Wafer decoding device and use method thereof

Abstract

The invention provides a wafer decoding device and a use method thereof, the wafer decoding device comprises a cabinet body, a support, a clamping mechanism, a switching mechanism, a plurality of electrode connecting seats, a cover body and a wind screen mechanism, the cabinet body is arranged on the ground; the support is arranged on the side, away from the ground, of the cabinet body. A station hole is formed in the center of the cabinet body. The clamping mechanism is arranged on the bracket and is used for transferring and clamping the wafer; the switching mechanism is arranged in the cabinet body and used for selectively switching the electrode connecting seats, and the telescopic ends stretch out and draw back to enable the electrode connecting seats to stretch into the station holes; a first inner cavity and a second inner cavity are formed in the electrode connecting base, the clamping mechanism is movably sleeved with the cover body, and the cover body abuts against the interior of the second inner cavity, so that the electrode connecting base is closed; the device does not need to replace a test clamping seat, can adapt to wafers of different batches and types for decoding test, enables the decoding process to be in a closed environment, can cool the contact surface of a wafer electrode and a probe, and improves the efficiency and stability of wafer decoding.

Description

Technical Field

[0001] The present invention relates to the technical field of chip decoding production, and in particular to a chip decoding device and a use method thereof. Background Art

[0002] The main function of chip decoding equipment is to decode digital signals or coded information on the chip. Chips are usually used to store large amounts of data or information, such as program codes, digital images, audio signals, etc. in integrated circuits. The decoding equipment reads the coded information on the chip and uses the built-in decoding algorithm or logic circuit to convert it into understandable data formats, such as text, images, audio, etc.

[0003] The chip test board, chip test system and chip test method with publication number CN113687206B include a main body, a system including a plurality of first through holes, the first through holes connecting the two sides of the main body; a chip test area, arranged on one side of the main body; and a main signal connector, arranged on the same side of the main body, the main signal connector is used to connect the chip test area without passing through the first through holes; wherein the chip test area connects the chip and tests at least one main signal of the chip through the main signal connector; the chip test area includes: a plurality of test points, arranged on the first surface a of the chip test board, the plurality of test points are distributed and configured around the four sides of the chip test area; a plurality of test needles, arranged on the second surface b of the chip test board, the plurality of test needles are distributed and connected to the plurality of test points; wherein the plurality of first through holes are respectively connected between the plurality of test needles and the plurality of test points.

[0004] Most of the existing chips are tested by placing a single test card holder on a workbench to contact the corresponding chip during the test decoding process. When decoding tests are performed on chips of different batches, the test card holder needs to be replaced continuously, which reduces the test efficiency. In addition, during the test decoding process, a large amount of heat will be generated at the contact point between the probe and the chip electrode, which will affect the stability of the decoding, thereby reducing the efficiency and stability of chip decoding. Summary of the invention

[0005] In view of this, the present invention proposes a chip decoding device and a method of using the same, which can adapt to different batches of chips for decoding testing without replacing the test card holder, and can keep the decoding process in a closed environment. The chip electrode and the probe contact surface can also be cooled, thereby improving the efficiency and stability of chip decoding.

[0006] The technical solution of the present invention is implemented as follows: In the first aspect, the present invention provides a chip decoding device, including a cabinet, a bracket, a clamping mechanism, a switching mechanism, a plurality of electrode connection seats, a cover body and a wind screen mechanism, wherein:

[0007] The cabinet is set on the ground and is hollow inside;

[0008] The bracket is arranged on a side of the cabinet away from the ground, and a work station hole is opened at the center of the cabinet;

[0009] The clamping mechanism is arranged on the bracket and is used for transporting and clamping the wafer;

[0010] The switching mechanism is arranged in the cabinet, and the switching mechanism has a plurality of evenly distributed telescopic ends, and the plurality of telescopic ends can rotate circumferentially;

[0011] A plurality of electrode connection seats are respectively arranged on the telescopic ends of each switching mechanism, and the plurality of telescopic ends rotate circumferentially to selectively switch the electrode connection seats, and the telescopic ends are telescoped to extend into the station holes;

[0012] The electrode connection seat is provided with a first inner cavity and a second inner cavity, the first inner cavity and the second inner cavity are arranged at an interval, the wafer is placed in the matching first inner cavity, a plurality of electrode probe groups are arranged in the first inner cavity, one end of the electrode probe group is in contact with the electrode of the wafer, and the other end is connected to the external coding port;

[0013] The cover body is movably sleeved on the outside of the clamping mechanism and is provided with an opening toward the cabinet body. The cover body abuts against the second inner cavity to seal the electrode connection seat.

[0014] The wind screen mechanism is arranged in a ring inside the cover body and is located at the opening of the cover body. The wind screen mechanism has a plurality of wind holes evenly distributed in a ring shape, and the plurality of wind holes supply air to the clamped wafer side.

[0015] On the basis of the above technical solution, preferably, the clamping mechanism includes a lateral movement component, a pushing component, a positioning component and an image acquisition component, wherein:

[0016] The transverse movement component is arranged on a side of the bracket away from the cabinet, and the transverse movement component has a transverse movement end that can move along a horizontal straight line;

[0017] The pushing assembly is arranged on the transverse moving end of the transverse moving assembly, and the pushing mechanism has a pushing end which can move linearly toward the cabinet side;

[0018] The positioning assembly is arranged on the pushing end of the pushing assembly, and the positioning assembly has a plurality of pairs of clamping parts that can move toward each other, and the clamping parts move toward each other to clamp the wafer;

[0019] The image acquisition component is arranged at the center of the side of the positioning component away from the pushing component, and is used for acquiring a picture of the wafer to be grasped.

[0020] On the basis of the above technical solution, preferably, the positioning assembly includes a connecting seat, a driving unit, a cross body, a plurality of pairs of screw rods and a plurality of positioning members, wherein:

[0021] The connecting seat is fixed on the pushing end of the pushing component, and the interior of the connecting seat is hollow;

[0022] The cross body is fixed to a side of the connecting seat away from the pushing assembly, and a plurality of installation cavities arranged opposite to each other are opened on the cross body, and the plurality of installation cavities are evenly distributed in a ring shape along the axis of the cross body;

[0023] A plurality of pairs of screw rods are disposed in oppositely disposed mounting cavities, and the screw rods are rotatably connected in the mounting cavities, and two opposite screw rods are located on the same straight line, and the threads are disposed oppositely;

[0024] A plurality of positioning members are respectively threadedly connected to the outside of each screw rod, and the positioning members are slidably connected in the installation cavity, and the distances between each positioning member and the axis of the cross body are equal, and the positioning members serve as the clamping parts of the positioning assembly;

[0025] The driving unit is arranged in the connecting seat and is located between the multiple pairs of screw rods, and is used for driving the multiple pairs of screw rods to rotate synchronously, so that the multiple positioning members move toward each other to clamp the wafer.

[0026] On the basis of the above technical solution, preferably, the driving unit includes a first motor, a main bevel gear, and a plurality of auxiliary bevel gears, wherein:

[0027] The first motor is fixed in the connecting seat, and the output shaft of the first motor passes through and extends into the cross body;

[0028] The main bevel gear is fixed on the output shaft of the first motor and is located at the center of the cross body;

[0029] A plurality of auxiliary bevel gears are arranged on one side of each lead screw close to the main bevel gear, and the plurality of auxiliary bevel gears are all meshed with the main bevel gear.

[0030] On the basis of the above technical solution, preferably, the pushing assembly includes a mounting seat, a first push rod and a plurality of guide members, wherein:

[0031] The transverse moving assembly is a linear moving module, the mounting seat is fixed on the transverse moving end of the transverse moving assembly, and a plurality of guide holes are opened on the side of the mounting seat facing the cabinet;

[0032] The first push rod is fixed on the mounting seat;

[0033] A plurality of guide members are arranged in each guide hole and are slidably connected to the inner side of the guide hole. One end of the guide member passes through the guide hole and is fixedly connected to the cover body.

[0034] A sliding hole is opened at the axial part of the cover body, and the connecting seat has an upper end and a lower end. The movable end of the first push rod is fixedly connected to the upper end of the connecting seat, and the upper end of the connecting seat is slidably connected in the sliding hole. The diameter of the lower end of the connecting seat is larger than the aperture of the sliding hole. The lower end of the connecting seat is located in the cover body and abuts against the inner wall of the cover body.

[0035] On the basis of the above technical solution, preferably, the switching mechanism includes a second motor, a shaft cylinder and a plurality of second push rods, wherein:

[0036] The shaft cylinder is rotatably connected to the inner side of the cabinet;

[0037] The second motor is arranged on the cabinet, and the output shaft of the second motor is fixedly connected to the axis of the shaft cylinder, so as to drive the shaft cylinder to rotate circumferentially;

[0038] The fixed ends of the second push rods are all arranged on the outside of the shaft cylinder and are evenly distributed in a ring shape along the axis of the shaft cylinder; and the plurality of electrode connection seats are respectively arranged on the movable ends of the second push rods.

[0039] On the basis of the above technical scheme, preferably, the axis center of the work station hole and the axis center of the shaft cylinder are on the same straight line, and the outer contour shape of the electrode connecting seat matches the inner contour shape of the work station hole; a plurality of pads are also arranged in the first inner cavity, and the chip is placed on the plurality of pads, and a ventilation hole connected to the second inner cavity is opened on the outer side of the first inner cavity, and the cover body abuts against the second inner cavity, and the wind hole of the wind screen mechanism corresponds to the position of the ventilation hole.

[0040] On the basis of the above technical solution, preferably, each electrode probe group includes a probe, an elastic member and a limiting plate, wherein:

[0041] The electrode connection seat is provided with a plurality of insertion holes;

[0042] The elastic member is fixed between the electrode connection seat and the limiting plate, and the position of the elastic member is set corresponding to the position of the insertion hole;

[0043] The probe is fixed at the axis of the limiting plate, and one end of the probe passes through the elastic member and the insertion hole in sequence and extends into the first inner cavity. The height of the probe extending into the first inner cavity is greater than the height of the pad.

[0044] On the basis of the above technical solution, preferably, it also includes a feeding conveyor belt, a plurality of loading trays and a discharging conveyor belt, wherein:

[0045] The feeding conveyor belt and the discharging conveyor belt are respectively arranged on both sides of the cabinet, and the transmission direction is the same as the moving direction of the transverse moving end of the transverse moving component. The feeding conveyor belt and the discharging conveyor belt are both crawler conveyor belts;

[0046] A plurality of loading trays are arranged on the connecting shafts of the feeding conveyor belt and the discharging conveyor belt, and the plurality of loading trays are arranged at intervals, and the wafers to be decoded are placed on the loading trays, and the central axis of the loading trays is in the same straight line as the central axis of the traverse end;

[0047] The moving distance of the transverse end of the transverse moving component spans between the feed conveyor belt and the discharge conveyor belt, and the transverse moving component has two transverse moving ends, the two transverse moving ends move laterally synchronously, and each transverse moving end is provided with a clamping mechanism, the position of one clamping mechanism corresponds to the position of the electrode connecting seat, and the position of the other clamping mechanism corresponds to the position of the loading plate at the end of the feed conveyor belt, and the distance from the output end face of the feed conveyor belt and the input end face of the discharge conveyor belt to the axial position of the electrode connecting seat is equal.

[0048] In a second aspect, the present invention further provides a method for using a chip decoding device, which is implemented using the above chip decoding device and includes the following steps:

[0049] S1, the feeding conveyor belt drives the loading tray to move toward the cabinet side, stops when it moves to the rightmost end, drives the two loading trays of the lateral movement component to move to the leftmost end, and the clamping mechanism is located at the position corresponding to the loading tray at the rightmost end, and the image acquisition component identifies the type of wafer to be decoded and obtains the corresponding clamping parameter information;

[0050] S2, according to the clamping parameter information, the first motor and the second motor are driven to operate respectively, the first motor drives multiple pairs of lead screws to rotate synchronously, so that multiple positioning members move toward each other to clamp the wafer to be decoded, the second motor drives the shaft cylinder to rotate, so that the electrode connection seat corresponding to the to-be-decoded is rotated to correspond to the station hole, and the second push rod pushes the electrode connection seat corresponding to the to-be-decoded to extend out of the station hole;

[0051] S3, the traverse assembly drives the two traverse ends to move to the rightmost side, and moves the clamped wafer to be decoded downward and places it on the pad of the first inner cavity. After placement, the two traverse ends of the traverse assembly are driven to move to the leftmost side again. At this time, the clamping mechanism on the left clamps the wafer to be decoded in the loading tray below, and the clamping mechanism on the right positions and clamps the wafer to be decoded in the first inner cavity below. The electrode of the wafer to be decoded abuts against the electrode probe group, so that the decoding circuit is connected to decode the wafer to be decoded;

[0052] S4, the cover moves downward with the clamping mechanism and abuts against the second inner cavity to form a closed space with the electrode connection seat, the wind holes of the wind screen mechanism blow air and enter the first inner cavity along the vent to blow air to cool the bottom of the wafer, and the wind screen mechanism on the other clamping mechanism blocks the air from the opening side of the cover to prevent dust from adhering to the surface of the wafer;

[0053] S5, after the chip to be decoded in the first inner cavity is decoded, the transverse movement component drives the two transverse movement ends to move to the far right, and places the decoded chip on the leftmost loading tray on the discharge conveyor belt, and places the chip to be decoded grabbed on the right side into the first inner cavity, repeating steps S3-S5 to complete the decoding of the chip.

[0054] The chip decoding device and the use method thereof of the present invention have the following beneficial effects compared with the prior art:

[0055] (1) The switching mechanism can flexibly select matching electrode connectors to adapt to different wafers, and then quickly adjust the matching electrode connectors according to different batches of wafers, reducing the time and manpower required to replace the electrode connectors, improving the efficiency of wafer decoding, and combining the precise positioning and transportation of the clamping mechanism to ensure the accurate alignment and electrical connection between the wafer and the electrode probe group. At the same time, the cooperation of the cover and the wind screen mechanism forms a closed and stable environment, effectively reducing external interference and dust adhesion, and improving the accuracy and reliability of decoding, thereby significantly improving production efficiency and decoding quality;

[0056] (2) The synchronous rotation of multiple pairs of first screw rods is achieved through the driving unit, so that the wafer can be clamped from four different directions at the same time during the clamping process, and the wafer can be accurately positioned, thereby improving the stability and accuracy of the clamping process and reducing the complexity and maintenance cost of the transmission system;

[0057] (3) By movably sleeved the cover on the outside of the positioning assembly, different types of electrode connection seats can be clamped and fixed at different heights of the wafer, while also reducing the risk of errors during operation;

[0058] (4) The elasticity and buffering effect of the elastic member can cope with the impact and vibration of the probe when it contacts the electrode point of the chip, which is beneficial to protect the probe and the electrode point on the chip from damage and improve the service life of the equipment. In addition, since the electrodes on the chip may have different heights, the elastic member can make the probe always fit closely with the electrode of the chip and cooperate with the clamping mechanism to keep the chip at the same height position, thereby improving the accuracy and reliability of the test;

[0059] (5) Through the coordinated work of the feeding conveyor belt, the transverse movement assembly and its clamping mechanism, and the unloading conveyor belt, the automatic feeding, clamping, processing and unloading of the wafers are realized, which greatly improves the working efficiency of wafer decoding. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0061] Figure 1 is a three-dimensional diagram of a chip decoding device of the present invention;

[0062] Figure 2 It is a front view of the chip decoding device of the present invention;

[0063] Figure 3 is a side cross-sectional view of a wafer decoding device of the present invention;

[0064] Figure 4 It is a schematic diagram of the connection structure between the clamping mechanism and the cover body of the wafer decoding device of the present invention;

[0065] Figure 5 A cross-sectional view of the electrode connection seat structure of the chip decoding device of the present invention;

[0066] Figure 6 It is a cross-sectional view of the connection between the cover body and the electrode connection seat structure of the chip decoding device of the present invention;

[0067] Figure 7 A three-dimensional diagram of a positioning assembly of a chip decoding device of the present invention;

[0068] Figure 8 It is a schematic diagram of the structure of the driving unit of the chip decoding device of the present invention. DETAILED DESCRIPTION

[0069] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0070] First, as Figure 1-8As shown, the present invention provides a chip decoding device, including a cabinet 1, a bracket 2, a clamping mechanism 3, a switching mechanism 4, a plurality of electrode connection seats 5, a cover body 6 and a wind screen mechanism 7, wherein the cabinet 1 is arranged on the ground and is hollow inside; the bracket 2 is arranged on a side of the cabinet 1 away from the ground, and a work station hole 100 is opened at the center of the cabinet 1; the clamping mechanism 3 is arranged on the bracket 2, and is used to transport and clamp the chip; the switching mechanism 4 is arranged in the cabinet 1, and the switching mechanism 4 has a plurality of evenly distributed telescopic ends, and the plurality of telescopic ends can rotate circumferentially; the plurality of electrode connection seats 5 are respectively arranged on the telescopic ends of the switching mechanism 4, and the plurality of telescopic ends rotate circumferentially to selectively switch the electrode connection seats 5, and the telescopic ends are telescoped to extend into the work station hole 1 00; a first inner cavity 500 and a second inner cavity 510 are provided in the electrode connection seat 5, the first inner cavity 500 and the second inner cavity 510 are arranged at intervals, and the chip is placed in the matching first inner cavity 500, and a plurality of electrode probe groups 501 are provided in the first inner cavity 500, one end of the electrode probe group 501 is abutted against the electrode of the chip, and the other end is connected to the external coding port; the cover body 6 is movably sleeved on the outside of the clamping mechanism 3, and an opening is provided on the side facing the cabinet 1, the cover body 6 abuts against the second inner cavity 510, so that the electrode connection seat 6 is closed; the wind screen mechanism 7 is arranged in the cover body 6 and is located at the opening of the cover body 7, the wind screen mechanism 7 has a plurality of wind holes evenly distributed in a ring shape, and the plurality of wind holes supply air to the clamped chip side.

[0071] It should be noted that the switching mechanism 4 switches the corresponding matching electrode connection seat 5 according to the chip to be decoded, and extends the matching electrode connection seat 5 into the workstation hole 100 through the telescopic end of the switching mechanism 4, so as to realize the selective switching of different electrode connection seats 5, so that the device can flexibly adapt to different types of chips and decoding requirements, thereby improving the production efficiency. The chip to be decoded is clamped by the clamping mechanism 3 and transferred to the first inner cavity 500 for positioning and clamping, so as to ensure that the electrode of the chip is aligned with the electrode probe group 501 in the electrode connection seat 5, so that the electrode probe group 501 abuts against the electrode of the chip to form an electrical connection. The other end is connected to the external encoding port, and the decoding operation is realized by reading the encoding information on the chip to ensure the accuracy of chip decoding. During the movement of the clamping mechanism 3, the cover body 6 cooperates with the second inner cavity 510 of the electrode connecting seat 5 to form a closed environment, reduce external interference, and avoid affecting the chip decoding process. At the same time, the wind screen mechanism 7 can further control the temperature and humidity in the cover body by supplying air, providing a more stable and reliable environment for chip decoding, improving the reliability of decoding, and in the clamping and transportation process, the wind screen mechanism 7 can form a wind screen for the opening of the cover body 6 by supplying air to prevent external dust from adhering to the surface of the chip.

[0072] It can be understood that the wind screen mechanism 7 is an annular air duct, and a connected external pipe is fixed to the outside of the annular air duct. The external pipe is connected to the air outlet of the external air cooling device and is used to blow air into the annular air duct.

[0073] According to this embodiment, the switching mechanism 4 is used to flexibly select a matching electrode connection seat 5 to adapt to different chips. Combined with the precise positioning and transportation of the clamping mechanism 3, the accurate alignment and electrical connection between the chip and the electrode probe group 501 are ensured. At the same time, the cooperation between the cover body 6 and the wind screen mechanism 7 forms a closed and stable environment, which effectively reduces external interference and dust adhesion, improves the accuracy and reliability of decoding, and thus significantly improves production efficiency and decoding quality.

[0074] The clamping mechanism 3 in this embodiment includes a transverse movement component 31, a pushing component 32, a positioning component 33 and an image acquisition component 34, wherein the transverse movement component 31 is arranged on the side of the bracket 2 away from the cabinet 1, and the transverse movement component 31 has a transverse movement end that can move along a horizontal straight line; the pushing component 32 is arranged on the transverse movement end of the transverse movement component 31, and the pushing mechanism 32 has a pushing end that can move straightly toward the cabinet 1 side; the positioning component 33 is arranged on the pushing end of the pushing component 32, and the positioning component 33 has a plurality of pairs of clamping parts that can move toward each other, and the clamping parts move toward each other to clamp the chip; the image acquisition component 34 is arranged at the center of the side of the positioning component 33 away from the pushing component 32, and is used to capture pictures of the chip to be grasped.

[0075] It should be noted that the precise positioning and transportation of the chip in a two-dimensional plane are achieved through the horizontal linear movement of the transverse movement component 31 and the linear propulsion of the pushing component 32; the multiple pairs of clamping parts of the positioning component 33 can move toward each other, accurately clamp the chip, and ensure its stability during the transportation process; at the same time, the image acquisition component 34 is an industrial camera, which can capture pictures of the chip to be grasped in real time, provide accurate visual feedback for the clamping mechanism, and further improve the accuracy of clamping.

[0076] As a preferred embodiment, the positioning assembly 33 in this embodiment includes a connecting seat 331, a driving unit 332, a cross body 333, a plurality of pairs of screw rods 334 and a plurality of positioning members 335, wherein the connecting seat 331 is fixed on the pushing end of the pushing assembly 32, and the interior of the connecting seat 331 is hollow; the cross body 333 is fixed on the side of the connecting seat 331 away from the pushing assembly 32, and a plurality of relatively arranged mounting cavities 3330 are opened on the cross body 333, and the plurality of mounting cavities 3330 are evenly distributed in a ring shape along the axis of the cross body 333; the plurality of pairs of screw rods 334 are respectively arranged in the relatively arranged mounting cavities 3330, and the plurality of relatively arranged mounting cavities 3330 are evenly distributed in a ring shape along the axis of the cross body 333. 330, and the screw rod 334 is rotatably connected in the installation cavity 3330, and the two opposite screw rods 334 are in the same straight line, and the threads are oppositely arranged; a plurality of positioning members 335 are respectively threadedly connected to the outside of each screw rod 334, and the positioning members 335 are slidably connected in the installation cavity 3330, and the distance between each positioning member 335 and the axial center of the cross body 333 is equal, and the positioning member 335 serves as the clamping part of the positioning assembly 33; the driving unit 332 is arranged in the connecting seat 331, and is located between the multiple pairs of screw rods 334, and is used to drive the multiple pairs of screw rods 334 to rotate synchronously, so that the multiple positioning members 335 move toward each other to clamp the chip.

[0077] It should be noted that the connecting seat 331 is fixed on the pushing end of the pushing assembly 32, and serves as the supporting structure of the entire positioning assembly 33. A plurality of relatively arranged mounting cavities 3330 are opened on the cross body 333, which provide space for the installation of the screw rod 334 and the positioning member 335. Multiple pairs of screw rods 334 are arranged in each relatively arranged mounting cavity 3330, and the two relatively screw rods 334 are on the same straight line, and the threads are arranged in opposite directions, so that when the two relatively screw rods rotate synchronously, the positioning members 335 on their outer sides will move toward or away from each other, and the positioning members 335 are respectively threadedly connected to the outer sides of each screw rod 334, and are slidably connected in the mounting cavity 3330, so that they move along the axial direction of the mounting cavity 3330 under the drive of the screw rod 334.

[0078] It can be understood that when the chip needs to be clamped, the driving unit 332 is started and drives multiple pairs of first screw rods 334 to rotate synchronously through the transmission mechanism. Since the threads of the two relative first screw rods 334 are arranged in opposite directions, when they rotate, they will drive their respective positioning members 335 to move toward each other; when the positioning members 335 move to the position in contact with the chip, they clamp the chip, thereby achieving precise positioning and clamping of the chip.

[0079] Specifically, the positioning member 335 in this embodiment is L-shaped, and the number of mounting cavities 3330 is four, and the four mounting cavities 3330 are evenly distributed in a ring shape with the axis of the cross body 333. Therefore, during the clamping process, the chip is clamped from four different directions at the same time to achieve accurate positioning of the chip. At the same time, the positioning member 335 is set in an L shape, which can not only clamp the chip from the side, but also cooperate with the pushing action of the pushing component 32 to clamp and fix the chip from the top. This clamping method is not only stable and reliable, but also can adapt to chips of different sizes and shapes, ensuring the stability and accuracy of the chip during transportation.

[0080] As a preferred embodiment, the driving unit 332 in this embodiment includes a first motor 3321, a main bevel gear 3322, and a plurality of secondary bevel gears 3323, wherein the first motor 3321 is fixed in the connecting seat 331, and the output shaft of the first motor 3321 passes through and extends into the cross body 41; the main bevel gear 3322 is fixed on the output shaft of the first motor 3321 and is located at the center of the cross body 333; the plurality of secondary bevel gears 3323 are arranged on one side of each screw rod 334 close to the main bevel gear 3322, and the plurality of secondary bevel gears 3323 are all meshed with the main bevel gear 3322.

[0081] It should be noted that when the first motor 3321 is started, its output shaft begins to rotate and drives the main bevel gear 3322 to rotate. Since the main bevel gear 3322 is meshed with multiple sub-bevel gears 3323, when the main bevel gear rotates, it will drive these sub-bevel gears to rotate synchronously. The rotation of the sub-bevel gears will further drive the respective first screw rods 334 to rotate. Since the threads of the two relative first screw rods 334 are oppositely arranged, when they rotate, they will drive their respective positioning members 335 to move toward or away from each other. When the positioning member 335 moves to a position in contact with the wafer, it will clamp the wafer, thereby achieving precise positioning and clamping of the wafer.

[0082] In this embodiment, the meshing design of the main bevel gear 3322 and the multiple sub-bevel gears 3323 realizes the synchronous rotation of multiple pairs of first screw rods 334, which not only improves the stability and accuracy of the clamping process, but also reduces the complexity and maintenance cost of the transmission system.

[0083] As a preferred embodiment, the pushing assembly 32 in this embodiment includes a mounting seat 321, a first push rod 322 and a plurality of guide members 323, wherein the transverse movement assembly 31 is a linear moving module, the mounting seat 321 is fixed on the transverse movement end of the transverse movement assembly 31, and the mounting seat 321 is provided with a plurality of guide holes on the side facing the cabinet 1; the first push rod 322 is fixed on the mounting seat 321; the plurality of guide members 323 are respectively arranged in each guide hole, and are slidably connected to the inner side of the guide hole, one end of the guide member 323 passes through the guide hole and is fixedly connected to the cover body 6; a sliding hole is provided in the axial direction of the cover body 6, the connecting seat 331 has an upper end and a lower end, the movable end of the first push rod 322 is fixedly connected to the upper end of the connecting seat 331, the upper end of the connecting seat 331 is slidably connected in the sliding hole, the lower end diameter of the connecting seat 331 is larger than the aperture of the sliding hole, the lower end of the connecting seat 331 is located in the cover body 6, and abuts against the inner wall of the cover body 6.

[0084] It should be noted that when the transverse movement assembly 31 is started and moves in a specific direction, the mounting seat 321 and the first push rod 322, the guide member 323 and other components thereon will also move accordingly. Since the guide member 323 is fixedly connected to the cover body 6, the cover body 6 will also move with the movement of the transverse movement assembly. At the same time, the sliding of the guide member 323 in the guide hole ensures the stability and accuracy of the movement of the cover body 6. When the cover body 6 moves to correspond to the second inner cavity 510, the first push rod 322 begins to extend, and its movable end pushes the upper end of the connecting seat 331 to move along the direction of the sliding hole. Since the upper end of the connecting seat 331 is slidably connected in the sliding hole, the positioning assembly 33 and the chip can be smoothly pushed to move toward the inside of the cover body 6. When the bottom end of the cover body 6 abuts against the inner bottom wall of the second inner cavity 510, the first push rod 322 will no longer drive the cover body 6 to move downward. When the first push rod 322 retracts, it drives the connecting seat 331 to move. The lower end of the connecting seat 331 supports the cover body 6 and moves upward synchronously, so that different types of electrode connecting seats 5 can be clamped and fixed at different heights of the chip, while also reducing the risk of errors during operation.

[0085] As a preferred embodiment, the switching mechanism 4 in this embodiment includes a second motor 41, a shaft cylinder 42 and a plurality of second push rods 43, wherein the shaft cylinder 42 is rotatably connected to the inner side of the cabinet 1; the second motor 41 is arranged on the cabinet 1, and the output shaft of the second motor 41 is fixedly connected to the axis of the shaft cylinder 42, so as to drive the shaft cylinder 42 to rotate circumferentially; the fixed ends of the plurality of second push rods 43 are all arranged on the outer side of the shaft cylinder 42, and are evenly distributed in a ring shape along the axis of the shaft cylinder 42; and a plurality of electrode connecting seats 5 are respectively arranged on the movable ends of each second push rod 43.

[0086] It should be noted that when the second motor 41 is started, its output shaft drives the shaft cylinder 42 to rotate. Since the fixed ends of the second push rod 43 are evenly distributed on the outside of the shaft cylinder 42, as the shaft cylinder 42 rotates, the second push rod 43 and the electrode connecting seat 5 on its movable end will also move circumferentially, so that different electrode connecting seats 5 can be switched between the corresponding positions of the work station hole 100, and then the matching electrode connecting seat 5 can be quickly adjusted according to different batches of chips, which reduces the time and manpower required for replacing the electrode connecting seat and improves the efficiency of chip decoding.

[0087] It is understandable that, since the number of electrode connection sockets 5 can be configured according to actual needs, new needs can be met by increasing the number of second push rods 43 and electrode connection sockets 5.

[0088] As a preferred embodiment, the axis of the work station hole 100 in this embodiment is on the same straight line as the axis of the shaft cylinder 42, and the outer contour shape of the electrode connecting seat 5 matches the inner contour shape of the work station hole 100; a plurality of pads 502 are also arranged in the first inner cavity 500, and the chip is placed on the plurality of pads 502, and a ventilation hole 520 connected to the second inner cavity 510 is opened on the outer side of the first inner cavity 500, and the cover body 6 abuts against the second inner cavity 510, and the wind hole of the wind screen mechanism 7 corresponds to the position of the ventilation hole 520.

[0089] It should be noted that a number of pads 502 are arranged in the first inner cavity 500, and the pads 502 are used to support the chip to ensure that the chip remains stable during the test or processing and the test results are not affected by shaking. In addition, the pads 502 maintain a gap between the chip and the inner wall of the first inner cavity 500. The cover body 6 abuts against the second inner cavity 510. When the cover body 6 moves into place, it will tightly cover the vent 520 and the opening of the second inner cavity 510, ensuring the closedness of the airflow and preventing the entry of external dust and impurities. During decoding, the airflow generated by the wind screen mechanism 7 can smoothly enter the first inner cavity 500, thereby achieving effective cooling of the chip. In addition, the power and wind speed of the wind screen mechanism 7 can be adjusted according to actual needs to meet the airflow requirements in different chip tests or processing processes and improve the reliability of chip decoding.

[0090] As a preferred embodiment, each electrode probe group 501 in this embodiment includes a probe 5011, an elastic member 5012 and a limiting plate 5013, wherein a plurality of through holes 530 are provided on the electrode connection seat 5; the elastic member 5012 is fixed between the electrode connection seat 5 and the limiting plate 5013, and the position of the elastic member 5013 is arranged corresponding to the position of the through hole 530; the probe 5011 is fixed at the axis of the limiting plate 5013, and one end of the probe 5011 successively penetrates the elastic member 5012 and the through hole 530 and extends into the first inner cavity 500, and the height of the probe 5011 extending into the first inner cavity 500 is greater than the height of the pad 502.

[0091] It should be noted that the elastic member 5012 provides the necessary elasticity and buffering to cope with the impact and vibration of the probe 5011 when it contacts the electrode point of the chip, which is beneficial to protect the probe 5011 and the electrode point on the chip from damage and improve the service life of the equipment. In addition, since the electrodes on the chip may have different heights, the elastic member 5012 can make the probe 5011 always fit tightly with the electrode of the chip, and cooperate with the clamping mechanism 3 to keep the chip at the same height position, thereby improving the accuracy and reliability of the test.

[0092] In addition, the outer side of the probe 5011 is wrapped with an insulating sleeve, which is made of a material with high insulation performance and has excellent electrical insulation performance. It can effectively prevent current from flowing between the probe 5011 and other non-target areas, thereby ensuring safety during the decoding process.

[0093] The present embodiment also includes a feeding conveyor belt 8, a plurality of loading trays 9 and a discharging conveyor belt 10, wherein the feeding conveyor belt 8 and the discharging conveyor belt 10 are respectively arranged on both sides of the cabinet 1, and the transmission direction is the same as the moving direction of the transverse end of the transverse movement component 31, and the feeding conveyor belt 8 and the discharging conveyor belt 10 are both crawler conveyor belts; a plurality of loading trays 9 are respectively arranged on the connecting shafts of the feeding conveyor belt 8 and the discharging conveyor belt 10, and a plurality of loading trays 9 are arranged at intervals, and the wafers to be decoded are placed on the loading trays 9, and the central axis of the loading tray 9 is aligned with the central axis of the transverse end. In the same straight line; the moving distance of the transverse end of the transverse moving component 31 spans between the feeding conveyor belt 8 and the discharging conveyor belt 10, and the transverse moving component 31 has two transverse moving ends, the two transverse moving ends move laterally synchronously, and each transverse moving end is provided with a clamping mechanism 3, the position of one clamping mechanism 3 corresponds to the position of the electrode connecting seat 5, and the position of the other clamping mechanism 3 corresponds to the position of the loading plate 9 at the end of the feeding conveyor belt 8, and the distance from the output end face of the feeding conveyor belt 8 and the input end face of the discharging conveyor belt 10 to the axial position of the electrode connecting seat 5 is equal.

[0094] It should be noted that the automatic feeding, clamping, processing and discharging of the wafers are realized through the coordinated work of the feeding conveyor belt 8, the traverse assembly 31 and its clamping mechanism 3, the discharging conveyor belt 10 and other components, which greatly improves the automation degree and production efficiency of the system.

[0095] In a second aspect, the present invention further provides a method for using a chip decoding device, which is implemented using the above chip decoding device and includes the following steps:

[0096] S1, the feeding conveyor belt 8 drives the loading tray 9 to move toward the cabinet 1 side, stops when it moves to the rightmost end, drives the two lateral moving ends to move to the leftmost end, and the clamping mechanism 3 is located at the rightmost end of the loading tray 9. The image acquisition component 34 identifies the type of wafer to be decoded and obtains the corresponding clamping parameter information;

[0097] S2, according to the clamping parameter information, the first motor 3321 and the second motor 41 are driven to operate respectively, the first motor 3321 drives the multiple pairs of screw rods 334 to rotate synchronously, so that the multiple positioning members 335 move toward each other to clamp the wafer to be decoded, the second motor 41 drives the shaft cylinder 42 to rotate, so that the electrode connection seat 5 corresponding to the to-be-decoded is rotated to correspond to the station hole 100, and the second push rod 43 pushes the electrode connection seat 5 corresponding to the to-be-decoded to extend out of the station hole 100;

[0098] S3, the traverse assembly 31 drives the two traverse ends to move to the rightmost side, and moves the clamped wafer to be decoded downward and places it on the pad 502 of the first inner cavity 500. After placement, the two traverse ends of the traverse assembly 31 are driven to move to the leftmost side again. At this time, the clamping mechanism 3 on the left clamps the wafer to be decoded in the loading tray 9 below, and the clamping mechanism 3 on the right positions and clamps the wafer to be decoded located below in the first inner cavity 500. The electrode of the wafer to be decoded abuts against the electrode probe group 501, so that the decoding circuit is connected to decode the wafer to be decoded;

[0099] S4, the cover body 6 moves downward with the clamping mechanism 3 and abuts against the second inner cavity 510, forming a closed space with the electrode connection seat 6, and the wind holes of the wind screen mechanism 7 blow air, which enters the first inner cavity 500 along the vent 520 to blow air to cool the bottom of the wafer, and the wind screen mechanism 7 on the other clamping mechanism 3 forms a shield to block the air from the opening side of the cover body 6 to prevent dust from adhering to the surface of the wafer;

[0100] S5, after the chip to be decoded in the first inner cavity 500 is decoded, the transverse movement component 31 drives the two transverse movement ends to move to the far right, and places the decoded chip on the loading tray 9 at the far left end of the discharge conveyor 10, and places the chip to be decoded grabbed on the right side into the first inner cavity 500, repeating steps S3-S5 to complete the decoding of the chip.

[0101] It should be noted that the image acquisition component 34 identifies the type of the wafer to be decoded, obtains the corresponding clamping parameter information, collects the shape, size, and color characteristics of the wafer through an industrial camera, analyzes the collected image through an image processing algorithm, and compares it with a preset wafer type database based on the shape, size, and color characteristics of the wafer to identify the type of wafer. For different types of wafers, due to their different shapes, sizes, materials and other characteristics, the required clamping parameters will also be different. Therefore, after identifying the type of wafer, it is necessary to obtain the clamping parameters corresponding to the type of wafer from the preset clamping parameter database. The clamping parameters include the clamping position and the clamping force. These parameters will be used to guide the subsequent clamping mechanism operation to ensure that the wafer will not be damaged during the clamping process and can be stably clamped. During the clamping process, a pressure sensor is set on the positioning member 335 to monitor the clamping force of the clamping mechanism in real time, and real-time feedback is provided for adjustment to ensure that the wafer can be stably and accurately clamped and processed during the subsequent processing, thereby improving the accuracy and efficiency of decoding.

[0102] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip decoding device, characterized in that: It comprises a cabinet (1), a bracket (2), a clamping mechanism (3), a switching mechanism (4), a plurality of electrode connection seats (5), a cover (6) and a wind screen mechanism (7), wherein: The cabinet (1) is arranged on the ground and is hollow inside; The bracket (2) is arranged on a side of the cabinet (1) away from the ground, and a work station hole (100) is opened at the center of the cabinet (1); The clamping mechanism (3) is arranged on the support (2) and is used for transporting and clamping the wafer; The switching mechanism (4) is arranged in the cabinet (1), and the switching mechanism (4) has a plurality of evenly distributed telescopic ends, and the plurality of telescopic ends can rotate in a circumferential direction; A plurality of electrode connection seats (5) are respectively arranged on the telescopic ends of the switching mechanisms (4); the plurality of telescopic ends rotate circumferentially to selectively switch the electrode connection seats (5); and the telescopic ends are telescoped so as to extend into the workstation holes (100); The electrode connection seat (5) is provided with a first inner cavity (500) and a second inner cavity (510), the first inner cavity (500) and the second inner cavity (510) are arranged at intervals, a wafer is placed in the matching first inner cavity (500), a plurality of electrode probe groups (501) are arranged in the first inner cavity (500), one end of the electrode probe group (501) is in contact with the electrode of the wafer, and the other end is connected to an external coding port; The cover body (6) is movably sleeved on the outside of the clamping mechanism (3) and is provided with an opening facing the cabinet body (1). The cover body (6) abuts against the inside of the second inner cavity (510), so that the electrode connection seat (6) is sealed. The wind screen mechanism (7) is arranged in a ring inside the cover body (6) and is located at the opening of the cover body (7). The wind screen mechanism (7) has a plurality of wind holes evenly distributed in a ring shape, and the plurality of wind holes supply air to the clamped wafer side.

2. The chip decoding device according to claim 1, characterized in that: The clamping mechanism (3) comprises a transverse movement component (31), a pushing component (32), a positioning component (33) and an image acquisition component (34), wherein: The transverse movement component (31) is arranged on a side of the support (2) away from the cabinet (1), and the transverse movement component (31) has a transverse movement end that can move along a horizontal straight line; The pushing assembly (32) is arranged on the transverse moving end of the transverse moving assembly (31), and the pushing mechanism (32) has a pushing end which can move linearly toward the cabinet (1); The positioning component (33) is arranged on the pushing end of the pushing component (32), and the positioning component (33) has a plurality of pairs of clamping parts that can move toward each other, and the clamping parts move toward each other to clamp the wafer; The image acquisition component (34) is arranged at the center of the side of the positioning component (33) away from the pushing component (32) and is used to capture a picture of the wafer to be grasped.

3. The chip decoding device according to claim 2, characterized in that: The positioning assembly (33) comprises a connecting seat (331), a driving unit (332), a cross body (333), a plurality of pairs of screw rods (334) and a plurality of positioning members (335), wherein: The connecting seat (331) is fixed on the pushing end of the pushing assembly (32), and the interior of the connecting seat (331) is hollow; The cross body (333) is fixed to a side of the connecting seat (331) away from the pushing assembly (32), and a plurality of installation cavities (3330) arranged opposite to each other are provided on the cross body (333), and the plurality of installation cavities (3330) are evenly distributed in a ring shape along the axis of the cross body (333); A plurality of pairs of screw rods (334) are disposed in oppositely disposed mounting cavities (3330), and the screw rods (334) are rotatably connected in the mounting cavities (3330), and two opposite screw rods (334) are located on the same straight line and have threads disposed oppositely; A plurality of positioning members (335) are respectively threadedly connected to the outside of each screw rod (334), and the positioning members (335) are slidably connected in the installation cavity (3330), and the distances between each positioning member (335) and the axis of the cross body (333) are all equal, and the positioning members (335) serve as the clamping parts of the positioning assembly (33); The driving unit (332) is arranged in the connecting seat (331) and is located between the multiple pairs of screw rods (334), and is used to drive the multiple pairs of screw rods (334) to rotate synchronously, so that the multiple positioning members (335) move towards each other to clamp the wafer.

4. The chip decoding device according to claim 3, characterized in that: The driving unit (332) comprises a first motor (3321), a main bevel gear (3322), and a plurality of auxiliary bevel gears (3323), wherein: The first motor (3321) is fixed in the connecting seat (331), and the output shaft of the first motor (3321) passes through and extends into the cross body (41); The main bevel gear (3322) is fixed on the output shaft of the first motor (3321) and is located at the center of the cross body (333); The plurality of auxiliary bevel gears (3323) are arranged on one side of each screw rod (334) close to the main bevel gear (3322), and the plurality of auxiliary bevel gears (3323) are all meshed with the main bevel gear (3322).

5. The chip decoding device according to claim 4, characterized in that: The pushing assembly (32) comprises a mounting seat (321), a first push rod (322) and a plurality of guide members (323), wherein: The transverse movement component (31) is a linear movement module, the mounting seat (321) is fixed on the transverse movement end of the transverse movement component (31), and a plurality of guide holes are provided on a side of the mounting seat (321) facing the cabinet (1); The first push rod (322) is fixed on the mounting seat (321); A plurality of guide members (323) are arranged in each guide hole and are slidably connected to the inner side of the guide hole; one end of the guide member (323) passes through the guide hole and is fixedly connected to the cover body (6); A sliding hole is provided in the axial direction of the cover body (6); the connecting seat (331) has an upper end and a lower end; the movable end of the first push rod (322) is fixedly connected to the upper end of the connecting seat (331); the upper end of the connecting seat (331) is slidably connected in the sliding hole; the diameter of the lower end of the connecting seat (331) is larger than the aperture of the sliding hole; the lower end of the connecting seat (331) is located in the cover body (6) and abuts against the inner wall of the cover body (6).

6. The chip decoding device according to claim 1, wherein: The switching mechanism (4) comprises a second motor (41), a shaft cylinder (42) and a plurality of second push rods (43), wherein: The shaft cylinder (42) is rotatably connected to the inner side of the cabinet (1); The second motor (41) is arranged on the cabinet (1), and the output shaft of the second motor (41) is fixedly connected to the axis of the shaft cylinder (42) to drive the shaft cylinder (42) to rotate in a circumferential direction; The fixed ends of the plurality of second push rods (43) are all arranged outside the shaft cylinder (42) and are evenly distributed in a ring shape along the axis of the shaft cylinder (42); and the plurality of electrode connection seats (5) are respectively arranged on the movable ends of the second push rods (43).

7. The chip decoding device according to claim 6, characterized in that: The axis of the work station hole (100) and the axis of the shaft cylinder (42) are on the same straight line, and the outer contour shape of the electrode connecting seat (5) matches the inner contour shape of the work station hole (100); a plurality of pads (502) are also arranged in the first inner cavity (500), and the wafer is placed on the plurality of pads (502), and a ventilation hole (520) connected to the second inner cavity (510) is opened on the outer side of the first inner cavity (500), the cover body (6) abuts against the second inner cavity (510), and the wind hole of the wind screen mechanism (7) corresponds to the position of the ventilation hole (520).

8. The chip decoding device according to claim 7, characterized in that: Each electrode probe group (501) comprises a probe (5011), an elastic member (5012) and a limiting plate (5013), wherein: The electrode connection seat (5) is provided with a plurality of insertion holes (530); The elastic member (5012) is fixed between the electrode connection seat (5) and the limiting plate (5013), and the position of the elastic member (5013) is arranged corresponding to the position of the insertion hole (530); The probe (5011) is fixed at the axis of the limiting plate (5013), and one end of the probe (5011) passes through the elastic member (5012) and the insertion hole (530) in sequence and extends into the first inner cavity (500), and the height of the probe (5011) extending into the first inner cavity (500) is greater than the height of the cushion block (502).

9. The chip decoding device according to claim 5, characterized in that: It also includes a feeding conveyor belt (8), a plurality of loading trays (9) and a discharging conveyor belt (10), wherein: The feeding conveyor belt (8) and the discharging conveyor belt (10) are respectively arranged on both sides of the cabinet (1), and the transmission direction is the same as the moving direction of the transverse movement end of the transverse movement component (31), and the feeding conveyor belt (8) and the discharging conveyor belt (10) are both crawler conveyor belts; A plurality of material loading trays (9) are arranged on the connecting shafts of the feeding conveyor belt (8) and the discharging conveyor belt (10), and the plurality of material loading trays (9) are arranged at intervals, and the wafers to be decoded are placed on the material loading trays (9), and the central axis of the material loading trays (9) is in the same straight line as the central axis of the traverse end; The moving distance of the transverse end of the transverse moving component (31) spans between the feeding conveyor belt (8) and the discharging conveyor belt (10), and the transverse moving component (31) has two transverse moving ends, the two transverse moving ends move laterally synchronously, and each transverse moving end is provided with a clamping mechanism (3), the position of one clamping mechanism (3) corresponds to the position of the electrode connecting seat (5), and the position of the other clamping mechanism (3) corresponds to the position of the loading plate (9) at the end of the feeding conveyor belt (8), and the distances from the output end face of the feeding conveyor belt (8) and the input end face of the discharging conveyor belt (10) to the axial position of the electrode connecting seat (5) are equal.

10. A method for using a chip decoding device, implemented by using the chip decoding device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, the feeding conveyor belt (8) drives the loading tray (9) to move toward the cabinet (1), stops when it moves to the rightmost end, drives the two loading trays (9) to move to the leftmost end, and the clamping mechanism (3) is located at the rightmost end of the loading tray (9) correspondingly, and the image acquisition component (34) identifies the type of the wafer to be decoded and obtains the corresponding clamping parameter information; S2, according to the clamping parameter information, respectively driving the first motor (3321) and the second motor (41) to operate, the first motor (3321) drives the multiple pairs of screw rods (334) to rotate synchronously, so that the multiple positioning members (335) move towards each other to clamp the wafer to be decoded, the second motor (41) drives the shaft tube (42) to rotate, so that the electrode connection seat (5) corresponding to the to-be-decoded is rotated to correspond to the workstation hole (100), and the second push rod (43) pushes the electrode connection seat (5) corresponding to the to-be-decoded to extend out of the workstation hole (100); S3, the lateral movement component (31) drives the two lateral movement ends to move to the rightmost side, and moves the clamped wafer to be decoded downward and places it on the cushion block (502) of the first inner cavity (500). After placement, the two lateral movement ends of the lateral movement component (31) are driven to move to the leftmost side again. At this time, the left clamping mechanism (3) clamps the wafer to be decoded in the loading tray (9) below, and the right clamping mechanism (3) positions and clamps the wafer to be decoded located below in the first inner cavity (500). The electrode of the wafer to be decoded abuts against the electrode probe group (501), so that the decoding circuit is connected to decode the wafer to be decoded; S4, the cover body (6) moves downward along with the clamping mechanism (3) and abuts against the inside of the second inner cavity (510), forming a closed space with the electrode connection seat (6), and the wind holes of the wind screen mechanism (7) blow air, which enters the first inner cavity (500) along the ventilation opening (520) to blow air to cool the bottom of the wafer, and the wind screen mechanism (7) on the other clamping mechanism (3) forms a shield to block the air blowing on the opening side of the cover body (6), thereby preventing dust from adhering to the surface of the wafer; S5, after the chip to be decoded in the first inner cavity (500) is decoded, the transverse movement component (31) drives the two transverse movement ends to move to the rightmost side, and places the decoded chip on the leftmost loading tray (9) on the discharge conveyor belt (10), and places the chip to be decoded grabbed on the right side into the first inner cavity (500), and repeats steps S3-S5 to complete the decoding of the chip.

Images