Wafer film pasting system

Abstract

The invention relates to the field of semiconductor wafer manufacturing, and provides a wafer film pasting system which is reasonable in design and compact in structure and can solve the technical problem of continuous film pasting operation of wafers and wafer rings in the prior art. The system comprises a wafer loading device, a wafer transfer calibration device, a wafer ring storage and transmission device, a film pasting workbench, a wafer and wafer ring film pasting post-transmission device, and a wafer film pasting device, a wafer labeling device and a wafer box automatic receiving device which are arranged in sequence, the wafer ring is borne by the film pasting workbench and is transmitted between the wafer ring storage and transmission device and the wafer film pasting device, and the wafer and wafer ring film-pasted assembly is borne by the wafer and wafer ring film-pasted transmission device and is transmitted among the wafer film pasting device, the wafer labeling device and the wafer box automatic receiving device.

Description

Technical Field

[0001] The invention relates to the field of semiconductor wafer manufacturing, and in particular to a wafer film attaching system. Background Art

[0002] Semiconductor wafers are one of the most basic and important components in the manufacture and packaging of microelectronic devices. The circuits on the surface of the wafer are the most critical parts of microelectronic devices such as semiconductor transistors and integrated circuits.

[0003] In the semiconductor packaging process, the incoming wafer needs to be thinned, polished and diced to achieve the particle shape of the chip. However, after the wafer is thinned, a wafer film used for dicing must be attached to the back of the chip before dicing can begin. The wafer film needs to be installed on a fixed wafer ring to support the wafer so that the chip particles will not scatter after the wafer is cut.

[0004] Therefore, the lamination of wafers and wafer rings is a very important part of the wafer processing technology.

[0005] To this end, we propose a wafer bonding system. Summary of the invention

[0006] 1. Technical issues to be solved

[0007] The invention provides a wafer film pasting system, which has reasonable design and compact structure and can solve the technical problem of the existing continuous film pasting operation of wafers and wafer rings.

[0008] (II) Technical solution

[0009] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0010] A wafer film pasting system comprises a wafer loading device, a wafer transfer calibration device, a wafer ring storage and transmission device, a film pasting workbench, a wafer and wafer ring post-film pasting transmission device, and a sequentially arranged wafer film pasting device, a wafer labeling device, and a wafer box automatic receiving device. The wafer ring is carried by the film pasting workbench and transmitted between the wafer ring storage and transmission device and the wafer film pasting device. The components of the wafer and wafer ring after film pasting are carried by the wafer and wafer ring post-film pasting transmission device and transmitted between the wafer film pasting device, the wafer labeling device, and the wafer box automatic receiving device.

[0011] Furthermore, the wafer loading device comprises a wafer box carrier and a wafer box opening and closing mechanism, wherein a door of the wafer box opening and closing mechanism is arranged at the front side of the wafer box carrier and is opened and closed by a driving unit;

[0012] A wafer transfer calibration device, comprising a wafer robot and a wafer edge finder, wherein the wafer robot is used to transfer the wafer in the wafer box to the wafer edge finder through the door frame for calibration;

[0013] A wafer ring storage and transmission device comprises a wafer ring storage mechanism and a wafer ring transmission mechanism, wherein the wafer ring storage mechanism comprises a wafer ring carrying plate and wafer ring positioning columns, and a group of wafer ring positioning columns arranged around the wafer ring are detachably mounted on the wafer ring carrying plate;

[0014] Furthermore, a hollow positioning sleeve is installed on the wafer ring supporting plate, and the wafer ring positioning column is installed in the positioning sleeve and detected by a photoelectric sensor.

[0015] Furthermore, the wafer ring carrying plate is slidably mounted on the wafer ring storage workbench via guide rails and is fixed via locking members.

[0016] Furthermore, a fixed mounting plate is installed at the output end of the wafer ring transmission mechanism, a movable buffer plate is elastically connected to the lower side of the fixed mounting plate through an elastic component, and a suction cup component is installed on the movable buffer plate.

[0017] Furthermore, the wafer film bonding device includes a roll film unloading mechanism, a roll film receiving mechanism, a release paper receiving mechanism, a film winding roller assembly, a film pressing roller, a film pulling mechanism, a wafer film pressing mechanism and a film cutting mechanism, wherein the roll film unloading mechanism, the release paper receiving mechanism, the film winding roller assembly and the film pressing roller are located on one horizontal side of the film cutting mechanism, the roll film receiving mechanism is located on the other horizontal side of the film cutting mechanism, and the film pulling mechanism and the wafer film pressing mechanism are arranged below the film cutting mechanism and can be translated in the horizontal direction;

[0018] The film cutting mechanism includes a film cutting lifting unit, a film cutting rotation driving unit, a mounting platform, a rotating platform and a rotating film cutting mechanism. The output end of the film cutting lifting unit is connected to the mounting platform. The mounting platform is rotatably supported below a rotating platform, and a film cutting rotation driving unit is fixed above the mounting platform. The film cutting rotation driving unit is used to drive the rotating platform to rotate. The rotating film cutting mechanism includes a film cutting unit and a film pressing unit, and the film cutting unit and the film pressing unit are mounted at both ends of the rotating platform.

[0019] Furthermore, the film cutting unit and the film pressing unit are slidably mounted on the rotating platform via a guide assembly and fixed via a locking member, and the guide assembly is arranged along the length direction of the rotating platform.

[0020] Furthermore, the roller of the film pressing unit is installed on a roller seat, and the roller seat is elastically connected to the bottom of the rotating platform. Specifically, the roller seat and the adjustment plate above the rotating platform are guided and matched through a guide column, and a spring is installed on the guide column, and the two ends of the spring are respectively against the rotating platform and the roller seat.

[0021] Further, the wafer and wafer ring post-filming transmission device includes a component transmission flip mechanism and a component horizontal transmission mechanism;

[0022] The component transmission flip mechanism includes a component horizontal drive unit, a component vertical drive unit, a crossbeam, a component flip drive unit and a gripping part controlled by a motor, wherein the component vertical drive unit is installed at the output end of the component horizontal drive unit, the crossbeam and the component flip drive unit are installed at the output end of the component vertical drive unit, the component flip drive unit is used to drive the crossbeam to perform a vertical 180-degree flipping action, the gripping part is installed on the crossbeam, and the gripping part includes a suction cup assembly;

[0023] The component horizontal transmission mechanism comprises a pair of component horizontal transmission rails with adjustable rail widths, and a cylinder clamp symmetrically connected to the pair of component horizontal transmission rails.

[0024] Furthermore, the grasping part includes a suction cup cylinder, a clamping claw column and a clamping claw cylinder. A pair of suction cup cylinders are symmetrically installed at both ends of the lower part of the beam. The output end of the suction cup cylinder is connected to a mounting frame, and the mounting frame is installed with a first suction cup assembly and a clamping claw cylinder. The output end of the clamping claw cylinder is connected to a pair of clamping claw columns, and a groove body for accommodating the outer edge of the wafer is opened on the clamping claw column.

[0025] Furthermore, a cantilever mechanism is provided on one side of the component horizontal transmission mechanism, the cantilever mechanism includes a cantilever and a cantilever horizontal driving unit, the cantilever is installed at the output end of the cantilever horizontal driving unit and extends above the component horizontal transmission mechanism, and the cantilever horizontal driving unit is arranged in parallel with the component horizontal transmission mechanism;

[0026] A limit plate and an inspection sensor are fixedly connected below the end of the cantilever and are slidably connected with a push block in a direction parallel to the horizontal transmission mechanism of the component. The end of the push block is elastically abutted against the limit plate through an elastic component and is connected to the inspection sensor through a touch rod.

[0027] Furthermore, the film laminating workbench includes a wafer ring fixing seat, a wafer fixing seat, a transfer seat and a horizontal driving unit for the film laminating workbench. The upper end surface of the wafer ring fixing seat is formed with a wafer ring positioning groove and a hollow opening concentric with the wafer ring fixing groove. The wafer fixing seat is installed in the hollow opening. The wafer ring fixing seat and the wafer fixing seat are installed on the transfer seat. The transfer seat is driven by the horizontal driving unit of the film laminating workbench to transfer between the wafer film laminating device and the wafer and wafer ring post-film laminating transmission device.

[0028] Further, a wafer labeling device includes a labeling mechanism and a labeling workbench;

[0029] The labeling mechanism is arranged above the cylinder fixture;

[0030] The labeling workbench is arranged below the labeling mechanism and can be lifted, lowered and rotated.

[0031] Furthermore, the labeling workbench includes a ceramic suction cup, a guide column, a rotation drive unit and a lifting drive unit. The ceramic suction cup is horizontally arranged and installed at the end of the guide column. The guide column and the rotation drive unit are installed at the output end of the lifting drive unit. The rotation drive unit is used to drive the guide column to rotate.

[0032] Furthermore, the automatic wafer box receiving device includes a material box vertical drive unit, a supporting bracket and a drawer bin, wherein the output end of the material box vertical drive unit is connected to the supporting bracket, and two or more drawer bins are spaced apart along the translation direction of the material box vertical drive unit and supported on the supporting bracket.

[0033] Furthermore, the supporting bracket is provided with partitions spaced apart along the translation direction of the vertical driving unit of the material box, and the drawer compartment includes a guide rail assembly, a loading plate and a horizontal driving unit of the material box, and the loading plate is slidably mounted on the partition via a pair of guide rail assemblies and driven by the horizontal driving unit of the material box, and the horizontal driving unit of the material box can drive the loading plate to move out of the supporting bracket.

[0034] (III) Beneficial effects

[0035] The embodiment of the present invention provides a wafer film attaching system, which has the following beneficial effects:

[0036] 1. The compact structure design reduces the space occupied by the equipment, the process layout is reasonable, the product flow is improved, and the continuous operation of the wafer and wafer ring film bonding process can be realized;

[0037] 2. Applicable to wafers of two or more sizes, and automatic adjustment of program formulas for various wafer thicknesses;

[0038] 3. The circular cutter mechanism of the film cutting device rotates precisely to avoid the appearance of flash on the film cut;

[0039] 4. The wafer and wafer ring are accurately transferred and have a certain degree of flexible connection to avoid damage to the wafer and wafer ring during the contact process. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a schematic diagram of the structure of the present invention;

[0041] Figure 2 It is a structural schematic diagram of the wafer loading device in the present invention;

[0042] Figure 3 It is a schematic diagram of the structure of the wafer robot and the wafer edge finder in the present invention;

[0043] Figure 4 It is a structural schematic diagram of the wafer ring storage and transmission device in the present invention;

[0044] Figure 5 It is a schematic diagram of the structure after enlarging the bottom of the wafer ring transmission mechanism in the present invention;

[0045] Figure 6 It is a structural schematic diagram of the wafer ring storage mechanism in the present invention;

[0046] Figure 7 It is a structural schematic diagram of the film sticking workbench in the present invention;

[0047] Figure 8 It is a structural schematic diagram of the component transmission flipping mechanism in the present invention;

[0048] Fig. 9 It is a schematic diagram of the structure of the cooperation among the first suction cup assembly, the clamping claw column and the crossbeam in the present invention;

[0049] Fig.10 It is a structural schematic diagram of the component horizontal transmission mechanism in the present invention;

[0050] Fig.11 It is a schematic diagram of the push block installation structure of the component horizontal transmission mechanism in the present invention;

[0051] Fig.12 It is a structural schematic diagram of the wafer film attaching device of the present invention from a first viewing angle;

[0052] Fig.13 The structure of the wafer film attaching device from a second viewing angle in the present invention is a schematic diagram;

[0053] Fig.14 The third perspective structure of the wafer film attaching device of the present invention is a schematic diagram;

[0054] Fig.15 It is a structural schematic diagram of the film cutting mechanism in the present invention;

[0055] Fig.16 It is a structural schematic diagram of a film cutting unit of the film cutting mechanism of the present invention from a first viewing angle;

[0056] Fig.17 It is a structural schematic diagram of the film cutting unit of the film cutting mechanism of the present invention from a second viewing angle;

[0057] Fig.18 It is a structural schematic diagram of the wafer labeling device in the present invention;

[0058] Fig.19 It is a schematic diagram of the structure of the automatic wafer box receiving device in the present invention;

[0059] Fig. 20It is a schematic diagram of the structure of the drawer bin of the automatic wafer box receiving device in the present invention.

[0060] In the figure:

[0061] 1. Wafer loading device;

[0062] 2. Wafer transfer calibration device;

[0063] 3. Wafer ring storage and transmission device;

[0064] 4. Film laminating workbench;

[0065] 5. Wafer film mounting device;

[0066] 6. Wafer and wafer ring transmission device after film bonding;

[0067] 7. Wafer labeling device;

[0068] 8. Automatic wafer box receiving device;

[0069] 11. Wafer box carrier;

[0070] 12. Door body;

[0071] 13. Door frame;

[0072] 14. Door vertical drive unit;

[0073] 15. Mounting plate;

[0074] 16. Installation frame;

[0075] 21. Wafer robot;

[0076] 22. Wafer edge finder;

[0077] 31. Wafer ring storage mechanism;

[0078] 311, wafer ring carrier plate;

[0079] 312. Wafer ring positioning column;

[0080] 313. Wafer ring storage workbench;

[0081] 32. Wafer ring transmission mechanism;

[0082] 321, fixed mounting plate;

[0083] 322, movable buffer plate;

[0084] 323, first suction cup assembly;

[0085] 314, positioning sleeve;

[0086] 41. Wafer ring fixing seat;

[0087] 42. Wafer holder;

[0088] 43. Transfer seat;

[0089] 44. Workbench horizontal drive unit;

[0090] 5111, coil film unwinding roller;

[0091] 5112, roll film unwinding drive unit;

[0092] 5121, release paper receiving roller;

[0093] 5122, release paper receiving drive unit;

[0094] 513, film winding roller assembly;

[0095] 514, film pressing roller;

[0096] 515. Coil film receiving mechanism;

[0097] 516, film pulling mechanism;

[0098] 517. Wafer lamination mechanism;

[0099] 5171, wafer lamination drive unit;

[0100] 52. Film cutting mechanism;

[0101] 521, film cutting lifting unit;

[0102] 5211, film cutting lifting slide;

[0103] 522. Installation platform;

[0104] 523, rotating stage;

[0105] 5241, round cutter;

[0106] 52412, cutter fixing seat;

[0107] 5251, roller;

[0108] 5252, roller seat;

[0109] 5253, guide column;

[0110] 5254, spring;

[0111] 5255, nut;

[0112] 5256, adjustment plate;

[0113] 611, component horizontal drive unit;

[0114] 612, component vertical drive unit;

[0115] 613, beam;

[0116] 614, component flip drive unit;

[0117] 615, first suction cup assembly;

[0118] 616, suction cup cylinder;

[0119] 6161, Gripper column;

[0120] 6162, Gripper Cylinder;

[0121] 617, mounting frame;

[0122] 621, component horizontal transport track;

[0123] 6221, cantilever;

[0124] 6222, cantilever horizontal drive unit;

[0125] 6223, front end limit plate;

[0126] 6224, stuck check sensor;

[0127] 62251, push block body;

[0128] 62252, push block connector;

[0129] 6226, rear end limit plate;

[0130] 6227, guide rail assembly;

[0131] 71. Labeling agency;

[0132] 721, guide column;

[0133] 722, lifting drive unit;

[0134] P, components after wafer ring film bonding;

[0135] 81. Material box vertical drive unit;

[0136] 82. Load-bearing bracket;

[0137] 821, partition;

[0138] 822, side panels;

[0139] 83. Drawer compartment;

[0140] 831, loading board;

[0141] 8311, first loading slot;

[0142] 8312, second loading slot;

[0143] 832. Material box detection sensor. DETAILED DESCRIPTION

[0144] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0145] See attached Figure 1-20 A wafer film pasting system comprises a wafer loading device 1, a wafer transfer calibration device 2, a wafer ring storage and transmission device 3, a film pasting workbench 4, a wafer and wafer ring post-film pasting transmission device 6, and a wafer film pasting device 5, a wafer labeling device 7, and a wafer box automatic receiving device 8 arranged in an (L-shaped) sequence. The wafer ring is carried by the film pasting workbench 4 and transmitted between the wafer ring storage and transmission device 3 and the wafer film pasting device 5. The components of the wafer and wafer ring after film pasting are carried by the wafer and wafer ring post-film pasting transmission device 6 and transmitted between the wafer film pasting device 5, the wafer labeling device 7, and the wafer box automatic receiving device 8.

[0146] Place the wafer box with the wafer on the wafer loading device, open the cover of the wafer loading device, and the wafer robot first moves the wafer out of the wafer box and sends it to the wafer edge finder to calibrate the center of the wafer and the notch angle. Finally, the wafer robot moves the wafer to the wafer holder, and places a certain number of wafer rings on the wafer ring carrier. The wafer rings are transferred to the wafer ring holder through the suction cup and the (vertical) drive unit. Then, the wafer film device placed above the film laminating workbench starts film laminating. After the film laminating is completed, the wafer and wafer ring are transferred to the transmission device after film laminating, and the wafer and wafer ring are transferred along the transmission track to the wafer labeling device. After labeling, they are pushed into the wafer and wafer ring film laminating receiving device. The wafer and wafer ring film laminating receiving device is equipped with double bins and automatically sends out after being full.

[0147] The wafer loading device includes a wafer box carrier 11 and a wafer box opening and closing mechanism, wherein a door body 12 of the wafer box opening and closing mechanism is arranged on the front side of the wafer box carrier 11 (opposite to the wafer box opening on the wafer box carrier 11) and is opened and closed by the drive of a door body vertical drive unit 14. Specifically, the wafer carrier is installed on a mounting plate 15 by a group of screw and stud assemblies, and the level can be conveniently adjusted by the arrangement of a group of screw and stud assemblies. The mounting plate 15 is fixed to the door frame 13 by a mounting frame 16, and a wafer box carrier 11 is provided on the inner side of the upper opening of the door frame 13, and its outer side is encapsulated by the door body.

[0148] The wafer transfer calibration device includes a wafer manipulator 21 and a wafer edge finder 22, wherein the wafer manipulator 21 is used to transfer the wafers in the wafer box to the wafer edge finder for calibration through the upper opening of the door frame 13, wherein the wafer manipulator 21 and the wafer edge finder 22 are both commercially available equipment, and reference may be made to the wafer manipulator and wafer edge finder products of Hiwin Technology (China) Co., Ltd.

[0149] The wafer ring storage and transmission device includes a wafer ring storage mechanism 31 and a wafer ring transmission mechanism 32. The wafer ring storage mechanism 31 includes a wafer ring carrier plate 311 and a wafer ring positioning column 312. A group of wafer ring positioning columns 312 arranged around the wafer ring are detachably mounted on the wafer ring carrier plate 311.

[0150] In this embodiment, a hollow positioning sleeve 314 is installed on the wafer ring carrier plate 311, and the wafer ring positioning column 312 is installed in the positioning sleeve 314 and detected by a photoelectric sensor. By selecting wafer ring positioning columns 312 with different surrounding radii, it can adapt to the storage of wafer rings of different sizes and detect them by a photoelectric sensor, thereby improving the versatility of the device. In addition, the wafer ring carrier plate 311 is slidably installed on the wafer ring storage workbench 313 through a guide rail and fixed by a locking member, so that the wafer ring carrier plate 311 can be easily pulled out and the wafer ring positioning column 312 can be replaced or adjusted in position.

[0151] In this embodiment, a fixed mounting plate 321 is installed at the output end of the wafer ring transmission mechanism 32, and a movable buffer plate 322 is elastically connected to the lower side of the fixed mounting plate 321 through an elastic component (generally composed of a spring and a guide column), and a first suction cup component 323 is installed on the movable buffer plate 322. The first suction cup component 323 can flexibly contact with the wafer ring to ensure the appearance quality of the wafer ring.

[0152] The wafer film pasting device includes a roll film unloading mechanism, a roll film receiving mechanism, a release paper receiving mechanism, a film winding roller assembly, a film pressing roller, a film pulling mechanism, a wafer film pressing mechanism and a film cutting mechanism, wherein the roll film unloading mechanism, the release paper receiving mechanism, the film winding roller assembly and the film pressing roller are located on one horizontal side of the film cutting mechanism, the roll film receiving mechanism is located on the other horizontal side of the film cutting mechanism, the film pulling mechanism and the wafer film pressing mechanism are arranged below the film cutting mechanism and can translate in the horizontal direction. Specifically, the release paper receiving roller of the release paper receiving mechanism is located on the outside of the roll film unloading roller of the roll film unloading mechanism, and the film winding roller assembly and the film pressing roller are arranged below the release paper receiving roller from top to bottom, wherein the roll film unloading roller of the roll film unloading mechanism is composed of a roll film unloading roller and a film cutting mechanism. The film unwinding drive unit drives, the film winding roller of the film winding mechanism is driven by the film winding drive unit, and the release paper winding roller of the release paper winding mechanism is driven by the release paper winding drive unit to realize unwinding or winding. The film winding roller assembly and the die pressing roller are passively supported on the frame without drive. The film winding roller of the film winding roller assembly can play a tensioning role on the one hand, and can also position the film material by installing a limit ring on the roller surface on the other hand. The wafer film pressing roller seat of the wafer film pressing mechanism and the film pulling roller seat of the film pulling mechanism are driven by the wafer film pressing drive unit to realize horizontal translation. The wafer film pressing roller seat is driven by the roller seat cylinder to realize lifting and lowering. During the translation of the wafer film pressing roller, it is ensured that it effectively presses the film below.

[0153] The film cutting mechanism includes a film cutting lifting unit, a film cutting rotation driving unit, a mounting platform, a rotating platform and a rotating film cutting mechanism. The output end of the film cutting lifting unit is connected to the mounting platform. The mounting platform is rotatably supported at the bottom thereof, and a rotating support frame and a film cutting rotation driving unit are fixedly connected to the top thereof. The rotating axis of the rotating platform passes through the rotating platform upward and is supported by the rotating support frame. The film cutting rotation driving unit drives the rotating platform to rotate through a belt and a pulley. The rotating film cutting mechanism includes a film cutting unit and a film pressing unit installed at both ends of the rotating platform.

[0154] In this embodiment, the film cutting unit and the film pressing unit are slidably mounted on the rotating platform through a guide assembly and fixed by a locking member. The guide assembly is arranged along the length direction of the rotating platform, that is, the film cutting unit and the film pressing unit can adjust their positions to adapt to wafers / wafer rings of different sizes.

[0155] In this embodiment, the roller of the film pressing unit is installed on a roller seat, and the roller seat is elastically connected to the bottom of the rotating platform. Specifically, the roller seat and the adjustment plate above the rotating platform are guided and matched through guide pillars, and the guide pillars penetrate the upper end of the adjustment plate to prevent the connection nut from falling off. A spring is installed on the guide pillar, and the two ends of the spring are respectively against the rotating platform and the roller seat. The roller of the film pressing unit is elastically connected and can provide a certain pre-tightening force. After the film cutting unit acts, the film pressing unit can flatten the incision surface on the one hand, and on the other hand, it can ensure that the remaining film material and the film adhered to the wafer are effectively separated to avoid the film from being lifted up during the subsequent film rolling process.

[0156] The film pasting workbench includes a wafer ring fixing seat 41, a wafer fixing seat 42, a transfer seat 43 and a horizontal driving unit 44 for the film pasting workbench. The upper end surface of the wafer ring fixing seat 41 is formed with a wafer ring positioning groove and a hollow opening concentric with the wafer ring fixing groove. The wafer fixing seat 42 is installed in the hollow opening. The wafer ring fixing seat 41 and the wafer fixing seat 42 are installed on the transfer seat 43. The transfer seat 43 is slidably supported on the guide rail assembly and driven by the horizontal driving unit 44 for the film pasting workbench to transfer between the wafer film pasting device and the wafer and wafer ring post-film pasting transmission device.

[0157] The wafer and wafer ring post-filming transmission device includes a component transmission flip mechanism and a component horizontal transmission mechanism;

[0158] The component transmission flip mechanism includes a component horizontal drive unit 611, a component vertical drive unit 612, a crossbeam 613, a component flip drive unit 614 and a gripping part controlled by a motor. The component vertical drive unit 612 is installed at the output end of the component horizontal drive unit 611. The crossbeam 613 and the component flip drive unit 614 are installed at the output end of the component vertical drive unit 612. The component flip drive unit 614 is used to drive the crossbeam 613 to perform a vertical 180-degree flipping action. The gripping part is installed on the crossbeam 613, and the gripping part includes a first suction cup assembly 615.

[0159] The component horizontal transport mechanism includes a pair of component horizontal transport rails 621 with adjustable rail widths, and a cylinder fixture symmetrically connected to the pair of component horizontal transport rails 621;

[0160] In this embodiment, the gripping part includes a suction cup cylinder 616, a clamping claw column 6161 and a clamping claw cylinder 6162. A pair of suction cup cylinders 616 are symmetrically installed at both ends of the lower part of the crossbeam 613. The output end of the suction cup cylinder 616 is connected to a mounting frame 617. The mounting frame 617 is installed with a first suction cup assembly 615 and a clamping claw cylinder 6162. The output end of the clamping claw cylinder 6162 is connected to a pair of clamping claw columns 6161. A groove body for accommodating the outer edge of the wafer is provided on the clamping claw column 6161. The suction cup cylinder 616 can drive the first suction cup assembly 615 and the clamping claw column 6161 to translate to adapt to a wafer of another size, and the clamping claw column 6161 is retracted inwardly under the action of the clamping claw cylinder 6162, and the edge of the wafer is positioned and accommodated in the groove body, thereby improving the stability of the assembly after the wafer and the wafer ring are filmed during the flipping process.

[0161] In this embodiment, a cantilever mechanism is provided on one side of the component horizontal transmission mechanism, and the cantilever mechanism includes a cantilever 6221 and a cantilever horizontal driving unit 6222. The cantilever 6221 is installed at the output end of the cantilever horizontal driving unit 6222 and extends to the top of the component horizontal transmission mechanism. The cantilever horizontal driving unit 6222 is arranged in parallel with the component horizontal transmission mechanism.

[0162] A front end limit plate 6223, a rear end limit plate 6226, and a jam check sensor 6224 are fixedly connected below the end of the cantilever 6221, and a push block that slides in a direction parallel to the horizontal transmission mechanism of the component is slidably connected through a guide rail assembly 6227. The push block is arranged between the front end limit plate 6223 and the rear end limit plate 6226. The push block includes a push block body 62251 and an L-shaped push block connector 62252 installed at the front end of the push block body 62251. The end of the push block body 62251 is elastically abutted against the rear end limit plate 6226 through an elastic assembly and abuts against the jam check sensor 6224 through a touch rod (which passes through the rear end limit plate 6226). The front end limit plate 6223 is used to limit the push block and prevent it from falling off.

[0163] The push block flexibly pushes the wafer ring for transmission under the action of the elastic component. The inspection sensor can detect in real time whether the wafer ring is stuck during the pushing process, and can output signals to the staff to remind them to eliminate the jamming situation, thereby avoiding damage to the wafer ring assembly after film pasting during the pushing process and improving the product qualification rate.

[0164] The wafer labeling device includes a labeling mechanism 71 and a labeling workbench;

[0165] The labeling mechanism 71 is arranged above the cylinder fixture;

[0166] The labeling workbench is arranged below the labeling mechanism 71 and can be raised, lowered and rotated.

[0167] Furthermore, the labeling workbench includes a ceramic suction cup (arranged below the component P after the wafer ring is filmed in the figure), a guide column 721, a labeling workbench rotation drive unit and a labeling workbench lifting drive unit 722, the ceramic suction cup is horizontally arranged and installed at the end of the guide column, the guide column and the labeling workbench rotation drive unit are installed on the slide at the output end of the labeling workbench lifting drive unit 722, wherein the guide column 721 is rotatably supported on the slide, and the labeling workbench rotation drive unit is fixed on the slide and drives the guide column 721 to rotate through a belt and a pulley.

[0168] The automatic wafer box receiving device includes a material box vertical drive unit 81, a supporting bracket 82 and a drawer bin 83. The output end of the material box vertical drive unit 81 is connected to the supporting bracket 82. Two or more drawer bins 83 are arranged at intervals along the translation direction of the material box vertical drive unit 81 and supported on the supporting bracket 82.

[0169] The supporting bracket 82 includes a pair of partitions 821 arranged in parallel with each other at an upper and lower interval and a side plate 822 connecting the two sides of the pair of partitions 821 to form a stable frame structure. The drawer compartment 83 includes a guide rail assembly, a loading plate 831 and a material box horizontal driving unit. The loading plate 831 is slidably installed on the partition 821 through a pair of guide rail assemblies and is driven by the material box horizontal driving unit. The material box horizontal driving unit can drive the loading plate 831 to move out of the supporting bracket 82.

[0170] Each drawer bin 83 can work alternately in the vertical direction. The drawer bin 83 at the standby position can be loaded with empty material boxes in advance, and the full material boxes can be removed after being moved to the standby position, so that the material can be collected without stopping the machine, thereby improving production efficiency.

[0171] In addition, the drawer bin 83 includes a guide rail assembly, a loading plate 831 and a horizontal driving unit for the loading plate 831. The loading plate 831 is slidably mounted on the partition 821 through a pair of guide rail assemblies and is driven by the horizontal driving unit of the loading plate 831. The horizontal driving unit of the loading plate 831 can drive the loading plate 831 to move out of the supporting bracket 82. The loading plate 831 can be provided with two loading slots arranged in a stepped manner from top to bottom as needed, namely a first loading slot 8311 and a second loading slot 8312. Both sides of the two loading slots are provided with material box detection sensors 832, which can adapt to carrying material boxes of different specifications and models without replacing the loading plate 831, thereby improving production efficiency.

[0172] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0173] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer film pasting system The wafer film pasting system comprises a wafer loading device, a wafer transfer calibration device, a wafer ring storage and transmission device, a film pasting workbench, a wafer and wafer ring post-film pasting transmission device, and a sequentially arranged wafer film pasting device, a wafer labeling device, and a wafer box automatic receiving device. The wafer ring is carried by the film pasting workbench and transmitted between the wafer ring storage and transmission device and the wafer film pasting device. The components of the wafer and wafer ring after film pasting are carried by the wafer and wafer ring post-film pasting transmission device and transmitted between the wafer film pasting device, the wafer labeling device, and the wafer box automatic receiving device.

2. The wafer film attaching system according to claim 1, characterized in that: The wafer loading device includes a wafer box carrier and a wafer box opening and closing mechanism, wherein a door body of the wafer box opening and closing mechanism is arranged at the front side of the wafer box carrier and is opened and closed by a driving unit; A wafer transfer calibration device, comprising a wafer robot and a wafer edge finder, wherein the wafer robot is used to transfer the wafer in the wafer box to the wafer edge finder through the door frame for calibration; The wafer ring storage and transmission device comprises a wafer ring storage mechanism and a wafer ring transmission mechanism. The wafer ring storage mechanism comprises a wafer ring carrying plate and wafer ring positioning columns. A group of wafer ring positioning columns arranged around the wafer ring are detachably mounted on the wafer ring carrying plate.

3. The wafer film attaching system according to claim 1, characterized in that: The wafer film mounting device comprises a roll film unloading mechanism, a roll film receiving mechanism, a release paper receiving mechanism, a film winding roller assembly, a film pressing roller, a film pulling mechanism, a wafer film pressing mechanism and a film cutting mechanism, wherein the roll film unloading mechanism, the release paper receiving mechanism, the film winding roller assembly and the film pressing roller are located on one horizontal side of the film cutting mechanism, the roll film receiving mechanism is located on the other horizontal side of the film cutting mechanism, and the film pulling mechanism and the wafer film pressing mechanism are arranged below the film cutting mechanism and can be translated in the horizontal direction; The film cutting mechanism includes a film cutting lifting unit, a film cutting rotation driving unit, a mounting platform, a rotating platform and a rotating film cutting mechanism. The output end of the film cutting lifting unit is connected to the mounting platform. The mounting platform is rotatably supported below a rotating platform, and a film cutting rotation driving unit is fixed above the mounting platform. The film cutting rotation driving unit is used to drive the rotating platform to rotate. The rotating film cutting mechanism includes a film cutting unit and a film pressing unit, and the film cutting unit and the film pressing unit are mounted at both ends of the rotating platform.

4. The wafer film attaching system according to claim 3, characterized in that: The film cutting unit and the film pressing unit are slidably mounted on the rotating platform through a guide assembly and fixed through a locking member. The guide assembly is arranged along the length direction of the rotating platform.

5. The wafer film attaching system as claimed in claim 3, characterized in that: The roller of the film pressing unit is installed on a roller seat, and the roller seat is elastically connected to the bottom of the rotating platform. Specifically, the roller seat and the adjustment plate above the rotating platform are guided and matched through guide pillars, and a spring is installed on the guide pillar, and the two ends of the spring are respectively against the rotating platform and the roller seat.

6. The wafer film attaching system according to claim 1, characterized in that: Wafer and wafer ring post-filming transmission device, including component transmission flip mechanism and component horizontal transmission mechanism; The component transmission flip mechanism includes a component horizontal drive unit, a component vertical drive unit, a crossbeam, a component flip drive unit and a gripping part controlled by a motor, wherein the component vertical drive unit is installed at the output end of the component horizontal drive unit, the crossbeam and the component flip drive unit are installed at the output end of the component vertical drive unit, the component flip drive unit is used to drive the crossbeam to perform a vertical 180-degree flipping action, the gripping part is installed on the crossbeam, and the gripping part includes a suction cup assembly; The component horizontal transmission mechanism comprises a pair of component horizontal transmission rails with adjustable rail widths, and a cylinder clamp symmetrically connected to the pair of component horizontal transmission rails.

7. The wafer film attaching system according to claim 6, characterized in that: The grabbing part includes a suction cup cylinder, a clamping claw column and a clamping claw cylinder. A pair of suction cup cylinders are symmetrically installed at both ends of the lower part of the beam. The output end of the suction cup cylinder is connected to a mounting frame, and the mounting frame is installed with a first suction cup assembly and a clamping claw cylinder. The output end of the clamping claw cylinder is connected to a pair of clamping claw columns, and a groove body for accommodating the outer edge of the wafer is provided on the clamping claw column.

8. The wafer film attaching system according to claim 7, characterized in that: A cantilever mechanism is provided on one side of the component horizontal transmission mechanism, the cantilever mechanism includes a cantilever and a cantilever horizontal driving unit, the cantilever is installed at the output end of the cantilever horizontal driving unit and extends above the component horizontal transmission mechanism, and the cantilever horizontal driving unit is arranged in parallel with the component horizontal transmission mechanism; A limit plate and an inspection sensor are fixedly connected below the end of the cantilever and are slidably connected with a push block in a direction parallel to the horizontal transmission mechanism of the component. The end of the push block is elastically abutted against the limit plate through an elastic component and is connected to the inspection sensor through a touch rod.

9. The wafer film attaching system according to claim 1, characterized in that: The film pasting workbench comprises a wafer ring fixing seat, a wafer fixing seat, a transfer seat and a horizontal driving unit for the film pasting workbench. The upper end surface of the wafer ring fixing seat is formed with a wafer ring positioning groove and a hollow opening concentric with the wafer ring fixing groove. The wafer fixing seat is installed in the hollow opening. The wafer ring fixing seat and the wafer fixing seat are installed on the transfer seat. The transfer seat is driven by the horizontal driving unit of the film pasting workbench to transfer between the wafer film pasting device and the wafer and wafer ring post-film pasting transmission device.

10. The wafer film attaching system according to claim 1, characterized in that: A wafer labeling device, comprising a labeling mechanism and a labeling workbench; The labeling mechanism is arranged above the cylinder fixture; The labeling workbench is arranged below the labeling mechanism and can be lifted, lowered and rotated; The automatic wafer box receiving device comprises a material box vertical drive unit, a supporting bracket and a drawer bin, wherein the output end of the material box vertical drive unit is connected to the supporting bracket, and two or more drawer bins are arranged at intervals along the translation direction of the material box vertical drive unit and supported on the supporting bracket.

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