Display panel, manufacturing method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a manufacturing method of the display panel and electronic equipment, and relates to the technical field of display. The display panel comprises a substrate, an array film layer, a passivation layer and a dam structure, the passivation layer is located on the side, away from the substrate, of the array film layer, the dam structure is located on the side, away from the substrate, of the passivation layer, and the dam structure comprises a crack dam and a first dam which are adjacently arranged. The frame area comprises a first area used for arranging a first dam, and in the first area, the orthographic projection of the passivation layer on the substrate is located in the orthographic projection of the first dam on the substrate. Through the arrangement, the contact area of the passivation layer and the thin film packaging layer at the position of the first dam can be effectively reduced or contact of the passivation layer and the thin film packaging layer can be avoided, so that the risk of damage such as cracks or stripping caused by stress mismatching of the passivation layer and the thin film packaging layer on the side, close to the crack dam, of the first dam is reduced, and the reliability of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] In the field of display technology, thin film packaging technology is usually used to package display panels. How to improve the reliability of thin film packaging technology has become a technical problem that technicians in this field urgently need to solve. Summary of the invention

[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, an object of the present application is to provide a display panel, a method for manufacturing a display panel, and an electronic device.

[0004] In a first aspect, the present application provides a display panel, the display panel comprising a display area and a frame area surrounding the display area;

[0005] The display panel further includes:

[0006] substrate;

[0007] An array film layer is located on the substrate;

[0008] A passivation layer, located on a side of the array film layer away from the substrate;

[0009] a dam structure, located on a side of the passivation layer away from the substrate, wherein the dam structure is located in the frame area and arranged around the display area, the dam structure comprises a crack dam and a first dam arranged adjacent to each other, and the crack dam is arranged on a side of the first dam away from the display area;

[0010] The border region includes a first area for setting the first dam, and in the first area, the orthographic projection of the passivation layer on the substrate is located within the orthographic projection of the first dam on the substrate.

[0011] In a possible implementation manner, on a side of the first dam facing the crack dam, an edge of the first dam is flush with an edge of the passivation layer, or the passivation layer is retracted relative to the first dam.

[0012] In a possible implementation, the border area further includes a second area located between the crack dam and the first dam;

[0013] An orthographic projection of the passivation layer on the substrate is outside an orthographic projection of the second region on the substrate.

[0014] In a possible implementation, the border area further includes a second area located between the crack dam and the first dam;

[0015] The passivation layer is distributed discontinuously on the second region;

[0016] In the second area, the passivation layer includes at least one passivation ring, and the passivation ring surrounds a side of the first dam away from the display area;

[0017] Preferably, the number of the passivation layers is multiple, and in the direction from the first dam to the crack dam, the multiple passivation rings are arranged at equal intervals;

[0018] Preferably, in the direction from the first dam to the crack dam, the distance between two adjacent passivation rings is 10 μm to 30 μm, and the size of the passivation ring is 10 μm to 30 μm.

[0019] In a possible implementation manner, the display panel further includes a thin film encapsulation layer, and the thin film encapsulation layer at least covers a side of the dam structure away from the substrate;

[0020] In the display area, the thin film encapsulation layer is located on a side of the passivation layer away from the substrate;

[0021] Preferably, in the first region, the thin film encapsulation layer includes a first inorganic encapsulation layer and a second inorganic encapsulation layer which are stacked.

[0022] In a possible implementation manner, the display panel further includes an organic material layer, and the organic material layer is located on a side of the passivation layer away from the substrate;

[0023] The organic material layer forms the dam structure in the frame area;

[0024] Preferably, the organic material layer includes a planarization layer and / or a pixel defining layer.

[0025] In a second aspect, the present application further provides a method for manufacturing a display panel, wherein the display panel includes a display area and a frame area surrounding the display area, wherein the frame area includes a first area, and the method includes:

[0026] providing a substrate;

[0027] Fabricating an array film layer on one side of the substrate;

[0028] Making a passivation layer on a side of the array film layer away from the substrate, and patterning the passivation layer;

[0029] A dam structure is formed on a side of the patterned passivation layer away from the substrate and located in the border area and surrounding the display area, wherein the dam structure includes a crack dam and a first dam that are adjacent to each other, the crack dam is located on a side of the first dam away from the display area, the first dam is located in the first area, and in the first area, the orthographic projection of the passivation layer on the substrate is located within the orthographic projection of the first dam on the substrate.

[0030] In a possible implementation manner, the step of forming a passivation layer on a side of the array film layer away from the substrate and patterning the passivation layer includes:

[0031] Coating a photoresist layer on the passivation layer, and forming an opening of the photoresist layer in a second region between the crack dam and the first dam by developing and exposing the passivation layer in the second region;

[0032] Etching the exposed passivation layer to remove the passivation layer located in the second area;

[0033] Preferably, the step of forming a dam structure located in the frame area and surrounding the display area on a side of the patterned passivation layer away from the substrate comprises:

[0034] A first dam is formed on the passivation layer in the first region, so that an edge of the first dam is flush with an edge of the passivation layer on a side of the first dam facing the crack dam, or the passivation layer is retracted relative to the first dam.

[0035] In a possible implementation manner, the step of forming a passivation layer on a side of the array film layer away from the substrate and patterning the passivation layer includes:

[0036] Coating a photoresist layer on the passivation layer, and forming a plurality of photoresist layer openings surrounding the first dam in a second region between the crack dam and the first dam by developing and exposing, exposing a portion of the passivation layer located in the second region;

[0037] The exposed passivation layer is etched to form a plurality of passivation rings surrounding the first dam in the second region.

[0038] In a third aspect, the present application further provides an electronic device, comprising a display panel as described in any one of the first aspects, or a display panel manufactured by the method for manufacturing a display panel as described in any one of the second aspects.

[0039] Based on any one of the above aspects, the display panel, the manufacturing method of the display panel and the electronic device provided by the present application include a substrate, an array film layer, a passivation layer and a dam structure, wherein the passivation layer is located on the side of the array film layer away from the substrate, the dam structure is located on the side of the passivation layer away from the substrate, and the dam structure includes a crack dam and a first dam arranged adjacent to each other. The frame area includes a first area for setting the first dam, and in the first area, the orthographic projection of the passivation layer on the substrate is located within the orthographic projection of the first dam on the substrate. Such an arrangement can effectively reduce the contact area between the passivation layer and the thin film encapsulation layer at the position of the first dam or avoid contact between the two, thereby reducing the risk of damage such as cracks or peeling of the passivation layer and the thin film encapsulation layer on the side of the first dam close to the crack dam due to stress mismatch (including thermal stress generated in a high temperature environment and film forming stress during the manufacturing process, etc.), thereby improving the reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 A schematic diagram of the regional distribution of the display panel provided in this embodiment;

[0042] Figure 2 for Figure 1 Schematic diagram of the film structure of the display panel in the middle MM direction Figure 1 ;

[0043] Figure 3 for Figure 1 Schematic diagram of the film structure of the display panel in the middle MM direction Figure 2 ;

[0044] Figure 4 for Figure 1 Schematic diagram of the film structure of the display panel in the middle MM direction Figure 3 ;

[0045] Figure 5 for Figure 1 Schematic diagram of the film structure of the display panel in the middle MM direction Figure 4 ;

[0046] Figure 6 for Figure 1 Schematic diagram of the film structure of the display panel in the middle MM direction Figure 5 ;

[0047] Figure 7A schematic diagram of a process of manufacturing a display panel provided in an embodiment of the present application;

[0048] Figure 8 for Figure 7 Corresponding process diagram.

[0049] icon:

[0050] 10 - display panel; 110 - substrate; 120 - array film layer; 130 - passivation layer; 140 - dam structure; 141 - first dam; 142 - second dam; 150 - thin film encapsulation layer; 160 - organic material layer. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0053] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0054] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0055] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed", "connected", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0056] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0057] The inventors found that when the display panel was subjected to a high-temperature reliability test, the display panel often had test failures. After analyzing the reasons for the above test failures, the inventors found that the main reason for the above failures was the failure of the display panel packaging, and the display panel is generally packaged using thin-film packaging technology. After tracing the causes of the packaging failure, the inventors found that the main reason was that the thin-film packaging layer and the passivation layer in contact with it had different thermal expansion coefficients under high-temperature test conditions. The two are prone to cracking or peeling due to thermal stress mismatch, thereby forming cracks that can be invaded by water and oxygen, which in turn causes the film layer (e.g., conductive layer) in the display panel to be corroded, causing poor film function (e.g., metal wiring breakage), affecting the display effect of the display panel.

[0058] In response to the above problems, some related technologies have proposed the following two solutions: Solution 1: Adjust the design of the thin-film encapsulation layer so that it does not cover the passivation layer to solve the problem of film layer stress mismatch. However, due to the limitations of the narrow frame and process, it is difficult for the existing technology to accurately control the deposition and coverage of the thin-film encapsulation layer, making it difficult to implement the above solution. Solution 2: Completely eliminate the passivation layer to solve the problem of stress mismatch between film layers. However, if the passivation layer is completely eliminated, water vapor and gas can easily penetrate into the metal conductive layer and cause oxidation or corrosion of the metal conductive layer, thereby affecting the reliability of the display panel.

[0059] In order to solve the problems in the prior art, the inventor innovatively designed the following technical solution, and the specific implementation scheme of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the above solutions in the prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed by this embodiment for the above technical problems below should all be the contributions made by the inventor to the present application in the process of invention and creation, and should not be understood as the technical content known to those skilled in the art.

[0060] Please refer to Figure 1and Figure 2 , Figure 1 The schematic diagram of the regional distribution of the display panel 10 provided in this embodiment is illustrated. Figure 2 Example Figure 1 Schematic diagram of the film structure of the display panel 10 in the MM direction. In the embodiment of the present application, the display panel 10 includes a display area AA and a frame area BA surrounding the display area AA.

[0061] In this embodiment, the display panel 10 further includes a substrate 110, an array film layer 120, a passivation layer 130 and a dam structure 140. The array film layer is located on one side of the substrate 110, and the array film layer 120 further includes at least a plurality of conductive layers and an insulating layer located between adjacent conductive layers, wherein a pixel circuit for driving the light-emitting device to emit light is formed in the array film layer 120.

[0062] The passivation layer 130 is located on the side of the array film layer away from the substrate 110, and the side of the passivation layer 130 facing the substrate 110 is connected to a conductive layer. The passivation layer 130 can protect the conductive layer from physical damage and corrosion by environmental factors (such as humidity and oxygen). The passivation layer 130 can be made of at least one material selected from silicon nitride, silicon carbide, silicon dioxide, and silicon carbide nitride.

[0063] The dam structure 140 is located on a side of the passivation layer 130 away from the substrate 110, wherein the dam structure 140 is located in the frame area BA and is arranged around the display area AA, that is, the orthographic projection of the dam structure 140 on the substrate 110 is annular as a whole. For example, when the display panel 10 is rectangular, the orthographic projection of the dam structure 140 on the substrate 110 is a rectangular ring. Specifically, the orthographic projection of the dam structure 140 on the array film layer 120 can be a regular ring as a whole (for example, a rectangular ring with uniform ring width), or an irregular ring as a whole (for example, a rectangular ring with non-uniform ring width).

[0064] The dam structure 140 includes a crack dam 142 and a first dam 141 that are adjacently arranged. The first dam 141 can block organic materials (such as organic encapsulation materials used for encapsulation) from entering the border area BA, so that the border area BA after cutting has no organic material layer 160, thereby preventing water vapor from penetrating into the display area AA from the edge along the organic material. The crack dam 142 is arranged on a side of the first dam 141 away from the display area AA, and the crack dam 142 can prevent the cutting crack from spreading to the display area AA, wherein the crack dam 142 can also be arranged around the display area AA.

[0065] The border area BA may include a first area BA1 for setting the first dam 141, in which the orthographic projection of the passivation layer 130 on the substrate 110 is located within the orthographic projection of the first dam 141 on the substrate 110. With such a design, at the position of the first dam structure, the passivation layer does not contact or contacts less with the thin film encapsulation layer covering the first dam structure, that is, the contact area between the passivation layer and the thin film encapsulation layer at the position of the first dam can be effectively reduced, thereby reducing the risk of damage such as cracks or peeling of the passivation layer 130 and the thin film encapsulation layer 150 on the side of the first dam 141 close to the crack dam 142 due to stress mismatch, thereby improving the reliability of the display panel 10, wherein the above-mentioned stress includes thermal stress generated in a high temperature environment (such as a high temperature reliability test) and film forming stress during the manufacturing process.

[0066] For further information, please refer to Figure 2 and Figure 3 The border area BA may also include a second area BA2 located between the crack dam 142 and the first dam 141. The passivation layer 130 may be partially located in the second area BA2 or entirely located in the first area BA1. Specifically, when manufacturing the passivation layer 130, the passivation layer 130 covering the array film layer 120 may be manufactured first, and then the passivation layer of the second area BA2 may be partially or completely etched.

[0067] Specifically, when the passivation layer 130 of the second area BA2 is completely etched, the orthographic projection of the passivation layer 130 on the substrate 110 is located outside the orthographic projection of the second area BA2 on the substrate 110. At this time, on the side of the first dam 141 facing the crack dam 142, the edge of the first dam 141 is flush with the edge of the passivation layer 130 (e.g., Figure 2 ), or the passivation layer 130 is retracted relative to the first bank 141 (as shown in Figure 3 As shown), the passivation layer and the thin film encapsulation layer do not contact or have little contact at the first dam position, reducing damage such as cracks or peeling caused by stress mismatch between the passivation layer 130 and the thin film encapsulation layer at the edge of the first dam 141, thereby improving the reliability of the display panel 10.

[0068] The inventors found in further practice that if the passivation layer 130 of the second area BA2 is completely etched, a large amount of components in the developer may be consumed when the photoresist layer is developed, resulting in a decrease in the developer concentration. The problem of residual photoresist layer development may occur, which in turn affects the etching of the passivation layer 130.

[0069] To do this, refer to Figure 4The passivation of the second area BA2 can be partially etched, and the second passivation layer 130 is discontinuously distributed on the second area BA2. Specifically, in the first area BA1, the passivation layer 130 may include at least one passivation ring surrounding the side of the first dam 141 away from the display area AA.

[0070] Preferably, the number of the passivation layer can be multiple, and in the direction from the first dam 141 to the crack dam 142, multiple passivation rings are arranged at equal intervals, the distance between two adjacent passivation rings is 10μm to 30μm, and the size of the passivation ring is 10μm to 30μm. Exemplarily, the distance between two adjacent passivation rings includes; the size of the passivation ring includes 10μm, 12μm, 15μm, 20μm, 15μm, 20μm, 25μm, 28μm or 30μm, etc., and the size of the passivation ring includes 10μm, 12μm, 15μm, 20μm, 15μm, 20μm, 25μm, 28μm or 30μm, etc.

[0071] Such a design can not only reduce the consumption of developer and production cost, but also avoid incomplete etching or residual glue problems caused by insufficient developer concentration, reduce the impact on the performance of the passivation layer 130, and improve the overall reliability of the display panel 10.

[0072] For further information, please refer to Figure 5 and Figure 6 The display panel 10 further includes a thin film encapsulation layer 150, which covers at least the display area AA and the first area BA1. Specifically, in the display area AA, the thin film encapsulation layer 150 is located on the side of the passivation layer 130 away from the substrate 110. In the first area BA1, the thin film encapsulation layer 150 covers the side of the dam structure 140 away from the substrate 110. The first dam 141 can prevent the thin film encapsulation layer 150 from overflowing to the second area BA2. Preferably, in the first area BA1, the thin film encapsulation layer 150 includes a first inorganic encapsulation layer and a second inorganic encapsulation layer stacked, and the thin film encapsulation layer 150 made of inorganic material can effectively prevent water vapor from entering the display area AA.

[0073] Furthermore, the display panel 10 may further include an organic material layer 160, which may be located on the side of the passivation layer 130 away from the substrate 110, wherein the organic material layer 160 may form the above-mentioned dam structure 140 in the border area BA. The organic material layer 160 includes a planarization layer and / or a pixel definition layer, and illustratively, the organic material layer 160 includes a planarization layer and a pixel definition layer that are stacked, and the planarization layer and the pixel definition layer may form a first dam 141 in the border area BA.

[0074] Based on the same inventive concept, the present application also provides a method for manufacturing a display panel. Figure 7 and Figure 8 , Figure 7 A schematic diagram of a process for manufacturing a display panel provided in an embodiment of the present application, Figure 8 for Figure 7 The corresponding process diagram. Figure 7 and Figure 8 The manufacturing method of the display panel provided in this embodiment is described in detail, wherein the display panel 10 includes a display area AA and a frame area BA surrounding the display area AA, and the display area AA includes a first area BA1.

[0075] S110: providing a substrate.

[0076] In this step, the substrate 110 may be made of a transparent material. Exemplarily, the substrate 110 may be a glass substrate 110 .

[0077] S120: forming an array film layer on one side of the substrate.

[0078] In this step, the array film layer 120 may include at least a plurality of conductive layers and an insulating layer located between adjacent conductive layers, wherein the array film layer 120 includes a pixel circuit for driving the light-emitting device to emit light.

[0079] S130: forming a passivation layer on a side of the array film layer away from the substrate, and performing patterning on the passivation layer.

[0080] Specifically, the border area BA may also include a second area BA2 located between the crack dam 142 and the first dam 141. When manufacturing the passivation layer 130, the passivation layer 130 covering the array film layer 120 may be manufactured first, and then the passivation of the second area BA2 may be partially or completely etched.

[0081] S140: forming a dam structure located in the frame area and surrounding the display area on the side of the patterned passivation layer away from the substrate.

[0082] In this step, the dam structure 140 includes a crack dam 142 and a first dam 141 that are adjacently arranged, the crack dam 142 is arranged on a side of the first dam 141 away from the display area AA, the first dam 141 is arranged in the first area BA1, and in the first area BA1, the orthographic projection of the passivation layer 130 on the substrate 110 is located within the orthographic projection of the first dam 141 on the substrate 110.

[0083] Specifically, organic material layers (for example, a planarization layer and a pixel definition layer) can be sequentially manufactured on the side of the passivation layer 130 away from the substrate 110 by spin coating an organic material. The organic material layers can form a first dam 141 in the border area BA (i.e., the first area BA1). On the side of the first dam 141 facing the crack dam 142, the edge of the first dam 141 is flush with the edge of the passivation layer 130, or the passivation layer 130 is retracted relative to the first dam 141.

[0084] The dam structure 140 is located in the frame area BA and is arranged around the display area AA, that is, the orthographic projection of the dam structure 140 on the substrate 110 is a ring shape as a whole. For example, when the display panel 10 is rectangular, the orthographic projection of the dam structure 140 on the substrate 110 is a rectangular ring. Specifically, the orthographic projection of the dam structure 140 on the array film layer 120 can be a regular ring shape (for example, a rectangular ring shape with uniform ring width) or an irregular ring shape (for example, a rectangular shape with uneven ring width).

[0085] The dam structure 140 includes a crack dam 142 and a first dam 141 that are adjacently arranged. The first dam 141 can block organic materials (such as organic encapsulation materials used for encapsulation) from entering the border area BA, so that there is no organic material layer distributed in the border area BA after cutting, thereby preventing water vapor from penetrating into the display area AA from the edge along the organic material. The crack dam 142 is arranged on a side of the first dam 141 away from the display area AA, and the crack dam 142 can prevent the cutting crack from spreading to the display area AA, wherein the crack dam 142 can also be arranged around the display area AA.

[0086] It is understandable that the crack dam 142 can be manufactured separately, that is, the crack dam 142 and the first dam 141 are manufactured in different process steps.

[0087] In the above method, after the passivation layer 130 is patterned, a dam structure 140 is formed on the side of the patterned passivation layer 130 away from the substrate 110, which is located in the frame area BA and surrounds the display area AA, so that in the first area BA1, the orthographic projection of the passivation layer 130 on the substrate 110 can be located within the orthographic projection of the first dam 141 on the substrate 110. Such a design can effectively reduce the contact area between the passivation layer and the thin film encapsulation layer at the first dam position or avoid contact between the two, thereby reducing the risk of damage such as cracks or peeling of the passivation layer 130 and the thin film encapsulation layer on the side of the first dam 141 close to the crack dam 142 due to stress mismatch (including thermal stress generated in a high temperature (such as high temperature reliability test) environment and film forming stress during the manufacturing process, etc.), thereby improving the reliability of the display panel 10.

[0088] Furthermore, in step S130, a passivation layer 130 covering the array film layer 120 may be first fabricated, and then the passivation layer 130 in the second area BA2 may be partially or completely etched to obtain a passivation layer 130 partially located in the second area BA2 or completely located in the first area BA1. Specifically, step S130 may be implemented by the following two methods.

[0089] In the first implementation method, a photoresist layer may be coated on the passivation layer 130 first, and a photoresist layer opening may be formed in the second area BA2 between the crack dam 142 and the first dam 141 after development and exposure, so as to expose the passivation layer 130 located in the second area BA2. Then, the exposed passivation layer 130 may be etched to remove the passivation layer 130 located in the second area BA2, so as to obtain the passivation layer 130 located entirely in the first area BA1. At this time, on the side of the first dam 141 facing the crack dam 142, the edge of the first dam 141 is flush with the edge of the passivation layer 130, or the passivation layer 130 is retracted relative to the first dam 141, so that the passivation layer has less contact or no contact with the thin film encapsulation layer at the position of the first dam, thereby reducing the stress difference between the passivation layer 130 and the thin film encapsulation layer at the edge of the first dam 141, reducing damage problems such as cracks or peeling caused by stress mismatch, and improving the reliability of the display panel 10.

[0090] The inventors further discovered that in the above implementation method, since the etched photoresist layer has a large area, a large amount of components in the developer may be consumed when the photoresist layer is developed, resulting in a decrease in the developer concentration, which may cause the problem of residual glue in the photoresist layer development, thereby affecting the etching of the passivation layer 130.

[0091] To this end, in the second implementation method, a photoresist layer can be first coated on the passivation layer 130, and multiple photoresist layer openings surrounding the first dam 141 are formed in the second area BA2 between the crack dam 142 and the first dam 141 by development and exposure, exposing part of the passivation layer 130 located in the second area BA2. Then, the exposed passivation layer 130 is etched to form multiple passivation rings surrounding the first dam 141 in the second area BA2. There can be multiple passivation layers, and in the direction from the first dam 141 to the crack dam 142, multiple passivation rings are arranged at equal intervals, the distance between two adjacent passivation rings is 10μm to 30μm, and the size of the passivation ring is 10μm to 30μm. Exemplarily, the distance between two adjacent passivation rings includes; the size of the passivation ring includes 10μm, 12μm, 15μm, 20μm, 15μm, 20μm, 25μm, 28μm or 30μm, etc., and the size of the passivation ring includes 10μm, 12μm, 15μm, 20μm, 15μm, 20μm, 25μm, 28μm or 30μm, etc.

[0092] Such a design can not only reduce the consumption of developer and production cost, but also avoid incomplete etching or residual glue problems caused by insufficient developer concentration, reduce the impact on the performance of the passivation layer 130, and improve the overall reliability of the display panel 10.

[0093] In addition, an embodiment of the present application further provides an electronic device, which includes any one of the display panels 10 in the above embodiments, or a display panel 10 manufactured by any one of the display panel manufacturing methods in the above embodiments. In the above display panel 10, the orthographic projection of the passivation layer 130 in the first area BA1 on the substrate 110 is located within the orthographic projection of the first dam 141 on the substrate 110. With such a design, the passivation layer 130 can be protected by the first dam 141 during thermal expansion, reducing the risk of damage such as cracks or peeling of the passivation layer 130 and the thin film encapsulation layer on the side of the first dam 141 close to the crack dam 142 due to stress mismatch, thereby improving the reliability of the display panel 10.

[0094] In summary, the embodiments of the present application provide a display panel, a method for manufacturing a display panel, and an electronic device. The above-mentioned display panel includes a substrate, an array film layer, a passivation layer, and a dam structure, wherein the passivation layer is located on the side of the array film layer away from the substrate, the dam structure is located on the side of the passivation layer away from the substrate, and the dam structure includes a crack dam and a first dam arranged adjacent to each other. The frame area includes a first region for setting the first dam, and in the first region, the orthographic projection of the passivation layer on the substrate is located within the orthographic projection of the first dam on the substrate. Such a setting can effectively reduce the contact area between the passivation layer and the thin film encapsulation layer at the position of the first dam, thereby reducing the risk of damage such as cracks or peeling caused by the mismatch of stress (including thermal stress generated in a high temperature environment and film forming stress during the manufacturing process, etc.) on the side of the first dam close to the crack dam between the passivation layer and the thin film encapsulation layer, thereby improving the reliability of the display panel.

[0095] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises a display area and a frame area surrounding the display area; The display panel further includes: substrate; An array film layer, located on the substrate; A passivation layer, located on a side of the array film layer away from the substrate; a dam structure, located on a side of the passivation layer away from the substrate, wherein the dam structure is located in the frame area and arranged around the display area, the dam structure comprises a crack dam and a first dam arranged adjacent to each other, and the crack dam is arranged on a side of the first dam away from the display area; The border region includes a first area for setting the first dam, and in the first area, the orthographic projection of the passivation layer on the substrate is located within the orthographic projection of the first dam on the substrate.

2. The display panel according to claim 1, wherein: On a side of the first dam facing the crack dam, an edge of the first dam is flush with an edge of the passivation layer, or the passivation layer is retracted relative to the first dam.

3. The display panel according to claim 2, wherein: The border region also includes a second region between the crack dam and the first dam; An orthographic projection of the passivation layer on the substrate is outside an orthographic projection of the second region on the substrate.

4. The display panel according to claim 2, wherein: The border region also includes a second region between the crack dam and the first dam; The passivation layer is distributed discontinuously on the second region; In the second area, the passivation layer includes at least one passivation ring, and the passivation ring surrounds a side of the first dam away from the display area; Preferably, the number of the passivation layers is multiple, and in the direction from the first dam to the crack dam, the multiple passivation rings are arranged at equal intervals; Preferably, in the direction from the first dam to the crack dam, the distance between two adjacent passivation rings is 10 μm to 30 μm, and the size of the passivation ring is 10 μm to 30 μm.

5. The display panel according to claim 2, wherein: The display panel further comprises a thin film encapsulation layer, wherein the thin film encapsulation layer at least covers a side of the dam structure away from the substrate; In the display area, the thin film encapsulation layer is located on a side of the passivation layer away from the substrate; Preferably, in the first region, the thin film encapsulation layer includes a first inorganic encapsulation layer and a second inorganic encapsulation layer which are stacked.

6. The display panel according to claim 2, wherein: The display panel further comprises an organic material layer, wherein the organic material layer is located on a side of the passivation layer away from the substrate; The organic material layer forms the dam structure in the frame area; Preferably, the organic material layer includes a planarization layer and / or a pixel defining layer.

7. A method for manufacturing a display panel, characterized in that: The display panel includes a display area and a frame area surrounding the display area, the frame area includes a first area, and the method includes: providing a substrate; Fabricating an array film layer on one side of the substrate; Making a passivation layer on a side of the array film layer away from the substrate, and patterning the passivation layer; A dam structure is formed on a side of the patterned passivation layer away from the substrate and located in the border area and surrounding the display area, wherein the dam structure includes a crack dam and a first dam that are adjacent to each other, the crack dam is located on a side of the first dam away from the display area, the first dam is located in the first area, and in the first area, the orthographic projection of the passivation layer on the substrate is located within the orthographic projection of the first dam on the substrate.

8. The method for manufacturing a display panel according to claim 7, wherein: The step of forming a passivation layer on a side of the array film layer away from the substrate and patterning the passivation layer comprises: Coating a photoresist layer on the passivation layer, and forming a photoresist layer opening in a second region between the crack dam and the first dam to be subsequently fabricated by development and exposure, so as to expose the passivation layer in the second region; The exposed passivation layer is etched to remove the passivation layer located in the second area.

9. The method for manufacturing a display panel according to claim 7, wherein: The step of forming a passivation layer on a side of the array film layer away from the substrate and patterning the passivation layer comprises: Coating a photoresist layer on the passivation layer, and forming a plurality of photoresist layer openings surrounding the first dam in a second region between the crack dam and the first dam by developing and exposing, exposing a portion of the passivation layer located in the second region; The exposed passivation layer is etched to form a plurality of passivation rings surrounding the first dam in the second region.

10. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 6, or a display panel manufactured by the method for manufacturing a display panel according to any one of claims 7 to 9.

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