A carrier and welding equipment for welding cable core wire and PCB board

Abstract

The present application relates to a carrier and welding equipment for welding cable core wires to PCB boards, and relates to the field of cable processing technology; wherein the carrier includes a first mold for loading cables, and a second mold for loading PCBs, the top surface of the second mold is provided with a slot for inserting the PCB board, and a fixing member is provided between the first mold and the second mold, and the fixing member is used to fix the first mold and the end of the second mold in connection; and when the first mold and the second mold are fixedly connected, the core wire in the first mold just fits the surface of the PCB board in the second mold; and also includes an upper top component, the upper top component is used to drive the PCB board in the slot to move up and out of the slot; the present application has the effect of realizing convenient loading and unloading of the carrier, cables, and PCB boards.

Description

Technical Field

[0001] The present application relates to the field of cable processing technology, and in particular to a carrier and welding equipment for welding cable core wires to PCB boards. Background Art

[0002] Data cables, such as USB cables, typically consist of a cable and connectors at each end. Manufacturing these cables typically involves cutting the coiled cable into desired lengths, electrically connecting the core wires to the corresponding terminals in the connector, and finally assembling the connectors to the electrical connections.

[0003] At present, when producing data cables, it is necessary to pre-process the ends of the cables first. Figure 1 As shown, a typical cable structure generally includes several core wires 14 and an aluminum foil layer 15 disposed around the core wires 14. The aluminum foil layer 15 is used to prevent electromagnetic interference and improve transmission efficiency. The aluminum foil layer 15 is coated with a braided layer 16. The braided layer 16 is used to improve the toughness of the product and prevent the aluminum foil layer 15 from falling off. The braided layer 16 is coated with an insulating layer 17. When processing a data cable, the cable end must first be pre-processed. That is, the layer structure around the core wire 14 is peeled off to expose the core wire 14 at the cable end. The core wire 14 is then soldered to the PCB board on the connector to achieve an electrical connection between the core wire 14 and the connector.

[0004] Before soldering, a pre-set carrier is generally used to fix the cable core wire and PCB separately to achieve pre-positioning of the core wire and PCB board, which facilitates subsequent soldering. However, current carriers generally have a slot for inserting the PCB board. In order to fix the PCB board, the slot size is generally adapted to the PCB, that is, the PCB board fits the inner wall of the slot. When the PCB board needs to be removed from the carrier after soldering is completed, the slot and PCB board are adapted to be plugged in. This plug-in method will not be convenient for removing the PCB board from the slot, so it needs to be improved. Summary of the Invention

[0005] In order to realize convenient loading and unloading of a carrier, cables and PCB boards, the present application provides a carrier and welding equipment for welding cable core wires and PCB boards.

[0006] This application provides a carrier for welding cable core wires and PCB boards, which adopts the following technical solutions:

[0007] A carrier for welding cable core wires to PCB boards, comprising a first mold for loading cables and a second mold for loading PCBs. The top surface of the second mold is provided with a slot for inserting the PCB board. A fixing piece is provided between the first mold and the second mold, and the fixing piece is used to fixedly connect the first mold with the end of the second mold. When the first mold and the second mold are fixedly connected, the core wire in the first mold fits exactly against the surface of the PCB board in the second mold. The carrier also includes an upper ejection assembly, which is used to drive the PCB board in the slot to move up and out of the slot.

[0008] By adopting the above technical solution, when it is necessary to weld the PCB board and the core wire, the cable can be loaded into the first mold, the PCB board can be inserted into the slot of the second mold, and then the first mold and the second mold can be connected with a fixing part so that the core wire at the end of the cable fits the PCB surface, thereby achieving the positioning of the core wire and the PCB board; after welding is completed, the upper ejection component can be used to eject the PCB board out of the slot to facilitate the removal of the PCB board, thereby improving the efficiency of loading and unloading molds.

[0009] Preferably, a mounting socket for cable insertion is provided on the surface of the first mold, and a rotating rod is rotatably connected to the first mold, and the side wall of the rotating rod is connected to a cover plate for opening and closing the mounting socket during the rotation of the rotating rod; the upper top assembly includes a gear set, a connecting rod, a docking plate, and a linkage piece; the connecting rod is rotatably connected to the second mold, and when the first mold and the second mold are fixedly connected under the drive of the fixing member, the connecting rod is connected to the rotating rod key and is coaxially arranged, the docking plate is rotatably connected to the second mold, and the gear set is used to drive the docking plate to rotate when the connecting rod rotates, the linkage piece is located in the slot, and the linkage piece is connected to the side wall of the docking plate. When the PCB board is inserted into the slot, the linkage piece is located between the bottom of the slot and the PCB board; when the rotating rod rotates to cause the cover plate to open the mounting socket, the docking plate rotates and causes the linkage piece to move in a direction away from the bottom of the slot.

[0010] By adopting the above technical solution, after completing welding, the operator needs to open the installation socket and remove the cable from the installation socket. During the process of opening the installation socket, the rotating rod rotates, and the connecting rod rotates with the rotation of the rotating rod. The gear set drives the docking plate to rotate when the connecting rod rotates, and then the linkage plate moves away from the bottom of the slot as the docking plate rotates, so that the PCB board located in the slot is pushed out of the slot by the linkage plate, which makes it convenient for the operator to remove the PCB board and improves the disassembly and assembly efficiency.

[0011] Preferably, the second mold is further provided with a driving member, and the driving member is used to drive the PCB board on the second mold to move along the length direction and / or width direction of the second mold.

[0012] By adopting the above technical solution, the PCB board on the second mold is moved by the driving member to adjust the position of the PCB board relative to the core wire, ensuring that the contact position between the core wire and the PCB board is exactly the point to be welded, thereby improving the accuracy of subsequent welding. In addition, since the core wire in the cable is generally relatively small and the size of the PCB board is much larger than the core wire, compared with adjusting the welding position of the core wire and the PCB board by moving the core wire, adjusting the position of the PCB to achieve the positioning operation of the welding point between the core wire and the PCB board is more efficient and convenient.

[0013] Preferably, it includes a visual display device, a controller, a welding mechanism, and a carrier for welding the cable core wire to the PCB board; the visual display device is electrically connected to the controller, the driving member and the welding mechanism are controlled by the controller, the visual display device is used to obtain a position image, the position image is an image of the positional relationship between the core wire on the first mold and the second mold fixedly connected by a fixing member and the PCB board, the controller is used to obtain the position image, and determine the welding point on the PCB board based on the position image, and control the driving member to move the PCB board in the slot so that the corresponding core wire fits the welding point on the PCB board, and the controller is also used to control the welding mechanism to start and weld the welding points on the PCB board.

[0014] By adopting the above technical solution, an image showing the positional relationship between the core wire and the PCB board (i.e., a position image) is captured by a visual display device, and a controller is used to automatically analyze the welding points on the PCB board for welding with the core wire. The controller controls the driving member to move the PCB board, i.e., adjust the position of the PCB board, and move the PCB board so that the core wire can fit with the corresponding welding points. Finally, the controller controls the welding mechanism to weld the aforementioned welding points. In summary, automatic docking, positioning, and welding of the welding positions of the core wire and the PCB board are achieved. Compared with a method of manually adjusting the position of the core wire with tweezers and moving the core wire to the corresponding welding point, the technical solution of the present application involves less manual participation, and uses an automated operation method to improve welding efficiency. At the same time, it can also avoid the inaccurate positioning caused by manual positioning operations, thereby improving welding quality.

[0015] Preferably, it further includes a vibrating screen plate, a first conveyor belt, a receiving plate and an adsorption mechanism; the vibrating screen plate is used to supply PCB boards; there are several receiving plates, which are arranged in sequence along the conveying direction of the first conveyor belt, and the receiving plates can move to the outlet of the vibrating screen plate with the movement of the first conveyor belt, and receive the PCB boards output from the outlet of the vibrating screen plate, and the PCB boards on the receiving plates are arranged in sequence along the length direction of the receiving plates, and the adsorption mechanism is used to adsorb the PCB boards on the receiving plates into the slots of the second mold.

[0016] By adopting the above technical solution, a vibrating screen plate and a receiving plate are provided to realize the supply of PCB boards, and the vibrating screen plate and the receiving plate can supply PCB boards one by one, making it convenient for the adsorption mechanism to absorb the PCB boards one by one from the receiving plate, realizing one-to-one loading of PCB boards and slots, further reducing manual participation, and improving the loading efficiency of PCB boards and the second mold.

[0017] Preferably, a first rotating shaft is provided between the receiving plate and the first conveyor belt, a frame is provided on the periphery of the first conveyor belt, and the upper surface of the frame near the outlet of the vibrating screen plate is provided with a first docking surface for fitting with the lower surface of the receiving plate, and the first docking surface is used to make the receiving plate rotate around the first rotating shaft when fitting with the receiving plate, and make the end near the outlet of the vibrating screen plate tilt upward.

[0018] By adopting the above technical solution, when the receiving plate moves to the vibrating screen plate outlet along with the transmission of the first conveyor belt, the lower surface of the receiving plate will fit with the first docking surface, and under the limiting action of the first docking surface, the receiving plate will rotate around the first rotating shaft, and the end of the receiving plate close to the vibrating screen plate outlet will be tilted upward, so that the PCB board output from the vibrating screen plate outlet can be quickly moved to the receiving plate under the guidance of the inclined receiving plate, and arranged in order on the receiving plate along the length direction of the receiving plate; the first conveyor belt can be controlled by the controller, so that the start and stop of the first conveyor belt can be controlled by the controller, so that several receiving plates can receive the PCB boards output from the vibrating screen plate outlet in an orderly manner.

[0019] Preferably, the adsorption mechanism includes a suction cup, an adsorption member for controlling a preset adsorption port of the suction cup to form a negative pressure, an adjusting member for driving the suction cup to rotate, and a movable member for driving the suction cup to move back and forth between the receiving plate and the second mold; the adjusting member and the adsorption member are controlled by a controller, and the controller is also electrically connected to an identifier, and the identifier is used to identify the orientation of each PCB board on the receiving plate relative to the receiving plate and obtain first identification information. The controller is used to obtain the first identification information identified by the identifier, and is also used to control the adsorption member to drive the suction cup to adsorb the PCB board on the receiving plate, control the movable member to drive the suction cup to move, and control the adjusting member to drive the suction cup to rotate based on the first identification information of the adsorbed PCB board, so that the PCB board is inserted into the slot of the second mold in a specified orientation.

[0020] By adopting the above technical solution, since the PCB output from the outlet of the vibrating screen plate to the receiving plate is inconsistent in direction relative to the receiving plate, when the PCB board is finally inserted into the slot of the second mold, the end of the PCB board with the welding point must be required to face the periphery of the slot for subsequent welding with the core wire. Therefore, before the PCB board is inserted into the slot of the second mold, the orientation of the PCB board needs to be corrected. The correction method proposed in this solution is to use an identifier to identify the PCB boards on the receiving plate one by one, and before the moving part transfers the PCB board to the second mold, the adjustment part is used to drive the suction cup to rotate during the transfer process, so that the PCB board adsorbed by the suction cup rotates, and then the PCB orientation is adjusted, so that the orientation of the PCB finally inserted into the slot of the second mold remains consistent and is the insertion orientation required for welding, so that in the automatic loading process of the PCB and the second mold, the installation position of the PCB board relative to the second mold can be automatically and efficiently adjusted.

[0021] Preferably, the identifier is also used to identify the positive and negative directions of each PCB board on the receiving plate and obtain second identification information; it also includes a correction component, which is used to drive the PCB board on the receiving plate to flip, and the controller is used to obtain the second identification information obtained by the identifier, and based on the second identification information, control the adsorption mechanism to adsorb the PCB board on the receiving plate with the second identification information as the positive direction to the second mold.

[0022] By adopting the above technical solution, since it is impossible to ensure the front and back of the PCB board output from the outlet of the vibrating screen plate to the receiving plate, when the PCB board is finally inserted into the slot of the second mold, it is necessary to require that the side of the PCB board with the welding point face upward (that is, the positive direction mentioned above) so that the core wire can fit with the upper surface of the PCB board for welding. For this reason, the identifier involved in this application can not only identify the orientation of the PCB, but also identify the front and back sides of the PCB (that is, the positive and negative directions), and control the adsorption mechanism to only adsorb the PCB board with the front side facing up (that is, the positive direction) into the second mold. For the PCB board that is stranded on the receiving plate and on the back line, this application provides a correction component that can be used to flip the aforementioned PCB board. The PCB board that was originally reversed can be adjusted to the positive direction by flipping the PCB board 180° through the correction component, and then it can be adsorbed by the adsorption mechanism.

[0023] Preferably, the correction assembly includes an arc-shaped baffle, a carrying plate, a recovery plate, a linkage rack, a linkage gear, a bevel gear set, and a reset torsion spring; the arc-shaped baffle is located on the periphery of the end portion of the first conveyor belt, and is used to fit with the receiving plate when the receiving plate moves along the end portion of the first conveyor belt, thereby enclosing a closed space together with the receiving plate; the carrying plate is rotatably connected to one side of the arc-shaped baffle through the reset torsion spring, and the carrying plate is located below the moving path of the receiving plate when it moves with the first conveyor belt, and when the reset torsion spring is not deformed, the length direction of the carrying plate is parallel to the length direction of the receiving plate;

[0024] The carrying plate is rotatably connected to the frame via a rotating shaft, and the recovery plate is tilted on the frame. The carrying plate is located at one end of the recovery plate in the length direction, and the carrying plate can be rotated to the extension line of the length direction of the recovery plate; the linkage gear is rotatably connected to the frame, and each receiving plate is correspondingly connected to a linkage rack, and the linkage rack is used to rotate with the linkage gear during the movement of the corresponding receiving plate, and the bevel gear group drives the carrying plate to rotate when the linkage gear rotates.

[0025] By adopting the above technical solution, when the receiving plate moves from one side of the first conveyor belt to the other side of the first conveyor belt, the receiving plate will be reversed. Therefore, the present application uses this movement and reversal of the receiving plate to drive the reverse PCB board trapped in the receiving plate to flip over. Specifically, in order to prevent the receiving plate from separating from the PCB in the receiving plate during the movement, the present application specially arranges an arc-shaped baffle at the end of the first conveyor belt. The arc-shaped baffle is adapted to the movement path of the receiving plate when reversing, and is always in contact with the open position of the receiving plate during the movement and reversal of the receiving plate, so that the PCB board It is confined in a closed space enclosed by the receiving plate and the arc-shaped baffle. When the receiving plate rotates to the bottom of the first conveyor belt, that is, when the receiving plate completes the reversal, the receiving plate will continue to move to the top of the carrying plate with the movement of the first conveyor belt, so that the PCB board falls onto the carrying plate under the action of its own weight. After that, the receiving plate continues to move, and during the movement, with the help of the transmission action of the linkage rack, linkage gear and bevel gear group, the carrying plate is tilted to be collinear with the recovery plate, so that the PCB board on the carrying plate is transferred to the recovery plate, and the adsorption mechanism can be controlled to adsorb the PCB board on the recovery plate.

[0026] Preferably, it further includes a carrying frame, a second conveyor belt, and a splicing component, wherein the carrying frame is used to place the first mold loaded with cables, and the first molds in the carrying frame are stacked along the height direction of the carrying frame, the second conveyor belt is used to convey the second mold to one side of the open position at the bottom end of the carrying frame, and the splicing component is used to drive the corresponding fixing component to fix the first mold at the bottom open position of the carrying frame and the second mold conveyed to the side of the bottom open position of the carrying frame to form a carrier, and push the carrier away from the bottom of the carrying frame.

[0027] By adopting the above technical solution, the second mold loaded with the PCB board is conveyed to one side of the bottom of the carrier frame by using a second conveyor belt, and then the first mold at the bottom of the carrier frame and the second mold located on one side thereof are fixed and spliced ​​together by means of fixing parts using a splicing piece, thereby finally forming a carrier, which is then pushed away from the bottom of the carrier frame. After the carrier is pushed away from the bottom of the carrier frame, the first mold in the carrier frame will continue to fall under the action of its own weight, thereby realizing the conveyance of the first mold.

[0028] In summary, this application includes at least one of the following beneficial technical effects:

[0029] 1. When soldering a PCB board to a core wire, the cable can be loaded into the first mold, the PCB board can be inserted into the slot of the second mold, and the first and second molds can be connected with fixing parts to ensure that the core wire at the end of the cable is in contact with the PCB surface, thus achieving the positioning of the core wire and the PCB board. After soldering is completed, the upper ejection assembly can be used to eject the PCB board from the slot to facilitate the removal of the PCB board, thus improving the efficiency of loading and unloading molds.

[0030] 2. Use a visual display device to capture an image showing the positional relationship between the core wire and the PCB board (i.e., a position image), use a controller to automatically analyze the soldering points on the PCB board used for soldering with the core wire, control the driving member through the controller to move the PCB board, that is, adjust the position of the PCB board, and move the PCB board so that the core wire can fit into the corresponding soldering points. Finally, use the controller to control the soldering mechanism to solder the aforementioned soldering points. In summary, automatic docking, positioning, and soldering of the soldering positions of the core wire and the PCB board are achieved. Compared with the method of manually adjusting the position of the core wire with tweezers and moving the core wire to the corresponding soldering point, the technical solution of the present application involves less manual participation, uses an automated operation method to improve welding efficiency, and can also avoid the inaccurate positioning caused by manual positioning operations, thereby improving welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a cross-sectional view disclosed in the background art for reflecting the internal structure of the cable.

[0032] Figure 2 It is a schematic diagram of the carrier structure used for the first mold structure, the second mold structure, and the first mold and the second mold after being assembled together in Example 1 of the present application.

[0033] Figure 3 yes Figure 2 Cross-sectional view along the AA axis.

[0034] Figure 4 yes Figure 2 Cross-sectional view along the BB direction.

[0035] Figure 5 It is a structural diagram of the cable core wire and PCB board welding equipment used in Example 2 of the present application.

[0036] Figure 6 This is a structural block diagram of the cable core wire and PCB board welding equipment used in Example 2 of the present application.

[0037] Figure 7 It is a schematic diagram used to illustrate the structure of the vibrating screen plate and the first conveyor belt in Example 2 of the present application.

[0038] Figure 8 It is a schematic diagram used to reflect the correction component structure in Example 2 of the present application.

[0039] Figure 9 yes Figure 5 Cross-sectional view along CC direction.

[0040] Explanation of the reference numerals: 1. first mold; 11. mounting socket; 12. rotating rod; 13. cover plate; 14. core wire; 15. aluminum foil layer; 16. braided layer; 17. insulating layer; 2. second mold; 21. slot; 3. fixing member; 31. fixing rod; 4. top assembly; 41. gear set; 42. connecting rod; 43. docking plate; 44. linkage plate; 5. driving member; 51. base; 52. bottom plate; 53. motor screw rod assembly structure; 54. plug-in block; 6. controller; 61. visual display device; 62. identifier; 7. welding mechanism; 71. welding table; 72. first cylinder; 73. welding gun; 8. frame; 81. vibrating screen plate; 82. first conveyor belt; 821. first Docking surface; 83, second conveyor belt; 84, receiving plate; 841, first rotating shaft; 842, first support plate; 843, second rotating shaft; 844, second support plate; 85, first interface; 86, correction component; 861, arc baffle; 862, bearing plate; 863, linkage rack; 864, linkage gear; 865, bevel gear set; 866, reset torsion spring; 87, recovery plate; 88, bearing frame; 881, discharge port; 882, baffle; 89, assembly part; 9, adsorption mechanism; 91, bracket; 92, support plate; 93, suction cup; 94, adjustment part; 95, adsorption part; 96, moving part; 961, second cylinder; 962, third cylinder; 963, first motor. DETAILED DESCRIPTION

[0041] The following is combined with Figure 2-9 This application is described in further detail.

[0042] Example 1

[0043] The embodiment of the present application discloses a carrier for welding a cable core wire and a PCB board. Figure 2The carrier for welding cable core wires to PCB boards includes a first mold 1 and a second mold 2. The first mold 1 has a mounting socket 11 for inserting the cable, and a rotating rod 12 is rotatably connected to a side wall of the first mold 1 near the mounting socket 11. A cover 13 is connected to the side wall of the rotating rod 12, and the cover 13 can open and close the mounting socket 11 during the rotation of the rotating rod 12. The second mold 2 has a slot 21 for inserting a single PCB board. The number of slots 21 can be multiple (such as the two shown in the figure in this application). This carrier can be used in scenarios where the cables at both ends of the cable are separately welded to the PCB boards. A fixing member 3 is also provided between the first mold 1 and the second mold 2. The fixing member 3 specifically includes a fixing rod 31 provided at the end of the second mold 2. The first mold 1 has a fixing hole on one end wall facing the fixing rod 31 for the fixing rod 31 to be inserted through an interference fit. By inserting the fixing rod 31 into the fixing hole, the friction resistance between the fixing rod 31 and the inner wall of the fixing hole is utilized to achieve the plug-in fixation of the first mold 1 and the second mold 2.

[0044] Reference Figure 2 、 Figure 3 and Figure 4 , and also includes an upper top assembly 4, which includes a gear set 41, a connecting rod 42, a docking plate 43 and a linkage piece 44. The connecting rod 42 is rotatably connected to the second mold 2, and a connecting hole is opened on the end wall of the rotating rod 12. When the fixing rod 31 is inserted into the fixing hole 32, the preset rectangular block at the end of the connecting rod 42 is inserted into the connecting hole of the rotating rod 12, and the connecting hole is a rectangular hole adapted to the end of the connecting rod 42, so that the connecting rod 42 and the rotating rod 12 are key-connected, so that the connecting rod 42 can rotate coaxially with the rotating rod 12.

[0045] The docking plate 43 is rotatably connected to the second mold 2 via a rotating shaft. The gear set 41 includes two intermeshing bevel gears, one of which is fixedly mounted on the connecting rod 42, and the other is fixedly mounted on the rotating shaft. This allows the connecting rod 42 and the docking plate 43 to rotate together when the rotating rod 12 rotates. A linkage piece 44 is connected to the side wall of the docking plate 43 and fits against the bottom of all slots 21 of the second mold 2. When a PCB is inserted into a slot 21, the linkage piece 44 is located between the PCB and the bottom of the slot 21. When the rotating rod 12 rotates and drives the cover 13 to open the mounting socket 11, the connecting rod 42 and the docking plate 43 rotate, causing the linkage piece 44 to move away from the bottom of the slot 21. This allows the linkage piece 44 to be used to eject the PCB from the slot 21, thus enabling convenient removal of the PCB from the second mold 2.

[0046] Reference Figure 2 and Figure 4, a driving member 5 is further provided on the second mold 2, and the driving member 5 is arranged in a one-to-one correspondence with the slot 21. The driving member 5 specifically includes a base 51, a bottom plate 52 and two sets of motor screw assembly structures 53; the base 51 is used for inserting the PCB board, and the lower end of the base 51 is provided with an insertion block 54 inserted on the bottom plate 52, one set of motor screw assembly structures 53 is arranged on the insertion block 54 and is threadedly connected to the base 51 to drive the PCB board and the base 51 to reciprocate along the X direction, and the other set of motor screw assembly structures 53 is arranged on the second mold 2, and is threadedly connected to the bottom plate 52, so as to drive the bottom plate 52, the base 51 located on the bottom plate 52, and the PCB to move back and forth along the Y direction in the figure; thereby adjusting the position of the PCB board relative to the slot 21, so that in the subsequent welding process, by adjusting the position of the PCB board relative to the slot 21, the surface of the PCB board and the welding point for welding with the core wire 14 are moved to fit with the end of the core wire 14, thereby facilitating accurate focusing of the core wire 14 and the PCB welding point, thereby improving welding efficiency and welding accuracy.

[0047] Example 2

[0048] Example 2 of the present application discloses a device for welding cable core wires and PCB boards, referring to Figure 5 and Figure 6 The device includes the carrier for soldering the cable core wire to the PCB (hereinafter referred to as the carrier) in Example 1; a visual display device 61, a controller 6, and a soldering mechanism 7. The soldering mechanism 7 includes a soldering table 71, a first air cylinder 72 disposed on the soldering table 71, and a soldering gun 73 mounted on the driving end of the first air cylinder 72, with the soldering gun 73 facing the upper surface of the soldering table 71. The welding gun 73 and the first cylinder 72 are both controlled by the controller 6, which can be a PLC controller. The visual display device 61 is electrically connected to the controller 6. The visual display device 61 is specifically an electronic magnifying glass, which is used to capture the electronic image of the surface of the welding table 71 and magnify the aforementioned electronic image. Correspondingly, if a carrier loaded with cables and PCB boards is placed on the welding table 71, then the aforementioned electronic image will be an image containing the carrier, and it will be an image of the carrier after magnification, and the magnification factor can enable the operator to clearly know each core wire and each preset welding point on the surface of the PCB board. The controller 6 is used to obtain the aforementioned electronic image and, based on the aforementioned electronic image and the pre-stored reference image, determine the welding points on the surface of the PCB board and the core wire corresponding to each welding point. Specifically, the reference image can be an image of the connection between the PCB board and the core wire that has been welded, and the reference image shows the one-to-one correspondence between each core wire and the welding point of the PCB board.

[0049] Accordingly, before welding, the controller 6 can first determine all the welding points on the PCB board based on the reference image, and then determine the core wire corresponding to each welding point and the position of the current corresponding core wire end based on the core wire color, wherein both the welding point and the core wire position can be expressed in coordinate form. The embodiment of the present application proposes that the welding gun 73 will weld the core wires to the PCB board one by one. Therefore, before welding the target core wire to the PCB board, the controller 6 will control the driving member 5 to drive the PCB board to move so that the welding point corresponding to the target core wire on the surface of the PCB board moves to fit with the target core wire end, and then control the first cylinder 72 to drive the welding gun 73 to move downward and control the welding gun 73 to weld the target core wire end. Among them, the target core wire refers to any core wire, and this application assumes that all core wires have different colors, so as to achieve a one-to-one correspondence between the core wires and the welding points; in addition, the welding table 71 can be provided with a mechanism for driving the welding gun 73 to move along the X direction and Y direction respectively (not shown in the figure, such as a combination structure of two sets of motor screws), so that the welding gun 73 can be moved to the top of the welding point between the target core wire and the PCB board to facilitate welding.

[0050] Reference Figure 5 、 Figure 6 and Figure 7 , also includes a vibrating sieve plate 81, a first conveyor belt 82, a receiving plate 84 and an adsorption mechanism 9; the vibrating sieve plate 81 is used to supply PCB boards, and a frame 8 is provided on one side of the outlet of the vibrating sieve plate 81. The first conveyor belt 82 is provided on the frame 8. There are several receiving plates 84, which are arranged in sequence along the conveying direction of the first conveyor belt 82. The receiving plates 84 are rotatably connected to the surface of the first conveyor belt 82 with a first support plate 842. The first support plate 842 is fixed on the first conveyor belt 82. The first support plate 842 faces the receiving plate. One side of the connecting plate 84 is rotatably connected to the first rotating shaft 841, and the side of the first rotating shaft 841 facing away from the first support plate 842 is fixedly connected to the second support plate 844, and the side of the second support plate 844 facing away from the first rotating shaft 841 is rotatably connected to the second rotating shaft 843. The side wall of the second rotating shaft 843 facing away from the second support plate 844 is fixedly connected to the lower surface of the connecting plate 84, and the first rotating shaft 841 and the second rotating shaft 843 are respectively provided with torsion springs. When the torsion springs are not deformed, the connecting plate 84 is set horizontally.

[0051] Reference Figure 5 、 Figure 6 and Figure 7The receiving plate 84 can move to the bottom of the outlet of the vibrating sieve plate 81 as the first conveyor belt 82 rotates, and the first conveyor belt 82 is controlled by the controller 6. Photoelectric switches (not shown in the figure) can be installed on both sides of the frame 8 near the outlet of the vibrating sieve plate 81 to detect whether the receiving plate 84 moves to the bottom of the outlet of the vibrating sieve plate 81. When the receiving plate 84 moves between the photoelectric switches, it is considered that the receiving plate 84 moves to the bottom of the outlet of the vibrating sieve plate 81. At this time, the controller 6 suspends the transmission of the first conveyor belt 82 and opens the preset discharge valve (not shown in the figure) at the outlet of the vibrating sieve plate 81, so that the PCB board falls onto the receiving plate 84 through the outlet of the vibrating sieve plate 81.

[0052] Reference Figure 5 、 Figure 6 and Figure 7 The surface of the frame 8 near the outlet of the vibrating sieve plate 81 is provided with a first docking surface 821. When the receiving plate 84 moves with the transmission of the first conveyor belt 82 to fit with the first docking surface 821, the receiving plate 84 will rotate around the second rotating shaft 843, and make one end of the receiving plate 84 near the outlet of the vibrating sieve plate 81 tilt upward and the other end tilt downward, so that the PCB boards falling from the outlet of the vibrating sieve plate 81 can be quickly and orderly arranged and placed on the receiving plate 84 under the guidance of the tilted receiving plate 84. In addition, every time the discharge valve is opened, the controller 6 can count through the built-in timer. When the timing reaches the specified time, it is considered that the length direction of the single receiving plate 84 has been filled with PCBs. At this time, the controller 6 can stop the reset timer, close the discharge valve and restart the first conveyor belt 82.

[0053] Reference Figure 5 、 Figure 6 and Figure 7 The adsorption mechanism 9 includes a bracket 91, a support plate 92 arranged on the bracket 91, a suction cup 93 arranged on the lower surface of the support plate 92, an adjusting member 94 for driving the suction cup 93 to rotate, an adsorption member 95 for controlling the formation of negative pressure at the preset adsorption port on the lower surface of the suction cup 93, and a moving member 96 for driving the support plate 92 to move. Among them, the moving member 96 includes a second cylinder 961 for driving the support plate 92 to rise and fall, a third cylinder 962 for driving the support plate 92 to move back and forth along the Z direction shown in the figure (the Z direction is parallel to the length direction of the receiving plate 84), and a first motor 963 for driving the bracket 91 to rotate; a second conveyor belt 83 is provided on one side of the adsorption mechanism 9, and the adsorption mechanism 9 can adsorb the PCB board on the receiving plate 84 in the P area shown in the figure to the slot 21 of the second mold 2 inserted into the Q area on the second conveyor belt 83.

[0054] Reference Figure 5 、 Figure 6 and Figure 7Specifically, the first motor 963 drives the support plate 92 to rotate, and the third cylinder 962 drives the support plate 92 to move, so that the support plate 92 can be moved to directly above any PCB board (hereinafter referred to as the target PCB board) on the receiving plate 84 in the P area, or moved to directly above the slot 21 in the second mold 2 in the Q area of ​​the second conveyor belt 83; the second cylinder 961 drives the support plate 92 to move downward, so that the suction cup 93 can be attached to the surface of the target PCB board, and then the adsorption component 95 is used to control the surface of the suction cup 93 to form a negative pressure, so that the target PCB board can be taken out of the receiving plate 84 and finally placed in the slot 21 in the Q area.

[0055] The controller 6 is also electrically connected to an identifier 62, which can be a camera device for identifying each PCB board within the receiving plate 84 moved to the M area, and obtaining first identification information and second identification information. Specifically, the identifier 62 collects image information of each PCB board within the receiving plate 84 within the M area, and the controller 6 is used to receive the image information and compare the image information with the pre-stored basic image, and generate first identification information and second identification information for each PCB board based on the comparison result. The controller 6 is used to record the position information of each PCB board within the M area on the receiving plate 84 to which it belongs, and its corresponding first identification information and second identification information. The basic image includes the front image, the back image, and the orientation image of the PCB board. The orientation image refers to the image of the part with the soldering point on the PCB when it is oriented in different directions (such as Figure 7 Each orientation image corresponds to a rotation angle of the adjusting member 94, and the rotation angle satisfies the following conditions: the PCB board is adsorbed by the suction cup 93, and after the suction cup 93 is controlled by the adjusting member 94 to rotate the corresponding rotation angle, the orientation of the PCB board after being inserted into the Q area is as follows Figure 7 As shown. Controller 6 compares the front and back images in the basic information with the image information captured by identifier 62. If they match the front image, the second identification information is "front." If not, i.e., if they match the back image, the second identification information is "back." Controller 6 is also configured to compare the orientation image in the basic information with the image information captured by identifier 62 and determine the rotation angle of adjustment member 94, which serves as the first identification information.

[0056] Among them, the M area and the P area are arranged in sequence along the conveying direction of the first conveyor belt 82. After the receiving plate 84 of the M area moves to the P area, the controller 6 is used to determine whether the PCB board is on the reverse side according to the second identification information corresponding to the PCB board before the adsorption mechanism 9 adsorbs the PCB on the receiving plate 84 of the P area each time. If so, the PCB board is skipped and the second identification information of the PCB on the receiving plate 84 is determined in sequence along the length direction of the receiving plate 84 until a PCB board with the second identification information as the front side is found. At this time, the controller 6 will control the suction cup 93 of the adsorption mechanism 9 to move to the top of the front PCB board based on the position information of the front PCB board, and then adsorb the front PCB board. After adsorption and before moving to the second conveyor belt 83, the controller 6 controls the adjustment member 94 to rotate to a rotation angle consistent with the first identification information corresponding to the front PCB board, so that when the front PCB is finally inserted into the slot 21 of the Q area, the orientation of the part with the welding point is as follows: Figure 5 The PCB in the middle Q area is shown.

[0057] Reference Figure 7 and Figure 8 As can be seen from the above, the PCB with the second identification information on the reverse side will be retained on the receiving plate 84. Accordingly, the present application also includes a correction assembly 86, which is used to flip the PCB retained on the receiving plate 84 180 degrees. Correction assembly 86 includes an arc-shaped baffle 861, a carrier plate 862, a linkage rack 863, a linkage gear 864, a bevel gear set 865, and a return torsion spring 866. The arc-shaped baffle 861 is set on the frame 8 and is located at one end of the first conveyor belt 82. The arc-shaped baffle 861 is arc-shaped and satisfies the following requirements: when the receiving plate 84 moves to one end of the first conveyor belt 82 close to the arc-shaped baffle 861, and moves from above the first conveyor belt 82 to below the first conveyor belt 82, the preset flexible rubber pad on the end wall at the open position of the receiving plate 84 is always in contact with the side wall of the arc-shaped baffle 861, so that the arc-shaped baffle 861 and the receiving plate 84 together enclose a closed space, thereby preventing the PCB board in the receiving plate 84 from detaching from the receiving plate 84 during the rotation of the receiving plate 84. In this process, when the receiving plate 84 moves to below the first conveyor belt 82, the PCB board in the receiving plate 84 is flipped over.

[0058] The supporting plate 862 is rotatably connected to the side wall of the arc-shaped baffle 861 through a rotating shaft, and the supporting plate 862 is located below the first conveyor belt 82. The reset torsion spring 866 is sleeved on the rotating shaft at the end of the supporting plate 862. When the reset torsion spring 866 is not deformed, the supporting plate 862 is set horizontally. When the receiving plate 84 moves to the bottom of the first conveyor belt 82, the supporting plate 862 is just below the moving path when the receiving plate 84 moves the arc-shaped baffle 861 and continues to move, so as to receive the PCB board that has been flipped over in the receiving plate 84.

[0059] A recovery plate 87 is provided at one end of the supporting plate 862. The recovery plate 87 is tilted downward at one end away from the receiving plate 84. The recovery plate 87 is fixed on the frame 8. The linkage gear 864 is rotatably connected to the side wall of the frame 8 near the supporting plate 862. Each end of the receiving plate 84 corresponds to a linkage rack 863. The linkage gear 864 is located on the moving path of the linkage rack 863 when the linkage rack 863 moves with the receiving plate 84, so as to engage with the linkage rack 863 and rotate as the linkage rack 863 moves. Bevel gear set 865 includes two intermeshing bevel gears, one of which is coaxially connected to the linkage gear 864. The other bevel gear is sleeved on the rotating shaft at the end of the carrier plate 862. When the linkage gear 864 rotates, it drives the receiving plate 84 to rotate, and causes the end of the receiving plate 84 near the recovery plate 87 to tilt downward so that the length of the receiving plate 84 is located on the extension line of the length of the recovery plate 87, thereby facilitating the rapid movement of the PCB on the receiving plate 84 to the recovery plate 87. An additional suction structure or robot can be provided to suck the PCB on the recovery plate 87 and pick it up on the second mold 2 of the second conveyor belt 83.

[0060] Reference Figure 5 and Figure 9 , also includes a carrying frame 88 and a splicing piece 89. The carrying frame 88 is arranged at one end of the second conveyor belt 83 away from the first conveyor belt 82. The first molds 1 loaded with cables are stacked in sequence along the height direction in the carrying frame 88. The splicing piece 89 can be specifically a cylinder. The splicing piece 89 is located at one end of the second conveyor belt 83 away from the first conveyor belt 82, and is located on the side of the second conveyor belt 83 away from the carrying frame 88. A discharge port 881 is provided at the lower end of the carrying frame 88. The side of the carrying frame 88 away from the second conveyor belt 83 is a welding table 71. The inner wall of the discharge port 881 is rotatably connected to a baffle 882 through a torsion spring. The baffle 882 is located on the side of the carrying frame 88 away from the second conveyor belt 83.

[0061] The discharge port 881 and the baffle 882 are both located on the moving path of the assembly 89, and the first mold 1 at the bottom of the carrier frame 88 (hereinafter referred to as the bottom first mold 1) is located in the discharge port 881. The second mold 2 at one end of the second conveyor belt 83 near the assembly 89 (hereinafter referred to as the end second mold 2) is also located on the moving path of the assembly 89. When the driving end of the assembly 89 extends, the end second mold 2 can be pushed toward the direction close to the bottom first mold 1, and under the obstruction of the baffle 882 and the torsion spring, the fixing rod 31 on the end first mold 1 is inserted into the bottom The driving end of the split piece 89 is inserted into the fixing hole 32 on the second mold 2 at the end, so that the second mold 2 at the end and the first mold 1 at the bottom are spliced ​​to form a carrier; when the driving end of the split piece 89 continues to extend, the carrier will push the baffle 882 under the push of the split piece 89, so that the baffle 882 rotates and opens the discharge port 881. After the carrier is pushed onto the welding table 71, the driving end of the split piece 89 retracts and returns to its original position. Optionally, the controller 6 can also be used to control the welding mechanism 7 to perform a welding operation on the carrier on the welding table 71 after each resetting of the split piece 89 (the specific operation content of the welding operation is as described above and will not be repeated here).

[0062] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A carrier for welding cable core wires to PCB boards, characterized by: The invention comprises a first mold (1) for loading cables, and a second mold (2) for loading PCBs, wherein the top surface of the second mold (2) is provided with a slot (21) for inserting a PCB board, and a fixing member (3) is provided between the first mold (1) and the second mold (2), wherein the fixing member (3) is used to fixedly connect the first mold (1) and the end of the second mold (2); and when the first mold (1) and the second mold (2) are fixedly connected, the core wire (14) in the first mold (1) is exactly attached to the surface of the PCB board in the second mold (2); and further comprises an upper top component (4), wherein the upper top component (4) is used to drive the PCB board in the slot (21) to move up and out of the slot (21); The surface of the first mold (1) is provided with an installation socket (11) for inserting a cable, and the first mold (1) is rotatably connected to a rotating rod (12), and the side wall of the rotating rod (12) is connected to a cover plate (13) for opening and closing the installation socket (11) during the rotation of the rotating rod (12); the upper top assembly (4) includes a gear set (41), a connecting rod (42), a docking plate (43), and a linkage piece (44); the connecting rod (42) is rotatably connected to the second mold (2), and when the first mold (1) and the second mold (2) are fixedly connected under the drive of the fixing member (3), the connecting rod (42) is key-connected with the rotating rod (12) and is coaxial. The docking plate (43) is rotatably connected to the second mold (2), the gear set (41) is used to drive the docking plate (43) to rotate when the connecting rod (42) rotates, the linkage piece (44) is located in the slot (21), and the linkage piece (44) is connected to the side wall of the docking plate (43), when the PCB board is inserted into the slot (21), the linkage piece (44) is located between the bottom of the slot (21) and the PCB board; when the rotating rod (12) rotates to make the cover plate (13) open the installation socket (11), the docking plate (43) rotates, and makes the linkage piece (44) move in a direction away from the bottom of the slot (21).

2. The carrier for welding a cable core wire to a PCB according to claim 1, characterized in that: The second mold (2) is also provided with a driving member (5), and the driving member (5) is used to drive the PCB board on the second mold (2) to move along the length direction and / or width direction of the second mold (2).

3. A cable core wire and PCB board welding device, characterized by: The invention comprises a visual display device (61), a controller (6), a welding mechanism (7), and a carrier for welding a cable core wire to a PCB board according to claim 2; the visual display device (61) is electrically connected to the controller (6), the driving member (5) and the welding mechanism (7) are controlled by the controller (6), the visual display device (61) is used to obtain a position image, the position image is an image of the positional relationship between the core wire (14) on the first mold (1) and the second mold (2) fixedly connected by the fixing member (3) and the PCB board, the controller (6) is used to obtain the position image, and determine the welding point on the PCB board based on the position image, and control the driving member (5) to drive the PCB board in the slot (21) to move so that the corresponding core wire (14) fits the welding point on the PCB board, and the controller (6) is also used to control the welding mechanism (7) to start and weld the welding point on the PCB board.

4. The cable core wire and PCB board welding equipment according to claim 3, characterized in that: The invention also includes a vibrating sieve plate (81), a first conveyor belt (82), a receiving plate (84) and an adsorption mechanism (9); the vibrating sieve plate (81) is used to supply PCB boards; the receiving plates (84) are multiple and are arranged in sequence along the conveying direction of the first conveyor belt (82); the receiving plates (84) can move to the outlet of the vibrating sieve plate (81) along with the movement of the first conveyor belt (82) and receive the PCB boards output from the outlet of the vibrating sieve plate (81); the PCB boards on the receiving plates (84) are arranged in sequence along the length direction of the receiving plates (84); and the adsorption mechanism (9) is used to adsorb the PCB boards on the receiving plates (84) into the slots (21) of the second mold (2).

5. The cable core wire and PCB board welding equipment according to claim 4, characterized in that: A first rotating shaft (841) is provided between the receiving plate (84) and the first conveyor belt (82); a frame (8) is provided on the periphery of the first conveyor belt (82); an upper surface of the frame (8) near the outlet of the vibrating sieve plate (81) is provided with a first docking surface (821) for abutting against the lower surface of the receiving plate (84); the first docking surface (821) is used to make the receiving plate (84) rotate around the first rotating shaft (841) when abutting against the receiving plate (84), and to make one end near the outlet of the vibrating sieve plate (81) tilt upward.

6. The cable core wire and PCB board welding equipment according to claim 4, characterized in that: The adsorption mechanism (9) comprises a suction cup (93), an adsorption member (95) for controlling a preset adsorption port of the suction cup (93) to form a negative pressure, an adjusting member (94) for driving the suction cup (93) to rotate, and a moving member (96) for driving the suction cup (93) to move back and forth between the receiving plate (84) and the second mold (2); the adjusting member (94) and the adsorption member (95) are controlled by a controller (6), and the controller (6) is also electrically connected to an identifier (62), and the identifier (62) is used to identify each PCB board on the receiving plate (84). The orientation of the receiving plate (84) is identified and first identification information is obtained. The controller (6) is used to obtain the first identification information obtained by the identifier (62), and is also used to control the adsorption member (95) to drive the suction cup (93) to adsorb the PCB board on the receiving plate (84), control the moving member (96) to drive the suction cup (93) to move, and is also used to control the adjustment member (94) to drive the suction cup (93) to rotate based on the first identification information of the adsorbed PCB board, so that the PCB board is inserted into the slot (21) of the second mold (2) according to the specified orientation.

7. The cable core wire and PCB board welding equipment according to claim 6, characterized in that: The identifier (62) is also used to identify the positive and negative directions of each PCB board on the receiving plate (84) and obtain second identification information; it also includes a correction component (86), the correction component (86) is used to drive the PCB board on the receiving plate (84) to flip, and the controller (6) is used to obtain the second identification information obtained by the identifier (62), and based on the second identification information, control the adsorption mechanism (9) to adsorb the PCB board on the receiving plate (84) with the second identification information being positive to the second mold (2).

8. The cable core wire and PCB board welding equipment according to claim 7, characterized in that: The correction component (86) includes an arc-shaped baffle (861), a carrying plate (862), a recovery plate (87), a linkage rack (863), a linkage gear (864), a bevel gear set (865), and a reset torsion spring (866); the arc-shaped baffle (861) is located at the periphery of the end of the first conveyor belt (82), and is used to fit with the receiving plate (84) when the receiving plate (84) moves along the end of the first conveyor belt (82), thereby forming a closed space together with the receiving plate (84); the carrying plate (862) is rotatably connected to one side of the arc-shaped baffle (861) through the reset torsion spring (866), and the carrying plate (862) is located below the moving path of the receiving plate (84) when it moves with the first conveyor belt (82). When the reset torsion spring (866) is not deformed, the length direction of the carrying plate (862) is parallel to the length direction of the receiving plate (84); The carrying plate (862) is rotatably connected to the frame (8) via a rotating shaft, the recovery plate (87) is tiltedly arranged on the frame (8), the carrying plate (862) is located at one end of the recovery plate (87) in the length direction, and the carrying plate (862) can be rotated to the extension line of the length direction of the recovery plate (87); the linkage gear (864) is rotatably connected to the frame (8), each receiving plate (84) is correspondingly connected to a linkage rack (863), the linkage rack (863) is used to rotate with the linkage gear (864) during the movement of the corresponding receiving plate (84), and the bevel gear set (865) drives the carrying plate (862) to rotate when the linkage gear (864) rotates.

9. The cable core wire and PCB board welding equipment according to claim 3, characterized in that: It also includes a carrying frame (88), a second conveyor belt (83), and a splicing piece (89), wherein the carrying frame (88) is used to place the first mold (1) loaded with the cable, and the first mold (1) in the carrying frame (88) is stacked along the height direction of the carrying frame (88), the second conveyor belt (83) is used to convey the second mold (2) to one side of the bottom open position of the carrying frame (88), and the splicing piece (89) is used to drive the corresponding fixing piece (3) to fix and splice the first mold (1) at the bottom open position of the carrying frame (88) and the second mold (2) conveyed to the side of the bottom open position of the carrying frame (88) to form a carrier, and push the carrier away from the bottom of the carrying frame (88).

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