Sensor module

Abstract

The invention discloses a sensor module which comprises a circuit board and a sensing unit. The circuit board has a first surface, a second surface opposite to the first surface, and a peripheral surface connecting the first surface and the second surface. The first surface is provided with a first grounding part, and the second surface is provided with a second grounding part. The conductive connecting part is continuously arranged on the first surface, the peripheral side surface and the second surface and is in contact with the first grounding part and the second grounding part. The sensing unit is electrically fixed on the first surface. According to the invention, the first grounding part and the second grounding part are connected through the conductive connection part and form a large conductive area together with the conductive connection part, so that the charge dredging speed is accelerated, the anti-electrostatic discharge capability of the sensor module is improved, and electronic elements on the sensing units are protected.

Description

Technical Field

[0001] The present invention relates to a sensor module, and in particular to a sensor module with good anti-static discharge capability. Background Art

[0002] Sensors usually have delicate electronic components. If they are subjected to electric shock (e.g., electrostatic discharge), the electronic components may not work properly or even be damaged. Some sensors are exposed to the user's touch, and the static electricity on the user's body may discharge to the sensor, causing damage to the sensor. In certain sensor usage scenarios, such as fingerprint readers, users will inevitably need to touch the fingerprint reader with their fingers, which greatly increases the chance of electrostatic discharge. Summary of the invention

[0003] In view of the problems in the prior art, an object of the present invention is to provide a sensor module which can enhance the ability to resist electrostatic discharge by using conductive material on the peripheral side of the circuit board to connect the grounds on the upper and lower surfaces of the circuit board together.

[0004] In order to achieve the above-mentioned object, the present invention proposes a sensor module, which includes a circuit board and a sensing unit. The circuit board has a first surface, a second surface opposite to the first surface, and a first peripheral side surface connecting the first surface and the second surface, the first surface is provided with a first grounding portion, and the second surface is provided with a second grounding portion; the circuit board is also provided with a first conductive connecting portion, which is continuously arranged on the first surface, the first peripheral side surface and the second surface and contacts the first grounding portion and the second grounding portion. The sensing unit is electrically fixed on the first surface.

[0005] As an optional technical solution, the first grounding portion and the second grounding portion both extend parallel to the first peripheral side surface.

[0006] As an optional technical solution, the circuit board also has a second circumferential side surface connecting the first surface and the second surface, a third grounding portion is also provided on the first surface, and the third grounding portion extends parallel to the second circumferential side surface, a fourth grounding portion is also provided on the second surface, and the fourth grounding portion extends parallel to the second circumferential side surface, and a second conductive connecting portion is also provided on the circuit board, and the second conductive material is continuously arranged on the first surface, the second circumferential side surface and the second surface and contacts the third grounding portion and the fourth grounding portion.

[0007] As an optional technical solution, the first peripheral side surface and the second peripheral side surface are located on two opposite sides of the circuit board; or, the first peripheral side surface and the second peripheral side surface are located on two adjacent sides of the circuit board.

[0008] As an optional technical solution, the sensor module further includes an insulating upper cover, which completely covers the sensing unit and the circuit board.

[0009] As an optional technical solution, the sensor module further includes a shell, wherein the shell has a containing space and an opening, the circuit board and the sensing unit are contained in the containing space, and there is a gap between the insulating upper cover and the opening.

[0010] As an optional technical solution, the first conductive connection portion at least partially overlaps with the first grounding portion and the second grounding portion respectively.

[0011] As an optional technical solution, the first grounding portion surrounds the sensing unit, and the first conductive connecting portion covers all peripheral side surfaces of the circuit board.

[0012] As an optional technical solution, the first conductive connection portion is made of a different material from the first grounding portion or the second grounding portion.

[0013] As an optional technical solution, a distribution area of ​​the first grounding portion is smaller than a distribution area of ​​the second grounding portion.

[0014] In the sensor module of the present invention, a first grounding portion is provided on the first surface of the circuit board, a second grounding portion is provided on the second surface, and a first conductive connecting portion is provided on the circuit board. The first conductive connecting portion is continuously provided on the first surface, the peripheral side surface and the second surface and connects the first grounding portion and the second grounding portion. In this way, the first grounding portion and the second grounding portion are connected through the conductive connecting portion, and together with the conductive connecting portion, a larger conductive area is formed, which speeds up the charge conduction speed, improves the anti-static discharge capability of the sensor module, and protects the electronic components on the sensing unit.

[0015] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 FIG. 4 is a schematic diagram of a sensor module according to a first embodiment of the present invention.

[0017] Figure 2 for Figure 1 Explosion diagram of the sensor module.

[0018] Figure 3 for Figure 1 Cross-sectional view of the sensor module along line XX.

[0019] Figure 4 for Figure 2 Schematic diagram of the grounding layout of the first surface of the circuit board.

[0020] Figure 5for Figure 2 Schematic diagram of the grounding layout of the second surface of the circuit board.

[0021] Figure 6 FIG. 4 is a schematic diagram of a grounding layout on a first surface of a circuit board according to a second embodiment of the present invention.

[0022] Figure 7 FIG. 4 is a schematic diagram of a grounding layout on the second surface of a circuit board according to a second embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following descriptions of the embodiments refer to the attached drawings to illustrate specific embodiments of the present invention. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0024] See also Figures 1 to 3 (It is not drawn to scale to facilitate observation of some structural features), Figure 1 is a schematic diagram of a sensor module according to a first embodiment of the present invention, Figure 2 for Figure 1 Explosion diagram of the sensor module. Figure 3 for Figure 1 The sensor module 1 according to the first embodiment comprises a housing 10, a circuit board 12, a sensing unit 16 and an insulating cover 18. The housing 10 has a receiving space 102 and an opening 104. The circuit board 12, the sensing unit 16 and the insulating cover 18 are stacked in a vertical direction Dv and received in the receiving space 102. The circuit board 12 has a first surface 122 and a second surface 124 opposite to the first surface 122. The first surface 122 and the second surface 124 are both provided with circuits (not shown). Figure 2 The first surface 122 faces the opening 104 (ie, the opening of the accommodating space 102 ), and the sensing unit 16 is electrically fixed on the first surface 122 . The insulating cover 18 completely covers the sensing unit 16 (the sensing surface 16 a thereof) and the circuit board 12 .

[0025] In addition, if Figure 3As shown, in the first embodiment, the circuit board 12 has a first grounding portion 126 and a third grounding portion 128 on the first surface 122, and the circuit board 12 has a second grounding portion 130 and a fourth grounding portion 132 on the second surface 124. The second grounding portion 130 and the fourth grounding portion 132 are respectively arranged corresponding to the first grounding portion 126 and the third grounding portion 128. Specifically, the second grounding portion 130 is arranged corresponding to the first grounding portion 126, and the fourth grounding portion 132 is arranged corresponding to the third grounding portion 128. In this embodiment, the first grounding portion 126 and the second grounding portion 130 are both adjacent to the first peripheral side surface 134 of the circuit board 12, and the first peripheral side surface 134 is connected between the first surface 122 and the second surface 124. Figure 2 and Figure 3 As shown, the circuit board 12 also has a first conductive connection portion 138 (at Figure 2 The first conductive connection portion 138 is continuously disposed on the first surface 122, the first peripheral side surface 134 and the second surface 124 and contacts the first grounding portion 126 and the second grounding portion 130. The material of the first conductive connection portion 138 is, for example, conductive ink. When making the first conductive connection portion 138, for example but not limited to, the conductive ink is continuously printed and applied on the first surface 122, the first peripheral side surface 134 and the second surface 124. In this way, the first grounding portion 126 and the second grounding portion 130 are connected by the first conductive connection portion 138 at that place (i.e., the side of the circuit board 12 adjacent to the first peripheral side surface 134, in this embodiment) Figure 3 ) together (together with the first conductive connection portion 138) form a larger conductive area, which speeds up the charge conduction speed at that location (i.e., the side of the circuit board 12 adjacent to the first peripheral surface 134); in other words, this structural configuration can enhance the anti-electrostatic discharge capability of the sensor module 1 at that location. In addition, in the first embodiment, the first conductive connection portion 138 at least partially overlaps with the first grounding portion 126 and the second grounding portion 130 respectively; this structural configuration helps to increase the conductivity between the first grounding portion 126 and the first conductive connection portion 138, and between the first conductive connection portion 138 and the second grounding portion 130, which is beneficial to the aforementioned charge conduction. In another embodiment, the first conductive connection portion 138 can also completely cover the first grounding portion 126 and / or the second grounding portion 130.

[0026] Similarly, the third grounding portion 128 and the fourth grounding portion 132 are both adjacent to the second peripheral side surface 136 of the circuit board 12, and the second peripheral side surface 136 is also connected between the first surface 122 and the second surface 124. Figure 2 In the illustrated embodiment, the first peripheral surface 134 and the second peripheral surface 136 are located on opposite sides of the circuit board 12. In another embodiment, the first peripheral surface 134 and the second peripheral surface 136 may be located on adjacent sides of the circuit board 12, but the present invention is not limited thereto. Figure 2 and Figure 3 As shown, the circuit board 12 also has a second conductive connection portion 140 (at Figure 2 The second conductive connection portion 140 is continuously disposed on the first surface 122, the second peripheral side surface 136 and the second surface 124 and contacts the third grounding portion 128 and the fourth grounding portion 132. The material of the second conductive connection portion 140 is, for example, conductive ink. When manufacturing the second conductive connection portion 140, for example but not limited to, the conductive ink is continuously printed and applied on the first surface 122, the second peripheral side surface 136 and the second surface 124. Thus, the third grounding portion 128 and the fourth grounding portion 132 are connected by the second conductive connection portion 140 and are located at that place (i.e., the side of the circuit board 12 adjacent to the second peripheral side surface 136, in this embodiment). Figure 3 The second conductive connection part 140 and the second conductive connection part 140 form a larger conductive area, which speeds up the charge conduction speed at that place (i.e., the side of the circuit board 12 adjacent to the second peripheral surface 136); in other words, this structural configuration can enhance the anti-electrostatic discharge capability of the sensor module 1 at that place. In addition, in the first embodiment, the second conductive connection part 140 overlaps at least partially with the third grounding part 128 and the fourth grounding part 132 respectively; this structural configuration helps to increase the conductivity between the third grounding part 128 and the second conductive connection part 140, and between the second conductive connection part 140 and the fourth grounding part 132, which is conducive to the aforementioned charge conduction. In another embodiment, the second conductive connection part 140 can also completely cover the third grounding part 128 and / or the fourth grounding part 132. In addition, in actual operation, the first conductive connection part 138 and the second conductive connection part 140 are not limited to the same material, for example, they can be made of conductive ink, conductive glue, conductive sheet (such as metal sheet) or other conductive structures (including composite structures).

[0027] In addition, in actual operation, the first grounding portion 126, the second grounding portion 130, the third grounding portion 128 and the fourth grounding portion 132 can be respectively embodied as grounding wires (such as wider wires), grounding planes (such as having a larger area), or a combination thereof in accordance with the circuit layout. Figure 4 , which is a schematic diagram of the grounding layout of the first surface 122 of the circuit board 12. In the first embodiment, the grounding layout on the first surface 122 is a C-shaped grounding layout with one side open, such as a C-shaped configuration with the opening facing upward (with Figure 4From a perspective of FIG. 1 , the grounding layout generally surrounds the sensing unit 16 (whose outline on the first surface 122 is indicated by a chain line). In the grounding layout on the first surface 122, the first grounding portion 126 is at least a grounding portion located on the left side of the circuit board 12 and extending parallel to the first peripheral surface 134, and the third grounding portion 128 is at least a grounding portion located on the right side of the circuit board 12 and extending parallel to the second peripheral surface 136. See also Figure 5 , which is a schematic diagram of the grounding layout of the second surface 124 of the circuit board 12. In the first embodiment, the grounding layout on the second surface 124 is arranged in a square shape, that is, a square-shaped grounding layout. In the grounding layout on the second surface 124, the second grounding portion 130 is at least located on the left side of the circuit board 12 (with Figure 5 The fourth grounding portion 132 is at least a grounding portion located on the right side of the circuit board 12 and extending parallel to the second peripheral side surface 136. Figure 4 and Figure 5 In the first embodiment, the grounding layout on the first surface 122 substantially corresponds to the grounding layout on the second surface 124; Figure 4 As shown in FIG. 1 , the C-shaped grounding layout on the first surface 122 further includes a grounding portion 127 connecting the first grounding portion 126 and the third grounding portion 128. Figure 5 As shown in , the U-shaped grounding layout on the second surface 124 further includes a grounding portion 131 connecting the third grounding portion 128 and the fourth grounding portion 132 , and the grounding portion 127 may correspond to the grounding portion 131 .

[0028] Please also see Figure 4 and Figure 5 . The outline of the conductive connection structure connecting the grounding portion on the first surface 122 and the grounding portion on the second surface 124 is drawn in the figure with a dotted line. In the present embodiment, the conductive connection structure includes a first conductive connection portion 138 and a second conductive connection portion 140, wherein the first conductive connection portion 138 is at least a portion of the conductive connection structure located on the left side of the circuit board 12 and extending parallel to the first peripheral side surface 134, and the second conductive connection portion 140 is at least a portion of the conductive connection structure located on the right side of the circuit board 12 and extending parallel to the second peripheral side surface 136. In the first embodiment, the conductive connection structure is configured in a C-shape as a whole, and the first conductive connection portion 138 and the second conductive connection portion 140 can be made of the same material, but this is not limited to this in actual operation. For example, although the first conductive connection portion 138 and the second conductive connection portion 140 are formed of different materials, the overall structure of the conductive connection structure can still be directly connected, which will not be described in detail.

[0029] As described above, in the sensor module 1, the grounding layout on the first surface 122 (including the first grounding portion 126 and the third grounding portion 128) and the grounding layout on the second surface 124 (including the second grounding portion 130 and the fourth grounding portion 132) together with the conductive connection structure (including the first conductive material 138 and the second conductive material 140) form a larger conductive area to accelerate the charge conduction speed. In addition, in actual operation, fewer electronic components may be arranged on the second surface 124 of the circuit board 12, so that it is easier to arrange a larger grounding area on the second surface 124, so that the aforementioned conductive area for grounding can be further increased, thereby increasing the charge conduction speed. In the first embodiment, the distribution area of ​​the first grounding portion 126 is smaller than the distribution area of ​​the second grounding portion 130. In another embodiment, the distribution area of ​​the third grounding portion 128 may be smaller than the distribution area of ​​the fourth grounding portion 132.

[0030] In addition, the insulating cover 18 is disposed in the opening 104 in a clearance fit manner, that is, there is a gap between the insulating cover 18 and the opening 104, and external static electricity can easily enter the sensor module 1 from the gap and be received by the grounding structure (including the grounding layout with the conductive connection structure) on the circuit board 12. In one embodiment, the periphery of the circuit board 12 (that is, the periphery of the circuit board 12) is closer to the aforementioned gap than other parts. The conductive connection structure covers at least a portion of the periphery of the circuit board 12 (for example, including the first peripheral side surface 134 and the second peripheral side surface 136), which can shorten the distance / path for the external charge to be grounded after being introduced into the circuit board 12, thereby reducing the chance of affecting other electronic components (such as the sensing unit 16).

[0031] In addition, in the first embodiment, the circuit board 12 can be cut from a large piece of circuit board (such as a printed circuit board), so in principle, a gap area G1 (for example, Figure 3), there will be no wire on it to avoid burrs on the edges of conductors such as wires when cutting. In addition, the existence of this gap area G1 limits the area size of the grounding portion and also lengthens the distance / path for external static electricity (for example, the gap between the self-insulating upper cover 18 and the opening 104) to enter the interior of the sensor module 1 and be introduced into the circuit board 12 and then grounded. In the present invention, the grounding portion is connected by an additional conductive connection structure provided on the first surface 122, the peripheral side surface and the second surface 124 to fill the aforementioned gap area G1, shorten the static electricity release path, and protect other electronic components on the sensor module 1. In one embodiment, in the sensor module 1, the conductive connection structure (including the first conductive connection portion 138 and the second conductive connection portion 140) for additionally connecting the grounding layout (including the first grounding portion 126, the second grounding portion 130, the third grounding portion 128 and the fourth grounding portion 132) is a secondary process, which is formed on the periphery (including the side surface) of the circuit board 12 after the circuit board 12 is cut.

[0032] In addition, in the sensor module 1, the electrical connection between the circuit board 12 and the outside (such as the control circuit) can be another flexible circuit board (such as Figure 2 The connection between the flexible circuit board and the circuit board 12 can be a direct fixed connection (such as welding) or a detachable connection via a connector. In addition, if the process permits, the circuit board 12 and the flexible circuit board can also be a single component. The flexible circuit board can pass through the housing 10 (for example, a channel connected to the outside of the housing 10 is formed on the side wall surface or the bottom wall surface in the accommodating space 102 of the housing 10 (the channel, for example, penetrates the housing 10 in the horizontal direction Dh or the vertical direction Dv, respectively) for its passage) to be electrically connected to the outside. In principle, the grounding of the circuit board 12 will also be connected to the external grounding through this flexible circuit board.

[0033] In addition, in actual operation, the layout of the first grounding portion 126 and the second grounding portion 130 on the circuit board 12 is determined in principle according to the actual circuit design and is not limited to the aforementioned embodiment. Figure 6 , which is a schematic diagram of the grounding layout of the first surface 322 of the circuit board 32 according to the second embodiment. The first grounding portion 326 on the first surface 322 is in the shape of a square, and the first grounding portion 326 surrounds the sensing unit 16 (its outline on the first surface 322 is represented by a chain line); at this time, the circuit board 32 can provide a connection interface on the first surface 322 (such as the dotted box in the figure) for connecting to a flexible circuit board (for connecting to the outside). In addition, the first grounding portion 326 can be logically regarded as four-segment grounding, and these four grounding segments extend parallel to the four peripheral side surfaces 334a~d of the circuit board 32 respectively (generally, the circuit board 32 is a quadrilateral, and logically the four peripheral side surfaces 334a~d are all the peripheral side surfaces of the circuit board 32). Please refer to Figure 7 , which is a schematic diagram of the grounding layout of the second surface portion 324 of the circuit board 32 according to the second embodiment. The second grounding portion 330 on the second surface 324 is in a square shape, corresponding to the first grounding portion 326. Similarly, the second grounding portion 330 can also be logically regarded as four sections of grounding, and these four sections of grounding extend parallel to the four first peripheral side surfaces 334a~d of the circuit board 32. Please also refer to Figure 6 and Figure 7 In the second embodiment, the first conductive connection portion 338 (whose outline is shown in the figure with a dotted line) is continuously disposed on the first surface 322, each peripheral side surface 334a-d and the second surface 324 and contacts the first grounding portion 326 and the second grounding portion 330; in other words, the first conductive connection portion 338 covers all peripheral side surfaces of the circuit board 12 (i.e., the four first peripheral side surfaces 334a-d). For other descriptions, please refer to the relevant description of the sensor module 1 in the previous text, which will not be repeated here.

[0034] In addition, the sensing unit 16 in each embodiment can be a fingerprint recognition element, and the material or structure of the insulating cover 18 is modified according to the recognition principle of the fingerprint recognition element (for example, optical, capacitive or other methods to obtain fingerprints). In this case, the sensor module 1 is a fingerprint recognition device; in one embodiment, the sensor module 1 can be integrated into a keyboard, so that the integrated keyboard has a fingerprint recognition function.

[0035] In the sensor module of the present invention, a first grounding portion is provided on the first surface of the circuit board, a second grounding portion is provided on the second surface, and a first conductive connecting portion is provided on the circuit board. The first conductive connecting portion is continuously provided on the first surface, the peripheral side surface and the second surface and connects the first grounding portion and the second grounding portion. In this way, the first grounding portion and the second grounding portion are connected through the conductive connecting portion, and together with the conductive connecting portion, a larger conductive area is formed, which speeds up the charge conduction speed, improves the anti-static discharge capability of the sensor module, and protects the electronic components on the sensing unit.

[0036] The above detailed description of the preferred embodiments is intended to more clearly describe the features and spirit of the present invention, rather than to limit the scope of protection of the present invention by the preferred embodiments disclosed above. On the contrary, the purpose is to include various changes and arrangements with equivalents within the scope of protection of the claims to be applied for by the present invention. Therefore, the scope of protection of the claims of the present invention should be interpreted in the broadest sense based on the above description, so as to include all possible changes and arrangements with equivalents.

Claims

1. A sensor module, characterized in that Include: A circuit board, comprising a first surface, a second surface opposite to the first surface, and a first peripheral side surface connecting the first surface and the second surface, wherein a first grounding portion is provided on the first surface, and a second grounding portion is provided on the second surface; a first conductive connecting portion is further provided on the circuit board, and the first conductive connecting portion is continuously provided on the first surface, the first peripheral side surface, and the second surface and contacts the first grounding portion and the second grounding portion; as well as The sensing unit is electrically fixed on the first surface.

2. The sensor module according to claim 1, characterized in that: The first grounding portion and the second grounding portion both extend parallel to the first peripheral side surface.

3. The sensor module according to claim 1, characterized in that: The circuit board also has a second circumferential side surface connecting the first surface and the second surface, a third grounding portion is also provided on the first surface, and the third grounding portion extends parallel to the second circumferential side surface, a fourth grounding portion is also provided on the second surface, and the fourth grounding portion extends parallel to the second circumferential side surface, and a second conductive connecting portion is also provided on the circuit board, and the second conductive material is continuously arranged on the first surface, the second circumferential side surface and the second surface and contacts the third grounding portion and the fourth grounding portion.

4. The sensor module according to claim 3, characterized in that: The first peripheral side surface and the second peripheral side surface are located on two opposite sides of the circuit board; or, the first peripheral side surface and the second peripheral side surface are located on two adjacent sides of the circuit board.

5. The sensor module according to claim 1, characterized in that: The sensor module further includes an insulating upper cover, which completely covers the sensing unit and the circuit board.

6. The sensor module according to claim 5, characterized in that: The sensor module further comprises a shell, wherein the shell has a containing space and an opening, the circuit board and the sensing unit are contained in the containing space, and a gap is formed between the insulating upper cover and the opening.

7. The sensor module according to claim 1, characterized in that: The first conductive connection portion at least partially overlaps with the first ground portion and the second ground portion respectively.

8. The sensor module according to claim 1, characterized in that: The first grounding portion surrounds the sensing unit, and the first conductive connecting portion covers all peripheral side surfaces of the circuit board.

9. The sensor module according to claim 1, characterized in that: The first conductive connection portion is made of different materials from the first grounding portion or the second grounding portion.

10. The sensor module according to claim 1, characterized in that: The distribution area of ​​the first grounding portion is smaller than the distribution area of ​​the second grounding portion.

Images