Silicon wafer cleaning apparatus, silicon wafer cleaning device, and silicon wafer cleaning method

Abstract

The present disclosure provides a silicon wafer cleaning device, a silicon wafer cleaning apparatus and a silicon wafer cleaning method. The silicon wafer cleaning device comprises a base, a first cleaning assembly and a second cleaning assembly connected to the base, wherein the first cleaning assembly is configured to clean a surface of a silicon wafer by means of polishing, and the second cleaning assembly is configured to clean the surface of the silicon wafer by means of sweeping; and wherein at least one of the first cleaning assembly and the second cleaning assembly is configured to be movable relative to the other to selectively enable only one of the first cleaning assembly and the second cleaning assembly to be in contact with the surface of the silicon wafer.

Description

Technical Field

[0001] This disclosure relates to the semiconductor manufacturing field, and more particularly to silicon wafer cleaning apparatus, silicon wafer cleaning equipment, and silicon wafer cleaning methods. Background Technology

[0002] Surface cleaning of silicon wafers is crucial in the silicon wafer manufacturing process. Silicon wafers are used in the production of electronic components, and their surfaces undergo various complex processes, such as etching, vapor deposition, and circuit design. Therefore, to ensure the precision of these processes and product performance, the surface of the silicon wafer must maintain a high level of cleanliness. Any residue or contaminants will affect the quality of subsequent processes and the overall performance of the finished product. This makes silicon wafer cleaning an indispensable and vital step in the entire manufacturing process.

[0003] Since the front side of a silicon wafer is a critical area for subsequent manufacturing processes, the cleanliness requirements for the front side are extremely high, necessitating the rigorous removal of any contaminants, particles, and residues that could potentially affect the process. Currently, silicon wafer cleaning typically involves a combination of physical and chemical cleaning methods using brushes and cleaning solutions to remove surface-adhered particles and minute foreign objects.

[0004] While existing cleaning technologies can remove most surface impurities, they still fall short in cleaning highly adhesive foreign matter. These residues can affect the stability of subsequent processes and product performance. Furthermore, the cleaning of the back side of silicon wafers is often given less attention, but residues on its surface can also cause adverse effects during subsequent use. Therefore, comprehensively improving the cleanliness of both the front and back sides of silicon wafers is a necessary direction for further optimizing manufacturing processes and product quality. Summary of the Invention

[0005] This disclosure provides a silicon wafer cleaning apparatus, silicon wafer cleaning equipment, and silicon wafer cleaning method. The silicon wafer cleaning apparatus combines polishing and sweeping methods and can dynamically switch between the two methods, thereby flexibly meeting different cleaning requirements.

[0006] The technical solution of this disclosure is implemented as follows: Firstly, this disclosure provides a silicon wafer cleaning device, the silicon wafer cleaning device comprising:

[0007] Base;

[0008] A first cleaning component and a second cleaning component are connected to the base, wherein the first cleaning component is used to clean the surface of the silicon wafer by polishing, and the second cleaning component is used to clean the surface of the silicon wafer by sweeping.

[0009] In this embodiment, at least one of the first cleaning component and the second cleaning component is configured to be movable relative to the other, so as to selectively enable only one of the first cleaning component and the second cleaning component to contact the surface of the silicon wafer.

[0010] In some optional examples, the silicon wafer cleaning device includes a drive unit connected to at least one of the first cleaning component and the second cleaning component.

[0011] In some alternative examples, the first cleaning component includes a cleaning part and a connecting rod, one end of which is connected to the cleaning part and the other end of which is connected to the drive part, such that the drive part can drive the cleaning part to move away from and toward the base via the connecting rod.

[0012] In some alternative examples, the cleaning section is cross-shaped, and the cross shape is arranged concentrically with the base.

[0013] In some optional examples, the cleaning unit includes a support and a polishing unit that is removably connected to the support.

[0014] In some optional examples, the second cleaning component has a lower hardness than the first cleaning component.

[0015] In some optional examples, the silicon wafer cleaning device also includes a control unit connected to the drive unit.

[0016] In some optional examples, the control unit controls the drive unit to drive the first cleaning component to clean the surface of the silicon wafer, and after the first cleaning component has finished cleaning the surface of the silicon wafer, drives the second cleaning component to clean the surface of the silicon wafer.

[0017] In some optional examples, the silicon wafer cleaning apparatus also includes a supply device for supplying cleaning fluid.

[0018] Secondly, this disclosure provides a silicon wafer cleaning device, the silicon wafer cleaning device comprising:

[0019] According to the silicon wafer cleaning device of the first aspect;

[0020] A drive module for driving the silicon wafer cleaning device to rotate and translate.

[0021] In some optional examples, the silicon wafer cleaning apparatus includes two silicon wafer cleaning devices arranged opposite each other for simultaneously cleaning the front and back sides of the silicon wafer.

[0022] Thirdly, this disclosure provides a silicon wafer cleaning method, which is performed using a silicon wafer cleaning apparatus according to the second aspect.

[0023] In some optional examples, the silicon wafer cleaning method includes: driving a first cleaning component of the silicon wafer cleaning device to clean the surface of the silicon wafer, and after the first cleaning component has cleaned the surface of the silicon wafer, driving a second cleaning component of the silicon wafer cleaning device to clean the surface of the silicon wafer.

[0024] This disclosure provides a silicon wafer cleaning apparatus and a silicon wafer cleaning device. The silicon wafer cleaning apparatus includes two cleaning components. Since these two cleaning components can clean the surface of the silicon wafer using polishing and sweeping methods respectively, the silicon wafer cleaning apparatus including these two cleaning components possesses different levels of cleaning capability to meet the cleaning requirements for different types of contaminants. This effectively removes strongly adhering contaminants while avoiding unnecessary over-cleaning. Furthermore, because the two cleaning components can alternately contact the silicon wafer through relative movement, the silicon wafer cleaning apparatus can dynamically switch between different cleaning modes according to cleaning needs, significantly improving cleaning efficiency. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a brush provided in an embodiment of this disclosure.

[0026] Figure 2 for Figure 1 A diagram showing the bottom of the brush.

[0027] Figure 3 A half-sectional view of a silicon wafer cleaning apparatus provided in an embodiment of this disclosure.

[0028] Figure 4 This is a cross-sectional schematic diagram of a silicon wafer cleaning apparatus provided in an embodiment of this disclosure.

[0029] Figure 5 A cross-sectional schematic diagram of a silicon wafer cleaning apparatus provided for another embodiment of this disclosure.

[0030] Figure 6 This is a bottom schematic diagram of a silicon wafer cleaning apparatus provided in an embodiment of this disclosure.

[0031] Figure 7 A cross-sectional schematic diagram of a portion of a silicon wafer cleaning apparatus provided in an embodiment of this disclosure.

[0032] Figure 8 A cross-sectional schematic diagram of a silicon wafer cleaning apparatus provided for another embodiment of this disclosure.

[0033] Figure 9A cross-sectional schematic diagram of a silicon wafer cleaning apparatus provided in yet another embodiment of this disclosure.

[0034] Figure 10 This is a schematic diagram of a silicon wafer cleaning device provided in an embodiment of this disclosure. Detailed Implementation

[0035] The technical solutions in this disclosure will now be clearly and completely described with reference to the accompanying drawings.

[0036] During silicon wafer processing, the wafers require multiple cleaning cycles to ensure surface quality and meet the requirements of subsequent processes. The main purpose of cleaning is to remove various contaminants accumulated during processing, including particulate impurities, chemical residues, metal ions, and other organic or inorganic contaminants. After each processing step, the surface of the silicon wafer may acquire new impurities due to exposure to different environments and process media; therefore, multiple cleaning cycles are crucial.

[0037] For example, in the final polishing (FP) process, if the equipment malfunctions, the silicon wafer surface may be exposed to residual polishing slurry for an extended period. This can cause particles in the polishing slurry to crystallize, forming raised crystals on the wafer surface. Although continuing FP operations on these wafers can largely remove these crystals, a small amount may still remain on the front side of the wafer. Furthermore, since the FP process typically only targets the front side of the wafer, the back side is not processed or polished, so the crystals remaining on the back side cannot be eliminated. Once these crystals form, they can cause a series of problems during the subsequent use of the wafer. For example, raised crystals on the back side of the wafer can prevent it from being placed flat in subsequent manufacturing processes.

[0038] To address the aforementioned issues, a cleaning step has been proposed in this field to be added after the FP process. In this cleaning step, a brush is used in conjunction with a cleaning solution such as pure water or a specific chemical solution to remove foreign matter from the silicon wafer surface, such as contaminants, particles, and residues. Figure 1 and Figure 2The diagram illustrates a brush 1 provided in some embodiments of the present disclosure. The brush 1 is generally disc-shaped and includes a body 11 and a brush portion 12. The brush portion 12 is disposed on a circular surface of the disc-shaped body and has a generally flat cleaning surface 12A. The brush portion 12 may be made of a flexible material, such as PVC, to avoid scratching the silicon wafer surface while cleaning. When using the brush 1, the flat cleaning surface 12A of the brush portion 12 of the brush 1 contacts the surface of the silicon wafer to be cleaned, and a certain pressure is applied to the surface of the silicon wafer to be cleaned by rotating the brush 1 about its axis, thereby achieving the purpose of cleaning the silicon wafer surface. During the above cleaning process, a cleaning liquid can be supplied to the surface of the silicon wafer to be cleaned to improve the cleaning ability.

[0039] However, the inventors noticed during the production process that the above-mentioned cleaning method might suffer from low removal efficiency when encountering highly adhesive foreign objects, such as crystals caused by polishing fluid. This is because the brush part 12 of the brush 1 is too soft and insufficient to remove highly adhesive foreign objects. Although multiple cleanings help reduce the residue of foreign objects, even with a strong cleaning solution, it is impossible to achieve the desired cleaning effect for foreign objects with strong adhesion.

[0040] Furthermore, as mentioned above, the main focus in this field has been on cleaning the front side of silicon wafers, with less emphasis on cleaning the back side. Moreover, the back side of silicon wafers often contains more highly adhesive foreign matter due to the lack of a fine polishing process. Through practical experience, the inventors have discovered that contaminants remaining on the back side of silicon wafers can negatively impact product performance and stability during subsequent use. For example, impurities and residues on the back side of the wafer can cause problems such as unstable equipment clamping and poor back-side contact, further affecting process accuracy and product reliability. Therefore, ensuring thorough cleaning of both the front and back sides of silicon wafers is crucial for improving manufacturing process quality and product performance.

[0041] Therefore, some embodiments of this disclosure provide a silicon wafer cleaning apparatus, silicon wafer cleaning equipment, and silicon wafer cleaning method. The silicon wafer cleaning apparatus combines polishing and sweeping methods and can dynamically switch between these two methods, thereby flexibly meeting different cleaning requirements.

[0042] The embodiments of this disclosure are described in detail below with reference to the accompanying drawings.

[0043] See Figure 3 Some embodiments of this disclosure provide a silicon wafer cleaning apparatus 2. The silicon wafer cleaning apparatus 2 may include a base 21, a first cleaning component 22 connected to the base 21, and a second cleaning component 23. The first cleaning component 22 is used to clean the surface of the silicon wafer by polishing. The second cleaning component 23 is used to clean the surface of the silicon wafer by sweeping.

[0044] At least one of the first cleaning component 22 and the second cleaning component 23 is configured to be movable relative to the other to selectively enable only one of the first cleaning component 22 and the second cleaning component 23 to contact the surface of the silicon wafer.

[0045] The base 21 provides necessary stable support for the various components of the silicon wafer cleaning device 2 and facilitates the connection of the cleaning components to other devices such as robotic arms. The base 21 may be generally cylindrical or may be other shapes, which are not limited in this disclosure.

[0046] The first cleaning component 22 and the second cleaning component 23 can be disposed on the same side of the base 21. For example... Figure 3 and Figure 4 As shown, the first cleaning component 22 and the second cleaning component 23 can be disposed on the underside of the base 21 and extend from the lower surface of the base 21 in a direction substantially perpendicular to the lower surface of the base 21. For each of the first cleaning component 22 and the second cleaning component 23, one end is connected to the base 21, and the other end, that is, the end furthest from the base 21, serves as the cleaning end for performing the cleaning operation. Figure 3 and Figure 4 In the middle, the lower ends of the first cleaning component 22 and the second cleaning component 23 are the cleaning ends.

[0047] The two cleaning components can perform cleaning operations in different ways. The first cleaning component 22 can remove foreign matter from the surface of the silicon wafer by polishing, grinding, or grinding, especially foreign matter with strong adhesion, such as polishing fluid crystals and highly adhesive residues. The second cleaning component 23 can remove particulate contaminants or less adhesive impurities from the surface of the silicon wafer by sweeping.

[0048] The combination of two cleaning components gives the silicon wafer cleaning device 2 a significant advantage over the brush 1. The first cleaning component 22 can remove strongly adhering contaminants, making up for the insufficient cleaning power of the brush 1, while the second cleaning component 23 can quickly remove lightly adhering contaminants, avoiding unnecessary over-cleaning and improving the overall cleaning efficiency of the silicon wafer cleaning device 2.

[0049] One of the first cleaning component 22 and the second cleaning component 23 can be configured to move relative to the other, or both the first cleaning component 22 and the second cleaning component 23 can move relative to each other, thus achieving two positional relationships relative to each other. These two positional relationships are respectively... Figure 3 and Figure 4 As exemplarily shown in the figure.

[0050] exist Figure 3In this configuration, compared to the first cleaning component 22, the second cleaning component 23 extends further from the lower surface of the base 21. In this state, as the silicon wafer cleaning device 2 continuously approaches the surface of the silicon wafer to be cleaned in order to clean it, only the cleaning end of the second cleaning component 23, i.e., Figure 3 The lower end of the second cleaning component 23 can contact the surface of the silicon wafer to be cleaned, while the cleaning end of the first cleaning component 22 cannot contact the silicon wafer. Therefore, based on Figure 3 The positional relationship between the first cleaning component 22 and the second cleaning component 23 is shown in the figure, and only the second cleaning component 23 can perform the cleaning operation.

[0051] exist Figure 4 In this configuration, compared to the second cleaning component 23, the first cleaning component 22 extends further from the lower surface of the base 21. In this state, as the silicon wafer cleaning device 2 continuously approaches the surface of the silicon wafer to be cleaned in order to clean it, only the cleaning end of the first cleaning component 22, i.e., Figure 3 The lower end of the first cleaning component 22 can contact the surface of the silicon wafer to be cleaned, while the cleaning end of the second cleaning component 23 cannot contact the silicon wafer. Therefore, based on Figure 3 The positional relationship between the first cleaning component 22 and the second cleaning component 23 shown in the figure indicates that only the first cleaning component 22 can perform the cleaning operation.

[0052] By changing the extension length of the first cleaning component 22 and the second cleaning component 23 from the base 21 through relative movement, flexible switching can be achieved for different types of contaminants and cleaning needs. This allows the cleaning device to select an appropriate cleaning method based on the surface conditions of different silicon wafers, such as the type and intensity of adhering contaminants, enhancing the flexibility and applicability of the equipment. Furthermore, the switching method allows the polishing mode of the first cleaning component and the cleaning mode of the second cleaning component to be executed independently, ensuring cleaning efficiency and avoiding unnecessary interference and resource waste.

[0053] Some embodiments of this disclosure provide a silicon wafer cleaning apparatus 2. This silicon wafer cleaning apparatus 2 includes two cleaning components. Since these two cleaning components can clean the surface of the silicon wafer using polishing and sweeping methods respectively, the silicon wafer cleaning apparatus including these two cleaning components possesses different levels of cleaning capability to meet the cleaning requirements for different types of contaminants. This effectively removes strongly adhering contaminants while avoiding unnecessary over-cleaning. Furthermore, since the two cleaning components can alternately contact the silicon wafer through relative movement, the silicon wafer cleaning apparatus is allowed to dynamically switch between different cleaning modes according to cleaning needs, performing cleaning operations independently without interfering with each other, ensuring cleaning efficiency and avoiding unnecessary interference and resource waste.

[0054] In order to enable movement of the first cleaning component 22 and / or the second cleaning component 23 relative to each other, according to some embodiments of the present disclosure, the silicon wafer cleaning device 2 may include a drive unit 24 connected to at least one of the first cleaning component 22 and the second cleaning component 23.

[0055] See Figure 5 The drive unit 24 can be disposed in the base 2 and can be connected to at least one of the first cleaning component 22 and the second cleaning component 23. That is, the drive unit 24 can be connected to the first cleaning component 22 or the second cleaning component 23, or the drive unit 24 can be connected to both the first cleaning component 22 and the second cleaning component 23, so as to drive the connected component to move accordingly.

[0056] As an example, the drive unit 24 may include a motor and a guide rail to drive the first cleaning component 22 and / or the second cleaning component 23 to move linearly along the guide rail. Alternatively, the drive unit 24 may also include other drive or transmission components such as cylinders, hydraulic cylinders, worm gears, etc., as long as they enable the movement of the cleaning components, and this disclosure is not limited thereto.

[0057] In addition, the drive unit 24 may also include a mechanical locking or limit function to prevent the cleaning component from moving accidentally due to external vibration or drive misoperation when a cleaning component is in the working position, thereby making the operation of the cleaning component in the working position more stable and also preventing the non-working cleaning component from entering the cleaning state.

[0058] The drive unit 24 can automatically switch the cleaning mode of the silicon wafer cleaning device 2, and can also make the state of the two cleaning components more stable when performing cleaning operations.

[0059] According to further embodiments of this disclosure, see Figure 5 The first cleaning component 22 may include a cleaning part 22A and a connecting rod 22B. One end of the connecting rod 22B is connected to the cleaning part 22A and the other end of the connecting rod is connected to the drive part 24, so that the drive part 24 can drive the cleaning part 22A to move away from and toward the base 21 via the connecting rod 22B.

[0060] The cleaning unit 22A, as the core component of the first cleaning assembly 22, can directly perform the cleaning task on the surface of the silicon wafer. The connecting rod 22B is used to transmit the driving force provided by the driving unit 24. Therefore, in this embodiment, at least the first cleaning assembly 22 is capable of moving relative to the second cleaning assembly 23 between a working position and a non-working position, thereby switching the cleaning mode of the silicon wafer cleaning device 2.

[0061] by Figure 5For example, connecting rod 22B is vertically arranged in the silicon wafer cleaning device 2. The lower end of connecting rod 22B is fixedly connected to the cleaning section 22A, while the upper end is connected to the drive section 24 via a transmission mechanism. The drive section 24 can push or pull the cleaning section 22A through connecting rod 22B, achieving precise movement of the cleaning section 22A. Figure 5 In the text, the phrase "moving in a direction away from and toward the base 21" can refer to moving in a vertical direction relative to the lower side of the base 21.

[0062] The force transmitted from the drive unit 24 by the connecting rod 22B enables more stable and precise movement of the cleaning unit 22A. That is, the cleaning unit 22A can move within a predetermined range along a preset path, ensuring the effectiveness of the cleaning operation. In particular, the cleaning requirements for silicon wafers of different thicknesses can be met by adjusting the range of movement of the cleaning unit 22A. Furthermore, this force transmission structure is simple and direct, reducing unnecessary energy loss.

[0063] Given that the silicon wafer cleaning device 2 can rotate about its own central axis and / or translate on the surface of the silicon wafer during the cleaning operation, therefore, in some embodiments of this disclosure, see Figure 6 The cleaning section 22A can be cross-shaped, and the cross shape and the base 21 can be arranged concentrically, so that when the silicon wafer cleaning device 2 rotates around its own central axis, the cross-shaped cleaning section 22A can also rotate around its center, thereby maximizing the coverage of the surface of the silicon wafer being cleaned.

[0064] like Figure 6 As shown, the cross-shaped structure of the cleaning section 22A can extend in four directions. Understandably, this significantly improves the surface coverage of the silicon wafer by the cleaning section 22A. Especially when cleaning large-diameter silicon wafers, the cross shape effectively covers the center and edge areas, reducing blind spots. The concentric arrangement of the cleaning section 22A and the base 21 allows for a more uniform distribution of cleaning force on the silicon wafer surface, avoiding localized over-cleaning or under-cleaning due to uneven force. In particular, the symmetry of the cross-shaped structure reduces vibration or deformation caused by force imbalance during the cleaning section's movement, thereby improving the stability and durability of the cleaning section 22A under high-intensity operation.

[0065] Since the first cleaning component 22 cleans the surface of the silicon wafer through polishing, it is also prone to wear and tear after use. Frequent replacement or repair of the first cleaning component 22 not only affects work efficiency but also poses a threat to the overall stability of the silicon wafer cleaning device 2. Considering this problem, the inventors propose a modular design for the first cleaning component 22, particularly the cleaning section 22A. Specifically, in some embodiments of this disclosure, see... Figure 7The cleaning unit 22A may include a bracket 221 and a polishing unit 222 that is removably connected to the bracket 221.

[0066] The bracket 221 can serve as the main body of the cleaning unit 22A, providing stable support and connection to the connecting rod 22B. The polishing unit 222 is used to actually perform the polishing cleaning task. As an example, the polishing unit 222 can be removably connected to the bracket 221 through snap-fit, threaded connection, magnetic attraction, or other means. This disclosure does not limit this.

[0067] Since the polishing section 222 directly contacts the surface of the silicon wafer when the first cleaning assembly 22 performs the cleaning task, only the polishing section 222 is worn. With this structure, the polishing section 222 can be easily disassembled, replaced, or cleaned according to cleaning needs, quickly restoring the cleaning function of the first cleaning assembly 22. More importantly, the polishing section 222 can be designed as a module to adapt to different silicon wafer cleaning needs. For example, polishing sections 222 with different functions or materials can be easily replaced according to the type of contaminants on the silicon wafer or the requirements of the cleaning task, thereby improving the applicability of the silicon wafer cleaning device 2.

[0068] In some embodiments of this disclosure, the second cleaning component 23 may have a lower hardness than the first cleaning component 22.

[0069] The lower-hardness second cleaning component 23 is advantageous for gently cleaning particles or lightly adhering contaminants on the silicon wafer surface, avoiding surface damage caused by excessive cleaning force. In contrast, the higher-hardness first cleaning component 22 is suitable for applying greater cleaning force to stubborn contaminants, ensuring cleaning effectiveness. As an example, the first cleaning component 22, particularly the cleaning part 22A of the first cleaning component 22, can be made of PET material; for example, the cleaning part 22A can be made of the same material as the polishing pad used for double-sided polishing of the silicon wafer. The second cleaning component 23 can be made of PVC sponge; for example, the second cleaning component 23 can be made of the same material as the brush used for final polishing cleaning.

[0070] To further enhance the automation level of silicon wafer cleaning device 2, see [link to relevant documentation]. Figure 8 The silicon wafer cleaning device may also include a control unit 25 connected to the drive unit 24.

[0071] In actual production, the silicon wafer cleaning device 2 may need to perform two cleaning modes for the same silicon wafer. The control unit 25 can control the drive unit 24 to drive the two cleaning components to perform cleaning operations alternately in a predetermined sequence according to a predetermined cleaning strategy, and can also control the cleaning time of each cleaning component, thus avoiding manual intervention during the cleaning process.

[0072] As an example of a cleaning strategy, the control unit 25 can control the drive unit 24 to drive the first cleaning component 22 to clean the surface of the silicon wafer, and after the first cleaning component 22 has cleaned the surface of the silicon wafer, drive the second cleaning component 23 to clean the surface of the silicon wafer.

[0073] Based on the above example, the cleaning operation performed by the silicon wafer cleaning device 2 can be divided into two stages. The control unit 25 can sense the cleaning status of the first cleaning component 22, such as a completion signal, and switch the operation of the drive unit 24 to sequentially drive the second cleaning component 23 to perform the cleaning task. After the cleaning task is completed, the control unit 25 can return to its initial state, awaiting the start of the next cleaning cycle.

[0074] The control unit 25 reduces repetitive operations and makes the cleaning process more efficient by controlling the two cleaning components to perform polishing and sweeping cleaning in sequence. Furthermore, polishing prioritizes the removal of strongly adhering contaminants, providing a cleaner surface condition for the sweeping components to remove residual particles, thus enhancing the overall cleaning effect. By coordinating the working sequence of the two cleaning methods, the control unit 25 fully leverages the advantages of polishing and sweeping, achieving a synergistic effect in cleaning both mechanical and particulate contaminants, thereby significantly improving the surface smoothness and particle cleanliness of the silicon wafer.

[0075] According to some embodiments of this disclosure, see Figure 9 The silicon wafer cleaning device 2 may also include a supply device 26 for supplying cleaning fluid.

[0076] The cleaning solution works synergistically with the first cleaning component 22 and the second cleaning component 23 to enhance the removal of strongly adhering contaminants and particulate impurities. The chemical solution dissolves or decomposes contaminants that are difficult to remove mechanically. The supply device 26 ensures consistent cleaning across all areas of the silicon wafer surface by uniformly spraying the cleaning solution, avoiding inadequate localized cleaning. Furthermore, the cleaning solution reduces surface damage caused by mechanical friction, providing protection, especially for precision-machined silicon wafer surfaces such as the front side.

[0077] See Figure 10 Some embodiments of this disclosure also provide a silicon wafer cleaning apparatus 3. The silicon wafer cleaning apparatus 3 may include: the silicon wafer cleaning device 2 described above; and a drive module 31 for driving the silicon wafer cleaning device 2 to rotate and translate.

[0078] In some embodiments of this disclosure, such as Figure 10 As shown, the silicon wafer cleaning device 3 may include two silicon wafer cleaning devices 2 arranged opposite to each other for simultaneously cleaning the front and back sides of the silicon wafer S.

[0079] As mentioned above, the back side of silicon wafer S typically does not undergo a final polishing process, making it prone to harboring a significant amount of highly adhesive foreign matter. By employing... Figure 10 The structure shown allows the two silicon wafer cleaning devices 2 to operate synchronously, ensuring a high level of cleanliness on both the front and back sides of the silicon wafer S. The cleaning of the back side of the silicon wafer by the silicon wafer cleaning device 2 effectively removes particles and strongly adhering contaminants, preventing problems such as unstable clamping or poor contact, and ensuring the stability of subsequent processes.

[0080] Furthermore, the two silicon wafer cleaning devices 2 can be controlled independently. This means that the two silicon wafer cleaning devices 2 can each select different cleaning methods, such as sweeping the front side and polishing the back side, thereby meeting the different cleaning needs of the front and back sides of the silicon wafer.

[0081] Some embodiments of this disclosure also provide a silicon wafer cleaning method. This silicon wafer cleaning method is performed using the silicon wafer cleaning apparatus 3 described above.

[0082] In some embodiments of this disclosure, the silicon wafer cleaning method may include: driving the first cleaning component 22 of the silicon wafer cleaning device 2 of the silicon wafer cleaning equipment 3 to clean the surface of the silicon wafer S, and after the first cleaning component 22 has cleaned the surface of the silicon wafer S, driving the second cleaning component 23 of the silicon wafer cleaning device 2 to clean the surface of the silicon wafer.

[0083] It should be noted that the technical solutions described in this disclosure can be combined arbitrarily as long as they do not conflict.

[0084] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A silicon wafer cleaning apparatus, characterized by comprising: The silicon wafer cleaning device comprises: a base; a first cleaning assembly and a second cleaning assembly connected to the base, wherein the first cleaning assembly is configured to clean the surface of a silicon wafer by means of polishing, and the second cleaning assembly is configured to clean the surface of the silicon wafer by means of sweeping; wherein at least one of the first cleaning assembly and the second cleaning assembly is configured to be movable relative to the other, so as to selectively enable only one of the first cleaning assembly and the second cleaning assembly to be in contact with the surface of the silicon wafer, the silicon wafer cleaning device comprises a driving portion connected to at least one of the first cleaning assembly and the second cleaning assembly, the first cleaning assembly comprises a cleaning portion and a connecting rod, one end of the connecting rod is connected to the cleaning portion, and the other end of the connecting rod is connected to the driving portion, so that the driving portion can drive the cleaning portion to move away from and towards the base via the connecting rod, the cleaning portion is in the shape of a cross, and the cross is arranged concentrically with the base.

2. The silicon wafer cleaning apparatus of claim 1, wherein The cleaning portion comprises a support and a polishing portion removably connected to the support.

3. The silicon wafer cleaning apparatus of claim 2, wherein The second cleaning assembly has a hardness smaller than that of the first cleaning assembly.

4. The silicon wafer cleaning apparatus of claim 2, wherein The silicon wafer cleaning device further comprises a control portion connected to the driving portion.

5. The silicon wafer cleaning apparatus of claim 4, wherein The control portion controls the driving portion to drive the first cleaning assembly to clean the surface of a silicon wafer, and after the first cleaning assembly finishes cleaning the surface of the silicon wafer, the control portion controls the driving portion to drive the second cleaning assembly to clean the surface of the silicon wafer.

6. The silicon wafer cleaning apparatus of claim 1 or 2, wherein The silicon wafer cleaning device further comprises a supply device for supplying a cleaning liquid.

7. A silicon wafer cleaning apparatus, characterized by comprising: The silicon wafer cleaning device comprises: the silicon wafer cleaning device according to any one of claims 1 to 6; a driving module for driving the silicon wafer cleaning device to rotate and translate.

8. The silicon wafer cleaning apparatus of claim 7, wherein The silicon wafer cleaning device comprises two silicon wafer cleaning devices arranged opposite to each other, for simultaneously cleaning the front and back surfaces of a silicon wafer.

9. A method of cleaning a silicon wafer, characterized by, The silicon wafer cleaning method is performed by using the silicon wafer cleaning device according to claim 7.

10. The method of claim 9, wherein the cleaning solution is applied to the silicon wafer at a temperature of about 20°C to about 60°C. The silicon wafer cleaning method comprises: driving a first cleaning assembly of a silicon wafer cleaning device of the silicon wafer cleaning device to clean the surface of a silicon wafer, and after the first cleaning assembly finishes cleaning the surface of the silicon wafer, driving a second cleaning assembly of the silicon wafer cleaning device to clean the surface of the silicon wafer.

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