Test response method, device and equipment of wafer machine and storage medium

Abstract

The invention relates to the field of integrated circuit testing, in particular to a test response method, device and equipment of a wafer machine table and a storage medium, and the method comprises the steps that search request information of a target wafer is received, and the search request information comprises customer wafer coordinate information of the target wafer based on a customer wafer coordinate system; inputting the customer wafer coordinate information of the target wafer into a pre-constructed corresponding relationship between a customer wafer coordinate system and a machine wafer coordinate system, and determining machine wafer coordinate information of the target wafer based on the machine wafer coordinate system; testing a to-be-tested wafer according to the machine wafer coordinate information of the target wafer to obtain test result information; sending the test result information; the test result information comprises customer wafer coordinate information of the target wafer. The wafer positioning speed is improved, a tester can conveniently check and test information of the target wafer on the to-be-processed wafer on the test machine table, and the data exchange difficulty is reduced.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit testing, and in particular to a test response method, device, equipment and storage medium for a wafer machine. Background Art

[0002] With the development of science and technology, integrated circuits are being used in more and more fields, and the output of integrated circuits is increasing rapidly every year. However, since each link in the production, testing and use of integrated circuits is very complicated, the equipment used in each of the above links may come from different manufacturers with different standards, which inevitably requires a lot of complex data communication between manufacturers with different standards. How to ensure the timeliness and reliability of data communication between the two parties has become a problem that everyone pays attention to.

[0003] In the existing integrated circuit test process, the test object is a wafer. A whole wafer is divided into multiple different chips according to r rows and c columns, and each chip needs to be tested for performance. The test machine itself contains a wafer coordinate system set by the machine manufacturer for the wafer to be tested as a reference system in the test, and the user of the test machine (usually from other links in the integrated circuit production) will set his own wafer coordinate system for the wafer to be tested as its reference system. This results in that for the same wafer to be tested, the coordinate system used in other systems of the user and the coordinate system used by the test machine cannot be unified. As a result, after receiving the user's test request, the test machine cannot quickly determine which chip needs to be tested, and can only determine the coordinates of the chip to be tested in the coordinate system corresponding to the test machine through manual intervention. This method is time-consuming, costly, and slow to respond.

[0004] Therefore, how to solve the problem of difficult data exchange and slow wafer positioning caused by the difference between the wafer coordinate system specified by the user of the test machine and the wafer coordinate system used by the test machine itself in the prior art is urgently needed to be solved by those skilled in the art. Summary of the invention

[0005] The purpose of the present invention is to provide a test response method, device, equipment and storage medium for a wafer machine to solve the problem of difficulty in data exchange and slow wafer positioning caused by the wafer coordinate system specified by the user of the test machine and the wafer coordinate system used by the test machine itself in the prior art.

[0006] In order to solve the above technical problems, the present invention provides a test response method of a wafer machine, comprising:

[0007] Receiving search request information of a target wafer, wherein the search request information includes guest wafer coordinate information of the target wafer based on a guest wafer coordinate system;

[0008] Inputting the guest wafer coordinate information of the target wafer into the correspondence between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system, and determining the machine wafer coordinate information of the target wafer based on the machine wafer coordinate system;

[0009] Testing the wafer to be tested according to the machine wafer coordinate information of the target wafer to obtain test result information;

[0010] The test result information is sent; the test result information includes the guest wafer coordinate information of the target wafer.

[0011] Optionally, in the test response method of the wafer machine, the method for determining the correspondence between the guest wafer coordinate system and the machine wafer coordinate system includes:

[0012] Obtain customer wafer coordinate system data and machine wafer coordinate system data;

[0013] Determine the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determine the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate;

[0014] Determine the horizontal axis offset and the vertical axis offset according to the guest side vertex coordinates and the machine side vertex coordinates;

[0015] According to the horizontal axis offset and the vertical axis offset, the corresponding relationship between the guest wafer coordinate system and the machine wafer coordinate system is obtained.

[0016] Optionally, in the test response method of the wafer machine, determining the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate, includes:

[0017] The coordinate value of the position with the smallest horizontal coordinate and the smallest vertical coordinate in the customer-side wafer coordinate system data is recorded as the customer-side vertex coordinate, and the coordinate value of the position with the smallest horizontal coordinate and the smallest vertical coordinate in the machine wafer coordinate system data is recorded as the machine vertex coordinate;

[0018] or,

[0019] The coordinate value of the position with the largest horizontal coordinate and the largest vertical coordinate in the guest-side wafer coordinate system data is recorded as the guest-side vertex coordinate, and the coordinate value of the position with the largest horizontal coordinate and the largest vertical coordinate in the machine wafer coordinate system data is recorded as the machine vertex coordinate;

[0020] or,

[0021] The coordinate value of the position with the smallest horizontal coordinate and the largest vertical coordinate in the guest-side wafer coordinate system data is recorded as the guest-side vertex coordinate, and the coordinate value of the position with the smallest horizontal coordinate and the largest vertical coordinate in the machine wafer coordinate system data is recorded as the machine vertex coordinate;

[0022] or,

[0023] The coordinate value of the position with the largest horizontal coordinate and the smallest vertical coordinate in the guest wafer coordinate system data is recorded as the guest vertex coordinate, and the coordinate value of the position with the largest horizontal coordinate and the smallest vertical coordinate in the tool wafer coordinate system data is recorded as the tool vertex coordinate.

[0024] Optionally, in the test response method of the wafer machine, before determining the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate, the method further includes:

[0025] Determine whether the x-axis direction in the customer wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are the same as the preset x-axis positive direction, and determine whether the y-axis direction in the customer wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are the same as the preset y-axis positive direction;

[0026] Accordingly, determining the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate, includes:

[0027] When the x-axis direction in the guest wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are both the same as the preset x-axis positive direction, and the y-axis direction in the guest wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are both the same as the preset y-axis positive direction, the coordinate value of the first vertex in the guest wafer coordinate system data is determined and recorded as the guest vertex coordinate, and the coordinate value of the first vertex in the machine wafer coordinate system data is determined and recorded as the machine vertex coordinate.

[0028] Optionally, in the test response method of the wafer machine, before determining the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate, the method further includes:

[0029] When the x-axis direction in the guest wafer coordinate system data is different from the positive direction of the x-axis, the horizontal coordinates of each wafer coordinate in the guest wafer coordinate system data are changed to corresponding opposite numbers;

[0030] When the x-axis direction in the machine wafer coordinate system data is different from the positive direction of the x-axis, the horizontal coordinate of each wafer coordinate in the machine wafer coordinate system data is changed to a corresponding opposite number;

[0031] When the y-axis direction in the guest wafer coordinate system data is different from the positive direction of the y-axis, the ordinate of each wafer coordinate in the guest wafer coordinate system data is changed to a corresponding opposite number;

[0032] When the y-axis direction in the machine wafer coordinate system data is different from the positive direction of the y-axis, the ordinate of each wafer coordinate in the machine wafer coordinate system data is changed into a corresponding opposite number.

[0033] Optionally, in the test response method of the wafer machine, the x-axis direction in the wafer coordinate data of the machine is determined as the positive direction of the x-axis, and the y-axis direction in the wafer coordinate data of the machine is determined as the positive direction of the y-axis;

[0034] Accordingly, determining whether the x-axis direction in the customer wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are the same as the preset x-axis positive direction, and determining whether the y-axis direction in the customer wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are the same as the preset y-axis positive direction includes:

[0035] Determine whether the x-axis direction in the guest wafer coordinate system data is the same as the positive direction of the x-axis, and determine whether the y-axis direction in the guest wafer coordinate system data is the same as the positive direction of the y-axis;

[0036] Correspondingly, when the x-axis direction in the guest wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are both the same as the preset x-axis positive direction, and the y-axis direction in the guest wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are both the same as the preset y-axis positive direction, determining the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate, includes:

[0037] When the x-axis direction in the guest wafer coordinate system data is the same as the positive direction of the x-axis, and the y-axis direction in the guest wafer coordinate system data is the same as the positive direction of the y-axis, the coordinate value of the first vertex in the guest wafer coordinate system data is determined, recorded as the guest vertex coordinate, and the coordinate value of the first vertex in the machine wafer coordinate system data is determined, recorded as the machine vertex coordinate.

[0038] Optionally, in the test response method of the wafer machine, the first vertex angle is a first vertex angle of a complete coverage area or a first vertex angle of an incomplete coverage area.

[0039] A test response device for a wafer machine, comprising:

[0040] A receiving module, used for receiving search request information of a target wafer, wherein the search request information includes request source information and guest wafer coordinate information of the target wafer based on a guest wafer coordinate system;

[0041] A coordinate conversion module, used for inputting the guest wafer coordinate information of the target wafer into the correspondence between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system, and determining the machine wafer coordinate information of the target wafer based on the machine wafer coordinate system;

[0042] A testing module, used for testing the wafer to be tested according to the machine wafer coordinate information of the target wafer to obtain test result information;

[0043] The message sending module is used to send the test result information; the test result information includes the guest wafer coordinate information of the target wafer.

[0044] A test response device for a wafer machine, comprising:

[0045] Memory for storing computer programs;

[0046] The processor is used to implement the steps of any one of the above-mentioned wafer machine test response methods when executing the computer program.

[0047] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of any one of the above-mentioned wafer information access response methods are implemented.

[0048] The test response method of the wafer machine provided by the present invention includes receiving the search request information of the target wafer, the search request information includes the guest wafer coordinate information of the target wafer based on the guest wafer coordinate system; inputting the guest wafer coordinate information of the target wafer into the correspondence relationship between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system, and determining the machine wafer coordinate information of the target wafer based on the machine wafer coordinate system; testing the wafer to be tested according to the machine wafer coordinate information of the target wafer to obtain the test result information; sending the test result information; the test result information includes the guest wafer coordinate information of the target wafer. The present invention quickly converts the coordinate values ​​from the guest wafer coordinate system into the coordinate values ​​under the machine wafer coordinate system through the correspondence relationship between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system, thereby improving the wafer positioning speed, facilitating the tester to view and test the target wafer on the wafer to be processed on the test machine, reducing the difficulty of data exchange, and realizing data alignment between different devices. The present invention also provides a wafer machine test response device, equipment and storage medium having the above beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0050] Figure 1 A flowchart of a specific implementation of the test response method of a wafer machine provided by the present invention;

[0051] Figure 2 A partial flow chart of another specific implementation of the test response method of a wafer machine provided by the present invention;

[0052] Figure 3 A schematic diagram of a process structure of a wafer according to a specific implementation of the test response method of a wafer machine provided by the present invention;

[0053] Figure 4 A schematic structural diagram of a specific implementation of the test response device for a wafer machine provided by the present invention.

[0054] In the figure, it includes 100-receiving module, 200-coordinate conversion module, 300-test module, and 400-message sending module. DETAILED DESCRIPTION

[0055] In order to enable those skilled in the art to better understand the scheme of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0056] The core of the present invention is to provide a test response method for a wafer machine, and a flow chart of a specific implementation method thereof is shown as follows: Figure 1 As shown, it is called specific implementation mode 1, including:

[0057] S101: receiving search request information of a target wafer, wherein the search request information includes guest wafer coordinate information of the target wafer based on a guest wafer coordinate system.

[0058] It can be considered that the search request information of the target wafer is information sent by the tester (or the user of the test machine) to the wafer test machine. The present invention describes the test process from the perspective of the wafer test machine.

[0059] S102: inputting the guest wafer coordinate information of the target wafer into the correspondence between the pre-constructed guest wafer coordinate system and the tool wafer coordinate system, and determining the tool wafer coordinate information of the target wafer based on the tool wafer coordinate system.

[0060] The guest wafer coordinate information of the target wafer is the coordinate value of the target wafer in the guest wafer coordinate system; the machine wafer coordinate information of the target wafer is the coordinate value of the target wafer in the machine wafer coordinate system.

[0061] Of course, after the correspondence between the guest wafer coordinate system and the machine wafer coordinate system is established, reverse search is also supported, that is, finding the guest wafer coordinate information of the chip from the machine wafer coordinate information of the chip.

[0062] S103: Testing the wafer to be tested according to the machine wafer coordinate information of the target wafer to obtain test result information.

[0063] The target wafer is found on the wafer to be tested, and the target wafer is tested. The specific test type and test means can be selected according to actual conditions, and the present invention is not limited here.

[0064] S104: Sending the test result information; the test result information includes the guest wafer coordinate information of the target wafer.

[0065] In this step, the test result information is returned to the sender of the search request information, and the customer wafer coordinate information of the target wafer is attached, so that the terminal of the test party that receives the test result information does not need to further perform coordinate conversion and can directly view the test results, further improving data exchange efficiency.

[0066] Specifically, the flowchart corresponding to the method for determining the correspondence between the guest wafer coordinate system and the machine wafer coordinate system is as follows: Figure 2 As shown, including:

[0067] S001: Obtain customer wafer coordinate system data and machine wafer coordinate system data.

[0068] The customer wafer coordinate system data is the relevant data information of the coordinate system established by the sender of the search request information for the wafer to be tested, including the coordinate axis X, Y directions, origin position, customer wafer schematic diagram, and coordinate value information of each chip on the wafer to be tested.

[0069] The machine wafer coordinate data is the coordinate data information established by the wafer testing machine for the wafer to be tested. Of course, the machine wafer coordinate data can also refer to the contents included in the customer wafer coordinate data, which will not be elaborated in the present invention.

[0070] When editing or operating a wafer, different manufacturers or equipment will establish different reference coordinate systems on the surface of the wafer to be tested. The differences in these coordinate systems will make data exchange difficult.

[0071] S002: Determine the coordinate value of the first vertex in the guest wafer coordinate system data, record it as the guest vertex coordinate, and determine the coordinate value of the first vertex in the tool wafer coordinate system data, record it as the tool vertex coordinate.

[0072] Whether it is the user of the test machine or the test machine, the basic unit of the horizontal and vertical coordinates in the coordinate data is the chip. For example, if the chip is the nth chip along the positive x-axis and the mth chip along the positive y-axis from the origin, then its coordinates must be (n, m). Although the customer wafer coordinate system data is different from the machine wafer coordinate system data, the two are essentially aimed at the same wafer to be tested, that is, the arrangement of the chips that make up the two coordinate data is finite and the same, so the top angles of the chips are also the same.

[0073] Specifically, this step includes:

[0074] The coordinate value of the position with the smallest horizontal coordinate and the smallest vertical coordinate in the customer-side wafer coordinate system data is recorded as the customer-side vertex coordinate, and the coordinate value of the position with the smallest horizontal coordinate and the smallest vertical coordinate in the machine wafer coordinate system data is recorded as the machine vertex coordinate;

[0075] or,

[0076] The coordinate value of the position with the largest horizontal coordinate and the largest vertical coordinate in the guest-side wafer coordinate system data is recorded as the guest-side vertex coordinate, and the coordinate value of the position with the largest horizontal coordinate and the largest vertical coordinate in the machine wafer coordinate system data is recorded as the machine vertex coordinate;

[0077] or,

[0078] The coordinate value of the position with the smallest horizontal coordinate and the largest vertical coordinate in the guest-side wafer coordinate system data is recorded as the guest-side vertex coordinate, and the coordinate value of the position with the smallest horizontal coordinate and the largest vertical coordinate in the machine wafer coordinate system data is recorded as the machine vertex coordinate;

[0079] or,

[0080] The coordinate value of the position with the largest horizontal coordinate and the smallest vertical coordinate in the guest wafer coordinate system data is recorded as the guest vertex coordinate, and the coordinate value of the position with the largest horizontal coordinate and the smallest vertical coordinate in the tool wafer coordinate system data is recorded as the tool vertex coordinate.

[0081] Since the wafers are stacked rectangles, no matter it is the customer wafer coordinate system data or the machine wafer coordinate system data, the x-axis and y-axis directions must be along the arrangement direction of the wafers, that is, the directions of the two perpendicular sides of the wafers. Therefore, to find the vertex angles of the arrangement of finite and identical wafers, you only need to find any one of the four vertices on the coordinate system. The wafers at these four vertices can be used as the first vertex angle. It should be noted that the first vertex angles corresponding to the two wafer coordinate data should be the same wafer. The wafers at the four vertices are the wafer with the largest horizontal coordinate and the largest vertical coordinate (max, max), the wafer with the smallest horizontal coordinate and the smallest vertical coordinate (min, min), the wafer with the largest horizontal coordinate and the smallest vertical coordinate (max, min), and the wafer with the smallest horizontal coordinate and the largest vertical coordinate (min, max).

[0082] The guest side vertex coordinates and the machine vertex coordinates in this preferred embodiment can facilitate program automation, so that the machine can automatically find the first vertex. Of course, the first vertex in the two wafer coordinate data in this step can also be determined by other means, such as manual intervention, etc., and the present invention is not limited here.

[0083] Furthermore, before determining the guest side vertex coordinates and the machine side vertex coordinates by the above method, it also includes:

[0084] A1: Determine whether the x-axis direction in the customer wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are the same as the preset x-axis positive direction, and determine whether the y-axis direction in the customer wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are the same as the preset y-axis positive direction.

[0085] Accordingly, determining the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate, includes:

[0086] A2: When the x-axis direction in the guest wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are both the same as the preset x-axis positive direction, and the y-axis direction in the guest wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are both the same as the preset y-axis positive direction, determine the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determine the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate.

[0087] In this preferred embodiment, before determining the guest vertex coordinates and the machine vertex coordinates, it is checked whether the x-axis orientation and y-axis orientation of the guest wafer coordinate system data and the machine wafer coordinate system data are consistent. Only when the x-axis orientation and the y-axis orientation are consistent, the coordinate value of the first vertex angle is determined by the above-mentioned method of the maximum and minimum values ​​of the horizontal and vertical coordinates, thereby ensuring that the vertex angle wafers determined by the above-mentioned method in the two wafer coordinate data are the same, thereby avoiding errors such as the first vertex angle in the guest wafer coordinate system data being the upper left wafer, and the first vertex angle in the machine wafer coordinate system data being the lower left wafer due to different orientations of the coordinate systems.

[0088] On the other hand, after the above determination, before determining the guest side vertex coordinates and the machine side vertex coordinates, the method further includes:

[0089] B1: When the x-axis direction in the guest wafer coordinate system data is different from the positive direction of the x-axis, the horizontal coordinates of each wafer coordinate in the guest wafer coordinate system data are changed to corresponding opposite numbers.

[0090] B2: When the x-axis direction in the tool wafer coordinate system data is different from the positive direction of the x-axis, the horizontal coordinate of each wafer coordinate in the tool wafer coordinate system data is changed to the corresponding opposite number.

[0091] B3: When the y-axis direction in the guest wafer coordinate system data is different from the positive direction of the y-axis, the ordinate of each wafer coordinate in the guest wafer coordinate system data is changed to a corresponding opposite number.

[0092] B4: When the y-axis direction in the tool wafer coordinate system data is different from the positive direction of the y-axis, the ordinate of each wafer coordinate in the tool wafer coordinate system data is changed to a corresponding opposite number.

[0093] Of course, there is no strict order for the above steps B1 to B4. They only provide four situations after the judgment of step A1. According to the different results of the judgment of step A1, at least one of B1 to B4 can be executed.

[0094] In this preferred embodiment, the axis that is judged to be different from the corresponding positive direction is reversed. During the specific execution, all the coordinates on the axis can be multiplied by -1 to ensure that the x-axis direction of the guest wafer coordinate system data and the machine wafer coordinate system data after processing in this step are the same as the positive direction of the x-axis, and the y-axis direction is the same as the positive direction of the y-axis, to ensure that the first vertex corresponding to the machine vertex coordinate and the first vertex corresponding to the guest wafer vertex coordinate are the same wafer, thereby improving the accuracy of subsequent operations and avoiding system errors.

[0095] Of course, the above steps can be further simplified, that is, the x-axis direction in the machine wafer coordinate data is determined as the positive direction of the x-axis, and the y-axis direction in the machine wafer coordinate data is determined as the positive direction of the y-axis.

[0096] Accordingly, determining whether the x-axis direction in the customer wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are the same as the preset x-axis positive direction, and determining whether the y-axis direction in the customer wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are the same as the preset y-axis positive direction includes:

[0097] C1: Determine whether the x-axis direction in the guest wafer coordinate system data is the same as the positive direction of the x-axis, and determine whether the y-axis direction in the guest wafer coordinate system data is the same as the positive direction of the y-axis.

[0098] Correspondingly, when the x-axis direction in the guest wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are both the same as the preset x-axis positive direction, and the y-axis direction in the guest wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are both the same as the preset y-axis positive direction, determining the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate, includes:

[0099] C2: When the x-axis direction in the guest wafer coordinate system data is the same as the positive direction of the x-axis, and the y-axis direction in the guest wafer coordinate system data is the same as the positive direction of the y-axis, determine the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determine the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate.

[0100] Determining the x-axis direction in the machine wafer coordinate data as the positive direction of the x-axis, and determining the y-axis direction in the machine wafer coordinate data as the positive direction of the y-axis, can save the judgment of whether the x-axis and y-axis of the machine wafer coordinate data are the same as the positive direction of the y-axis. Only the judgment and subsequent adjustment of the guest wafer coordinate system data are required, which greatly simplifies the process steps, saves computing power, and improves process efficiency.

[0101] S003: Determine the horizontal axis offset and the vertical axis offset according to the guest side vertex coordinates and the machine side vertex coordinates.

[0102] In the above steps, the coordinate values ​​of the same point (that is, the first vertex angle) in the two wafer coordinate systems are determined. In this step, it is only necessary to subtract the horizontal coordinates of the two coordinate values ​​to obtain the horizontal axis offset, and to subtract the two vertical coordinates to obtain the vertical axis offset.

[0103] If in the customer wafer coordinate system data, the coordinate value of the first vertex is (x1, y1); if in the machine wafer coordinate system data, the coordinate value of the first vertex is (x2, y2), then the horizontal axis offset dx=x2-x1, and the vertical axis offset dy=y2-y1.

[0104] S004: Obtaining a correspondence between the guest wafer coordinate system and the machine wafer coordinate system according to the horizontal axis offset and the vertical axis offset.

[0105] By utilizing the horizontal axis offset and the vertical axis offset, each chip (equivalent to each coordinate point) in the guest wafer coordinate system is processed to obtain the coordinate value of each chip in the guest wafer coordinate system in the machine wafer coordinate system, that is, the correspondence between the guest wafer coordinate system and the machine wafer coordinate system is obtained. Of course, the horizontal axis offset and the vertical axis offset can also be directly used as the correspondence between the guest wafer coordinate system and the machine wafer coordinate system, and the present invention is not limited thereto.

[0106] The following is a detailed process for converting the customer wafer coordinate information of any wafer into the corresponding machine wafer coordinate information:

[0107] Continuing with the previous example, assuming that the coordinates of the guest wafer coordinate information of the chip in the guest wafer coordinate system data are (x3, y3), the process of converting it into the coordinates of the corresponding machine wafer coordinate information (x4, y4) is as follows:

[0108] X4=x3+dx; (1)

[0109] X4=y3+dy; (2)

[0110] That is, in this step, the chip coordinates of the customer wafer coordinate system can be converted into coordinates that can be directly read and recognized by the test machine.

[0111] As a specific implementation manner, the first vertex angle is a first vertex angle of a complete coverage area or a first vertex angle of an incomplete coverage area.

[0112] In this specific implementation manner, it is further explained that the first vertex angle can be the first vertex angle of the complete coverage area or the first vertex angle of the incomplete coverage area. For details, please refer to Figure 3 , it can be seen that the wafer is circular, but the individual chips that make up the coordinate system are rectangular, which results in the existence of two types of chips, one is the chip that is completely covered by the wafer area, and the other is the chip that is only partially covered by the wafer area. The fully covered area is the area composed of chips that are completely covered by the wafer area, and the incompletely covered area is the area composed of chips that are partially covered by the wafer area. Figure 3 The dark squares are used to mark the chips partially covered by the wafer, and the chips surrounded by the dark chips are the chips completely covered by the wafer. It can be seen from the figure that if the first vertex angle is determined based on the complete coverage area, any one of #41 (1,1), #36 (6,1), #5 (6,5), and #10 (1,5) can be determined as the first vertex angle. If the first vertex angle is determined based on the incomplete coverage area, any one of (0,0), (7,0), (7,6), and (0,6) can be determined as the first vertex angle. In this preferred embodiment, two graphic references for determining the first vertex angle are provided, which further broadens the versatility of the present invention and expands the application scenarios of the present invention. Of course, regarding the numbering information of the chip, S-shaped paths are supported, and other paths can also be customized, which is not limited by the present invention.

[0113] The test response method of the wafer machine provided by the present invention includes receiving the search request information of the target wafer, the search request information includes the guest wafer coordinate information of the target wafer based on the guest wafer coordinate system; inputting the guest wafer coordinate information of the target wafer into the correspondence relationship between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system, and determining the machine wafer coordinate information of the target wafer based on the machine wafer coordinate system; testing the wafer to be tested according to the machine wafer coordinate information of the target wafer to obtain the test result information; sending the test result information; the test result information includes the guest wafer coordinate information of the target wafer. The present invention quickly converts the coordinate values ​​from the guest wafer coordinate system into the coordinate values ​​under the machine wafer coordinate system through the correspondence relationship between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system, thereby improving the wafer positioning speed, facilitating the tester to view and test the target wafer on the wafer to be processed on the test machine, reducing the difficulty of data exchange, and realizing data alignment between different devices.

[0114] The following is an introduction to a test response device for a wafer tool provided by an embodiment of the present invention. The test response device for a wafer tool described below and the test response method for a wafer tool described above can be referred to each other.

[0115] Figure 4 The structural block diagram of the test response device of the wafer machine provided by the embodiment of the present invention is shown in FIG. Figure 4 The test response device of the wafer tool may include:

[0116] The receiving module 100 is used to receive search request information of a target wafer, wherein the search request information includes request source information and guest wafer coordinate information of the target wafer based on a guest wafer coordinate system;

[0117] The coordinate conversion module 200 is used to input the guest wafer coordinate information of the target wafer into the correspondence between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system, and determine the machine wafer coordinate information of the target wafer based on the machine wafer coordinate system;

[0118] The test module 300 is used to test the wafer to be tested according to the machine wafer coordinate information of the target wafer to obtain test result information;

[0119] The message sending module 400 is used to send the test result information; the test result information includes the guest wafer coordinate information of the target wafer.

[0120] As a preferred implementation, the test response device of the wafer machine includes:

[0121] An acquisition unit is used to acquire customer wafer coordinate system data and machine wafer coordinate system data;

[0122] A vertex unit, used to determine the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determine the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate;

[0123] An offset unit, used to determine a horizontal axis offset and a vertical axis offset according to the guest side vertex coordinates and the machine side vertex coordinates;

[0124] The corresponding relationship unit is used to obtain the corresponding relationship between the guest wafer coordinate system and the machine wafer coordinate system according to the horizontal axis offset and the vertical axis offset.

[0125] As a preferred embodiment, the corner unit includes:

[0126] The coordinate maximum vertex angle unit is used to record the coordinate value of the position with the smallest horizontal coordinate and the smallest vertical coordinate in the guest wafer coordinate system data as the guest vertex angle coordinate, and record the coordinate value of the position with the smallest horizontal coordinate and the smallest vertical coordinate in the machine wafer coordinate system data as the machine vertex angle coordinate;

[0127] or,

[0128] Used to record the coordinate value of the position with the largest horizontal coordinate and the largest vertical coordinate in the customer-side wafer coordinate system data as the customer-side vertex coordinate, and record the coordinate value of the position with the largest horizontal coordinate and the largest vertical coordinate in the machine wafer coordinate system data as the machine vertex coordinate;

[0129] or,

[0130] Used to record the coordinate value of the position with the smallest horizontal coordinate and the largest vertical coordinate in the guest-side wafer coordinate system data as the guest-side vertex coordinate, and record the coordinate value of the position with the smallest horizontal coordinate and the largest vertical coordinate in the machine wafer coordinate system data as the machine vertex coordinate;

[0131] or,

[0132] It is used to record the coordinate value of the position with the largest horizontal coordinate and the smallest vertical coordinate in the guest wafer coordinate system data as the guest vertex coordinate, and record the coordinate value of the position with the largest horizontal coordinate and the smallest vertical coordinate in the machine wafer coordinate system data as the machine vertex coordinate.

[0133] As a preferred embodiment, the corner unit further includes:

[0134] A direction determination unit, used to determine whether the x-axis direction in the customer wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are the same as a preset x-axis positive direction, and to determine whether the y-axis direction in the customer wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are the same as a preset y-axis positive direction;

[0135] The conditional vertex unit is used to determine the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and to determine the coordinate value of the first vertex in the tool wafer coordinate system data, recorded as the tool vertex coordinate, when the x-axis direction in the guest wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are both the same as the preset x-axis positive direction, and the y-axis direction in the guest wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are both the same as the preset y-axis positive direction.

[0136] As a preferred embodiment, the corner unit further includes:

[0137] A guest x-axis transformation unit, used for converting the horizontal coordinates of each wafer coordinate in the guest wafer coordinate system data into corresponding opposite numbers when the x-axis direction in the guest wafer coordinate system data is different from the positive direction of the x-axis;

[0138] A machine x-axis conversion unit, used for converting the horizontal coordinates of each wafer coordinate in the machine wafer coordinate data into corresponding opposite numbers when the x-axis direction in the machine wafer coordinate data is different from the positive direction of the x-axis;

[0139] A guest y-axis conversion unit, used for converting the ordinate of each wafer coordinate in the guest wafer coordinate system data into a corresponding opposite number when the y-axis direction in the guest wafer coordinate system data is different from the positive direction of the y-axis;

[0140] The machine y-axis conversion unit is used to convert the ordinate of each wafer coordinate in the machine wafer coordinate data into a corresponding opposite number when the y-axis direction in the machine wafer coordinate data is different from the positive direction of the y-axis.

[0141] As a preferred implementation, the x-axis direction in the machine wafer coordinate system data is determined as the positive direction of the x-axis, and the y-axis direction in the machine wafer coordinate system data is determined as the positive direction of the y-axis;

[0142] Accordingly, the corner unit comprises:

[0143] A simplified judgment unit, used to judge whether the x-axis direction in the guest-side wafer coordinate system data is the same as the positive direction of the x-axis, and to judge whether the y-axis direction in the guest-side wafer coordinate system data is the same as the positive direction of the y-axis;

[0144] The simplified conditional vertex unit is used to determine the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, when the x-axis direction in the guest wafer coordinate system data is the same as the positive direction of the x-axis, and the y-axis direction in the guest wafer coordinate system data is the same as the positive direction of the y-axis. The coordinate value is recorded as the guest vertex coordinate, and the coordinate value of the first vertex in the machine wafer coordinate system data is recorded as the machine vertex coordinate.

[0145] The test response device of the wafer machine provided by the present invention includes a receiving module 100, which is used to receive the search request information of the target chip, and the search request information includes the request source information and the guest wafer coordinate information of the target chip based on the guest wafer coordinate system; a coordinate conversion module 200, which is used to input the guest wafer coordinate information of the target chip into the correspondence between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system, and determine the machine wafer coordinate information of the target chip based on the machine wafer coordinate system; a testing module 300, which is used to test the wafer to be tested according to the machine wafer coordinate information of the target chip to obtain test result information; a message sending module 400, which is used to send the test result information; the test result information includes the guest wafer coordinate information of the target chip. The present invention uses a pre-constructed correspondence between the guest wafer coordinate system and the machine wafer coordinate system to quickly convert the coordinate values ​​from the guest wafer coordinate system into the coordinate values ​​under the machine wafer coordinate system, thereby improving the wafer positioning speed, facilitating the tester to view and test the target wafer on the wafer to be processed on the test machine, reducing the difficulty of data exchange, and realizing data alignment between different devices.

[0146] The test response device of the wafer machine of the present embodiment is used to implement the test response method of the wafer machine mentioned above. Therefore, the specific implementation of the test response device of the wafer machine can be seen in the embodiment of the test response method of the wafer machine in the previous text. For example, the receiving module 100, the coordinate conversion module 200, the testing module 300, and the message sending module 400 are respectively used to implement steps S101, S102, S103, and S104 in the test response method of the wafer machine mentioned above. Therefore, its specific implementation can refer to the description of the corresponding embodiments of each part, which will not be repeated here.

[0147] The present invention also provides a test response device for a wafer machine, comprising:

[0148] Memory for storing computer programs;

[0149] A processor is used to implement the steps of any of the above-mentioned test response methods for a wafer machine when executing the computer program. The test response method for a wafer machine provided by the present invention includes receiving a search request information of a target wafer, wherein the search request information includes the guest wafer coordinate information of the target wafer based on the guest wafer coordinate system; inputting the guest wafer coordinate information of the target wafer into the correspondence between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system to determine the machine wafer coordinate information of the target wafer based on the machine wafer coordinate system; testing the wafer to be tested according to the machine wafer coordinate information of the target wafer to obtain test result information; and sending the test result information; the test result information includes the guest wafer coordinate information of the target wafer. The present invention uses a pre-constructed correspondence between the guest wafer coordinate system and the machine wafer coordinate system to quickly convert the coordinate values ​​from the guest wafer coordinate system into the coordinate values ​​under the machine wafer coordinate system, thereby improving the wafer positioning speed, facilitating the tester to view and test the target wafer on the wafer to be processed on the test machine, reducing the difficulty of data exchange, and realizing data alignment between different devices.

[0150] The present invention also provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of any of the above-mentioned test response methods for wafer machines are implemented. The test response method for wafer machines provided by the present invention includes receiving search request information of a target wafer, wherein the search request information includes guest wafer coordinate information of the target wafer based on a guest wafer coordinate system; inputting the guest wafer coordinate information of the target wafer into a correspondence relationship between a pre-constructed guest wafer coordinate system and a machine wafer coordinate system, and determining the machine wafer coordinate information of the target wafer based on the machine wafer coordinate system; testing the wafer to be tested according to the machine wafer coordinate information of the target wafer to obtain test result information; and sending the test result information; the test result information includes the guest wafer coordinate information of the target wafer. The present invention uses a pre-constructed correspondence between the guest wafer coordinate system and the machine wafer coordinate system to quickly convert the coordinate values ​​from the guest wafer coordinate system into the coordinate values ​​under the machine wafer coordinate system, thereby improving the wafer positioning speed, facilitating the tester to view and test the target wafer on the wafer to be processed on the test machine, reducing the difficulty of data exchange, and realizing data alignment between different devices.

[0151] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0152] It should be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0153] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0154] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0155] The test response method, device, equipment and storage medium of the wafer machine provided by the present invention are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A test response method for a wafer machine, characterized in that: include: Receiving search request information of a target wafer, wherein the search request information includes guest wafer coordinate information of the target wafer based on a guest wafer coordinate system; Inputting the guest wafer coordinate information of the target wafer into the correspondence between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system, and determining the machine wafer coordinate information of the target wafer based on the machine wafer coordinate system; Testing the wafer to be tested according to the machine wafer coordinate information of the target wafer to obtain test result information; The test result information is sent; the test result information includes the guest wafer coordinate information of the target wafer.

2. The wafer machine test response method according to claim 1, wherein: The method for determining the correspondence between the guest wafer coordinate system and the machine wafer coordinate system includes: Obtain customer wafer coordinate system data and machine wafer coordinate system data; Determine the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determine the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate; Determine the horizontal axis offset and the vertical axis offset according to the guest side vertex coordinates and the machine side vertex coordinates; According to the horizontal axis offset and the vertical axis offset, the corresponding relationship between the guest wafer coordinate system and the machine wafer coordinate system is obtained.

3. The wafer machine test response method according to claim 2, wherein: Determining the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate, includes: The coordinate value of the position with the smallest horizontal coordinate and the smallest vertical coordinate in the customer-side wafer coordinate system data is recorded as the customer-side vertex coordinate, and the coordinate value of the position with the smallest horizontal coordinate and the smallest vertical coordinate in the machine wafer coordinate system data is recorded as the machine vertex coordinate; or, The coordinate value of the position with the largest horizontal coordinate and the largest vertical coordinate in the guest-side wafer coordinate system data is recorded as the guest-side vertex coordinate, and the coordinate value of the position with the largest horizontal coordinate and the largest vertical coordinate in the machine wafer coordinate system data is recorded as the machine vertex coordinate; or, The coordinate value of the position with the smallest horizontal coordinate and the largest vertical coordinate in the guest-side wafer coordinate system data is recorded as the guest-side vertex coordinate, and the coordinate value of the position with the smallest horizontal coordinate and the largest vertical coordinate in the machine wafer coordinate system data is recorded as the machine vertex coordinate; or, The coordinate value of the position with the largest horizontal coordinate and the smallest vertical coordinate in the guest wafer coordinate system data is recorded as the guest vertex coordinate, and the coordinate value of the position with the largest horizontal coordinate and the smallest vertical coordinate in the tool wafer coordinate system data is recorded as the tool vertex coordinate.

4. The wafer machine test response method according to claim 3, wherein: Before determining the coordinate value of the first vertex in the guest wafer coordinate system data as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data as the machine vertex coordinate, the method further includes: Determine whether the x-axis direction in the customer wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are the same as the preset x-axis positive direction, and determine whether the y-axis direction in the customer wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are the same as the preset y-axis positive direction; Accordingly, determining the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate, includes: When the x-axis direction in the guest wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are both the same as the preset x-axis positive direction, and the y-axis direction in the guest wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are both the same as the preset y-axis positive direction, the coordinate value of the first vertex in the guest wafer coordinate system data is determined and recorded as the guest vertex coordinate, and the coordinate value of the first vertex in the machine wafer coordinate system data is determined and recorded as the machine vertex coordinate.

5. The wafer machine test response method according to claim 4, wherein: Before determining the coordinate value of the first vertex in the guest wafer coordinate system data as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data as the machine vertex coordinate, the method further includes: When the x-axis direction in the guest wafer coordinate system data is different from the positive direction of the x-axis, the horizontal coordinates of each wafer coordinate in the guest wafer coordinate system data are changed to corresponding opposite numbers; When the x-axis direction in the machine wafer coordinate system data is different from the positive direction of the x-axis, the horizontal coordinate of each wafer coordinate in the machine wafer coordinate system data is changed to a corresponding opposite number; When the y-axis direction in the guest wafer coordinate system data is different from the positive direction of the y-axis, the ordinate of each wafer coordinate in the guest wafer coordinate system data is changed to a corresponding opposite number; When the y-axis direction in the machine wafer coordinate system data is different from the positive direction of the y-axis, the ordinate of each wafer coordinate in the machine wafer coordinate system data is changed into a corresponding opposite number.

6. The wafer machine test response method as claimed in claim 4, characterized in that: Determine the x-axis direction in the machine wafer coordinate system data as the x-axis positive direction, and determine the y-axis direction in the machine wafer coordinate system data as the y-axis positive direction; Accordingly, determining whether the x-axis direction in the customer wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are the same as the preset x-axis positive direction, and determining whether the y-axis direction in the customer wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are the same as the preset y-axis positive direction includes: Determine whether the x-axis direction in the guest wafer coordinate system data is the same as the positive direction of the x-axis, and determine whether the y-axis direction in the guest wafer coordinate system data is the same as the positive direction of the y-axis; Correspondingly, when the x-axis direction in the guest wafer coordinate system data and the x-axis direction in the machine wafer coordinate system data are both the same as the preset x-axis positive direction, and the y-axis direction in the guest wafer coordinate system data and the y-axis direction in the machine wafer coordinate system data are both the same as the preset y-axis positive direction, determining the coordinate value of the first vertex in the guest wafer coordinate system data, recorded as the guest vertex coordinate, and determining the coordinate value of the first vertex in the machine wafer coordinate system data, recorded as the machine vertex coordinate, includes: When the x-axis direction in the guest wafer coordinate system data is the same as the positive direction of the x-axis, and the y-axis direction in the guest wafer coordinate system data is the same as the positive direction of the y-axis, the coordinate value of the first vertex in the guest wafer coordinate system data is determined, recorded as the guest vertex coordinate, and the coordinate value of the first vertex in the machine wafer coordinate system data is determined, recorded as the machine vertex coordinate.

7. The wafer machine test response method as claimed in claim 2, wherein: The first vertex angle is a first vertex angle of a complete coverage area or a first vertex angle of a non-complete coverage area.

8. A test response device for a wafer machine, characterized in that: include: A receiving module, used for receiving search request information of a target wafer, wherein the search request information includes request source information and guest wafer coordinate information of the target wafer based on a guest wafer coordinate system; A coordinate conversion module, used for inputting the guest wafer coordinate information of the target wafer into the correspondence between the pre-constructed guest wafer coordinate system and the machine wafer coordinate system, and determining the machine wafer coordinate information of the target wafer based on the machine wafer coordinate system; A testing module, used for testing the wafer to be tested according to the machine wafer coordinate information of the target wafer to obtain test result information; The message sending module is used to send the test result information; the test result information includes the guest wafer coordinate information of the target wafer.

9. A test response device for a wafer machine, characterized in that: include: Memory for storing computer programs; A processor is used to implement the steps of the wafer tool test response method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the wafer information access response method according to any one of claims 1 to 7 are implemented.

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