Wafer operation device and operation method

Abstract

The invention discloses a wafer transfer device. The wafer transfer device comprises a fixing device for fixing a wafer and a moving device for moving the wafer, the fixing device comprises a clamping assembly and an adsorption assembly. The clamping assembly comprises a moving part and a positioning part, and the moving part can move in a reciprocating mode; the adsorption assembly comprises a negative pressure part, and the negative pressure part is arranged on the moving part. And after the arm takes the WAFER, when the WAFER reaches the positioning stop block and the in-place detection of the SENSOR is triggered at the same time, vacuum adsorption is carried out, so that the position consistency can be realized, the WAFER is firmly adsorbed on the FORK, and the ROBOT is not easy to damage when running towards other stations at a high speed.

Description

Technical Field

[0001] The present application relates to the field of wafer processing in the semiconductor industry, and in particular to a wafer operation device and operation method. Background Art

[0002] As the precision and requirements of modern semiconductor processes continue to increase, the requirements for the damage rate of WAFER (wafer) continue to decrease, and the stability and reliability of the transfer robot need to be continuously improved. Traditional robots use a single vacuum adsorption method or a single clamping and positioning method to pick up and place WAFER. The vacuum adsorption method can better protect the WAFER from slipping during high-speed operation, but it is difficult to ensure the position consistency of the WAFER, and a separate positioning mechanism needs to be added to achieve it. The single clamping and positioning method can better ensure the consistency of the position of the WAFER, but it is easy to drop the wafer when running at high speed or the mechanical movement is not smooth. Summary of the invention

[0003] In order to solve the problems existing in the prior art, the present application provides a wafer operation device and an operation method.

[0004] Traditional manipulators usually detect whether the WAFER is in place through vacuum pressure detection or fiber optic sensor detection. This single detection method has poor reliability for large-sized WAFER detection. This design combines these two detection methods into the same manipulator to improve detection reliability.

[0005] Before taking wafers from the Cassette (a wafer library for storing wafers), mapping (scanning, that is, scanning the wafers placed in the cassette to obtain information about the wafers stored in each layer of the cassette, such as whether there are wafers, whether the wafers are tilted, etc.) is required to ensure the status of the wafers in the cassette. To achieve this, the mapping sensor has a calibrated detection distance. When switching between two adjacent wafer sizes, the traditional design cannot achieve fast switching compatibility. This design adds a position switching mechanism to the mapping sensor to achieve this goal.

[0006] The specific technical solutions of this application are as follows:

[0007] A wafer operation device, comprising a fixing device for fixing the wafer and a moving device for moving the wafer;

[0008] The fixing device comprises a clamping component and an adsorption component;

[0009] The clamping assembly includes a moving part and a positioning part, and the moving part can move back and forth;

[0010] The adsorption assembly includes a negative pressure portion, and the negative pressure portion is arranged on the moving portion.

[0011] In a specific embodiment, the moving part includes a guide rail and a slider connected in a sliding manner, and a limiting platform is provided on the slider, and the limiting platform can abut against the edge of the wafer;

[0012] Preferably, the limiting platform is an arc-shaped boss, and the side of the limiting platform close to the wafer is an arc shape adapted to the wafer;

[0013] Further preferably, the slider is connected to a synchronous belt assembly, and the synchronous belt assembly drives the moving part to reciprocate.

[0014] In a specific embodiment, the slider is provided with a support arm, one end of the support arm is fixedly connected to the slider, a placement arm is provided at the end of the support arm away from the slider, and the limiting portion is provided at a position where the placement arm is away from the support arm.

[0015] In a specific embodiment, the positioning portion includes a positioning stopper; the positioning stopper is arc-shaped on a side close to the wafer;

[0016] Preferably, the side of the positioning stopper close to the wafer is in an arc shape that matches the shape of the wafer;

[0017] Preferably, two positioning blocks are relatively arranged.

[0018] In a specific embodiment, a positioning point is provided on the positioning block;

[0019] Preferably, at least one positioning point is provided on each positioning block;

[0020] Further preferably, two positioning points are provided on the positioning block;

[0021] Further preferably, all positioning points can abut against the edge of the wafer at the same time;

[0022] Further preferably, the positioning block and the positioning point are both symmetrical structures;

[0023] Further preferably, the central angles of two positioning points respectively located on two positioning blocks and far away from each other on the wafer are 60-80°; the central angles of two positioning points respectively located on two positioning blocks and close to each other on the wafer are 30-50°.

[0024] In a specific embodiment, the negative pressure part includes a first support platform arranged on the moving part, a negative pressure groove is opened on the first support platform, and the negative pressure groove is connected to a negative pressure pipeline;

[0025] Preferably, the negative pressure pipe is connected to the bottom of the negative pressure tank;

[0026] Further preferably, the first support platform and the negative pressure groove are both arc-shaped.

[0027] In a specific embodiment, when the clamping assembly clamps the wafer, the first support platform is located below the wafer;

[0028] Preferably, when the adsorption assembly adsorbs the wafer, the air pressure in the negative pressure pipe and the negative pressure tank is lower than the air pressure above the wafer;

[0029] Further preferably, the pressure of the negative pressure pipe is -70kpa to -85kpa;

[0030] Further preferably, a pressure sensor is provided inside the negative pressure pipe.

[0031] In a specific embodiment, the negative pressure pipeline is arranged on the placement arm of the clamping assembly; preferably, the negative pressure pipeline is embedded inside the placement arm of the clamping assembly.

[0032] In a specific embodiment, a second support platform arranged opposite to the first support platform is installed on the moving part; preferably, a negative pressure groove is provided on the second support platform;

[0033] Further preferably, the negative pressure pipe is connected to the negative pressure groove on the first support platform and the negative pressure groove on the second support platform respectively.

[0034] In a specific embodiment, a connection assembly is provided between the placement arm and the support arm; the connection assembly comprises a support portion fixed on the support arm; the support portion is located below the placement arm;

[0035] Preferably, a blocking portion is provided on a side of the support portion close to the support arm, and the blocking portion abuts against a side of the placement arm close to the support arm;

[0036] Further preferably, a pressing block is arranged above the placement arm, and the pressing block and the supporting portion are both located at one end of the placement arm and are respectively located on both sides of the placement arm; a clamping portion is protruded from the lower side of the end of the pressing block away from the supporting arm, and a clamping groove adapted to the clamping portion is provided on the placement arm;

[0037] The pressing block and the supporting part are both clamped and fixedly connected with the placing arm;

[0038] Further preferably, the distance between the limiting platform and the pressing block is greater than the diameter of the wafer.

[0039] In a specific embodiment, the distance between the first support platform and the second support platform is smaller than the diameter of the wafer;

[0040] Preferably, the distance between the negative pressure groove on the first supporting platform and the negative pressure groove on the second supporting platform is smaller than the diameter of the wafer.

[0041] In a specific embodiment, the slider is connected to a synchronous belt assembly, and the synchronous belt assembly drives the moving part to reciprocate;

[0042] The synchronous belt assembly comprises a motor, a first driven wheel and a belt body; the first driven wheel and the motor are respectively arranged at two ends of the slide rail;

[0043] Preferably, a second driven wheel is provided on the belt body, and the second driven wheel is provided at a position close to the motor and opposite to the first driven wheel;

[0044] Further preferably, a tensioning wheel is arranged on the belt body, and the tensioning wheel is arranged at a position close to the motor and located on the outside of the belt body.

[0045] In a specific embodiment, a position sensor is arranged on the placement arm.

[0046] In a specific embodiment, a support plate is provided between the moving device and the fixing device, and the fixing device is fixed on the support plate; the moving device includes a horizontal module and a vertical module for driving the fixing device to move.

[0047] In a specific embodiment, a scanning sensor capable of scanning the wafer position is arranged on the mobile device, and the scanning sensor is connected to a master controller; the master controller is connected to the mobile device; the master controller is capable of judging the scanning sensor signal and controlling the movement of the mobile device;

[0048] Preferably, a reciprocating assembly is provided on the mobile device, and the reciprocating assembly is connected to the film scanning sensor;

[0049] Further preferably, the reciprocating assembly includes a second guide rail and a second slider; a support rod is provided on the second slider. One end of the support rod is connected to the second slider, and the film scanning sensor is provided at the end of the support rod away from the slider;

[0050] Further preferably, a contraction component for driving the second slider to reciprocate is provided between the moving device and the reciprocating component, and the moving direction of the contraction component intersects or is perpendicular to the moving direction of the reciprocating component;

[0051] Further preferably, the contraction component can drive the reciprocating component to move;

[0052] Further preferably, the contraction assembly comprises a cylinder.

[0053] The present application also provides a wafer operation device, comprising the above-mentioned operation device and a general controller;

[0054] The master controller can control mobile devices and fixed devices.

[0055] In a specific embodiment, the negative pressure pipeline is connected to a negative pressure pump, and the pressure sensor and the negative pressure pump are connected to a main controller; the main controller can determine the measurement value of the pressure sensor to control the start and stop of the negative pressure pump.

[0056] In a specific embodiment, the in-situ sensor is connected to a master controller, and the master controller makes a decision based on the measured value output of the in-situ sensor and / or the pressure sensor.

[0057] The present application also provides a wafer operation method, comprising the following steps:

[0058] Move the operating device into the jam;

[0059] Lift the operating device and remove the wafer from the jam;

[0060] The operating device clamps and absorbs the wafer;

[0061] Run the wafer.

[0062] In one embodiment, the actuator is inserted deep into the plug and beyond the wafer.

[0063] In a specific embodiment, when the operating device penetrates deep into the plug, the clamping space of the operating device exceeds the wafer by more than 1 mm; preferably 2 mm and more.

[0064] In a specific embodiment, when the operating device is stuck, the position of the wafer in the jam is first detected, and then the wafer at the appropriate position is selected for operation.

[0065] In a specific embodiment, the wafer is positioned while being clamped, so that the wafer is positioned at a preset position.

[0066] In a specific embodiment, after the wafer is clamped and positioned, negative pressure adsorption is used to fix the wafer.

[0067] In a specific implementation, when the wafer is operated, the position and fixation of the wafer are first determined, and then the wafer is operated.

[0068] In a specific embodiment, when determining the position and fixation of the wafer, it is determined by the clamping force or position and the adsorption negative pressure.

[0069] Beneficial Effects

[0070] The present application provides a wafer operation device and operation method. After the arm (manipulator) takes the WAFER, when it reaches the positioning block and triggers the in-situ detection SENSOR (sensor) at the same time, vacuum adsorption is performed, so that position consistency can be achieved and the WAFER can be firmly adsorbed on the FORK (fork), so that the ROBOT (robot) is not easily damaged when running at high speed to other workstations.

[0071] An ultra-thin SENSOR is designed and installed just below the arm for in-situ detection, forming a double check with the VAC (vacuum) pressure sensor to improve the accuracy and safety of WAFER in-situ status detection.

[0072] A cylinder transmission mechanism is designed under the arm to switch the MAPPING and the distance between the SENSOR and the WAFER, thereby realizing the MAPPING of WAFERs of various specifications and sizes without the need to replace PARTS (parts), thus improving functional compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] Figure 1 It is the overall structure diagram of the operating device of this application;

[0074] Figure 2 This is a structural diagram of the operating device of the present application from another perspective;

[0075] Figure 3 This is a diagram of the structure of the wafer used by the operating device of this application;

[0076] Figure 4 This is a structural diagram of the wafer clamping device of the present application;

[0077] Figure 5 It is the overall structure diagram of the mobile part of this application;

[0078] Figure 6 is a top view of the mobile portion of the present application;

[0079] Figure 7 It is a partial cross-sectional view of the mobile part of the present application;

[0080] Figure 8 It is an exploded view of the mobile components of this application;

[0081] Fig. 9 It is the block structure diagram of this application;

[0082] Fig.10 This is a diagram of the operating device and the jamming structure of the present application.

[0083] In the figure, 1. clamping assembly; 2. moving part; 21. guide rail; 22. slider; 23. limit platform; 24. placement arm; 25. support arm; 26. pressure block; 27. synchronous belt assembly; 28. in-position sensor; 3. positioning part; 31. positioning block; 32. positioning point; 4. fixing assembly; 5. negative pressure part; 51. first support platform; 52. negative pressure groove; 53. second support platform; 54. negative pressure pipeline; 6. reciprocating assembly; 7. contraction assembly; 8. support plate; 9. wafer; 91. jam. DETAILED DESCRIPTION

[0084] The present application is described in detail below. Although specific embodiments of the present application are shown, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0085] It should be noted that certain words are used in the specification and claims to refer to specific components. Those skilled in the art should understand that technicians may use different nouns to refer to the same component. This specification and claims do not use the difference in nouns as a way to distinguish components, but use the functional differences of components as the criterion for distinction. As mentioned throughout the specification and claims, "including" or "comprising" are open-ended terms and should be interpreted as "including but not limited to". The subsequent description of the specification is a preferred embodiment of the present application, but the description is based on the general principles of the specification and is not intended to limit the scope of the present application. The scope of protection of the present application shall be determined by the attached claims.

[0086] refer to Figure 1 and Figure 2 The present application provides a wafer moving device for transferring the position of a wafer 9, including a fixing device and a moving device.

[0087] The fixing device is used to fix the wafer 9, and the moving device is used to transfer the wafer 9. The fixing device can fix and release the wafer 9. The wafer 9 is fixed when the wafer 9 is transferred, and the wafer 9 is released after the wafer 9 is transferred to the target position, so that the wafer 9 is moved to the target position.

[0088] refer to Figure 1 and Figure 2 , the fixing device comprises a clamping component 1 and an adsorption component;

[0089] refer to Figure 1 and Figure 2The clamping assembly 1 is used to clamp and fix the wafer 9. When clamping the wafer 9, the clamping assembly 1 can also move the wafer 9, position the wafer 9, and fix the wafer 9 at a preset position.

[0090] refer to Figure 1 and Figure 2 The adsorption component is used to adsorb and fix the wafer 9, and through the adsorption effect, the wafer 9 is stably fixed on the fixing device.

[0091] refer to Figure 1 and Figure 2 Since the thickness of wafer 9 is relatively thin, the clamping force of the clamping component 1 on wafer 9 cannot be too large. Therefore, the adsorption component is used to fix wafer 9 again to strengthen the fixing effect of wafer 9, thereby reducing the possibility of position displacement of wafer 9 during the movement of wafer 9 and improving the operation accuracy of wafer 9.

[0092] refer to Figure 1 and Figure 2 , the clamping assembly 1 includes a moving part 2 and a positioning part 3, and the moving part 2 can move reciprocatingly;

[0093] refer to Figure 3 and Figure 4 The moving part 2 can move closer to or farther from the positioning part 3. When the clamping assembly 1 clamps the wafer 9, the wafer 9 is located between the moving part 2 and the positioning part 3. The reciprocating movement of the moving part 2 can achieve the clamping and fixing of the wafer 9.

[0094] refer to Figure 3 and Figure 4 The positioning part 3 is a fixed structure. On the one hand, the positioning part 3 can clamp the wafer 9. On the other hand, the positioning part 3 is preset at the position where the wafer 9 needs to be fixed, and then the wafer 9 is positioned so that the wafer 9 can be fixed at the desired position according to the preset. This improves the running accuracy of the wafer 9.

[0095] refer to Figure 3 and Figure 4 In the present application, the positioning part 3 is set as a fixed structure, so that the positioning part 3 has a higher positioning accuracy during manufacture and use. Compared with setting the positioning part 3 as a mobile structure, the positioning part 3 of the fixed structure has a higher positioning accuracy. At the same time, the positioning part 3 of the fixed structure is easier to control the accuracy during manufacture, thereby reducing the manufacturing cost of the positioning part 3 and the clamping assembly 1.

[0096] refer to Figure 5 and Figure 6 The adsorption component includes a negative pressure part 5, and the negative pressure part 5 is arranged on the moving part 2.

[0097] refer to Figure 5 and Figure 6The negative pressure part 5 is used to form negative pressure; when the wafer 9 is placed on the negative pressure part 5, the negative pressure part 5 forms negative pressure, and then under the action of atmospheric pressure, the wafer 9 is pressed against the negative pressure part 5 by the air pressure. The negative pressure part 5 can control the adsorption force on the wafer 9 by controlling the magnitude of the negative pressure. Not only can the wafer 9 be adsorbed and fixed on the negative pressure part 5, but also the magnitude of the adsorption force can be controlled to reduce the possibility of deformation or even damage of the wafer 9 due to the force.

[0098] refer to Figure 5 and Figure 6 , the negative pressure part 5 is installed on the moving part 2 of the clamping assembly 1, so that the negative pressure part 5 can reciprocate with the moving part 2.

[0099] refer to Figure 5 and Figure 6 In another specific embodiment, the negative pressure part 5 is installed on the positioning part 3, and the negative pressure part 5 is a fixed structure.

[0100] refer to Figure 1 and Figure 2 The moving part 2 includes a guide rail 21 and a slider 22 which are slidably connected. A limiting platform 23 is provided on the slider 22. The limiting platform 23 can abut against the edge of the wafer 9.

[0101] refer to Figure 1 and Figure 2 The guide rail 21 and the slider 22 are slidably connected, and the slider 22 can reciprocate along the guide rail 21. The reciprocating movement of the slider 22 on the guide rail 21 can clamp and fix the wafer 9.

[0102] refer to Figure 1 and Figure 2 The limit platform 23 is located above the slider 22, and the limit platform 23 is higher than the upper surface of the slider 22. When the wafer 9 is placed on the slider 22, the edge of the wafer 9 will abut against the limit platform 23, and then the limit platform 23 moves with the slider 22, thereby clamping and fixing the wafer 9.

[0103] refer to Figure 1 and Figure 2 , the slider 22 moves back and forth along the guide rail 21, and the guide rail 21 can limit the moving direction of the slider 22, so that the slider 22 can move along the set route. On the other hand, the gap between the slider 22 and the guide rail 21 can be reduced by applying a pre-tightening force between the guide rail 21 and the slider 22, thereby improving the moving accuracy between the guide rail 21 and the slider 22. In addition, the slider 22 on the guide rail 21 can move quickly, so it can quickly clamp and fix the wafer 9, thereby reducing the operating time of the wafer 9 and improving the operating efficiency of the wafer 9.

[0104] refer to Figure 5 and Figure 6 Preferably, the limiting platform 23 is an arc-shaped boss, and the side of the limiting platform 23 close to the wafer 9 is an arc shape adapted to the wafer 9;

[0105] refer to Figure 3 and Figure 4 The limit table 23 abuts against the side edge of the wafer 9, thereby achieving clamping and fixing of the wafer 9. The limit table 23 is set to an arc shape, thereby increasing the contact area between the limit table 23 and the wafer 9, reducing the pressure applied by the limit table 23 to the wafer 9 and reducing the stress concentration of the limit table 23 on the wafer 9, thereby reducing the possibility of the limit table 23 causing damage to the wafer 9 when clamping the wafer 9.

[0106] refer to Figure 1 and Figure 2 Further preferably, the slider 22 is connected with a synchronous belt assembly 27, and the synchronous belt assembly 27 drives the moving part 2 to move back and forth.

[0107] refer to Figure 1 and Figure 2 The synchronous belt assembly 27 is the power source of the slider 22. The synchronous belt assembly 27 is connected to the slider 22, and the synchronous belt assembly 27 can drive the slider 22 to move back and forth on the guide rail 21. By controlling the running speed of the synchronous belt assembly 27, the moving speed of the slider 22 can be controlled, so that the slider 22 and the limit table 23 can move at a suitable speed and clamp the wafer 9. The use of the synchronous belt assembly 27 helps to control the moving speed of the slider 22.

[0108] refer to Figure 1 and Figure 2 A support arm 25 is provided on the slider 22, one end of the support arm 25 is fixedly connected to the slider 22, a placement arm 24 is provided at the end of the support arm 25 away from the slider 22, and the limit platform 23 is provided at a position where the placement arm 24 is away from the support arm 25.

[0109] refer to Figure 1 and Figure 2 The slider 22 can drive the support arm 25 to move, the support arm 25 is fixedly connected to the placement arm 24, and the limit table 23 is located on the placement arm 24, so the slider 22 drives the support arm 25, the placement arm 24 and the limit table 23 to move back and forth together. Then the limit table 23 can clamp and fix the wafer 9.

[0110] The limiting platform 23 is located at one end of the placing arm 24 away from the supporting arm 25 .

[0111] refer to Figure 1 and Figure 2The support arm 25 and the placement arm 24 are used to connect the limit table 23 and the slider 22. At the same time, the placement arm 24 can also carry the wafer 9. The connecting arm is used to support and connect the placement arm 24. The shape of the connecting arm is adapted to the slider 22, so that the slider 22 and the connecting arm can be connected in a coordinated manner, reducing the space occupied by the connecting arm.

[0112] refer to Figure 1 and Figure 2 , the positioning portion 3 includes a positioning stopper 31; the positioning stopper 31 is arc-shaped on a side close to the wafer 9;

[0113] The positioning portion 3 is a fixed structure, and accordingly, the positioning portion 3 is fixed on the mobile device.

[0114] refer to Figure 1 and Figure 2 The positioning block 31 is fixed on the mobile device. When the mobile device is stationary, the positioning block 31 is also stationary. The positioning block 31 is used to position the wafer 9. The positioning block 31 is fixed at a preset fixed position of the wafer 9. When the wafer 9 is located on the placement arm 24, the limit table 23 moves toward the positioning block 31, so that the edge of the wafer 9 abuts against the positioning block 31, thereby achieving the clamping and positioning of the wafer 9.

[0115] refer to Figure 1 and Figure 2 Since the positioning stopper 31 is already at the target position when it is at the preset position, when the limit table 23 clamps the wafer 9 so that the edge of the wafer 9 abuts against the positioning stopper 31, the wafer 9 is simultaneously moved to the preset position, and the wafer 9 is positioned while being clamped and fixed.

[0116] refer to Figure 1 and Figure 2 Preferably, the side of the positioning stopper 31 close to the wafer 9 is in an arc shape that matches the shape of the wafer 9;

[0117] The arc-shaped edge of the positioning stopper 31 can increase the contact area with the wafer 9 , thereby avoiding the occurrence of stress concentration on the wafer 9 and reducing the possibility of the wafer 9 being damaged by the force of the positioning stopper 31 .

[0118] Preferably, two positioning blocks 31 are relatively arranged.

[0119] The relatively arranged positioning blocks 31 clamp and position the wafer 9 at the same time, thereby improving the positioning effect of the positioning blocks 31 on the wafer 9 and further reducing the pressure of the positioning blocks 31 on the wafer 9. In addition, the use of two positioning blocks 31 to clamp the wafer 9 at the same time makes the force on the wafer 9 more uniform. The relatively arranged two positioning blocks 31 can clamp the wafer 9 at a position close to the middle, reducing the possibility of the wafer 9 deviating. Therefore, the use of two relatively arranged positioning blocks 31 can not only improve the positioning accuracy of the wafer 9, but also reduce the possibility of damage to the wafer 9 and improve the operation efficiency of the wafer 9.

[0120] refer to Figure 3 and Figure 4 In a specific embodiment, a positioning point 32 is provided on the positioning block 31;

[0121] In another specific embodiment, no positioning point 32 is provided on the positioning stopper 31 .

[0122] refer to Figure 3 and Figure 4 When the positioning point 32 is set on the positioning stopper 31, the wafer 9 is clamped and moved by the limit table 23, and the edge of the wafer 9 will contact the positioning point 32; the positioning point 32 limits the wafer 9 and fixes the wafer 9 in a preset position. By positioning the wafer 9 through the positioning point 32, it is only necessary to correct the position of the positioning point 32 during manufacturing, which makes the manufacturing of the positioning stopper 31 and the positioning point 32 more convenient, and the point contact between the positioning point 32 and the wafer 9 is easier to control the accuracy than the surface contact, which helps to reduce the manufacturing difficulty of the wafer 9 positioning, thereby reducing the manufacturing cost. In addition, the point contact between the positioning point 32 and the wafer 9 is easier to achieve positioning than the direct surface contact with the positioning stopper 31; it helps to improve the positioning accuracy of the wafer 9.

[0123] refer to Figure 3 and Figure 4 , preferably, at least one positioning point 32 is provided on each positioning block 31;

[0124] Specifically, the number of the positioning points 32 set on each positioning block 31 is any value among 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10.

[0125] Further preferably, two positioning points 32 are provided on the positioning block 31;

[0126] refer to Figure 3 and Figure 4 , further preferably, all the positioning points 32 can abut against the edge of the wafer 9 at the same time;

[0127] The positioning points 32 are used to position the wafer 9 when preset. Therefore, when the limit table 23 pushes the wafer 9 to move and is clamped, the edge of the wafer 9 contacts all the positioning points 32, thereby confirming that the wafer 9 is clamped and fixed at the preset target position.

[0128] Further preferably, the positioning block 31 and the positioning point 32 are both symmetrical structures;

[0129] refer to Figure 3 and Figure 4 The two positioning blocks 31 and the positioning points 32 thereon are symmetrical about the central axis of the support arm 25 and the placement arm 24, so that the wafer 9 can be fixed on the central axis of the placement arm 24, that is, the wafer 9 is placed in the center, and the possibility of the wafer 9 being offset or deflected is reduced when the wafer 9 is operated. In addition, the symmetrically arranged positioning blocks 31 and the positioning points 32 also make the force on the wafer 9 more uniform, reducing the stress deformation of the wafer 9. At the same time, from the manufacturing point of view, the symmetrically arranged positioning blocks 31 and the positioning points 32 can be preliminarily calibrated by themselves during the processing according to the symmetry. That is, if the positioning blocks 31 or the positioning points 32 are asymmetrical during processing, it means that the processing positioning blocks 31 and the positioning points 32 are unqualified products.

[0130] refer to Figure 1 and Figure 4 Further preferably, the center angles of the two positioning points 32 respectively located on the two positioning blocks 31 and far away from each other on the wafer 9 are 60 to 80°; the center angles of the two positioning points 32 respectively located on the two positioning blocks 31 and close to each other on the wafer 9 are 30 to 50°.

[0131] refer to Figure 4 Specifically, the central angles of the two positioning points 32 on the wafer 9, which are respectively located on the two positioning blocks 31 and far away from each other, are: 30°, 31°, 32°, 33°, 34°, 35°, 36°, 37°, 38°, 39°, 40°, 41°, 42°, 43°, 44°, 45°, 46°, 47°, 48°, 49°, 50°, 51°, 52°, 53°, 54°, 55°, 56°, 57°, 58°, 59°, 60°, 61°, 62°, 63°, 64°, 65°, 66°, 67°, 68°, 69°, 70°, 71°, 72°, 73°, 74°, 75°, 76°, 77°, 78°, 79°, 80°.

[0132] refer to Figure 5 and Figure 6The negative pressure part 5 includes a first support platform 51 disposed on the moving part 2, a negative pressure groove 52 is opened on the first support platform 51, and the negative pressure groove 52 is connected to a negative pressure pipe 54;

[0133] refer to Figure 5 and Figure 6 Preferably, the negative pressure pipe 54 is connected to the bottom of the negative pressure groove 52; when the clamping assembly 1 clamps the wafer 9, the first supporting platform 51 is located below the wafer 9.

[0134] refer to Figure 5 and Figure 6 The first supporting platform 51 is disposed on the placement arm 24 , and the first supporting platform 51 and the negative pressure tank 52 are both located below the wafer 9 .

[0135] refer to Figure 5 and Figure 6 In a specific embodiment, the first support platform 51 is located at a position where the placement arm 24 is close to the limiting platform 23 .

[0136] Negative pressure can be generated in the negative pressure pipe 54 , and the negative pressure tank 52 is also in a negative pressure state through the negative pressure pipe 54 .

[0137] refer to Figure 5 and Figure 6 When the wafer 9 is clamped and fixed on the placement arm 24 , the negative pressure pipe 54 and the negative pressure groove 52 generate negative pressure, and then the wafer 9 is adsorbed on the placement arm 24 by the negative pressure groove 52 .

[0138] refer to Figure 5 and Figure 6 The wafer 9 is adsorbed on the placement arm 24 through the negative pressure groove 52 to improve the fixing strength of the wafer 9, and then the wafer 9 is operated to reduce the possibility of the wafer 9 being separated from the placement arm 24 during the operation.

[0139] refer to Figure 5 and Figure 6 In addition, the negative pressure groove 52 located below the wafer 9 adsorbs the wafer 9, reducing the force at the edge of the wafer 9 when it is fixed, thereby reducing the possibility of deformation of the wafer 9 due to the clamping force during operation. At the same time, the adsorption force that the negative pressure groove 52 can exert on the wafer 9 is much greater than the force that the edge of the wafer 9 can withstand. Therefore, the use of the negative pressure groove 52 to adsorb and fix the wafer 9 greatly improves the fixing effect of the wafer 9.

[0140] refer to Figure 5 and Figure 6 Further preferably, the first support platform 51 and the negative pressure groove 52 are both arc-shaped.

[0141] The arc-shaped first support platform 51 and the negative pressure groove 52 can increase the contact area between the negative pressure groove 52 and the wafer 9 to avoid excessive concentration of the adsorption force applied to the wafer 9 when the negative pressure in the negative pressure groove 52 is excessive, thereby reducing the possibility of deformation or damage of the wafer 9 when being adsorbed.

[0142] refer to Figure 5 and Figure 6 Preferably, when the adsorption assembly adsorbs the wafer 9, the air pressure in the negative pressure pipe 54 and the negative pressure tank 52 is lower than the air pressure above the wafer 9;

[0143] The air pressure in the negative pressure tank 52 and the negative pressure pipe 54 is relatively low, and thus, under the effect of the pressure difference, the wafer 9 is pressed onto the placement arm 24 by the gas above it.

[0144] Further preferably, the pressure of the negative pressure pipe 54 is -70kpa to -85kpa;

[0145] Specifically, the pressure in the negative pressure pipe 54 is: -70kpa, -71kpa, -72kpa, -73kpa, -74kpa, -75kpa, -76kpa, -77kpa, -78kpa, -79kpa, -80kpa, -81kpa, -82kpa, -83kpa, -84kpa, and -85kpa.

[0146] refer to Figure 5 and Figure 6 Further preferably, a pressure sensor (not shown in the figure) is provided inside the negative pressure pipe 54.

[0147] refer to Figure 5 and Figure 6 The pressure sensor can detect the gas pressure in the negative pressure pipe 54. When the wafer 9 is placed at the preset position, the wafer 9 will be located above the negative pressure groove 52, and then negative pressure will be generated in the negative pressure pipe 54, thereby adsorbing the wafer 9 onto the placement arm 24.

[0148] refer to Figure 5 and Figure 6 When the placement position of the wafer 9 deviates from the preset position, the wafer 9 will deviate from the negative pressure groove 52. At this time, when the negative pressure pipe 54 generates negative pressure, the gas above the wafer 9 will be sucked in, thereby making the pressure in the negative pressure pipe 54 different from the preset value.

[0149] refer to Figure 5 and Figure 6Therefore, when the pressure detected by the pressure sensor is the same as the preset value, it means that the wafer 9 has been placed on the placement arm 24 and is adsorbed by the negative pressure in the negative pressure groove 52. When the pressure detected by the pressure sensor is different from the preset value, it means that the wafer 9 is not adsorbed by the negative pressure in the negative pressure groove 52, and the wafer 9 may have deviated from the preset position.

[0150] refer to Figure 5 and Figure 6 By using a pressure sensor to detect the pressure value in the negative pressure pipe 54, it is possible to determine whether the wafer 9 is adsorbed by negative pressure based on the relationship between the detected pressure value and the preset pressure value, and it is also possible to determine whether the wafer 9 is located at the preset position.

[0151] refer to Figure 5 and Figure 6 The negative pressure pipe 54 is arranged on the placement arm 24 of the clamping assembly 1; preferably, the negative pressure pipe 54 is embedded inside the placement arm 24 of the clamping assembly 1.

[0152] refer to Figure 7 and Figure 8 , the negative pressure pipe 54 is hidden inside the placement arm 24, which reduces the leakage of the negative pressure pipe 54 and reduces the space occupied by the negative pressure pipe 54. On the other hand, the negative pressure pipe 54 inside the placement arm 24 will be wrapped by the placement arm 24, so that the placement arm 24 protects the negative pressure pipe 54, reducing the possibility of leakage of the negative pressure pipe 54.

[0153] refer to Figure 7 and Figure 8 , a second support platform 53 arranged opposite to the first support platform 51 is installed on the moving part 2; preferably, a negative pressure groove 52 is opened on the second support platform 53;

[0154] refer to Figure 6 and Figure 7 The first support platform 51 and the second support platform 53 are arranged opposite to each other, and the first support platform 51 and the second support platform 53 are respectively located at the two end positions of the placement arm 24. When the wafer 9 is placed on the placement arm 24, the first support platform 51 and the second support platform 53 are respectively located at the two end positions below the wafer 9, and the negative pressure grooves 52 on the first support platform 51 and the second support platform 53 simultaneously adsorb the wafer 9, which can increase the adsorption and fixing effect of the wafer 9, and at the same time, the two ends of the wafer 9 are subjected to uniform adsorption force at the same time, so that the force on the wafer 9 is more uniform, and the possibility of deformation of the wafer 9 is reduced.

[0155] refer to Figure 7 and Figure 8 , further preferably, the negative pressure pipe 54 is connected to the negative pressure groove 52 on the first support platform 51 and the negative pressure groove 52 on the second support platform 53 respectively.

[0156] refer to Figure 7 and Figure 8 The negative pressure grooves 52 on the first supporting platform 51 and the second supporting platform 53 are both connected to the negative pressure pipeline 54, so that the negative pressures in the two negative pressure grooves 52 are equal, and thus the adsorption forces on the wafer 9 are also equal.

[0157] refer to Figure 8 and Fig. 9 , a connecting assembly is provided between the placement arm 24 and the support arm 25; the connecting assembly includes a support portion fixed on the support arm 25; the support portion is located below the placement arm 24;

[0158] refer to Figure 8 and Fig. 9 The support part is connected to the placement arm 24, and the support part can also provide support for the placement arm 24. The support part and the placement arm 24 are connected by bolts.

[0159] Preferably, a blocking portion is provided on a side of the support portion close to the support arm 25, and the blocking portion abuts against a side of the placement arm 24 close to the support arm 25;

[0160] refer to Figure 8 and Fig. 9 The blocking portion is used to position the placement arm 24 when it is connected to the support portion. When the placement arm 24 is placed on the support portion and abuts against the blocking portion, the threaded holes for bolt connection on the placement arm 24 and the support portion are aligned, and then they can be connected and fixed using bolts.

[0161] refer to Figure 8 and Fig. 9 , further preferably, a pressing block 26 is provided above the placement arm 24, and the pressing block 26 and the supporting portion are both located at one end of the placement arm 24, and are respectively located on both sides of the placement arm 24;

[0162] refer to Figure 8 and Fig. 9 , the pressing block 26 is located above the placement arm 24, and is used to compact the placement arm 24 and fix the placement arm 24. When the placement arm 24 is fixedly connected to the connecting arm, the placement arm 24 is clamped by the support portion and the pressing block 26, and then fixedly connected by bolts. The two ends of the bolt are in contact with the support portion and the pressing block 26 respectively, thereby avoiding the concentrated stress at the bolt connection position from directly acting on the placement arm 24, and reducing the deformation of the placement arm 24 under the bolt pre-tightening. Make the placement arm 24 more stable and flat, so that the wafer 9 can be fixed flatly on the placement arm 24.

[0163] refer to Figure 8 and Fig. 9The pressing block 26 has a protruding clamping portion on the lower side of one end away from the supporting arm 25, and a clamping groove adapted to the clamping portion is provided on the placing arm 24;

[0164] refer to Figure 8 and Fig. 9 When the pressing block 26 is connected to the placement arm 24, the clamping portion will be embedded in the clamping groove. The clamping portion and the clamping groove cooperate to achieve positioning of the pressing block 26 or the placement arm 24, and reduce the possibility of misalignment or deviation between the pressing block 26 and the placement arm 24. It can also enhance the connection stability between the placement arm 24 and the pressing block 26. Due to the limitation of the machining accuracy of the bolt connection, the accuracy of the bolt connection is low. The clamping portion and the clamping groove cooperate to achieve connection positioning, so that the connection between the placement arm 24 and the support portion is more accurate, and the placement arm 24 can be accurately fixed at a preset position.

[0165] refer to Figure 8 and Fig. 9 , the pressing block 26 and the supporting portion are both clamped and fixedly connected with the placing arm 24;

[0166] The pressing block 26, the placing arm 24 and the supporting part are connected using bolt connections.

[0167] refer to Figure 8 and Fig. 9 , further preferably, the distance between the limiting platform 23 and the pressing block 26 is greater than the diameter of the wafer 9 .

[0168] The pressing block 26 is located at one end of the placement arm 24 close to the support arm 25, and the limiting platform 23 is located at one end of the placement arm 24 and the supporting arm 25. Therefore, the pressing block 26 and the limiting platform 23 are respectively located at the two end positions of the placement arm 24. After the wafer 9 is placed on the placement arm 24, it will be located between the pressing block 26 and the limiting platform 23. Therefore, the distance between the pressing block 26 and the limiting platform 23 is greater than the diameter of the wafer 9, so that the wafer 9 can be placed on the placement arm 24. In addition, since the wafer 9 is in contact with the positioning point 32 on the side close to the support arm 25, the positioning point 32 can fix and position the wafer 9, so the wafer 9 does not contact the pressing block 26. However, the distance between the pressing block 26 and the fixed wafer 9 should not be too large to cause space waste.

[0169] refer to Figure 7 and Figure 8 , the distance between the first supporting platform 51 and the second supporting platform 53 is smaller than the diameter of the wafer 9;

[0170] Preferably, the distance between the negative pressure groove 52 on the first supporting platform 51 and the negative pressure groove 52 on the second supporting platform 53 is smaller than the diameter of the wafer 9 .

[0171] refer to Figure 7 and Figure 8 The negative pressure groove 52 is used to adsorb the wafer 9. Therefore, when the wafer 9 is clamped and fixed on the placement arm 24, the wafer 9 needs to cover both the two negative pressure grooves 52 on the first support platform 51 and the second support platform 53. Then, the negative pressure generated in the negative pressure groove 52 adsorbs the wafer 9 onto the placement arm 24.

[0172] Therefore, when the limiting platform 23 clamps and fixes the wafer 9, the distance between the negative pressure groove 52 on the first supporting platform 51 and the negative pressure groove 52 on the second supporting platform 53 is smaller than the diameter of the wafer 9, so that the negative pressure groove 52 can absorb and fix the wafer 9.

[0173] refer to Figure 1 and Figure 2 The slider 22 is connected with a synchronous belt assembly 27, and the synchronous belt assembly 27 drives the moving part 2 to move back and forth;

[0174] The synchronous belt assembly 27 includes a motor, a first driven wheel and a belt body; the first driven wheel and the motor are respectively arranged at both ends of the slide rail;

[0175] refer to Figure 1 and Figure 2 The motor is meshedly connected with the belt body, the first driven wheel and the motor straighten the belt body at both ends of the belt body, and the electrode drives the belt body to run.

[0176] refer to Figure 1 and Figure 2 Preferably, a second driven wheel is provided on the belt body, and the second driven wheel is provided at a position close to the motor and opposite to the first driven wheel;

[0177] refer to Figure 1 and Figure 2 The second driven wheel is arranged opposite to the first driven wheel, and the first driven wheel and the second driven wheel fix the running direction of the belt body.

[0178] refer to Figure 1 and Figure 2 In a specific embodiment, the first driven wheel and the second driven wheel are arranged in parallel with the slider 22, so when the belt body runs between the first driven wheel and the second driven wheel, it can drive the slider 22 to move back and forth.

[0179] refer to Figure 1 and Figure 2 Further preferably, a tensioning wheel is arranged on the belt body, and the tensioning wheel is arranged at a position close to the motor and located on the outside of the belt body.

[0180] refer to Figure 1 and Figure 2The tensioning wheel can move elastically, and the tensioning wheel presses the belt body toward the inside; thereby increasing the path length of the belt body, so that the belt body can be connected to the motor and the first driven wheel and the second driven wheel in a tensioned state.

[0181] refer to Figure 1 and Figure 2 The driven wheel is arranged on the outside of the belt body, so that the tensioning wheel is pre-tightened toward the inside of the belt body, and the belt body is retracted to a nearby position, thereby reducing the space occupied by the belt body and improving the space utilization rate of the synchronous belt assembly 27.

[0182] The tensioning wheel located at the outside makes it convenient for the staff to debug it, and then the staff can more conveniently use the tensioning wheel to apply appropriate pre-tightening force to the belt body. It can not only put the belt body in a tensioned state and improve the running accuracy of the belt body, but also reduce the possibility of serious wear of the belt body due to excessive pre-tightening force.

[0183] refer to Figure 1 and Figure 8 A position sensor 28 is provided on the placement arm 24 .

[0184] The in-position sensor 28 is used to detect the wafer 9 on the placement arm 24. Specifically, when the wafer 9 is at the preset position on the placement arm 24, the wafer 9 detects its in-position signal, thereby determining that the wafer 9 is at the preset position of the placement arm 24, and then the moving device is used to operate the wafer 9.

[0185] refer to Figure 1 and Figure 8 , and when the in-position sensor 28 detects the wafer 9 on the placement arm 24, no in-position signal is detected, which means that the wafer 9 has not fallen on the placement arm 24, or the wafer 9 is not fixed in the preset position. At this time, it is necessary to start the moving device so that the placement arm 24 can receive the wafer 9 again until the in-position sensor 28 detects the in-position signal of the wafer 9.

[0186] The in-position sensor 28 is used to determine the position information of the wafer 9, so as to reduce the deviation of the wafer 9 when it falls on the placement arm 24, thereby reducing the occurrence of operation errors of the wafer 9, thereby improving the reliability of the operation of the wafer 9.

[0187] refer to Figure 1 and Figure 2 A support plate 8 is provided between the moving device and the fixing device, and the fixing device is fixed on the support plate 8; the moving device includes a horizontal module and a vertical module for driving the fixing device to move.

[0188] Through the coordinated use of the horizontal module and the vertical module, the wafer 9 can be taken and moved to the target position.

[0189] In the present application, both the horizontal module and the vertical module are modules known in the art and will not be described in detail here.

[0190] refer to Figure 1 and Figure 2 A scanning sensor capable of scanning the position of the wafer 9 is arranged on the mobile device, and the scanning sensor is connected to a master controller; the master controller is connected to the mobile device; the master controller can judge the scanning sensor signal and control the movement of the mobile device;

[0191] refer to Figure 1 and Figure 2 The scanning sensor is used to scan the wafer 9 to determine the position of the wafer 9. After the scanning sensor scans and determines the position of the wafer 9, it transmits the position signal of the wafer 9 to the main controller, and then the main controller changes back to control the movement of the moving device, and then the moving device moves the fixing device to the position of the wafer 9, so that the fixing device fixes the wafer 9, and then the wafer 9 is radially rotated.

[0192] refer to Figure 1 and Figure 2 Preferably, a reciprocating assembly 6 is provided on the mobile device, and the reciprocating assembly 6 is connected to the film scanning sensor;

[0193] After the scanning sensor detects the position of the wafer 9 and transmits the position signal to the main controller, the reciprocating assembly 6 moves the scanning sensor to be retracted into the moving device.

[0194] refer to Figure 1 and Figure 2 When the scanning sensor scans the position information of wafer 9, the reciprocating assembly 6 moves the scanning sensor to the front of the mobile device, so that the scanning sensor can more accurately locate the position of wafer 9. When the fixed device is needed to take the wafer 9, the scanning sensor is temporarily not in use. Therefore, the reciprocating assembly 6 moves the scanning sensor to the mobile device, and the scanning sensor does not exceed the position of the fixed device. Reduce the influence of the scanning sensor when the fixed device takes the wafer 9. Make the fixed device more convenient to take the wafer 9.

[0195] refer to Figure 1 and Figure 2 Further preferably, the reciprocating assembly 6 includes a second guide rail 21 and a second slider 22; a support rod is provided on the second slider 22. One end of the support rod is connected to the second slider 22, and the film scanning sensor is provided at an end of the support rod away from the slider 22;

[0196] refer to Figure 1 and Figure 2, further preferably, a contraction component 7 is provided between the moving device and the reciprocating component 6, and the moving direction of the contraction component 7 intersects or is perpendicular to the moving direction of the reciprocating component 6;

[0197] Further preferably, the contraction component 7 can drive the reciprocating component 6 to move;

[0198] Further preferably, the shrinking assembly 7 comprises a cylinder.

[0199] refer to Figure 1 and Figure 2 The cylinder can drive the second slider 22 to move back and forth along the second guide tube, and the support rod is used to connect the second slider 22 and the scanning sensor.

[0200] refer to Figure 1 and Figure 2 Under the extension of the support rod, the scanning sensor can protrude forward and exceed the fixing device, so that the scanning sensor can be located in front of the fixing device to scan the position of the wafer 9.

[0201] refer to Figure 1 and Figure 2 The second guide rail 21 is arranged in parallel with the cylinder. When the cylinder moves back and forth, it drives the second slider 22 to move along the second guide rail 21. The matching accuracy of the second guide rail 21 and the second slider 22 is higher than the moving accuracy of the cylinder. Therefore, the matching of the second slider 22 and the second guide rail 21 improves the moving accuracy of the film scanning sensor. At the same time, the matching between the second guide rail 21 and the second slider 22 can also increase the connection strength and reduce the possibility of the film scanning sensor and the support rod tilting or bending during the movement.

[0202] refer to Figure 1 and Figure 2 , the present application also provides a wafer operation device, including the above-mentioned operation device and a general controller;

[0203] The master controller can control mobile devices and fixed devices.

[0204] The negative pressure pipeline 54 is connected to a negative pressure pump, and the pressure sensor and the negative pressure pump are connected to a main controller; the main controller can determine the measured value of the pressure sensor to control the start and stop of the negative pressure pump.

[0205] The pressure sensor can detect the gas pressure in the negative pressure pipe 54 . When the wafer 9 is placed at a preset position, the wafer 9 will be located above the negative pressure groove 52 , and then negative pressure will be generated in the negative pressure pipe 54 , thereby adsorbing the wafer 9 onto the placement arm 24 .

[0206] When the placement position of the wafer 9 deviates from the preset position, the wafer 9 will deviate from the negative pressure groove 52. At this time, when the negative pressure pipe 54 generates negative pressure, the gas above the wafer 9 will be sucked in, thereby making the pressure in the negative pressure pipe 54 different from the preset value.

[0207] Therefore, when the pressure detected by the pressure sensor is the same as the preset value, it means that the wafer 9 has been placed on the placement arm 24 and is adsorbed by the negative pressure in the negative pressure groove 52. When the pressure detected by the pressure sensor is different from the preset value, it means that the wafer 9 is not adsorbed by the negative pressure in the negative pressure groove 52, and the wafer 9 may have deviated from the preset position.

[0208] By using a pressure sensor to detect the pressure value in the negative pressure pipe 54, it is possible to determine whether the wafer 9 is adsorbed by negative pressure based on the relationship between the detected pressure value and the preset pressure value, and it is also possible to determine whether the wafer 9 is located at the preset position.

[0209] The in-position sensor 28 is connected to the main controller, and the main controller makes a decision based on the measured value output of the in-position sensor 28 and / or the pressure sensor.

[0210] The in-position sensor 28 is used to detect the wafer 9 on the placement arm 24. Specifically, when the wafer 9 is at the preset position on the placement arm 24, the wafer 9 detects its in-position signal, thereby determining that the wafer 9 is at the preset position of the placement arm 24, and then the moving device is used to operate the wafer 9.

[0211] When the in-position sensor 28 detects the wafer 9 on the placement arm 24 and does not detect an in-position signal, it means that the wafer 9 has not fallen on the placement arm 24, or the wafer 9 is not fixed in the preset position. At this time, it is necessary to start the moving device so that the placement arm 24 can receive the wafer 9 again until the in-position sensor 28 detects the in-position signal of the wafer 9.

[0212] The in-position sensor 28 is used to determine the position information of the wafer 9, so as to reduce the deviation of the wafer 9 when it falls on the placement arm 24, thereby reducing the occurrence of operation errors of the wafer 9, thereby improving the reliability of the operation of the wafer 9.

[0213] In the present application, the in-position sensor 28 and the pressure sensor are used simultaneously to determine the position of the wafer 9 at the same time. The double determination has double insurance, further accurately locates the position information of the wafer 9, improves the accuracy of the operation of the wafer 9, and reduces the possibility that the wafer 9 is not fixed and operated during the operation of the wafer 9. The stability and reliability of the operation equipment for the operation of the wafer 9 are improved.

[0214] The present application also provides a wafer operation method, comprising the following steps:

[0215] Move the operating device into the jam 91;

[0216] Lift the operating device to remove the wafer 9 from the jam 91;

[0217] The operating device clamps and absorbs the wafer 9;

[0218] Wafer 9 is operated.

[0219] refer to Figure 1 and Fig.10 , a wafer 9 is placed in the plug 91, the part of the operating device that clamps the wafer 9 enters the inside of the plug 91, and the part that clamps the wafer 9 is placed under the wafer 9, and then the operating device is lifted upward, so that the part that clamps the wafer 9 lifts up the wafer 9, so that the wafer 9 is separated from the plug 91.

[0220] Then, the operating device clamps and fixes the wafer 9, and also uses adsorption to fix the wafer 9 firmly on the operating device. This improves the fixing effect of the operating device on the wafer 9. This reduces the possibility of the wafer 9 detaching from the operating device during operation. This improves the stability and reliability of the operation of the wafer 9.

[0221] The running device is inserted deep into the plug 91 and beyond the wafer 9 .

[0222] When the operating device is lifted inside the plug 91, the wafer 9 will be separated from the plug 91, and the wafer 9 will fall into the position where the operating device fixes the wafer 9. Therefore, the operating device needs to go deep into the plug 91 and exceed the wafer 9 so that the wafer 9 can fall into a position where it can be fixed.

[0223] Compared with first removing the wafer 9 from the plug 91 and then moving the wafer 9 to a fixed position of the operating device, the solution in the present application is simpler and faster.

[0224] When the operating device penetrates into the plug 91, the clamping space of the operating device exceeds the wafer 91 by more than millimeters; preferably, it is 2 millimeters or more.

[0225] Specifically, the clamping space of the operating device exceeds the size of the wafer 9 by: 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2mm, 2.1mm, 2.2mm, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm, 2.8mm, 2.9mm, 3mm, 3.1mm, 3.2mm, 3.3mm, 3.4mm, 3.5mm, 3.6mm, 3.7mm, 3.8mm, 3.9mm, 4mm, 4.2mm, 4.4mm, 4.5mm, 4.6mm, 4.8mm, and 5mm.

[0226] When the operating device is in the plug 91 , the position of the wafer 9 in the plug 91 is first detected, and then the wafer 9 at the appropriate position is selected for operation.

[0227] Because in the present application, the operating device penetrates into the plug 91 and exceeds the wafer 9, and at the same time, the operating device takes and fixes the wafer 9 by lifting. Therefore, when the wafer 9 is in a deviated position in the plug 91, the operating device penetrates into the plug 91 and causes impact damage to the wafer 9.

[0228] In addition, the operating device itself has a certain volume, and will occupy the space inside the plug 91 when it goes deep into the plug 91. When detecting the position of the wafer 9 in the plug 91, it will also determine whether there is space in the plug 91 for the operating device to enter.

[0229] Before the operating device takes the wafer 9 , the position of the wafer 9 in the plug 91 is first determined, thereby reducing the collision or collision between the operating device and the wafer 9 , thereby reducing the occurrence of damage to the wafer 9 .

[0230] When the wafer 9 is clamped, the wafer 9 is positioned at the same time, so that the wafer 9 is positioned at a preset position.

[0231] When the wafer 9 is taken, it is taken by lifting. Therefore, under the action of gravity, friction and air resistance, it is inevitable that the wafer 9 will be displaced when it falls on the operating device.

[0232] Therefore, in the present application, when clamping the wafer 9, the clamping component moves the wafer 9 so that the wafer 9 is clamped at a preset position, and when clamping different wafers 9, they are all fixed at the same preset position. In this way, when the operating device operates the wafer 9 fixed at the same position, it has a lower operating difficulty, and reduces the operating difficulty of the high-precision operation of the wafer 9.

[0233] Compared with directly clamping the wafer 9 at the falling position, the wafer 9 falling at different positions will be fixed at different positions, that is, the clamping part of the operating device corresponds to the position of the wafer 9. This will cause the movement and uncertainty of the wafer 9 to be too much during the operation, which greatly increases the difficulty of high-precision operation of the wafer 9.

[0234] After the wafer 9 is clamped and positioned, negative pressure adsorption is used to fix the wafer 9.

[0235] If the clamping force is too large when clamping the wafer 9, the edge of the wafer 9 will be damaged, thereby causing damage to the wafer 9. If the clamping force is too small, the wafer 9 will easily fall off the operating device. Therefore, negative pressure adsorption is used again to increase the fixing effect of the wafer 9 and reduce the possibility of the wafer 9 falling off the operating device.

[0236] When the wafer 9 is operated, the position and fixation of the wafer 9 are first determined, and then the wafer 9 is operated.

[0237] When determining the position and fixation of the wafer 9, the clamping force and the adsorption negative pressure are used for determination.

[0238] After the operating device clamps and adsorbs the wafer 9, the negative pressure of adsorption and the force of clamping are detected. If the detected negative pressure of adsorption is the same as the preset value, it means that the wafer 9 is adsorbed on the operating device. If the detected negative pressure of adsorption is different from the preset value, it means that the wafer 9 is not adsorbed or the wafer 9 is offset and fails to adsorb firmly. At this time, the wafer 9 cannot be operated directly, but the position of the wafer 9 needs to be readjusted before operation. If the force or position of the wafer 9 is detected to be the same as the preset, it means that the wafer 9 is clamped and fixed on the operating device. If the detected force or position is different from the preset, it means that the position of the wafer 9 deviates and the fixing effect of the wafer 9 does not meet the expectations. Therefore, the position of the wafer 9 needs to be readjusted before operation.

[0239] In the present application, when determining the position and fixation of the wafer 9, it can be determined only by the clamping force or position, or only by the adsorption negative pressure. Preferably, it can be determined by both the clamping force or position and the adsorption negative pressure. This further improves the operating reliability of the operating device for the wafer 9.

[0240] In summary, the present application provides a running device. The fixing device is driven by the vertical module and the horizontal module of the moving device. The vertical module (not shown in the figure) is driven to move up and down, and then driven by the horizontal module (not shown in the figure) to move left and right in front of the wafer 9 storage. The wafer 9 is stored in a number of plugs 91 arranged in the horizontal direction, and each plug 91 is vertically arranged with multiple layers of wafer 9 storage space. There are support parts on the left and right sides of each layer of storage space for supporting both sides of the wafer 9. In the same plug 91, several wafers 9 are stored at intervals of layers. When taking a wafer, the horizontal module and the longitudinal module first drive the fixing device to move to the front of the corresponding plug 91, and then the synchronous belt assembly 27 drives the support arm 25 and the placement arm 24 to extend forward until the placement arm 24 is completely located directly below the wafer 9; and the limit portion of the placement arm 24 needs to exceed the position of the wafer 9 by about 2 mm to ensure that the wafer 9 can fall completely on the placement arm 24.

[0241] Then the vertical module drives the placement arm 24 to lift upward, and during the lifting, the placement arm 24 first contacts the lower surface of the wafer 9, and then continues to lift to separate the wafer 9 from the support structure in the plug 91. The placement arm 24 is then moved outward horizontally using the synchronous belt to rotate in the opposite direction.

[0242] At this time, the placement arm 24 is in the ejection state, and the limit table 23 at the end of the placement arm 24 is still a certain distance away from the positioning blocks 31 on both sides. The wafer 9 is held by the placement arm 24 and has not yet contacted the positioning blocks 31 and the positioning points 32. As the motor rotates, the synchronous belt drives the slider 22 to move toward the origin, and at the same time drives the placement arm 24 to move toward the origin. When the wafer 9 moves to the edge and contacts one or two positioning points 32 respectively, the positioning points 32 on the left and right sides will have a conflicting effect on the wafer 9, and adjust the position of the wafer 9 in the left and right directions respectively. As the placement arm 24 moves further toward the origin, the wafer 9 is adaptively adjusted between the limit table and the positioning block 31. Until the slider 22 and the placement arm 24 move to the origin. Then the negative pressure pump is started to draw the negative pressure state in the negative pressure tank 52, so that the wafer 9 is firmly adsorbed on the placement arm 24.

[0243] When the slider 22 and the placement arm 24 move to the origin, the reset information is fed back to the main controller, and the main controller controls the negative pressure pump to start, while monitoring the pressure sensor and the in-position sensor 28; when the detections of the pressure sensor and the in-position sensor 28 meet the preset values, it means that the wafer 9 has been fixed, and then the horizontal module and the vertical module are used to operate the wafer 9.

[0244] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make modifications to the present embodiment without any creative contribution as needed, but such modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. A wafer operation device, wherein: including a fixing device for fixing the wafer and a moving device for moving the wafer; The fixing device comprises a clamping component and an adsorption component; The clamping assembly includes a moving part and a positioning part, and the moving part can move back and forth; The adsorption assembly includes a negative pressure portion, and the negative pressure portion is arranged on the moving portion.

2. The wafer operation device according to claim 1, wherein: The moving part comprises a guide rail and a slider which are slidably connected. A limiting platform is arranged on the slider, and the limiting platform can abut against the edge of the wafer.

3. The wafer operation device according to claim 2, wherein: The slider is provided with a support arm, one end of the support arm is fixedly connected to the slider, a placement arm is provided at one end of the support arm away from the slider, and the limiting portion is provided at a position where the placement arm is away from the support arm; An in-position sensor is arranged on the placement arm.

4. The wafer operation device according to claim 1, wherein: The positioning portion includes a positioning stopper; The side of the positioning stopper close to the wafer is in an arc shape that matches the shape of the wafer; The positioning blocks are relatively provided with two; A positioning point is provided on the positioning block; At least one positioning point is provided on each positioning block; All positioning points can abut against the wafer edge at the same time.

5. The wafer operation device according to claim 4, wherein: The center angles of two positioning points on the wafer that are respectively located on the two positioning blocks and far away from each other are 60-80 degrees; the center angles of two positioning points on the wafer that are respectively located on the two positioning blocks and close to each other are 30-50 degrees.

6. The wafer operation device according to claim 1, wherein: The negative pressure part comprises a first support platform arranged on the moving part, a negative pressure groove is opened on the first support platform, and the negative pressure groove is connected to a negative pressure pipeline; The first support platform and the negative pressure groove are both arc-shaped; When the wafer is clamped by the clamping assembly, the first supporting platform is located below the wafer.

7. The wafer operation device according to claim 6, wherein: When the adsorption assembly adsorbs the wafer, the air pressure in the negative pressure pipe and the negative pressure tank is lower than the air pressure above the wafer; The pressure of the negative pressure pipeline is -70kpa to -85kpa; A pressure sensor is arranged inside the negative pressure pipeline.

8. The wafer operation device according to claim 3, wherein: A connecting assembly is provided between the placement arm and the support arm; the connecting assembly comprises a support portion fixed on the support arm; the support portion is located below the placement arm; A blocking portion is provided on a side of the support portion close to the support arm, and the blocking portion abuts against a side of the placement arm close to the support arm; A pressure block is arranged above the placement arm, and the pressure block and the support part are both located at one end of the placement arm and are respectively located on both sides of the placement arm; the pressure block has a clamping part protruding from the lower side of the end away from the support arm, and a clamping groove adapted to the clamping part is opened on the placement arm.

9. The wafer operation device according to claim 2, wherein: The slider is connected with a synchronous belt assembly, and the synchronous belt assembly drives the moving part to move back and forth; The synchronous belt assembly comprises a motor, a first driven wheel and a belt body; the first driven wheel and the motor are respectively arranged at two ends of the slide rail; A second driven wheel is arranged on the belt body, and the second driven wheel is arranged at a position close to the motor and opposite to the first driven wheel; A tensioning wheel is arranged on the belt body, and the tensioning wheel is arranged at a position close to the motor and located on the outer side of the belt body.

10. The wafer operation device according to claim 1, wherein: The mobile device is provided with a scanning sensor capable of scanning the wafer position, and the scanning sensor is connected to a general controller; the general controller is connected to the mobile device; the general controller can judge the scanning sensor signal and control the movement of the mobile device.

11. The wafer operation device according to claim 10, wherein: A reciprocating assembly is provided on the mobile device, and the reciprocating assembly is connected to a film scanning sensor; The reciprocating assembly includes a second guide rail and a second slider; a support rod is arranged on the second slider; one end of the support rod is connected to the second slider, and the film scanning sensor is arranged at an end of the support rod away from the slider; A contraction component for driving the second slider to reciprocate is arranged between the moving device and the reciprocating component, and the moving direction of the contraction component intersects or is perpendicular to the moving direction of the reciprocating component.

12. A wafer operation device, wherein: It comprises the operating device and the general controller as described in any one of claims 1 to 11; The master controller is capable of controlling the mobile device and the fixed device; The negative pressure pipeline is connected to a negative pressure pump, and the pressure sensor and the negative pressure pump are connected to a main controller; the main controller can determine the measured value of the pressure sensor to control the start and stop of the negative pressure pump.

13. The wafer moving device according to claim 1, wherein: The in-position sensor is connected to a master controller, and the master controller outputs a determination based on the measured values ​​of the in-position sensor and / or the pressure sensor.

14. A wafer operation method, wherein: The following steps are involved: Move the operating device into the jam; Lift the operating device and remove the wafer from the jam; The operating device clamps and absorbs the wafer; Run the wafer.

15. The method according to claim 14, wherein: When the operating device is stuck, first detect the position of the wafer in the jam, and then select the wafer at the appropriate position for operation; Push the running device deeper into the jammer and beyond the wafer; When the operating device penetrates deeply into the plug, the clamping space of the operating device exceeds the wafer by more than 1 mm.

16. The method according to claim 14, wherein: While clamping the wafer, the wafer is positioned at the same time, so that the wafer is positioned at a preset position; After the wafer is positioned by clamping, negative pressure adsorption is used to fix the wafer; When moving the wafer, first determine the position and fixation of the wafer, and then move the wafer; When determining the position and fixation of the wafer, it is determined by the clamping force or position and the adsorption negative pressure.

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