Full-automatic planting plate detaching machine

Abstract

The invention discloses a full-automatic planting plate detaching machine. Comprising a rack as well as a light plate feeding mechanism, a finished product output mechanism, a semi-finished product conveying track, a finished product conveying track, an A-surface carrier unlocking and positioning mechanism, a B-surface carrier unlocking and positioning mechanism, a semi-finished product turnover mechanism, a finished product turnover mechanism, a PCB (Printed Circuit Board) detaching and transplanting mechanism, a carrier collecting mechanism and a carrier transplanting mechanism which are mounted on the rack. By integrating a plurality of procedures and equipment, the full-automatic process from feeding of the light plate, unlocking of the carrier, detaching and planting of the surface A / B, plate turning, collection of the empty carrier and output of finished products is achieved, the time and labor cost of material transfer between the equipment are remarkably reduced, and therefore the overall production efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board processing, and in particular to a fully automatic board removal and transplanting machine. Background Art

[0002] The electronics industry has developed rapidly in the 21st century. The performance of PCB boards, an important component of its products, has been continuously improved, and the process requirements of PCB boards have become increasingly higher. PCB boards are circuit boards. The processing of PCB boards is a relatively active industry in the contemporary electronic component industry.

[0003] With the development of science and technology and the popularization of automated production, the processing of PCB boards has gradually been automated. In the PCB processing process, the PCB board needs to be placed in a spring carrier for single-sided or double-sided processing. In this processing process, it is necessary to perform processes such as unlocking the carrier, implanting the board, removing the board, turning the board, and collecting the carrier.

[0004] However, in the existing PCB processing methods, each process equipment needs to be operated separately, which increases the number of operation links and equipment, not only high production costs, but also requires a lot of manpower for the entire processing process. At the same time, the material transfer between equipment wastes a lot of time, and each equipment needs to be operated and monitored by personnel, which increases labor intensity and limits production efficiency.

[0005] The above shortcomings need to be improved. Summary of the invention

[0006] In order to overcome the problems in the prior art of PCB board processing, such as high production cost, much time wasted in material transfer between equipment, and limited production efficiency, due to the need for each process equipment to perform separate operations, the present invention provides a fully automatic board removal and transplanting machine.

[0007] The technical solution of the present invention is as follows:

[0008] A fully automatic board removal machine, comprising:

[0009] frame;

[0010] A bare board feeding mechanism, installed on the frame, for feeding a bare PCB board;

[0011] A finished product output mechanism, installed on the frame, for outputting finished PCB boards;

[0012] A semi-finished product conveying track is installed on the frame, and is used to receive an empty A-side carrier or a carrier loaded with a semi-finished PCB board, and convey the A-side carrier to the semi-finished product removal station, and output an A-side carrier loaded with a bare PCB board;

[0013] A finished product conveying track is installed on the frame, and is used to receive an empty B-side carrier or a carrier loaded with a finished PCB board, and convey the B-side carrier to a finished product removal station, and output a B-side carrier loaded with a semi-finished PCB product;

[0014] A semi-finished product turning mechanism is installed on the frame and is used to transport the semi-finished PCB board located at the semi-finished product removal station to the semi-finished product turning station and turn it 180°;

[0015] A PCB removal and transplanting mechanism is installed on the frame, and is used to implant the PCB bare board supplied by the bare board feeding mechanism into the A-side carrier located at the semi-finished product removal and transplanting station, implant the semi-finished PCB board located at the semi-finished product flipping station into the B-side carrier located at the finished product removal and transplanting station, and transport the finished PCB board in the B-side carrier located at the finished product removal and transplanting station to the finished product output mechanism;

[0016] A carrier collection mechanism, mounted on the frame, for collecting empty A-side carriers and B-side carriers;

[0017] The carrier transplanting mechanism is installed on the frame and is used to transport the A-side carrier located at the empty semi-finished product removal and implantation station and the B-side carrier located at the empty finished product removal and implantation station to the carrier collecting mechanism.

[0018] The fully automatic plate removal machine according to the above scheme also includes:

[0019] A finished product flipping mechanism is installed on the frame and is used to transport the finished PCB board located at the finished product removal station to the finished product flipping station and flip it 180 degrees according to demand;

[0020] The PCB dismantling and transplanting mechanism is also used to transport the finished PCB board located at the finished product turning station to the finished product output mechanism.

[0021] Furthermore, the PCB removal and transplantation mechanism includes:

[0022] A first PCB removal and transplanting robot is installed on the frame and is used to supply the PCB light board from the light board feeding mechanism to the A-side carrier located at the semi-finished product removal station, and to transport the finished PCB board located at the finished product flipping station to the finished product output mechanism;

[0023] The second PCB removal and transplanting robot is installed on the frame and is symmetrically arranged with the first PCB removal and transplanting robot, and is used to implant the semi-finished PCB board located at the semi-finished product flipping station into the B-side carrier located at the finished product removal station, and to transport the finished PCB board in the B-side carrier located at the finished product removal station to the finished product output mechanism.

[0024] According to the fully automatic board removal and transplanting machine of the above scheme, the bare board loading mechanism includes a first lifting module, and the lifting end of the first lifting module is provided with a first lifting platform for placing a bare board box, and the bare board box is used to stack PCB bare boards.

[0025] According to the fully automatic board removal and transplanting machine of the above scheme, the bare board feeding mechanism is located below the output end of the finished product output mechanism;

[0026] The finished product output mechanism includes a cylinder driving mechanism, a primary movable plate, a secondary movable plate, a transmission belt and a finished product output track. The cylinder driving mechanism is fixed on the frame, and the driving end of the cylinder driving mechanism is connected to one side of the primary movable plate. The bottom of the primary movable plate is slidably connected to the frame through a first linear slide rail, and the bottom of the secondary movable plate is slidably connected to the top of the primary movable plate through a second linear slide rail. The transmission belt is arranged on the other side of the primary movable plate, and the lower side of the transmission belt is connected to the frame through a first connecting member, and the upper side of the transmission belt is connected to the secondary movable plate through a second connecting member. The finished product output track is arranged on the secondary movable plate, and the output end of the finished product output track is connected to the lower machine.

[0027] According to the fully automatic plate removal machine of the above scheme, the carrier collection mechanism includes:

[0028] A-side carrier collection mechanism, mounted on the frame, for collecting empty A-side carriers;

[0029] A B-side carrier collection mechanism, mounted on the frame and arranged side by side with the A-side carrier collection mechanism, for collecting empty B-side carriers;

[0030] The carrier transplanting mechanism comprises:

[0031] A surface carrier transplanting mechanism, installed on the frame, used to transport the surface A carrier located at the semi-finished product removal station to the surface A carrier collecting mechanism;

[0032] The B-side carrier transplanting mechanism is installed on the frame and symmetrically arranged with the A-side carrier transplanting mechanism, and is used for transporting the B-side carrier located at the finished product removal station to the B-side carrier collecting mechanism.

[0033] Furthermore, the A-side carrier collection mechanism and the B-side carrier collection mechanism have the same structure;

[0034] The A-side carrier collection mechanism includes a second lifting module, and a second lifting platform for stacking and storing A-side carriers is provided at the lifting end of the second lifting module. Anti-falling positioning panels are provided on two adjacent sides of the outer periphery of the second lifting platform, and vehicle tidying components for tidying the positions of A-side carriers are provided on the tops of two adjacent anti-falling positioning panels.

[0035] Furthermore, the carrier regularization assembly includes a linear drive module and a carrier regularization plate, the linear drive module is fixed on the top of the corresponding anti-overturning positioning panel, the driving end of the linear drive module is connected to the carrier regularization plate, and the linear drive module is used to drive the carrier regularization plate to move along the direction of the adjacent anti-overturning positioning panel.

[0036] According to the fully automatic board removal and transplanting machine of the above scheme, the semi-finished product flipping mechanism includes a first jacking mechanism and a flipping mechanism, the first jacking mechanism is fixed on the frame, the flipping mechanism is connected to the jacking end of the first jacking mechanism, a flipping arm is provided at the flipping end of the flipping mechanism, and a vacuum suction cup for sucking the semi-finished PCB board is provided on the flipping arm.

[0037] The fully automatic plate removal machine according to the above scheme also includes:

[0038] A surface carrier unlocking and positioning mechanism, installed on the semi-finished product dismantling station, used for positioning and unlocking the surface A carrier transported to the semi-finished product dismantling station;

[0039] The B-side carrier unlocking and positioning mechanism is installed on the finished product removal and implantation station and is used to position and unlock the B-side carrier transported to the finished product removal and implantation station.

[0040] Furthermore, the A-side carrier unlocking and positioning mechanism and the B-side carrier unlocking and positioning mechanism have the same structure;

[0041] The A-side carrier unlocking and positioning mechanism includes a second lifting mechanism fixed on the frame, a positioning base plate arranged at the lifting end of the second lifting mechanism, and four unlocking cylinders respectively arranged laterally at the four corners of the bottom of the positioning base plate, and the telescopic ends of the four unlocking cylinders are provided with pins for positioning and unlocking the A-side carrier.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] 1. By integrating multiple processes and equipment, one device can realize the fully automated process from loading bare boards, unlocking carriers, removing A-side / B-side implants, turning over boards, collecting empty carriers, to finished product output, which significantly reduces the time and labor costs of material transfer between equipment, thereby improving overall production efficiency; by reducing the number of equipment and operators for independent operations, the fully automatic implant removal machine helps to reduce production costs, including equipment purchase costs, maintenance costs, and labor costs;

[0044] 2. By setting up semi-finished product conveying tracks and finished product conveying tracks, compatibility of PCB finished products and PCB semi-finished products is achieved;

[0045] 3. By setting up the finished product turning mechanism, it can be flexibly adjusted according to customer needs, such as whether the plate needs to be turned over, etc., to meet diverse production needs;

[0046] 4. In order to prevent the PCB from being damaged when the flipping mechanism flips, the flipping mechanism is first lifted and then flipped to eliminate the angle between the PCB and the track during flipping;

[0047] 5. In order to improve the accuracy of board removal and transplantation, the carrier unlocking and positioning mechanism is used to accurately position and unlock the incoming carrier, and then the camera component is used to perform software correction on the position of the PCB board absorbed by the PCB removal and transplantation mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0049] Figure 1 It is a structural schematic diagram of a fully automatic plate removal machine in one embodiment of the present invention;

[0050] Figure 2 A top view of a fully automatic board removal machine according to an embodiment of the present invention;

[0051] Figure 3 It is a structural schematic diagram of a light plate loading mechanism in one embodiment of the present invention;

[0052] Figure 4 This is a structural schematic diagram of a finished product output mechanism in one embodiment of the present invention;

[0053] Figure 5 It is a structural schematic diagram of a finished product output mechanism from another perspective in one embodiment of the present invention;

[0054] Figure 6 It is a structural schematic diagram of the A-side carrier collection mechanism in one embodiment of the present invention;

[0055] Figure 7 This is a schematic structural diagram of a semi-finished product turning mechanism in one embodiment of the present invention;

[0056] Figure 8 Schematic diagram of the structure of the A-side carrier unlocking and positioning mechanism in one embodiment of the present invention.

[0057] In the figure,

[0058] 1. Frame; 2. Bare board loading mechanism; 21. First lifting module; 22. First lifting platform; 3. Finished product output mechanism; 4. Semi-finished product conveying track; 5. Finished product conveying track; 51. Cylinder drive mechanism; 52. Primary moving plate; 53. Secondary moving plate; 54. Drive belt; 55. Finished product output track; 56. First linear slide rail; 57. Second linear slide rail; 58. First connecting piece; 59. Second connecting piece; 6. A-side carrier unlocking and positioning mechanism; 61. Second lifting mechanism; 62. Positioning base plate; 63. Unlocking cylinder; 64. Pin; 7. B-side carrier unlocking and positioning mechanism; 8. Semi-finished product turning mechanism; 81. First lifting mechanism; 82. Turning mechanism; 821. Turning arm; 822, vacuum suction cup; 9, finished product turning mechanism; 10, PCB dismantling and transplanting mechanism; 101, first PCB dismantling and transplanting robot; 102, second PCB dismantling and transplanting robot; 11, carrier collection mechanism; 111, A-side carrier collection mechanism; 1111, second lifting module; 1112, second lifting platform; 1113, anti-falling positioning enclosure; 1114, carrier regularization component; 11141, linear drive module; 11142, carrier regularization plate; 112, B-side carrier collection mechanism; 12, carrier transplanting mechanism; 121, A-side carrier transplanting mechanism; 122, B-side carrier transplanting mechanism; 13, first lower visual positioning camera; 14, second lower visual positioning camera. DETAILED DESCRIPTION

[0059] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. It is also stated that the embodiments described below are only used to explain the present invention and are not used to limit the present invention.

[0060] It should be noted that the terms "install", "set", "connect", "fix" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. The indicated orientation or position relationship is based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the application product is usually placed when in use, or the orientation or position relationship commonly understood by those skilled in the art, or the orientation or position relationship in which the application product is usually placed when in use. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0061] See also Figure 1 , Figure 2 An embodiment of the present invention provides a fully automatic PCB removal and transplanting machine, including a frame 1 and a bare board loading mechanism 2 installed on the frame 1, a finished product output mechanism 3, a semi-finished product conveying track 4, a finished product conveying track 5, an A-side carrier unlocking and positioning mechanism 6, a B-side carrier unlocking and positioning mechanism 7, a semi-finished product flipping mechanism 8, a finished product flipping mechanism 9, a PCB removal and transplanting mechanism 10, a carrier collecting mechanism 11 and a carrier transplanting mechanism 12.

[0062] Among them, the light board feeding mechanism 2 is used to supply PCB light boards.

[0063] The finished product output mechanism 3 is used to output the finished PCB board.

[0064] The semi-finished product conveying track 4 is used to receive an empty A-side carrier or one loaded with a semi-finished PCB board, and to convey the A-side carrier to a semi-finished product removal station, and to output an A-side carrier loaded with a bare PCB board.

[0065] The finished product conveying track 5 is used to receive an empty B-side carrier or one loaded with a finished PCB board, and to convey the B-side carrier to the finished product removal station, and to output a B-side carrier loaded with a semi-finished PCB product.

[0066] The A-side carrier unlocking and positioning mechanism 6 is used to position and unlock the A-side carrier transported to the semi-finished product dismantling station.

[0067] The B-side carrier unlocking and positioning mechanism 7 is used to position and unlock the B-side carrier transported to the finished product removal and transplantation station. Since both the A-side carrier and the B-side carrier are provided with spring parts for locking the PCB board, in order to enable the PCB removal and transplantation mechanism 10 to smoothly place the PCB board into the A-side carrier and the B-side carrier, or take out the PCB board from the A-side carrier and the B-side carrier, during the board removal and transplantation process, the A-side carrier and the B-side carrier need to be unlocked by the A-side carrier unlocking and positioning mechanism 6 and the B-side carrier unlocking and positioning mechanism 7.

[0068] The semi-finished product turning mechanism 8 is used to transport the semi-finished PCB board located at the semi-finished product removal station to the semi-finished product turning station and turn it 180°.

[0069] The finished product turning mechanism 9 is used to transport the finished PCB board located at the finished product removal station to the finished product turning station according to demand, and turn it 180 degrees.

[0070] The PCB removal and transplanting mechanism 10 is used to implant the PCB bare board supplied by the bare board loading mechanism 2 onto the A-side carrier located at the semi-finished product removal station, implant the semi-finished PCB board located at the semi-finished product flipping station onto the B-side carrier located at the finished product removal station, transport the finished PCB board in the B-side carrier located at the finished product removal station to the finished product output mechanism 3, and transport the finished PCB board located at the finished product flipping station to the finished product output mechanism 3.

[0071] The carrier collection mechanism 11 is used to collect empty A-side carriers and B-side carriers.

[0072] The carrier transfer mechanism 12 is used to transport the A-side carriers located at the semi-finished product removal and implantation stations and the B-side carriers located at the finished product removal and implantation stations to the carrier collection mechanism 11 .

[0073] Working principle:

[0074] First, the semi-finished product conveying track 4 receives the empty A-side carrier conveyed by the upper computer, and conveys the A-side carrier to the semi-finished product removal and planting station; the A-side carrier unlocking and positioning mechanism 6 positions and unlocks the A-side carrier conveyed to the semi-finished product removal and planting station; the PCB removal and transplanting mechanism 10 implants the PCB bare board supplied by the bare board feeding mechanism 2 onto the A-side carrier located at the semi-finished product removal and planting station; the semi-finished product conveying track 4 conveys the A-side carrier loaded with the PCB bare board to the SMT main line reflow furnace for A-side processing to form a semi-finished PCB board;

[0075] Secondly, the semi-finished product conveying track 4 receives the A-side carrier loaded with the semi-finished PCB board conveyed by the host computer, and conveys the A-side carrier to the semi-finished product removal and planting station; the A-side carrier unlocking and positioning mechanism 6 positions and unlocks the A-side carrier conveyed to the semi-finished product removal and planting station; the semi-finished product flipping mechanism 8 conveys the semi-finished PCB board at the semi-finished product removal and planting station to the semi-finished product flipping station and flips it 180°; the finished product conveying track 5 receives the empty B-side carrier conveyed by the host computer, and conveys the B-side carrier to the finished product removal and planting station The B-side carrier unlocking and positioning mechanism 7 positions and unlocks the B-side carrier transported to the finished product removal and planting station; the PCB removal and planting transplanting mechanism 10 implants the semi-finished PCB board flipped at the semi-finished product flipping station onto the B-side carrier at the finished product removal and planting station; the carrier transplanting mechanism 12 transports the empty A-side carrier at the semi-finished product removal and planting station to the carrier collecting mechanism 11 for temporary storage; the finished product conveying track 5 transports the B-side carrier loaded with the PCB semi-finished product to the SMT main line reflow furnace for B-side processing to form a PCB board finished product;

[0076] Then, the finished product conveying track 5 receives the B-side carrier loaded with the finished PCB board delivered by the host computer, and conveys the B-side carrier to the finished product removal and planting station; the B-side carrier unlocking and positioning mechanism 7 positions and unlocks the B-side carrier delivered to the finished product removal and planting station. At this time, if the customer has no need to flip the board, the PCB disassembly and transplanting mechanism 10 will transport the finished PCB board in the B-side carrier at the finished product disassembly station to the finished product output mechanism 3, and the finished product output mechanism 3 will then transport the finished PCB board to the lower machine, and the carrier transplanting mechanism 12 will transport the empty B-side carrier at the finished product disassembly station to the carrier collection mechanism 11 for temporary storage; if the customer has a need to flip the board, the finished product flipping mechanism 9 will transport the finished PCB board at the finished product disassembly station to the finished product flipping station and flip it 180°, and the PCB disassembly and transplanting mechanism 10 will then transport the flipped PCB board at the finished product flipping station to the finished product output mechanism 3, and the finished product output mechanism 3 will then transport the flipped PCB board to the lower machine, and the carrier transplanting mechanism 12 will transport the empty B-side carrier at the finished product disassembly station to the carrier collection mechanism 11 for temporary storage.

[0077] The fully automatic board removal and implantation machine of the present invention integrates multiple processes and equipment, and a single device realizes a fully automated process from loading bare boards, unlocking carriers, removing A-side / B-side boards, turning boards, collecting empty carriers, to finished product output, which significantly reduces the time and labor costs of transferring materials between devices, thereby improving overall production efficiency; since the number of equipment and operators operating independently is reduced, the fully automatic board removal and implantation machine helps to reduce production costs, including equipment purchase costs, maintenance costs, and labor costs; by providing a semi-finished product conveying track 4 and a finished product conveying track 5, compatibility between PCB finished products and PCB semi-finished products is achieved; by providing a finished product flipping mechanism 9, it can be flexibly adjusted according to customer needs, such as whether flipping boards is required, etc., to meet diverse production needs.

[0078] See also Figure 1 , Figure 2 In one embodiment, the PCB dismantling and transplanting mechanism 10 includes a first PCB dismantling and transplanting robot 101 and a second PCB dismantling and transplanting robot 102. The first PCB dismantling and transplanting robot 101 and the second PCB dismantling and transplanting robot 102 are both mounted on the frame 1, and the second PCB dismantling and transplanting robot 102 is symmetrically arranged with the first PCB dismantling and transplanting robot 101. The first PCB dismantling and transplanting robot 101 is used to implant the PCB light board supplied by the light board feeding mechanism 2 into the A-side carrier located at the semi-finished product dismantling station, and to transport the finished PCB board located at the finished product flipping station to the finished product output mechanism 3; the second PCB dismantling and transplanting robot 102 is used to implant the semi-finished PCB board located at the semi-finished product flipping station into the B-side carrier located at the finished product dismantling station, and to transport the finished PCB board in the B-side carrier located at the finished product dismantling station to the finished product output mechanism 3.

[0079] The above-mentioned PCB dismantling and transplanting mechanism 10 can process different processes at the same time through the coordinated work of the first PCB dismantling and transplanting robot 101 and the second PCB dismantling and transplanting robot 102. For example, when the first PCB dismantling and transplanting robot 101 is implanting the PCB bare board into the A-side carrier, the second PCB dismantling and transplanting robot 102 can simultaneously take out the finished PCB board from the B-side carrier or implant the semi-finished PCB board. This parallel operation significantly improves the overall efficiency of the production line; in addition, the symmetrically arranged first PCB dismantling and transplanting robot 101 and the second PCB dismantling and transplanting robot 102 can be responsible for different areas on the production line respectively, making the work process clearer and orderly, and reducing interference and waiting time between robots.

[0080] It should be noted that, since the first PCB dismantling and transplanting robot 101 and the second PCB dismantling and transplanting robot 102 are prior arts, the present invention will not describe their specific structures and working principles in detail.

[0081] See also Figure 2 In one embodiment, the frame 1 is further provided with a first lower visual positioning camera 13 and a second lower visual positioning camera 14 for taking photos upwards. The first lower visual positioning camera 13 is located below the moving path of the first PCB dismantling and transplanting robot 101, and the second lower visual positioning camera 14 is located below the moving path of the second PCB dismantling and transplanting robot 102. The first lower visual positioning camera 13 and the second lower visual positioning camera 14 can take photos of the PCB boards sucked by the first PCB dismantling and transplanting robot 101 and the second PCB dismantling and transplanting robot 102 from below, so as to perform software correction on the positions of the PCB boards sucked by the first PCB dismantling and transplanting robot 101 and the second PCB dismantling and transplanting robot 102, so as to improve the accuracy of dismantling.

[0082] See also Figure 1 , Figure 2 In one embodiment, the carrier collection mechanism 11 includes an A-side carrier collection mechanism 111 and a B-side carrier collection mechanism 112, both of which are mounted on the frame 1, and the B-side carrier collection mechanism 112 is arranged side by side with the A-side carrier collection mechanism 111. The carrier transplanting mechanism 12 includes an A-side carrier transplanting mechanism 121 and a B-side carrier transplanting mechanism 122, both of which are mounted on the frame 1, and the B-side carrier transplanting mechanism 122 is arranged symmetrically with the A-side carrier transplanting mechanism 121. Among them, the A-side carrier collection mechanism 111 is used to collect empty A-side carriers; the B-side carrier collection mechanism 112 is used to collect empty B-side carriers; the A-side carrier transplanting mechanism 121 is used to transport the empty A-side carriers located at the semi-finished product dismantling station to the A-side carrier collection mechanism 111; the B-side carrier transplanting mechanism 122 is used to transport the empty B-side carriers located at the finished product dismantling station to the B-side carrier collection mechanism 112.

[0083] The above-mentioned carrier collection mechanism 11 can collect the A-side carriers and the B-side carriers separately through the A-side carrier collection mechanism 111 and the B-side carrier collection mechanism 112 to avoid confusion and ensure that each carrier can be properly managed and used. The carrier collection mechanism 11 ensures that the transplanting process of each carrier can be accurately controlled separately through the A-side carrier collection mechanism 111 and the B-side carrier collection mechanism 112, ensuring that each carrier can be accurately and quickly transported to the designated location, and can avoid interference and waiting between different carriers, thereby improving the efficiency of the transplanting process and reducing errors caused by confusion.

[0084] It should be noted that, since the A-side carrier transplanting mechanism 121 and the B-side carrier transplanting mechanism 122 are prior arts, the present invention will not describe their specific structures and working principles in detail.

[0085] See also Figure 3 In one embodiment, the light board loading mechanism 2 includes a first lifting module 21, and a first lifting platform 22 for placing a light board box is provided at the lifting end of the first lifting module 21, and the light board box is used to stack PCB light boards. The light board loading mechanism 2 set above can realize a large number of PCB light boards at one time by cooperating with the light board box, which greatly improves the loading speed and does not need frequent loading.

[0086] See also Figure 1 , Figure 2 , Figure 4 , Figure 5 In one embodiment, the light plate feeding mechanism 2 is located below the output end of the finished product output mechanism 3; the finished product output mechanism 3 includes a cylinder driving mechanism 51, a primary movable plate 52, a secondary movable plate 53, a transmission belt 54 and a finished product output track 55. The cylinder driving mechanism 51 is fixed on the frame 1, and the driving end of the cylinder driving mechanism 51 is connected to one side of the primary movable plate 52. The bottom of the primary movable plate 52 is slidably connected to the frame 1 through a first linear slide rail 56, and the bottom of the secondary movable plate 53 is slidably connected to the top of the primary movable plate 52 through a second linear slide rail 57. The transmission belt 54 is arranged on the other side of the primary movable plate 52, and the lower side of the transmission belt 54 is connected to the frame 1 through a first connecting member 58, and the upper side of the transmission belt 54 is connected to the secondary movable plate 53 through a second connecting member 59. The finished product output track 55 is arranged on the secondary movable plate 53, and the output end of the finished product output track 55 is connected to the lower machine. The finished product output track 55 is used to transport the finished PCB board. The cylinder drive mechanism 51 can drive the finished product output track 55 to move back and forth along the driving direction through the transmission of the primary moving plate 52, the secondary moving plate 53 and the transmission belt 54, so that the finished product output track 55 can smoothly receive the finished PCB board delivered by the first PCB removal and transplantation robot 101 or the second PCB removal and transplantation robot 102, and can be connected with the lower machine through the light board feeding mechanism 2 to output the finished PCB board to the lower machine. The finished product output mechanism 3 with the above-mentioned structure effectively utilizes the space, reduces the equipment footprint, and makes the entire production line more compact and efficient.

[0087] See also Figure 6In one embodiment, the A-side carrier collection mechanism 111 includes a second lifting module 1111, and the lifting end of the second lifting module 1111 is provided with a second lifting platform 1112 for stacking and storing the A-side carriers, and the two adjacent sides of the outer periphery of the second lifting platform 1112 are provided with anti-falling positioning panels 1113. The A-side carrier collection mechanism 111 set above can realize the temporary storage of a large number of A-side carriers at one time through the cooperation of the second lifting module 1111, the second lifting platform 1112 and the anti-falling positioning panels 1113, which significantly improves the storage efficiency of the production line and reduces the time cost of frequent replacement and movement of carriers; the setting of the anti-falling positioning panels 1113 effectively prevents the A-side carriers from tipping over and misaligning during the stacking and storage process, and improves the storage stability. In addition, the anti-falling positioning panels 1113 not only play a protective role, but also guide the A-side carriers to be arranged neatly through its structural design, reducing operational errors and safety hazards caused by the confusion of carriers.

[0088] Furthermore, the tops of two adjacent anti-falling positioning panels 1113 are each provided with a vehicle regularization component 1114 for regularizing the position of the A-side vehicle. The vehicle regularization component 1114 includes a linear drive module 11141 and a vehicle regularization plate 11142. The linear drive module 11141 is fixed to the top of the corresponding anti-falling positioning panel 1113. The driving end of the linear drive module 11141 is connected to the vehicle regularization plate 11142. The linear drive module 11141 is used to drive the vehicle regularization plate 11142 to move along the direction of the adjacent anti-falling positioning panels 1113. The vehicle regularization component 1114 set up as above can adjust the moving range and strength of the vehicle regularization plate 11142 according to actual needs, ensuring that A-side vehicles of different sizes and weights can be properly regularized.

[0089] It should be noted that, since the structure of the B-side carrier collection mechanism 112 is the same as that of the A-side carrier collection mechanism 111 , the present invention will not elaborate on the specific structure and working principle of the B-side carrier collection mechanism 112 .

[0090] See also Figure 7In one embodiment, the semi-finished product turning mechanism 8 includes a first lifting mechanism 81 and a turning mechanism 82. The first lifting mechanism 81 is fixed on the frame 1. The turning mechanism 82 is connected to the lifting end of the first lifting mechanism 81. The turning end of the turning mechanism 82 is provided with a turning arm 821. The turning arm 821 is provided with a vacuum suction cup 822 for sucking the semi-finished PCB board. In order to prevent the semi-finished PCB board from being damaged during turning, the semi-finished product turning mechanism 8 first lifts the turning mechanism 82 for a distance through the first lifting mechanism 81, and the turning mechanism 82 then drives the turning arm 821 to turn, and then sucks the semi-finished PCB board through the vacuum suction cup 822, so as to eliminate the angle between the semi-finished PCB board and the semi-finished product conveying track 4 during turning, and avoid the semi-finished PCB board from colliding with the semi-finished product conveying track 4 during turning.

[0091] It should be noted that, since the finished product turning mechanism 9 and the semi-finished product turning mechanism 8 have the same structure, the present invention will not describe the specific structure and working principle of the finished product turning mechanism 9 in detail.

[0092] See also Figure 8 In one embodiment, the unlocking and positioning mechanism 6 of the A-surface carrier includes a second lifting mechanism 61 fixed on the frame 1, a positioning base plate 62 arranged at the lifting end of the second lifting mechanism 61, and four unlocking cylinders 63 arranged transversely at the four corners of the bottom of the positioning base plate 62, and the telescopic ends of the four unlocking cylinders 63 are provided with pins 64 for positioning and unlocking the A-surface carrier. When the A-surface carrier is transported to the semi-finished product removal and transplantation station, the second lifting mechanism 61 drives the positioning base plate 62 to rise; this rising action enables the positioning base plate 62 to lift the A-surface carrier, and accurately positions the A-surface carrier through the pins 64 arranged at the telescopic ends of the unlocking cylinders 63; once the A-surface carrier is firmly positioned, the four unlocking cylinders 63 will start to work, driving their respective pins 64 to move outward, and the locking state of the spring member on the A-surface carrier can be released through the outward movement of the four pins 64; in addition, the PCB removal and transplantation mechanism 10 can smoothly put the PCB board into the A-surface carrier, or take the PCB board out of the A-surface carrier. The above-mentioned A-side carrier unlocking and positioning mechanism 6, through its sophisticated design and efficient operation process, not only improves production efficiency, but also ensures accuracy and stability of operation.

[0093] It should be noted that, since the B-side carrier unlocking and positioning mechanism 7 and the A-side carrier unlocking and positioning mechanism 6 have the same structure, the present invention will not elaborate on the specific structure and working principle of the B-side carrier unlocking and positioning mechanism 7.

[0094] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the appended claims of the present invention.

[0095] The above is an exemplary description of the present invention in conjunction with the accompanying drawings. It is obvious that the implementation of the present invention is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.

Claims

1. A fully automatic board removal machine, characterized in that: include: frame; A bare board feeding mechanism, installed on the frame, for feeding a bare PCB board; A finished product output mechanism, installed on the frame, for outputting finished PCB boards; A semi-finished product conveying track is installed on the frame, and is used to receive an empty A-side carrier or a carrier loaded with a semi-finished PCB board, and convey the A-side carrier to the semi-finished product removal station, and output an A-side carrier loaded with a bare PCB board; A finished product conveying track is installed on the frame, and is used to receive an empty B-side carrier or a carrier loaded with a finished PCB board, and convey the B-side carrier to a finished product removal station, and output a B-side carrier loaded with a semi-finished PCB product; A semi-finished product turning mechanism is installed on the frame and is used to transport the semi-finished PCB board located at the semi-finished product removal station to the semi-finished product turning station and turn it 180°; A PCB removal and transplanting mechanism is installed on the frame, and is used to implant the PCB bare board supplied by the bare board feeding mechanism into the A-side carrier located at the semi-finished product removal and transplanting station, implant the semi-finished PCB board located at the semi-finished product flipping station into the B-side carrier located at the finished product removal and transplanting station, and transport the finished PCB board in the B-side carrier located at the finished product removal and transplanting station to the finished product output mechanism; A carrier collection mechanism, mounted on the frame, for collecting empty A-side carriers and B-side carriers; The carrier transplanting mechanism is installed on the frame and is used to transport the A-side carrier located at the empty semi-finished product removal and implantation station and the B-side carrier located at the empty finished product removal and implantation station to the carrier collecting mechanism.

2. The fully automatic board removal machine according to claim 1 is characterized in that: Also includes: A finished product flipping mechanism is installed on the frame and is used to transport the finished PCB board located at the finished product removal station to the finished product flipping station and flip it 180 degrees according to demand; The PCB dismantling and transplanting mechanism is also used to transport the finished PCB board located at the finished product turning station to the finished product output mechanism.

3. The fully automatic board removal machine according to claim 2 is characterized in that: The PCB removal and transplantation mechanism comprises: A first PCB removal and transplanting robot is installed on the frame and is used to supply the PCB light board from the light board feeding mechanism to the A-side carrier located at the semi-finished product removal station, and to transport the finished PCB board located at the finished product flipping station to the finished product output mechanism; The second PCB removal and transplanting robot is installed on the frame and is symmetrically arranged with the first PCB removal and transplanting robot, and is used to implant the semi-finished PCB board located at the semi-finished product flipping station into the B-side carrier located at the finished product removal station, and to transport the finished PCB board in the B-side carrier located at the finished product removal station to the finished product output mechanism.

4. The fully automatic board removal machine according to claim 1 is characterized in that: The bare board loading mechanism comprises a first lifting module, a lifting end of which is provided with a first lifting platform for placing a bare board box, and the bare board box is used for stacking PCB bare boards.

5. The fully automatic board removal machine according to claim 1 is characterized in that: The light plate feeding mechanism is located below the output end of the finished product output mechanism; The finished product output mechanism includes a cylinder driving mechanism, a primary movable plate, a secondary movable plate, a transmission belt and a finished product output track. The cylinder driving mechanism is fixed on the frame, and the driving end of the cylinder driving mechanism is connected to one side of the primary movable plate. The bottom of the primary movable plate is slidably connected to the frame through a first linear slide rail, and the bottom of the secondary movable plate is slidably connected to the top of the primary movable plate through a second linear slide rail. The transmission belt is arranged on the other side of the primary movable plate, and the lower side of the transmission belt is connected to the frame through a first connecting member, and the upper side of the transmission belt is connected to the secondary movable plate through a second connecting member. The finished product output track is arranged on the secondary movable plate, and the output end of the finished product output track is connected to the lower machine.

6. The fully automatic board removal machine according to claim 1 is characterized in that: The carrier collection mechanism comprises: A-side carrier collection mechanism, mounted on the frame, for collecting empty A-side carriers; A B-side carrier collection mechanism, mounted on the frame and arranged side by side with the A-side carrier collection mechanism, for collecting empty B-side carriers; The carrier transplanting mechanism comprises: A surface carrier transplanting mechanism, installed on the frame, used to transport the surface A carrier located at the semi-finished product removal station to the surface A carrier collecting mechanism; The B-side carrier transplanting mechanism is installed on the frame and symmetrically arranged with the A-side carrier transplanting mechanism, and is used for transporting the B-side carrier located at the finished product removal station to the B-side carrier collecting mechanism.

7. The fully automatic board removal machine according to claim 6 is characterized in that: The A-side carrier collection mechanism and the B-side carrier collection mechanism have the same structure; The A-side carrier collection mechanism includes a second lifting module, and a second lifting platform for stacking and storing A-side carriers is provided at the lifting end of the second lifting module. Anti-falling positioning panels are provided on two adjacent sides of the outer periphery of the second lifting platform, and vehicle tidying components for tidying the positions of A-side carriers are provided on the tops of two adjacent anti-falling positioning panels.

8. The fully automatic board removal machine according to claim 1 is characterized in that: The semi-finished product turning mechanism includes a first lifting mechanism and a turning mechanism, the first lifting mechanism is fixed on the frame, the turning mechanism is connected to the lifting end of the first lifting mechanism, a turning arm is arranged at the turning end of the turning mechanism, and a vacuum suction cup for sucking the semi-finished PCB board is arranged on the turning arm.

9. The fully automatic board removal machine according to claim 1, characterized in that: Also includes: A surface carrier unlocking and positioning mechanism, installed on the semi-finished product dismantling station, used for positioning and unlocking the surface A carrier transported to the semi-finished product dismantling station; The B-side carrier unlocking and positioning mechanism is installed on the finished product removal and implantation station and is used to position and unlock the B-side carrier transported to the finished product removal and implantation station.

10. The fully automatic board removal machine according to claim 9, characterized in that: The A-side carrier unlocking and positioning mechanism and the B-side carrier unlocking and positioning mechanism have the same structure; The A-side carrier unlocking and positioning mechanism includes a second lifting mechanism fixed on the frame, a positioning base plate arranged at the lifting end of the second lifting mechanism, and four unlocking cylinders respectively arranged laterally at the four corners of the bottom of the positioning base plate, and the telescopic ends of the four unlocking cylinders are provided with pins for positioning and unlocking the A-side carrier.

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