Wafer cleaning device, system and method and chemical mechanical polishing equipment

Abstract

The invention provides a wafer cleaning device, system and method and chemical mechanical polishing equipment. The wafer cleaning device comprises a wafer conveying and positioning device and a wafer rotating and positioning device, the top of the wafer conveying and positioning device is higher than the wafer rotating and positioning device, and the wafer conveying and positioning device and the wafer rotating and positioning device are integrated into a positioning and cleaning unit; the main shaft rotating assembly is connected to the lower portion of the positioning and cleaning unit and used for driving the positioning and cleaning unit to rotate; and the lifting assembly is connected below the main shaft rotating assembly and used for driving the main shaft rotating assembly and the positioning and cleaning unit to ascend and descend, and conveying positioning and rotating positioning of the wafer are achieved through different ascending and descending heights of the main shaft rotating assembly. According to the wafer cleaning device, the wafer positioning and cleaning unit and the main shaft rotating assembly are integrated, the wafer conveying, positioning and cleaning functions are achieved, and the space utilization rate of the wafer cleaning device is increased.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer processing, and in particular relates to a wafer cleaning device, system, method and chemical mechanical polishing equipment. Background Art

[0002] In the semiconductor manufacturing process, the surface treatment and cleaning of wafers are key steps to ensure the quality of subsequent processes. Wafer cleaning is required after chemical mechanical polishing. The cleaning process requires that the wafers on the conveyor belt be accurately positioned first, and then cleaned and dried. However, the existing wafer conveying and positioning device and the cleaning device are independent of each other and operate separately, resulting in low space utilization of wafer cleaning equipment. Summary of the invention

[0003] In view of this, the present application provides a wafer cleaning device, system, method and chemical mechanical polishing equipment, so as to solve or at least alleviate one or more of the above-mentioned problems and other problems existing in the prior art.

[0004] In order to achieve the above-mentioned object, the first aspect of the present application provides a wafer cleaning device, wherein the wafer cleaning device comprises:

[0005] A wafer conveying and positioning device and a wafer rotation positioning device, wherein the top of the wafer conveying and positioning device is higher than the wafer rotation positioning device, and the wafer conveying and positioning device and the wafer rotation positioning device are integrated into a positioning and cleaning unit;

[0006] a spindle rotating assembly, the spindle rotating assembly being connected below the positioning and cleaning unit and being used for driving the positioning and cleaning unit to rotate; and

[0007] A lifting assembly is connected to the bottom of the main shaft rotating assembly, and is used to drive the main shaft rotating assembly and the positioning and cleaning unit to rise and fall, and utilizes the different heights of the main shaft rotating assembly to achieve the conveying positioning and rotation positioning of the wafer.

[0008] In the wafer cleaning device as described above, optionally, the wafer transport positioning device and the wafer rotation positioning device are positioned along the transport direction of the wafer, the wafer transport positioning device is configured to stop the wafer in the transport direction of the wafer, and the wafer rotation positioning device is configured to radially position the wafer together with the wafer transport positioning device.

[0009] In the wafer cleaning device as described above, optionally, the wafer conveying and positioning device includes a pair of conveying and positioning claws arranged at circumferential intervals, and the wafer rotation positioning device includes a pair of rotation positioning claws arranged at circumferential intervals, each of the conveying and positioning claws includes a conveying and positioning stop post and a first clamping member, and each of the rotation positioning claws includes a rotation positioning stop post and a second clamping member, the conveying and positioning stop post is higher than the rotation positioning stop post, and the first clamping member and the second clamping member are used to clamp the outer periphery of the wafer to facilitate rotation cleaning and / or spin drying of the wafer.

[0010] In the wafer cleaning device as described above, optionally, each of the conveying positioning claws includes two separated conveying positioning stop posts and the first clamping member located between the conveying positioning stop posts, and each of the rotational positioning claws includes two separated rotational positioning stop posts and the second clamping member located between the rotational positioning stop posts.

[0011] In the wafer cleaning device as described above, optionally, the middle portion of the first clamping member is pivotally connected between the conveying positioning blocking columns, the top end of the first clamping member is used to clamp the outer periphery of the wafer, and the bottom end of the first clamping member is provided with a first counterweight block;

[0012] The middle part of the second clamping member is pivotally connected between the rotation positioning blocking columns, the top end of the second clamping member is used to clamp the outer periphery of the wafer, and the bottom end of the second clamping member is provided with a second counterweight block.

[0013] In the wafer cleaning device as described above, optionally, each of the conveying positioning claws includes a first support column arranged on its inner side, and each of the rotating positioning claws includes a second support column arranged on its inner side, and the top ends of the first support column and the second support column are located in the same horizontal plane.

[0014] In the wafer cleaning device as described above, optionally, the lifting component is an electric lifting slide, which is used for lifting and lowering the positioning cleaning unit and positioning it at different heights.

[0015] In the wafer cleaning device as described above, optionally, the positioning and cleaning unit and the spindle rotating assembly are connected in a detachable manner, and a protective sealing cover is provided at the connection portion between the positioning and cleaning unit and the spindle rotating assembly.

[0016] In the wafer cleaning device as described above, optionally, the protective sealing cover is a fixed sealing component, the bottom of the protective sealing cover is fixedly connected to the spindle rotating assembly, and the protective sealing cover is arranged outside the rotation output end of the spindle rotating assembly.

[0017] In the wafer cleaning device as described above, optionally, the positioning and cleaning unit and the spindle rotation assembly are connected via an adapter shaft, the adapter shaft is connected to the positioning and cleaning unit via a first boss and a flange arranged at the top, the adapter shaft is connected to the rotation output end of the spindle rotation assembly via a connecting hole arranged at the bottom, and the adapter shaft is covered in the protective sealing cover.

[0018] In the wafer cleaning device as described above, optionally, a sealing cover is provided on the top of the positioning and cleaning unit to seal the connection portion between the positioning and cleaning unit and the adapter shaft.

[0019] In the wafer cleaning device as described above, optionally, the lifting assembly includes an auxiliary guiding device, the auxiliary guiding device includes an auxiliary guiding rod and a guide seat, the auxiliary guiding rod and the guide seat cooperate with each other, and the auxiliary guiding device is used to guide the lifting assembly to move axially along the auxiliary guiding rod.

[0020] In the wafer cleaning device as described above, optionally, the wafer cleaning device includes a sealing bellows, which is sleeved on the outside of the spindle rotating assembly, one end of the sealing bellows is sealed connected to the spindle rotating assembly, and the other end is sealed connected to the joint between the spindle rotating assembly and the external frame, and the sealing bellows is used to prevent contaminants from entering the wafer cleaning area through the joint.

[0021] In the wafer cleaning device as described above, optionally, the retractable length of the sealing bellows is greater than the lifting range of the lifting assembly.

[0022] In the wafer cleaning device as described above, optionally, the positioning and cleaning unit has a positioning height, a wafer connection height, a cleaning height and a recovery height.

[0023] At the positioning height, the top of the wafer conveying and positioning device is higher than the wafer, the top of the wafer rotating and positioning device is lower than the wafer, and the wafer conveying and positioning device is configured to position a wafer stopper transmitted through the wafer rotating and positioning device at the wafer conveying and positioning device;

[0024] At the wafer joint height, the top of the wafer conveying and positioning device and the top of the wafer rotating and positioning device are both higher than the wafer, so as to position the wafer in the positioning and cleaning unit;

[0025] At the cleaning height, the positioning cleaning unit as a whole is higher than the height of the splice; and

[0026] At the restored height, the positioning and cleaning unit is entirely lower than the wafer conveying path.

[0027] In order to achieve the aforementioned object, the second aspect of the present application provides a wafer cleaning system, wherein the wafer cleaning system comprises:

[0028] A wafer cleaning device as described in any one of the first aspects above; and

[0029] Two parallel and spaced wafer conveyor belts, the positioning and cleaning unit is located between the two wafer conveyor belts, and the distance between the two wafer conveyor belts is smaller than the diameter of the wafer and larger than the width of the positioning and cleaning unit.

[0030] In the wafer cleaning system as described above, optionally, the positioning cleaning unit has a positioning height, a wafer connection height, a cleaning height and a recovery height.

[0031] At the positioning height, the wafer conveying and positioning device is higher than the wafer, and the wafer rotating and positioning device is lower than the wafer;

[0032] At the wafer joint height, the wafer conveying and positioning device and the wafer rotating and positioning device are higher than the wafer, so that the wafer is positioned in the positioning and cleaning unit;

[0033] At the cleaning height, the positioning cleaning unit is higher than the wafer conveyor belt as a whole; and

[0034] At the restored height, the positioning and cleaning unit is entirely lower than the wafer.

[0035] In order to achieve the aforementioned objective, the third aspect of the present application provides a wafer chemical mechanical polishing device, wherein the wafer chemical mechanical polishing device has a wafer cleaning system as described in any one of the aforementioned second aspects.

[0036] In order to achieve the aforementioned object, a fourth aspect of the present application provides a method for performing wafer positioning cleaning in a wafer cleaning system as described in any one of the aforementioned second aspects, wherein the steps of the method include:

[0037] Positioning: moving the positioning and cleaning unit to a positioning height, and the wafer conveying and positioning device stops the wafer;

[0038] Joining wafers: the positioning and cleaning unit is moved upward to the joining wafer height, and the wafer rotation positioning device and the wafer conveying and positioning device together radially position the wafer;

[0039] Cleaning and drying: the positioning cleaning unit is moved upward to a cleaning height, and the spindle rotating assembly drives the positioning cleaning unit to rotate, so as to clean and dry the wafer; and

[0040] Reset: the spindle rotating assembly stops rotating, the positioning and cleaning unit is lowered to the recovery height, the wafer falls onto the wafer conveyor belt during the lowering process, and the wafer conveyor belt transports the wafer to the next workstation.

[0041] The wafer cleaning device of the present invention integrates a wafer positioning and cleaning unit and a spindle rotating assembly, has wafer conveying, positioning and cleaning functions, and improves the space utilization rate of the wafer cleaning equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0043] Figure 1 A three-dimensional diagram of an embodiment of a wafer cleaning device of the present invention;

[0044] Figure 2 for Figure 1 A full cross-sectional view of an embodiment of the invention;

[0045] Figure 3 for Figure 2 A magnified view of the local area A;

[0046] Figure 4 for Figure 1 A three-dimensional diagram of a positioning cleaning unit of an embodiment of the present invention;

[0047] Figure 5 It is a schematic diagram of a positioning cleaning unit of a wafer cleaning system of the present invention when it is at a positioning height;

[0048] Figure 6 It is a schematic diagram of a wafer cleaning system of the present invention when the positioning cleaning unit is at a wafer connection height;

[0049] Figure 7 It is a schematic diagram of a wafer cleaning system of the present invention when the positioning cleaning unit is at a cleaning height;

[0050] Figure 8 It is a schematic diagram of a wafer cleaning system of the present invention when the positioning cleaning unit is at a recovery height;

[0051] Fig. 9 A top view of the wafer cleaning system of the present invention when the positioning cleaning unit is at the wafer connection height;

[0052] Fig.10 A flowchart of a wafer cleaning method is shown in FIG.

[0053] Figure numerals: 1-wafer conveying and positioning device; 2-wafer rotation positioning device; 3-positioning and cleaning unit; 4-spindle rotation assembly; 5-lifting assembly; 6-base; 7-external frame; 9-conveying and positioning claws; 10-rotation positioning claws; 11-conveying and positioning blocking column; 12-rotation positioning blocking column; 13-first clamping member; 14-second clamping member; 15-first counterweight block; 16-second counterweight block; 18-protective sealing cover; 19-adapter shaft; 20-sealing cover; 21-guide rod; 22-sealing bellows; 23-wafer conveyor belt; 24-first support column; 25-second support column; 26-roller; 27-wafer; 28-wafer cleaning area; 29-screw nut; 30-screw; 31-auxiliary guide 3-direction device; 32-auxiliary guide rod; 33-guide seat; 34-slide base; 35-rotation component housing; 36-motor; 37-neck; 38-rotation output end; 39-first boss; 40-flange; 41-first threaded hole; 42-second threaded hole; 43-first screw; 44-second screw; 45-quick change module; 47-convex ring; 48-inner flange; 49-first step; 50-second step; 51-second boss; 52-motor housing; 53-slide connecting seat; 54-center through hole; 55-protective cover; 56-first narrow slit; 57-second narrow slit; 58-third narrow slit; 59-fourth narrow slit; 60-seam; 61-top of the rotation component housing; D-positioning cleaning unit width. DETAILED DESCRIPTION

[0054] With reference to the accompanying drawings and specific embodiments, the structure, composition, characteristics and advantages of the wafer cleaning device, system, method and chemical mechanical polishing equipment of the present invention will be described below in an exemplary manner. However, all descriptions should not be used to form any limitations on the present invention.

[0055] For any single technical feature described or implied in the embodiments mentioned in this document, or any single technical feature displayed or implied in the accompanying drawings, the present invention still allows any combination or deletion between these technical features (or their equivalents) without any technical obstacles, and thus it should be considered that these more embodiments according to the present invention are also within the scope of the description of this document.

[0056] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.

[0057] The term “rotation output end” refers to the end of the main shaft rotation component 4 for outputting rotational motion and transmitting torque. For example, the rotation output end 38 in this embodiment may refer to the output shaft of the motor 36 .

[0058] Figure 1 It is a three-dimensional diagram of an embodiment of a wafer cleaning device of the present invention.

[0059] like Figure 1 As shown in FIG. 1 , this embodiment provides a wafer cleaning device, which can be used, for example, to clean a wafer conveyor belt 23 (see FIG. 1 ). Figure 5 ) transported wafer 27 (see Figure 5 ) for positioning and cleaning, the device includes a positioning and cleaning unit 3, a spindle rotation component 4 and a lifting component 5. The device is intended to achieve precise positioning and efficient cleaning of the wafer 27. Through the organic combination of various components, the integrated processing of the wafer 27 during the positioning and cleaning process is realized, thereby improving the cleaning efficiency. Among them, the positioning and cleaning unit 3 includes a wafer conveying and positioning device 1 and a wafer rotation positioning device 2. The wafer conveying and positioning device 1 and the wafer rotation positioning device 2 define a wafer holding space, and the top of the wafer conveying and positioning device 1 is higher than the wafer rotation positioning device 2.

[0060] Specifically, the wafer conveying and positioning device 1 and the wafer rotation and positioning device 2 are integrated into a positioning and cleaning unit 3, and are jointly arranged on the upper part of the wafer cleaning device of the present invention. The positioning and cleaning unit 3 is used to constrain and position the wafer 27 during the cleaning process, so as to ensure the position stability of the wafer 27 during the cleaning process. The top of the wafer conveying and positioning device 1 is higher than the wafer rotation and positioning device 2, and is also higher than the wafer 27. The wafer conveying and positioning device 1 can stop the wafer 27 from moving along the conveying direction of the wafer 27. The wafer 27 is the operating object of the present wafer cleaning device. The wafer 27 can be conveyed by a conveying device outside the present wafer cleaning device. At this time, the conveying direction of the wafer 27 is determined by the structure of the external conveying device. Since the top of the wafer conveying and positioning device 1 is higher than the wafer rotation and positioning device 2, the wafer 27 can enter the wafer holding space between the wafer conveying and positioning device 1 and the wafer rotation and positioning device 2 through the top of the wafer rotation and positioning device 2. The wafer cleaning device of the present invention can further position the wafer 27 in the wafer holding space to prevent the wafer 27 from slipping and falling during the movement and rotation process. When the wafer 27 enters the wafer holding space, the top of the wafer rotation positioning device 2 is lower than the wafer 27 and will not hinder the movement of the wafer 27.

[0061] Optionally, the positioning and cleaning unit 3 may include a base 6, a wafer transport positioning device 1 and a wafer rotation positioning device 2 are installed on both sides of the base 6, and a wafer holding space defined between the wafer transport positioning device 1 and the wafer rotation positioning device 2 is formed above the base 6.

[0062] The spindle rotating assembly 4 is arranged and connected below the positioning and cleaning unit 3, and is used to drive the positioning and cleaning unit 3 to rotate. During the cleaning process, the spindle rotating assembly 4 drives the positioning and cleaning unit 3 to rotate, and the wafer 27 is kept in the positioning and cleaning unit 3 and rotates together with the positioning and cleaning unit 3; the rotation of the wafer 27 makes the cleaning liquid sprayed evenly and acts on the entire surface, thereby improving the cleaning effect and efficiency. After the cleaning is completed, the wafer 27 is dried by the centrifugal action of the rotation, so that the surface is smooth and free of water marks.

[0063] The lifting assembly 5 is connected to the lower part of the main shaft rotating assembly 4, and is used to drive the main shaft rotating assembly 4 and the positioning and cleaning unit 3 to rise and fall. Since the main shaft rotating assembly 4 is connected to the lower part of the positioning and cleaning unit 3, it can move up and down together with the positioning and cleaning unit 3. The lifting assembly 5 adjusts the height of the positioning and cleaning unit 3 by using the different heights of the main shaft rotating assembly 4, and realizes the conveying positioning and rotation positioning of the wafer 27 at different working heights. Among them, the working height can include the positioning height, the wafer splicing height, the cleaning height and the recovery height.

[0064] This embodiment integrates the wafer conveying and positioning device 1 and the wafer rotation and positioning device 2 into a positioning and cleaning unit 3, and combines the coordinated actions of the spindle rotation component 4 and the lifting component 5 to achieve accurate positioning and efficient processing of the conveying and positioning and rotation cleaning process of the wafer 27. This design not only optimizes the equipment structure and saves space, but also improves the stability and efficiency of the cleaning process and effectively prevents the wafer 27 from falling out or shifting in position.

[0065] The positioning and cleaning unit 3 simultaneously plays the role of positioning the wafer 27 and cleaning the wafer 27, while the existing wafer cleaning devices mostly use two separate devices for wafer positioning and cleaning, and the wafer 27 needs to be transferred between the two devices, and it is necessary to recalibrate the working position of the wafer positioning and cleaning devices. Due to the use of the positioning and cleaning unit 3, the wafer cleaning device of the present invention saves the above-mentioned calibration step and improves the wafer cleaning efficiency.

[0066] Furthermore, the wafer conveying positioning device 1 and the wafer rotation positioning device 2 of the positioning cleaning unit 3 can be arranged along the wafer conveying direction ( Fig. 9 The wafer conveying and positioning device 1 can be configured to stop the wafer 27 in the conveying direction of the wafer to ensure that the wafer 27 does not continue to move along the conveying direction. The wafer rotation positioning device 2 can be configured to radially position the wafer 27 together with the wafer conveying and positioning device 1, so that the wafer 27 cannot move freely in the radial direction of the positioning and cleaning unit 3, thereby completing the radial positioning of the wafer 27. This design can effectively stop and position the wafer 27, ensuring that the wafer 27 maintains its position in the positioning and cleaning unit 3, which is beneficial to the subsequent wafer cleaning process.

[0067] Figure 2 for Figure 1 A full cross-sectional view of an embodiment of the invention, Figure 3 for Figure 2 The enlarged view of the local area A in Figure 2 and Figure 3 Embodiments of the present invention will be described.

[0068] The positioning cleaning unit 3 and the main shaft rotating assembly 4 can be connected in a detachable manner, and a protective sealing cover 18 is provided at the connection portion between the positioning cleaning unit 3 and the main shaft rotating assembly 4. The protective sealing cover 18 prevents the cleaning liquid and other dirt from splashing to the connection portion, causing corrosion and damage. Figure 2 As shown, preferably, the positioning and cleaning unit 3 and the spindle rotating assembly 4 can be connected through an adapter shaft 19, and the adapter shaft 19 is connected to the positioning and cleaning unit 3 through a first boss 39 and a flange 40 arranged at the top. In this embodiment, the lower end of the positioning and cleaning unit 3 has a neck 37, and the neck 37 is fixedly connected to the bottom of the base 6. The center of the neck 37 is provided with a central through hole 54 extending in the axial direction, and the central through hole 54 passes through the neck 37 and the base 6. A cylindrical first boss 39 is provided on the top of the adapter shaft 19. The first boss 39 extends into the central through hole 54 of the neck 37, and the outer diameter of the first boss 39 is equal to the inner diameter of the central through hole 54 of the neck 37, forming a tight shaft-hole fitting connection to avoid radial movement of the positioning and cleaning unit 3 and the wafer 27. Keyways corresponding to the positions of the outer cylindrical surface of the first boss 39 and the inner wall of the center through hole 54 are provided, and the first boss 39 and the neck 37 of the positioning and cleaning unit 3 are firmly fixed circumferentially through the engagement connection between the keyway and the key, so that the adapter shaft 19 and the positioning and cleaning unit 3 rotate synchronously.

[0069] The adapter shaft 19 is connected to the rotation output end 38 of the main shaft rotation assembly 4 through a connection hole set at the bottom. The rotation output end 38 is connected to the connection hole to form a tight shaft-hole fit to prevent the radial movement of the adapter shaft 19. The connection hole is located at the center of the bottom of the adapter shaft 19, so that the symmetry axes of the rotation output end 38 and the adapter shaft 19 connected together coincide. The adapter shaft 19 can also be a centrally symmetrical structure to eliminate eccentric vibration during high-speed rotation, so that the wafer 27 rotates more smoothly. In addition, a keyway with a corresponding position and shape is set in the connection hole between the rotation output end 38 and the adapter shaft 19. The keyway and the key are connected to each other so that the rotation output end 38 and the adapter shaft 19 are firmly fixed circumferentially, so that the rotation output end 38 drives the adapter shaft 19 and the positioning and cleaning unit 3, and rotates synchronously with them.

[0070] The positioning and cleaning unit 3 and the adapter shaft 19, as well as the adapter shaft 19 and the rotating output end 38, are circumferentially fixed by using keyways and keys, thereby ensuring the synchronous rotation of the positioning and cleaning unit 3, the adapter shaft 19 and the rotating output end 38, ensuring the precise transmission of the rotating motion, and avoiding the circumferential movement caused by the positioning and cleaning unit 3 slipping or loosening during high-speed rotation, thereby ensuring the cleaning quality of the wafer.

[0071] like Figure 2 and Figure 3 As shown, a flange 40 is provided on the outer cylindrical surface of the first boss 39, the bottom of the neck 37 supports the flange 40, and a first threaded hole 41 distributed circumferentially and extending axially is provided at the bottom end of the neck 37. Through holes distributed circumferentially and extending axially are provided on the flange 40, and a first screw 43 passes through the through hole of the flange 40 and is screwed to the first threaded hole 41, thereby firmly fixing the neck 37 and the positioning and cleaning unit 3 to the adapter shaft 19 in the axial direction. An axially extending through hole is provided on the first boss 39, and a second threaded hole 42 is provided at the top of the rotating output end 38. A second screw 44 passes through the through hole of the first boss 39 and is screwed to the second threaded hole 42, thereby firmly fixing the adapter shaft 19 to the top of the rotating output end 38 in the axial direction.

[0072] To summarize, axial and circumferential fixed connections are formed between the positioning cleaning unit 3 and the adapter shaft 19 , and between the adapter shaft 19 and the rotating output end 38 , ensuring that the positioning cleaning unit 3 is firmly installed and rotates synchronously with the rotating output end 38 during the wafer cleaning and drying process.

[0073] After the positioning and cleaning unit 3 and the adapter shaft 19 are axially fixed and circumferentially fixed, there is no relative rotation and relative displacement between the two. The positioning and cleaning unit 3 and the adapter shaft 19 can be integrated into a quick-change module 45. The quick-change module 45 can be axially fixedly connected to the rotating output end 38 by a second screw 44, and can be circumferentially fixed to the rotating output end 38 by a key connection. Figure 2 As shown in the figure, the second screw 44 is located in the central through hole 54. By inserting a tool from the top of the central through hole 54 to loosen / lock the second screw 44, the quick-change module 45 can be easily separated / connected from the rotation output end 38 of the spindle rotation assembly 4, thereby realizing rapid replacement or maintenance of the quick-change module 45, making the maintenance and parts replacement efficiency of the wafer cleaning device of the present invention higher.

[0074] Preferably, a plurality of quick-change modules 45 can be prepared, and positioning and cleaning units 3 suitable for different wafer specifications such as 6 inches, 8 inches or 12 inches can be installed respectively, so as to obtain quick-change modules 45 suitable for wafers of different sizes. When the wafer cleaning device of the present invention needs to clean wafers 27 of different sizes, quick-change modules 45 of corresponding sizes are selected and quick disassembly and installation are completed, which improves the replacement efficiency of the positioning and cleaning units 3 when cleaning wafers 27 of different sizes, and is more suitable for cleaning wafers 27 of different sizes.

[0075] Furthermore, the circumferential fixed connection between the positioning cleaning unit 3 and the adapter shaft 19, and the adapter shaft 19 and the main shaft rotation assembly 4 can also adopt spline connection, tapered pin fitting connection, bolt flange connection, etc., which can also maintain the stability of the rotational connection and the accuracy of the rotational motion transmission.

[0076] As an optional embodiment, the neck 37 can be directly connected to the rotating output end 38, so that the inner diameter of the central through hole 54 is equal to the outer diameter of the rotating output end 38, and the central through hole 54 and the rotating output end 38 are matched and connected. A radial through hole is provided in the neck 37, and the same number of radial threaded holes are provided in the adapter shaft 19, and screws pass through the through hole and the threaded hole to fix the positioning cleaning unit 3 with the adapter shaft 19. This connection method can also connect the positioning cleaning unit 3 and the spindle rotating assembly 4 in a detachable manner, and has the advantages of reducing the longitudinal occupied space and being more compact.

[0077] like Figure 2 As shown, preferably, a sealing cover 20 can be provided on the top of the positioning cleaning unit 3 to seal the connection between the positioning cleaning unit 3 and the adapter shaft 19. Specifically, the sealing cover 20 is connected to the top opening of the central through hole 54, and sealing the top opening can prevent the cleaning liquid from entering the central through hole 54. Since the top of the first boss 39 of the adapter shaft 19 is inserted into and matched with the central through hole 54, the cleaning liquid accumulated in the hole will rust and damage the matching part. The sealing cover 20 is conducive to maintaining the stability of the connection structure between the positioning cleaning unit 3 and the adapter shaft 19 and increasing its durability.

[0078] The sealing cover 20 can be designed as a detachable structure. Threads can be provided on the sealing cover 20 and the inner wall of the central through hole 54, so that the sealing cover 20 is screwed to the top opening of the central through hole 54 and has good sealing performance; the sealing cover 20 with a plug can also be used, and a corrosion-resistant rubber sealing ring is sleeved on the plug, and the diameter of the plug is larger than the inner diameter of the central through hole 54. The sealing ring fits tightly with the inner wall of the central through hole 54, so that the sealing cover 20 has good sealing performance.

[0079] After the sealing cover 20 is set, when disassembling the quick-change module 45 and the positioning cleaning unit 3, the sealing cover 20 must be removed first and then the second screw 44. The installation sequence during assembly is reversed, which is simple and easy. The sealing cover 20 has good sealing and protective effects, improves the durability of the positioning cleaning unit 3, and the detachable structural design of the sealing cover 20 makes the convenience of replacement and maintenance of the quick-change module 45 and the positioning cleaning unit 3 almost unaffected.

[0080] The spindle rotating assembly 4 may include a rotating assembly housing 35 and a motor 36. The motor 36 is fixedly connected to the rotating assembly housing 35. The motor 36 may include an output shaft and a motor housing 52, and the output shaft of the motor 36 is a specific embodiment of the rotating output end 38. Figure 2 As shown, the output shaft, the top of the motor housing 52 and the top 61 of the rotating assembly housing are exposed to the environment. During the cleaning process of the wafer 27, a cleaning liquid is sprayed to clean the wafer 27, and the cleaning liquid is easy to splash to these parts. Since the cleaning liquid is corrosive to a certain extent, if no protective measures are taken, the service life of the spindle rotating assembly 4 will be greatly shortened. Therefore, the output shaft, the top of the motor housing 52 and the top 61 of the rotating assembly housing can be coated with an anti-rust layer by spraying paint, electroplating or the like to prevent rust, or anti-rust materials such as stainless steel can be used in these parts.

[0081] The output shaft rotates relative to the motor housing 52, so it is difficult to avoid the cleaning liquid and external impurities from penetrating into the motor 36 from the connection between the two and causing damage. A protective sealing cover 18 can be provided at the connection between the positioning cleaning unit 3 and the adapter shaft 19 to play a protective role. The protective sealing cover 18 can be a fixed seal, the bottom of which is fixedly connected to the spindle rotating assembly 4. The protective sealing cover 18 is provided outside the rotating output end 38 to block splashing cleaning liquid. The adapter shaft 19 is also covered in the protective sealing cover 18 to isolate the splashing cleaning liquid generated during the wafer cleaning process.

[0082] Specifically, Figure 3It is shown that the protective sealing cover 18 may include a convex ring 47, an inner flange 48, a first step 49 and a second step 50. The second step 50 is arranged at the bottom of the protective sealing cover 18. The bottom surface of the second step 50 is in close contact with the top 61 of the rotating component housing. The second step 50 is circumferentially provided with through holes, and the top 61 of the rotating component housing is circumferentially provided with axially extending threaded holes. Screws pass through the through holes and are screwed into the threaded holes to fix the second step 50 to the top 61 of the rotating component housing. In this way, the protective sealing cover 18 is fixedly connected to the top of the spindle rotating assembly 4, effectively avoiding the influence of vibration or displacement caused by the operation of the equipment on the sealing effect, and ensuring the reliability and sealing of the device during efficient operation. The protective sealing cover 18 is not connected to the neck 37 and the adapter shaft 19, but is fixedly connected to the top 61 of the rotating component housing, that is, when the adapter shaft 19 is removed from the rotating output end 38, the protective sealing cover 18 still remains fixedly connected to the top 61 of the rotating component housing, which reduces the replacement of the quick-change module 45 (see Figure 2 ), which is conducive to improving the maintainability of the cleaning device of the present invention. In addition, the convex ring 47 and the inner flange 48 surround the lateral periphery of the adapter shaft 19, which is convenient for the disassembly and assembly operation of the quick replacement module 45.

[0083] The first step 49 is arranged on the inner side of the second step 50 , and the inner side surface of the first step 49 is a cylindrical surface, the inner diameter of the cylindrical surface is equal to the outer diameter of the second boss 51 of the motor 36 , and the second boss 51 plays a radial positioning role for the protective sealing cover 18 .

[0084] The inner flange 48 is arranged on the inner side of the first step 49 and extends radially toward the inner adapter shaft 19. The inner side surface of the inner flange 48 is close to the adapter shaft 19 and can be clamped to form a first narrow gap 56. The top of the inner flange 48 is close to the bottom of the flange 40 and can be clamped to form a second narrow gap 57.

[0085] The convex ring 47 is located at the top of the protective sealing cover 18, extends axially and is close to the bottom of the neck 37 of the positioning and cleaning unit 3, and can be clamped to form a third narrow gap 58. The inner side of the convex ring 47 and the outer peripheral surface of the flange 40 can be clamped to form a fourth narrow gap 59.

[0086] When the wafer is cleaned, the output shaft, the adapter shaft 19 and the neck 37 rotate synchronously at high speed, while the motor housing 52, the top 61 of the rotating component housing and the protective sealing cover 18 remain fixed. The first narrow slit 56, the second narrow slit 57, the third narrow slit 58 and the fourth narrow slit 59 form a narrow slit sealing structure, which can not only block the cleaning liquid and other contaminants, but also avoid friction and collision between the rotating and fixed parts. The narrow slit structure is continuous and curved, which can block contaminants from being adhered to and accumulated at the connection between the output shaft and the motor housing 52. The contaminants will corrode the structure of the connection and even penetrate into the motor housing 52, causing corrosion and damage, thereby improving the service life and operation stability of the cleaning equipment.

[0087] Furthermore, a protective cover 55 can be added above the protective sealing cover 18. The protective cover 55 is clamped between the flange 40 and the neck 37 to be fixed. The edge of the protective cover 55 extends outward and bends downward to cover the third narrow slit 58 and the fourth narrow slit 59 underneath, making it difficult for cleaning fluid and other dirt to splash inside, thereby enhancing the sealing performance of the narrow slit sealing structure.

[0088] Preferably, a gasket or filler for dynamic sealing can be provided in the above-mentioned narrow gap sealing structure to enhance the sealing effect of the narrow gap sealing structure; these gaskets and fillers can have a certain elasticity, and a tightening force can be applied to the gasket or filler through the structure on both sides of the narrow gap, which can further optimize the sealing effect.

[0089] Furthermore, the protective sealing cover 18 can be made of corrosion-resistant materials such as stainless steel to effectively withstand the erosion of wafer cleaning fluid and water vapor, ensuring that the protective sealing cover 18 has a good service life and protective effect during the long-term operation of the equipment.

[0090] like Figure 2 As shown, the rotating assembly housing 35 passes through the external frame 7. When the lifting assembly 5 drives the spindle rotating assembly 4 to move up and down, the rotating assembly housing 35 rises and falls synchronously relative to the external frame 7. In addition, the wafer cleaning device of the present invention can be set in a closed wafer cleaning area 28. Figure 2 The wafer cleaning area 28 has a high cleanliness level and is isolated from the external environment, ensuring that the surface of the wafer 27 remains clean before and after cleaning.

[0091] The wafer cleaning device of the present invention further includes a sealing bellows 22. The sealing bellows 22 is sleeved on the outside of the spindle rotating assembly 4, one end of the sealing bellows 22 is sealed and connected to the spindle rotating assembly 4, and the other end is sealed and connected to the joint 60 between the spindle rotating assembly 4 and the external frame 7. Specifically, one end of the sealing bellows 22 can be sealed and connected to the lower end surface of the radially outward protrusion of the top 61 of the rotating assembly housing, and the rotating assembly housing 35 passes through the external frame 7 and forms a joint 60 at the junction. The other end of the sealing bellows 22 is sealed and connected to the external frame 7 near the joint 60, and the sealing bellows 22 is used to prevent dust, liquid or other contaminants from entering the wafer cleaning area 28 through the joint 60.

[0092] A certain gap may be left between the inner wall of the sealing bellows 22 and the outer wall of the rotating assembly housing 35, thereby reducing the wear caused by friction between the main shaft rotating assembly 4 and the sealing bellows 22 during the up and down movement. The sealing bellows 22 is used to prevent dust, liquid or other pollutants in the outside air from entering the wafer cleaning area 28 through the joint 60, causing contamination of the surface of the wafer 27. In addition, since the sealing bellows 22 surrounds the outer side of the main shaft rotating assembly 4, it has an anti-collision operation, and can also prevent the cleaning liquid from splashing onto the rotating assembly housing 35 to cause corrosion, thereby extending the service life of the main shaft rotating assembly 4.

[0093] Furthermore, if Figure 2 As shown, the sealing bellows 22 has a certain degree of retractability, and its retractable length is greater than the lifting range of the lifting assembly 5. This design allows the sealing bellows 22 to freely retract and contract with the lifting movement of the equipment when the spindle rotating assembly 4 and the positioning and cleaning unit 3 are lifted and lowered, so as not to affect the normal operation of the equipment. The retractability of the sealing bellows 22 ensures that it always maintains a tight seal with the spindle rotating assembly 4 and the external frame 7, and will not leak or loosen due to the height change of the lifting assembly 5, further improving the sealing and stability of the equipment.

[0094] The sealing bellows 22 may be made of a material having high chemical corrosion resistance and good elasticity, to ensure that the sealing bellows 22 can maintain good sealing effect and elasticity even if it is splashed by cleaning liquid or corroded by corrosive gases in the working environment during use.

[0095] like Figure 2 As shown, the lifting assembly 5 can be an electric lifting slide, which is used for lifting and lowering the positioning cleaning unit 3 and positioning at different heights. The electric lifting slide automatically adjusts the positioning cleaning unit 3 to the corresponding height according to the requirements of different processes such as positioning, wafer splicing, cleaning and drying, thereby reducing the error of manual operation and improving the movement accuracy of the positioning cleaning unit 3 and the wafer cleaning efficiency.

[0096] Specifically, the electric lifting slide comprises a screw nut 29, a screw 30 and a slide base 34. The screw 30 is rotatably connected to the slide base 34 through a bearing and is fixed relative to the axial direction of the slide base 34. The screw nut 29 is fixedly connected to the external frame 7, and the screw nut 29 and the screw 30 are connected by threads to form a spiral transmission structure. When the screw 30 rotates, the screw nut 29 is fixed and the screw 30 moves along the axial direction. Figure 2 In the figure, the screw rod 30 drives the slide base 34 to rise or fall together.

[0097] The slide base 34 includes a slide connection seat 53 fixedly connected thereto. The slide connection seat 53 is fixedly connected to the rotating assembly housing 35, so that the slide base 34 is fixedly connected to the spindle rotating assembly 4. A drive motor is fixedly arranged on the slide base 34, and the drive motor is connected to the screw rod 30 ( Figure 2 The driving motor (not shown) drives the screw 30 to rotate, so that the slide base 34 drives the spindle rotating assembly 4 to rise or fall together. The slide base 34 also includes a guide rod 21. Specifically, two guide rods 21 are arranged in parallel on both sides of the screw 30, and are fixedly connected to the slide base 34 and pass through the screw nut 29. The guide rod 21 cooperates with the screw nut 29 to limit the rotation of the slide base 34 during the lifting process, ensuring that the position of the positioning cleaning unit 3 is accurate during the lifting and lowering adjustment.

[0098] In order to further improve the structural stability of the lifting assembly 5, preferably, as Figure 2 As shown, the wafer cleaning device of the present invention also includes an auxiliary guide device 31. The auxiliary guide device 31 includes an auxiliary guide rod 32 and a guide seat 33. The auxiliary guide rod 32 and the guide seat 33 cooperate with each other to guide the lifting assembly 5 to move along the axial direction of the auxiliary guide rod 32, so that the wafer 27 is more stable during the cleaning process. Specifically, in this embodiment, the auxiliary guide rod 32 is fixedly connected to the slide connection seat 53 and is parallel to the screw rod 30, and the guide seat 33 is fixedly connected to the external frame 7 and is connected with the auxiliary guide rod 32. A through hole can be set inside the guide seat 33, which is sleeved on the outside of the auxiliary guide rod 32 to form a shaft-hole fit; a linear bearing can also be installed in the through hole of the guide seat 33 to reduce the sliding resistance between the guide seat 33 and the auxiliary guide rod 32, so that the lifting and lowering of the slide base 34 is smoother.

[0099] Figure 4 for Figure 1 A three-dimensional diagram of the positioning cleaning unit of the embodiment.

[0100] like Figure 4As shown, the positioning and cleaning unit 3 of the present invention comprises a wafer conveying and positioning device 1 and a wafer rotation positioning device 2. Preferably, the wafer conveying and positioning device 1 may include a pair of conveying and positioning claws 9 arranged at intervals in the circumferential direction, and the wafer rotation positioning device 2 may include a pair of rotation positioning claws 10 arranged at intervals in the circumferential direction. These claws are used to position the wafer 27 (see FIG. 1 ) during the wafer conveying, positioning and rotation process. Figure 5 ) to ensure the stability of the position of the wafer 27 during the spin cleaning and spin drying operations. Each transport positioning claw 9 may include a transport positioning stop post 11 and a first clamping member 13. Each rotation positioning claw 10 may include a rotation positioning stop post 12 and a second clamping member 14.

[0101] Further, each transport positioning claw 9 may include two separated transport positioning posts 11 and a first clamping member 13 located between the transport positioning posts 11, and each rotation positioning claw 10 may include two separated rotation positioning posts 12 and a second clamping member 14 located between the rotation positioning posts 12. The arrangement of the positioning posts at both sides and the clamping member in the middle is conducive to accurate and firm clamping of the wafer 27.

[0102] The transport positioning stop post 11 is higher than the rotation positioning stop post 12, ensuring that the wafer 27 can pass over the rotation positioning stop post 12 along the transport direction of the wafer and then be stopped by the transport positioning stop post 11. The rotation positioning claw 10 and the transport positioning claw 9 together complete the positioning of the wafer 27. The first clamping member 13 and the second clamping member 14 can clamp the outer periphery of the wafer 27 and stably fix the wafer 27 on the positioning and cleaning unit 3, so as to facilitate the rotation cleaning and / or spin drying of the wafer 27, ensuring that the wafer 27 is accurately positioned and stably positioned during the rotation cleaning and spin drying process.

[0103] The coordinated clamping action of the first clamping member 13 and the second clamping member 14 ensures that the wafer 27 can be stably and evenly supported and clamped during the entire wafer cleaning process, whether it is cleaning or drying, to prevent deviation or loosening. The conveying positioning stop column 11, the rotating positioning stop column 12 and the first clamping member 13 and the second clamping member 14 cooperate to first position and then clamp. This wafer clamping operation reduces the range of motion required by the first clamping member 13 and the second clamping member 14, reduces the space occupied, and makes the structure of the wafer cleaning device of the present invention more compact.

[0104] The first clamping member 13 is pivotally connected between the two conveying positioning posts 11. Specifically, the first clamping member 13 is rotatably connected to the horizontal rotation axis between the two conveying positioning posts 11. The horizontal rotation axis enables the bottom end of the first clamping member 13 to rotate outward while the top end rotates inward to stably clamp the wafer 27.

[0105] In order to enhance the clamping effect, the middle of the first clamping member 13 can be pivotally connected between the conveying positioning stopper columns 11, and the first counterweight block 15 is provided at the bottom end of the first clamping member 13. When the wafer 27 is in a high-speed rotating state, the centrifugal force acts on the first counterweight block 15, so that the first counterweight block 15 drives the bottom end of the first clamping member 13 to rotate toward the outside of the positioning and cleaning unit 3, and the top end of the first clamping member 13 rotates toward the inside of the positioning and cleaning unit 3, so as to clamp the outer periphery of the wafer 27.

[0106] Similarly, the middle of the second clamping member 14 can be pivotally connected between the rotation positioning stopper columns 12, and a second counterweight block 16 is provided at the bottom end of the second clamping member 14. Based on the same principle, when the wafer 27 rotates, the bottom end of the second clamping member 14 rotates toward the outside of the positioning and cleaning unit 3, and the top end of the second clamping member 14 rotates toward the inside of the positioning and cleaning unit 3 to clamp the outer periphery of the wafer 27 to prevent the wafer 27 from shifting or loosening during rotation, so as to facilitate the rotation cleaning and / or drying of the wafer 27.

[0107] In this embodiment, there are two first clamping members 13 and two second clamping members 14, which clamp the outer periphery of the wafer 27 from four directions. As required, other numbers of first clamping members 13 and second clamping members 14 may be used, or the direction of the clamping force may be adjusted by adjusting the positions of the clamping members, so as to adapt to wafers 27 of different shapes. In addition, the first counterweight 15 and the second counterweight 16 enable the first clamping member 13 and the second clamping member 14 to have an automatic centering function, so that the wafer 27 automatically obtains balance during rotation, is free from the influence of eccentric vibration, and enhances the rotation stability of the wafer 27.

[0108] In the wafer cleaning device of the present invention, the conveying positioning claw 9 and the rotating positioning claw 10 also include a support structure for supporting the wafer 27 and ensuring that the wafer 27 remains stable during the positioning and cleaning process. Specifically, each conveying positioning claw 9 includes a first support column 24 arranged on the inner side thereof. The first support column 24 is located on the inner side of the conveying positioning stop column 11. Similarly, each rotating positioning claw 10 includes a second support column 25 arranged on the inner side thereof, and the second support column 25 is located on the inner side of the rotating positioning stop column 12. In this embodiment, the two first support columns 24 and the two second support columns 25 provide four support points located on the same plane for the wafer 27, providing reliable horizontal support for the wafer 27 during the cleaning and drying process.

[0109] In order to ensure the position stability of the wafer 27 in different processes, the tops of the first support column 24 and the second support column 25 are designed to be on the same horizontal plane. In an optional embodiment, the tops of the first support column 24 and the second support column 25 are respectively configured as platform structures to make surface contact with the surface of the wafer 27 to improve the stability of supporting the wafer 27. This design allows the wafer 27 to maintain a horizontal posture throughout the cleaning and processing process, avoiding inaccurate positioning and eccentric vibration caused by tilting or shaking, thereby improving the stability of the equipment and the cleaning effect.

[0110] In addition, since the first clamping member 13 and the second clamping member 14 have a self-centering adjustment function, the platform structure of the first support column 24 and the second support column 25 allows the wafer 27 to slide slightly on the top thereof, ensuring that the wafer 27 can automatically adjust to a rotationally balanced position under the action of the clamping members, thereby improving the centering accuracy and stability of the wafer 27 during rotation.

[0111] In addition, both the transport positioning claw 9 and the rotation positioning claw 10 can be installed on the positioning and cleaning unit 3 by means of fixed connection such as screws, so as to achieve stable positioning of the wafer 27. When installing, both need to face the center of the positioning and cleaning unit 3, so as to ensure that the first support column 24 of the transport positioning claw 9 and the second support column 25 of the rotation positioning claw 10 are both located on the inner side of the positioning and cleaning unit 3, ensuring accurate support and positioning of the wafer 27.

[0112] Figure 5 It is a schematic diagram of a positioning cleaning unit of a wafer cleaning system of the present invention when it is at a positioning height; Figure 6 It is a schematic diagram of a wafer cleaning system of the present invention when the positioning cleaning unit is at a wafer connection height; Figure 7 It is a schematic diagram of a wafer cleaning system of the present invention when the positioning cleaning unit is at a cleaning height; Figure 8 It is a schematic diagram of a wafer cleaning system of the present invention when the positioning cleaning unit is at a recovery height; Fig. 9 This is a top view of the wafer cleaning system of the present invention when the positioning cleaning unit is at the wafer height. Figures 5 to 9 The working states of the positioning cleaning unit 3 of the wafer cleaning device at different heights and the structure of the wafer cleaning system are described.

[0113] The positioning and cleaning unit 3 of the wafer cleaning device of the present invention has a positioning height, a wafer bonding height, a cleaning height and a recovery height.

[0114] like Figure 5As shown, when the positioning and cleaning unit 3 is at the positioning height, the top of the wafer conveying and positioning device 1 is higher than the wafer 27, and the top of the wafer rotation positioning device 2 is lower than the wafer 27. The wafer conveying and positioning device 1 is configured to stop and position the wafer 27 that has been transported through the wafer rotation positioning device 2 at the wafer conveying and positioning device 1. The wafer cleaning device of the present invention uses the wafer conveying and positioning device 1 to stop the wafer 27 at the positioning height so as to perform the next action.

[0115] like Figure 6 As shown, when the positioning and cleaning unit 3 is at the wafer-joining height, the top of the wafer conveying and positioning device 1 and the top of the wafer rotating and positioning device 2 are both higher than the wafer 27, and are used to position the wafer 27 in the positioning and cleaning unit 3 from both sides. The wafer cleaning device of the present invention uses the wafer conveying and positioning device 1 and the wafer rotating and positioning device 2 to position the wafer 27 at the wafer-joining height so as to perform the next action.

[0116] like Figure 7 As shown, when the positioning cleaning unit 3 is at the cleaning height, the positioning cleaning unit 3 is higher than the wafer conveying path as a whole. At the recovery height, the positioning cleaning unit 3 is lower than the wafer conveying path as a whole. The "wafer conveying path" and "wafer conveying direction" here are both determined by the structure of the wafer conveying equipment. For example, the wafer conveyor belt 23 used in this embodiment is a part of the wafer conveying equipment that supports and transports the wafer 27. The wafer 27 is placed on the wafer conveyor belt 23 and driven to move, as shown in FIG. Fig. 9 The rightward arrow direction in the figure is the wafer conveying direction, and the path through which the wafer 27 moves is the wafer conveying path. A plurality of horizontally arranged rollers can also be used to alternately convey the wafer 27 instead of the wafer conveyor belt 23.

[0117] Therefore, at the cleaning height, the wafer cleaning device of the present invention carries the wafer 27 up to the cleaning height, and the positioning cleaning unit 3 at the cleaning height is higher than the wafer connection height as a whole, so that the wafer cleaning device has enough space to clean the wafer 27. The spindle rotating assembly 4 is used to drive the positioning cleaning unit 3 and the wafer 27 to rotate for cleaning and / or drying.

[0118] like Figure 8 As shown, when the positioning and cleaning unit 3 is at the recovery height, the wafer 27 is replaced on the wafer conveyor belt 23, and the wafer conveying positioning device 1 and the wafer rotation positioning device 2 are both lower than the wafer 27, so that the wafer conveyor belt 23 can drive the wafer 27 to move along the wafer conveying direction to the next workstation.

[0119] Figures 5 to 9The wafer cleaning system of the present invention is shown in the figure, and the wafer cleaning system includes the wafer cleaning device disclosed in the present invention, and two parallel and spaced wafer conveyor belts 23 for conveying wafers 27. The design purpose of the wafer cleaning system is to realize the automatic conveying, positioning, cleaning and drying operations of the wafer 27, and improve the cleaning efficiency of the wafer 27. In addition, the two wafer conveyor belts 23 are arranged in parallel and spaced, so that the positioning and cleaning unit 3 is located between the two wafer conveyor belts 23, and the distance between the two wafer conveyor belts 23 is less than the diameter of the wafer 27 and greater than the width of the positioning and cleaning unit 3. The width of the positioning and cleaning unit 3 is as shown in FIG. Fig. 9 As shown in D in FIG. This arrangement ensures that the wafer 27 can be stably transported on the wafer conveyor belt 23, and when the width direction of the positioning and cleaning unit 3 is perpendicular to the wafer conveying direction, the positioning and cleaning unit 3 can freely move up and down between the two wafer conveyor belts 23, thereby switching the positioning and cleaning unit 3 between positioning, splicing, cleaning, and recovery height. Furthermore, a plurality of rollers 26 are arranged in parallel and spaced apart to better support the wafer conveyor belt 23 and prevent the wafer conveyor belt 23 from collapsing due to the weight of the wafer. The wafer conveyor belt 23 is embedded in the groove on the surface of the roller 26. Preferably, the wafer conveyor belt 23 can protrude outward from the groove to prevent the roller 26 from contacting and scratching the wafer 27. The wafer conveyor belt 23 is tensioned and driven by the roller 26, thereby realizing the transmission of the wafer 27.

[0120] In the wafer cleaning system of the present invention, the positioning cleaning unit 3 has multiple working positions, including positioning height, wafer connection height, cleaning height and recovery height. Each height setting corresponds to a different operation step, ensuring efficient processing of the wafer 27 during the entire cleaning and transfer process.

[0121] At the positioning height, the wafer conveying and positioning device 1 is higher than the wafer 27, and the wafer rotating and positioning device 2 is lower than the wafer 27. The positioning and cleaning unit 3 stops the wafer 27 at the positioning height to complete the preliminary positioning.

[0122] At the wafer connection height, the wafer conveying and positioning device 1 and the wafer rotation positioning device 2 are both higher than the wafer 27. At this position, the wafer 27 completely enters the inner side of the wafer conveying and positioning device 1 and the wafer rotation positioning device 2, and the wafer 27 is positioned in the positioning and cleaning unit 3, effectively preventing the wafer 27 from shifting or slipping during the subsequent cleaning process.

[0123] At the cleaning height, the positioning cleaning unit 3 and the wafer conveying positioning device 1 and the wafer rotating positioning device 2 included therein are higher than the wafer conveyor belt 23 as a whole. At this position, the positioning cleaning unit 3 can rotate freely without interfering with the wafer conveyor belt 23.

[0124] At the restored height, the positioning and cleaning unit 3 and the wafer conveying and positioning device 1 and the wafer rotating and positioning device 2 included therein are lower than the wafer 27 as a whole, specifically, lower than the contact surface between the bottom of the wafer 27 and the wafer conveyor belt 23. The positioning and cleaning unit 3 at the restored height is out of contact with the wafer 27. The wafer 27 remains on the wafer conveyor belt 23.

[0125] The positioning cleaning unit 3 of the wafer cleaning system will complete various steps of wafer cleaning at different positions of positioning height, wafer connection height, cleaning height and recovery height, making the cleaning process more accurate and efficient and improving the cleaning effect.

[0126] Fig.10 The following is a flowchart of the wafer cleaning method. Fig.10 The method flow of positioning and cleaning a wafer in the wafer cleaning system of the present invention is described.

[0127] As shown in the figure, the present invention also provides a method for performing wafer positioning and cleaning on a wafer cleaning system, including four steps of positioning, wafer joining, cleaning and drying, and resetting. The dynamic process of each step will be described in detail below.

[0128] In the positioning step, the positioning and cleaning unit 3 is moved to the positioning height, and the wafer 27 is transferred to the wafer cleaning system of the present invention by the external transmission system through the wafer conveyor belt 23, and the wafer conveying and positioning device 1 stops the wafer 27. At this time, the top of the wafer conveying and positioning device 1 is higher than the wafer 27, and the position of the wafer rotation positioning device 2 is lower than the wafer 27. Therefore, the wafer 27 can pass above the wafer rotation positioning device 2 and be stopped by the wafer conveying and positioning device 1, so that the wafer 27 stays above the positioning and cleaning unit 3.

[0129] In the wafer splicing step, the positioning and cleaning unit 3 is moved up to the wafer splicing height, and the wafer rotation positioning device 2 and the wafer conveying and positioning device 1 radially position the wafer 27. At this time, the wafer conveying and positioning device 1 and the wafer rotation positioning device 2 are both higher than the wafer 27, and the first support column 24 and the second support column 25 just contact or are close to the wafer 27. It should be noted that at this time, the conveying positioning stop column 11 and the rotation positioning stop column 12 position the wafer 27, but do not tightly clamp the wafer 27. The wafer conveying and positioning device 1 and the wafer rotation positioning device 2 cooperate to position the wafer 27 to ensure that no obvious offset and shaking will occur during the movement of the positioning and cleaning unit 3. In this step, the wafer 27 is firmly held in the positioning and cleaning unit 3, ready for the subsequent cleaning and drying.

[0130] In the cleaning and drying steps, the positioning cleaning unit 3 is moved up to the cleaning height, and the spindle rotating assembly 4 drives the positioning cleaning unit 3 to rotate to clean and dry the wafer 27. The spindle rotating assembly 4 drives the wafer 27 to rotate around its central axis. The first clamping member 13 and the second clamping member 14 firmly clamp the wafer 27 due to the centrifugal effect and automatically complete the centering adjustment. The cleaning liquid is evenly sprayed on the surface of the wafer 27 through the nozzle. During the rotation process, the cleaning liquid covers the entire wafer to achieve comprehensive cleaning. After the cleaning is completed, the drying is continued through the rotation operation. When the wafer is rotating at high speed, the water remaining on the surface is quickly thrown out by the centrifugal force, thereby completing the drying process. The entire cleaning and drying process is carried out automatically to ensure uniform and efficient wafer cleaning.

[0131] The reset step includes that after the wafer cleaning device of the present invention completes cleaning and drying, the spindle rotating assembly 4 stops rotating and the positioning cleaning unit 3 is lowered to the recovery height. At this time, since the positioning cleaning unit 3 also stops rotating, the first clamping member 13 and the second clamping member 14 automatically loosen the clamping of the wafer 27. During the descent process, the positioning cleaning unit 3 descends from above the wafer conveyor belt 23 to below the wafer conveyor belt 23. Since the width of the wafer 27 is greater than the interval between the two wafer conveyor belts 23, the wafer 27 falls to the wafer conveyor belt 23 during the descent process and is supported by the wafer conveyor belt 23. The positioning cleaning unit 3 continues to descend and loses contact with the wafer 27 until the wafer conveying positioning device 1 is lower than the wafer 27 and reaches the reset height. Start the wafer conveyor belt 23 to transport the wafer 27 to the next station.

[0132] After the resetting step, the wafer cleaning system can repeat the above-mentioned positioning, wafer joining, cleaning, drying and resetting steps to clean the next wafer.

[0133] The present invention also relates to a wafer chemical mechanical polishing device, which has the wafer cleaning system of the present invention. After completing the chemical mechanical polishing of the wafer, the wafer chemical mechanical polishing device positions, cleans and spin-dries the polished wafer through the wafer cleaning system. By integrating the wafer cleaning system with the polishing device, the space utilization rate of the device can be effectively improved, the size of the device can be reduced, the risk of contamination and falling of the wafer during transportation can be reduced, and the processing efficiency can be improved.

[0134] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A wafer cleaning device, characterized in that: The wafer cleaning device comprises: A wafer conveying and positioning device and a wafer rotation positioning device, wherein the top of the wafer conveying and positioning device is higher than the wafer rotation positioning device, and the wafer conveying and positioning device and the wafer rotation positioning device are integrated into a positioning and cleaning unit; a spindle rotating assembly, the spindle rotating assembly being connected below the positioning and cleaning unit and being used for driving the positioning and cleaning unit to rotate; and A lifting assembly is connected to the bottom of the main shaft rotating assembly, and is used to drive the main shaft rotating assembly and the positioning and cleaning unit to rise and fall, and utilizes the different heights of the main shaft rotating assembly to achieve the conveying positioning and rotation positioning of the wafer.

2. The wafer cleaning device according to claim 1, characterized in that: The wafer conveying positioning device and the wafer rotation positioning device are positioned along the conveying direction of the wafer. The wafer conveying positioning device is configured to stop the wafer in the conveying direction of the wafer. The wafer rotation positioning device is configured to radially position the wafer together with the wafer conveying positioning device.

3. The wafer cleaning device according to claim 2, characterized in that: The wafer conveying and positioning device includes a pair of conveying and positioning claws arranged at circumferential intervals, and the wafer rotation positioning device includes a pair of rotation positioning claws arranged at circumferential intervals, each of the conveying and positioning claws includes a conveying and positioning stop post and a first clamping member, and each of the rotation positioning claws includes a rotation positioning stop post and a second clamping member, the conveying and positioning stop post is higher than the rotation positioning stop post, and the first clamping member and the second clamping member are used to clamp the outer periphery of the wafer to facilitate rotation cleaning and / or spin drying of the wafer.

4. The wafer cleaning device according to claim 3, characterized in that: Each of the conveying positioning claws includes two separated conveying positioning posts and the first clamping member located between the conveying positioning posts, and each of the rotation positioning claws includes two separated rotation positioning posts and the second clamping member located between the rotation positioning posts.

5. The wafer cleaning device according to claim 4, characterized in that: The middle part of the first clamping member is pivotally connected between the conveying positioning blocking columns, the top end of the first clamping member is used to clamp the outer periphery of the wafer, and the bottom end of the first clamping member is provided with a first counterweight block; The middle part of the second clamping member is pivotally connected between the rotation positioning blocking columns, the top end of the second clamping member is used to clamp the outer periphery of the wafer, and the bottom end of the second clamping member is provided with a second counterweight block.

6. The wafer cleaning device according to claim 4, characterized in that: Each of the conveying positioning claws includes a first supporting column arranged on the inner side thereof, and each of the rotating positioning claws includes a second supporting column arranged on the inner side thereof, and the top ends of the first supporting column and the second supporting column are located in the same horizontal plane.

7. The wafer cleaning device according to claim 1, characterized in that: The lifting component is an electric lifting slide, which is used for lifting and lowering the positioning and cleaning unit and positioning it at different heights.

8. The wafer cleaning device according to claim 1, characterized in that: The positioning and cleaning unit and the main shaft rotating assembly are connected in a detachable manner, and a protective sealing cover is arranged at the connection portion between the positioning and cleaning unit and the main shaft rotating assembly.

9. The wafer cleaning device according to claim 8, characterized in that: The protective sealing cover is a fixed sealing component, the bottom of the protective sealing cover is fixedly connected to the main shaft rotating component, and the protective sealing cover is arranged outside the rotating output end of the main shaft rotating component.

10. The wafer cleaning device according to claim 8, characterized in that: The positioning and cleaning unit and the spindle rotating assembly are connected via an adapter shaft, the adapter shaft is connected to the positioning and cleaning unit via a first boss and a flange arranged at the top, the adapter shaft is connected to the rotating output end of the spindle rotating assembly via a connecting hole arranged at the bottom, and the adapter shaft is covered in the protective sealing cover.

11. The wafer cleaning device according to claim 10, characterized in that: A sealing cover is provided on the top of the positioning and cleaning unit for sealing the connection portion between the positioning and cleaning unit and the adapter shaft.

12. The wafer cleaning device according to claim 1, characterized in that: The lifting assembly includes an auxiliary guide device, which includes an auxiliary guide rod and a guide seat. The auxiliary guide rod and the guide seat cooperate with each other, and the auxiliary guide device is used to guide the lifting assembly to move axially along the auxiliary guide rod.

13. The wafer cleaning device according to claim 1, characterized in that: The wafer cleaning device includes a sealing bellows, which is sleeved on the outside of the spindle rotating assembly. One end of the sealing bellows is sealed and connected to the spindle rotating assembly, and the other end is sealed and connected to the joint between the spindle rotating assembly and the external frame. The sealing bellows is used to prevent contaminants from entering the wafer cleaning area through the joint.

14. The wafer cleaning device according to claim 13, characterized in that: The retractable length of the sealing bellows is greater than the lifting range of the lifting assembly.

15. The wafer cleaning device according to claim 1 or 2, characterized in that: The positioning and cleaning unit has a positioning height, a splicing height, a cleaning height and a recovery height. At the positioning height, the top of the wafer conveying and positioning device is higher than the wafer, the top of the wafer rotating and positioning device is lower than the wafer, and the wafer conveying and positioning device is configured to position a wafer stopper transmitted through the wafer rotating and positioning device at the wafer conveying and positioning device; At the wafer joint height, the top of the wafer conveying and positioning device and the top of the wafer rotating and positioning device are both higher than the wafer, so as to position the wafer in the positioning and cleaning unit; At the cleaning height, the positioning cleaning unit as a whole is higher than the height of the splice; and At the restored height, the positioning and cleaning unit is entirely lower than the wafer conveying path.

16. A wafer cleaning system, characterized in that: The wafer cleaning system comprises: A wafer cleaning device as claimed in any one of claims 1 to 14; and Two parallel and spaced wafer conveyor belts, the positioning and cleaning unit is located between the two wafer conveyor belts, and the distance between the two wafer conveyor belts is smaller than the diameter of the wafer and larger than the width of the positioning and cleaning unit.

17. The wafer cleaning system according to claim 16, wherein: The positioning and cleaning unit has a positioning height, a splicing height, a cleaning height and a recovery height. At the positioning height, the wafer conveying and positioning device is higher than the wafer, and the wafer rotating and positioning device is lower than the wafer; At the wafer joint height, the wafer conveying and positioning device and the wafer rotating and positioning device are higher than the wafer, so that the wafer is positioned in the positioning and cleaning unit; At the cleaning height, the positioning cleaning unit is higher than the wafer conveyor belt as a whole; and At the restored height, the positioning and cleaning unit is entirely lower than the wafer.

18. A wafer chemical mechanical polishing device, characterized in that: The wafer chemical mechanical polishing equipment has a wafer cleaning system as described in claim 16 or 17 above.

19. A wafer cleaning method, using the wafer cleaning system according to claim 17 to perform wafer cleaning, characterized in that: The steps of the method include: Positioning: moving the positioning and cleaning unit to a positioning height, and the wafer conveying and positioning device stops the wafer; Joining wafers: the positioning and cleaning unit is moved upward to the joining wafer height, and the wafer rotation positioning device and the wafer conveying and positioning device together radially position the wafer; Cleaning and drying: the positioning cleaning unit is moved upward to a cleaning height, and the spindle rotating assembly drives the positioning cleaning unit to rotate, so as to clean and dry the wafer; and Reset: the spindle rotating assembly stops rotating, the positioning and cleaning unit is lowered to the recovery height, the wafer falls onto the wafer conveyor belt during the lowering process, and the wafer conveyor belt transports the wafer to the next workstation.

Images