Solder paste smearing device for vapor chamber radiator

Abstract

The invention discloses a uniform temperature plate radiator solder paste smearing device, and relates to the field of uniform temperature plate radiator manufacturing, the uniform temperature plate radiator solder paste smearing device comprises an equipment base, a clamp positioning table and a heat dissipation structure, the top of the clamp positioning table is movably provided with a radiator clamp, and the heat dissipation structure is installed in the radiator clamp; a plurality of sets of heat dissipation fins are installed on the inner side face of the heat dissipation structure, a double-three-axis driving device and a single-three-axis driving device are arranged on the top of the equipment base, and tin plating devices are installed on the side faces of the double-three-axis driving device and the single-three-axis driving device. The first solder paste smearing mechanism is arranged, the radiator clamp is used for fixing and clamping the heat pipe, the uniform temperature plate and the multiple sets of heat dissipation fins, and then the multiple sets of heat dissipation fins and the pouring grooves between the heat pipe are overlapped, so that the first solder paste smearing mechanism can extend into the pouring grooves through a long and thin first needle tube; solder paste smearing is carried out on the multiple heat dissipation fins at the same time, the solder paste smearing efficiency can be improved, and therefore the production efficiency of products is improved.

Description

Technical Field

[0001] The invention relates to the field of manufacturing a temperature-averaging plate radiator, and in particular to a solder paste coating device for a temperature-averaging plate radiator. Background Art

[0002] Vapor chamber heat sink, sometimes also called planar heat pipe or vapor chamber heat sink, adopts two-phase cooling in a flat plate format and has high heat transfer capability. It is mostly used for cooling electronic products. Currently, the most widely used is 3DVC, which is the structure of vapor chamber VC + heat pipe + cooling fins.

[0003] Among them, the more typical one is the air-cooled radiator structure. The notable feature of this heat dissipation structure is that multiple groups of heat pipes are arranged on the top of the temperature equalizer body, and the inner cavity of the temperature equalizer body and the internal cavity of the heat pipe are connected, and the capillary structure is also connected. Because the cavities are connected, steam can directly enter the interior of the heat pipe to realize heat transfer, and the heat transfer efficiency will be higher. In addition, multiple groups of cooling fins are installed on the outside of the multiple groups of heat pipes. The cooling fins are in contact with the air, so that the heat of the heat pipes is transferred to the cooling fins, and the cooling fins transfer the heat to the air.

[0004] The connection between multiple groups of cooling fins and heat pipes is usually carried out by applying solder paste and then hot-welding. The staff will fit the temperature equalizing board into a special fixture. The temperature equalizing board here comes with multiple groups of one-piece heat pipes. Then the staff will evenly apply solder paste to the connection between the cooling fins and the heat pipes, and then assemble the cooling fins and heat pipes coated with solder paste. Finally, the entire fixture is placed in a hot air tunnel furnace for baking. The high temperature will melt the solder paste and connect the cooling fins and heat pipes together. Usually, a 3DVC product has more cooling fins, and solder paste needs to be applied to the connection between each group of cooling fins and heat pipes, which makes the overall processing efficiency of the product relatively slow. Summary of the invention

[0005] Based on this, the purpose of the present invention is to provide a solder paste coating device for a temperature vapor chamber heat sink to solve the technical problems mentioned in the above background.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a temperature equalizing plate radiator solder paste coating device, comprising an equipment base, a fixture positioning platform and a heat dissipation structure, a double-speed chain group conveying system for transporting the fixture positioning platform is arranged on one side of the equipment base, and a radiator fixture is movably installed on the top of the fixture positioning platform, a heat dissipation structure is installed inside the radiator fixture, and a plurality of heat dissipation fins are installed on the inner side of the heat dissipation structure, a dual three-axis drive device and a single three-axis drive device are arranged on the top of the equipment base, and a tin coating device is installed on the sides of the dual three-axis drive device and the single three-axis drive device, and the tin coating device is used to coat solder paste on the heat dissipation structure and the heat dissipation fins.

[0007] By adopting the above technical solution, a first solder paste applying mechanism is set up, and a radiator clamp is used to fix and clamp the heat pipe, the temperature equalizing plate and multiple groups of cooling fins, so that the filling grooves between the multiple groups of cooling fins and the heat pipes overlap. In this way, the first solder paste applying mechanism can use a slender first needle tube to extend into the filling groove and apply solder paste to multiple cooling fins at the same time, which can speed up the efficiency of solder paste application and thus improve the production efficiency of the product.

[0008] The present invention is further configured such that the tin coating device is a first solder paste coating mechanism, and the first solder paste coating mechanism includes a first supporting plate, and a first solder paste tube is installed on the side of the first supporting plate by setting a second supporting plate, and a first tin filling device is installed on the side of the first supporting plate, and a first needle tube is connected to the end of the first tin filling device.

[0009] Preferably, a first tin filling device is provided to extract the tin paste from the first tin paste cylinder, and then the tin paste is poured into the filling tank through the first needle tube.

[0010] The present invention is further configured such that a plurality of first sliding blocks are provided on the side of the first supporting plate, and a first sliding rail is movably installed in the first sliding block, a first limiting block is provided at one end of the first sliding rail, and a first protective plate is provided at the other end of the first sliding rail, and a first spring is sleeved on the outside of the first sliding rail, a first circular hole is opened on the side of the first protective plate, and the first circular hole matches the first needle tube.

[0011] Preferably, a movable first protective plate is provided to protect the first needle tube, thereby reducing the risk of deformation due to stress.

[0012] The present invention is further configured such that the heat dissipation structure includes a temperature averaging plate, and a plurality of groups of connecting columns are arranged on the side of the temperature averaging plate, and a plurality of groups of heat pipes are arranged on the side of the temperature averaging plate.

[0013] Preferably, a 3DVC heat sink is formed by providing a heat dissipation structure and installing heat dissipation fins, and then reflow soldering.

[0014] The present invention is further configured such that a plurality of groups of heat pipes and heat dissipation fins are movably interlaced with each other, and a perfusion groove is provided on the side of the heat dissipation fins where each group of heat pipes is bonded, and a plurality of groups of perfusion holes are provided on the side of the radiator clamp, and the positions of the plurality of groups of perfusion holes and the plurality of groups of perfusion grooves correspond to each other.

[0015] Preferably, by opening a filling groove on the heat sink fins, when multiple groups of heat sink fins are stacked and sleeved on the heat pipe, the filling grooves of the multiple groups of heat sink fins can form a filling channel, and then the first solder paste applying mechanism can fill solder paste on multiple heat sink fins at the same time.

[0016] The present invention is further configured such that the dual three-axis drive device includes a screw moving assembly installed on the top of the equipment base, and a first dual-axis drive assembly and a second dual-axis drive assembly are installed on the top of the screw moving assembly, and a first solder paste smearing mechanism is installed on the sides of the first dual-axis drive assembly and the second dual-axis drive assembly.

[0017] Preferably, a dual three-axis drive device is provided to drive two groups of first solder paste smearing mechanisms and is designed according to different products so that the equipment can either fill two groups of filling holes through the dual three-axis drive device or fill one group of filling holes through a single three-axis drive device, which helps to improve the filling efficiency for different products.

[0018] The present invention is further configured such that the tin coating device is a second solder paste coating mechanism, and the second solder paste coating mechanism includes a third supporting plate, and a second solder paste tube is installed on the side of the third supporting plate by arranging a fourth supporting plate, a second tin filling device is installed on the side of the third supporting plate, and the end of the second tin filling device is threadedly connected with a connecting sleeve, and the end of the connecting sleeve is connected with a second needle tube.

[0019] Preferably, by providing a second solder paste smearing mechanism, the second tin filling device can extract solder paste from the second solder paste cylinder and fill the solder paste into the filling slot position of the heat sink fin through the second needle tube.

[0020] The present invention is further configured such that a plurality of groups of second sliding blocks are provided on the side of the third supporting plate, and two groups of second sliding rails are movably installed in the plurality of second sliding blocks, a second limiting block is provided at one end of the two groups of second sliding rails, and a second protective plate is connected to the other end of the two groups of second sliding rails, and a second circular hole matching the second needle tube is provided on the side of the second protective plate, a connecting rod is provided on the side of the two groups of second limiting blocks, and a second spring is sleeved on the outside of the connecting rod, and the two groups of connecting rods and the third supporting plate are movably penetrated.

[0021] Preferably, the second needle tube can be protected by providing a second protective plate to reduce the risk of deformation due to stress.

[0022] The present invention is further configured such that a plurality of third protective plates are movably installed on the inner sides of the two groups of the second slide rails, and the plurality of third protective plates and the connecting sleeves are connected by setting a plurality of third springs, the third protective plates include two groups of third sliders, and the two groups of third sliders are movably installed corresponding to the two groups of second slide rails respectively, a connecting plate is arranged between the two groups of the third sliders, and a protective tube matching the second needle tube is arranged in the middle position of the connecting plate, and the protective tube and the second needle tube are movably arranged to penetrate each other.

[0023] Preferably, the second needle tube can be further protected by providing a plurality of sets of slidable third protection plates.

[0024] In summary, the present invention mainly has the following beneficial effects: 1. The present invention sets a first solder paste coating mechanism and uses a radiator clamp to fix and clamp the heat pipe, the temperature equalizing plate and multiple groups of heat dissipating fins, so that the filling grooves between the multiple groups of heat dissipating fins and the heat pipes overlap. In this way, the first solder paste coating mechanism can use a slender first needle tube to extend into the filling groove to simultaneously coat the multiple heat dissipating fins with solder paste, which can speed up the efficiency of solder paste coating and thus improve the production efficiency of the product.

[0025] 2. The present invention can protect the first needle tube by arranging a first protective plate to slide on the outside of the first needle tube. When the first solder paste smearing mechanism is working, the first needle tube is relatively slender in shape, and thus the first needle tube is easily deformed when extending into the inside of the perfusion tank. The first protective plate can slide on the outside of the first needle tube, limit and clamp the first needle tube, and reduce the risk of deformation of the first needle tube.

[0026] 3. The present invention provides a second solder paste smearing mechanism. When the second solder paste smearing mechanism is working, the protection effect for the second needle tube is better. The second solder paste smearing mechanism is not only provided with a second protective plate with the same function as the first protective plate, but also provided with multiple groups of third protective plates that can be linked. The third protective plate can protect a section of the needle tube between the second tin filling device and the second protective plate, further reducing the risk of deformation of the second needle tube. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the connection between the fixture positioning platform, the heat sink fixture, the heat dissipation structure and the heat dissipation fins of the present invention; Figure 3 It is a schematic diagram of the structure of the heat sink fixture of the present invention; Figure 4 It is a schematic diagram of the installation of the heat dissipation structure and heat dissipation fins of the present invention; Figure 5 It is a schematic structural diagram of the dual-three-axis driving device of the present invention; Figure 6 It is a schematic diagram of the structure of the single three-axis driving device of the present invention; Figure 7 This is a schematic structural diagram of a first solder paste coating mechanism of the present invention; Figure 8 It is a schematic diagram of the connection between the first sliding block, the first sliding rail and the first limiting block of the present invention; Fig. 9 It is a schematic structural diagram of a second solder paste applying mechanism of the present invention; Fig.10It is a schematic diagram of the connection between the second sliding block, the second sliding rail, the second limiting block and the third protective plate of the present invention; Fig.11 It is a schematic diagram of the structure of the third protective plate of the present invention.

[0028] Description of reference numerals: 1. Equipment base; 2. Fixture positioning table; 3. Radiator fixture; 4. Heat dissipation structure; 401. Temperature plate; 402. Connecting column; 403. Heat pipe; 5. Double three-axis drive device; 501. Screw moving assembly; 502. First double-axis drive assembly; 503. Second double-axis drive assembly; 6. Single three-axis drive device; 7. First solder paste smearing mechanism; 701. First bearing plate; 702. Second bearing plate; 703. First solder paste cylinder; 704. First tin filling device; 705. First needle tube; 706. First slider; 707. First slide rail; 708. First limit block; 709. First protective plate; 710. The first circular hole; 711, the first spring; 8, the second solder paste applying mechanism; 801, the third supporting plate; 802, the fourth supporting plate; 803, the second solder paste cylinder; 804, the second tin filling device; 805, the connecting sleeve; 806, the second needle tube; 807, the second slider; 808, the second slide rail; 809, the second limit block; 810, the second protective plate; 811, the second circular hole; 812, the connecting rod; 813, the second spring; 814, the third protective plate; 815, the third spring; 8141, the third slider; 8142, the connecting plate; 8143, the protective tube; 9, the filling hole; 10, the heat sink fin; 11, the filling tank. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0030] The following describes an embodiment of the present invention based on its overall structure. First embodiment:

[0031] See also Figure 1 - Figure 8A solder paste coating device for a heat spreader radiator comprises a device base 1, a fixture positioning platform 2 and a heat dissipation structure 4. A double-speed chain group conveying system for transporting the fixture positioning platform 2 is arranged on one side of the device base 1, and a heat dissipation fixture 3 is movably installed on the top of the fixture positioning platform 2. A heat dissipation structure 4 is installed inside the heat dissipation fixture 3, and a plurality of heat dissipation fins 10 are installed on the inner side of the heat dissipation structure 4. The heat dissipation fixture 3 can be used to smear the heat pipe 403, the heat spreader 401 and the plurality of heat dissipation fins 10 of the heat dissipation structure 4. Fixed and clamped, a dual three-axis drive device 5 and a single three-axis drive device 6 are arranged on the top of the equipment base 1, and a tin coating device is installed on the side of the dual three-axis drive device 5 and the single three-axis drive device 6. The tin coating device is used to apply solder paste to the heat dissipation structure 4 and the heat dissipation fins 10. The first solder paste coating mechanism 7 can use a slender first needle tube 705 to extend into the filling groove 11 of the heat dissipation fin 10, and solder paste can be applied to multiple heat dissipation fins 10 at the same time, which can speed up the efficiency of solder paste coating, thereby improving the production efficiency of the product.

[0032] In the above embodiments, please refer to Figure 7 and Figure 8 The tin coating device is a first solder paste coating mechanism 7, and the first solder paste coating mechanism 7 includes a first supporting plate 701, and a first solder paste tube 703 is installed on the side of the first supporting plate 701 by setting a second supporting plate 702, a first tin filling device 704 is installed on the side of the first supporting plate 701, and a first needle tube 705 is connected to the end of the first tin filling device 704, and the solder paste is extracted from the first solder paste tube 703 by setting the first tin filling device 704, and then the solder paste is poured into the filling tank 11 through the first needle tube 705.

[0033] In the above embodiments, please refer to Figure 7 and Figure 8 A plurality of first sliders 706 are arranged on the side of the first supporting plate 701, and a first slide rail 707 is movably installed in the first slider 706, a first limit block 708 is arranged at one end of the first slide rail 707, and a first protective plate 709 is arranged at the other end of the first slide rail 707, and a first spring 711 is sleeved on the outside of the first slide rail 707, a first circular hole 710 is opened on the side of the first protective plate 709, and the first circular hole 710 matches the first needle tube 705. By setting a movable first protective plate 709, the first needle tube 705 can be protected to reduce the risk of deformation due to force.

[0034] In the above embodiments, please refer to Figure 4 The heat dissipation structure 4 includes a temperature averaging plate 401, and a plurality of connecting columns 402 are arranged on the side of the temperature averaging plate 401, and a plurality of heat pipes 403 are arranged on the side of the temperature averaging plate 401. The heat dissipation structure 4 and the heat dissipation fins 10 are installed and then re-furnace-welded to form a 3DVC radiator.

[0035] In the above embodiments, please refer to Figure 3 and Figure 4 A plurality of heat pipes 403 and heat sink fins 10 are movably connected and arranged therebetween, and a perfusion groove 11 is provided on the side of the heat sink fins 10 and at the joint of each group of heat pipes 403. A plurality of perfusion holes 9 are provided on the side of the radiator clamp 3, and the positions of the plurality of perfusion holes 9 and the plurality of perfusion grooves 11 correspond to each other. By providing perfusion grooves 11 on the heat sink fins 10, when a plurality of heat sink fins 10 are stacked and sleeved on the heat pipes 403, the perfusion grooves 11 of the plurality of heat sink fins 10 can form a perfusion channel, and the first solder paste applying mechanism 7 can simultaneously perfuse solder paste to a plurality of heat sink fins 10.

[0036] In the above embodiments, please refer to Figure 5 The dual three-axis driving device 5 includes a screw moving assembly 501 installed on the top of the equipment base 1, and a first dual-axis driving assembly 502 and a second dual-axis driving assembly 503 are installed on the top of the screw moving assembly 501, and the sides of the first dual-axis driving assembly 502 and the second dual-axis driving assembly 503 are both installed with a first solder paste smearing mechanism 7. The dual three-axis driving device 5 is arranged to drive two groups of first solder paste smearing mechanisms 7, and is designed according to different products, so that the equipment can not only irrigate two groups of irrigating holes 9 through the dual three-axis driving device 5, but also irrigate one group of irrigating holes 9 through the single three-axis driving device 6, which helps to improve the irrigating efficiency for different products. Second embodiment:

[0037] See also Fig.10 - Fig.11The tin coating device is a second solder paste coating mechanism 8, and the second solder paste coating mechanism 8 includes a third carrier plate 801, and a second solder paste cylinder 803 is installed on the side of the third carrier plate 801 by setting a fourth carrier plate 802, and a second tin filling device 804 is installed on the side of the third carrier plate 801, and the end of the second tin filling device 804 is threadedly connected with a connecting sleeve 805, and the end of the connecting sleeve 805 is connected with a second needle tube 806. By setting the second solder paste coating mechanism 8, the second tin filling device 804 can be drawn from the second solder paste cylinder 803. Take solder paste, and inject the solder paste through the second needle tube 806 to the injection groove 11 position of the heat sink 10. A plurality of second sliders 807 are arranged on the side of the third carrier plate 801, and two second slide rails 808 are movably installed in the plurality of second sliders 807. One end of the two second slide rails 808 is provided with a second limit block 809, and the other end of the two second slide rails 808 is connected to a second protective plate 810, and a second circular hole 811 matching the second needle tube 806 is provided on the side of the second protective plate 810. By setting the second protective plate 810, In order to protect the second needle tube 806 and reduce the risk of its deformation under stress, the sides of the two groups of second limit blocks 809 are provided with connecting rods 812, and the outer sleeve of the connecting rods 812 is provided with a second spring 813, and the two groups of connecting rods 812 and the third bearing plate 801 are movably arranged through, and the inner sides of the two groups of second slide rails 808 are movably installed with multiple groups of third protective plates 814, and the multiple groups of third protective plates 814 and the connecting sleeve 805 are connected by setting multiple groups of third springs 815, and the third protective plate 814 includes two groups of third sliders 8141, and the two groups of third The sliders 8141 are movably installed corresponding to the two groups of second slide rails 808 respectively, a connecting plate 8142 is arranged between the two groups of third sliders 8141, and a protective tube 8143 matching the second needle tube 806 is arranged in the middle position of the connecting plate 8142, and the protective tube 8143 and the second needle tube 806 are movably penetrated, and a plurality of groups of interlockable third protective plates 814 are arranged, and the third protective plate 814 can protect a section of the needle tube between the second tin-filling device 804 and the second protective plate 810, thereby further reducing the risk of deformation of the second needle tube 806.

[0038] During specific operation of the present invention: for the first embodiment, during operation, the staff opens the radiator clamp 3, engages the heat dissipation structure 4 into the radiator clamp 3, and then sets multiple groups of heat dissipation fins 10 on the heat pipes 403 of the heat dissipation structure 4, and then closes the radiator clamp 3. Finally, the staff places the radiator clamp 3 on the clamp positioning table 2 of the double-speed chain conveying system.

[0039] The double-speed chain group conveying system drives the fixture positioning platform 2 and the radiator fixture 3 on the top thereof to move to one side of the dual three-axis drive device 5 or one side of the single three-axis drive device 6. If there are two pouring grooves 11 at the same height, the fixture positioning platform 2 and the radiator fixture 3 will stop at one side of the dual three-axis drive device 5. If there is only one pouring hole 9 at the same height, the fixture positioning platform 2 and the radiator fixture 3 will stop at one side of the single three-axis drive device 6.

[0040] For example: the double-speed chain group conveying system drives the fixture positioning table 2 and the radiator fixture 3 on its top to move to one side of the single three-axis drive device 6 and stop, and the single three-axis drive device 6 is started to adjust the position of the first solder paste smearing mechanism 7, so that the first circular hole 710 of the first protective plate 709 is aligned with the injection hole 9 of the radiator fixture 3, and then the single three-axis drive device 6 works to push the first solder paste smearing mechanism 7 to approach the radiator fixture 3. As the position of the first solder paste smearing mechanism 7 moves, the first protective plate 709 fits the outer wall of the radiator fixture 3, and then the radiator fixture 3 will limit the movement of the first protective plate 709, so that the first protective plate 709 drives the first slide rail 707 to slide inside the first slider 706, and at the same time, the first protective plate 709 will compress the first spring 711, and the first supporting plate 701 drives the second supporting plate 702, the first solder paste cylinder 703, the first tin injection device 704 and the first needle tube 705 continues to move, and then the first needle tube 705 passes through the first circular hole 710 of the first protective plate 709 into the injection hole 9. As the first needle tube 705 continues to go deeper, the first needle tube 705 will extend into the deepest part of the injection grooves 11 of the multiple groups of heat sink fins 10, and then the first tin injection device 704 is started. The first tin injection device 704 extracts the solder paste in the first solder paste tube 703 and ejects it from the first needle tube 705. At the same time, the single three-axis drive device 6 drives the first solder paste coating mechanism 7 to retreat, and the first protective plate 709 will also be reset under the reset action of the first spring 711, and then the solder paste will fill the injection grooves 11 of the multiple overlapping heat sink fins 10. After the above steps, the multiple injection grooves 11 of the heat sink fins 10 are all coated with solder paste. After the coating is completed, the staff will put the radiator fixture 3 together with the internal heat dissipation structure 4 and the heat sink fins 10 into the hot air tunnel furnace for welding.

[0041] For the second embodiment, on the basis of the first embodiment, the first solder paste coating mechanism 7 installed on the side of the dual three-axis drive device 5 and the single three-axis drive device 6 is replaced with a second solder paste coating mechanism 8. When the second solder paste coating mechanism 8 is working, the single three-axis drive device 6 is started to adjust the position of the second solder paste coating mechanism 8 so that the second circular hole 811 of the second protective plate 810 is aligned with the injection hole 9 of the radiator clamp 3, and then the single three-axis drive device 6 drives the second solder paste coating mechanism 8 to continue to approach the radiator clamp 3. After the second protective plate 810 is attached to the outer wall of the radiator clamp 3, the radiator clamp 3 will limit the movement of the second protective plate 810, and then the second protective plate 810 drives the two sets of second slide rails 808 to slide inside the second slider 807, and at the same time the second spring 813 will be compressed, and the third supporting plate 801 drives the second tinning device 804 and the second The needle tube 806 continues to move, and then the second needle tube 806 will pass through the second circular hole 811 and enter the perfusion hole 9. The multiple groups of third protective plates 814 will also move with the second needle tube 806 under the pushing action of the third spring 815 until a group of third protective plates 814 close to the second protective plate 810 fits with it. The connecting sleeve 805 continues to move, so that the multiple groups of third springs 815 are compressed, and then the distance between the multiple groups of third protective plates 814 is shortened, and the second needle tube 806 will continue to extend into the deepest part of the perfusion groove 11. Under the action of the third spring 815, the multiple groups of third protective plates 814 are evenly distributed on the outside of the second needle tube 806. The multiple groups of third protective plates 814 can better protect the second needle tube 806. The second needle tube 806 works in the same way as the first needle tube 705 to perfuse solder paste into the interior of the perfusion groove 11.

[0042] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A solder paste coating device for a temperature-homing plate heat sink, comprising a device base (1), a fixture positioning platform (2) and a heat dissipation structure (4), characterized in that: A double-speed chain group conveying system for transporting the fixture positioning platform (2) is arranged on one side of the equipment base (1), and a heat sink fixture (3) is movably installed on the top of the fixture positioning platform (2), a heat dissipation structure (4) is installed inside the heat sink fixture (3), and a plurality of heat dissipation fins (10) are installed on the inner side of the heat dissipation structure (4), a dual three-axis drive device (5) and a single three-axis drive device (6) are arranged on the top of the equipment base (1), and a tinning device is installed on the side of the dual three-axis drive device (5) and the single three-axis drive device (6), and the tinning device is used to apply solder paste to the heat dissipation structure (4) and the heat dissipation fins (10).

2. The solder paste coating device for a heat spreader according to claim 1, characterized in that: The tin coating device is a first solder paste coating mechanism (7), and the first solder paste coating mechanism (7) comprises a first carrier plate (701), and a first solder paste cylinder (703) is installed on the side of the first carrier plate (701) by arranging a second carrier plate (702), and a first tin pouring device (704) is installed on the side of the first carrier plate (701), and the end of the first tin pouring device (704) is connected to a first needle tube (705).

3. The solder paste coating device for a heat spreader according to claim 2, characterized in that: A plurality of first sliding blocks (706) are arranged on the side of the first supporting plate (701), and a first sliding rail (707) is movably installed in the first sliding block (706), a first limiting block (708) is arranged at one end of the first sliding rail (707), and a first protective plate (709) is arranged at the other end of the first sliding rail (707), and a first spring (711) is sleeved on the outside of the first sliding rail (707), and a first circular hole (710) is opened on the side of the first protective plate (709), and the first circular hole (710) matches the first needle tube (705).

4. The solder paste coating device for a heat spreader according to claim 3, characterized in that: The heat dissipation structure (4) comprises a temperature averaging plate (401), and a plurality of groups of connecting columns (402) are arranged on the side of the temperature averaging plate (401), and a plurality of groups of heat pipes (403) are arranged on the side of the temperature averaging plate (401).

5. The solder paste coating device for a heat spreader according to claim 4, characterized in that: The plurality of groups of heat pipes (403) and the heat dissipation fins (10) are movably interlaced with each other, and a pouring groove (11) is provided on the side of the heat dissipation fins (10) where each group of heat pipes (403) is in contact with each other. The side of the heat sink fixture (3) is provided with a plurality of groups of pouring holes (9), and the positions of the plurality of groups of pouring holes (9) and the plurality of groups of pouring grooves (11) correspond to each other.

6. The solder paste coating device for a heat spreader according to claim 5, characterized in that: The dual-three-axis drive device (5) comprises a screw moving assembly (501) installed on the top of the equipment base (1), and a first dual-axis drive assembly (502) and a second dual-axis drive assembly (503) are installed on the top of the screw moving assembly (501), and a first solder paste smearing mechanism (7) is installed on the side surfaces of the first dual-axis drive assembly (502) and the second dual-axis drive assembly (503).

7. The solder paste coating device for a heat spreader according to claim 6, characterized in that: The tin coating device is a second solder paste coating mechanism (8), and the second solder paste coating mechanism (8) comprises a third carrier plate (801), and a second solder paste cylinder (803) is installed on the side of the third carrier plate (801) by arranging a fourth carrier plate (802), a second tin pouring device (804) is installed on the side of the third carrier plate (801), and the end of the second tin pouring device (804) is threadedly connected to a connecting sleeve (805), and the end of the connecting sleeve (805) is connected to a second needle tube (806).

8. The solder paste coating device for a heat spreader according to claim 7, characterized in that: A plurality of groups of second sliding blocks (807) are arranged on the side of the third supporting plate (801), and two groups of second slide rails (808) are movably installed in the plurality of second sliding blocks (807), one end of the two groups of second slide rails (808) are arranged with a second limiting block (809), and the other end of the two groups of second slide rails (808) are connected with a second protective plate (810), and a second circular hole (811) matching the second needle tube (806) is provided on the side of the second protective plate (810), and a connecting rod (812) is arranged on the outside of the connecting rod (812), and a second spring (813) is sleeved on the outside of the connecting rod (812), and the two groups of connecting rods (812) and the third supporting plate (801) are movably interwoven.

9. The solder paste coating device for a temperature homogenizing plate heat sink according to claim 8, characterized in that: A plurality of third protective plates (814) are movably mounted on the inner sides of the two groups of the second slide rails (808), and the plurality of third protective plates (814) and the connecting sleeve (805) are connected by arranging a plurality of third springs (815); the third protective plates (814) include two groups of third sliders (8141), and the two groups of third sliders (8141) are movably mounted corresponding to the two groups of the second slide rails (808), a connecting plate (8142) is arranged between the two groups of the third sliders (8141), and a protective tube (8143) matching the second needle tube (806) is arranged in the middle position of the connecting plate (8142), and the protective tube (8143) and the second needle tube (806) are movably arranged to penetrate each other.

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