to the support seat 121. The support seat 121 is used to support the grinding head assembly 122, so that the grinding head assembly 122 is arranged above the grinding pad 11. The grinding head assembly 122 is used to carry the wafer and cooperate with the grinding pad 11 to grind the wafer. In the present invention, the grinding head assembly 122 can move laterally relative to the support seat 121 so that the grinding head assembly 122 moves toward the circumferential side of the grinding pad 11.

[0040] In some embodiments, the grinding head assembly 122 can move back and forth from one side of the periphery of the grinding pad 11 to the other side. As an implementation mode, the grinding pad 11 can form a loading station and a maintenance station on both sides of its periphery, respectively. The grinding head assembly 122 can move back and forth between the loading station and the maintenance station. Through the above-mentioned arrangement, when processing the wafer, the grinding head assembly 122 can be controlled to move to the loading station to realize the loading of the wafer. After the grinding head assembly 122 obtains the wafer, it can be moved back to the grinding pad 11 to realize the processing and polishing of the wafer. When the grinding head assembly 122 needs to be repaired and replaced, the grinding head assembly 122 can be controlled to move to the maintenance station. At this time, the maintenance personnel can repair and replace the grinding head assembly 122 on one side of the grinding pad 11, which is convenient to operate.

[0041] It can be understood that based on the grinding unit 10 of the present invention, maintenance personnel only need to repair and replace the grinding head assembly 122 on one side of the grinding pad 11, which is safe and convenient to operate, and solves the technical problem that "existing grinding unit maintenance personnel need to bend over and stand on the grinding pad to repair and replace the grinding head assembly 122, which is inconvenient to operate and easily causes damage to the grinding pad and contaminates the grinding unit."

[0042] Further, in some embodiments, the support seat 121 includes a support portion 1211 extending outward, and the grinding head assembly 122 includes a connecting portion 1221 and a grinding head 1222 disposed below the connecting portion 1221. The connecting portion 1221 is slidably connected to the supporting portion 1211. Through the above arrangement, the connecting portion 1221 can move back and forth in the extension direction of the supporting portion 1211 to drive the grinding head 1222 to move. Optionally, a sliding groove 1212 is provided on the supporting portion 1211, and a sliding rack 1213 is provided in the sliding groove 1212. The connecting portion 1221 is provided with a sliding wheel 1223 protruding on the side, and the sliding wheel 1223 is disposed in the sliding groove 1212 and connected to the sliding rack 1213. The sliding wheel 1223 can move relative to the sliding rack 1213 to drive the connecting portion 1221 to move.

[0043] Furthermore, in some embodiments, the grinding unit also includes a grinding table 13 for carrying a grinding pad 11, and a liquid supply device 14, a grinding pad dresser 15, a dresser cleaner 16 and a grinding pad cleaner 19 arranged around the grinding table 13. The liquid supply device 14 cooperates with the grinding pad dresser 15 to achieve the rest of the grinding pad 111, the dresser cleaner 16 is used to achieve the cleaning of the grinding pad dresser 15, and the grinding pad cleaner 19 is used for the grinding pad dresser 15 to rinse the grinding pad 11 when the grinding pad dresser 15 is dressing the grinding pad 11, so as to prevent the dressing residue from entering the wafer processing area and damaging the wafer.

[0044] Furthermore, the present invention also proposes a CMP polishing device, including a pre-zone 3, a cleaning zone 2 and a polishing zone 1, wherein the cleaning zone 2 is arranged adjacent to the pre-zone 3 and the polishing zone 1, and the polishing zone 1 includes a plurality of polishing units 10 of the present invention. In some embodiments, the pre-zone 3, the cleaning zone 2 and the polishing zone 1 of the present invention are arranged side by side, and the cleaning zone 2 is arranged between the pre-zone 3 and the polishing zone 1. The wafer is transferred from the pre-zone 3 to the polishing zone 1 via the cleaning zone 2 for processing and polishing. After the processing is completed, the wafer is returned to the cleaning zone 2 for cleaning and drying, and returned to the pre-zone 3. Through the above-mentioned arrangement, the present invention arranges the cleaning zone 2 between the polishing zone 1 and the pre-zone 3, which is more conducive to the process selection of wafer pre-cleaning before polishing.

[0045] Further, in some embodiments, the cleaning area 2 includes two cleaning lines 21 and a transmission module 22 disposed between the two cleaning lines 21. Specifically, the cleaning lines 21 are disposed on the upper and lower sides of the cleaning area 2 to realize the cleaning / drying of the wafers, and the transmission module 22 is used to realize the transmission of the wafers between the pre-area 3 and the grinding area 1. Through the above arrangement, the wafers from the pre-area 3 can pass through the cleaning area 2 and be transferred to the grinding area 1 through the transmission module 22, and the wafers polished in the grinding area 1 can be returned to the upper and lower cleaning lines 21 for cleaning and drying, and then transferred back to the pre-area 3.

[0046] Furthermore, in some embodiments, the cleaning line 21 includes a first functional module 211, a second functional module 212 and a third functional module 213 arranged in sequence, the first functional module 211 and the second functional module 212 both include cleaning units 201 stacked up and down, the third functional module 213 includes a cleaning unit 201 and a drying unit 202 stacked up, the drying unit 202 is arranged above the cleaning unit 201, the cleaning unit 201 can realize pre-cleaning and fine cleaning of the wafer, and the drying unit 202 is used to dry the wafer after cleaning.

[0047] It can be understood that between cleaning units and drying units of different specifications, due to their different processing time for wafers, the units may idle. For example, the wafers need to be cleaned through units A and B respectively. If the processing time of unit B is faster than that of unit A, unit B will have to wait for unit A, causing unit B to idle, thereby reducing the efficiency of the entire machine. The present invention configures the first functional module 211, the second functional module 212 and the third functional module 213 to be five cleaning units 201 and one drying unit 202 respectively, so as to be compatible with a variety of cleaning processes. For example, it can be configured as three roller cleaning units, two pen cleaning units, one drying unit 202 or four roller cleaning units, one pen cleaning unit, one drying unit, etc., effectively decomposing a single cleaning module with a bottleneck and improving the cleaning efficiency and the efficiency of the entire machine.

[0048] Furthermore, in some embodiments, the cleaning area 2 also includes a first robot 41 and a second robot 42. The first robot 41 can be movably disposed between the cleaning area 2 and the grinding area 1 to realize the flipping of the wafer and the transfer of the wafer between the cleaning area 2 and the grinding area 1. The second robot 42 can be movably disposed between the cleaning line 21 and the transmission module 22 to realize the transfer of the wafer between various functional modules.

[0049] Through the above-mentioned arrangement, the wafer from the front area 3 can be transferred to the first robot 41 via the transmission module 22. The first robot 41 can flip the wafer according to the situation and transfer it to the grinding area 1 for grinding. In addition, optionally, before transferring the wafer to the grinding area 1 for grinding, the first robot 41 can also transfer the wafer to the first functional module 211 for pre-cleaning to remove stains on the wafer surface and improve the grinding effect. Further, the polished wafer can be directly transferred by the first robot 41 to the cleaning unit 201 arranged at the bottom of the first functional module 211 to achieve preliminary cleaning of the wafer, and then the wafer is taken out by the second robot 42 and transferred to the cleaning unit 201 arranged at the top of the first functional module 211 for further cleaning. After the wafer is cleaned by the first functional module 211, the second robot 42 takes out the wafer, and repeats the above steps, and transfers it to the second functional module 212 and the third functional module 213 in turn until the wafer is transferred to the front area 3.

[0050] Furthermore, in some embodiments, the cleaning area 2 also includes an auxiliary robot 44 , which can be fixedly disposed between any adjacent functional modules of the same cleaning line to assist in transporting wafers to reduce the carrying load of the second robot 42 .

[0051] Furthermore, in some embodiments, a wafer temporary storage mechanism is provided on the cleaning area 2 on the side close to the grinding area 1. The wafer temporary storage mechanism is used to temporarily store wafers to relieve the working pressure of the cleaning area 2. In addition, the wafer temporary storage mechanism can also ensure that the surface of the wafer is moistened when storing the wafer, which is convenient for subsequent cleaning.

[0052] Furthermore, in some embodiments, a first maintenance channel 51 connected to the outside is vertically arranged between the cleaning area 2 and the grinding area 1, a second maintenance channel 52 is horizontally arranged between the cleaning line 21 and the transmission module 22, the first maintenance channel 51 is connected to the second maintenance channel 52, the first manipulator 41 is arranged in the first maintenance channel 51 and can move along the extension direction of the first maintenance channel 51, and the second manipulator 42 is arranged in the second maintenance channel 52 and can move along the extension direction of the second maintenance channel 52.

[0053] Through the above arrangement, when the entire device needs to be repaired or maintained, the first manipulator 41 can be moved to the bottom of the first maintenance channel 51, and the second manipulator 42 can be moved to the rightmost side of the second maintenance channel 52. Maintenance personnel can enter the first maintenance channel 51 and the second maintenance channel 52 from the outside to repair and maintain the grinding area 1 and the cleaning area 2, which is convenient for maintenance and debugging of components inside the device. Furthermore, the first maintenance channel 51 and the second maintenance channel 52 of the present invention are arranged inside the device, and also serve as the moving area of ​​the first manipulator 41 and the second manipulator 42, that is, the first maintenance channel 51 and the second maintenance channel 52 of the present invention do not occupy additional space of the device. Based on the above principle, the present invention adds two additional maintenance channels while ensuring that the overall volume of the device remains unchanged. Through reasonable layout, the technical problem of difficult maintenance of existing equipment is solved.

[0054] Furthermore, in some embodiments, the front area 3 includes a third robot 43, a wafer loading table 31 and a wafer measuring table 32. The third robot 43 can be movably arranged between the front area 3 and the cleaning area 2 to realize the transfer of wafers between the front area 3 and the cleaning area 2. The wafer loading table 31 and the wafer measuring table 32 are arranged side by side on the side of the front area 3 facing away from the cleaning area 2. Preferably, it can be configured into four wafer loading tables 31, one spare wafer loading table 31 or four wafer loading tables 31, one wafer measuring table 32 and other modes. Through the above arrangement, the wafer located on the wafer loading table 31 can be transferred to the transmission module 22 via the third robot 43, and the wafer located in the drying unit can be transferred to the third robot 43 via the second robot 42, and then returned to the wafer loading table 31 by the third robot 43. Furthermore, because the present invention is provided with a wafer measuring table 32 side by side on one side of the wafer loading table 31, the overall layout space of the equipment is further optimized and the size of the equipment is reduced.

[0055] Furthermore, in some embodiments, an emergency discharge table may be provided in the front area 3. The emergency discharge table is provided on the side of the front area 3 facing away from the cleaning area 2 and is arranged side by side with the wafer loading table 31. The emergency discharge table is used to discharge the wafers out of the equipment. Preferably, the emergency discharge table is also provided with a drying mechanism, and the drying mechanism is used to dry the discharged wafers. It can be understood that the emergency discharge table can send the wafers in the equipment out for emergency discharge when an abnormality occurs in the equipment, and at the same time avoid the wafers being stored in a space with chemical gases for a long time, resulting in defective wafers.

[0056] Furthermore, in some embodiments, a plurality of loading stations and an auxiliary station may be arranged side by side on the side of the front area 3 facing away from the cleaning area 2, the wafer loading table 31 is installed at the loading station, and the emergency discharge table and the wafer measurement table 32 may be selected to be installed at the auxiliary station. In addition, the auxiliary station may also be arranged in multiple numbers to respectively adapt to the emergency discharge table and the wafer measurement table 32, and the user may flexibly configure it according to needs.

[0057] Further, in some embodiments, the grinding area 1 includes a first grinding unit 101, a second grinding unit 102, a third grinding unit 103 and a fourth grinding unit 104, the first grinding unit 101 and the second grinding unit 102 are arranged on one side of the grinding area 1 to constitute a first grinding system, the third grinding unit 103 and the fourth grinding unit 104 are arranged on the other side of the grinding area 1 to constitute a second grinding system, and the grinding area 1 also includes a loading platform 17, which is movably arranged between the first grinding system and the second grinding system, and the loading platform 17 is used for transferring and loading wafers between the cleaning area 2 and the first grinding system and transferring and loading wafers between the cleaning area 2 and the second grinding system.

[0058] Through the above-mentioned arrangement, the movable loading platform 17 can receive the wafer from the first robot 41 and return to the side of the grinding unit 10 to deliver the wafer to the first grinding system and / or the second grinding system for grinding. The polished wafer is then transferred to the loading platform 17 by the grinding head assembly 122 and returned to the first robot 41 by the loading platform 17. It can be understood that since the CMP grinding equipment of the present invention includes two groups of grinding systems arranged at the upper and lower parts, the upper and lower groups of grinding systems can operate independently. When one group of grinding systems is shut down for maintenance, the other group of grinding systems can operate normally. The two groups of grinding systems are alternately operated and maintained, which can achieve minimal downtime and improve the processing efficiency of the equipment.

[0059] Furthermore, in some embodiments, the grinding area 1 also includes a cleaning mechanism 18, which is arranged at the loading station of the wafer. Optionally, the cleaning mechanism 18 can be a cleaning ring and is arranged between the grinding head 1222 and the loading platform 17. The cleaning ring can spray cleaning liquid at both the upper and lower ends to clean the wafer. Specifically, after the wafer processing is completed, the grinding head can be moved to the loading station. At this time, the cleaning mechanism 18 sprays cleaning liquid from the upper part to achieve pre-cleaning of the lower surface of the wafer, and then the wafer is placed on the loading platform 17. At this time, the cleaning mechanism 18 sprays cleaning liquid from the lower part to achieve pre-cleaning of the upper surface of the wafer.

[0060] Furthermore, in some embodiments, a transversely arranged third maintenance channel 53 is formed between the first grinding system and the second grinding system, the third maintenance channel 53 is connected to the first maintenance channel 51 , the loading platform 17 is arranged in the third maintenance channel 53 and can move along the extension direction of the third maintenance channel 53 .

[0061] Through the above arrangement, when the entire device needs to be repaired or maintained, the loading platform 17 can be moved to the rightmost side of the third maintenance channel 53, and the maintenance personnel can enter the third maintenance channel 53 from the outside through the first maintenance channel 51 to maintain the various devices in the grinding area 1, which is convenient for the maintenance and debugging of the components inside the device. Furthermore, the third maintenance channel 53 of the present invention is arranged inside the grinding area 1, and also serves as the moving area of ​​the loading platform 17, that is, the third maintenance channel 53 of the present invention does not occupy additional space in the grinding area. Based on the above principle, the present invention not only ensures that the overall volume of the device remains unchanged, but also adds a third maintenance channel, and solves the technical problem of the difficulty of maintenance of the existing equipment through reasonable layout.

[0062] In summary, the present invention has the following beneficial technical effects compared with the prior art:

[0063] 1. The grinding head assembly of the present invention can move laterally relative to the support seat so that the grinding head assembly moves toward the peripheral side of the grinding pad. Through the above arrangement, maintenance personnel only need to repair and replace the grinding head assembly on one side of the grinding pad, which is safe and convenient to operate, and solves the technical problem that "the maintenance personnel of the existing grinding unit need to stand on the grinding pad to repair and replace the grinding head assembly, which is inconvenient to operate and easily damages the grinding pad and pollutes the grinding unit.

[0064] 2. The cleaning area of ​​the present invention is arranged between the grinding area and the pre-area, which is more conducive to the process selection of wafer pre-cleaning before grinding. At the same time, because the CMP grinding equipment of the present invention includes two sets of processing lines arranged at the upper and lower parts, the upper and lower sets of processing lines can operate independently. When one set of processing lines is shut down for maintenance, the other set of processing lines can operate normally. The two sets of processing lines are alternately operated and maintained, which can achieve the minimum downtime and improve the processing efficiency of the equipment.

[0065] 3. The present invention configures the first functional module, the second functional module and the third functional module into a mode of five cleaning units and one drying unit respectively, which is compatible with a variety of cleaning processes. For example, it can be configured as three roller cleaning units, two pen cleaning units, one drying unit or four roller cleaning units, one pen cleaning unit, one drying unit and other cleaning processes, effectively decomposing a single cleaning module with a bottleneck and improving the cleaning efficiency and the efficiency of the whole machine.

[0066] 4. The present invention is provided with a first maintenance channel, a second maintenance channel, and a third maintenance channel. Maintenance personnel can enter the above maintenance channels from the outside to repair and maintain the grinding area and the cleaning area, which is convenient for maintenance and debugging of components inside the equipment. Furthermore, the first maintenance channel, the second maintenance channel, and the third maintenance channel of the present invention do not occupy additional space of the equipment. Under the condition of ensuring that the overall volume of the equipment remains unchanged, three additional maintenance channels are added with a reasonable layout, which solves the technical problem of difficult maintenance of existing equipment.

[0067] 5. The present invention arranges a wafer measuring platform side by side on one side of the wafer loading platform, which further optimizes the overall layout space of the equipment and reduces the size of the equipment.

[0068] 6. The present invention provides an emergency discharge table to solve the problem that such equipment on the market cannot remove the wafers inside the equipment in time when it stops abnormally, resulting in wafer transition reaction caused by the wafers existing in a humid environment for a long time, thereby causing wafer defects. The emergency discharge table is compatible with the wafer drying function.

[0069] The above is one or more implementation methods provided in combination with specific contents, and it is not intended that the specific implementation of the present invention is limited to these descriptions. Any similarity or similarity with the method, structure, etc. of the present invention, or any technical deduction or replacement made on the premise of the concept of the present invention, shall be regarded as the protection scope of the present invention.

Claims

1. A grinding unit, comprising a grinding pad (11) and a grinding assembly (12), characterized in that: The grinding assembly (12) comprises a support seat (121) and a grinding head assembly (122) connected to the support seat (121); the support seat (121) is arranged on one side of the grinding pad (11); the grinding head assembly (122) is arranged above the grinding pad (11); the grinding head assembly (122) can move laterally relative to the support seat (121) so that the grinding head assembly (122) moves toward the circumferential side of the grinding pad (11).

2. A grinding unit according to claim 1, characterized in that: The support seat (121) comprises a support portion (1211) extending outward, and the grinding head assembly (122) comprises a connecting portion (1221) and a grinding head (1222) arranged below the connecting portion (1221), and the connecting portion (1221) is connected to the support portion (1211).

3. A grinding unit according to claim 2, characterized in that: The support portion (1211) is provided with a sliding groove (1212), a sliding rack (1213) is arranged in the sliding groove (1212), and a sliding wheel (1223) is protruded on one side of the connecting portion (1221), and the sliding wheel (1223) is arranged in the sliding groove (1212) and connected to the sliding rack (1213).

4. A grinding unit according to claim 1, characterized in that: The grinding unit further comprises a grinding table (13) for carrying the grinding pad (11), and a liquid supplier (14), a grinding pad dresser (15), a dresser cleaner (16) and a grinding pad cleaner (19) arranged around the grinding table (13).

5. A CMP polishing device, comprising a pre-zone (3), a cleaning zone (2) and a polishing zone (1), characterized in that: The cleaning zone (2) is arranged adjacent to the pre-zone (3) and the grinding zone (1), and the grinding zone (1) comprises a grinding unit (10) as claimed in any one of the preceding claims.

6. A CMP polishing device according to claim 5, characterized in that: The cleaning area (2) comprises two cleaning lines (21) and a transmission module (22) arranged between the two cleaning lines (21); the cleaning lines (21) are used to clean and / or dry the workpiece; and the transmission module (22) is used to transmit the workpiece between the pre-area (3) and the grinding area (1).

7. A CMP polishing device according to claim 6, characterized in that: The cleaning line (21) comprises a first functional module (211), a second functional module (212) and a third functional module (213) which are arranged in sequence; the first functional module (211) and the second functional module (212) both comprise a cleaning unit (201) which is stacked up and down; and the third functional module (213) comprises a cleaning unit (201) and a drying unit (202) which are stacked up and down.

8. A CMP polishing device according to claim 7, characterized in that: The system further comprises a first manipulator (41) and a second manipulator (42); the first manipulator (41) is movably arranged between the cleaning area (2) and the grinding area (1) to realize the flipping of the workpiece and the transfer of the workpiece between the cleaning area (2) and the grinding area (1); the second manipulator (42) is movably arranged on one side of the cleaning line (21) to realize the transfer of the workpiece between the functional modules.

9. A CMP polishing device according to claim 8, characterized in that: A first maintenance channel (51) is formed between the cleaning area (2) and the grinding area (1), a second maintenance channel (52) is formed between the cleaning line (21) and the transmission module (22), and the first maintenance channel (51) is connected to the second maintenance channel (52); The first manipulator (41) is arranged in the first maintenance channel (51) and is movable along the extension direction of the first maintenance channel (51); the second manipulator (42) is arranged in the second maintenance channel (52) and is movable along the extension direction of the second maintenance channel (52).

10. The CMP polishing equipment according to claim 5, characterized in that: The invention also comprises a third robot (43), the front area (3) comprises a wafer loading platform (31), the third robot (43) is arranged between the front area (3) and the cleaning area (2), and is used to realize the transmission of the processed parts between the front area (3) and the cleaning area (2), and the wafer loading platform (31) is arranged on the side of the front area (3) facing away from the cleaning area (2).

11. A CMP polishing device according to claim 10, characterized in that: The front area (3) is also provided with a wafer measurement platform (32) and / or an emergency discharge platform on the side facing away from the cleaning area (2); the wafer measurement platform (32) and / or the emergency discharge platform are arranged side by side with the wafer loading platform (31).

12. A CMP polishing device according to claim 5, characterized in that: The grinding area (1) comprises a first grinding unit (101), a second grinding unit (102), a third grinding unit (103) and a fourth grinding unit (104); the first grinding unit (101) and the second grinding unit (102) are arranged on one side of the grinding area (1) to form a first grinding system, and the third grinding unit (103) and the fourth grinding unit (104) are arranged on the other side of the grinding area (1) to form a second grinding system; The grinding area (1) also includes a loading platform (17), which is arranged between the first grinding system and the second grinding system. The loading platform (17) is used for transferring the workpiece between the cleaning area (2) and the first grinding system and between the cleaning area (2) and the second grinding system.

13. A CMP polishing device according to claim 12, characterized in that: The grinding area (1) further comprises a cleaning mechanism (18), wherein the cleaning mechanism (18) is arranged at a loading station of the workpiece.

14. A CMP polishing device according to claim 12, characterized in that: A third maintenance channel (53) is formed between the first grinding system and the second grinding system. The third maintenance channel (53) is connected to the first maintenance channel (51). The loading platform (17) is arranged in the third maintenance channel (53) and can move along the extension direction of the third maintenance channel (53).

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