Manufacturing method of flexible circuit board and laminated inductance circuit board

Abstract

The invention discloses a manufacturing method of a flexible circuit board and a laminated inductance circuit board, and the method comprises the steps: firstly, taking a flexible copper-clad plate, and manufacturing a circuit pattern which is composed of a first joint end, a head end connection section, a circuit distribution section, a tail end connection section and a second joint end in sequence; the circuit distribution section is formed by a plurality of upper coil sections, a plurality of bent sections and a plurality of lower coil sections which are cyclically alternated in sequence; the upper coil section and the lower coil section are open coil sections, and openings are connected with the bent sections respectively; a cover film is pasted on the flexible core board, and the flexible circuit board is formed through post-process processing; and then the flexible circuit boards are laminated to form the laminated inductance circuit board. Effective cooperation is formed before and after the whole machining process, a processized and batched machining process is formed from design to machining, the machining efficiency and reliability of the inductance circuit board are improved, the service life of a product is prolonged, scrapped materials can be selected for recycling in the machining process, and the machining cost is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the field of flexible circuit board manufacturing and the field of inductor circuit board manufacturing, and in particular to a method for manufacturing a flexible circuit board and a laminated inductor circuit board. Background Art

[0002] In modern application fields such as smart connected cars and low-altitude aircraft, electronic modules need to have inductive characteristics to meet specific functional requirements. The current production methods for this characteristic include: one is to solder independent inductive components on the surface of the circuit board; the other is to directly design the inductive coil as a multi-layer structure and integrate it inside the circuit board, that is, first design a multi-layer circuit board, and then use through holes or stacked blind holes to connect the inductive coil lines of each layer.

[0003] The above-mentioned production method has the following defects: (1) As an additional production step, welding the inductor components separately will increase the manufacturing cost and reduce the overall reliability of the equipment. More importantly, welding the inductor components separately will occupy a large space, which is not conducive to promoting the miniaturization of electronic equipment. In addition, as time goes by and the materials age, the separately welded inductor components may decay, affecting the service life and performance of the equipment.

[0004] (2) A multi-layer structure is used to make a flat inductor circuit board. On the one hand, the production of multi-layer circuit boards is not only complicated and time-consuming, but also uses more materials, resulting in increased costs. On the other hand, when connecting inductor coils between different layers, through-hole or stacked blind hole technology is usually required. Strictly speaking, the coil circuit formed by the connection is not a single circuit, which will lead to the existence of cross-layer connection points. During the application process, there may be connection points that cause inductor interference problems and reduce inductor accuracy. If you hope to solve these problems by improving the processing accuracy of the circuit board, it will further increase the manufacturing difficulty and process.

[0005] Therefore, in order to solve the above-mentioned problems, it is necessary to provide a method for manufacturing a flexible circuit board and a laminated inductor circuit board. Summary of the invention

[0006] The present invention aims to solve the comprehensive problems of the prior art such as the complicated processing and low inductance precision of the laminated inductor circuit board. Firstly, a method for manufacturing a flexible circuit board and a laminated inductor circuit board is proposed. The manufacturing method comprises the following steps: S10: Take a flexible copper-clad laminate, make a circuit pattern, and form a flexible core board; the circuit pattern is composed of a first joint end, a head end connection section, a circuit distribution section, a tail end connection section, and a second joint end in sequence; the circuit distribution section is composed of a plurality of upper coil sections, a plurality of bending sections, and a plurality of lower coil sections in a cyclic alternating manner; the upper coil section and the lower coil section are both open coil sections, and the openings are respectively connected to different bending sections; S20: applying a cover film to the flexible core board, and performing post-processing to form the flexible circuit board.

[0007] Furthermore, the flexible core board is formed by manufacturing the circuit pattern, and then removing the insulating medium layer in some of the bending sections, the circuit pattern in the bending sections forms a first hollow circuit, and the entire board forms the flexible core board.

[0008] Furthermore, the forming of the flexible circuit board is to stick the covering film on the flexible core board, and then laser mill the covering film corresponding to the first hollow circuit to form a second hollow circuit.

[0009] Furthermore, a single side of the first hollow circuit is smaller than that of the second hollow circuit.

[0010] Furthermore, the forming of the flexible core board is that after the circuit pattern is made, a pure glue layer is attached to the plurality of upper coil segments and the plurality of lower coil segments.

[0011] Furthermore, the covering film is attached by cutting the first covering film corresponding to the bending section to form a pattern covering film, and then aligning and attaching the pattern covering film to the bending section.

[0012] Furthermore, the pattern covering film extends into the upper coil segment and the lower coil segment.

[0013] A method for manufacturing a laminated inductor circuit board is also proposed. The laminated inductor circuit board is manufactured by laminating the above-mentioned flexible circuit board; the lamination is to fold a plurality of the bending segments in sequence, and overlap the coil segments to form concentric coils.

[0014] Furthermore, the lamination is: making a mold, the mold comprising a top mold and a bottom mold, the bottom mold is provided with a protrusion, the protrusion corresponds to the center of the concentric circle, the top mold opens a window corresponding to the protrusion, the flexible circuit board is laminated using the mold, and then pressed to form a pressed plate.

[0015] Furthermore, the laminate is treated with a potting glue.

[0016] The beneficial effects of the technical solution of the present invention are: (1) By designing a flexible printed circuit board with a circuit pattern consisting of a first connector end, a head end connection section, a circuit distribution section (including an upper coil section, a bending section and a lower coil section alternately connected), a tail end connection section and a second connector end in sequence, the entire circuit of the inductor line forms the effect of a strictly identical circuit, thereby solving the problem that the existing technology separately welds the inductor components, increases the manufacturing complexity and cost, is not conducive to the miniaturization design of the equipment, and may cause the inductor components to age and decay over a long period of time, affecting the service life and performance of the equipment.

[0017] (2) The flexible circuit board is made to be bendable and can be stacked to form a flat inductor circuit board. This solves the problem that the existing technology uses a multi-layer structure to form a flat inductor circuit board, the production process is complicated and time-consuming, and when connecting the inductor coils between different layers, the through-hole or stacked blind-hole technology will cause inductor interference, further increasing the difficulty of manufacturing and the number of steps.

[0018] (3) The overall processing process forms effective coordination before and after, and the process from design to processing is streamlined and can be mass-produced, which greatly improves the processing efficiency and reliability of the inductor circuit board and extends the application life of the product. In addition, during the processing, auxiliary processing tools can choose to use scrap materials for recycling, effectively reducing processing costs and reducing environmental pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of a process flow of a flexible circuit board according to an embodiment of the present invention; Figure 2 is a schematic plan view of a flexible circuit board according to an embodiment of the present invention; Figure 3 for Figure 2 A partial enlarged schematic diagram of FD in the middle; Figure 4 for Figure 3 AA cross-sectional diagram of ; Figure 5 for Figure 3 BB cross-section diagram; Figure 6 It is a schematic cross-sectional view of a mold according to an embodiment of the present invention.

[0021] Explanation of the accompanying drawings: 10, flexible circuit board; 1010, first connector end; 1020, head end connecting section; 1030, line distribution section; 1030a, upper coil section; 1030b, bending section; 1030c, lower coil section; 1040, tail end connecting section; 1050, second connector end; FD, local enlarged schematic diagram; 1060, covering film; 1061, covering film PI layer; 1062, covering film glue layer; 1060a, first hollow circuit; 1060b, second hollow circuit; 1070, pure glue layer; 1080, flexible core board insulating layer; 20, mold; 2010, top mold; 2010a, window; 2020, bottom mold; 2020a, bump; 200, pressed laminated structure.

[0022] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, inside, outside...) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0026] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0027] See also Figure 1 , Figure 1 Schematic diagram of the process flow of an embodiment of the present invention.

[0028] The present invention first provides a method for manufacturing a flexible circuit board, comprising: Figure 1 The following will implement the various steps in the process Figure 1 Each step in the process is further explained step by step.

[0029] See also Figure 2 , Figure 3 , Figure 4 and Figure 5 , Figure 2 is a schematic plan view of a flexible circuit board according to an embodiment of the present invention; Figure 3 for Figure 2 A partial enlarged schematic diagram of FD in the middle; Figure 4 for Figure 3 AA cross-sectional diagram of ; Figure 5 for Figure 3 Schematic diagram of BB cross section.

[0030] Step S10: Take a flexible copper clad laminate, make a circuit pattern, and form a flexible core board; the circuit pattern is composed of a first connector end 1010, a head end connecting section 1020, a circuit distribution section 1030, a tail end connecting section 1040 and a second connector end 1050 in sequence; the circuit distribution section 1030 is composed of a plurality of upper coil sections 1030a, a plurality of bending sections 1030b and a plurality of lower coil sections 1030c in a cyclic alternating manner; the upper coil section 1030a and the lower coil section 1030c are both open coil sections, and the openings are respectively connected to different bending sections 1030b.

[0031] Step S20 : ​​attaching a cover film 1060 to the flexible core board and performing subsequent processing to form the flexible circuit board 10 .

[0032] First, the circuit pattern of the flexible core board is designed to include a first joint end 1010, a head end connection section 1020, a circuit distribution section 1030 (including an upper coil section 1030a, a bending section 1030b and a lower coil section 1030c), a tail end connection section 1040 and a second joint end 1050, wherein the upper coil section 1030a and the lower coil section 1030c are both open coil sections, and are respectively connected to different bending sections 1030b to form a "snake-shaped" circuit pattern as a whole, and then a covering film 1060 is attached to the flexible core board with the completed circuit pattern to protect the internal circuit from the influence of the external environment, thereby providing a processing basis for subsequent processes.

[0033] It is worth noting that the shapes of the head end connecting section 1020 and the bending section 1030b are both straight lines, which can reduce the complexity of processing on the one hand, and on the other hand, is more conducive to the lamination of the subsequent process, effectively avoiding irregular pattern lamination, which is prone to problems such as gluing or cracking at the edges.

[0034] For further information, see Figure 3 , a partially enlarged schematic diagram FD; the flexible core board is formed by making a circuit pattern, and then removing the insulating medium layer in several bending sections 1030b, the circuit pattern in the bending section 1030b forms a first hollow circuit 1060a, including a flexible core board insulation layer 1080, and the entire board forms a flexible core board.

[0035] By making the circuit of the bending section 1030b into a first hollow circuit 1060a, the area has better bending performance when bending and folding in the subsequent process, preventing the covering film 1060 in the area from wrinkling or delamination when bending due to the large area, and preventing excessive bending from affecting the transmission of electrical signals.

[0036] Furthermore, the flexible circuit board 10 is formed by attaching a covering film 1060 (including a covering film adhesive layer 1062 and a covering film PI layer 1061) (Note: PI in this application refers to polyimide) to the flexible core board, and then laser milling the covering film 1060 corresponding to the first hollow circuit 1060a to form a second hollow circuit 1060b.

[0037] By forming the first hollow circuit 1060a in the bending section 1030b of the flexible core board, then attaching the cover film 1060, and finally forming the second hollow circuit 1060b, the adhesive layer of the cover film 1060 can form a "wrapping" structure for the first hollow circuit 1060a. This design can effectively increase the bonding force between layers, because there is no insulating layer of the flexible core board at the edge, and the adhesive layer can better adhere to the circuit pattern.

[0038] Furthermore, the first hollow circuit 1060a is manufactured first and then subsequent steps are designed so that the first hollow circuit 1060a is tightly wrapped by the adhesive layer of the covering film 1060, thereby enhancing the stability of the first hollow circuit 1060a and improving the ability of the first hollow circuit 1060a to resist the influence of the external environment, thereby improving the reliability and service life of the entire circuit board.

[0039] Furthermore, a single side of the first hollow circuit 1060a is smaller than that of the second hollow circuit 1060b, ensuring that the bending area has better flexibility and adaptability without affecting the transmission of electrical signals, reducing problems such as wrinkles and delamination that may occur during bending, and can consolidate the "wrapping" effect of the glue formed by the second hollow circuit 1060b on the first hollow circuit 1060a, thereby improving the bending performance of the bending area and effectively preventing the side of the copper surface of the first hollow circuit 1060a from being exposed, thereby preventing the risks of oxidation and aging of the exposed copper surface of the first hollow circuit 1060a during application.

[0040] Preferably, the size of the first hollow circuit 1060a is 20 μm to 75 μm smaller than the size of the second hollow circuit 1060b.

[0041] Furthermore, the flexible core board is formed by forming a circuit pattern according to the design data, and then attaching a pure adhesive layer 1070 to a plurality of upper coil segments 1030a and a plurality of lower coil segments 1030c.

[0042] By attaching a pure adhesive layer 1070 to the area of ​​the upper coil segment 1030a and the lower coil segment 1030c, and then attaching a covering film 1060 to the bending segment 1030b, after the subsequent bending segments 1030b are stacked, they can be directly pressed and adhered (without attaching the adhesive layer 2030 separately), instead of uniformly coating the adhesive layer on the entire structure. This can significantly reduce the additional thickness increase and effectively reduce the overall thickness of the board. Further, the space occupied during application can be reduced, which means that more functions or components can be integrated in a limited space, which is conducive to promoting the development of electronic devices towards miniaturization, and can also improve production efficiency, reduce process steps, reduce the risk of errors caused by multi-step operations, and help improve the yield rate.

[0043] Preferably, the pure adhesive layer 1070 is an acrylic adhesive layer, an epoxy resin adhesive layer or a PET adhesive layer.

[0044] Furthermore, the covering film 1060 is attached by cutting the first covering film corresponding to the bending section 1030b to form a pattern covering film, and then aligning and attaching the pattern covering film to the bending section 1030b.

[0045] Furthermore, the graphic covering film extends into the upper coil segment 1030a and the lower coil segment 1030c to provide support and protection for the bending area, thereby avoiding excessive stress at the edges during the bending process, which may cause the graphic covering film to warp, break or be damaged. At the same time, it improves the overall flexibility and durability of the circuit board, ensuring that it can maintain good electrical performance after multiple bends.

[0046] Preferably, the patterned cover film extends into the upper coil segment 1030a and the lower coil segment 1030c by a distance of 20 μm to 75 μm.

[0047] See also Figure 6 , Figure 6 It is a schematic cross-sectional view of a mold according to an embodiment of the present invention.

[0048] This embodiment also provides a method for manufacturing a laminated inductor circuit board, which uses a previous process to prepare a flexible circuit board 10 for lamination, that is, folding a plurality of bending sections 1030b in sequence, and overlapping an upper coil section 1030a and a lower coil section 1030c to form a concentric coil.

[0049] By optimizing the circuit design in the previous process, multiple bending segments 1030b are folded in sequence, so that the upper coil segment 1030a and the lower coil segment 1030c can be overlapped together in the form of concentric circles and then pressed together. The pure glue layer 1070 attached in the previous process forms a bonding effect between the upper coil segments 1030a and the lower coil segments 1030c to form an overall stacked structure. By enabling the upper coil segment 1030a and the lower coil segment 1030c to complete the interlayer connection without relying on through holes or stacked blind holes, this design avoids the through hole or stacked blind hole technology in the traditional method, thereby reducing the number of cross-layer connection points, reducing the possibility of inductance interference, and improving the inductance accuracy.

[0050] Further, the lamination is as follows: a mold 20 is made ( Figure 6 The portion that does not contain the laminated structure 200 is the mold 20), the mold 20 includes a top mold 2010 and a bottom mold 2020, the bottom mold 2020 is provided with a bump 2020a, the bump 2020a corresponds to the center of the concentric circle, the top mold 2010 has a window 2010a corresponding to the bump 2020a, the mold 20 is used to laminate the flexible circuit board 10, and then laminated to form a laminated plate.

[0051] Specifically, a mold 20 is manufactured according to product design requirements. The mold 20 includes a top mold 2010 and a bottom mold 2020. The bottom mold 2020 is provided with a protrusion 2020a whose position corresponds to the center of the concentric coil to be formed on the final circuit board. The top mold 2010 has a window 2010a at a corresponding position to reserve space for the protrusion 2020a during the lamination process. The designed flexible circuit boards 10 are stacked and arranged in layers. The prepared laminated board is accurately inserted into the protrusion 2020a on the bottom mold with its center hole, and the coil can form a concentric circle layout according to a predetermined design. The top mold 2010 is placed on the bottom mold 2020 so that the window 2010a on the top mold 2010 just corresponds to the protrusion 2020a on the bottom mold 2020, forming a laminated structure 200 as a whole. A certain temperature and pressure are then applied to the assembled laminated structure 200 by special equipment to promote close bonding between the layers of materials to form a laminated board.

[0052] Furthermore, the size of the window 2010a on one side is larger than the size of the bump 2020a, preferably, larger than 20 μm to 100 μm.

[0053] Furthermore, the height of the bump 2020a is higher than the thickness of the pressing plate and lower than the thickness of the top mold 2010. The thinner top mold 2010 and the bottom mold 2020 help to improve the thermal conductivity because they can reduce the resistance on the heat conduction path and effectively transfer the heat from the heating source to the pressing plate to be pressurized, which helps to ensure uniform heating and avoid local overheating or insufficient cooling. In addition, a mold 20 of appropriate thickness can ensure a more uniform pressure distribution over the entire pressing plate. If the mold 20 is too thick, it may cause uneven pressure distribution and affect the pressing quality.

[0054] Optionally, the thickness of the top mold 2010 and the bottom mold 2020 are both 0.5 mm to 3.0 mm.

[0055] Optionally, the mold 20 can be made using scrapped circuit boards with smooth surfaces (preferably rigid circuit boards). For example, two scrapped circuit boards are taken, and holes are punched in one of them according to the distribution and size of the center hole. The plate body removed after the holes are punched is bonded to the surface of the other circuit board at a position corresponding to the center hole to form a bump 2020a, thereby forming the bottom mold 2020 as a whole.

[0056] Optionally, the production of the bottom mold 2020 can also be: designing the position of the bump 2020a on the surface of another circuit board, screen printing water glue, or attaching pure glue, pressing, forming the bump 2020a, and forming the bottom mold 2020. Regardless of whether screen printing water glue or attaching pure glue is used, it is necessary to press after the glue material is applied to ensure that the glue layer is evenly distributed and firmly bonded to the circuit board, and at the same time form the required bump 2020a.

[0057] Optionally, the top mold 2010 and the bottom mold 2020 are also provided with alignment holes and alignment pins. After alignment through the alignment holes, they are fixed with pins to ensure that each component can be accurately aligned during the assembly process, thereby achieving precise positioning and fixation between the components.

[0058] It is worth noting that the diameter of the alignment hole is slightly larger than the maximum diameter of the alignment pin, but should not be too large to avoid inaccurate or unstable positioning due to excessive clearance.

[0059] The pressing in this embodiment is preferably rapid pressing, with a pressing pressure of 10kg / cm² to 30kg / cm², preferably 15kg / cm², 18kg / cm² or 20kg / cm²; a pressing time of 10min to 30min, preferably 20min or 25min; and a pressing temperature of 100℃ to 160℃, preferably 120℃ or 150℃.

[0060] Since the presence of the mold 20 will have a blocking effect on the lamination process, fast lamination is used in conjunction with a longer lamination time to distribute heat more evenly over the entire lamination board, which not only shortens the production cycle, but also ensures a strong bond between the layers, improves the quality and reliability of the final product, and helps reduce defects caused by uneven heating or pressurization, which is crucial for applications that require a good connection between each layer. Proper temperature control promotes the flow of resin, allowing it to fully fill the gap while expelling air and other impurities that may affect electrical performance, thereby improving the consistency and reliability of the finished circuit board.

[0061] Furthermore, potting the laminate can effectively isolate moisture, dust and other pollutants in the external environment, thereby preventing these factors from damaging the internal circuits. At the same time, filling the gaps on the laminate and covering the components with potting can also provide additional mechanical support and reduce the risk of damage due to vibration or impact.

[0062] Optionally, the potting glue can be used to make a potting glue mold, and the potting glue is poured into the position of the press plate except the first joint end 1010 and the second joint end 1050. When it is used later, the first joint end 1010 and the second joint end 1050 are welded to other components. The purpose of this method is to make the press plate form a firm overall inductor circuit board structure; or, other components can be welded to the first joint end 1010 and the second joint end 1050 first, and then a potting glue mold is made, and the overall press plate including the first joint end 1010 and the second joint end 1050 is potted with glue. The purpose of this method is to make the inductor circuit board after welding form a sealed, firm and waterproof structure as a whole.

[0063] Optionally, the potting glue is epoxy resin, polyurethane or silicone rubber.

[0064] It is worth noting that since the design and processing process of the flexible circuit board 10 and the laminated inductor circuit board of this embodiment is relatively precise, the structure of the actual processing process and the thickness of each layer, line width and other dimensions are all at the micron level. If the drawings are made according to the enlarged ratio of the actual structure, there will be a problem of unclear drawings. Therefore, in order to more clearly and intuitively represent the implementation process of the manufacturing method of this embodiment, the drawings of this embodiment are all schematic diagrams that enlarge the technical features, which do not represent the size of the actual structure, nor are they enlarged drawings of the actual structure in proportion.

[0065] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing a flexible circuit board, characterized in that: The production method comprises the following steps: S10: Take the flexible copper clad board, make a circuit pattern, and form a flexible core board; The circuit pattern is composed of a first connector end, a head end connection section, a circuit distribution section, a tail end connection section, and a second connector end in sequence; The line distribution section is composed of a plurality of upper coil sections, a plurality of bending sections and a plurality of lower coil sections in a cyclic alternating sequence; The upper coil segment and the lower coil segment are both open coil segments, and the openings are respectively connected to the bending segments; S20: applying a cover film to the flexible core board, and performing post-processing to form the flexible circuit board.

2. The method for manufacturing a flexible circuit board according to claim 1, characterized in that: The flexible core board is formed by manufacturing the circuit pattern, removing the insulating medium layer in some of the bending sections, the circuit pattern in the bending sections forms a first hollow circuit, and the entire board forms the flexible core board.

3. The method for manufacturing a flexible circuit board according to claim 2, characterized in that: The forming of the flexible circuit board is to stick the covering film on the flexible core board, and then laser mill the covering film corresponding to the first hollow circuit to form a second hollow circuit.

4. The method for manufacturing a flexible circuit board according to claim 3, characterized in that: A single side of the first hollow circuit is smaller than that of the second hollow circuit.

5. The method for manufacturing a flexible circuit board according to claim 1, characterized in that: The forming of the flexible core board is that after the circuit pattern is made, a pure glue layer is attached to both the upper coil segment and the lower coil segment.

6. The method for manufacturing a flexible circuit board according to claim 1, characterized in that: The covering film is attached by cutting the first covering film corresponding to the bending section to form a pattern covering film, and then aligning and attaching the pattern covering film to the bending section.

7. The method for manufacturing a flexible circuit board according to claim 6, characterized in that: The pattern cover film extends into the upper coil segment and the lower coil segment.

8. A method for manufacturing a laminated inductor circuit board, characterized in that: The laminated inductor circuit board is made by laminating the flexible circuit board as described in any one of claims 1 to 7; the lamination is obtained by folding a plurality of the bending segments in sequence, and the coil segments are overlapped to form concentric coils.

9. The method for manufacturing a laminated inductor circuit board according to claim 8, wherein: The lamination is as follows: a mold is made, the mold includes a top mold and a bottom mold, the bottom mold is provided with a protrusion, the protrusion corresponds to the center of the concentric circle, the top mold opens a window corresponding to the protrusion, the flexible circuit board is laminated using the mold, and then pressed to form a pressed plate.

10. The method for manufacturing a laminated inductor circuit board according to claim 9, wherein: The pressed plate is subjected to a potting glue treatment.

Images