Metal roller manufacturing method
The gaseous photoresist is deposited on the surface of the metal roller by vacuum evaporation technology to form a thin and uniform photoresist film, and a preset pattern layer is formed through the exposure and development step, which solves the problem of difficulty in reducing the thickness of the photoresist layer in the prior art, and improves the surface patterning effect of the metal roller.
Patent Information
- Application Number
- CN202311311631.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-10-11
- Publication Date
- 2025-04-11
AI Technical Summary
The thickness of the photoresist layer of the conventional metal rollers is difficult to reduce, resulting in poor uniformity of the photoresist layer.
Using vacuum evaporation technology, the solid-state photoresist is heated into a gaseous photoresist, and the gaseous photoresist is deposited on the surface of the metal roller through a rotating mechanism to form a photoresist film with a thickness of no more than 0.2 microns, and a preset pattern layer is formed through the exposure and development step.
The thinning and uniformity of the photoresist layer are achieved, and the problem of difficulty in reducing the thickness of the photoresist layer in the prior art is solved, and the surface patterning effect of the metal roller is improved.
Smart Images
Figure CN119800285A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a roller manufacturing method, in particular to a metal roller manufacturing method. Background Art
[0002] The photoresist layer formed on the outer surface of the existing metal roller is mostly coated, which requires the photoresist layer to reach a larger thickness to be more uniform, thus virtually causing a stagnation in the relevant technical research in this field. Therefore, the inventor believes that the above defects can be improved, and has devoted himself to research and applied scientific principles, and finally proposed a reasonable design and effective improvement of the present invention. Summary of the invention
[0003] An embodiment of the present invention provides a method for manufacturing a metal roller, which can effectively improve the defect that the thickness of the photoresist layer formed by the existing metal roller is difficult to reduce.
[0004] The embodiment of the present invention discloses a method for manufacturing a metal roller, which includes: a placement step: placing a metal roller in a vacuum evaporation chamber, and allowing the metal roller to rotate in the vacuum evaporation chamber; a evaporation step: heating a solid photoresist to convert the solid photoresist into a gaseous photoresist and depositing it toward the rotating metal roller to form a photoresist film with a thickness not greater than 0.2 microns (μm); and a patterning step: performing an exposure and development operation on the photoresist film to form a preset pattern layer on the photoresist film.
[0005] Preferably, the photoresist film is deposited at a speed of no more than 0.5 nanometers / minute, and the uniformity of the photoresist film is no more than 15%.
[0006] Preferably, the solid photoresist contains no solvent.
[0007] Preferably, the metal roller manufacturing method further includes a preparation step before the placement step: providing a photoresist evaporation device, the photoresist evaporation device comprising: a vacuum evaporation chamber, having a working area, which is elongated and defines a length direction; a rotating mechanism, arranged corresponding to the working area; an evaporation boat, having a plurality of evaporation areas arranged along the length direction; wherein each evaporation area is provided with a solid photoresist; and a heater, connected to the evaporation boat; wherein, in the placement step, the rotating mechanism carries and rotates the metal roller arranged in the working area; in the evaporation step, the heater heats the evaporation boat so that the solid photoresist arranged in each evaporation area is transformed into a gaseous photoresist toward the metal roller.
[0008] Preferably, a evaporation range is defined between each evaporation zone and the working area, and the evaporation ranges of any two adjacent evaporation zones partially overlap.
[0009] Preferably, each vapor deposition area has an emission angle corresponding to the vapor deposition range, and the difference between the emission angles of any two adjacent vapor deposition areas is less than 10 degrees.
[0010] Preferably, the emission angle of each evaporation zone is between 60 degrees and 150 degrees.
[0011] Preferably, the evaporation boat can pass through the heater to form a photoresist film with a uniformity of no more than 15% on the metal roller at a speed of no more than 0.5 nm / min.
[0012] Preferably, the metal roller is a copper roller or a chrome roller, and the evaporation boat is a tungsten boat.
[0013] Preferably, the outer surface of the metal roller has a first forming area exposed outside the preset pattern layer and a second forming area covered by the preset pattern layer. The metal roller manufacturing method further includes: a metal etching step: etching the outer surface of the metal roller by a dry etching method so that the metal roller is concavely formed with a plurality of grooves in the first forming area; wherein the appearance of the plurality of grooves corresponds to the preset pattern layer to jointly constitute an intermediate three-dimensional pattern; and a forming etching step: etching from the intermediate three-dimensional pattern to remove the preset pattern layer and concavely form a rolling three-dimensional pattern on the outer surface of the metal roller, which corresponds to the intermediate three-dimensional pattern.
[0014] In summary, the metal roller manufacturing method disclosed in the embodiment of the present invention can form the photoresist film with a relatively thin thickness and good uniformity on the metal roller by implementing the placement step and the evaporation step. Furthermore, the metal roller manufacturing method can further form the preset pattern layer on the photoresist film by the patterning step, so as to facilitate the subsequent patterning of the outer surface of the metal roller.
[0015] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 Schematic diagram of the process of manufacturing a metal roller according to an embodiment of the present invention.
[0017] Figure 2 for Figure 1 Schematic diagram of the preparation steps in .
[0018] Figure 3 for Figure 1 Schematic diagram of the steps in placing parts.
[0019] Figure 4 for Figure 1 Schematic diagram of the evaporation steps in FIG.
[0020] Figure 5 for Figure 4 Schematic cross-sectional view along section line VV.
[0021] Figure 6 for Figure 5 An enlarged schematic diagram of region VI.
[0022] Figure 7 for Figure 1 Schematic diagram of the patterning steps in .
[0023] Figure 8 for Figure 1 Schematic diagram of the metal etching step in .
[0024] Fig. 9 for Figure 1 Schematic diagram of the shaping etching step in FIG. DETAILED DESCRIPTION
[0025] The following is an explanation of the implementation method of the "Metal Roller Manufacturing Method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.
[0026] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.
[0027] See also Figures 1 to 9 As shown, it is an embodiment of the present invention. Figure 1 As shown, this embodiment discloses a metal roller manufacturing method S100, which sequentially includes a preparation step S110, a placement step S120, a vapor deposition step S130, a patterning step S140, a metal etching step S150 and a forming etching step S160. The specific implementation of the above-mentioned multiple steps S110-S160 will be described below, but they can also be adjusted and changed according to design requirements.
[0028] The preparation step S110: Figures 2 to 4 As shown, a photoresist evaporation device 100 is provided. The photoresist evaporation device 100 comprises a vacuum evaporation chamber 1, a rotating mechanism 2 correspondingly arranged in the vacuum evaporation chamber 1, a evaporation boat 3 located in the vacuum evaporation chamber 1, and a heater 4 connected to the evaporation boat 3.
[0029] Specifically, the vacuum deposition chamber 1 has a working area 11, which is long and defines a length direction L, and the working area 11 is preferably arranged horizontally. The rotating mechanism 2 (along the length direction L) is arranged corresponding to the working area 11; that is, the rotating mechanism 2 is arranged at least at one end of the working area 11 along the length direction L, and is used to carry and rotate a metal roller 300 arranged in the working area 11.
[0030] Furthermore, the evaporation boat 3 is described as a tungsten boat in this embodiment, and the evaporation boat 3 may be located below the working area 11. The evaporation boat 3 has a plurality of evaporation areas 31 arranged along the length direction L, and the plurality of evaporation areas 31 are preferably arranged at equal intervals from each other along the length direction L. In this embodiment, the plurality of evaporation areas 31 are spaced at equal distances from the working area 11 (or the metal roller 300), but the present invention is not limited thereto.
[0031] Furthermore, each of the evaporation regions 31 is groove-shaped and is provided with a solid photoresist 200a, and the solid photoresist 200a in this embodiment is limited to not containing a solvent. In other words, any component not used for evaporation of the solid photoresist 200a is different from the evaporation boat 3 referred to in this embodiment.
[0032] The heater 4 is connected to the evaporation boat 3, and the heater 4 can be used to heat the evaporation boat 3, so that the solid photoresist 200a disposed in each of the evaporation areas 31 is transformed into a gaseous photoresist 200b toward the working area 11, so as to facilitate the deposition of the gaseous photoresist 200b in a gaseous form, thereby providing a new photoresist forming method, and the formed photoresist layer can achieve a uniformity that meets the requirements when the thickness is relatively thin. In other words, any step not used to evaporate the solid photoresist 200a is different from the preparation step S110 referred to in this embodiment.
[0033] In addition, in order to enable the photoresist evaporation device 100 to achieve a better photoresist evaporation effect and to be more conducive to controlling the implementation process of photoresist evaporation, the photoresist evaporation device 100 preferably has at least part of the following features. Specifically, a evaporation range 311 is defined between each of the evaporation zones 31 and the working area 11, and the evaporation ranges 311 of any two adjacent evaporation zones 31 partially overlap, thereby effectively avoiding the working area 11 from having an area that cannot be covered by the gaseous photoresist 200b.
[0034] Furthermore, each of the evaporation zones 31 is in a groove shape and has an emission angle 312 corresponding to the evaporation range 311, and the difference between the emission angles 312 of any two adjacent evaporation zones 31 is less than 10 degrees. The emission angle 312 of each evaporation zone 31 is preferably between 60 degrees and 150 degrees. In addition, the heater 4 includes a plurality of heating parts 41, which are respectively arranged corresponding to the plurality of evaporation zones 31; for example, a heating part 41 can be arranged below each evaporation zone 31.
[0035] It should be noted that the metal roller manufacturing method S100 in this embodiment uses the photoresist evaporation device 100 to implement the component placement step S120, the evaporation step S130 and the patterning step S140, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the component placement step S120, the evaporation step S130 and the patterning step S140 can also be implemented by using other photoresist evaporation mechanisms with structures different from those of this embodiment.
[0036] The step S120 of placing components: Figures 3 to 5 As shown, the metal roller 300 is placed in the vacuum evaporation chamber 1, and the metal roller 300 can rotate in the vacuum evaporation chamber 1. In this embodiment, the metal roller 300 is preferably a copper roller or a chrome roller in a cylindrical shape, and the metal roller 300 is arranged in the working area 11 of the vacuum evaporation chamber 1, so that the rotating mechanism 2 can carry and rotate the metal roller 300 arranged in the working area 11. In other words, the metal roller 300 can rotate in the working area 11 through the rotating mechanism 2.
[0037] The evaporation step S130: Figures 4 to 6As shown, the solid photoresist 200a is heated so that the solid photoresist 200a is transformed into the gaseous photoresist 200b and deposited toward the rotating metal roller 300 to form a photoresist film 200c with a thickness not greater than 0.2 micrometers (μm). In this embodiment, when the rotating mechanism 2 rotates the metal roller 300, the heater 4 can be used to heat the evaporation boat 3 so that the solid photoresist 200a disposed in each of the evaporation areas 31 is transformed into the gaseous photoresist 200b toward the metal roller 300 and deposited on the metal roller 300 to form the photoresist film 200c.
[0038] The photoresist film 200c is preferably deposited at a speed of no more than 0.5 nanometers per minute, and the uniformity of the photoresist film 200c can effectively reach no more than 15%. Further, the temperature of each of the evaporation zones 31 can be raised by the corresponding heating unit 41 to a temperature suitable for converting the solid photoresist 200a into the gaseous photoresist 200b (e.g., 600 degrees Celsius to 1100 degrees Celsius), thereby controlling the evaporation boat 3 (or multiple evaporation zones 31) to form the photoresist film 200c with a uniformity of no more than 15% on the (outer surface of) the metal roller 300 at a speed of no more than 0.5 nanometers per minute through the heater 4.
[0039] The patterning step S140: Figure 6 and Figure 7 As shown, the photoresist film 200c is subjected to an exposure and development operation to form a preset pattern layer 200d on the photoresist film 200c. In this embodiment, the outer surface of the metal roller 300 has a first forming area 301 exposed outside the preset pattern layer 200d and a second forming area 302 covered by the preset pattern layer 200d.
[0040] According to this, if Figures 1 to 9 As shown, the metal roller manufacturing method S100 in this embodiment can form the photoresist film 200c with a thinner thickness and better uniformity on the metal roller 300 by implementing the placement step S120 and the evaporation step S130. Furthermore, the metal roller manufacturing method S100 can further form the photoresist film 200c into the preset pattern layer 200d through the patterning step S140, so as to facilitate the subsequent accurate implementation of the outer surface patterning of the metal roller 300 (such as: the metal etching step S150 and the forming etching step S160).
[0041] The metal etching step S150: Figure 7 and Figure 8As shown, the outer surface of the metal roller 300 is etched by dry etching so that the metal roller 300 is concavely formed with a plurality of grooves 3011 in the first forming area 301. The shapes of the plurality of grooves 3011 correspond to the preset pattern layer 200d, so as to form an intermediate three-dimensional pattern M together.
[0042] The forming etching step S160: Figure 8 and Fig. 9 As shown, etching is performed from the intermediate three-dimensional pattern M to remove the preset pattern layer 200d, and the outer surface of the metal roller 300 is concavely formed with a rolling three-dimensional pattern R, which corresponds to (e.g., is substantially the same as) the intermediate three-dimensional pattern M. Among them, the metal roller 300 has a portion formed by etching in the second forming area 302, and its appearance corresponds to (e.g., is substantially the same as) the preset pattern layer 200d.
[0043] It should be additionally noted that, although the metal roller manufacturing method S100 is described in this embodiment by implementing the above-mentioned multiple steps S110-S160, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, at least one of the preparation step S110, the metal etching step S150 and the forming etching step S160 can also be omitted or replaced by other methods according to design requirements.
[0044] Technical Effects of Embodiments of the Invention
[0045] In summary, the metal roller manufacturing method disclosed in the embodiment of the present invention can form the photoresist film with a relatively thin thickness and good uniformity on the metal roller by implementing the placement step and the evaporation step. Furthermore, the metal roller manufacturing method can further form the preset pattern layer on the photoresist film by the patterning step, so as to facilitate the subsequent patterning of the outer surface of the metal roller.
[0046] Furthermore, the photoresist evaporation equipment disclosed in the embodiment of the present invention can perform deposition operations using the gaseous photoresist, thereby providing a new photoresist forming method, and the photoresist film formed can achieve the required uniformity under the condition of thin thickness.
[0047] In addition, the metal roller manufacturing method disclosed in the embodiment of the present invention forms a thin and uniform photoresist film by directly vapor depositing photoresist, and further combines the metal roller of a specific material to jointly go through multiple etching steps (such as: the metal etching step, and the forming etching step) so as to form the rolled three-dimensional pattern on the outer surface of the metal roller, thereby overcoming the technical prejudice in this field.
[0048] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the patent scope of the present invention.
Claims
1. A method for manufacturing a metal roller, characterized in that: The metal roller manufacturing method comprises: A placement step: placing a metal roller in a vacuum evaporation chamber, and allowing the metal roller to rotate in the vacuum evaporation chamber; a vapor deposition step: heating a solid photoresist to convert the solid photoresist into a gaseous photoresist and depositing the gaseous photoresist toward the rotating metal roller to form a photoresist film with a thickness not greater than 0.2 micrometers; and A patterning step: performing an exposure and development operation on the photoresist film to form a preset pattern layer on the photoresist film.
2. The method for manufacturing a metal roller according to claim 1, characterized in that: The photoresist film is deposited at a speed of no more than 0.5 nanometers / minute, and the uniformity of the photoresist film is no more than 15%.
3. The method for manufacturing a metal roller according to claim 1, characterized in that: The solid photoresist does not contain a solvent.
4. The method for manufacturing a metal roller according to claim 1, characterized in that: The metal roller manufacturing method further comprises, before the step of placing components: A preparation step: providing a photoresist evaporation device, the photoresist evaporation device comprising: The vacuum evaporation chamber has a working area, which is elongated and defines a length direction; a rotating mechanism, arranged corresponding to the working area; A vapor deposition boat having a plurality of vapor deposition areas arranged along the length direction; wherein each of the vapor deposition areas is provided with the solid photoresist; and a heater connected to the evaporation boat; Wherein, in the placing step, the rotating mechanism carries and rotates the metal roller disposed in the working area; in the evaporation step, the heater heats the evaporation boat so that the solid photoresist disposed in each of the evaporation areas is transformed into a gaseous photoresist toward the metal roller.
5. The method for manufacturing a metal roller according to claim 4, characterized in that: A evaporation range is defined between each of the evaporation zones and the working area, and the evaporation ranges of any two adjacent evaporation zones partially overlap.
6. The method for manufacturing a metal roller according to claim 5, characterized in that: Each of the evaporation regions has an emission angle corresponding to the evaporation range, and a difference between the emission angles of any two adjacent evaporation regions is less than 10 degrees.
7. The method for manufacturing a metal roller according to claim 6, characterized in that: The emission angle of each of the evaporation zones is between 60 degrees and 150 degrees.
8. The method for manufacturing a metal roller according to claim 4, characterized in that: The evaporation boat can pass through the heater to form the photoresist film with a uniformity of no more than 15% on the metal roller at a speed of no more than 0.5 nanometers / minute.
9. The method for manufacturing a metal roller according to claim 4, characterized in that: The metal roller is a copper roller or a chrome roller, and the evaporation boat is a tungsten boat.
10. The method for manufacturing a metal roller according to claim 1, characterized in that: The outer surface of the metal roller has a first forming area exposed outside the preset pattern layer and a second forming area covered by the preset pattern layer. The metal roller manufacturing method further comprises: a metal etching step: etching the outer surface of the metal roller by dry etching so that the metal roller is concavely provided with a plurality of grooves in the first forming area; wherein the shapes of the plurality of grooves correspond to the preset pattern layer to form an intermediate three-dimensional pattern together; and A forming etching step: etching from the intermediate three-dimensional pattern to remove the preset pattern layer and make the outer surface of the metal roller concave to form a rolled three-dimensional pattern corresponding to the intermediate three-dimensional pattern.