A circuit board welding tooling for the production of electronic computers

Abstract

The present invention discloses a circuit board soldering tooling for the production of electronic computers, which relates to the technical field of circuit board processing. It includes a base, a chip mounting mechanism, a heating mechanism, and a cooling mechanism, and also includes: a turntable; a positioning mechanism for positioning the circuit board; a solder paste brushing mechanism for brushing the solder paste on the circuit board from different directions and also for preventing the solder paste from separating from the circuit board; a lifting mechanism; an auxiliary linkage mechanism for driving the circuit board to rotate. This circuit board soldering tooling for the production of electronic computers brushes the solder paste on the circuit board from four directions in sequence, enabling the solder paste to be fully brushed on the soldering position of the circuit board through the solder guiding groove, avoiding the problem in the prior art that the direction of automatic solder paste brushing is single and it is difficult to ensure the sufficiency of solder paste brushing, further ensuring the quality of subsequent electronic component soldering. The solder paste on the circuit board is prevented from adhering to the template through the protection component, further ensuring the quality of solder paste brushing.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and particularly relates to a circuit board soldering tool for electronic computer production. Background Art

[0002] In the process of PCB circuit board manufacturing, SMT (Surface Mount Technology) is widely used, and reflow soldering is a commonly used technical means.

[0003] When the existing circuit boards are subjected to reflow soldering, the direction of brushing the solder paste is single, and it is difficult to brush the solder paste on the welding position of the circuit board sufficiently from multiple directions. As a result, it is easy to have problems such as insufficient solder paste, leading to insecure soldering between electronic components and the circuit board; secondly, when separating the template from the circuit board after brushing the solder paste, there will be varying degrees of adhesion between the template and the solder paste on the circuit board, affecting the effect of brushing the solder paste and further affecting the quality of subsequent electronic component soldering; in addition, currently when soldering circuit boards, brushing solder, placing components, heating, and cooling are usually carried out on different devices, resulting in the need for workers to transfer the semi-finished circuit boards multiple times, leading to low efficiency in circuit board soldering processing, and during the transfer of the circuit board, it may cause the displacement of electronic components on the circuit board, affecting the quality of the finished circuit board. Summary of the Invention

[0004] The purpose of the present invention is to provide a circuit board soldering tool for electronic computer production to solve the above deficiencies in the prior art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A circuit board soldering tool for electronic computer production, including a base, a component placement mechanism, a heating mechanism, and a cooling mechanism, further including:

[0006] A turntable, which is rotatably connected to the top of the base;

[0007] A positioning mechanism, which has multiple ones and is installed inside the base for positioning the circuit board;

[0008] A solder brushing mechanism, which is arranged above the base for brushing the solder paste on the circuit board from different directions and also for preventing the solder paste from separating from the circuit board;

[0009] A lifting mechanism, which has multiple ones and is respectively connected to the solder brushing mechanism, the component placement mechanism, the heating mechanism, and the cooling mechanism for respectively driving the solder brushing mechanism, the component placement mechanism, the heating mechanism, and the cooling mechanism to lift;

[0010] An auxiliary linkage mechanism, which is connected to the positioning mechanism for driving the circuit board to rotate;

[0011] An ejection mechanism, which is installed inside the base for ejecting the soldered circuit board.

[0012] Furthermore, a driving mechanism is also installed inside the base. The driving mechanism includes a first motor installed on the inner wall of the bottom of the base and a driving shaft fixedly connected to the center of the bottom of the turntable;

[0013] A first gear is fixedly sleeved on the outer part of the output shaft of the first motor;

[0014] The bottom end of the driving shaft is rotatably connected to the inner wall of the bottom of the base, and a first one-way gear is installed on the outer part of the driving shaft. The first gear meshes with the first one-way gear.

[0015] Furthermore, the positioning mechanism includes a turntable rotatably connected inside the turntable, a material placing groove opened at the top of the turntable, and a positioning groove arranged at the bottom of the material placing groove;

[0016] The turntables in multiple positioning mechanisms are distributed in a circular array with the driving shaft as the center.

[0017] Furthermore, the tin brushing mechanism includes a shell, a template, a magnetic attraction component, a tin scraping component, a feeding component, a material collecting component, and a protection component;

[0018] The template is arranged at the bottom of the shell, and a plurality of tin guiding grooves corresponding to the welding positions of the circuit board are opened on the template;

[0019] The magnetic attraction component includes two electromagnets installed inside the shell and two groups of iron blocks installed inside the template. The electromagnets cooperate with the iron blocks;

[0020] The tin scraping component includes a lead screw rotatably connected inside the shell, a linkage frame screwed on the outer part of the lead screw, and a scraping strip fixedly connected to the bottom of the linkage frame. The top of the linkage frame is slidably connected to the inner wall of the top of the shell. One end of the lead screw is connected to a second motor, and the second motor is installed on the outer wall of the shell. An inclined groove is opened at the bottom of one side of the scraping strip.

[0021] Furthermore, the protection component includes a fixing plate installed inside the shell, a plurality of first electric push rods installed at the bottom of the fixing plate, and a lifting plate fixedly connected to the extending ends of the plurality of first electric push rods;

[0022] The fixing plate is located inside the linkage frame, so the fixing plate will not affect the movement of the linkage frame. The width of the lifting plate is smaller than the inner diameter of the linkage frame, so the linkage frame will not come into contact with the lifting plate when moving left and right;

[0023] A plurality of limiting blocks are installed at the bottom of the lifting plate, and the plurality of limiting blocks are respectively adapted to the plurality of tin guiding grooves on the template;

[0024] The feeding assembly includes a material guide tube installed inside the fixed plate, one end of the material guide tube extends to the outside of the shell, and the other end of the material guide tube is equipped with multiple diversion tubes facing vertically downward, the lower edge of the diversion tube is higher than the upper edge of the scraper strip, and the multiple diversion tubes are all located on the inner side of the moving path of the linkage frame, so the linkage frame will not contact the diversion tube when moving.

[0025] Furthermore, the material receiving assembly includes a material guide platform fixedly connected to the inner wall of one side of the shell, a material receiving trough opened inside the shell, and a scraper plate arranged inside the material receiving trough;

[0026] The material guide platform is adapted to the oblique groove;

[0027] A material guide groove is provided on the inner wall of one side of the shell, the material guide groove is located on the top of the material guide platform and is connected to the material receiving groove;

[0028] A second electric push rod is installed inside the housing, and an extended end of the second electric push rod is fixedly connected to the top of the scraper plate;

[0029] A tin discharge groove is provided on the outer wall of the shell body close to the material receiving groove. After the shell body moves upward and leaves the material discharging groove, the solder paste in the material receiving groove is discharged through the tin discharge groove.

[0030] Further, the lifting mechanism includes a bracket installed on the top of the base and a cylinder installed inside the bracket;

[0031] The tin brushing mechanism, the patch mechanism, the heating mechanism and the cooling mechanism are respectively installed at the extended ends of the cylinders in the plurality of lifting mechanisms.

[0032] Further, the auxiliary linkage mechanism includes a driven shaft fixedly connected to the center of the bottom of the rotating disk and a second one-way gear installed outside the driven shaft;

[0033] The base is internally rotatably connected with a gear ring, and a third motor is also installed on the inner wall of the bottom of the base. The output end of the third motor is fixedly connected to a second gear, and the upper edge of the second gear is lower than the lower edge of the second one-way gear. The second one-way gear and the second gear are both meshed with the gear ring.

[0034] Further, the ejection mechanism includes an ejection plate arranged inside the positioning groove, a lifting rod installed at the bottom of the ejection plate, and a transmission shaft rotatably connected to the inner wall of the bottom of the base;

[0035] The lifting rod is arranged to penetrate the driven shaft, and the lower edge of the lifting rod is higher than the upper edge of the second gear;

[0036] A third one-way gear is installed outside the transmission shaft, and the third one-way gear is meshed with the first gear;

[0037] A reciprocating screw is also fixedly sleeved on the outside of the transmission shaft. A jacking block is screwed on the outside of the reciprocating screw. The top of the jacking block is fixedly connected with a jacking rod, and the jacking rod is directly below the lifting rod in a static state.

[0038] A limiting rod is also fixedly connected to the inner wall of the bottom of the base, and the jacking block is also slidably sleeved on the outside of the limiting rod.

[0039] Compared with the prior art, a circuit board welding tool for electronic computer production provided by the present invention has the following beneficial effects:

[0040] 1. Through the cooperation of the tin brushing mechanism and the auxiliary linkage mechanism, the circuit board is brushed with tin in turn from four directions, so that the solder paste is fully brushed on the welding position of the circuit board through the tin guiding groove, avoiding the problem that the direction of automatic solder paste brushing in the prior art is single and it is difficult to ensure the sufficiency of solder paste brushing, and further ensuring the quality of subsequent electronic component welding;

[0041] 2. After the circuit board is brushed with solder paste, when the template is separated from the circuit board, the protective component is used to prevent the solder paste on the circuit board from adhering to the template, further ensuring the quality of tin brushing;

[0042] 3. Through the setting of the auxiliary linkage mechanism, the circuit board is driven to rotate in segments, changing the direction of the circuit board, so that the circuit board can be brushed with tin from different directions. After the circuit board is pasted, by driving the pasted circuit board to rotate in segments, through the heat-conducting material, the pasted circuit board can be evenly preheated. When the circuit board is heated, by driving the circuit board to rotate in segments, the temperature inside the material placing groove can be made more uniform, so that the solder paste melts more evenly, avoiding the problem that the local solder paste does not melt thoroughly. When the circuit board is cooled, by driving the circuit board to rotate in segments, the melted solder paste can be cooled from different directions, reducing the difference in the cooling speed between the melted solder pastes at each position. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0044] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0045] Figure 2 It is a schematic diagram of the structure of the positioning mechanism of the present invention;

[0046] Figure 3 It is a schematic diagram of the internal structure of the base of the present invention;

[0047] Figure 4 Schematic diagram of the external structure of the tin-brushing mechanism of the present invention;

[0048] Figure 5 Schematic diagram of the magnetic attraction component and the template structure of the present invention;

[0049] Figure 6 Schematic diagram of the internal structure of the housing of the present invention;

[0050] Figure 7 Schematic diagram of the material receiving component structure of the present invention;

[0051] Figure 8 Schematic diagram of the protection component and the feeding component structure of the present invention;

[0052] Figure 9 Schematic diagram of the ejecting mechanism structure of the present invention.

[0053] Explanation of reference numerals:

[0054] 1. Base; 2. SMT mechanism; 3. Heating mechanism; 4. Cooling mechanism; 5. Turntable; 6. First motor; 7. Drive shaft; 8. First gear; 9. First one-way gear; 10. Turntable; 11. Feeding groove; 12. Positioning groove; 13. Housing; 14. Template; 15. Electromagnet; 16. Iron block; 17. Lead screw; 18. Linkage frame; 19. Scraping bar; 20. Second motor; 21. Fixed plate; 22. First electric push rod; 23. Lifting plate; 24. Limiting block; 25. Guide pipe; 26. Diverting pipe; 27. Guide table; 28. Material receiving groove; 29. Scraping plate; 30. Guide groove; 31. Second electric push rod; 32. Bracket; 33. Cylinder; 34. Driven shaft; 35. Second one-way gear; 36. Tooth ring; 37. Third motor; 38. Second gear; 39. Ejecting plate; 40. Lifting rod; 41. Transmission shaft; 42. Third one-way gear; 43. Reciprocating screw; 44. Jacking block; 45. Jacking rod; 46. Limiting rod. Detailed implementation manners

[0055] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0056] Example 1: Please refer to Figure 1 - Figure 9, A circuit board welding tool for electronic computer production, including a base 1, a chip placement mechanism 2, a heating mechanism 3, and a cooling mechanism 4. The chip placement mechanism 2 is a prior art and is used to place different types of electronic components at corresponding positions on the circuit board after brushing tin. The heating mechanism 3 is a prior art and is used to heat the circuit board with electronic components placed on it to melt the solder paste. The cooling mechanism 4 is a prior art and is used to cool the heated circuit board to re-cool and solidify the melted solder paste, so that the electronic components are fixed to the circuit board.

[0057] It further includes:

[0058] A turntable 5, which is rotatably connected to the top of the base 1. A driving mechanism is also installed inside the base 1. The driving mechanism includes a first motor 6 installed on the bottom inner wall of the base 1 and a driving shaft 7 fixedly connected to the center of the bottom of the turntable 5. An external portion of the output shaft of the first motor 6 is fixedly sleeved with a first gear 8. The bottom end of the driving shaft 7 is rotatably connected to the bottom inner wall of the base 1. A first one-way gear 9 is installed on the external portion of the driving shaft 7. The first gear 8 meshes with the first one-way gear 9.

[0059] By controlling the first motor 6 to drive the first gear 8 to rotate counterclockwise, through the meshing action between the first gear 8 and the first one-way gear 9, the driving shaft 7 is driven to rotate clockwise, and then the turntable 5 is driven to rotate clockwise. Among them, by controlling the first motor 6 to drive the turntable 5 to pause every quarter turn, the turntable 10 inside the turntable 5 is driven to sequentially rotate from directly below the housing 13 to directly below the chip placement mechanism 2, directly below the heating mechanism 3, and directly below the cooling mechanism 4, and finally return to directly below the housing 13.

[0060] In addition, when the first gear 8 rotates counterclockwise, the third one-way gear 42 also rotates accordingly, but the transmission shaft 41 does not rotate accordingly.

[0061] A positioning mechanism, which has a plurality of them and is installed inside the base 1. In this embodiment, the number of the positioning mechanisms is four and is used to position the circuit board. The positioning mechanism includes a turntable 10 rotatably connected inside the turntable 5, a material placement groove 11 opened on the top of the turntable 10, and a positioning groove 12 provided at the bottom of the material placement groove 11. The turntables 10 in the plurality of positioning mechanisms are annularly arrayed with the driving shaft 7 as the center.

[0062] The staff places the circuit board to be welded inside the positioning groove 12 below the housing 13. The circuit board fits with the positioning groove 12, which is convenient for positioning the circuit board.

[0063] The tin brushing mechanism is arranged above the base 1, and is used to brush the solder paste on the circuit board from different directions, and is also used to prevent the solder paste from separating from the circuit board. The tin brushing mechanism includes a shell 13, a template 14, a magnetic suction component, a tin scraping component, a feeding component, a material receiving component and a protective component; the template 14 is arranged at the bottom of the shell 13, and a plurality of tin guide grooves corresponding to the welding positions of the circuit board are opened on the template 14; the magnetic suction component includes two electromagnets 15 installed in the shell 13 and two groups of iron blocks 16 installed in the template 14, and the electromagnetic The iron 15 cooperates with the iron block 16; the tin scraping assembly includes a screw rod 17 rotatably connected to the inside of the housing 13, a linkage frame 18 screwed to the outside of the screw rod 17, and a scraping strip 19 fixed to the bottom of the linkage frame 18. The top of the linkage frame 18 is slidably connected to the inner wall of the top of the housing 13. One end of the screw rod 17 is connected to a second motor 20, which is mounted on the outer wall of the housing 13. An oblique groove is provided at the bottom of one side of the scraping strip 19. The feeding assembly includes a guide pipe 25 mounted inside the fixed plate 21, and one end of the guide pipe 25 extends The guide tube 25 extends to the outside of the shell 13. The other end of the guide tube 25 is equipped with a plurality of vertically downward shunt tubes 26. The lower edge of the shunt tube 26 is higher than the upper edge of the scraper 19. The plurality of shunt tubes 26 are located on the inner side of the moving path of the linkage frame 18. Therefore, the linkage frame 18 will not contact the shunt tube 26 when it moves. The material receiving assembly includes a guide table 27 fixed to the inner wall of one side of the shell 13, a material receiving trough 28 opened inside the shell 13, and a scraper plate 29 arranged inside the material receiving trough 28. The guide table 27 is adapted to the oblique groove; the shell A material guide groove 30 is provided on the inner wall of one side of the housing 13, and the material guide groove 30 is located on the top of the material guide platform 27 and is connected to the material receiving groove 28; a second electric push rod 31 is installed inside the housing 13, and the extended end of the second electric push rod 31 is fixedly connected to the top of the scraper plate 29; a tin discharge groove is provided on the outer wall of the housing 13 near the material receiving groove 28. After the housing 13 moves upward and leaves the inside of the material discharge groove 11, the second electric push rod 31 is controlled to drive the scraper plate 29 to continue to move downward, and all the solder paste inside the material receiving groove 28 is discharged through the tin discharge groove;

[0064] After the circuit board is placed in the positioning groove 12 below the shell 13, the shell 13 is driven downward by the lifting mechanism, and the shell 13 moves downward along the inner wall of the material discharge groove 11 until the template 14 fits the top of the circuit board. At this time, the tin guide groove on the template 14 corresponds to each tin brushing position on the circuit board, and the solder paste is guided to the top of the template 14 through the material guide pipe 25 and the shunt pipe 26, and is located on the left side of the scraper 19, and then the second motor 20 is controlled to drive the screw rod 17 to rotate clockwise, driving the linkage frame 18 to move left, and the scraper 19 moves left along the top of the template 14. The scraper 19 pushes the solder paste to move left along the top of the template 14 synchronously. When the solder paste reaches the tin guide groove position, the scraper 19 presses the solder paste into the inside of the tin guide groove, so that the solder paste contacts the soldering position of the circuit board. After the scraper 19 moves to the left and abuts against the material guide table 27, the remaining solder paste passes through the material guide The groove 30 is squeezed into the inside of the material receiving groove 28, and then the second electric push rod 31 is controlled to drive the scraper plate 29 to move downward along the inner wall of the material receiving groove 28 and the outer wall on the left side of the scraper bar 19, so that the solder paste squeezed into the material receiving groove 28 is separated from the scraper bar 19, and then the second motor 20 is controlled to drive the screw rod 17 to rotate counterclockwise, drive the linkage frame 18 and the scraper bar 19 to move rightward and reset, and then drive the housing 13 to move up and reset through the lifting mechanism, and drive the turntable 10 and the circuit board inside it to rotate 90° through the auxiliary linkage mechanism, repeat the above-mentioned tin brushing operation, and brush the circuit board from another direction. In this cycle, the circuit board is brushed from four directions in turn, so that the solder paste is fully brushed on the circuit board welding position through the tin guide groove, avoiding the problem of the single direction of automatic solder paste brushing in the prior art that it is difficult to ensure the sufficiency of solder paste brushing, and further ensuring the quality of subsequent electronic component welding;

[0065] Among them, after the circuit board is brushed with solder paste for the first time, the electromagnet 15 is controlled to be de-energized to separate the template 14 from the shell 13, and then when the shell 13 moves upward, the template 14 is still attached to the top of the circuit board. After the circuit board is brushed with solder paste from four directions, the electromagnet 15 is energized to fix the shell 13 and the template 14 together again, and then when the shell 13 is moved up and reset, the template 14 is driven to move upward synchronously.

[0066] The protection component includes a fixed plate 21 installed inside the housing 13, a plurality of first electric push rods 22 installed at the bottom of the fixed plate 21, and a lifting plate 23 fixed to the extended ends of the plurality of first electric push rods 22; the fixed plate 21 is located on the inner side of the linkage frame 18, so the fixed plate 21 will not affect the movement of the linkage frame 18, and the width of the lifting plate 23 is smaller than the inner diameter of the linkage frame 18, so the linkage frame 18 will not contact the lifting plate 23 when moving left and right; a plurality of limit blocks 24 are installed at the bottom of the lifting plate 23, and the plurality of limit blocks 24 are respectively adapted to the plurality of tin guide grooves on the template 14;

[0067] After the solder paste is brushed on the circuit board, control the first electric push rod 22 to drive the lifting plate 23 and the limit block 24 to move downward, so that the lower edge of the limit block 24 is at the same horizontal height as the upper edge of the solder guiding groove. Then, drive the housing 13 and the template 14 to move upward synchronously. During this process, control the first electric push rod 22 to drive the limit block 24 to move downward along the inner wall of the solder guiding groove at the same speed, so that the solder paste on the circuit board will not adhere to the template 14, further ensuring the quality of solder brushing.

[0068] Lifting mechanisms, multiple in number. In this embodiment, the number of lifting mechanisms is four, and they are respectively connected to the solder brushing mechanism, the chip mounting mechanism 2, the heating mechanism 3, and the cooling mechanism 4, and are used to drive the solder brushing mechanism, the chip mounting mechanism 2, the heating mechanism 3, and the cooling mechanism 4 to lift. The lifting mechanism includes a bracket 32 installed on the top of the base 1 and a cylinder 33 installed inside the bracket 32; the solder brushing mechanism, the chip mounting mechanism 2, the heating mechanism 3, and the cooling mechanism 4 are respectively installed at the extending ends of the cylinders 33 in multiple lifting mechanisms. Among them, for the solder brushing mechanism, the housing 13 is installed at the extending end of the cylinder 33;

[0069] When brushing solder on the circuit board, control the cylinder 33 to drive the housing 13 to move downward. After the solder brushing is completed, control the cylinder 33 to drive the housing 13 to move upward;

[0070] When mounting chips on the circuit board, control the cylinder 33 to drive the chip mounting mechanism 2 to move downward to reach the top of the material placing groove 11, and place each electronic component at the corresponding welding position; after the chip mounting is completed, control the cylinder 33 to drive the chip mounting mechanism 2 to move upward and reset;

[0071] When heating the circuit board, control the cylinder 33 to drive the heating mechanism 3 to move downward to reach the top of the material placing groove 11, start the heating mechanism 3 to heat the circuit board inside the positioning groove 12, and melt the solder paste. After the circuit board heating is completed, control the cylinder 33 to drive the heating mechanism 3 to move upward and reset;

[0072] When cooling the circuit board, control the cylinder 33 to drive the cooling mechanism 4 to move downward to reach the top of the material placing groove 11, start the cooling mechanism 4 to cool the circuit board, so that the electronic components are fixed to the circuit board. After the cooling is completed, control the cylinder 33 to drive the cooling mechanism 4 to move upward and reset.

[0073] The auxiliary linkage mechanism, which is connected to the positioning mechanism and is used to drive the circuit board to rotate. The auxiliary linkage mechanism includes a driven shaft 34 fixedly connected to the center of the bottom of the turntable 10 and a second one-way gear 35 installed outside the driven shaft 34; a gear ring 36 is rotatably connected inside the base 1, and a third motor 37 is also installed on the inner wall of the bottom of the base 1. The output end of the third motor 37 is fixedly connected with a second gear 38, and the upper edge of the second gear 38 is lower than the lower edge of the second one-way gear 35. Both the second one-way gear 35 and the second gear 38 are engaged with the gear ring 36;

[0074] Among them, a heat-conducting material or a heat-insulating material is provided between two adjacent turntables 10, and the heat-conducting material and the heat-insulating material are alternately arranged in the clockwise direction. As Figure 2 shown, at this time, a heat-insulating material is provided between the left turntable 10 (the turntable 10 below the housing 13) and the front turntable 10 (the turntable 10 below the patch mechanism 2), a heat-conducting material is provided between the front turntable 10 and the right turntable 10 (the turntable 10 below the heating mechanism 3), a heat-insulating material is provided between the right turntable 10 and the rear turntable 10 (the turntable 10 below the cooling mechanism 4), and a heat-conducting material is provided between the rear turntable 10 and the left turntable 10;

[0075] When the turntable 5 rotates clockwise, it drives each second one-way gear 35 to move along a clockwise circular track. During this process, through the meshing between the second one-way gear 35 and the gear ring 36, the second one-way gear 35 is driven to rotate counterclockwise. When the second one-way gear 35 rotates counterclockwise, the driven shaft 34 does not rotate accordingly;

[0076] By controlling the third motor 37 to drive the second gear 38 to rotate clockwise, through the meshing between the second gear 38 and the gear ring 36, the gear ring 36 is driven to rotate clockwise, and then each second one-way gear 35 is driven to rotate synchronously clockwise. When the second one-way gear 35 rotates clockwise, the driven shaft 34 is driven to rotate synchronously, and then the turntable 10 is driven to rotate synchronously. Among them, the driving turntable 10 pauses every 90° rotation, so as to facilitate changing the direction of the circuit board, so as to brush the tin on the circuit board from different directions. At the same time, after the circuit board is patched, by driving the patched circuit board to pause every 90° rotation, through the heat-conducting material, the patched circuit board can be evenly preheated. When the circuit board is heated, by driving the circuit board to pause every 90° rotation, the temperature inside the material slot 11 can be made more uniform, so that the solder paste melts more evenly, avoiding the problem of incomplete melting of the local solder paste. When the circuit board is cooled, by driving the circuit board to pause every 90° rotation, the melted solder paste can be cooled from different directions, reducing the difference in the cooling speed of the melted solder paste.

[0077] Ejecting mechanism, which is installed inside the base 1 and is used to eject the soldered circuit board. The ejecting mechanism includes an ejecting plate 39 arranged inside the positioning groove 12, a lifting rod 40 installed at the bottom of the ejecting plate 39, and a transmission shaft 41 rotatably connected to the inner wall of the bottom of the base 1; the lifting rod 40 penetrates through the driven shaft 34 and does not contact the driven shaft 34, and the lower edge of the lifting rod 40 is higher than the upper edge of the second gear 38; a third one-way gear 42 is installed outside the transmission shaft 41, and the third one-way gear 42 meshes with the first gear 8; a reciprocating screw 43 is also fixedly sleeved outside the transmission shaft 41, a jacking block 44 is screwed outside the reciprocating screw 43, a jacking rod 45 is fixedly connected to the top of the jacking block 44, and the jacking rod 45 is located directly below the lifting rod 40 in a stationary state; a limiting rod 46 is also fixedly connected to the inner wall of the bottom of the base 1, and the jacking block 44 is also slidably sleeved outside the limiting rod 46;

[0078] After the circuit board is cooled and the cooling mechanism 4 moves up and resets, by controlling the first motor 6 to drive the first gear 8 to rotate clockwise, through the meshing action between the first gear 8 and the third one-way gear 42, the transmission shaft 41 is driven to rotate counterclockwise. At this time, the first one-way gear 9 also rotates accordingly, but the drive shaft 7 does not rotate accordingly. When the transmission shaft 41 rotates, the reciprocating screw 43 is driven to rotate synchronously, and then the jacking block 44 is driven to move up from the bottom end of the reciprocating screw 43 to its top end. During this process, the lifting rod 40 is driven to move upward synchronously through the jacking rod 45, and the ejecting plate 39 moves upward synchronously, ejecting the cooled circuit board upward into the discharge slot 11, which is convenient for the staff to take out;

[0079] After the circuit board is taken out, the first motor 6 drives the reciprocating screw 43 to continue rotating, driving the jacking block 44 and the jacking rod 45 to move down and reset. The lifting rod 40 and the ejecting plate 39 move down and reset under the action of their own gravity.

[0080] It should be noted that the device structure and drawings of the present invention mainly describe the principle of the present invention. On the basis of this design principle, the settings of the power mechanism, power supply system, control system, etc. of the device are not fully described. Under the premise that those skilled in the art understand the principle of the above invention, the specific power mechanism, power supply system, and control system can be clearly known. The control method of the application document is automatically controlled by a controller, and the control circuit of the controller can be realized by simple programming by those skilled in the art; only some exemplary embodiments of the present invention are described above by way of illustration. Undoubtedly, for those of ordinary skill in the art, without departing from the spirit and scope of the present invention, the described embodiments can be modified in various different ways. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present invention.

Claims

1. A circuit board welding tooling for electronic computer production, comprising a base (1), a chip mounting mechanism (2), a heating mechanism (3) and a cooling mechanism (4), characterized in that, It also includes: A turntable (5) rotatably connected to the top of the base (1); A positioning mechanism, which has a plurality of them and is installed inside the base (1) for positioning the circuit board. The positioning mechanism includes a turntable (10) rotatably connected inside the turntable (5); A solder brushing mechanism, which is arranged above the base (1) for brushing solder paste on the circuit board from different directions and also for preventing the solder paste from separating from the circuit board; A lifting mechanism, which has a plurality of them and is respectively connected to the solder brushing mechanism, the chip mounting mechanism (2), the heating mechanism (3) and the cooling mechanism (4) for respectively driving the solder brushing mechanism, the chip mounting mechanism (2), the heating mechanism (3) and the cooling mechanism (4) to lift; An auxiliary linkage mechanism, which is connected to the positioning mechanism for driving the circuit board to rotate. The auxiliary linkage mechanism includes a driven shaft (34) fixedly connected to the center of the bottom of the turntable (10) and a second one-way gear (35) installed outside the driven shaft (34); A gear ring (36) is rotatably connected inside the base (1), and a third motor (37) is also installed on the inner wall of the bottom of the base (1). The output end of the third motor (37) is fixedly connected with a second gear (38), and both the second one-way gear (35) and the second gear (38) are meshed with the gear ring (36); An ejecting mechanism, which is installed inside the base (1) for ejecting the soldered circuit board.

2. The circuit board welding tooling for electronic computer production according to claim 1, characterized in that, A driving mechanism is also installed inside the base (1). The driving mechanism includes a first motor (6) installed on the inner wall of the bottom of the base (1) and a driving shaft (7) fixedly connected to the center of the bottom of the turntable (5); A first gear (8) is fixedly sleeved outside the output shaft of the first motor (6); The bottom end of the driving shaft (7) is rotatably connected to the inner wall of the bottom of the base (1). A first one-way gear (9) is installed outside the driving shaft (7), and the first gear (8) is meshed with the first one-way gear (9).

3. The circuit board soldering tooling for electronic computer production according to claim 2, characterized in that, The positioning mechanism further includes a material placing groove (11) opened on the top of the turntable (10) and a positioning groove (12) arranged at the bottom of the material placing groove (11); The turntables (10) in the plurality of positioning mechanisms are annularly arranged in an array centered on the driving shaft (7).

4. The circuit board soldering tooling for electronic computer production according to claim 3, characterized in that, The solder brushing mechanism includes a housing (13), a template (14), a magnetic attraction assembly, a tin scraping assembly, a feeding assembly, a material collecting assembly and a protection assembly; The template (14) is arranged at the bottom of the housing (13), and a plurality of tin guiding grooves corresponding to the welding positions of the circuit board are opened on the template (14); The magnetic attraction assembly includes two electromagnets (15) installed inside the housing (13) and two groups of iron blocks (16) installed inside the template (14), and the electromagnets (15) cooperate with the iron blocks (16); The tin scraping assembly includes a lead screw (17) rotatably connected inside the housing (13), a linkage frame (18) screwed outside the lead screw (17), and a scraping bar (19) fixedly connected to the bottom of the linkage frame (18). The top of the linkage frame (18) is slidably connected to the inner wall of the top of the housing (13). One end of the lead screw (17) is connected to a second motor (20), and the second motor (20) is installed on the outer wall of the housing (13). An inclined groove is formed at the bottom of one side of the scraping bar (19).

5. The circuit board welding tooling for electronic computer production according to claim 4, characterized in that, The protection assembly includes a fixing plate (21) installed inside the housing (13), a plurality of first electric push rods (22) installed at the bottom of the fixing plate (21), and a lifting plate (23) fixedly connected to the extending ends of the plurality of first electric push rods (22); A plurality of limiting blocks (24) are installed at the bottom of the lifting plate (23), and the plurality of limiting blocks (24) are respectively adapted to a plurality of tin guiding grooves on the template (14); The feeding assembly includes a feeding pipe (25) installed inside the fixing plate (21). One end of the feeding pipe (25) extends to the outside of the housing (13), and the other end of the feeding pipe (25) is installed with a plurality of shunt pipes (26) vertically downward.

6. The circuit board soldering tooling for electronic computer production according to claim 5, characterized in that, The material receiving assembly includes a material guiding table (27) fixedly connected to the inner wall of one side of the housing (13), a material receiving groove (28) formed inside the housing (13), and a scraping plate (29) arranged inside the material receiving groove (28); The material guiding table (27) is adapted to the inclined groove; A material guiding groove (30) is formed on the inner wall of one side of the housing (13). The material guiding groove (30) is located at the top of the material guiding table (27) and is communicated with the material receiving groove (28); A second electric push rod (31) is installed inside the housing (13), and the extending end of the second electric push rod (31) is fixedly connected to the top of the scraping plate (29); A tin discharging groove is formed on the outer wall of the housing (13) close to the material receiving groove (28).

7. An electronic computer production circuit board welding tooling according to claim 6, characterized in that, The lifting mechanism includes a bracket (32) installed on the top of the base (1) and a cylinder (33) installed inside the bracket (32); The tin brushing mechanism, the chip mounting mechanism (2), the heating mechanism (3), and the cooling mechanism (4) are respectively installed at the extending ends of the cylinders (33) in a plurality of lifting mechanisms.

8. A circuit board soldering tool for electronic computer production according to claim 7, characterized in that, The ejecting mechanism includes an ejecting plate (39) arranged inside the positioning groove (12), a lifting rod (40) installed at the bottom of the ejecting plate (39), and a transmission shaft (41) rotatably connected to the inner wall of the bottom of the base (1); The lifting rod (40) penetrates through the driven shaft (34); A third one-way gear (42) is installed on the outer part of the transmission shaft (41), and the third one-way gear (42) meshes with the first gear (8); A reciprocating screw rod (43) is also fixedly sleeved on the outer part of the transmission shaft (41). A jacking block (44) is screwed on the outer part of the reciprocating screw rod (43). A jacking rod (45) is fixedly connected to the top of the jacking block (44), and the jacking rod (45) is located directly below the lifting rod (40) in a static state; A limiting rod (46) is also fixedly connected to the inner wall at the bottom of the base (1), and the jacking block (44) is also slidably sleeved outside the limiting rod (46).

Images