Pressure sensor using magnetic field

Abstract

The invention relates to a pressure sensor using a magnetic field. A pressure sensor using a magnetic field according to the present invention comprises: an elastic part containing a magnetic material having a residual magnetization value; and a circuit unit that generates a Hall voltage when a magnetic field changes, and that senses the magnitude of the Hall voltage corresponding to the change in the magnetic field when the magnetic field applied to the circuit unit changes due to the deformation of at least a portion of the elastic unit based on an external pressure.

Description

Technical Field

[0001] The present invention relates to a pressure sensor using a magnetic field, and more particularly to a pressure sensor using a magnetic field, which can be operated by remote action of a magnetic field without establishing an electrical connection between a pressurized object and an electrode. Background Art

[0002] There are many pressure sensors currently used to sense input intensity. Figure 1 As shown, the existing pressure sensor may include a piezoresistivity pressure sensor according to the working principle. Figure 1 (a)], Capacitance pressure sensor [ Figure 1 (b)], Piezoelectric pressure sensor [ Figure 1 (c)] etc.

[0003] In particular, piezoresistive pressure sensors and capacitive pressure sensors are widely used due to their simple working principles and easy manufacturing processes. Piezoresistive pressure sensors sense changes in resistance value according to changes in pressure F applied from the outside. Capacitive pressure sensors sense changes in capacitance C according to changes in thickness d caused by pressure F. Piezoelectric pressure sensors sense changes in polarization according to changes in pressure F applied from the outside.

[0004] As described above, the conventional pressure sensor uses electric field and resistance, but has the disadvantage of requiring electrodes to be attached to both ends of the object affected by pressure. That is, since electrical wiring must be provided at both ends of the object affected by pressure, the product structure becomes complicated and the product design is restricted. Summary of the invention

[0005] Technical issues

[0006] An object of the present invention is to provide a pressure sensor using a magnetic field, which adopts a new pressure sensing method that cannot be achieved by existing pressure sensors.

[0007] In addition, an object of the present invention is to provide a pressure sensor using a magnetic field, which can be operated by the remote action of the magnetic field without establishing an electrical connection between the pressurized object and the electrode.

[0008] Another object of the present invention is to provide a pressure sensor using a magnetic field to increase the degree of freedom in product design.

[0009] However, these technical problems are only exemplary and are not intended to limit the scope of the present invention.

[0010] Technical Solution

[0011] The above-mentioned purpose of the present invention is achieved by a pressure sensor utilizing a magnetic field. The pressure sensor utilizing a magnetic field according to the present invention includes: an elastic part, which includes a magnetic material having a residual magnetization intensity value; a circuit part, which generates a Hall voltage when the magnetic field changes. When at least a part of the elastic part is deformed based on external pressure, causing the magnetic field applied to the circuit part to change, the circuit part senses the size of the Hall voltage corresponding to the change in the magnetic field.

[0012] In addition, the above-mentioned purpose of the present invention is achieved by a pressure sensor utilizing a magnetic field. The pressure sensor utilizing a magnetic field according to the present invention includes: an elastic part, which includes a magnetic material having a residual magnetization intensity value; a first circuit part, which generates a Hall voltage when the magnetic field changes; a second circuit part, which generates a current by inducing an electromotive force when the magnetic field changes. When at least a part of the elastic part is deformed based on external pressure, causing the magnetic field applied to the first circuit part and the second circuit part to change, the first circuit part senses the Hall voltage corresponding to the magnetic field change, and the second circuit part senses the current change corresponding to the magnetic field change.

[0013] Furthermore, according to an embodiment of the present invention, a spacing area may be disposed between the elastic portion and the circuit portion.

[0014] Furthermore, according to an embodiment of the present invention, a spacing area may be disposed between the elastic portion and the first circuit portion or the second circuit portion.

[0015] Furthermore, according to an embodiment of the present invention, when external pressure acts on the elastic portion, the spacing area may provide a space for a portion of the elastic portion to move.

[0016] Furthermore, according to an embodiment of the present invention, the Hall voltage may be generated based on a potential difference generated when a moving direction of free electrons in the circuit portion conductor is bent due to a change in the magnetic field.

[0017] In addition, according to an embodiment of the present invention, the magnitude of the Hall voltage may increase as the elastic portion and the circuit portion get closer.

[0018] Furthermore, according to an embodiment of the present invention, the magnitude of the pressure applied to the elastic portion may be sensed by the first circuit portion, and the rate of change of the pressure applied to the elastic portion may be sensed by the second circuit portion.

[0019] The elastic portion may be disposed on a first side of the circuit portion, and the substrate portion may be disposed on a second side of the circuit portion opposite to the first side.

[0020] In addition, according to one embodiment of the present invention, the elastic portion may be arranged on the first side of the first circuit portion, and the elastic portion may be arranged at a predetermined distance from the second side opposite to the first side of the first circuit portion, and a substrate portion may be arranged on the second side opposite to the first side of the second circuit portion facing the first circuit portion.

[0021] In addition, according to an embodiment of the present invention, a coil portion may be further included, which applies a second magnetic field to the elastic portion so that the elastic portion is provided as an actuator.

[0022] In addition, the above object of the present invention is achieved by a touch sensor, which includes one or more pressure sensors using a magnetic field.

[0023] Beneficial Effects

[0024] According to the present invention as described above, the pressure sensing method using a magnetic field is a new pressure sensing method that cannot be implemented by existing pressure sensors, and has the effect of providing a pressure sensor using a magnetic field.

[0025] In addition, according to the present invention, the pressure sensor using the magnetic field has the following effects: the presence, absence and change of pressure applied to the sensor causes spatiotemporal changes in the deformation and recovery of the elastic part containing magnetic particles and the magnetic field intensity caused thereby, and the pressure can be remotely sensed without establishing an electrical connection between the elastic part containing the magnetic particles and the circuit part for sensing the magnetic field change.

[0026] Furthermore, according to the present invention, the elastic portion containing magnetic particles and the circuit portion can be operated without establishing an electrical connection, and the plurality of electrodes of the circuit portion are located on the same substrate, and the two ends of the elastic portion containing magnetic particles do not need to be connected to electrodes. Therefore, in addition to pressure sensors utilizing magnetic fields, it is easy to integrate with microelectronic circuits on the same substrate, which is conducive to application in the Internet of Things and the like where the integration of sensors and information processing circuits is ideal.

[0027] Obviously, these effects cannot limit the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic diagram of a pressure sensor using an existing pressure sensing method.

[0029] Figure 2 and Figure 3 FIG. 4 is a schematic diagram of a pressure sensor using a magnetic field and a driving process thereof according to a first embodiment of the present invention.

[0030] Figure 4 FIG. 4 is a schematic diagram of a driving principle of a pressure sensor using a magnetic field according to a first embodiment of the present invention.

[0031] Figure 5 FIG. 4 is a schematic diagram of a pressure sensor using a magnetic field and a driving process thereof according to a second embodiment of the present invention.

[0032] Figure 6 FIG. 4 is a schematic diagram of a driving principle of a pressure sensor using a magnetic field according to a second embodiment of the present invention.

[0033] Figure 7 and Figure 8 FIG. 4 is a schematic diagram of a pressure sensor using a magnetic field and a driving process thereof according to a third embodiment of the present invention.

[0034] Fig. 9 FIG. 4 is a schematic diagram of a driving principle of a pressure sensor using a magnetic field according to a third embodiment of the present invention.

[0035] Fig.10 is a schematic diagram of an application example of using a pressure sensor using a magnetic field according to an embodiment of the present invention as an actuator.

[0036] Fig.11 FIG. 4 is a schematic diagram of a pressure sensor using a magnetic field and a driving process thereof according to a fourth embodiment of the present invention.

[0037] <Description of Reference Symbols>

[0038] 100, 200, 300, 400: Pressure sensors using magnetic fields

[0039] 110, 210, 310, 410: Elastic part

[0040] 120, 220, 320, 420: Interval area

[0041] 130, 330, 430: Circuit unit, first circuit unit

[0042] 250, 350, 450: Circuit unit, second circuit unit

[0043] 140, 240, 340, 440: Substrate part DETAILED DESCRIPTION

[0044] Reference is made to the accompanying drawings illustrated with embodiments as examples. In order to enable those skilled in the art to implement the present invention, these embodiments are specifically described below. These embodiments are fully and in detail described below so that those with common knowledge in the relevant technical field can implement the present invention. Various embodiments of the present invention should be understood to be different from each other but not mutually exclusive. For example, the specific shapes, structures and characteristics recorded herein can be implemented as other embodiments without exceeding the spirit and scope of the present invention. In addition, the position or arrangement of individual components in each disclosed embodiment should be understood to be changeable without exceeding the spirit and scope of the present invention. Therefore, the following detailed description is not intended to limit the present invention, and as long as it can be properly described, the scope of the present invention is limited only by the attached claims and all scopes equivalent thereto. Similar reference numerals in the drawings refer to the same or similar functions in various aspects, and for convenience, length, area, thickness, etc. and their forms can also be exaggerated.

[0045] In order to enable those skilled in the art to easily implement the present invention, preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0046] Figure 2 and Figure 3 FIG. 1 is a schematic diagram of a pressure sensor 100 using a magnetic field and a driving process thereof according to a first embodiment of the present invention. Figure 4 FIG. 1 is a schematic diagram of a driving principle of a pressure sensor 100 using a magnetic field according to a first embodiment of the present invention.

[0047] Reference Figure 2 and Figure 3 The pressure sensor 100 using a magnetic field according to the first embodiment may be a static pressure sensor, which uses an elastic part 110 containing magnetic particles. The pressure sensor 100 may include an elastic part 110 and a circuit part 130. Here, it may further include a spacer 120 and a substrate part 140. The elastic part 110, the spacer 120, and the circuit part 130 may be provided by thin-filming through a semiconductor manufacturing process.

[0048] The elastic portion 110 may have a remanent magnetization value, and the elastic portion 110 may still have magnetism even after the external magnetic field is applied and removed.

[0049] The elastic part 110 may include magnetic particles. The elastic part 110 may include an elastic material in which magnetic particles are dispersed in a matrix. As an example, the elastic part 110 may include at least a magnetorheological elastomer (MRE), which itself may be composed of a magnetorheological elastomer.

[0050] As an example, the magnetic particles can be at least one selected from iron, carbonyl iron, iron alloy, iron oxide, iron nitride, iron carbide, low carbon steel, nickel, cobalt and mixtures thereof or alloys thereof. In addition, the magnetic particles can be uncoated magnetic particles or magnetic particles coated with organic resin. In addition, the magnetic particles can contain neodymium (Nd) based materials such as FeNdB. The matrix material can be any one of polymers such as natural rubber and synthetic rubber.

[0051] According to an embodiment, the elastic part 110 may include a supporting part 111 and a deforming part 115, wherein the supporting part 111 is connected to other components and is a supporting part of the elastic part 110, and the deforming part 115 is connected to the supporting part 111 as a whole and is a deformable or positionally variable part of the elastic part 110. The supporting part 111 may not contain magnetic particles, and only the deforming part 115 contains magnetic particles.

[0052] The elastic part 110 may be in a state of being magnetized by at least the magnetic particles. Thus, the elastic part 110 may display a magnetic field. In addition, the magnetic particles are affected by the externally applied magnetic field, and the properties of the elastic part 110 such as stiffness, tensile strength, and elongation may change. In addition, the magnetic particles are affected by the externally applied magnetic field, and the shape of the elastic part 110 itself may also be deformed.

[0053] The elastic portion 110 may be in the form of a sheet or a film, and its form is not limited thereto as long as it has elasticity and residual magnetization value and can apply a magnetic field to the circuit portion 130 described later.

[0054] The spacer 120 may form a space PD1 between the elastic portion 110 and the circuit portion 130. The spacer 120 may be disposed between one side of the elastic portion 110 and one side of the circuit portion 130 while having a predetermined thickness. In addition, when the elastic portion 110 is applied with a pressure P, the spacer 120 may provide a space for a portion of the elastic portion 110 [e.g., the deformation portion 115] to move.

[0055] The circuit unit 130 may generate a Hall voltage when a magnetic field changes. The circuit unit 130 may be a Hall effect sensor and may be made of a metal wire or a semiconductor wire.

[0056] The pressure sensor 100 using magnetic field of the present invention uses the Hall effect principle. Figure 4 The Hall effect is explained as follows:

[0057] First, when the current I in the conductor refWhen the current flows, the free electrons move in the opposite direction of the current. p Or if the magnetic field is brought closer, the free electrons moving based on the Hall effect will bend their moving direction due to the Lorentz force according to Fleming's left-hand rule. The Hall effect generates a potential difference, and the Hall voltage (V) is formed in the circuit set based on this electromotive force. hall ). If the direction of the current movement or the direction of the magnetic field changes, the Hall effect and the Hall voltage will also change accordingly.

[0058] The Hall voltage can be obtained by For example, I ref ~1mA, B p ~600Gauss, n~10 22 m -3 (doped silicon,N d ~10 16 ), t~100nm, can be displayed as V Hall ~60mV.

[0059] The magnetic field applied to the circuit portion 130 may change according to whether the distance PD between the elastic portion 110 and the circuit portion 130 becomes closer or farther, and accordingly, a Hall voltage may be generated.

[0060] like Figure 3 As shown, a pressure P can be applied to the elastic part 110. That is, a part of the elastic part 110 is deformed (115->115'), so that the distance PD from the circuit part 130 becomes closer (PD1->PD2). As a result, a magnetic field can be applied from the elastic part 110 to the circuit part 130. Since the elastic part 110 can display a magnetic field in a magnetized state, the closer it is to the circuit part 130, the greater the magnetic field strength applied, and thus the Hall voltage V Hal 1 increases. Therefore, the pressure P applied to the elastic part 110 and the output signal V of the circuit part 130 Hall The circuit unit 130 can detect the Hall voltage V Hall The size of the pressure P applied to the elastic part 110 is sensed.

[0061] The substrate 140 can be used to support the components of the pressure sensor 100 using a magnetic field. The target object (not shown) connected to the pressure sensor 100 can be in a three-dimensional form or in various other forms, so the part connected to the target object (not shown), that is, the substrate 140, can preferably be made of a flexible material. However, the target object (not shown) can also be in a planar form or a material that is difficult to connect with a flexible material, so the substrate 140 is not necessarily limited to a flexible material.

[0062] The substrate portion 140 may be disposed below the circuit portion 130 and support the circuit portion 130. The substrate portion 140, the circuit portion 130, the spacer 120, and the elastic portion 110 may be stacked in sequence to form the pressure sensor 100. From another perspective, the elastic portion 110 may be disposed on a first side (for example, the upper side) of the circuit portion 130, and the substrate portion 140 may be disposed on a second side (for example, the lower side) opposite to the first side.

[0063] Figure 5 FIG. 2 is a schematic diagram of a pressure sensor 200 using a magnetic field and a driving process thereof according to a second embodiment of the present invention. Figure 6 FIG. 2 is a schematic diagram of the driving principle of a pressure sensor 200 using a magnetic field according to a second embodiment of the present invention. Figures 5 and 6 In the following description, only Figures 2 to 4 The components that are different from the first embodiment are replaced by the same components as described above. The reference numerals of the same components in the first embodiment and the second embodiment are represented by 100 series and 200 series, which correspond to each other.

[0064] Reference Figure 5 The pressure sensor 200 using a magnetic field according to the second embodiment may include an elastic portion 210 and a circuit portion 250. Here, it may further include a spacer 220 and a substrate portion 240. The elastic portion 210, the spacer 220, and the substrate portion 240 are substantially the same as the elastic portion 110, the spacer 120, and the substrate portion 140.

[0065] like Figure 6 As shown, the pressure sensor 200 using magnetic field according to the second embodiment can use magnetic induction. Figure 2 Similarly, as the elastic portion 210 is acted upon by the pressure P, an induced electromotive force ε due to magnetic field induction may be generated on the wires of the circuit portion 250 .

[0066] The induced electromotive force ε can be obtained from Calculated. For example, Bp~600Gauss, A~10 -4 m 2 (That is, the spatial area enclosed by the circuit wire when one side of the circuit wire is about 1 cm). The pressure change occurs in about 1 second. When ΔBp is 600 Gauss, the change in the magnetic field acting on the circuit can be displayed as ε~6μV.

[0067] The magnetic field applied to the circuit part 250 may change as the distance PD between the elastic part 210 and the circuit part 250 becomes closer or farther, thereby generating an induced electromotive force. The circuit part 250 may be made of a loop-shaped metal wire or semiconductor wire as a magnetic induction sensor or a Lorentz force sensor.

[0068] The elastic part 210 can show a magnetic field in a magnetized state, so when it approaches or moves away from the circuit part 250, it can generate current by induced electromotive force ε based on the change of the magnetic field. The circuit part 250 can sense the change rate of the pressure P applied to the elastic part 210 by detecting the change of the current.

[0069] Figure 7 and Figure 8 FIG. 4 is a schematic diagram of a pressure sensor 300 using a magnetic field and a driving process according to a third embodiment of the present invention. Fig. 9 FIG. 1 is a schematic diagram of the driving principle of a pressure sensor 300 using a magnetic field according to a third embodiment of the present invention. Figures 7 to 9 In the following description, only the components different from the first embodiment and the second embodiment are described, and the same components are replaced by the previous description. The reference numerals of the same components in the first embodiment, the second embodiment and the third embodiment are represented by 100 series, 200 series and 300 series, respectively, which correspond to each other.

[0070] Reference Figure 7 and Figure 8 According to the third embodiment, the pressure sensor 300 using a magnetic field may include an elastic part 310, a first circuit part 330, and a second circuit part 350. Here, it may further include a spacer 320, a substrate part 340, and a dielectric layer 360. The elastic part 310, the spacer 320, and the substrate part 340 are substantially the same as the elastic part 110, the spacer 120, and the substrate part 140 described above. In addition, the first circuit part 330 is substantially the same as the circuit part 130, and the second circuit part 350 is substantially the same as the circuit part 250.

[0071] like Fig. 9 As shown, the pressure sensor 300 using magnetic field according to the third embodiment can use the Hall effect principle and magnetic induction method, which is a combination of the first embodiment and the second embodiment.

[0072] The positions of the first circuit portion 330 and the second circuit portion 350 may be interchangeable. Figure 7 As shown, when the second circuit portion 350 is located above the first circuit portion 330 , a spacer 320 may be disposed between the elastic portion 310 and the second circuit portion 350 . The substrate portion 340 may be disposed below the first circuit portion 330 .

[0073] On the contrary, when the first circuit portion 330 is located above the second circuit portion 350, the spacing area 320 may be interposed between the elastic portion 310 and the first circuit portion 330. The substrate portion 340 may be disposed below the second circuit portion 350.

[0074] A dielectric layer 360 may be interposed between the first circuit portion 330 and the second circuit portion 350 .

[0075] The first circuit part 330 is used as a Hall effect sensor, and the second circuit part 350 can be used as a magnetic induction sensor or a Lorentz force sensor. The first circuit part 330 is separated from the elastic part 310 by PD1-1, and the second circuit part 350 is separated from the elastic part by PD1-2.

[0076] like Figure 8 As shown in FIG. 1 , when pressure P is applied to the elastic portion 310, a portion of the elastic portion 310 is deformed, thereby shortening the distance between the first circuit portion 330 and the second circuit portion 350 (PD1-1->PD2-1)(PD1-2->PD2-2). Thus, the elastic portion 310 can apply a magnetic field to the first circuit portion 330 and the second circuit portion 350, respectively. The first circuit portion 330 can detect the Hall voltage V Ha1l At the same time, the second circuit unit 350 can detect the current change generated by the induced electromotive force ε to sense the change rate of the pressure P.

[0077] As described above, the pressure sensor 300 according to the third embodiment has the advantage of being able to sense both the absolute magnitude of pressure and the pressure change rate.

[0078] Fig.10 1 is a schematic diagram of an application example in which a pressure sensor 100 ′ using a magnetic field according to an embodiment of the present invention is used as an actuator.

[0079] Reference Fig.10 The pressure sensor 100 ′ using a magnetic field may further include a coil portion 190 for applying a magnetic field to the elastic portion 110 . Fig.10 Although the coil portion 190 is illustrated as being arranged apart from the upper portion of the elastic portion 110, the arrangement position of the coil portion 190 is not limited thereto as long as a magnetic field is applied only to the elastic portion 110 and no magnetic field is applied to the first circuit portion 130 and the second circuit portion 150.

[0080] If the coil part 190 applies a magnetic field to the elastic part 110, the rigidity, shape, etc. of the elastic part 110 change based on the applied magnetic field and the elastic part 110 can be used as an actuator. The tactile sensation provided by the actuator includes not only vibration, knocking, and twisting, but also a tactile sensation with a pattern, a sense of rhythm, and a direction. The elastic part 110 can be made of an elastic material containing magnetic particles or a magnetorheological elastomer, so that various tactile sensations can be easily achieved by changing the shape of the material.

[0081] Fig.11 FIG. 4 is a schematic diagram of a pressure sensor 400 using a magnetic field and a driving process thereof according to a fourth embodiment of the present invention. Fig.11In the following description, only the components different from the third embodiment are described, and the same components are replaced by the previous description. The reference numerals of the same components in the third embodiment and the fourth embodiment are represented by 300 series and 400 series, respectively, which correspond to each other.

[0082] Reference Fig.11 According to the fourth embodiment, the pressure sensor 400 using a magnetic field may include an elastic portion 410, a spacer 420, a first circuit portion 430, a substrate portion 440, a second circuit portion 450, and a dielectric layer 460. Here, in addition to the sensors of the first circuit portion 430 and the second circuit portion 450, a circuit portion 470 may also be included. The additional circuit portion 470 may include an information processing circuit, a sensor power supply circuit, a USB communication circuit, a sensor signal input circuit, a wired power supply circuit, a battery charging circuit, a voltage control circuit, and the like. In addition, an insulating layer 480 is used to insulate the circuit portion 470 from the first circuit portion 430 or the second circuit portion 450, and the insulating layer 480 may be stacked above the second circuit portion 450.

[0083] In addition, according to one embodiment, the pressure sensor 100-400 using a magnetic field of the present invention can be used as a touch sensor. The touch sensor can be provided in a form in which one or more pressure sensors 100-400 are aligned. If a specific pressure sensor senses pressure, it can be used as a touch sensor by determining the arrangement position of the pressure sensor.

[0084] As described above, the pressure sensors 100-400 using magnetic fields of the present invention adopt a new pressure sensing method that cannot be implemented by existing pressure sensors, and can be operated by the remote action of the magnetic field without establishing an electrical connection between the elastic part to which the pressure P is applied and the electrode. That is, the pressure is sensed by applying a magnetic field to the circuit part through the elastic part, so there is no need to connect additional electrodes to both ends of the elastic part.

[0085] Furthermore, the elastic part applying pressure can operate without establishing electrical connection with the electrode, and since the circuit part exists on one substrate part, it is easy to integrate with a microelectronic circuit and has a favorable effect in applications such as the Internet of Things.

[0086] In addition, the existing pressure sensor can only detect through either static pressure or dynamic pressure detection methods, and therefore can only detect one of the absolute value or change rate of pressure. The advantage of the pressure sensor of the present invention is that it can simultaneously detect static pressure and dynamic pressure changes by using a sensor that utilizes a magnetic field.

[0087] As described above, the present invention lists preferred embodiments for illustration and description, but the present invention is not limited to the above embodiments, and those skilled in the art can make various modifications and changes without departing from the spirit of the present invention. Such modifications and changes all belong to the scope of the present invention and the appended claims.

Claims

1. A pressure sensor using a magnetic field, comprising: a resilient portion comprising a magnetic material having a residual magnetization value; A circuit part that generates a Hall voltage when the magnetic field changes. When at least a portion of the elastic portion is deformed due to external pressure and causes a change in the magnetic field applied to the circuit portion, the circuit portion senses a Hall voltage corresponding to the change in the magnetic field.

2. A pressure sensor using a magnetic field, comprising: a resilient portion comprising a magnetic material having a residual magnetization value; A first circuit unit that generates a Hall voltage when a magnetic field changes; The second circuit part generates a current by induction electromotive force when the magnetic field changes, When at least a portion of the elastic portion is deformed based on external pressure, causing the magnetic field applied to the first circuit portion and the second circuit portion to change, the first circuit portion senses the Hall voltage corresponding to the magnetic field change, and the second circuit portion senses the current change corresponding to the magnetic field change.

3. The pressure sensor using a magnetic field as claimed in claim 1, wherein: A spacing area is sandwiched between the elastic part and the circuit part.

4. The pressure sensor using a magnetic field as claimed in claim 2, wherein: A spacing area is sandwiched between the elastic portion and the first circuit portion or the second circuit portion.

5. The pressure sensor using a magnetic field according to claim 3 or 4, wherein: When external pressure acts on the elastic portion, the spacer provides a space for a portion of the elastic portion to move.

6. The pressure sensor using a magnetic field as claimed in claim 1, wherein: The Hall voltage is generated based on a potential difference caused by bending of the moving direction of free electrons in the circuit portion conductor due to the change in the magnetic field.

7. The pressure sensor using a magnetic field as claimed in claim 1, wherein: The Hall voltage increases as the elastic portion and the circuit portion get closer.

8. The pressure sensor using a magnetic field as claimed in claim 2, wherein: The magnitude of the pressure applied to the elastic part is sensed by the first circuit part, and the rate of change of the pressure applied to the elastic part is sensed by the second circuit part.

9. The pressure sensor using a magnetic field as claimed in claim 1, wherein: The elastic portion is arranged on the first side of the circuit portion, A substrate portion is disposed on a second side opposite to the first side of the circuit portion.

10. The pressure sensor using a magnetic field as claimed in claim 2, wherein: The elastic portion is arranged on the first side of the first circuit portion, The elastic portion is arranged at a predetermined distance from a second side opposite to the first side of the first circuit portion. A substrate portion is arranged on a second side opposite to the first side of the second circuit portion that the first circuit portion faces.

11. The pressure sensor using a magnetic field according to claim 1 or 2, wherein: The invention further includes a coil portion for applying a second magnetic field to the elastic portion so that the elastic portion is provided as an actuator.

12. A touch sensor comprising one or more pressure sensors using a magnetic field according to claim 1 or 2.

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