Flexible circuit board processing method, device and equipment, computer equipment and flexible circuit board

Abstract

The invention relates to a flexible circuit board processing method, device and equipment, computer equipment and a flexible circuit board. The method comprises the steps that a target circuit machining pattern is obtained, the target circuit machining pattern comprises a target cutting line, and the target cutting line is divided into a plurality of cutting line segments through at least one connecting part; performing laser cutting on the to-be-processed flexible circuit board along each cutting line segment to form a waste material and a target flexible circuit board which are connected with each other through a connecting part; and laser cutting is carried out on each connecting part, so that the waste material is separated from the target flexible circuit board, and the target flexible circuit board is obtained. By adopting the method, the machining precision can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing, and in particular to a flexible circuit board processing method, device, equipment, computer equipment and a flexible circuit board. Background Art

[0002] Flexible circuit board is a circuit board made of flexible substrate, which has the characteristics of being thin, light, bendable and foldable. In the cutting process of flexible circuit board, the flexible circuit board is usually placed on the honeycomb board first, and the flexible circuit board is adsorbed and fixed by negative pressure, and then the circuit board is cut and processed by precision cutting equipment.

[0003] However, with the miniaturization and precision of electronic products, the circuit structure on the flexible circuit board is getting smaller and smaller, and the requirements for cutting accuracy are getting higher and higher. However, the adsorption force of the honeycomb board on the small structure is difficult to be evenly distributed, which will cause the small structure to be unstable or partially deformed, resulting in the circuit board offset or material not being cut through during the cutting process, making the processing accuracy unable to meet the product requirements. Summary of the invention

[0004] Based on this, it is necessary to provide a flexible circuit board processing method, device, equipment, computer equipment and flexible circuit board that can improve processing accuracy in response to the above technical problems.

[0005] In a first aspect, the present application provides a method for processing a flexible circuit board, the method comprising:

[0006] Acquire a target line processing pattern, the target line processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion;

[0007] Laser cutting the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion;

[0008] Laser cutting is performed on each connection portion to separate the waste material from the target flexible circuit board, thereby obtaining the target flexible circuit board.

[0009] In one embodiment, the target circuit processing pattern further includes a material region, and the material region includes at least one of a long strip region and an arc angle region;

[0010] The connecting portion is arranged in the middle of the long strip area and on at least one corresponding target cutting line in the arc angle area.

[0011] In one embodiment, the length of the connecting portion is 200-350 μm.

[0012] In one of the embodiments, the target cutting line includes a plurality of local line segments in a preset direction, where the preset direction is a horizontal direction or a vertical direction; and the plurality of connecting portions are arranged alternately on the plurality of local line segments in the preset direction.

[0013] In one embodiment, before obtaining the target line processing pattern, the method further includes:

[0014] Acquire an initial circuit processing pattern and processing characteristic information of the flexible circuit board to be processed, wherein the initial circuit processing pattern includes an initial cutting line;

[0015] Determine the spacing distance between adjacent connecting parts according to the processing characteristic information;

[0016] According to the spacing distance, multiple connection parts are set on the initial cutting line to obtain the target line processing pattern.

[0017] In one embodiment, before laser cutting the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion, the method further includes:

[0018] The flexible circuit board to be processed is adsorbed on a round hole jig, wherein the round hole jig includes a plurality of adsorption holes, and the aperture of the adsorption holes is less than or equal to 300 μm.

[0019] In one of the embodiments, the target circuit processing pattern further includes a material area;

[0020] The adsorption hole is arranged opposite to the material area, and the aperture of the adsorption hole is smaller than or equal to the minimum width of the material area.

[0021] In one embodiment, laser cutting is performed on the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion, including:

[0022] Detecting the spacing distance between each cutting line segment and adjacent and parallel cutting line segments;

[0023] The cutting line segments are laser cut in the order of the spacing distance from small to large, so as to form waste materials and target flexible circuit boards which are connected to each other through the connecting parts.

[0024] In a second aspect, the present application also provides a flexible circuit board processing device, the device comprising:

[0025] An acquisition module, used for acquiring a target line processing pattern, wherein the target line processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion;

[0026] A first cutting module is used to laser cut the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion;

[0027] The second cutting module is used to perform laser cutting on each connection part to separate the waste material from the target flexible circuit board to obtain the target flexible circuit board.

[0028] In a third aspect, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0029] Acquire a target line processing pattern, the target line processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion;

[0030] Laser cutting the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion;

[0031] Laser cutting is performed on each connection portion to separate the waste material from the target flexible circuit board, thereby obtaining the target flexible circuit board.

[0032] In a fourth aspect, the present application also provides a laser processing device, which uses the above flexible circuit board processing method to laser process a flexible circuit board.

[0033] In a fifth aspect, the present application also provides a flexible circuit board, which is processed by the above flexible circuit board processing method.

[0034] In a sixth aspect, the present application further provides a laser processing system, comprising a controller and the above-mentioned laser processing device, wherein the controller is used to:

[0035] Acquire a target line processing pattern, the target line processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion;

[0036] Controlling the laser processing equipment to laser cut the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion;

[0037] The laser processing equipment is controlled to perform laser cutting on each connection part so as to separate the waste material from the target flexible circuit board and obtain the target flexible circuit board.

[0038] In a seventh aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the following steps are implemented:

[0039] Acquire a target line processing pattern, the target line processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion;

[0040] Laser cutting the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion;

[0041] Laser cutting is performed on each connection portion to separate the waste material from the target flexible circuit board, thereby obtaining the target flexible circuit board.

[0042] In an eighth aspect, the present application further provides a computer program product, including a computer program, which implements the following steps when executed by a processor:

[0043] Acquire a target line processing pattern, the target line processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion;

[0044] Laser cutting the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion;

[0045] Laser cutting is performed on each connection portion to separate the waste material from the target flexible circuit board, thereby obtaining the target flexible circuit board.

[0046] The above-mentioned flexible circuit board processing method, device, equipment, computer equipment and flexible circuit board first obtain the target circuit processing pattern, the target circuit processing pattern includes a target cutting line, the target cutting line is divided into multiple cutting line segments by at least one connecting part, and then the flexible circuit board to be processed is laser cut along each cutting line segment to form waste material and target flexible circuit board connected to each other by the connecting part, and then each connecting part is laser cut to separate the waste material from the target flexible circuit board to obtain the target flexible circuit board. In this way, in the process of cutting along the cutting line segment, the connecting part can provide auxiliary support for the fine structure formed by cutting to enhance the local support force, so that the fine structure formed in the process of cutting the flexible circuit board can be more stably adsorbed and not easily offset, thereby reducing the influence of the fine structure formed previously on the subsequent processing process, reducing the cutting error, and reducing the situation of not cutting through, thereby effectively improving the processing accuracy, after the fine structure is substantially formed, the connecting part is disconnected, and the waste material and the target flexible circuit board can be separated, thereby obtaining a high-precision target flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0048] Figure 1 A schematic diagram of a process of manufacturing a flexible circuit board according to an embodiment of the present invention;

[0049] Figure 2 A schematic diagram of a target circuit processing pattern in one embodiment;

[0050] Figure 3 A schematic diagram of a target circuit processing pattern in another embodiment;

[0051] Figure 4 is a structural block diagram of a flexible circuit board processing device in one embodiment;

[0052] Figure 5 A schematic diagram of the structure of a laser processing device in one embodiment;

[0053] Figure 6 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0055] Flexible circuit boards are circuit boards made of flexible substrates, which are thin, bendable, and foldable. As electronic products develop towards miniaturization, lightness, and high performance, flexible circuit boards are increasingly used in smart phones, wearable devices, and other fields. In recent years, the technology of flexible circuit boards has continued to advance, the circuit accuracy has become higher, and the circuit structure has become more complex, making the processing requirements of flexible circuit boards more stringent.

[0056] In the cutting process of flexible circuit boards, the use of jigs for fixing can provide stronger fixing force to prevent the workpiece from shifting or vibrating during the cutting process. However, for flexible circuit boards with complex structures or precision components on the surface, jigs cannot be used for fixing. In this case, honeycomb panels are usually used for adsorption fixation.

[0057] Honeycomb board is a device that fixes the workpiece by vacuum adsorption. Its surface is covered with uniform small holes, which can provide uniform adsorption force to ensure that the circuit board remains stable during the cutting process. However, with the miniaturization and precision development of electronic products, the circuit structure on the flexible circuit board is getting smaller and smaller, and the width of the circuit structure and the distance between the circuits have been reduced to 100-200μm. The requirements for cutting accuracy of flexible circuit boards are also getting higher and higher. The thin, flexible, bendable and foldable characteristics of flexible circuit boards will cause the flexible circuit boards to shift during the cutting process. As they are deformed by external forces, even if the deformed part of the material has been processed, it may cause the unfinished part to move and deform, resulting in the subsequent actual cutting trajectory deviating from the preset trajectory, or some areas cannot be cut through. And the smaller the structure, the more significant the degree of its offset and deformation.

[0058] In addition, the pore size of the honeycomb panel is usually above 350μm, and its adsorption force on the fine structure with a width of 100-200μm is difficult to be evenly distributed, which will also lead to unstable adsorption of the fine structure, thereby aggravating the offset and deformation of the flexible circuit board and the fine structure thereon during the cutting process, causing the cutting to deviate from the preset trajectory or the material to not be cut through, etc., making the processing accuracy unable to meet product requirements.

[0059] In an exemplary embodiment, Figure 1 As shown, a flexible circuit board processing method is provided, and the flexible circuit board processing method is applied to laser processing equipment. This embodiment takes the execution subject of the method as an example of a terminal, wherein the terminal can be a laser processing device, or other terminals that can control the laser processing device, such as various personal computers, laptops, smart phones, tablet computers, Internet of Things devices, and portable wearable devices. The laser processing equipment can be a device that can use a high-energy-density laser beam to cut and process the flexible circuit board. The Internet of Things device can be a smart speaker, a smart TV, a smart air conditioner, a smart car device, a projection device, etc. The portable wearable device can be a smart watch, a smart bracelet, a head-mounted device, etc. The head-mounted device can be a virtual reality (VR) device, an augmented reality (AR) device, smart glasses, etc. It can be understood that the execution subject of the method can also be a server, or a system including a terminal and a server, and is implemented through the interaction between the terminal and the server.

[0060] In this embodiment, the method includes the following steps S10-S30. Among them:

[0061] Step S10, obtaining a target line processing pattern, wherein the target line processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion.

[0062] Among them, flexible circuit boards can refer to circuit boards made of flexible substrates, which have the characteristics of being light, thin, bendable, and foldable.

[0063] The target circuit processing pattern may refer to a technical document used to guide the flexible circuit board cutting process, and may indicate information such as the cutting path, waste area, circuit board area, and related processing parameters through graphics, symbols, and annotations, etc., to ensure the accuracy and efficiency of the cutting process. The flexible circuit board cutting process will produce waste, and the waste may refer to the material cut off from the flexible circuit board. After the waste is cut off, the target flexible circuit board forming the circuit structure can be obtained. The waste area may refer to the area corresponding to the waste in the target circuit processing pattern, and the circuit board area may refer to the area corresponding to the target flexible circuit board in the target circuit processing pattern. The target circuit processing pattern may be designed and drawn in advance according to the actual needs of the product and the processing needs, etc., and this embodiment does not limit this.

[0064] The target circuit processing pattern at least includes a target cutting line. The target cutting line may refer to a line clearly marked in the target circuit processing pattern, indicating that the cutting tool needs to cut along its path, and is used to separate the circuit board area and the waste area.

[0065] In some feasible implementations, the target cutting line may be the outline of the waste area. According to the actual situation of the waste, the target cutting line may be in a regular or irregular ring shape, the waste area is located inside the target cutting line, and the circuit board area is located outside the target cutting line. It is understandable that, as circuits become increasingly complex, the target circuit processing pattern may include multiple target cutting lines, each target cutting line surrounds a waste area, and the area not surrounded by any target cutting line is connected to form a circuit board area.

[0066] As an example, Figure 2 As shown, Figure 2 is a schematic diagram of a target circuit processing pattern in an embodiment, Figure 2 The dotted line in represents the target cutting line 202, Figure 2 The target circuit processing pattern shown includes 8 target cutting lines 202, each of which encloses a waste area 204, and the area outside the target cutting lines 202 connected to each other is the circuit board area 206. After cutting along the target cutting lines 202, the waste corresponding to the waste area 204 can fall off from the flexible circuit board, and after removing the waste, the target flexible circuit board can be obtained.

[0067] At least one connection portion may be provided on each target cutting line, and each connection portion may divide the target cutting line into two segments. By providing one or more connection portions, the target cutting line may be divided into multiple segments, each of which is a cutting segment. Figure 3 , Figure 3 The dotted line in represents the cutting line segment 302, and the short solid line connecting the cutting line segments 302 represents the connecting portion 304. The cutting line segment 302 and the connecting portion 304 are connected end to end to form a target cutting line.

[0068] Both the cutting line segment and the connecting part belong to the target cutting line and need to be cut. The difference between the two is reflected in the order and length of cutting. The length of the cutting line segment is much longer than the connecting part, which is prone to errors due to material offset, deformation, etc. during the cutting process. Therefore, the cutting is first performed along the cutting line segment, and the waste material and the target flexible circuit board are connected through the uncut connecting part after the cutting line segment is cut, providing support for the waste material and the target flexible circuit board, and limiting the deformation of the flexible circuit board under the action of external force during the subsequent cutting process. The length of the connecting part is shorter, so the connecting part is disconnected after all the cutting line segments are cut, and the operation of disconnecting the connecting part has little effect on the overall processing accuracy.

[0069] Step S20 , laser cutting the flexible circuit board to be processed along each cutting line segment to form waste material and a target flexible circuit board connected to each other through a connecting portion.

[0070] The flexible circuit board to be processed may refer to a flexible circuit board that needs to be cut.

[0071] Exemplarily, before the flexible circuit board is cut, the flexible circuit board to be processed can be picked up manually, by a robot or by a mechanical arm, and the flexible circuit board to be processed can be fixed. After the flexible circuit board to be processed is fixed, the laser processing equipment can be controlled to process the flexible circuit board to be processed according to the target circuit processing pattern, that is, the laser processing equipment is controlled to emit laser to the flexible circuit board to be processed, and the laser is controlled to cut the flexible circuit board to be processed along the cutting line segment to obtain the waste material and the target flexible circuit board connected to each other through the connecting part.

[0072] Step S30 , laser cutting each connection portion to separate the waste material from the target flexible circuit board to obtain the target flexible circuit board.

[0073] Exemplarily, after all cutting line segments are cut, the laser is controlled to perform laser cutting on each connection part. After the connection part is cut off, the waste material connected by the connection part is separated from the target flexible circuit board. The separated waste material is removed to obtain the target flexible circuit board.

[0074] In the above-mentioned flexible circuit board processing method, firstly, a target circuit processing pattern is obtained, the target circuit processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion, and then the flexible circuit board to be processed is laser cut along each cutting line segment to form waste material and a target flexible circuit board connected to each other by the connecting portion, and then each connecting portion is laser cut to separate the waste material from the target flexible circuit board to obtain the target flexible circuit board. In this way, in the process of cutting along the cutting line segment, the connecting portion can provide auxiliary support for the fine structure formed by cutting to enhance the local support force, so that the fine structure formed in the process of cutting the flexible circuit board can be more stably adsorbed and not easily offset, thereby reducing the influence of the fine structure formed previously on the subsequent processing process, reducing the cutting error, and reducing the situation of not cutting through, thereby effectively improving the processing accuracy, and after the fine structure is substantially formed, the connecting portion is disconnected to achieve the separation of the waste material and the target flexible circuit board, thereby obtaining a high-precision target flexible circuit board.

[0075] In an exemplary embodiment, the target line processing pattern further includes a material region, and the material region includes at least one of a long strip region and an arc angle region;

[0076] The connecting portion is arranged in the middle of the long strip area and on at least one corresponding target cutting line in the arc angle area.

[0077] The material area may refer to a portion of the target circuit processing pattern that will not be eliminated by the laser.

[0078] The long strip area may refer to a portion of the material area whose aspect ratio exceeds a preset aspect ratio threshold. Since the length of the long strip structure is much greater than its width or thickness, after its contour is cut off, the support force is significantly reduced, and it is easy to become a stress concentration area, which makes it more prone to deformation, especially in the middle position.

[0079] The arc angle area can refer to the area in the material area where the contour line is an arc line. Since the curvature of the arc angle area changes greatly, after its contour line is cut off, the supporting force is significantly reduced, and stress concentration is likely to occur when it is subjected to force, making it more likely to deform.

[0080] In this embodiment, by setting a connecting part in the middle of the long strip area and the arc angle area, auxiliary support can be provided for the long strip area and the arc angle area, thereby enhancing local rigidity, reducing deformation and vibration, and thus improving processing stability and accuracy.

[0081] In an exemplary embodiment, the length of the connecting portion is 200-350 μm, for example, 200 μm, 250 μm, 300 μm, 350 μm, etc.

[0082] If the length of the connection is too short, the support force it can provide is insufficient. If the length of the connection is too long, it may still cause a large cutting error when the connection is subsequently cut off, resulting in the accuracy of the target flexible circuit board failing to meet actual needs. The length of the connection is 200-350μm, which can provide a large support force to avoid deformation and offset during the cutting process of the flexible circuit board, and can effectively reduce the cutting error of the connection and improve processing accuracy.

[0083] In an exemplary embodiment, the target cutting line includes a plurality of local line segments in a preset direction, where the preset direction is a horizontal direction or a vertical direction; and the plurality of connecting portions are arranged alternately on the plurality of local line segments in the preset direction.

[0084] Among them, the local line segment can refer to a line segment extending in the same direction on the target cutting line, and the preset direction can refer to a direction perpendicular to the extension direction of the local line segment. For example, if the local line segment extends in the horizontal direction, the preset direction can be the vertical direction; if the local line segment extends in the vertical direction, the preset direction can be the horizontal direction.

[0085] like Figure 3 As shown, multiple connecting parts are arranged alternately on multiple local line segments in a preset direction, which may refer to connecting parts on two adjacent local line segments in the preset direction, which are located at different positions in the extension direction. Since the cutting of flexible circuit boards is usually to form circuits, the cutting forms mostly slender structures, and deformation and offset are usually caused by insufficient support force in the extension direction. Therefore, arranging connecting parts along the extension direction can significantly increase the support force, effectively avoid deformation and offset, and improve processing accuracy. Slender structures are prone to bending and deformation, especially in the middle part. By staggering the support points, the bending moment can be dispersed more effectively and the overall elastic modulus and stability can be improved. Secondly, if the connections on multiple local line segments are arranged symmetrically, the supporting forces are concentrated in the same position. To achieve the same anti-bending effect, more connections are required. The staggered arrangement can effectively reduce the number of connections and improve processing efficiency. Thirdly, to ensure that the connection can be completely cut through, the connection and its surroundings will inevitably be repeatedly subjected to laser heat. The staggered arrangement of the connections can increase the distance between the connections, thereby reducing the heat concentration of the light spot, avoiding damage to the flexible circuit board caused by the heat concentration of the light spot, and improving the processing quality.

[0086] In an exemplary embodiment, before obtaining the target line processing pattern, the method further includes:

[0087] Acquire an initial circuit processing pattern and processing characteristic information of the flexible circuit board to be processed, wherein the initial circuit processing pattern includes an initial cutting line;

[0088] Determine the spacing distance between adjacent connecting parts according to the processing characteristic information;

[0089] According to the spacing distance, multiple connection parts are set on the initial cutting line to obtain the target line processing pattern.

[0090] Among them, the processing characteristic information may refer to the physical and chemical property data of the flexible circuit board to be processed, which may include at least one of elastic modulus, strength, stiffness, absorption rate of laser energy, etc. These data have a certain influence on the effect of laser processing and the final performance of the target flexible circuit board.

[0091] The initial cutting line may refer to a cutting line that has not been segmented according to the connection part. In some feasible embodiments, the initial cutting line may be a contour line of the waste area. The initial line processing pattern may refer to a line processing pattern with an initial cutting line drawn but no connection part set.

[0092] Multiple connection parts can be set on each initial cutting line, and the spacing distance between adjacent connection parts can refer to the distance between two adjacent connection parts set on the same initial cutting line, extending the initial cutting line. In some feasible implementations, the spacing distance can be a spacing distance range, and when setting the connection parts, it is only necessary to ensure that the actual spacing distance is within the spacing distance range, which can improve the flexibility of setting the connection parts.

[0093] Exemplarily, before cutting, an initial circuit processing pattern may be designed and drawn based on actual product requirements and processing requirements, and then the material of the flexible circuit board to be processed may be determined, thereby querying and determining the processing characteristic information of the material; further, the spacing distance between adjacent connection parts may be calculated based on a preset spacing distance algorithm and processing characteristic information, wherein the preset spacing distance algorithm may be determined in advance based on big data or test results, and this embodiment does not impose any restrictions on this; then, based on the calculated spacing distance, a plurality of connection parts may be set on the initial circuit processing pattern to obtain a target circuit processing pattern.

[0094] In some feasible implementations, the processing characteristic information may include elastic modulus. The spacing distance between adjacent connection parts may be positively correlated with the elastic modulus of the flexible circuit board to be processed, that is, the larger the elastic modulus of the material, the longer the spacing distance may be, and the smaller the elastic modulus of the material, the shorter the spacing distance may need to be set to effectively avoid deformation or displacement of the flexible circuit board to be processed during the cutting process.

[0095] In this embodiment, by adaptively adjusting the spacing distance between adjacent connection parts according to the processing characteristic information of the flexible circuit board to be processed, the application scope of the processing method can be effectively expanded, and high-precision laser cutting processing of flexible circuit boards to be processed of different materials can be achieved.

[0096] In an exemplary embodiment, before laser cutting the to-be-processed flexible circuit board along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion, the method further includes:

[0097] The flexible circuit board to be processed is adsorbed on a round hole jig, wherein the round hole jig includes a plurality of adsorption holes, and the aperture of the adsorption holes is less than or equal to 300 μm.

[0098] It should be noted that the pore size of the honeycomb panel is usually above 350μm, and its adsorption force on the fine structure with a width of 100-200μm is difficult to be evenly distributed, which will also lead to unstable adsorption of the fine structure, thereby aggravating the offset and deformation of the flexible circuit board and the fine structure thereon during the cutting process, causing the cutting to deviate from the preset trajectory or the material to not be cut through, etc., making the processing accuracy unable to meet product requirements.

[0099] Among them, the round hole jig can refer to a template or frame with multiple round adsorption holes. The design of these adsorption holes can match the specific marks or features on the flexible circuit board. When in use, the flexible circuit board can be placed on the round hole jig and aligned through the adsorption holes. It can also be combined with vacuum adsorption and other technologies to further stabilize the position of the circuit board. In this way, during laser cutting operations, errors caused by the movement of the circuit board can be effectively avoided, thereby improving production efficiency and product quality.

[0100] The adsorption hole is a circular through hole on the circular hole jig. During the cutting process, the circular hole jig can be connected to the vacuum system. After the vacuum system is started, negative pressure can be generated through the adsorption hole, so that the flexible circuit board attached to the adsorption hole is tightly adsorbed on the surface of the circular hole jig. The larger the aperture of the adsorption hole, the more areas that cannot be completely covered by the adsorption hole. These areas hanging on the adsorption hole are easily deformed by suction under high vacuum because they are flexible and lack support.

[0101] When the diameter of the adsorption hole is less than or equal to 300μm, the periphery of the adsorption hole can provide a higher support force for the flexible circuit board, effectively reducing the deformation of the flexible circuit board due to adsorption. When the flexible circuit board requires a greater support force, the diameter of the adsorption hole can be reduced, and the diameter of the adsorption hole can be set to 250μm, 200μm, 150μm, 100μm, 50μm, etc.

[0102] In some feasible embodiments, the pore size of the adsorption pore is 150-300 μm, for example, 150 μm, 200 μm, 250 μm, 300 μm, etc.

[0103] The smaller the adsorption hole diameter, the greater the support force for the flexible circuit board, and the less likely the flexible circuit board is to deform and deflect during the cutting process. However, if the adsorption hole diameter is too small, it may lead to insufficient adsorption force, which will lead to reduced adsorption stability. The adsorption hole diameter is within the range of 150-300μm, which can not only ensure a greater support force for the flexible circuit board, avoid deformation and deflection during the cutting process of the flexible circuit board, but also ensure sufficient adsorption force and improve adsorption stability, thereby reducing cutting errors and reducing the situation of incomplete cutting, effectively improving processing accuracy.

[0104] In some feasible implementations, each waste area and each circuit board area corresponds to at least one adsorption hole, so that it can be ensured that during the cutting process, both the waste area and the circuit board area can be adsorbed and will not fall off the jig, thereby avoiding interference of the waste falling off with the subsequent cutting process.

[0105] For example, before cutting the flexible circuit board, the flexible circuit board to be processed can be picked up manually, by a robot or a mechanical arm, and placed on a round hole jig. The vacuum system connected to the round hole jig is turned on to generate negative pressure through the adsorption holes, thereby adsorbing the flexible circuit board to be processed on the round hole jig.

[0106] In this embodiment, compared with the method of adsorption through large-diameter holes on the honeycomb plate, by reducing the aperture of the adsorption hole on the round hole jig, the uniformity of the distribution of the adsorption force can be effectively improved, the local support force can be enhanced, and the vibration and deformation caused by the interaction between the tool and the workpiece during the cutting process can be reduced. In this way, the fine structure formed during the cutting process of the flexible circuit board can be adsorbed more stably and is not easy to deviate, thereby reducing the influence of the fine structure formed previously on the subsequent processing process, reducing the cutting error, and reducing the situation of not cutting through, thereby effectively improving the processing accuracy of the flexible circuit board. The method of adsorption through large-diameter holes on the honeycomb plate actually measured an error of 50-60um after deformation, and the sample accuracy could not meet the product requirements. After reducing the aperture of the adsorption hole and setting the connection part, the cutting straightness of the finished product was tested, and the error could be effectively controlled within the range of 10um.

[0107] In an exemplary embodiment, the target line processing pattern further includes a material region;

[0108] The adsorption hole is arranged opposite to the material area, and the aperture of the adsorption hole is smaller than or equal to the minimum width of the material area.

[0109] The material area may refer to the portion of the target circuit processing pattern that will not be eliminated by the laser. The material area may include a waste area and a circuit board area. The waste area may refer to the area corresponding to the waste in the target circuit processing pattern. The circuit board area may refer to the area corresponding to the target flexible circuit board in the target circuit processing pattern.

[0110] In some feasible embodiments, the target cutting line can be the outline of the waste area. Depending on the actual situation of the waste, the target cutting line can be in a regular or irregular ring shape. The area inside the target cutting line is the waste area. After the cutting is completed along the target cutting line, the material corresponding to the waste area, that is, the waste, can be removed from the flexible circuit board to be processed. The area outside the target cutting line is the circuit board area. It can be understood that due to the increasing complexity of the circuit, the target circuit processing pattern may include multiple target cutting lines, each target cutting line surrounds a waste area, and the area not surrounded by any target cutting line is connected to form a circuit board area. After removing all the waste, the material corresponding to the remaining circuit board area is the target circuit board.

[0111] Whether it is a waste area or a circuit board area, when its contour is partially cut off but not completely cut off, it is more likely to deform under the action of external force, thereby affecting the subsequent processing accuracy of itself and other material areas connected to it.

[0112] If the adsorption hole diameter is small and the adsorption hole can be completely covered by each waste area and circuit board area, the periphery of the adsorption hole can provide a higher support force for the flexible circuit board, thereby effectively reducing the displacement or deformation of the flexible circuit board due to adsorption. Therefore, when designing a circular hole fixture, the minimum width of the material area in the target circuit processing pattern can be detected first, and then the diameter of the adsorption hole of the circular hole fixture can be made less than or equal to the minimum width of the material area, and the adsorption hole is set relative to the material area, so as to ensure that the adsorption hole can be completely covered by each waste area and circuit board area.

[0113] In this embodiment, by making the hole diameter of the adsorption hole less than or equal to the minimum width of the material area, and the adsorption hole is arranged relative to the material area, it can be ensured that the adsorption hole can be completely covered by each waste area and circuit board area, so that the periphery of the adsorption hole can provide a higher supporting force for the flexible circuit board, thereby effectively reducing the displacement or deformation of the flexible circuit board due to adsorption, reducing cutting errors, and reducing the situation of incomplete cutting, thereby effectively improving the processing accuracy.

[0114] In some feasible implementations, laser cutting is performed on the flexible circuit board to be processed along each cutting line segment to form waste material and a target flexible circuit board interconnected by a connecting portion, including steps S21 to S22, wherein:

[0115] Step S21, detecting the spacing distance between each cutting line segment and adjacent and parallel cutting line segments;

[0116] Step S22 , laser cutting each cutting line segment in the order of the spacing distance from small to large, to form waste material and a target flexible circuit board interconnected by a connecting portion.

[0117] It should be noted that during the laser cutting process along the cutting line segment, as more and more cutting line segments are cut off, the support force on the material area becomes lower and the force becomes more unbalanced, making it more likely to deform. On the other hand, under the same support force and the same external force, the smaller the structure, the more likely it is to deform.

[0118] Exemplarily, before performing the cutting process of the flexible circuit board, the spacing distance corresponding to each cutting line segment can be detected first, wherein the spacing distance corresponding to each cutting line segment refers to the spacing distance between each cutting line segment and its adjacent and parallel cutting line segments; then the spacing distances are arranged in order from small to large as the processing order of the cutting line segments. When performing the cutting process of the flexible circuit board, after fixing the flexible circuit board to be processed, the laser processing equipment can be controlled to emit laser to the flexible circuit board to be processed, and the laser can be controlled to cut the flexible circuit board to be processed along the corresponding cutting line segment according to the processing order based on the spacing distance confirmation in advance, so as to obtain waste and target flexible circuit boards interconnected by connecting parts.

[0119] It can be understood that if there are multiple cutting line segments that are adjacent and parallel to the cutting line segment, the initial spacing distance between each adjacent and parallel cutting line segment can be determined first, and then the minimum value of the initial spacing distances or the sum of the initial spacing distances can be determined as the spacing distance used for sorting. For example, the spacing distance between the cutting line segment L1 and the cutting line segment adjacent and parallel to the left side is 1, and the spacing distance between the cutting line segment adjacent and parallel to the left side is 2; the spacing distance between the cutting line segment L2 and the cutting line segment adjacent and parallel to the upper side is 2, and the spacing distance between the cutting line segment adjacent and parallel to the lower side is 5; since the minimum value of the initial spacing distance corresponding to L1 is 1, and the minimum value of the initial spacing distance corresponding to L2 is 2, it can be determined that the processing order of L1 is prior to L2; or, since the sum of the initial spacing distances corresponding to L1 is 3, and the sum of the initial spacing distances corresponding to L2 is 7, it can be determined that the processing order of L1 is prior to L2.

[0120] In this embodiment, by optimizing the cutting sequence, the processing accuracy can be effectively improved. Specifically, in the initial stage of processing when the support force is high and the overall stability is good, the area with a smaller spacing distance is processed first, which can effectively improve the processing accuracy of the fine structure. In the later stage of processing, when the support force and stability decrease, the area with a larger spacing distance is processed. Since the large block structure itself has a strong ability to resist deformation, it can still maintain a high processing accuracy even if the support conditions are weakened.

[0121] It should be understood that, although the steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indications of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps is not strictly limited in order, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0122] Based on the same inventive concept, the embodiment of the present application also provides a laser processing device for implementing the flexible circuit board processing method involved above. The implementation scheme for solving the problem provided by the device is similar to the implementation scheme recorded in the above method, so the specific limitations in one or more laser processing device embodiments provided below can refer to the limitations of the flexible circuit board processing method above, and will not be repeated here.

[0123] In an exemplary embodiment, Figure 4 As shown, a flexible circuit board processing device is provided, comprising:

[0124] An acquisition module 402 is used to acquire a target line processing pattern, where the target line processing pattern includes a target cutting line, where the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion;

[0125] The first cutting module 404 is used to laser cut the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion;

[0126] The second cutting module 406 is used to perform laser cutting on each connection portion to separate the waste material from the target flexible circuit board to obtain the target flexible circuit board.

[0127] In an exemplary embodiment, the flexible circuit board processing device further includes a setting module. Before acquiring the target circuit processing pattern, the setting module is used to:

[0128] Acquire an initial circuit processing pattern and processing characteristic information of the flexible circuit board to be processed, wherein the initial circuit processing pattern includes an initial cutting line;

[0129] Determine the spacing distance between adjacent connecting parts according to the processing characteristic information;

[0130] According to the spacing distance, multiple connection parts are set on the initial cutting line to obtain the target line processing pattern.

[0131] In an exemplary embodiment, the flexible circuit board processing device further includes an adsorption module, and before laser cutting the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board interconnected by a connecting portion, the adsorption module is used to:

[0132] The flexible circuit board to be processed is adsorbed on a round hole jig, wherein the round hole jig includes a plurality of adsorption holes, and the aperture of the adsorption holes is less than or equal to 300 μm.

[0133] In an exemplary embodiment, the first cutting module 404 is further configured to:

[0134] Detecting the spacing distance between each cutting line segment and adjacent and parallel cutting line segments;

[0135] The cutting line segments are laser cut in the order of the spacing distance from small to large, so as to form waste materials and target flexible circuit boards which are connected to each other through the connecting parts.

[0136] In an exemplary embodiment, Figure 5 As shown, a laser processing device is provided, including a round hole fixture 502, a laser 504 and a displacement device 506, wherein the round hole fixture 502 includes a plurality of adsorption holes, and the aperture of the adsorption holes is less than or equal to 300 μm, wherein:

[0137] The round hole fixture 502 is configured to absorb the flexible circuit board 508 to be processed;

[0138] The laser 504 is configured to emit laser light, and the laser light is used to cut the flexible circuit board 508 to be processed;

[0139] The displacement device 506 is configured to control the laser to perform laser cutting on the flexible circuit board to be processed along each cutting line segment to form waste material and target flexible circuit board interconnected by connecting parts; laser cutting is performed on each connecting part to separate the waste material from the target flexible circuit board to obtain the target flexible circuit board.

[0140] In an exemplary embodiment, a laser processing system is provided, comprising a controller and the above-mentioned laser processing device, wherein the controller is used to:

[0141] Acquire a target line processing pattern, the target line processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion;

[0142] Laser cutting the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion;

[0143] Laser cutting is performed on each connection portion to separate the waste material from the target flexible circuit board, thereby obtaining the target flexible circuit board.

[0144] In an exemplary embodiment, the controller can also implement the steps in the above method embodiments.

[0145] In an exemplary embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as shown in FIG. Figure 6 As shown. The computer device includes a processor, a memory, an input / output interface, a communication interface, a display unit and an input device. The processor, the memory and the input / output interface are connected through a system bus, and the communication interface, the display unit and the input device are connected to the system bus through the input / output interface. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the computer device is used to exchange information between the processor and the external device. The communication interface of the computer device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be realized through WIFI, a mobile cellular network, near field communication (NFC) or other technologies. When the computer program is executed by the processor, a flexible circuit board processing method is realized. The display unit of the computer device is used to form a visually visible picture, which can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad set on the computer device shell, or an external keyboard, touchpad or mouse.

[0146] Those skilled in the art will understand that Figure 6 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0147] In one embodiment, a computer device is further provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above method embodiments when executing the computer program.

[0148] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0149] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0150] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0151] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

[0152] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0153] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for processing a flexible circuit board, characterized in that: The method comprises: Acquire a target line processing pattern, wherein the target line processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion; Laser cutting the flexible circuit board to be processed along each of the cutting line segments to form a waste material and a target flexible circuit board connected to each other through a connecting portion; Laser cutting is performed on each of the connection portions to separate the waste material from the target flexible circuit board, thereby obtaining the target flexible circuit board.

2. The method according to claim 1, characterized in that: The target circuit processing pattern further includes a material region, and the material region includes at least one of a long strip region and an arc angle region; The connecting portion is disposed in the middle of the long strip region and on at least one corresponding target cutting line in the arc angle region.

3. The method according to claim 1, characterized in that The length of the connecting portion is 200-350 μm.

4. The method according to claim 1, characterized in that: The target cutting line includes a plurality of local line segments in a preset direction, where the preset direction is a horizontal direction or a vertical direction; and the plurality of connecting parts are arranged in a staggered manner on the plurality of local line segments in the preset direction.

5. The method according to claim 1, characterized in that Before obtaining the target line processing pattern, it also includes: Acquire an initial circuit processing pattern and processing characteristic information of the flexible circuit board to be processed, wherein the initial circuit processing pattern includes an initial cutting line; Determining the spacing distance between adjacent connecting parts according to the processing characteristic information; According to the spacing distance, a plurality of connection parts are arranged on the initial cutting line to obtain a target line processing pattern.

6. The method according to claim 1, characterized in that Before laser cutting the flexible circuit board to be processed along each cutting line segment to form a waste material and a target flexible circuit board connected to each other through a connecting portion, the method further includes: The flexible circuit board to be processed is adsorbed onto a round hole jig, wherein the round hole jig comprises a plurality of adsorption holes, and the aperture of the adsorption holes is less than or equal to 300 μm.

7. The method according to claim 6, characterized in that The target line processing pattern also includes a material area; The adsorption hole is arranged opposite to the material area, and the diameter of the adsorption hole is smaller than or equal to the minimum width of the material area.

8. The method according to any one of claims 1 to 7, characterized in that The method of laser cutting the flexible circuit board to be processed along each of the cutting line segments to form a waste material and a target flexible circuit board connected to each other through a connecting portion comprises: Detecting the spacing distance between each cutting line segment and adjacent and parallel cutting line segments; The cutting line segments are laser cut in the order of the spacing distance from small to large to form waste materials and target flexible circuit boards that are interconnected through the connecting parts.

9. A flexible circuit board processing device, characterized in that: The device comprises: An acquisition module, used for acquiring a target line processing pattern, wherein the target line processing pattern includes a target cutting line, and the target cutting line is divided into a plurality of cutting line segments by at least one connecting portion; A first cutting module, used for laser cutting the flexible circuit board to be processed along each of the cutting line segments to form a waste material and a target flexible circuit board connected to each other through a connecting portion; The second cutting module is used to perform laser cutting on each of the connecting parts to separate the waste material from the target flexible circuit board to obtain the target flexible circuit board.

10. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 8 are implemented.

11. A laser processing device, characterized in that: The laser processing equipment uses the method according to any one of claims 1 to 8 to perform laser processing on a flexible circuit board.

12. A flexible circuit board, characterized in that: The flexible circuit board is obtained by processing using the method according to any one of claims 1 to 8.

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