Structure utilizing PCB (printed circuit board) as carrier for mutual connection of heating sheets and preparation method

Abstract

The invention discloses a structure using a PCB as a heating sheet interconnection carrier and a preparation method thereof, a rigid PCB is clamped between an upper layer hot melt adhesive film and a lower layer hot melt adhesive film, and a packaging structure is formed through heating melting, so that a rigid and non-deformable first waterproof area is realized; and meanwhile, a flexible and variable second annular waterproof buffer area is formed on the outer side. The durability and the waterproofness of the heating assembly are improved, and the comfort of the heating clothes is also considered. Compared with a traditional flexible circuit board, the flexible circuit board has higher mechanical strength, can be compatible with multiple types of heating pieces, meets individual requirements, improves the market adaptability of the heating clothes and prolongs the service life of the heating clothes.

Description

Technical Field

[0001] The present invention relates to the technical field of wearable heating devices, and in particular to a structure and a preparation method thereof, which utilizes a PCB circuit board as a carrier for interconnecting heating sheets. Background Art

[0002] In the design of wearable heating clothing, the connection and fixing method of the heating sheet directly affects the durability, waterproofness and wearing comfort of the product. Traditionally, the industry generally uses flexible printed circuits (FPC) as a carrier for connecting the heating sheets to each other to adapt to the flexible characteristics of clothing. However, although flexible printed circuits have excellent performance in terms of bendability, they have the following problems in practical applications:

[0003] 1. The durability of flexible circuit boards is poor. Due to their flexibility, they are prone to cracks or damage under mechanical stress such as washing and twisting, resulting in connection failure. In addition, the welding temperature requirements of flexible circuit boards are low, and the solder joint strength is weak. They are prone to cold solder joints or solder joint cracking due to long-term use or environmental changes, thus affecting the functional stability of the heating clothing.

[0004] 2. Flexible circuit boards are not good at water resistance. During multiple washings, moisture can easily penetrate into the interior through the edges or solder joints of the flexible circuit board, causing corrosion or short circuits in the circuit board. This situation is particularly serious under harsh operating conditions, limiting the application scope of heating clothing.

[0005] See also Figure 1 , the copper belt 9 has many connection points, which makes the wearing experience in the clothes not good, and causes many wires to be inside the clothes.

[0006] See also Figure 2 , FPC flexible circuit board 10, the welding temperature resistance is below 180 ℃, which is easy to cause the undesirable phenomenon of cold welding or brittle cracking of FPC due to welding. In addition, FPC connected with many electronic wires is easy to be broken by the stress of washing machine.

[0007] To overcome these problems, some designs try to use rigid PCBs instead of flexible circuit boards to improve mechanical strength and solder joint reliability. However, rigid PCBs have poor compatibility with flexible clothing, which can easily reduce wearing comfort. In addition, if not handled properly during the fixing and packaging process, stress concentration can easily form between the rigid area and the flexible clothing, resulting in a poor user experience.

[0008] Therefore, how to retain the mechanical strength and waterproofness of the rigid PCB circuit board while taking into account the flexibility and wearing comfort of the heating clothing has become a technical problem to be solved by the present invention. Summary of the invention

[0009] The technical problem solved by the present invention is to address the defects existing in the above-mentioned prior art and provide a structure and preparation method using a PCB circuit board as a carrier for connecting heating plates to each other, so as to solve the problems of insufficient durability, poor waterproofness and poor flexibility compatibility with clothing of the heating plate connection method proposed in the above-mentioned background technology.

[0010] In order to solve the above technical problems, the technical solution adopted by the present invention is as follows:

[0011] A structure using a PCB circuit board as a carrier for connecting heating sheets to each other, comprising:

[0012] Upper hot melt adhesive film;

[0013] Lower layer hot melt adhesive film;

[0014] A rigid circuit board sandwiched between the upper hot melt adhesive film and the lower hot melt adhesive film, the rigid circuit board is provided with a soldering pad for connecting a power input, a temperature controller and at least one heating sheet, and the soldering pad is connected to the corresponding electronic harness by welding;

[0015] The upper hot melt adhesive film and the lower hot melt adhesive film are bonded to each other by heating and melting to form a packaging structure covering the rigid circuit board and its pads. The packaging structure uses the rigid and non-deformable characteristics of the rigid circuit board to form a rigid and non-deformable first waterproof area.

[0016] Furthermore, the surface areas of the upper hot-melt adhesive film and the lower hot-melt adhesive film are respectively larger than the surface area of ​​the rigid circuit board, so that the rigid circuit board is located between the upper hot-melt adhesive film and the lower hot-melt adhesive film after the upper hot-melt adhesive film and the lower hot-melt adhesive film are melted and bonded, thereby forming a flexible, deformable second annular waterproof buffer area on the outer side of the hard, non-deformable waterproof area.

[0017] As a further solution of the present invention, the rigid circuit board is a rigid PCB circuit board, and the pads of the rigid PCB circuit board are connected to the electronic wiring harness through a high-temperature welding process. The heating sheets that can be connected to the rigid PCB circuit board include but are not limited to carbon fiber heating sheets, carbon nanotube film heating sheets, graphene film heating sheets and printed conductive carbon-based slurry heating sheets.

[0018] As a further solution of the present invention, the thickness of the rigid circuit board is greater than 0.8 mm to ensure that the PCB circuit board has sufficient rigidity and durability.

[0019] As a further solution of the present invention, the upper hot melt adhesive film and the lower hot melt adhesive film are respectively made of thermoplastic polyurethane material (TPU) to ensure that they can be effectively bonded when heated and form a waterproof packaging structure.

[0020] As a further solution of the present invention, when a structure using a PCB circuit board as a carrier for interconnecting heating plates is used in heating clothing, the packaging structure enables the rigid circuit board to form a rigid waterproof area inside the heating clothing that can maintain its structural integrity and functional stability during wearing and washing.

[0021] As a further solution of the present invention, an upper cloth layer is fixedly disposed on the upper surface of the upper hot-melt adhesive film, and a lower cloth layer is fixedly disposed on the lower surface of the lower hot-melt adhesive film.

[0022] A method for preparing a structure using a PCB circuit board as a carrier for connecting heating sheets to each other comprises the following steps:

[0023] Step 1, providing a rigid PCB circuit board: providing a rigid PCB circuit board, wherein the PCB circuit board is provided with a plurality of pads for connecting a power input, a temperature controller and at least one heating sheet;

[0024] Step 2, welding the electronic wiring harness: welding the electronic wiring harness to the pad through a high temperature welding process, wherein the electronic wiring harness is used to connect a power source, a temperature controller and a heating plate;

[0025] Step 3, arranging hot melt adhesive film: sandwiching the rigid PCB circuit board between the upper hot melt adhesive film and the lower hot melt adhesive film, wherein the surface areas of the upper hot melt adhesive film and the lower hot melt adhesive film are respectively larger than the surface area of ​​the rigid PCB circuit board;

[0026] Step 4, heating and melting: heating the upper hot melt adhesive film and the lower hot melt adhesive film to melt and adhere them to the rigid PCB circuit board to form a packaging structure covering the rigid PCB circuit board and its pads;

[0027] Step 5, forming a waterproof area: utilizing the rigidity of the rigid PCB circuit board, the packaging structure forms a rigid, non-deformable first waterproof area, and at the same time forms a flexible, deformable second annular waterproof buffer area on the outer side of the rigid area.

[0028] As a further solution of the present invention, in step 1, the surface of the rigid PCB circuit board is subjected to an anti-oxidation treatment to improve the durability and environmental adaptability of the circuit board.

[0029] As a further solution of the present invention, in step 2, the temperature range of the high temperature welding process is 240° C. to 300° C. to ensure the reliability of welding and the mechanical strength of the solder joint.

[0030] As a further solution of the present invention, in step 3, the arrangement position of the rigid PCB circuit board is pre-treated to make its surface dust-free and oil-free to ensure the best bonding effect between the hot melt adhesive film and the PCB circuit board.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] 1. Improved durability and reliability: By using a rigid PCB circuit board, the package structure forms a rigid, non-deformable first waterproof area after packaging. Compared with traditional flexible circuit boards, the rigid PCB circuit board of the present invention has higher mechanical strength and stability, can effectively resist external mechanical stress and bending deformation, and significantly improves the durability and reliability of the heating component in complex use environments.

[0033] 2. Enhanced waterproof performance: The surface area of ​​the upper and lower hot melt adhesive films is larger than that of the rigid PCB circuit board. After heating and melting, not only a first waterproof area is formed on the surface of the rigid PCB circuit board, but also a flexible and variable second annular waterproof buffer area is formed outside the rigid area. The double-layer waterproof structure makes the present invention far superior to the existing technology in terms of waterproof effect, and can effectively prevent water from penetrating during long-term wearing and multiple washing processes, protecting the integrity and stability of the internal circuit.

[0034] 3. Taking both flexibility and rigidity into account: The present invention combines a rigid PCB circuit board with a flexible hot melt adhesive film, which not only retains the protective performance of the rigid area, but also provides a flexible area outside the rigid area. This structural design cleverly solves the contradiction between the flexibility required for heating clothing and the rigidity of the circuit board, making the heating clothing more durable and protective while maintaining comfort.

[0035] 4. Diverse heating sheet compatibility: Rigid PCB circuit boards are compatible with various types of heating sheets, including but not limited to carbon fiber heating sheets, carbon nanotube film heating sheets, graphene film heating sheets, and printed conductive carbon-based slurry heating sheets. Compared with the limitations of traditional flexible circuit boards, the present invention greatly expands the selection range of heating sheets, meets the personalized needs of different users for heating clothing, and has significant market adaptability.

[0036] 5. The process is simple and controllable: The preparation method of the present invention has a simple process and is easy to control. The hot melt adhesive film is tightly combined with the rigid PCB circuit board through a heating and melting process, which can achieve efficient and stable product quality control during the production process, is suitable for large-scale production, and reduces production costs.

[0037] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0039] Figure 1 It is a structural schematic diagram of the copper belt machine connection method in the prior art.

[0040] Figure 2 The figure is a structural diagram of the FPC flexible circuit board connection method in the prior art.

[0041] Figure 3 This is a structural schematic diagram of a method for preparing a heating sheet using a single group of carbon fibers using a PCB circuit board as a heating carrier.

[0042] Figure 4 The present invention is a structural schematic diagram of a method for preparing a heating sheet by using a double group or multiple groups of carbon fibers and a PCB circuit board as a heating carrier.

[0043] Figure 5 It is a schematic diagram of the carbon fiber heating sheet of the present invention.

[0044] Figure 6 This is a structural schematic diagram of a method for preparing a heating sheet by connecting two sheets in series using a sheet material or a sheet structured heating material, including a printed conductive carbon-based slurry, or a carbon nanotube film or a graphene film material, as a heating carrier.

[0045] Figure 7 The present invention is a structural schematic diagram of a method for preparing a heating sheet by connecting four or more sheets in series and using a sheet material or a sheet structured heating material, including a printed conductive carbon-based slurry, or a carbon nanotube film or a graphene film material, as a heating carrier.

[0046] Figure 8 The present invention is a structural schematic diagram of a method for preparing a heating sheet by connecting two pieces in parallel and using a sheet material or a sheet structured heating material, including a printed conductive carbon-based slurry, or a carbon nanotube film or a graphene film material, as a heating carrier.

[0047] Fig. 9 A structural schematic diagram of a method for preparing a heating sheet by connecting four or more pieces in parallel and using a sheet material or a sheet structured heating material, including a printed conductive carbon-based slurry, or a carbon nanotube film or a graphene film material, as a heating carrier.

[0048] Fig.10It is a schematic diagram of the structure of the series connection of heating sheets of printed or film-type sheet heating materials.

[0049] Fig.11 It is a schematic diagram of the structure of the parallel connection of the heating plates of the printed or film-type sheet heating material.

[0050] The reference numerals and names in the figures are as follows:

[0051] An upper hot-melt adhesive film 1, a lower hot-melt adhesive film 2, a rigid circuit board 3, a soldering pad 4, an electronic wiring harness 5, an upper fabric layer 6, a lower fabric layer 7, a heating sheet 8, a copper tape 9 and an FPC flexible circuit board 10. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0053] See also Figure 3 —11, in the embodiment of the present invention,

[0054] A structure using a PCB circuit board as a carrier for interconnecting heating sheets, comprising: an upper hot melt adhesive film 1; a lower hot melt adhesive film 2;

[0055] A rigid circuit board 3 is sandwiched between the upper hot melt adhesive film 1 and the lower hot melt adhesive film 2. The rigid circuit board 3 is provided with a soldering pad 4 for connecting a power input, a temperature controller and at least one heating sheet 8. The soldering pad 4 is connected to the corresponding electronic harness 5 by welding.

[0056] The upper hot melt adhesive film 1 and the lower hot melt adhesive film 2 are bonded to each other by heating and melting to form a packaging structure covering the rigid circuit board 3 and its pad 4. The packaging structure uses the rigid and non-deformable characteristics of the rigid circuit board 3 to form a rigid and non-deformable first waterproof area.

[0057] Furthermore, the surface areas of the upper hot-melt adhesive film 1 and the lower hot-melt adhesive film 2 are respectively larger than the surface areas of the rigid circuit board 3, so that the rigid circuit board 3 is located between the upper hot-melt adhesive film 1 and the lower hot-melt adhesive film 2 after the upper hot-melt adhesive film 1 and the lower hot-melt adhesive film 2 are melted and bonded, thereby forming a flexible and deformable second annular waterproof buffer area on the outer side of the hard and non-deformable waterproof area.

[0058] The rigid circuit board 3 is a rigid PCB circuit board, and the pad 4 of the rigid PCB circuit board is connected to the electronic wiring harness 5 through a high-temperature welding process. The heating sheet 8 that can be connected to the rigid PCB circuit board includes but is not limited to carbon fiber heating sheets, carbon nanotube film heating sheets 8, graphene film heating sheets 8 and printed conductive carbon-based slurry heating sheets 8.

[0059] The thickness of the rigid circuit board is above 0.8 mm to ensure that the PCB circuit board has sufficient rigidity and durability.

[0060] The upper hot melt adhesive film 1 and the lower hot melt adhesive film 2 are respectively made of thermoplastic polyurethane (TPU) materials to ensure that they can be effectively bonded when heated and form a waterproof packaging structure.

[0061] When the structure using PCB circuit board as a carrier for connecting heating sheets to each other is used in heating clothing, the packaging structure enables the rigid circuit board 3 to form a rigid waterproof area inside the heating clothing that can maintain its structural integrity and functional stability during wearing and washing.

[0062] An upper fabric layer 6 is fixedly disposed on the upper surface of the upper hot-melt adhesive film 1 , and a lower fabric layer 7 is fixedly disposed on the lower surface of the lower hot-melt adhesive film 2 .

[0063] A method for preparing a structure using a PCB circuit board as a carrier for connecting heating sheets to each other comprises the following steps:

[0064] Step 1, providing a rigid PCB circuit board: providing a rigid PCB circuit board, on which a plurality of pads 4 are provided for connecting a power input, a temperature controller and at least one heating sheet 8;

[0065] Step 2, welding the electronic wiring harness 5: welding the electronic wiring harness 5 to the pad 4 through a high temperature welding process, and the electronic wiring harness 5 is used to connect the power supply, the temperature controller and the heating plate 8;

[0066] Step 3, arranging hot melt adhesive film: sandwiching the rigid PCB circuit board between the upper hot melt adhesive film 1 and the lower hot melt adhesive film 2, wherein the surface areas of the upper hot melt adhesive film 1 and the lower hot melt adhesive film 2 are respectively larger than the surface areas of the rigid PCB circuit board;

[0067] Step 4, heating and melting: heating the upper hot melt adhesive film 1 and the lower hot melt adhesive film 2 to melt and adhere them to the rigid PCB circuit board to form a packaging structure covering the rigid PCB circuit board and its pads 4;

[0068] Step 5: Forming a waterproof area: Utilizing the rigidity of the rigid PCB circuit board, the packaging structure forms a rigid, non-deformable first waterproof area, and at the same time forms a flexible, variable second annular waterproof buffer area on the outer side of the rigid area.

[0069] In step 1, the surface of the rigid PCB circuit board is subjected to an anti-oxidation treatment to improve the durability and environmental adaptability of the circuit board.

[0070] In step 2, the temperature of the high temperature soldering process ranges from 240°C to 300°C to ensure the reliability of soldering and the mechanical strength of the solder joint.

[0071] In step 3, the layout position of the rigid PCB is pre-treated to make its surface dust-free and oil-free to ensure the best bonding effect between the hot melt adhesive film and the PCB.

[0072] The difference between the PCB circuit board of the present invention and the FPC flexible circuit board as a carrier for connecting the heating sheets in the heating clothing is as follows:

[0073]

[0074] Embodiment 1:

[0075] In the actual application of wearable heating clothes, the conventionally used flexible printed circuit (FPC) is usually designed as a carrier for connecting the heating sheet 8 due to its easy-to-bend characteristics. However, during long-term use, the heating clothes often need to withstand the test of mechanical distortion, repeated washing and environmental changes, which makes the FPC easy to be damaged, the solder joints are poorly soldered or broken. In this case, the connection between the heating sheets 8 fails, which directly affects the functional stability and user experience of the heating clothes.

[0076] In order to solve this problem, in this embodiment, a rigid PCB circuit board 5 is used as a connection carrier of the heating sheet 8, and through innovative packaging technology, a heating component structure that takes into account waterproofness, durability and flexibility is achieved.

[0077] The specific implementation steps are as follows:

[0078] First, a rigid PCB circuit board 5 is selected as a connection carrier between the heating sheets 8. The PCB circuit board 5 is pre-equipped with a plurality of pads 4 for connecting the heating sheets 8, the power input line and the temperature controller. Since the rigid PCB has high mechanical strength and can effectively resist external mechanical stress, the circuit stability can be maintained during long-term wearing and washing.

[0079] Next, the electronic harness 5 is firmly soldered to the pad 4 on the PCB circuit board 5 through a high temperature soldering process. The soldering process is performed at a temperature range of 240°C to 300°C to ensure that the solder joint has sufficient mechanical strength to prevent cold solder joints or breakage due to temperature changes or external forces in actual use.

[0080] After welding is completed, the rigid PCB circuit board 5 is sandwiched between the upper hot melt adhesive film 18 and the lower hot melt adhesive film 22. It is worth noting that the surface area of ​​the upper and lower hot melt adhesive films 22 is larger than the surface area of ​​the rigid PCB circuit board 5. This design ensures that in the subsequent heating and melting process, the hot melt adhesive film can completely cover the rigid PCB circuit board 5 and extend outside it to form a flexible area.

[0081] Subsequently, the assembled PCB circuit board 5 and the hot melt adhesive film assembly are placed in a heating device for heating and melting treatment. The hot melt adhesive film melts and adheres to the rigid PCB circuit board 5 during heating to form a packaging structure. In this process, by utilizing the rigidity of the rigid PCB circuit board 5, the packaging structure forms a rigid, non-deformable first waterproof area 12 on its surface. In addition, due to the ductility of the hot melt adhesive film, a flexible, deformable second annular waterproof buffer area 13 is formed on the outside of the rigid PCB circuit board 5.

[0082] The final encapsulated heating component not only ensures the protection and durability of the circuit board in the hard area, but also effectively takes into account the softness and wearing comfort of the heating clothing through the flexible area. Compared with the traditional FPC circuit board, this structural design can significantly improve the waterproof performance of the heating clothing, especially in multiple washings or humid environments, it can still effectively prevent moisture from penetrating into the circuit, thereby ensuring the long-term normal operation of the heating clothing.

[0083] Through the technical solution of this embodiment, the heating clothing not only has significant improvements in durability and waterproofness, but also overcomes the incompatibility problem between the rigid circuit board 3 and the flexible clothing, significantly improving the user's wearing experience.

[0084] Embodiment 2:

[0085] In the design of wearable heating clothing with multiple heating sheets 8, flexible printed circuits (FPCs) are traditionally used for connection because they are soft and can better adapt to the bending characteristics of clothing. However, when the number of heating sheets 8 increases, the limitations of FPC gradually become apparent. Especially in the case where multiple heating sheets 8 of different types need to be connected, FPC is prone to cold solder joints and cracked solder joints during the welding process due to insufficient solder joint strength and low mechanical strength, and even breakage problems during multiple washing and wearing. In addition, due to the poor temperature resistance of FPC itself, its reliability and durability are greatly limited when using different types of heating sheets 8.

[0086] To solve the above problems, this embodiment proposes a design that uses a rigid PCB circuit board 5 as a connection carrier for the heating plate 8, and combines a multi-layer hot-melt adhesive film packaging process to ensure reliable connection of multiple heating plates 8 and enhance the durability and waterproofness of the overall structure.

[0087] The specific application steps are as follows:

[0088] First, a suitable rigid PCB circuit board 5 is selected, on which a plurality of pads 4 are arranged for connecting different types of heating sheets 8. In this embodiment, the types of heating sheets 8 include carbon fiber heating sheets, carbon nanotube film heating sheets 8, and graphene film heating sheets 8. Since the rigid PCB circuit board 5 can withstand higher welding temperatures (240°C to 300°C), the reliability of the solder joints is greatly improved, effectively avoiding the problems of cold solder joints and solder joint cracking that are prone to occur when the flexible circuit board is connected to different types of heating sheets 8.

[0089] Next, the welded rigid PCB circuit board 5 is sandwiched between the upper hot melt adhesive film 18 and the lower hot melt adhesive film 22. In particular, the surface area of ​​the hot melt adhesive film is designed to be larger than the surface area of ​​the rigid PCB circuit board 5, so that during the packaging process, the rigid PCB circuit board 5 can be completely covered by the hot melt adhesive film and a flexible area is formed on the outside. This design not only provides a rigid and waterproof protection area, but also ensures the comfort of the heating garment through the flexible area on the outside.

[0090] Subsequently, the upper and lower hot melt adhesive films 22 are melted and bonded to the rigid PCB circuit board 5 by a heating and melting process. The melted hot melt adhesive film tightly covers the rigid PCB circuit board 5 and the pad 4, not only forming a good waterproof packaging structure in the rigid area, but also forming a flexible and variable waterproof area in the outer area of ​​the PCB board. This design effectively solves the compatibility problem of multiple different types of heating sheets 8 in the same heating clothing, ensuring the reliable connection between the heating sheets 8 and the flexibility of the overall clothing.

[0091] Through the application of this embodiment, not only the stable connection and operation of multiple heating sheets 8 are achieved, but also the service life of the heating garment and the user's wearing experience are greatly improved. Compared with the traditional solution using flexible circuit boards, this embodiment shows significant progress in mechanical strength, welding reliability, waterproofness and flexible compatibility, ensuring the wide applicability of heating garments in different application scenarios.

[0092] In the present invention, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0093] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

Claims

1. A structure using PCB circuit board as a carrier for connecting heating sheets to each other, characterized in that: include: Upper hot melt adhesive film; Lower layer hot melt adhesive film; A rigid circuit board sandwiched between the upper hot melt adhesive film and the lower hot melt adhesive film, the rigid circuit board is provided with a soldering pad for connecting a power input, a temperature controller and at least one heating sheet, and the soldering pad is connected to the corresponding electronic harness by welding; The upper hot melt adhesive film and the lower hot melt adhesive film are bonded to each other by heating and melting to form a packaging structure covering the rigid circuit board and its pads. The packaging structure uses the rigid and non-deformable characteristics of the rigid circuit board to form a rigid and non-deformable first waterproof area. Furthermore, the surface areas of the upper hot-melt adhesive film and the lower hot-melt adhesive film are respectively larger than the surface area of ​​the rigid circuit board, so that the rigid circuit board is located between the upper hot-melt adhesive film and the lower hot-melt adhesive film after the upper hot-melt adhesive film and the lower hot-melt adhesive film are melted and bonded, thereby forming a flexible, deformable second annular waterproof buffer area on the outer side of the hard, non-deformable waterproof area.

2. A structure according to claim 1 that uses a PCB circuit board as a carrier for connecting heating sheets to each other, characterized in that: The rigid circuit board is a rigid PCB circuit board, and the pads of the rigid PCB circuit board are connected to the electronic wiring harness through a high-temperature welding process. The heating sheets that can be connected to the rigid PCB circuit board include but are not limited to carbon fiber heating sheets, carbon nanotube film heating sheets, graphene film heating sheets and printed conductive carbon-based slurry heating sheets.

3. A structure using a PCB circuit board as a carrier for connecting heating sheets to each other according to claim 2, characterized in that: The thickness of the rigid circuit board is greater than 0.8 mm to ensure that the PCB circuit board has sufficient rigidity and durability.

4. The structure of using PCB circuit board as a carrier for connecting heating sheets to each other according to claim 1, characterized in that: The upper hot melt adhesive film and the lower hot melt adhesive film are respectively made of thermoplastic polyurethane materials to ensure that they can be effectively bonded when heated and form a waterproof packaging structure.

5. The structure of using PCB circuit board as a carrier for connecting heating sheets to each other according to claim 1, characterized in that: When the structure using PCB circuit board as a carrier for connecting heating plates to each other is used in heating clothing, the packaging structure enables the rigid circuit board to form a rigid waterproof area inside the heating clothing that can maintain its structural integrity and functional stability during wearing and washing.

6. The structure of using PCB circuit board as a carrier for connecting heating sheets to each other according to claim 1, characterized in that: An upper fabric layer is fixedly arranged on the upper surface of the upper hot-melt adhesive film, and a lower fabric layer is fixedly arranged on the lower surface of the lower hot-melt adhesive film.

7. A method for preparing a structure using a PCB circuit board as a carrier for connecting heating sheets to each other, characterized in that: The following steps are involved: Step 1, providing a rigid PCB circuit board: providing a rigid PCB circuit board, wherein the PCB circuit board is provided with a plurality of pads for connecting a power input, a temperature controller and at least one heating sheet; Step 2, welding the electronic wiring harness: welding the electronic wiring harness to the pad through a high temperature welding process, wherein the electronic wiring harness is used to connect a power source, a temperature controller and a heating plate; Step 3, arranging hot melt adhesive film: sandwiching the rigid PCB circuit board between the upper hot melt adhesive film and the lower hot melt adhesive film, wherein the surface areas of the upper hot melt adhesive film and the lower hot melt adhesive film are respectively larger than the surface area of ​​the rigid PCB circuit board; Step 4, heating and melting: heating the upper hot melt adhesive film and the lower hot melt adhesive film to melt and adhere them to the rigid PCB circuit board to form a packaging structure covering the rigid PCB circuit board and its pads; Step 5, forming a waterproof area: utilizing the rigidity of the rigid PCB circuit board, the packaging structure forms a rigid, non-deformable first waterproof area, and at the same time forms a flexible, deformable second annular waterproof buffer area on the outer side of the rigid area.

8. The method for preparing a structure using a PCB circuit board as a carrier for interconnecting heating sheets according to claim 7, characterized in that: In step 1, the surface of the rigid PCB circuit board is subjected to an anti-oxidation treatment to improve the durability and environmental adaptability of the circuit board.

9. The method for preparing a structure using a PCB circuit board as a carrier for interconnecting heating sheets according to claim 7, characterized in that: In step 2, the temperature range of the high temperature soldering process is 240° C. to 300° C. to ensure the reliability of soldering and the mechanical strength of solder joints.

10. The method for preparing a structure using a PCB circuit board as a carrier for interconnecting heating sheets according to claim 7, characterized in that: In step 3, the arrangement position of the rigid PCB circuit board is pre-treated to make its surface dust-free and oil-free to ensure the best bonding effect between the hot melt adhesive film and the PCB circuit board.

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